1
®
FN8223.2
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.
XDCP is a trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005, 2007, 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
X9C303
Logarithmic Digitally Controlled Potentiometer (XDCP™)
Terminal Voltage ±5V, 100 Taps, Log Ta per
Description
The Intersil X9C303 is a digitally controlled potenti ometer
(XDCP). The device consists of a resistor array, wiper
switches, a control section, and nonvolatile me mory. The
wiper position is controlled by a three-wire interface.
The resistor array is composed of 99 resistive elements.
Between each element and at either end are tap points
accessible to the wiper terminal. The position of the wiper
element is controlled by the CS, U/D, and INC inputs. The
position of the wiper can be stored in nonvolatile memory
and then be recalled upon a subsequent power-up
operation.
The device can be used as a three-terminal potentiometer or
as a two-terminal variable resistor in a wide vari ety of
applications ranging from control, to signal processing, to
parameter adjustment. Digitally
-
controlled potentiometers
provide three powerful application advantages; (1) the
variability and reliability of a solid-state potentiometer , (2) the
flexibility of computer-based digital controls, and (3) the use
of nonvolatile memory for potentiometer settings retention.
Features
Solid-state potentiometer
Three-wire serial interface
100 wiper tap points
- Wiper position stored in nonvolatile memory and
recalled on power-up
99 resistive elements, log taper
- Temperature compensated
- End-to-end resistance, 32kΩ ±15%
- Terminal voltages, ±5V
Low powe r CMOS
-V
CC = 5V
- Activ e current, 3mA max.
- Standby current, 750µA max.
High reliabili ty
- Endurance, 100 ,000 data changes per bit
- Register data retention, 100 years
Packages
- 8 Ld TSSOP
- 8 Ld SOIC
- 8 Ld PDIP
Pb-free available (RoHS co mpliant)
Block Diagram
7-BIT
UP/DOWN
COUNTER
7-BIT
NONVOLATILE
MEMORY
STORE AND
RECALL
CONTROL
CIRCUITRY
ONE
OF
HUNDRED
DECODER RESISTOR
ARRAY
RL/VL
RW/VW
RH/VH
U/D
INC
CS
TRANSFER
VCC
ONE-
GATES
99
98
97
96
2
1
0
VSS
Data Sheet January 30, 2009
2FN8223.2
January 30, 2009
Pin Descriptions
VH and VL
The high (VH) and low (VL) terminals of the device are
equivalent to the fixed te rminals of a mechanical
potentiometer. The minimum voltage is –5V and the
maximum is +5V. It should be noted that the terminology of
VL and VH references the relative position of th e terminal in
relation to wiper movement direction selected by the U/D
input and not the voltage potential on the terminal.
VW
VW is the wiper terminal, equivalent to the movable terminal
of a mechanical potentiometer . The position of the wiper
within the array is determined by the control inputs. The
wiper terminal series resistance is typically 40Ω.
Up/Down (U/D)
The U/D input controls the direction of the wiper movement
and whether the counter is incremented or decremented.
Increment (INC)
The INC input is negative-edge triggered. Toggling INC will
move the wiper and either increment or decrement the counter
in the direction indicated by the logic level on the U/D input.
Chip Select (CS)
The device is selected when the CS input is LOW. The current
counter value is stored in nonvolatile memory when CS is
returned HIGH while the INC input is also HIGH. After the store
operation is complete, the device will be placed in the low
power standby mode until the device is selected once again.
Pinouts X9C303
(8 LD SOIC, 8 LD PDIP)
TOP VIEW
X9C303
(8 LD TSSOP)
TOP VIEW
Ordering Information
PART
NUMBER PART
MARKING TEMP. RANGE
(°C) PACKAGE PKG.
