Advance Data Sheet May 2000 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Features The SMC/SMW Dual-Output Series Surface-Mount Power Modules use advanced, surface-mount technology and deliver high-quality, compact, dc-dc conversion at an economical price. Low profile: 10 mm x 30.2 mm x 49.5 mm (0.39 in. x 1.19 in. x 1.95 in.) Wide input voltage range: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input-to-output isolation: 1500 V Operating case temperature range: -40 C to +105 C Overcurrent protection, unlimited duration Remote on/off Output voltage adjustment: 90% to 105% of VO, nom Output overvoltage protection Undervoltage lockout UL* 1950 Recognized, CSA C22.2 No. 950-95 Certified, VDE 0805 (EN60950, IEC950) Licensed CE mark meets 73/23/EEC and 93/68/EEC directives (SMW only) Within FCC Class A radiated limits Applications Communication equipment Computer equipment Distributed power architectures Options Negative remote on-off logic Synchronization Tight output voltage regulation Input voltage turn-on adjustment * UL is a registered trademark of Underwriters Laboratories, Inc. CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should be followed. (The CE mark is placed on selected products.) Description The SMC/SMW Dual-Output Series Surface-Mount Power Modules are low-profile, dc-dc converters that operate over an input voltage range of 18 Vdc to 36 Vdc or 36 Vdc to 75 Vdc and provide a precisely regulated output. The output is isolated from the input, allowing versatile polarity configurations and grounding connections. The modules have a maximum power rating of 10 W and efficiencies up to 80%. Built-in filtering for both input and output minimizes the need for external filtering. These modules are designed and manufactured to be gull-winged surface-mounted power modules that are reflowed with other surface-mount components in a typical surface-mount fashion. SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Advance Data Sheet May 2000 Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Input Voltage: Continuous Transient (100 ms) Operating Case Temperature (See Thermal Considerations section.) Storage Temperature I/O Isolation Voltage Device Symbol Min Typ Max Unit SMC SMW SMW All VI VI VI, trans TC 0 0 0 -40 -- -- -- -- 50 80 100 105* Vdc Vdc V C All All Tstg -- -55 -- -- -- 120 1500 C Vdc * Maximum case temperature varies based on power dissipation. See derating curves, Figure 14, for details. Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Table 1. Input Specifications Parameter Operating Input Voltage Maximum Input Current (VI = 0 to VI, max; IO = IO, max) Inrush Transient Input Reflected-ripple Current (5 Hz to 20 MHz; 12 H source impedance; TA = 25 C; see Figure 7.) Input Ripple Rejection (100 Hz--120 Hz) Device Symbol Min Typ Max Unit SMC SMW SMC SMW All VI VI 18 36 -- -- -- 24 48 -- -- -- 36 75 1.2 0.6 0.2 Vdc Vdc A A -- 5 -- A2s mAp-p -- 45 -- dB II, max II, max All I2t II All -- Fusing Considerations CAUTION: This power module is not internally fused. An input line fuse must always be used. This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a normal-blow fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data for further information. 2 Tyco Electronics Corp. Advance Data Sheet May 2000 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Electrical Specifications (continued) Table 2. Output Specifications Parameter Output Voltage Set Point (VI = VI, nom; IO = IO, max; TA = 25 C) Device Code or Suffix Symbol Min Typ Max Unit All VO1, set VO2, set VO1, set VO2, set VO1, set VO2, set VO1 VO2 VO1 VO2 VO1 VO2 -- 4.75 -4.75 11.40 -11.40 14.25 -14.25 4.5 -4.5 10.80 -10.80 13.50 -13.50 -- 5.0 -5.0 12.0 -12.0 15.0 -15.0 -- -- -- -- -- -- -- 5.25 -5.25 12.60 -12.60 15.75 -15.75 5.5 -5.5 13.20 -13.20 16.50 -16.50 -- Vdc Vdc Vdc Vdc Vdc Vdc Vdc Vdc Vdc Vdc Vdc Vdc -- AJ BK, CL