Contents
Cyclone V Device Overview................................................................................................. 3
Key Advantages of Cyclone V Devices............................................................................. 3
Summary of Cyclone V Features.....................................................................................4
Cyclone V Device Variants and Packages......................................................................... 5
Cyclone V E........................................................................................................5
Cyclone V GX..................................................................................................... 7
Cyclone V GT......................................................................................................9
Cyclone V SE.................................................................................................... 12
Cyclone V SX....................................................................................................14
Cyclone V ST.................................................................................................... 15
I/O Vertical Migration for Cyclone V Devices...................................................................18
Adaptive Logic Module................................................................................................ 18
Variable-Precision DSP Block........................................................................................19
Embedded Memory Blocks........................................................................................... 21
Types of Embedded Memory............................................................................... 21
Embedded Memory Capacity in Cyclone V Devices................................................. 21
Embedded Memory Configurations.......................................................................22
Clock Networks and PLL Clock Sources.......................................................................... 22
FPGA General Purpose I/O...........................................................................................23
PCIe Gen1 and Gen2 Hard IP....................................................................................... 24
External Memory Interface.......................................................................................... 24
Hard and Soft Memory Controllers....................................................................... 24
External Memory Performance............................................................................ 25
HPS External Memory Performance......................................................................25
Low-Power Serial Transceivers......................................................................................25
Transceiver Channels......................................................................................... 25
PMA Features................................................................................................... 26
PCS Features....................................................................................................27
SoC with HPS.............................................................................................................28
HPS Features....................................................................................................28
FPGA Configuration and Processor Booting............................................................30
Hardware and Software Development.................................................................. 31
Dynamic and Partial Reconfiguration............................................................................. 31
Dynamic Reconfiguration....................................................................................31
Partial Reconfiguration....................................................................................... 31
Enhanced Configuration and Configuration via Protocol....................................................32
Power Management.................................................................................................... 33
Document Revision History for Cyclone V Device Overview...............................................33
Contents
Cyclone V Device Overview
2
Cyclone V Device Overview
The Cyclone® V devices are designed to simultaneously accommodate the shrinking
power consumption, cost, and time-to-market requirements; and the increasing
bandwidth requirements for high-volume and cost-sensitive applications.
Enhanced with integrated transceivers and hard memory controllers, the Cyclone V
devices are suitable for applications in the industrial, wireless and wireline, military,
and automotive markets.
Related Information
Cyclone V Device Handbook: Known Issues
Lists the planned updates to the Cyclone V Device Handbook chapters.
Key Advantages of Cyclone V Devices
Table 1. Key Advantages of the Cyclone V Device Family
Advantage Supporting Feature
Lower power consumption • Built on TSMC's 28 nm low-power (28LP) process technology and includes an
abundance of hard intellectual property (IP) blocks
• Up to 40% lower power consumption than the previous generation device
Improved logic integration and
differentiation capabilities
• 8-input adaptive logic module (ALM)
• Up to 13.59 megabits (Mb) of embedded memory
• Variable-precision digital signal processing (DSP) blocks
Increased bandwidth capacity • 3.125 gigabits per second (Gbps) and 6.144 Gbps transceivers
• Hard memory controllers
Hard processor system (HPS)
with integrated Arm* Cortex*-A9
MPCore* processor
• Tight integration of a dual-core Arm Cortex-A9 MPCore processor, hard IP, and an
FPGA in a single Cyclone V system-on-a-chip (SoC)
• Supports over 128 Gbps peak bandwidth with integrated data coherency between
the processor and the FPGA fabric
Lowest system cost • Requires only two core voltages to operate
• Available in low-cost wirebond packaging
• Includes innovative features such as Configuration via Protocol (CvP) and partial
reconfiguration
CV-51001 | 2018.05.07
Intel Corporation. All rights reserved. Intel, the Intel logo, Altera, Arria, Cyclone, Enpirion, MAX, Nios, Quartus
and Stratix words and logos are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other
countries. Intel warrants performance of its FPGA and semiconductor products to current specifications in
accordance with Intel's standard warranty, but reserves the right to make changes to any products and services
at any time without notice. Intel assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Intel. Intel
customers are advised to obtain the latest version of device specifications before relying on any published
information and before placing orders for products or services.
*Other names and brands may be claimed as the property of others.