DWG. #
X9C303P X9C303P 0 to +70 8 Ld PDIP MDP0031
X9C303PI X9C303P I -40 to +85 8 Ld PDIP MDP0031
X9C303PIZ (Notes 1, 2) X9C303P ZI -40 to +85 8 Ld PDIP (300 mil) (Pb-free) MDP0031
X9C303PZ (Notes 1, 2) X9C303P Z 0 to +70 8 Ld PDIP (300 mil) (Pb-free) MDP0031
X9C303S8*, ** X9C303S 0 to +70 8 Ld SOIC (150 mil) MDP0027
X9C303S8I* X9C303S I -40 to +85 8 Ld SOIC (150 mil) MDP0027
X9C303S8IZ* (Note 1) X9C303S ZI -40 to +85 8 Ld SOIC (150 mil) (Pb-free) MDP0027
X9C303S8Z* (Note 1) X9C303S Z 0 to +70 8 Ld SOIC (150 mil) (Pb-free) MDP0027
X9C303V8*, ** 9C303 0 to +70 8 Ld TSSOP (4.4mm) M8.173
X9C303V8I* C303 I -40 to +85 8 Ld TSSOP (4.4mm) M8.173
X9C303V8IZ* (Note 1) C303 IZ -40 to +85 8 Ld TSSOP (4.4mm) (Pb-free) M8.173
X9C303V8Z* (Note 1) 9C303 Z 0 to +70 8 Ld TSSOP (4.4mm) (Pb-free) M8.173
X9C303S8I-2.7 X9C303S G -40 to +85 8 Ld SOIC (150 mil) MDP0027
X9C303S8IZ-2.7 (Note 1) X9C303S ZG -40 to +85 8 Ld SOIC (150 mil) (Pb-free) MDP0027
*Add “T1” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
**Add “T2” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die att ach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC
J STD-020.
2. Pb-free PDIPs can be used for through hole wave solder processing only . They are not intended for use in Reflow solder processing applications.
VCC
CS
VL
VW
INC
U/D
VH
VSS
1
2
3
4
8
7
6
5
X9C303
1
2
3
4
8
7
6
5
X9C303
CS
VCC
INC
U/D
VL
VW
VSS
VH
X9C303
3FN8223.2
January 30, 2009
Potentiometer Relationships
Principles of Operation
There are three sections of the X9C303: the input co ntrol,
counter and decode section; the nonvolatile memory; and the
resistor array. The input control se ction operates just l ike an
up/down counter. The output of thi s counter is decoded to turn
on a single electronic switch connecting a point on the resistor
array to the wiper output. Under the proper con ditions, the
contents of the counter can be sto red in nonvolatile memory
and retained fo r future use. The resisto r array is comprised of
99 individual resistors connected in series. At ei ther end of the
array and between each resistor is an electronic sw itch that
transfers the potential at that point to the wipe r.
The wiper, when at either fixed terminal, acts like its
mechanical equivalent and does not move beyond the last
position. That is, the counter does not wrap aroun d when
clocked to either extreme.
The electronic switches on the device operate in a “ma ke
before break” mode when the wiper changes tap positions. If
the wiper is moved several positions, multiple taps are
connected to the wiper for tIW (INC to VW change). The
RTOTAL value for the device can temporarily be reduced by a
significant amount if the wiper is moved several positions.
When the device is powered-down, the last counter position
stored will be maintained in the nonvolatile memory. When
power is restored, the contents of the memory are recalled
and the counter is reset to the value last stored.
Instructions and Programming
The INC, U/D and CS input s control the movement of the
wiper along the resistor array. With CS set LOW, the device is
selected and enabled to respond to the U/D and INC input s.
HIGH to LOW transitions on INC will increment or decrement
(depending on the st ate of th e U/D in put) a seven-bit counter.
The output of this counter is decoded to select on e of
one-hundred wiper positions along the re sistive arra y.
The value of the counter is stored in no nvolatile memory
whenever CS transitions HIGH while the INC input is also
HIGH.
The system may select the X9C303, move the wiper, and
deselect the device without having to store the latest wiper
position in nonvolatile memory. The wiper movement is
performed as previously described ; once the new position is
reached, the system would the keep INC LOW while taking
CS HIGH. The new wiper position would be maintained until
changed by the system or until a power-down/up cycle
recalled the previously stored data.
This would allow the system to always power-up to a preset
value stored in nonvolatile memory; then during system
operation minor adjustments could be made. The
adjustments might be based on user preference: system
parameter changes due to temperature drift, etc.