AJ BK, CL AJ BK CL -- -- -- -- IO1, IO2 IO1, IO2 IO1, IO2 -- -- -- -- 0.1 0.06 0.05 -- -- -- -- -- -- -- 35 50 120 150 1.0 0.42 0.33 mVrms mVrms mVp-p mVp-p A A A AJ BK CL AJ BK CL SMC010xx SMW010AJ SMW010BK SMW010CL All IO1, IO2 IO1, IO2 IO1, IO2 IO1, IO2 IO1, IO2 IO1, IO2 -- -- -- -- -- -- -- TBD TBD 76 76 -- -- -- -- -- -- -- 77 78 79 79 265 4.0 2.5 2.5 6.0 3.5 3.5 -- -- -- -- -- A A A A A A % % % % kHz AJ BK CL Output Voltage (Over all line, load, and temperature conditions until end of life; see Figure 9.) AJ BK CL Output Regulation (For line and load see characteristic curves.) Output Ripple and Noise (Across 2 x 0.47 F ceramic capacitors; see Figure 8.): RMS Peak-to-peak (5 Hz to 20 MHz) Output Current (At IO < IO, min, the modules may exceed output ripple specifications, but operation is guaranteed.) Output Current-limit Inception (VO = 90% VO, set) Output Short-circuit Current (VO = 0.25 V) Efficiency (VI = VI, nom; IO = IO, max; TA = 25 C; see Figure 9.) Switching Frequency Tyco Electronics Corp. 3 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Advance Data Sheet May 2000 Electrical Specifications (continued) Table 2. Output Specifications (continued) Parameter Device Code or Suffix Symbol Min Typ Max Unit All All -- -- -- -- 2 1.5 -- -- %VO, set ms All All -- -- -- -- 2 1.5 -- -- %VO, set ms Dynamic Response (for duals: IO1 or IO2 = IO, max; IO/t = 1A/10 s; VI = VI, nom; TA = 25 C): Load Change from IO = 50% to 75% of IO, max: Peak Deviation Settling Time (VO < 10% of peak deviation) Load Change from IO = 50% to 25% of IO, max: Peak Deviation Settling Time (VO < 10% of peak deviation) Table 3. Isolation Specifications Parameter Isolation Capacitance Isolation Resistance Min -- 10 Typ 600 -- Max -- -- Unit pF M Min Typ 4,860,000 -- Max Unit hours g (oz.) Table 4. General Specifications Parameter Calculated MTBF (IO = 80% of IO, max; TC = 40 C) Weight 4 -- 30 (1.05) Tyco Electronics Corp. Advance Data Sheet May 2000 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Electrical Specifications (continued) Table 5. Feature Specifications Parameter Remote On/Off Signal Interface (optional): (VI = 0 V to VI, max; open collector or equivalent compatible; signal referenced to VI(-) terminal. See Figure 10 and Feature Descriptions.): Positive Logic-- If Device Code Suffix "1" Is Not Specified: Logic Low--Module Off Logic High--Module On Negative Logic-- Device Code Suffix "1": Logic Low--Module On Logic High--Module Off Module Specifications: On/Off Current--Logic Low On/Off Voltage: Logic Low Logic High (Ion/off = 0) Open Collector Switch Specifications: Leakage Current During Logic High (Von/off = 10 V) Output Low Voltage During Logic Low (Ion/off = 1 mA) Turn-on Delay and Rise Times (At 80% of IO, max; TA = 25 C): Case 1: On/Off Input Is Set for Unit On and then Input Power Is Applied (delay from point at which VI = VI, min until VO = 10% of VO, nom). Case 2: Input Power Is Applied for at Least One Second, and then the On/Off Input Is Set to Turn the Module On (delay from point at which on/off input is toggled until VO = 10% of VO, nom). Output Voltage Rise Time (time for VO to rise from 10% of VO, nom to 90% of VO, nom) Output Voltage Overshoot (at 80% of IO, max; TA = 25 C) Output Voltage Set-point Adjustment Range Output Overvoltage Protection (clamp) Device Code or Suffix Symbol Min Typ Max Unit All Ion/off -- -- 1.0 mA All All Von/off Von/off -0.7 -- -- -- 1.2 10 V V All Ion/off -- -- 50 A All Von/off -- -- 1.2 V All Tdelay -- 5 20 ms All Tdelay -- 1 10 ms All Trise -- 0.2 5 ms All -- -- -- 5 % AJ BK, CL AJ -- -- 90 90 5.6 -5.6 13.2 -13.2 16.6 -16.6 11 20 -- -- -- -- -- -- -- -- 14 27 110 100 7.0 -7.0 18.0 -18.0 22.0 -22.0 -- -- %VO, nom %VO, nom V V V V V V V V BK CL Undervoltage Lockout Tyco Electronics Corp. SMC SMW VO1, clamp VO2, clamp VO1, clamp VO2, clamp VO1, clamp VO2, clamp Vuvlo Vuvlo 5 