TOSHIBA TLP721(D4,M)SERIES, TLP733(D4,M)SERIES, TLP747(D4,M)SERIES TOSHIBA PHOTOCOUPLER TLP721(D4,M)SERIES, TLP733({D4,M)SERIES, TLP747(D4,M)SERIES ATTACHMENT : SPECIFICATIONS FOR VDE0884 OPTION : (D4) Types : TLP721, TLP721F, TLP733, TLP733F, TLP734, TLP734F, TLP747G, TLP747GF, TLP747J, TLP747JF This data sheet refers to black mold-regin devices, TLPxxx (D4xxx, M) that previously has a white-resin mold and have been changed. When designing new products please use black mold-resin devices. Type designations for Option : (D4), which are tested under VDE0884 requirements. Ex. : TLP734F (D4-GR-LF4, M) D4 : VDEO0884 option GR =: CTR rank name LF4 : standard lead bend name M : black mold-resin devices Note : Use Toshiba standard type number for safety standard application. Ex. TLP734F (D4-GR-LF4, M)~TLP734F VDE0884 ISOLATION CHARACTERISTICS DESCRIPTION SYMBOL | RATING UNIT Application Classification (DIN VDE0110 Teil 2/01,89, Table 1) for rated mains voltage=300 Vams LIV 7 for rated mains voltage=600 VRemMs -Tl Climatic Classification 40/100/21 (DIN IEC68 Teil 1/09.80) o/ne _ Pollution Degree (DIN VDEO110 Teil 2/01.89) 2 Maximum Operating Insulation Voltage TLPxxx type 890 TLPxxxF type VIORM 1130 Vpk Input to output Test Voltage, Method A TLPxxx type 1335 Vpr=1.5XVIORM, Type and Sample Test Vpr Vpk 4. RNhke Dartial Thicerharaa anf! MT Dees 7 dernin 1605 p Sg A ER Ar BO oe RY Lhd AAAL & FYE are Input to output Test Voltage, Method B TLPxxx type 1670 Vpr=1.875X VIORM. 100% Production Test Vpr Vpk tp= 1s, Partial Discharge <5pC TLPxxxF type 2120 Highest Permissible Overvoltage Ik (Transient Overvoltage, tpr = 10s) VTR 8000 Vp Safety Limiting Values (Max. permissible ratings in case of fault, also refer to thermal derating curve) Current (Input current Ip, Psi=0) Isi 400 mA Power (Output or Total Power Dissipation) Psi 700 mW Temperature Tsi 150 C Insulation Resistance, VyqQ=500V, Ta=25C Rsi 210" a VIQ =500V, Ta=Tsi = 10 961 001EBC2 @ TOSHIBA is continually working to improve the quality and the reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to observe standards of safety, and to avoid situations in which a malfunction or failure of a TOSHIBA product could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set farth in the most recent oroducts specifications. Also, pleace keen in mind the precautions and canditions set forth in the TOSHIBA Semiconductor Reliability, Handbook. 1998-02-27 1/3 TOSHIBA TLP721(D4,M)SERIES, TLP733(D4,M)SERIES, TLP747(D4,M)SERIES INSULATION RELATED SPECIFICATIONS Eh. 10,16mm piteh TLPxxx type TLPxxxF type Minimum Creepage Distance (*) Cr 7.0mm 8.0mm Minimum Ciearance (*) Ci 7.0mm 8.0mm Minimum Insulation Thickness ti 0.5mm Comperative Tracking Index CTI 175 (DIN IEC112/ VDE0308, Part 1) (VDEO110 Teil 2/01.89 Group Ia) (*) in accordance with DIN VDEO110 Teil 1/01.89, Table 2, & 4 1. If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value (e. g. at a standard distance between soldering eye centres of 7.5mm), If this is not permissible, the user shall take suitable measures, 2. This phetocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits, TLP733 SERIES TLP721 SERIES TLP747 SERIES VDE Test sign : Marking on product e for VDE0884 4 A, eel Marking on packing Ay AY for VDE0884 ? 0884 0884 96 1001EBC2" @ Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulvrize the product, or us chemicals to dissolve them. When disposing of the products, follow the appropriate rqulations. Do not dispos of the products with other industrial waste or with domestic garbage. @ The products described in this document are subject to foreign exchange and foreign trade control laws. @ The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATIGN or others. @ The information contained herein is subject to change without notice. 1998-02-27 2/3 TOSHIBA TLP721(D4,M)SERIES, TLP733(D4,M)SERIES, TLP747(D4,M)SERIES Figure 1 ~~ Partial discharge measurement procedure according to VDE0884 Destructive test for qualification and sampling tests. VINITIAL (8EV) Vv I Method A i i ' i Vor (1835V for TLPxxx ) I I * (for type and sampling tests, destructive tests) | \ (1635V for TLPxxxF) ! ! I I I t1, te =1 to 10s 1 ot | | VIORM tg, ta =l1s --p------ a tq tp (Measuring time for partial discharge) =50s 1 booty 1 | 890V for TLPxxx } th = 628 booty 1 | (1130V for TLPxxxF) I I tini =10s o - em 1 1 1 t ly t I 1 t | ' 1 23! 1 p 1 dtd ! ! ! I I iti | tint | f8 tht t f T 1 1 Figure 2 Partial discharge measurement procedure according to VDEO884 Non-destructive test for 100% inspection. v (1670V for TLPxxx ) - Vpr (2120V for TLPxxxF) Method B . f VIORM (for sample test, non-destructive test) --b---------------------- Lif (890V for TLPxxx ) tg, ta =0.1s ' (1130V for TLPxxxF) tp (Measuring time for partial discharge) 1s ' ' th =1.2s 1 1 et 1 = 2 = 1 | tg! p It 1! men th ! ! Figure 3. Dependency of maximum safety ratings on ambient temperature Isi (mA) Psi (mW) 580 000 400 800 300 600 200 400 160 200 mo a 0 25 50 15 100 125 150 175 Ta (C) 1998-02-27 3/3