The state of U/D may be changed while CS remains LOW.
This allows the host system to enable the device and then
move the wiper up and down until the proper trim is attained.
Pin Names
SYMBOL DESCRIPTION
VHHigh Terminal (Potentiometer)
VWWiper Terminal (Potentiometer)
VLLow Terminal (Potentiometer)
VSS Ground
VCC Supply Voltage
U/D Up/Down Control Input
INC Increment Control Input
CS Chip Select Control Input
NC No Connection
VL
VH
(VS)R99
R98
R2
R1
S100
S99
S98
S3
S2
S1
VW
Gi20LogR1R2. . . Ri
+++
RTOTAL
------------------------------------------------- VW
VS
--------- V L0V=()==
R1R2. . . R99
+++ R
TOTAL
=
(REFER TEST CIRC UIT 1)
Mode Selection
CS INC U/D MODE
L H Wiper Up
L L Wiper Down
H X Store Wiper Position
H X X Standby Current
L X No Store, Return to Standby
L H Wiper Up (not recommended)
L L Wiper Down (not recommended)
X9C303
4FN8223.2
January 30, 2009
Symbol Table
Typical Electrical Taper
WAVEFORM INPUTS OUTPUTS
Must be
steady Will be
steady
May change
from Low to
High
Will change
from Low to
High
May change
from High to
Low
Will change
from High to
Low
Don’t Care:
Changes
Allowed
Changing:
State Not
Known
N/A Center Line
is High
Impedance
100
90
80
70
60
50
40
30
20
10
0
% TOTAL RESISTANCE
0
3
6
9
12
15
18
21
24
27
30
33
36
39
42
45
48
51
54
57
60
63
66
69
72
75
78
81
84
87
90
93
96
99
TAP
R(VH - VW)
R(VW - VL)
Test Circuit #1
TEST POINT
VW
VH
VL
VS
Test Circuit #2
FORCE
VL
VW
VH
TEST POINT
CURRENT
Circuit #3 SPICE Macro Model
CW
RTOTAL
RHRL
CH
RW
10pF
CL
10pF
25pF
X9C303
5FN8223.2
January 30, 2009
Absolute Maximum Ratings Thermal Information
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . .-65°C to +135°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage on CS, INC, U/D and VCC with Respect to VSS . -1V to +7V
Voltage on VH and VL Referenced to VSS . . . . . . . . . . . . -8V to +8V
ΔV = |VH - VL| X9C303 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10V
Wiper Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1mA
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
Recommended Operating Conditions
Commercial Temperature Range. . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial Temperature Range . . . . . . . . . . . . . . . . . .-40°C to +85°C
Military Temperature Range. . . . . . . . . . . . . . . . . . .-55°C to +125°C
Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
Power Rating at +25°C X9C303 . . . . . . . . . . . . . . . . . . . . . . .10mW
Physical Characteristics
Marking Includes
Manufacturer’s Trademark
Resistance Value or Code
Date Code
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
Analog Specifications Over recommended operating conditions, unless otherwise specified. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
SYMBOL PARAMETER TEST CONDITIONS
LIMITS
UNITMIN TYP
(Note 3) MAX
RTOTAL End-to-End Resistance 32 κΩ
End-to-End Resistance Tolerance -15 +15 %
VHVH Terminal Voltage -5 +5 V
VLVL Terminal Voltage -5 +5 V
RWWiper Resistance Max Wiper Current ±1mA 40 100 Ω
Tap Position Relative Step Size Err or Error = log (Vw(n)) - log (Vw(n - 1))
