
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2002 www.anpec.com.tw2
APM9932/C
APM9932/C
Symbol Parameter Test Condition Min. Typ. Max. Unit
Static N-Ch 20
BVDSS Drain-Source Br eakdo wn
Voltage VGS=0V , IDS=250µAP-Ch -20 V
VDS=18V , VGS=0V N-Ch 1
IDSS Zero Gate Voltage Drain
Current VDS=-18V , VGS=0V P-Ch -1 µA
VDS=VGS , IDS=250µAN-Ch 0.6 1.3
VGS(th) Gate Threshold Voltage VDS=VGS , IDS=-250µAP-Ch -0.6 -1.3 V
VGS=±16V , VDS=0V N-Ch ±100
IGSS Gate Leakage Current VGS=±12V , VDS=0V P-Ch ±100 nA
VGS=10V , IDS=9A 12 18
VGS=4.5V , IDS=7A N-Ch 17 27
VGS=-4.5V , IDS=-6A 30 42
RDS(ON)aDrain-Source On-state
Resistance
VGS=-2.5V , IDS=-5A P-Ch 45 60
mΩ
ISD=5A , VGS=0V N-Ch 0.6 1.3
VSDaDiode Forward Voltage ISD=-2A , VGS=0V P-Ch -0.6 -1.3 V
Electrical Characteristics (TA = 25°C unless otherwise noted)
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)
Symbol Parameter N-Channel P-Channel Unit
VDSS Drain-Sourc e Voltage 20 -20
VGSS Gate-Source Voltage ±16 ±12 V
ID*Maximum Drain Current – Continuous 15 -6
IDM Maximum Drain Current – Pulsed 30 -10 A
TA=25°C2.5 2.5
PDMaximum Power Dissipation TA=100°C1.0 1.0 W
TJMaximum Junction Temperature 150 °C
TSTG Storage Temperature Range -55 to 150 °C
RθjA Thermal Resistance – Junction to Ambient 50 °C/W
* Surface Mounted on FR4 Board, t ≤ 10 sec.
Notesa : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%