ISO
9001:2008
Registered
Summary of Cyclone V Features
Table 2. Summary of Features for Cyclone V Devices
Feature Description
Technology • TSMC's 28-nm low-power (28LP) process technology
• 1.1 V core voltage
Packaging • Wirebond low-halogen packages
• Multiple device densities with compatible package footprints for seamless migration between
different device densities
• RoHS-compliant and leaded(1)options
High-performance
FPGA fabric
Enhanced 8-input ALM with four registers
Internal memory
blocks
• M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)
• Memory logic array block (MLAB)—640-bit distributed LUTRAM where you can use up to 25%
of the ALMs as MLAB memory
Embedded Hard IP
blocks
Variable-precision DSP • Native support for up to three signal processing precision levels
(three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the same
variable-precision DSP block
• 64-bit accumulator and cascade
• Embedded internal coefficient memory
• Preadder/subtractor for improved efficiency
Memory controller DDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC support
Embedded transceiver
I/O
PCI Express* (PCIe*) Gen2 and Gen1 (x1, x2, or x4) hard IP with
multifunction support, endpoint, and root port
Clock networks • Up to 550 MHz global clock network
• Global, quadrant, and peripheral clock networks
• Clock networks that are not used can be powered down to reduce dynamic power
Phase-locked loops
(PLLs)
• Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)
• Integer mode and fractional mode
FPGA General-purpose
I/Os (GPIOs)
• 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter
• 400 MHz/800 Mbps external memory interface
• On-chip termination (OCT)
• 3.3 V support with up to 16 mA drive strength
Low-power high-speed
serial interface
• 614 Mbps to 6.144 Gbps integrated transceiver speed
• Transmit pre-emphasis and receiver equalization
• Dynamic partial reconfiguration of individual channels
HPS
(Cyclone V SE, SX,
and ST devices only)
• Single or dual-core Arm Cortex-A9 MPCore processor-up to 925 MHz maximum frequency with
support for symmetric and asymmetric multiprocessing
• Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0
On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller, NAND
flash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART, controller area
network (CAN), serial peripheral interface (SPI), I2C interface, and up to 85 HPS GPIO
interfaces
• System peripherals—general-purpose timers, watchdog timers, direct memory access (DMA)
controller, FPGA configuration manager, and clock and reset managers
• On-chip RAM and boot ROM
continued...
(1) Contact Intel for availability.
Cyclone V Device Overview
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Cyclone V Device Overview
4
Feature Description
• HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweight HPS-to-FPGA
bridges that allow the FPGA fabric to issue transactions to slaves in the HPS, and vice versa
• FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface to the multiport
front end (MPFE) of the HPS SDRAM controller
• Arm CoreSight™ JTAG debug access port, trace port, and on-chip trace storage
Configuration • Tamper protection—comprehensive design protection to protect your valuable IP investments
• Enhanced advanced encryption standard (AES) design security features
• CvP
• Dynamic reconfiguration of the FPGA
• Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive parallel (FPP) x8 and
x16 configuration options
• Internal scrubbing (2)
• Partial reconfiguration (3)
Cyclone V Device Variants and Packages
Table 3. Device Variants for the Cyclone V Device Family
Variant Description
Cyclone V E Optimized for the lowest system cost and power requirement for a wide spectrum of general logic
and DSP applications
Cyclone V GX Optimized for the lowest cost and power requirement for 614 Mbps to 3.125 Gbps transceiver
applications
Cyclone V GT The FPGA industry’s lowest cost and lowest power requirement for 6.144 Gbps transceiver
applications
Cyclone V SE SoC with integrated Arm-based HPS
Cyclone V SX SoC with integrated Arm-based HPS and 3.125 Gbps transceivers
Cyclone V ST SoC with integrated Arm-based HPS and 6.144 Gbps transceivers
Cyclone V E
This section provides the available options, maximum resource counts, and package
plan for the Cyclone V E devices.
The information in this section is correct at the time of publication. For the latest
information and to get more details, refer to the Product Selector Guide.
Related Information
Product Selector Guide
Provides the latest information about Intel products.
(2) The SEU internal scrubbing feature is available for Cyclone V E, GX, SE, and SX devices with
the "SC" suffix in the part number. For device availability and ordering, contact your local Intel
sales representatives.
(3) The partial reconfiguration feature is available for Cyclone V E, GX, SE, and SX devices with
the "SC" suffix in the part number. For device availability and ordering, contact your local
Intel® sales representatives.
Cyclone V Device Overview
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Cyclone V Device Overview
5
Available Options
Figure 1. Sample Ordering Code and Available Options for Cyclone V E Devices
The SEU internal scrubbing feature is available for Cyclone V E, GX, SE, and SX devices with the "SC" suffix in
the part number. For device availability and ordering, contact your local Intel sales representatives.
Family Signature
Embedded Hard IPs
Package Type
Package Code
Operating Temperature
FPGA Fabric Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
E : Enhanced logic/memory
B : No hard PCIe or hard
memory controller
F : No hard PCIe and maximum
2 hard memory controllers
5C : Cyclone V
F : FineLine BGA (FBGA)
U : Ultra FineLine BGA (UBGA)
M : Micro FineLine BGA (MBGA)
FBGA Package Type
17 : 256 pins
23 : 484 pins
27 : 672 pins
31 : 896 pins
UBGA Package Type
15 : 324 pins
19 : 484 pins
MBGA Package Type
13 : 383 pins
15 : 484 pins
C : Commercial (TJ = 0° C to 85° C)
I : Industrial (TJ = -40° C to 100° C)
A : Automotive (TJ = -40° C to 125° C)
6 (fastest)
7
8
N : Lead-free packaging
Contact Intel for availability
of leaded options
ES : Engineering sample
5C E F A9 F 31 C7N
Member Code
Family Variant
A2 : 25K logic elements
A4 : 49K logic elements
A5 : 77K logic elements
A7 : 150K logic elements
A9 : 301K logic elements
SC : Internal scrubbing support
Maximum Resources
Table 4. Maximum Resource Counts for Cyclone V E Devices
Resource Member Code
A2 A4 A5 A7 A9
Logic Elements (LE) (K) 25 49 77 150 301
ALM 9,430 18,480 29,080 56,480 113,560
Register 37,736 73,920 116,320 225,920 454,240
Memory (Kb) M10K 1,760 3,080 4,460 6,860 12,200
MLAB 196 303 424 836 1,717
Variable-precision DSP Block 25 66 150 156 342
18 x 18 Multiplier 50 132 300 312 684
PLL 4 4 6 7 8
GPIO 224 224 240 480 480
LVDS Transmitter 56 56 60 120 120
Receiver 56 56 60 120 120
Hard Memory Controller 1 1 2 2 2
Cyclone V Device Overview
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Cyclone V Device Overview
6
Related Information
True LVDS Buffers in Devices, I/O Features in Cyclone V Devices
Provides the number of LVDS channels in each device package.