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Characteristic Curves OUTPUT VOLTAGE 1, VO1 (V) 5.00 VI = LOW LINE VI = NOM LINE VI = HIGH LINE 5.05 5.00 4.90 0.0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 4.85 VI = HIGH LINE VI = NOM LINE VI = LOW LINE 4.80 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.9 1.0 8-1790(C) Note: Output 2 has characteristics similar to output 1 when IO1 = 0.5 A and IO2 varies. Figure 1. SMx010AJ Typical Load Regulation of Output1 with Fixed IO2 = 0.5 A at TC = 25 C 5.25 OUTPUT VOLTAGE 1, VO1 (V) 4.90 OUTPUT CURRENT 2, IO2 (A) 0.1 OUTPUT CURRENT 1, IO1 (A) 5.20 VI = LOW LINE 5.15 5.10 VI = NOM LINE VI = HIGH LINE 5.05 5.00 4.95 0.0 4.95 4.75 0.0 4.95 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 8-1792(C) Note: Output 2 has characteristics similar to output 1 when IO2 = 1.0 A and IO1 varies. Figure 3. SMx010AJ Typical Cross Regulation, VO1 vs. IO2 with Fixed IO1 = 1.0 A at TC = 25 C NORMALIZED OUTPUT VOLTAGE 1 (VO1/VO1, set) OUTPUT VOLTAGE 1, VO1 (V) 5.15 5.10 Advance Data Sheet May 2000 1.020 1.016 VI = NOM LINE 1.013 VI = LOW LINE 1.010 1.006 1.003 1.000 0.996 IO = IO, min IO = IO, max VI = HIGH LINE 0.993 0.990 0.0 0.15 0.30 0.45 0.60 0.75 0.90 1.05 NORMALIZED OUTPUT CURRENT (IO1/IO1, max) OUTPUT CURRENT 2, IO2 (A) 8-1793(C) 8-1791(C) Note: Output 2 has characteristics similar to output 1 when IO2 = 0.1 A and IO1 varies. Figure 2. SMx010AJ Typical Cross Regulation, VO1 vs. IO2 with Fixed IO1 = 0.1 A at TC = 25 C 6 Note: Output 2 has characteristics similar to output 1 when IO1 = (0.5 * IO, max) and IO2 varies. Figure 4. SMx010BK, CL Load Regulation of Output1 with Fixed IO2 = 0.5 * IO, max at TC = 25 C, Normalized VO1 vs. Normalized Current IO1 Tyco Electronics Corp. SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Advance Data Sheet May 2000 Characteristics Curves (continued) Test Configurations TO OSCILLOSCOPE NORMALIZED OUTPUT VOLTAGE 1 (VO1/VO1, set) 1.023 1.020 CURRENT PROBE LTEST 1.016 VI(+) 12 H 1.013 CS 220 F BATTERY 1.010 1.007 IO = IO, min IO = IO, max IMPEDANCE < 0.1 @ 20 C, 100 kHz 33 F VI = LOW LINE VI = NOM LINE VI = HIGH LINE 1.003 1.000 VI(-) 8-203(C) 0.996 0.0 0.15 0.30 0.45 0.60 0.75 0.90 1.05 NORMALIZED OUTPUT CURRENT 2 (IO2/IO2, max) Note: Input reflected-ripple current is measured with a simulated source impedance of 12 H. Capacitor Cs offsets possible battery impedance. Current is measured at the input of the module. 8-1794(C) Note: Output 2 has characteristics similar to output 1 when IO2 = IO, min and IO1 varies. Figure 7. Input Reflected-Ripple Test Setup Figure 5. SMx010BK, CL Typical Cross Regulation, Normalized VO1 vs. Normalized IO2 with Fixed IO1 = IO, min at TC = 25 C COPPER STRIP VO1(+) 0.47 F 0.47 F SCOPE RLOAD1 0.47 F 0.47 F SCOPE RLOAD2 NORMALIZED OUTPUT VOLTAGE 1 (VO1/VO1, set) 1.006 1.000 COM 0.993 0.987 VO2(+) 0.980 VI = LOW LINE VI = NOM LINE VI = HIGH LINE 0.973 0.966 IO = IO, min 8-808(C).g IO = IO, max 0.960 0.953 0.0 0.15 0.30 0.45 0.60 0.75 0.90 1.05 Note: Use four 0.47 F ceramic capacitors. Scope measurement should be made using a BNC socket. Position the load between 50 mm and 75 mm (2 in. and 3 in.) from the module. Figure 8. Peak-to-Peak Output Noise Measurement Test Setup NORMALIZED OUTPUT CURRENT 2 (IO2/IO2, max) 8-1795(C) Note: Output 2 has characteristics similar to output 1 when IO2 = IO, max and IO1 varies. Figure 6. SMx010BK, CL Typical Cross Regulation, Normalized VO1 vs. Normalized IO2 with Fixed IO1 = IO, max at TC = 25 C Tyco Electronics Corp. 7 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Test Configurations (continued) Safety Considerations CONTACT AND DISTRIBUTION LOSSES VI(+) VO1 IO II LOAD COM SUPPLY LOAD VO2 VI(-) CONTACT RESISTANCE 8-863(C).a Note: All measurements are taken at the module terminals. When socketing, place Kelvin connections at module terminals to avoid measurement errors due to socket contact resistance. 