i.MX28 Applications Processors for Consumer Products, Rev. 3
72 Freescale Semiconductor
Revision History
5 Revision History
Table 70 summarizes revisions to this document.
Table 70. Document Revision History
Rev.
Number Date Substantive Change(s)
Rev. 3 07/2012 • Removed the Power Consumption table, and added Table 12, "Run IDD Test Case,," on page 14.
• Updated Table 23, "ON Impedance of EMI Drivers for Different Drive Strengths," on page 20.
Rev. 2 03/2012 • In Section 1.1, “Device Features:”
—Updated synchronous serial ports (SSP) support for the i.MX28
—Updated Ethernet support for the i.MX28
—Updated Low-Resolution A/D Converter (LRADC) support for the i.MX28
• Updated Table 2, "i.MX28 Functional Differences," on page 4.
•In Table 6, "DC Absolute Maximum Ratings," on page 12, removed the PSWITCH parameter as this
paramater is explained in detail in Ta ble 1 1.
•In Table 8, "Recommended Power Supply Operating Conditions," on page 13:
—Updated two parameters: “VDD5V Supply Voltage” and “Offstate Current”
—Updated the third footnote
•In Table 9, "Operating Temperature Conditions," on page 13, added a new footnote in the “Parameter”
column.
•In Table 13, "Power Supply Characteristics," on page 15, updated the “VDD4P2 Output Current Limit
Accuracy” parameter.
•In Section 3.1.2.1, “Recommended Operating Conditions for Specific Clock Targets:”
—Removed the “System Clocks” table
—Updated two TBD values in the first row of Ta bl e 1 4
—Removed the first row in Ta ble 15
—Removed the first row in Ta ble 16
•In Table 20, "Power Mode Settings," on page 17, changed the second column name from “Deep Sleep”
to “Offstate.”
• Updated Table 22, "EMI Digital Pin DC Characteristics," on page 20.
•In Table 30, "LRADC Electrical Specifications," on page 27, updated the “DC Electrical Specification”
section.
•In Table 31, "HSADC Electrical Specification," on page 28, updated the “DC Electrical Specification”
section.
•In Section 3.5.5, “Coresight ETM9 AC Interface Timing,” updated the first paragraph.
•In Section 3.5.5.1, “TRACECLK Timing,” corrected the title of Ta b le 4 3 .
•In Section 3.5.5.2, “Trace Data Signal Timing,” corrected the titles of Figure 15 and Table 44.
Rev. 1 04/2011 • Updated Section 1.1, “Device Features.”
• Added Section 3.2, “Thermal Characteristics.”
•In Table 1, "Ordering Information," on page 3, added two rows.
• Updated Table 2, "i.MX28 Functional Differences," on page 4.
• Updated Table 4, "i.MX28 Digital and Analog Modules," on page 7.
•In Table 8, "Recommended Power Supply Operating Conditions," on page 13, updated BATT row.
• Updated Table 9, "Operating Temperature Conditions," on page 13.
• Replaced the term “DC Characteristics” with “Power Consumption” in the title and introduction of the
Power Consumption table. Also changed Dissipation to Consumption in first row.
• Updated Table 25, "Digital Pin DC Characteristics for GPIO in 3.3-V Mode," on page 21.
• Updated Table 26, "Digital Pin DC Characteristics for GPIO in 1.8 V Mode," on page 22.
• Updated and added a footnote to Table 33, "Ethernet PLL Specifications," on page 29.
• Updated DDR1 row of Table 34, "EMI Command/Address AC Timing," on page 30.
• Added Section 4.4, “i.MX280 Ball Map.”
•In Section 4.5, “i.MX283 Ball Map,” updated Figure 67.