Package Plan
Table 5. Package Plan for Cyclone V E Devices
Member
Code
M383
(13 mm)
M484
(15 mm)
U324
(15 mm)
F256
(17 mm)
U484
(19 mm)
F484
(23 mm)
F672
(27 mm)
F896
(31 mm)
GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO
A2 223 — 176 128 224 224 — —
A4 223 — 176 128 224 224 — —
A5 175 — — — 224 240 — —
A7 — 240 — — 240 240 336 480
A9 — — — — 240 224 336 480
Cyclone V GX
This section provides the available options, maximum resource counts, and package
plan for the Cyclone V GX devices.
The information in this section is correct at the time of publication. For the latest
information and to get more details, refer to the Product Selector Guide.
Related Information
Product Selector Guide
Provides the latest information about Intel products.
Cyclone V Device Overview
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Cyclone V Device Overview
7
Available Options
Figure 2. Sample Ordering Code and Available Options for Cyclone V GX Devices
The SEU internal scrubbing feature is available for Cyclone V E, GX, SE, and SX devices with the "SC" suffix in
the part number. For device availability and ordering, contact your local Intel sales representatives.
Family Signature
Embedded Hard IPs
Transceiver Count
Transceiver
Speed Grade
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
GX : 3-Gbps transceivers
B : No hard PCIe or hard
memory controller
F : Maximum 2 hard PCIe and
2 hard memory controllers
5C : Cyclone V
C3 :
36K logic elements
C4 : 50K logic elements
C5 : 77K logic elements
C7 : 150K logic elements
C9 : 301K logic elements
B : 3
F : 4
A : 5
C : 6
D : 9
E : 12
6 : 3.125 Gbps
7 : 2.5 Gbps
F : FineLine BGA (FBGA)
U : Ultra FineLine BGA (UBGA)
M : Micro FineLine BGA (MBGA)
FBGA Package Type
23 : 484 pins
27 : 672 pins
31 : 896 pins
35 : 1,152 pins
UBGA Package Type
15 : 324 pins
19 : 484 pins
MBGA Package Type
11 : 301 pins
13 : 383 pins
15 : 484 pins
C : Commercial (TJ = 0° C to 85° C)
I : Industrial (TJ = -40° C to 100° C)
A : Automotive (TJ = -40° C to 125° C)
6 (fastest)
7
8
N : Lead-free packaging
Contact Intel for availability
of leaded options
ES
:
Engineering sample
5C GX FC9 E 6F 35 C7N
Member Code
Family Variant
SC : Internal scrubbing support
Maximum Resources
Table 6. Maximum Resource Counts for Cyclone V GX Devices
Resource Member Code
C3 C4 C5 C7 C9
Logic Elements (LE) (K) 36 50 77 150 301
ALM 13,460 18,860 29,080 56,480 113,560
Register 53,840 75,440 116,320 225,920 454,240
Memory (Kb) M10K 1,350 2,500 4,460 6,860 12,200
MLAB 182 424 424 836 1,717
Variable-precision DSP Block 57 70 150 156 342
18 x 18 Multiplier 114 140 300 312 684
PLL 4 6 6 7 8
3 Gbps Transceiver 3 6 6 9 12
GPIO(4) 208 336 336 480 560
continued...
(4) The number of GPIOs does not include transceiver I/Os. In the Intel Quartus® Prime software,
the number of user I/Os includes transceiver I/Os.
Cyclone V Device Overview
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Cyclone V Device Overview
8
Resource Member Code
C3 C4 C5 C7 C9
LVDS Transmitter 52 84 84 120 140
Receiver 52 84 84 120 140
PCIe Hard IP Block 1 2 2 2 2
Hard Memory Controller 1 2 2 2 2
Related Information
True LVDS Buffers in Devices, I/O Features in Cyclone V Devices
Provides the number of LVDS channels in each device package.
Package Plan
Table 7. Package Plan for Cyclone V GX Devices
Member
Code
M301
(11 mm)
M383
(13 mm)
M484
(15 mm)
U324
(15 mm)
U484
(19 mm)
GPIO XCVR GPIO XCVR GPIO XCVR GPIO XCVR GPIO XCVR
C3 — — — — — — 144 3 208 3
C4 129 4 175 6 — — — — 224 6
C5 129 4 175 6 — — — — 224 6
C7 — — — — 240 3 — — 240 6
C9 — — — — — — — — 240 5
Member
Code
F484
(23 mm)
F672
(27 mm)
F896
(31 mm)
F1152
(35 mm)
GPIO XCVR GPIO XCVR GPIO XCVR GPIO XCVR
C3 208 3 — — — — — —
C4 240 6 336 6 — — — —
C5 240 6 336 6 — — — —
C7 240 6 336 9 480 9 — —
C9 224 6 336 9 480 12 560 12
Cyclone V GT
This section provides the available options, maximum resource counts, and package
plan for the Cyclone V GT devices.