2 [ V O J - COM ] I O J = --------------------------------------------------- x 100 [VI(+) - VI(-)]II J=1 Advance Data Sheet May 2000 % SMC Modules For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL 1950, CSA C22.2 No. 950-95, and VDE 0805 (EN60950, IEC950). For the converter output to be considered meeting the requirements of safety extra-low voltage (SELV), the input must meet SELV requirements. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a maximum 5 A normal-blow fuse in the ungrounded lead. SMW Modules Figure 9. Output Voltage and Efficiency Measurement Test Setup Design Considerations Input Source Impedance The power module should be connected to a low ac-impedance input source. Highly inductive source impedances can affect the stability of the power module. If the source inductance exceeds 4 H, a 33 F electrolytic capacitor (ESR < 0.7 at 100 kHz) mounted close to the power module helps ensure stability of the unit. For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL 1950, CSA C22.2 No. 950-95, and VDE 0805 (EN60950, IEC950). If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75 Vdc), for the module's output to be considered meeting the requirements of safety extra-low voltage (SELV), all of the following must be true: The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains. One VI pin and one VO pin are to be grounded, or both the input and output pins are to be kept floating. The input pins of the module are not operator accessible. Another SELV reliability test is conducted on the whole system, as required by the safety agencies, on the combination of supply source and the subject module to verify that under a single fault, hazardous voltages do not appear at the module's output. Solder Recommendations Large surface-mount components typically require a thicker stencil than smaller components to ensure a reliable solder joint. The SMC/SMW-Series SurfaceMount Power Modules have been evaluated for solder joint reliability and shock and vibration requirements using 170,000 cubic mils (2.8 mm3) of solder. This volume can be obtained by printing solder 12 mils thick on the copper pads on overprinting the copper pads 13 mils (0.33 mm) around the pad area with 8 mils of printed solder. Although this volume is recommended, tests have been conducted using lower volumes with successful results. Contact technical support for further assistance. 8 Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. Tyco Electronics Corp. Advance Data Sheet May 2000 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Safety Considerations (continued) If not using the remote on/off feature, perform one of the following: SMW Modules (continued) For negative logic, short the ON/OFF pin to VI(-). The power module has extra-low voltage (ELV) outputs when all inputs are ELV. For positive logic, leave the ON/OFF pin open (floating). The input to these units is to be provided with a maximum 5 A normal-blow fuse in the ungrounded lead. VI(+) VI(-) - Feature Descriptions Von/off + Overcurrent Protection Ion/off To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting for an unlimited duration. At the point of current-limit inception, the unit shifts from voltage control to current control. If the output voltage is pulled very low during a severe fault, the current-limit circuit can exhibit either foldback or tailout characteristics (output-current decrease or increase). The unit operates normally once the output current is brought back into its specified range. Remote On/Off Two remote on/off options are available. Positive logic (if device code suffix "1" is not specified) remote on/off turns the module on during a logic-high voltage on the remote ON/OFF pin, and off during a logic low. Negative logic, device code suffix "1," remote on/off turns the module off during