F-212 ERM8-013-05.0-S-DV-DS-L-TR TM ERM8-030-02.0-S-DV-TR (0,80mm) .0315" ERM8-060-05.0-L-DV-TR ERM8 SERIES RUGGED HIGH SPEED HEADER SPECIFICATIONS Board Mates: ERF8 For complete specifications and recommended PCB layouts see www.samtec.com?ERM8 Cable Mates: ERCD, ERDP Insulator Material: Black LCP Terminal Material: Phosphor Bronze Plating: Au or Sn over 50" (1,27m) Ni Current Rating: 1.4A @ 95C (6 adjacent pins powered) Operating Temp Range: -55C to +125C Voltage Rating: 200 VAC max RoHS Compliant: Yes Edge Rate contacts for reduced broadside coupling Rated @ 3dB Insertion Loss ERM8/ERF8 7mm Stack Height with PCB effects* w/o PCB effects** Single-Ended Signaling 10.5 GHz / 21 Gbps 10.5 GHz / 21 Gbps Differential Pair Signaling 9.5 GHz / 19 Gbps 11 GHz / 22 Gbps *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?ERM8 or contact sig@samtec.com NO. OF POSITIONS PER ROW ERM8 s PCI Expres -005, -010, -013, -020, -025, -030, -040, -049, -050, -060, -070, -075 notes at Download app ppnote /a m co www.samtec. mtec.com sa @ IG S t Contac protocols on s for question APPLICATIONS POS. PART NOs. SERIES NEXUS5001TM.org POWER.orgTM 11 17 20 23 35 ASP-137968-01 ASP-137972-01 ASP-130365-01 ASP-130366-01 ASP-135020-01 ERM8-DV ERM8-DV ERM8-DV ERM8-DV ERM8-DV (1,61) .063 (4,61) .181 (7,61) .300 (8,61) .339 B (8,91) .351 Specify LEAD STYLE from chart -L Extended Guide Post (-EGP) option for blind mate and docking applications available PLATING OPTION -S -EGP (3,20) .126 02 (1,07) .042 B A (0,80) .0315 (1,32) .052 DIA WWW.SAMTEC.COM (16,00) -09.0 (14,00) .551 .629 DV OTHER OPTION TR -L = 10" (0,25m) Gold on contact, Matte Tin on tail (10,80) .425 (5,60) .220 (15,00) -08.0 (13,00) .512 .591 *Processing conditions will affect mated height. -EGPS No. of Positions x (0,80) .0315 + (6,00) .236 -L & -EGP = No. of Positions x (0,80) .0315 + (9,00) .354 -EGPS = No. of Positions x 01 (0,80) .0315 + (10,00) .394 -05.0 -07.0 (12,00) -05.0 (10,00) .394 .472 = 30" (0,76m) Gold on contact, Matte Tin on tail (7,20) .283 (3,25) .128 (5,97) .235 (8,91) .351 (11,91) .469 (12,91) .508 (1,10) .043 Note: Some lengths, styles and options are non-standard, non-returnable. LEAD STYLE ERF8 LEAD STYLE (9,00) -02.0 (7,00) .276 .354 (5,70) .224 STANDARD -02.0 -05.0 -08.0 -09.0 MATED HEIGHT* ERM8 LEAD STYLE TM s ocol t o r d P orte p p u S (R) A (1,50mm) .059" NOMINAL WIPE EXTENDED LIFE PRODUCT 10 year Mixed Flowing Gas with 30" Gold Call Samtec for maximum cycles mated with ERF8 Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10mm) .004" max (005-030) (0,12mm) .005" max (040-060) (0,15mm) .006" max (070-075) LEAD STYLE Designed for Rugged Micro pitch applications TM Processing: ARM/HSSTP NEXUS5001TM.org POWER.orgTM 7mm to 16mm Mated Height Hot Swap option (5,60) .220 -DS -TR = Differential Pair (Lead Style -05.0 only) (-013, -025 positions only) (Hot swap) = Tape & Reel Packaging -L = Latching (Lead Style -05.0 only) (N/A with -EGP & -EGPS option) -EGP = Extended Guide Post (Lead Style -05.0 only) (N/A with -L & -EGPS option) -EGPS = Extended Guide Post Shield (Lead Style -05.0 only) (N/A with -L & -EGP option) (-010, -020, -025, -030 only) -K = (4,00mm) .157" DIA Polyimide Film Pick & Place Pad