The information in this section is correct at the time of publication. For the latest
information and to get more details, refer to the Product Selector Guide.
Related Information
Product Selector Guide
Provides the latest information about Intel products.
Cyclone V Device Overview
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Cyclone V Device Overview
9
Available Options
Figure 3. Sample Ordering Code and Available Options for Cyclone V GT Devices
Family Signature
Embedded Hard IPs
Transceiver Count
Transceiver
Speed Grade
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
GT : 6-Gbps transceivers
F : Maximum 2 hard PCIe and
2 hard memory controllers
5C : Cyclone V
D5 : 77K logic elements
D7 : 150K logic elements
D9 : 301K logic elements
B : 3
F : 4
A : 5
C : 6
D : 9
E : 12
5 : 6.144 Gbps
F : FineLine BGA (FBGA)
U : Ultra FineLine BGA (UBGA)
M : Micro FineLine BGA (MBGA)
FBGA Package Type
23 : 484 pins
27 : 672 pins
31 : 896 pins
35 : 1,152 pins
UBGA Package Type
19 : 484 pins
MBGA Package Type
11 : 301 pins
13 : 383 pins
15 : 484 pins
C : Commercial (TJ = 0° C to 85° C)
I : Industrial (TJ = -40° C to 100° C)
A : Automotive (TJ = -40° C to 125° C)
7
5C GT F D9 E 5 F 35 C 7N
Member Code
Family Variant Optional Suffix
Indicates specific device
options or shipment method
N : Lead-free packaging
Contact Intel for availability
of leaded options
ES : Engineering sample
Maximum Resources
Table 8. Maximum Resource Counts for Cyclone V GT Devices
Resource Member Code
D5 D7 D9
Logic Elements (LE) (K) 77 150 301
ALM 29,080 56,480 113,560
Register 116,320 225,920 454,240
Memory (Kb) M10K 4,460 6,860 12,200
MLAB 424 836 1,717
Variable-precision DSP Block 150 156 342
18 x 18 Multiplier 300 312 684
PLL 6 7 8
6 Gbps Transceiver 6 9 12
GPIO(5) 336 480 560
LVDS Transmitter 84 120 140
continued...
(5) The number of GPIOs does not include transceiver I/Os. In the Intel Quartus Prime software,
the number of user I/Os includes transceiver I/Os.
Cyclone V Device Overview
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Cyclone V Device Overview
10
Resource Member Code
D5 D7 D9
Receiver 84 120 140
PCIe Hard IP Block 2 2 2
Hard Memory Controller 2 2 2
Related Information
True LVDS Buffers in Devices, I/O Features in Cyclone V Devices
Provides the number of LVDS channels in each device package.
Package Plan
Table 9. Package Plan for Cyclone V GT Devices
Transceiver counts shown are for transceiver ≤5 Gbps . 6 Gbps transceiver channel count support depends on
the package and channel usage. For more information about the 6 Gbps transceiver channel count, refer to the
Cyclone V Device Handbook Volume 2: Transceivers.
Member
Code
M301
(11 mm)
M383
(13 mm)
M484
(15 mm)
U484
(19 mm)
GPIO XCVR GPIO XCVR GPIO XCVR GPIO XCVR
D5 129 4 175 6 — — 224 6
D7 — — — — 240 3 240 6
D9 — — — — — — 240 5
Member
Code
F484
(23 mm)
F672
(27 mm)
F896
(31 mm)
F1152
(35 mm)
GPIO XCVR GPIO XCVR GPIO XCVR GPIO XCVR
D5 240 6 336 6 — — — —
D7 240 6 336 9 (6)480 9 (6)— —
D9 224 6 336 9 (6)480 12 (7)560 12 (7)
Related Information
6.144-Gbps Support Capability in Cyclone V GT Devices, Cyclone V Device Handbook
Volume 2: Transceivers
Provides more information about 6 Gbps transceiver channel count.
(6) If you require CPRI (at 6.144 Gbps) and PCIe Gen2 transmit jitter compliance, Intel
recommends that you use only up to three full-duplex transceiver channels for CPRI, and up to
six full-duplex channels for PCIe Gen2. The CMU channels are not considered full-duplex
channels.
(7) If you require CPRI (at 6.144 Gbps) and PCIe Gen2 transmit jitter compliance, Intel
recommends that you use only up to three full-duplex transceiver channels for CPRI, and up to
eight full-duplex channels for PCIe Gen2. The CMU channels are not considered full-duplex
channels.
Cyclone V Device Overview
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Cyclone V Device Overview
11
Cyclone V SE
This section provides the available options, maximum resource counts, and package
plan for the Cyclone V SE devices.
The information in this section is correct at the time of publication. For the latest
information and to get more details, refer to the Product Selector Guide.