a logic high and on during a logic low or when the remote ON/OFF pin is shorted to the VI(-) pin. To turn the power module on and off, the user must supply a switch to control the voltage between the on/off terminal and the VI(-) terminal (Von/off). The switch may be an open collector or equivalent (see Figure 10). A logic low is Von/off = -0.7 V to 1.2 V. The maximum Ion/off during a logic low is 1 mA. The switch should maintain a logic-low voltage while sinking 1 mA. During a logic high, the maximum Von/off generated by the power module is 10 V. The maximum allowable leakage current of the switch at Von/off = 10 V is 50 A. The module has internal capacitance to reduce noise at the ON/OFF pin. Additional capacitance is not generally needed and may degrade the start-up characteristics of the module. REMOTE ON/OFF 8-758(C).a Figure 10. Remote On/Off Implementation Output Voltage Adjustment Output voltage set point adjustment allows the user to increase or decrease the output voltage set point of a module. This is accomplished by connecting an external resistor between the TRIM pin and either the VO(+) or VO(-) pins. With an external resistor between the TRIM and VO(+) pins (Radj-down), the output voltage set point (VO, adj) decreases (see Figure 11). The following equation determines the required external resistor value to obtain an output voltage change from VO, nom to VO, adj: R adj-down ( V O, adj - L ) G = --------------------------------------- - H ( V O, nom - V O, adj ) where Radj-down is the resistance value connected between TRIM and VO(+), and G, H, and L are defined in the table below. TRIM Radj-down VO2(-) RLOAD2 VI(-) COM VI(+) VO1(+) RLOAD1 8-715(C).j Figure 11. Circuit Configuration to Decrease Output Voltage Tyco Electronics Corp. 9 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Advance Data Sheet May 2000 Feature Descriptions (continued) Output Overvoltage Protection Output Voltage Adjustment (continued) The output overvoltage clamp consists of control circuitry, independent of the primary regulation loop, that monitors the voltage on the output terminals. This control loop has a higher voltage set point than the primary loop (see Feature Specifications table). In a fault condition, the overvoltage clamp ensures that the output voltage does not exceed VO, clamp, max. This provides a redundant voltage-control that reduces the risk of output overvoltage. With an external resistor connected between the TRIM and VO(-) pins (Radj-up), the output voltage set point (VO, adj) increases (see Figure 12). The following equation determines the required external resistor value to obtain an output voltage from VO, nom to VO, adj: R adj-up GL = ----------------------------------------- - H [ ( V O, adj - L ) - K ] where Radj-up is the resistance value connected between TRIM and VO(-), and the values of G, H, K, and L are shown in the following table. SMx010AJ SMx010BK SMx010CL G H K L 10000 45300 45300 2050 2050 2050 7.5 -- -- 2.49 2.49 2.49 Although the AJ output can be trimmed up, with mismatched loads, the output voltage on the lightly loaded output will increase. The output voltage between the COM pin and both the VO1(+) and VO2(-) pins must be kept lower than the minimum overvoltage protection voltage found in the Feature Specifications table. The BK and CL modules can only be trimmed down. Input Voltage Turn-On Adjustment (Optional) The input voltage at which the unit turns on can be adjusted upward to add additional hysteresis between the points at which the modules turn on and turn off. This feature can be useful when the power system has high impedance between the source voltage and the power unit causing the input to drop as the supply is turned on. Please consult the factory for application guidelines and/or a description of how to use this feature. Synchronization (Optional) With external circuitry, the