for tap n = 2 - 99, VH-VL = 10V 0.005 0.115 dB
Resistor Noise At 1kHz 23 nV(RMS)/
Hz
Charge Pump Noise At 850kHz 20 mV(RMS)
End-to-End Resistance
Temperature Coefficient T = -40°C to +85°C ±400 ppm/°C
Ratiometric Temperature Coefficient Tap position 84 ±20 ppm/°C
CH/CL/CW
(Note 5) Potentiometer Capacitance See “Circuit #3 SPICE Macro Model” on
page 4 10/10/25 pF
X9C303
6FN8223.2
January 30, 2009
DC Electrical Specifications Over recommended operating conditions, unless otherwise specified. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
SYMBOL PARAMETER TEST CONDITIONS
LIMITS
UNITMIN TYP
(Note 3) MAX
ICC Vcc Active Current CS = VIL, U/D = VIL or VIH and
INC = 0.4V to 2.4V @ Max tCYC 13mA
ISB Standby Supply Current CS = VCC - 0.3V , U/D and INC =V
SS or
VCC - 0.3V 200 750 µA
ILI CS, INC, U/D Input Leakage Current VIN = VSS to VCC -10 +10 µA
VIH CS, INC, U/D Input HIGH Voltage 2 V
VIL CS, INC, U/D Input LOW voltage 0.8 V
CIN (Note 5) CS, INC, U/D Input Capacitance VCC = 5V, VIN = VSS,
TA = +25°C, f = 1MHz 10 pF
EEPROM SPECS
EEPROM Endurance Wiper storage operations over
recommended operation conditions 100,000 Cycles
EEPROM Retention At +55°C 100 Years
NOTES:
3. Typical values are for TA = +25°C and nominal supply voltage.
Standard Parts
PART NUMBER MAXIMUM RESISTANCE WIPER INCREMENTS MINIMUM RESISTANCE
X9C303 32kΩLog Taper 40Ω Typical
AC Conditions of Test
Input Pulse Levels 0V to 3V
Input Rise and Fall Times 10ns
Input Reference Levels 1.5V
AC Electrical Specifications Over recommended operating conditions, unless otherwise specified. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
SYMBOL PARAMETER
LIMITS
UNITMIN TYP
(Note 4) MAX
tCl CS to INC Set-up 100 ns
tlD INC HIGH to U/D Change 100 ns
tDI U/D to INC Set-up 2.9 µs
tlL INC LOW Period 1 µs
tlH INC HIGH Period 1 µs
tlC INC Inactive to CS Inactive 1 µs
tCPH CS Deselect Time 20 ms
tIW (Note 5) INC to VW Change 100 µs
tCYC INC Cycle Time 2 µs
X9C303
7FN8223.2
January 30, 2009
AC Timing Diagram
NOTES:
4. Typical values are for TA = +25°C and nominal supply voltage.
5. This parameter is not 100% tested.
6. MI in the “AC Timing Diagram” refers to the minimum incremental change in the VW output due to a change in the wiper position.
tR, tF (Note 5) INC Input Rise and Fall Time 500 ns
tPU (Note 5) Power-up to Wiper Stable 500 µs
tR VCC (Note 5) VCC Power-up Rate 0.2 50 mV/µs
AC Electrical Specifications Over recommended operating conditions, unless otherwise specified. Parameters with MIN and/or MAX
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested. ( Continued)
SYMBOL PARAMETER
LIMITS
UNITMIN TYP
(Note 4) MAX
CS
INC
U/D
VW
tCI tIL tIH
tCYC
tID tDI
tIW
MI
tIC tCPH
tFtR
10%
90% 90%
(NOTE 6)
X9C303
8FN8223.2
January 30, 2009
X9C303
Thin Shrink Small Outline Plastic Packages (TSSOP)
α
INDEX
AREA E1
D
N
123
-B-
0.10(0.004) C AMBS
e
-A-
b
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
c
E0.25(0.010) BM M
L
0.25
0.010
GAUGE
PLANE
A2