Related Information
Product Selector Guide
Provides the latest information about Intel products.
Available Options
Figure 4. Sample Ordering Code and Available Options for Cyclone V SE Devices
The SEU internal scrubbing feature is available for Cyclone V E, GX, SE, and SX devices with the "SC" suffix in
the part number. For device availability and ordering, contact your local Intel sales representatives.
Cyclone V SE and SX low-power devices (L power option) offer 30% static power reduction for devices with
25K LE and 40K LE, and 20% static power reduction for devices with 85K LE and 110K LE.
Family Signature
Embedded Hard IPs
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
SE : SoC with enhanced logic/memory
5C : Cyclone V
F : FineLine BGA (FBGA)
U : Ultra FineLine BGA (UBGA)
FBGA Package Type
31 : 896 pins
UBGA Package Type
19 : 484 pins
23 : 672 pins
C : Commercial (TJ = 0° C to 85° C)
I : Industrial (TJ = -40° C to 100° C)
A : Automotive (TJ = -40° C to 125° C)
6 (fastest)
7
8
Processor Cores
Omit for dual-core
S : Single-core
N : Lead-free packaging
Contact Intel for availability
of leaded options
ES : Engineering sample
5C SE M A6 F 31 C6 S N
Member Code
Family Variant
A2 : 25K logic elements
A4 : 40K logic elements
A5 : 85K logic elements
A6 : 110K logic elements
B : No hard PCIe or hard
memory controller
M : No hard PCIe and
1 hard memory controller
SC : Internal scrubbing support
L
Power Option
Omit for standard power
L : Low power
Cyclone V Device Overview
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Cyclone V Device Overview
12
Maximum Resources
Table 10. Maximum Resource Counts for Cyclone V SE Devices
Resource Member Code
A2 A4 A5 A6
Logic Elements (LE) (K) 25 40 85 110
ALM 9,430 15,880 32,070 41,910
Register 37,736 60,376 128,300 166,036
Memory (Kb) M10K 1,400 2,700 3,970 5,570
MLAB 138 231 480 621
Variable-precision DSP Block 36 84 87 112
18 x 18 Multiplier 72 168 174 224
FPGA PLL 5 5 6 6
HPS PLL 3 3 3 3
FPGA GPIO 145 145 288 288
HPS I/O 181 181 181 181
LVDS Transmitter 32 32 72 72
Receiver 37 37 72 72
FPGA Hard Memory Controller 1 1 1 1
HPS Hard Memory Controller 1 1 1 1
Arm Cortex-A9 MPCore Processor Single- or dual-
core
Single- or dual-
core
Single- or dual-core Single- or dual-core
Related Information
True LVDS Buffers in Devices, I/O Features in Cyclone V Devices
Provides the number of LVDS channels in each device package.
Package Plan
Table 11. Package Plan for Cyclone V SE Devices
The HPS I/O counts are the number of I/Os in the HPS and does not correlate with the number of HPS-specific
I/O pins in the FPGA. Each HPS-specific pin in the FPGA may be mapped to several HPS I/Os.
Member Code U484
(19 mm)
U672
(23 mm)
F896
(31 mm)
FPGA GPIO HPS I/O FPGA GPIO HPS I/O FPGA GPIO HPS I/O
A2 66 151 145 181 — —
A4 66 151 145 181 — —
A5 66 151 145 181 288 181
A6 66 151 145 181 288 181
Cyclone V Device Overview
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Cyclone V Device Overview
13
Cyclone V SX
This section provides the available options, maximum resource counts, and package
plan for the Cyclone V SX devices.
The information in this section is correct at the time of publication. For the latest
information and to get more details, refer to the Product Selector Guide.
Related Information
Product Selector Guide
Provides the latest information about Intel products.
Available Options
Figure 5. Sample Ordering Code and Available Options for Cyclone V SX Devices
The SEU internal scrubbing feature is available for Cyclone V E, GX, SE, and SX devices with the "SC" suffix in
the part number. For device availability and ordering, contact your local Intel sales representatives.
Cyclone V SE and SX low-power devices (L power option) offer 30% static power reduction for devices with
25K LE and 40K LE, and 20% static power reduction for devices with 85K LE and 110K LE.
Family Signature
Embedded Hard IPs Transceiver Count
Transceiver
Speed Grade
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
SX : SoC with 3-Gbps transceivers
F : Maximum 2 hard PCIe
controllers and 1 hard
memory controller
5C : Cyclone V
C2 : 25K logic elements
C4 : 40K logic elements
C5 : 85K logic elements
C6 : 110K logic elements
C : 6
D : 9
6 : 3.125 Gbps
F : FineLine BGA (FBGA)
U : Ultra FineLine BGA (UBGA)
FBGA Package Type
31 : 896 pins
UBGA Package Type
23 : 672 pins
C : Commercial (TJ = 0° C to 85° C)
I : Industrial (TJ = -40° C to 100° C)
A : Automotive (TJ = -40° C to 125° C)
6 (fastest)
7
8
N : Lead-free packaging
Contact Intel for availability
of leaded options
ES : Engineering sample
5C SX FC6 D 6F 31 C6N
Member Code
Family Variant
SC : Internal scrubbing support
L
Power Option
Omit for standard power
L : Low power
Maximum Resources
Table 12. Maximum Resource Counts for Cyclone V SX Devices
Resource Member Code
C2 C4 C5 C6
Logic Elements (LE) (K) 25 40 85 110
ALM 9,430 15,880 32,070 41,910
Register 37,736 60,376 128,300 166,036
Memory (Kb) M10K 1,400 2,700 3,970 5,570
MLAB 138 231 480 621
Variable-precision DSP Block 36 84 87 112
18 x 18 Multiplier 72 168 174 224
FPGA PLL 5 5 6 6
continued...