unit is capable of synchronization from an independent time base with a switching rate of 256 kHz. Other frequencies may be available; please consult the factory for application guidelines and/or a description of the external circuit needed to use this feature. TRIM Radj-up VO2(-) RLOAD2 VI(-) COM VI(+) VO1(+) Thermal Considerations RLOAD1 8-715(C).k Figure 12. Circuit Configuration to Increase Output Voltage The SMC/SMW-Series Surface-Mount Power Modules have a fixed current-limit set point. Therefore, as the output voltage is adjusted down, the available output power is reduced. In addition, the minimum output current is a function of the output voltage. As the output voltage is adjusted down, the minimum required output current can increase (i.e., minimum power is constant). As the output voltage is adjusted up, the output power should be held constant (maximum load current decreases). 10 The power module operates in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat-dissipating components inside the unit are thermally coupled to the case. Heat is removed by conduction, convection, and radiation to the surrounding environment. Proper cooling can be verified by measuring the case temperature. The case temperature (TC) should be measured at the position indicated in Figure 13. Tyco Electronics Corp. Advance Data Sheet May 2000 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Thermal Considerations (continued) Solution: Given: VI = 48 V, IO = 1 A (IO, max), TA = 84 C Determine PD (Figure 16): PD = 2.50 W Determine airflow (Figure 14): v = 1 ms-1 (200 ft./min.) 25 (0.98) 15 (0.59) 3.5 1 8-1363(C).d Note: Dimensions are in millimeters and (inches). Pin locations are for reference only. Figure 13. SMC and SMW Case Temperature Measurement Location POWER DISSIPATION, PD (W) MAXIMUM CASE TEMPERATURE 3.0 2.5 2.0 1.5 NATURAL CONVECTION 1.0 ms -1 (200 ft./min.) 2.0 ms -1 (400 ft./min.) 3.0 ms -1 (600 ft./min.) 1.0 0.5 0 40 45 50 55 60 65 70 75 80 85 90 Note that the view in Figure 13 is of the surface of the module. The temperature at this location should not exceed the maximum case temperature indicated on the derating curves. The output power of the module should not exceed the rated power for the module as listed in the Ordering Information table. MAX AMBIENT TEMPERATURE, TA (C) 8-1375(C).b Figure 14. SMC010/SMW010 Forced Convection Power Derating; Either Orientation 3.5 Systems in which these power modules are used typically generate natural convection airflow rates of 0.25 ms-1 (50 ft./min.) due to other heat-dissipating components in the system. Therefore, the natural convection condition represents airflow rates of approximately 0.25 ms-1 (50 ft./min.). Use of Figure 14 is shown in the following example. Example What is the minimum airflow necessary for an SMW010AJ operating at VI = 48 V, an output current of 1 A, and a maximum ambient temperature of 84 C? Tyco Electronics Corp. POWER DISSIPATION, P D (W) Heat Transfer Characteristics Increasing airflow over the module enhances the heat transfer via convection. Figure 14 shows the maximum power that can be dissipated by the module without exceeding the maximum case temperature versus local ambient temperature (TA) for natural convection through 3.0 ms-1 (600 ft./min.). 95 100 105 110 3.0 2.5 2.0 1.5 VI = 36 V VI = 24 V VI = 18 V 1.0 0.5 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 NORMALIZED OUTPUT CURRENT, IO1 = IO2 [(IO1 + IO2)/(IO1, max + IO2, max)] 8-1813(C) Figure 15. SMC010AJ, BK, CL Typical Power Dissipation vs. Normalized Output Current at TC = 25 C 11 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Advance Data Sheet May 2000 Thermal Considerations (continued) FACING PWB PWB Heat Transfer Characteristics (continued) 3.0 POWER DISSIPATION, P D (W) MODULE 2.5 VI = 75 V VI = 60 V 2.0 1.5 VI = 36 V 1.0 AIR VELOCITY AND AMBIENT TEMPERATURE