(0,80mm) .0315"
ERM8 SERIES
ERM8–060–05.0–L–DV–TR
ERM8–013–05.0–S–DV–DS–L–TR
ERM8–030–02.0–S–DV–TR
7mm to 16mm
Mated Height
Hot Swap
option
Edge Rate™ contacts for
reduced broadside coupling
Extended Guide Post (–EGP)
option for blind mate and
docking applications available
Designed
for Rugged
Micro pitch
applications
WWW.SAMTEC.COM
Note: Some lengths, styles
and options are non-standard,
non-returnable.
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?ERM8
Insulator Material:
Black LCP
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
1.4A @ 95°C
(6 adjacent pins powered)
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
200 VAC max
RoHS Compliant:
Ye s
Processing:
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10mm) .004" max (005-030)
(0,12mm) .005" max (040-060)
(0,15mm) .006" max (070-075)
(0,80)
.0315
(1,32)
.052
DIA
No. of Positions x
(0,80) .0315 + (6,00) .236
–L & –EGP = No. of Positions x
(0,80) .0315 + (9,00) .354
(1,07)
.042
02
01
–EGPS = No. of Positions x
(0,80) .0315 + (10,00) .394
B
A
(5,60)
.220
(3,20)
.126
(10,80)
.425
(3,25)
.128
(1,10)
.043
(7,20)
.283
(5,70)
.224
(5,60)
.220
(8,91)
.351
F-212
–L
SPECIFICATIONS
APPLICATIONS
STANDARD POS. PART NOs. SERIES
NEXUS5001™.org
POWER.org™
11 ASP-137968-01 ERM8-DV
17 ASP-137972-01 ERM8-DV
ARM/HSSTP 20 ASP-130365-01 ERM8-DV
NEXUS5001™.org
POWER.org™
23 ASP-130366-01 ERM8-DV
35 ASP-135020-01 ERM8-DV
–005, –010, –013,
–020, –025, –030,
–040, –049, –050,
–060, –070, –075
–L
= 10µ"
(0,25µm)
Gold on
contact,
Matte Tin
on tail
–S
= 30µ"
(0,76µm)
Gold on
contact,
Matte Tin
on tail
Specify
LEAD
STYLE
from
chart
ERM8 NO. OF POSITIONS
PER ROW TR
PLATING
OPTION OTHER
OPTION
LEAD
STYLE DV
–TR
= Tape
& Reel
Packaging
PCI Express
®
Download app notes at
www.samtec.com/appnote
Contact SIG @ samtec.com
for questions on protocols
Protocols
Supported
–EGP
–EGPS
LEAD
STYLE AB
–02.0 (1,61) .063 (5,97) .235
–05.0 (4,61) .181 (8,91) .351
–08.0 (7,61) .300 (11,91) .469
–09.0 (8,61) .339 (12,91) .508
RUGGED HIGH SPEED HEADER
™
Board Mates:
ERF8
Cable Mates:
ERCD, ERDP
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 30µ" Gold
TM
Call Samtec for maximum cycles mated with ERF8
(1,50mm)
.059"
NOMINAL
WIPE
ERM8/ERF8
7mm Stack Height
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling 10.5 GHz / 21 Gbps 10.5 GHz / 21 Gbps
Differential Pair Signaling 9.5 GHz / 19 Gbps 11 GHz / 22 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?ERM8 or contact sig@samtec.com
MATED HEIGHT*
ERM8
LEAD
STYLE
ERF8
LEAD STYLE
–05.0 –07.0
–02.0 (7,00)
.276
(9,00)
.354
–05.0 (10,00)
.394
(12,00)
.472
–08.0 (13,00)
.512
(15,00)
.591
–09.0 (14,00)
.551
(16,00)
.629
*Processing conditions will
affect mated height.
–DS
= Differential Pair
(Lead Style –05.0 only)
(–013, –025 positions only)
(Hot swap)
–L
= Latching
(Lead Style –05.0 only)
(N/A with –EGP
& –EGPS option)
–EGP
= Extended Guide Post
(Lead Style –05.0 only)
(N/A with –L & –EGPS option)
–EGPS
= Extended
Guide Post Shield
(Lead Style –05.0 only)
(N/A with –L & –EGP option)
(–010, –020, –025, –030 only)
–K
= (4,00mm) .157" DIA
Polyimide Film
Pick & Place Pad