Cyclone V Device Overview
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Cyclone V Device Overview
14
Resource Member Code
C2 C4 C5 C6
HPS PLL 3 3 3 3
3 Gbps Transceiver 6 6 9 9
FPGA GPIO (8) 145 145 288 288
HPS I/O 181 181 181 181
LVDS Transmitter 32 32 72 72
Receiver 37 37 72 72
PCIe Hard IP Block 2 2 2 (9)2 (9)
FPGA Hard Memory Controller 1 1 1 1
HPS Hard Memory Controller 1 1 1 1
Arm Cortex-A9 MPCore Processor Dual-core Dual-core Dual-core Dual-core
Related Information
True LVDS Buffers in Devices, I/O Features in Cyclone V Devices
Provides the number of LVDS channels in each device package.
Package Plan
Table 13. Package Plan for Cyclone V SX Devices
The HPS I/O counts are the number of I/Os in the HPS and does not correlate with the number of HPS-specific
I/O pins in the FPGA. Each HPS-specific pin in the FPGA may be mapped to several HPS I/Os.
Member Code U672
(23 mm)
F896
(31 mm)
FPGA GPIO HPS I/O XCVR FPGA GPIO HPS I/O XCVR
C2 145 181 6 — — —
C4 145 181 6 — — —
C5 145 181 6 288 181 9
C6 145 181 6 288 181 9
Cyclone V ST
This section provides the available options, maximum resource counts, and package
plan for the Cyclone V ST devices.
The information in this section is correct at the time of publication. For the latest
information and to get more details, refer to the Product Selector Guide.
(8) The number of GPIOs does not include transceiver I/Os. In the Intel Quartus Prime software,
the number of user I/Os includes transceiver I/Os.
(9) 1 PCIe Hard IP Block in U672 package.
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15
Related Information
Product Selector Guide
Provides the latest information about Intel products.
Available Options
Figure 6. Sample Ordering Code and Available Options for Cyclone V ST Devices
Family Signature
Embedded Hard IPs
Transceiver Count
Transceiver
Speed Grade
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
ST : SoC with 6.144-Gbps transceivers
F : 2 hard PCIe controllers
and 1 hard memory controller
5C : Cyclone V
D5 : 85K logic elements
D6 : 110K logic elements
D : 9
5 : 6.144 Gbps
F : FineLine BGA (FBGA)
31 : 896 pins
I : Industrial (TJ= -40° C to 100° C)
7
N : Lead-free packaging
Contact Intel for availability
of leaded options
ES : Engineering sample
5C ST FD6 D 5F 31 C6N
Member Code
Family Variant
Maximum Resources
Table 14. Maximum Resource Counts for Cyclone V ST Devices
Resource Member Code
D5 D6
Logic Elements (LE) (K) 85 110
ALM 32,070 41,910
Register 128,300 166,036
Memory (Kb) M10K 3,970 5,570
MLAB 480 621
Variable-precision DSP Block 87 112
18 x 18 Multiplier 174 224
FPGA PLL 6 6
HPS PLL 3 3
6.144 Gbps Transceiver 9 9
FPGA GPIO(10) 288 288
HPS I/O 181 181
LVDS Transmitter 72 72
continued...
(10) The number of GPIOs does not include transceiver I/Os. In the Intel Quartus Prime software,
the number of user I/Os includes transceiver I/Os.
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Resource Member Code
D5 D6
Receiver 72 72
PCIe Hard IP Block 2 2
FPGA Hard Memory Controller 1 1
HPS Hard Memory Controller 1 1
Arm Cortex-A9 MPCore Processor Dual-core Dual-core
Related Information
True LVDS Buffers in Devices, I/O Features in Cyclone V Devices
Provides the number of LVDS channels in each device package.
Package Plan
Table 15. Package Plan for Cyclone V ST Devices
• The HPS I/O counts are the number of I/Os in the HPS and does not correlate with the number of HPS-
specific I/O pins in the FPGA. Each HPS-specific pin in the FPGA may be mapped to several HPS I/Os.
• Transceiver counts shown are for transceiver ≤5 Gbps . 6 Gbps transceiver channel count support depends
on the package and channel usage. For more information about the 6 Gbps transceiver channel count,
refer to the Cyclone V Device Handbook Volume 2: Transceivers.
Member Code F896
(31 mm)
FPGA GPIO HPS I/O XCVR
D5 288 181 9 (11)
D6 288 181 9 (11)
Related Information
6.144-Gbps Support Capability in Cyclone V GT Devices, Cyclone V Device Handbook
Volume 2: Transceivers
Provides more information about 6 Gbps transceiver channel count.