MEASURED BELOW THE MODULE VI = 48 V 0.5 AIRFLOW 76 (3.0) 0.0 0.0 0.2 0.4 0.6 0.8 1.0 NORMALIZED OUTPUT CURRENT, IO1 = IO2 [(IO1 + IO2)/(IO1, max + IO2, max)] 13 (0.5) 8-1126(C).d 8-1817(C) Note: Dimensions are in millimeters and (inches). Figure 16. SMW010AJ, BK, CL Typical Power Dissipation vs. Normalized Output Current at TC = 25 C Module Derating The derating curves in Figure 14 were derived by measurements obtained in an experimental apparatus shown in Figure 17. Note that the module and the printed-wiring board (PWB) that it is mounted on are both vertically oriented. The passage has a rectangular cross section. Figure 17. Experimental Test Setup Surface-Mount Power Module Solder Reflow Recommendation The SMC/SMW-Series surface-mount power modules are constructed with SMT (surface-mount technology) components and assembly guidelines. Such large mass/low thermal resistance devices heat up slower than typical SMT components. It is recommended that the customer review data sheets in order to customize the solder reflow profile for application board assembly. It is recommended that a reflow profile must be characterized for the module on the application board assembly. The solder paste type, component, and board thermal sensitivity must be considered in order to form the desired fused solder fillet. The power module leads are plated with tin (Sn) solder to prevent corrosion and ensure good solderability. Typically, the eutectic solder melts at 183 C, wets the land, and subsequently wicks the device lead. Sufficient time must be allocated to fuse the plating on the lead and ensure a reliable solder joint. 12 There are several types of SMT reflow technologies currently used in the industry. These surface-mount power modules can be adequately soldered using natural convection, IR (radiant infrared), convection/IR, or forced convection technologies. The surface-mount power module solder reflow profile is established by accurately measuring the module gull-wing lead surface temperature. Tyco Electronics Corp. SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Advance Data Sheet May 2000 Surface-Mount Power Module Solder Reflow Recommendation (continued) The maximum oven temperature and conveyor speed should prevent the lead temperature from exceeding the maximum thermal profile limits as shown in Figure 18. The lead temperature during a typical reflow profile is shown in Figure 19. Failure to observe these maximum lead temperatures and duration may result in permanent damage to the power module. Relative temperatures of the module gull-wing leads vary according to many factors, including surrounding components, internal paths, and connecting paths. Typically, pin 1 is a good choice for a conservative measurement since it is usually connected to heavy paths for current conduction which also tend to heat the lead faster. These variables make it difficult to compare various types of surface-mount modules; however, based upon a sampling, the unit has been found to be more robust during temperature profiles compared with other SMT modules available in the industry at the time of this publication. GULL-WING LEAD TEMPERATURE ( C) 230 C MAX (PEAK) 183 C 150 C 90 s MAX 120 C 6 MINUTES MAX 4 C/s MAX TIME (s) 8-2275(C) Figure 18. Maximum Thermal Profile Limits 250 MELTING POINT (60/40 SOLDER) GULL-WING LEAD TEMPERATURE ( C) 200 150 100 50 2:30 5:00 7:30 10:00 TIME (min.) 8-2274(C).a Figure 19. Typical Reflow Soldering Profile Tyco Electronics Corp. 13 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Advance Data Sheet May 2000 Packaging Information Vacuum Formed Trays 381 (15.00) 378 (14.89) 345 (13.58) 285 (11.22) 225 (8.86) 165 (6.50) 105 (4.14) 45 (1.78) 3 (0.11) 216 (8.50) 0.00 The SMC/SMW-Series surface-mount power modules are delivered in plastic vacuum formed trays (see Figure 20) that allow automated placement of the modules via a surface-mount pick and place machine. 