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AC, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
0.05(0.002)
M8.173
8 LEAD THIN SHRINK NARROW BODY SMALL OUTLINE
PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.047 - 1.20 -
A1 0.002 0.006 0.05 0.15 -
A2 0.031 0.051 0.80 1.05 -
b 0.0075 0.0118 0.19 0.30 9
c 0.0035 0.0079 0.09 0.20 -
D 0.116 0.120 2.95 3.05 3
E1 0.169 0.177 4.30 4.50 4
e 0.026 BSC 0.65 BSC -
E 0.246 0.256 6.25 6.50 -
L 0.0177 0.0295 0.45 0.75 6
N8 87
α0o8o0o8o-
Rev. 1 12/00
9FN8223.2
January 30, 2009
X9C303
Small Outline Package Family (SO)
GAUGE
PLANE
A2
A1 L
L1
DETAIL X 4° ±4°
SEATING
PLANE
eH
b
C
0.010 BMCA
0.004 C
0.010 BMCA
B
D
(N/2)
1
E1
E
NN (N/2)+1
A
PIN #1
I.D. MARK
h X 45°
A
SEE DETAIL “X”
c
0.010
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO)
SYMBOL
INCHES
TOLERANCE NOTESSO-8 SO-14
SO16
(0.150”)
SO16 (0.300”)
(SOL-16)
SO20
(SOL-20)
SO24
(SOL-24)
SO28
(SOL-28)
A 0.068 0.068 0.068 0.104 0.104 0.104 0.104 MAX -
A1 0.006 0.006 0.006 0.007 0.007 0.007 0.007 ±0.003 -
A2 0.057 0.057 0.057 0.092 0.092 0.092 0.092 ±0.002 -
b 0.017 0.017 0.017 0.017 0.017 0.017 0.017 ±0.003 -
c 0.009 0.009 0.009 0.011 0.011 0.011 0.011 ±0.001 -
D 0.193 0.341 0.390 0.406 0.504 0.606 0.704 ±0.004 1, 3
E 0.236 0.236 0.236 0.406 0.406 0.406 0.406 ±0.008 -
E1 0.154 0.154 0.154 0.295 0.295 0.295 0.295 ±0.004 2, 3
e 0.050 0.050 0.050 0.050 0.050 0.050 0.050 Basic -
L 0.025 0.025 0.025 0.030 0.030 0.030 0.030 ±0.009 -
L1 0.041 0.041 0.041 0.056 0.056 0.056 0.056 Basic -
h 0.013 0.013 0.013 0.020 0.020 0.020 0.020 Reference -
N 8 14 16 16 20 24 28 Reference -
Rev. M 2/07
NOTES:
1. Plastic or metal protrusions of 0.006” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994
10
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No lice nse is gran t ed by i mpli catio n or other wise u nder an y p a tent or patent right s of Int ersi l or it s sub sidi aries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8223.2
January 30, 2009
X9C303
Plastic Dual-In-Line Packages (PDIP)
MDP0031
PLASTIC DUAL-IN-LINE PACKAGE
SYMBOL
INCHES
TOLERANCE NOTESPDIP8 PDIP14 PDIP16 PDIP18 PDIP20
A 0.210 0.210 0.210 0.210 0.210 MAX
A1 0.015 0.015 0.015 0.015 0.015 MIN
A2 0.130 0.130 0.130 0.130 0.130 ±0.005
b 0.018 0.018 0.018 0.018 0.018 ±0.002
b2 0.060 0.060 0.060 0.060 0.060 +0.010/-0.015
c 0.010 0.010 0.010 0.010 0.010 +0.004/-0.002
D 0.375 0.750 0.750 0.890 1.020 ±0.010 1
E 0.310 0.310 0.310 0.310 0.310 +0.015/-0.010
E1 0.250 0.250 0.250 0.250 0.250 ±0.005 2
e 0.100 0.100 0.100 0.100 0.100 Basic
eA 0.300 0.300 0.300 0.300 0.300 Basic
eB 0.345 0.345 0.345 0.345 0.345 ±0.025
L 0.125 0.125 0.125 0.125 0.125 ±0.010
N 8 14 16 18 20 Reference
Rev. C 2/07
NOTES:
1. Plastic or metal protrusions of 0.010” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions E and eA are measured with the leads constrained perpendicular to the seating plane.
4. Dimension eB is measured with the lead tips unconstrained.
5. 8 and 16 lead packages have half end-leads as shown.
D
L
A
eb
A1
NOTE 5
A2
SEATING
PLANE
L
N
PIN #1
INDEX
E1
12 N/2
b2
E
eB
eA
c