(11) If you require CPRI (at 4.9152 Gbps) and PCIe Gen2 transmit jitter compliance, Intel
recommends that you use only up to seven full-duplex transceiver channels for CPRI, and up
to six full-duplex channels for PCIe Gen2. The CMU channels are not considered full-duplex
channels.
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I/O Vertical Migration for Cyclone V Devices
Figure 7. Vertical Migration Capability Across Cyclone V Device Packages and Densities
The arrows indicate the vertical migration paths. The devices included in each vertical migration path are
shaded. You can also migrate your design across device densities in the same package option if the devices
have the same dedicated pins, configuration pins, and power pins.
Variant Member
Code
Package
M301 M383 M484 F256 U324 U484 F484 U672 F672 F896 F1152
Cyclone V E
A2
A4
A5
A7
A9
Cyclone V GX
C3
C4
C5
C7
C9
Cyclone V GT
D5
D7
D9
Cyclone V SE
A2
A4
A5
A6
Cyclone V SX
C2
C4
C5
C6
Cyclone V ST D5
D6
You can achieve the vertical migration shaded in red if you use only up to 175 GPIOs
for the M383 package, and 138 GPIOs for the U672 package. These migration paths
are not shown in the Intel Quartus Prime software Pin Migration View.
Note: To verify the pin migration compatibility, use the Pin Migration View window in the
Intel Quartus Prime software Pin Planner.
Adaptive Logic Module
Cyclone V devices use a 28 nm ALM as the basic building block of the logic fabric.
The ALM, as shown in following figure, uses an 8-input fracturable look-up table (LUT)
with four dedicated registers to help improve timing closure in register-rich designs
and achieve an even higher design packing capability than previous generations.
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Figure 8. ALM for Cyclone V Devices
FPGA Device
1
2
3
4
5
6
7
8
Adaptive
LUT
Full
Adder
Reg
Reg
Full
Adder
Reg
Reg
You can configure up to 25% of the ALMs in the Cyclone V devices as distributed
memory using MLABs.
Related Information
Embedded Memory Capacity in Cyclone V Devices on page 21
Lists the embedded memory capacity for each device.
Variable-Precision DSP Block
Cyclone V devices feature a variable-precision DSP block that supports these features:
• Configurable to support signal processing precisions ranging from 9 x 9, 18 x 18
and 27 x 27 bits natively
• A 64-bit accumulator
• A hard preadder that is available in both 18- and 27-bit modes
• Cascaded output adders for efficient systolic finite impulse response (FIR) filters
• Internal coefficient register banks, 8 deep, for each multiplier in 18- or 27-bit
mode
• Fully independent multiplier operation
• A second accumulator feedback register to accommodate complex multiply-
accumulate functions
• Fully independent Efficient support for single-precision floating point arithmetic
• The inferability of all modes by the Intel Quartus Prime design software
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Table 16. Variable-Precision DSP Block Configurations for Cyclone V Devices
Usage Example Multiplier Size (Bit) DSP Block Resource
Low precision fixed point for video
applications
Three 9 x 9 1
Medium precision fixed point in FIR
filters
Two 18 x 18 1
FIR filters and general DSP usage Two 18 x 18 with accumulate 1
High precision fixed- or floating-point
implementations
One 27 x 27 with accumulate 1
You can configure each DSP block during compilation as independent three 9 x 9, two
18 x 18, or one 27 x 27 multipliers. With a dedicated 64 bit cascade bus, you can
cascade multiple variable-precision DSP blocks to implement even higher precision
DSP functions efficiently.
Table 17. Number of Multipliers in Cyclone V Devices
The table lists the variable-precision DSP resources by bit precision for each Cyclone V device.
Variant Member
Code
Variable-
precision
DSP Block
Independent Input and Output
Multiplications Operator
18 x 18
Multiplier
Adder Mode
18 x 18
Multiplier
Adder
Summed
with 36 bit
Input
9 x 9
Multiplier
18 x 18
Multiplier
27 x 27
Multiplier
Cyclone V E A2 25 75 50 25 25 25
A4 66 198 132 66 66 66
A5 150 450 300 150 150 150
A7 156 468 312 156 156 156
A9 342 1,026 684 342 342 342
Cyclone V
GX
C3 57 171 114 57 57 57
C4 70 210 140 70 70 70
C5 150 450 300 150 150 150
C7 156 468 312 156 156 156
C9 342 1,026 684 342 342 342
Cyclone V GT D5 150 450 300 150 150 150
D7 156 468 312 156 156 156
D9 342 1,026 684 342 342 342
Cyclone V SE A2 36 108 72 36 36 36
A4 84 252 168 84 84 84
A5 87 261 174 87 87 87
A6 112 336 224 112 112 112
Cyclone V SX C2 36 108 72 36 36 36
C4 84 252 168 84 84 84
C5 87 261 174 87 87 87
continued...
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Variant Member
Code
Variable-
precision
DSP Block
Independent Input and Output
Multiplications Operator
18 x 18
Multiplier
Adder Mode
18 x 18
Multiplier
Adder
Summed
with 36 bit
Input
9 x 9
Multiplier
18 x 18
Multiplier
27 x 27
Multiplier
C6 112 336 224 112 112 112
Cyclone V ST D5 87 261 174 87 87 87
D6 112 336 224 112 112 112
Embedded Memory Blocks
The embedded memory blocks in the devices are flexible and designed to provide an
optimal amount of small- and large-sized memory arrays to fit your design
requirements.