13 (0.51) S 213 (8.37) 212 (8.33) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 184 (7.25) 90 (3.55) 848116547 137 (5.40) L 43 (1.70) 12 (0.48) 4 (0.16) 0.00 19 (0.75) 8-2263(C) Note: Dimensions are in millimeters and (inches). Figure 20. Vacuum Formed Tray Specifications: Material: PVC (ESD protected) Capacity: 24 pieces/tray Weight: 90 g (3.2 oz.) 14 Tyco Electronics Corp. SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Advance Data Sheet May 2000 Outline Diagram Dimensions are in millimeters and (inches). See next page for pin descriptions. Tolerances: x.x 0.5 mm (0.020 in.); x.xx 0.4 mm (0.015 in.). Top View 49.5 (1.95) Lucent SMW010CL DC-DC Power Module IN:DC 36-75V, 0.6A OUT1:DC 15V,0.33A OUT2:DC -15V,0.33A 30.23 (1.19) MAX PATENT PENDING MADE IN USA VDE 1 TUV Rheinland Side Views 0.25 (0.010) 0.30 0.1 (0.012 0.004) 9.7 (0.38) 2.0 (0.08) NO-SLIDE MECHANICAL RETAINING PINS, 2 PLACES 1.8 (0.07) Bottom View 1.75 (0.069) 47.78 (1.881) 12.07 (0.475) 35.3 (1.39) 1.27 (0.050) DIA 2.5 (0.10) 3.51 (0.138) 8.48 (0.33) 13.49 (0.53) 33.50 (1.32) 38.51 (1.52) 43.48 (1.71) 8-1507(C).e Tyco Electronics Corp. 15 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Advance Data Sheet May 2000 Recommended Hole Pattern Component-side footprint. Dimensions are in millimeters and (inches). Tolerances: x.x 0.5 mm (0.020 in.); x.xx 0.4 mm (0.015 in.). CAUTION: Care must be taken to ensure the board in the periphery of the footprint is flat. FOOTPRINT PERIPHERY 1.6 (0.063) DIA PILOT HOLE, REQUIRED FOR GUIDE PIN, 1 PLACE 2.8 (0.11) 1.6 (0.063) SLOT 13.11 (0.516) 36.8 (1.45) 31.2 (1.23) 3.02 (0.119) 43.0 (1.693) PIN 1 PAD* 3.3 (0.13) 5.0 (0.197) 10.0 (0.39) 4.1 (0.16) 30.0 (1.18) 35.0 (1.38) 40.0 (1.57) 8-1507(C).e Pin Function Pin Function 1 2 3 4 5 6 VO1(+) COM VO2(-) TRIM N/C N/C 12 11 10 9 8 7 VI(+) VI(-) N/C SYNC (optional) ON/OFF TURN-ON ADJUSTMENT (optional) * The recommended solder paste volume is 2.8 cubic mm (170,000 cubic mils/pin). See Design Considerations section. N/C may be used for internal module connections and should not be connected by the customer. 16 Tyco Electronics Corp. SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Advance Data Sheet May 2000 Ordering Information Table 6. Device Codes Input Voltage 24 V 24 V 24 V 48 V 48 V 48 V Output Voltages 5 V, -5 V 12 V, -12 V 15 V, -15 V 5 V, -5 V 12 V, -12 V 15 V, -15 V Output Power 10 W 10 W 10 W 10 W 10 W 10 W Device Code SMC010AJ* SMC010BK* SMC010CL* SMW010AJ SMW010BK SMW010CL Comcode TBD TBD TBD 108611047 108729781 108560954 * SMC codes are available upon request only. Contact the factory for minimum order size and availability. Optional features may be ordered using the device code suffixes shown below. The feature suffixes are listed numerically in descending order. Please contact your Tyco Electronics' Account Manager or Field Application Engineer for pricing and availability. Table 7. Device Options Option Negative logic remote on/off Tyco Electronics Corp. Device Code Suffix 1 17 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Advance Data Sheet May 2000 Notes 18 Tyco Electronics Corp. Advance Data Sheet May 2000 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Notes Tyco Electronics Corp. 19 SMC/SMW Dual-Output Series Surface-Mount Power Modules: 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W Advance Data Sheet May 2000 Tyco Electronics Power Systems, Inc. 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 FAX: +1-888-315-5182 (Outside U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900 http://power.tycoeleectronics.com Tyco Electronics Corportation reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. (c) 2001 Tyco Electronics Corporation, Harrisburg, PA. All International Rights Reserved. Printed in U.S.A. May 2000 DS00-002EPS Printed on Recycled Paper