Types of Embedded Memory
The Cyclone V devices contain two types of memory blocks:
• 10 Kb M10K blocks—blocks of dedicated memory resources. The M10K blocks are
ideal for larger memory arrays while still providing a large number of independent
ports.
• 640 bit memory logic array blocks (MLABs)—enhanced memory blocks that are
configured from dual-purpose logic array blocks (LABs). The MLABs are ideal for
wide and shallow memory arrays. The MLABs are optimized for implementation of
shift registers for digital signal processing (DSP) applications, wide shallow FIFO
buffers, and filter delay lines. Each MLAB is made up of ten adaptive logic modules
(ALMs). In the Cyclone V devices, you can configure these ALMs as ten 32 x 2
blocks, giving you one 32 x 20 simple dual-port SRAM block per MLAB.
Embedded Memory Capacity in Cyclone V Devices
Table 18. Embedded Memory Capacity and Distribution in Cyclone V Devices
Variant
Member
Code
M10K MLAB
Total RAM Bit
(Kb)Block RAM Bit (Kb) Block RAM Bit (Kb)
Cyclone V E A2 176 1,760 314 196 1,956
A4 308 3,080 485 303 3,383
A5 446 4,460 679 424 4,884
A7 686 6,860 1338 836 7,696
A9 1,220 12,200 2748 1,717 13,917
Cyclone V GX C3 135 1,350 291 182 1,532
C4 250 2,500 678 424 2,924
C5 446 4,460 678 424 4,884
C7 686 6,860 1338 836 7,696
C9 1,220 12,200 2748 1,717 13,917
continued...
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Variant
Member
Code
M10K MLAB
Total RAM Bit
(Kb)Block RAM Bit (Kb) Block RAM Bit (Kb)
Cyclone V GT D5 446 4,460 679 424 4,884
D7 686 6,860 1338 836 7,696
D9 1,220 12,200 2748 1,717 13,917
Cyclone V SE A2 140 1,400 221 138 1,538
A4 270 2,700 370 231 2,460
A5 397 3,970 768 480 4,450
A6 553 5,530 994 621 6,151
Cyclone V SX C2 140 1,400 221 138 1,538
C4 270 2,700 370 231 2,460
C5 397 3,970 768 480 4,450
C6 553 5,530 994 621 6,151
Cyclone V ST D5 397 3,970 768 480 4,450
D6 553 5,530 994 621 6,151
Embedded Memory Configurations
Table 19. Supported Embedded Memory Block Configurations for Cyclone V Devices
This table lists the maximum configurations supported for the embedded memory blocks. The information is
applicable only to the single-port RAM and ROM modes.
Memory Block Depth (bits) Programmable Width
MLAB 32 x16, x18, or x20
M10K 256 x40 or x32
512 x20 or x16
1K x10 or x8
2K x5 or x4
4K x2
8K x1
Clock Networks and PLL Clock Sources
550 MHz Cyclone V devices have 16 global clock networks capable of up to operation.
The clock network architecture is based on Intel's global, quadrant, and peripheral
clock structure. This clock structure is supported by dedicated clock input pins and
fractional PLLs.
Note: To reduce power consumption, the Intel Quartus Prime software identifies all unused
sections of the clock network and powers them down.
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PLL Features
The PLLs in the Cyclone V devices support the following features:
• Frequency synthesis
• On-chip clock deskew
• Jitter attenuation
• Programmable output clock duty cycles
• PLL cascading
• Reference clock switchover
• Programmable bandwidth
• User-mode reconfiguration of PLLs
• Low power mode for each fractional PLL
• Dynamic phase shift
• Direct, source synchronous, zero delay buffer, external feedback, and LVDS
compensation modes
Fractional PLL
In addition to integer PLLs, the Cyclone V devices use a fractional PLL architecture.
The devices have up to eight PLLs, each with nine output counters. You can use the
output counters to reduce PLL usage in two ways:
• Reduce the number of oscillators that are required on your board by using
fractional PLLs
• Reduce the number of clock pins that are used in the device by synthesizing
multiple clock frequencies from a single reference clock source
If you use the fractional PLL mode, you can use the PLLs for precision fractional-N
frequency synthesis—removing the need for off-chip reference clock sources in your
design.
The transceiver fractional PLLs that are not used by the transceiver I/Os can be used
as general purpose fractional PLLs by the FPGA fabric.
FPGA General Purpose I/O
Cyclone V devices offer highly configurable GPIOs. The following list describes the
features of the GPIOs:
• Programmable bus hold and weak pull-up
• LVDS output buffer with programmable differential output voltage (VOD ) and
programmable pre-emphasis
• On-chip parallel termination (RT OCT) for all I/O banks with OCT calibration to
limit the termination impedance variation
• On-chip dynamic termination that has the ability to swap between series and
parallel termination, depending on whether there is read or write on a common
bus for signal integrity
• Easy timing closure support using the hard read FIFO in the input register path,
and delay-locked loop (DLL) delay chain with fine and coarse architecture
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