SCLS034F − DECEMBER 1982 − REVISED NOVEMBER 2004
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DWide Operating Voltage Range of 2 V to 6 V
DOutputs Can Drive Up To 10 LSTTL Loads
DLow Power Consumption, 20-µA Max ICC
DTypical tpd = 14 ns
D±4-mA Output Drive at 5 V
DLow Input Current of 1 µA Max
DOperation From Very Slow Input
Transitions
DTemperature-Compensated Threshold
Levels
DHigh Noise Immunity
DSame Pinouts as ’HC00
description/ordering information
Each circuit functions as a NAND gate, but
because of the Schmitt action, it has dif ferent input
threshold levels for positive- and negative-going
signals. The ’HC132 devices perform the Boolean
function Y = A • B or Y = A + B in positive logic.
These circuits are temperature compensated and
can be triggered from the slowest of input ramps
and still give clean jitter-free output signals.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP − N Tube of 25 SN74HC132N SN74HC132N
Tube of 50 SN74HC132D
SOIC − D Reel of 2500 SN74HC132DR HC132
SOIC − D
Reel of 250 SN74HC132DT
HC132
−40°C to 85°CSOP − NS Reel of 2000 SN74HC132NSR HC132
−40 C to 85 C
SSOP − DB Reel of 2000 SN74HC132DBR HC132
Tube of 90 SN74HC132PW
TSSOP − PW Reel of 2000 SN74HC132PWR HC132
TSSOP − PW
Reel of 250 SN74HC132PWT
HC132
CDIP − J Tube of 25 SNJ54HC132J SNJ54HC132J
−55°C to 125°CCFP − W Tube of 150 SNJ54HC132W SNJ54HC132W
−55 C to 125 C
LCCC − FK Tube of 55 SNJ54HC132FK SNJ54HC132FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated
!"#$ % &'!!($ #% )'*+&#$ ,#$(-
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1B
1Y
2A
2B
2Y
GND
VCC
4B
4A
4Y
3B
3A
3Y
SN54HC132 ...J OR W PACKAGE
SN74HC132 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
4A
NC
4Y
NC
3B
1Y
NC
2A
NC
2B
1B
1A
NC
3Y
3A V
4B
2Y
GND
NC
SN54HC132 . . . FK PACKAGE
(TOP VIEW)
CC
NC − No internal connection
)!,'&$% &")+#$ $ 34 #++ )#!#"($(!% #!( $(%$(,
'+(%% $.(!0%( $(,- #++ $.(! )!,'&$% )!,'&$
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SCLS034F − DECEMBER 1982 − REVISED NOVEMBER 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
(each gate)
INPUTS
OUTPUT
A B
OUTPUT
Y
H H L
LXH
X L H
logic diagram (positive logic)
A
B
Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC132 SN74HC132
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 2 5 6 2 5 6 V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SCLS034F − DECEMBER 1982 − REVISED NOVEMBER 2004
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54HC132 SN74HC132
UNIT
PARAMETER
TEST CONDITIONS
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 0.7 1.2 1.5 0.7 1.5 0.7 1.5
V
T+
4.5 V 1.55 2.5 3.15 1.55 3.15 1.55 3.15 V
VT+
6 V 2.1 3.3 4.2 2.1 4.2 2.1 4.2
V
2 V 0.3 0.6 1 0.3 1 0.3 1
V
T−
4.5 V 0.9 1.6 2.45 0.9 2.45 0.9 2.45 V
VT−
6 V 1.2 2 3.2 1.2 3.2 1.2 3.2
V
2 V 0.2 0.6 1.2 0.2 1.2 0.2 1.2
V
T+
− V
T−
4.5 V 0.4 0.9 2.1 0.4 2.1 0.4 2.1 V
VT+ − VT−
6 V 0.5 1.3 2.5 0.5 2.5 0.5 2.5
V
2 V 1.9 1.998 1.9 1.9
I
OH
= −20 µA4.5 V 4.4 4.499 4.4 4.4
V
OH
V
I
= V
IH
or V
IL
IOH = −20 µA
6 V 5.9 5.999 5.9 5.9 V
VOH
VI = VIH or VIL
IOH = −4 mA 4.5 V 3.98 4.3 3.7 3.84
V
IOH = −5.2 mA 6 V 5.48 5.8 5.2 5.34
2 V 0.002 0.1 0.1 0.1
I
OL
= 20 µA4.5 V 0.001 0.1 0.1 0.1
V
OL
V
I
= V
IH
or V
IL
IOL = 20 µA
6 V 0.001 0.1 0.1 0.1 V
VOL
VI = VIH or VIL
IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33
V
IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33
IIVI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
ICC VI = VCC or 0, IO = 0 6 V 2 40 20 µA
Ci2 V to 6 V 3 10 10 10 pF
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC132 SN74HC132
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 60 120 186 156
t
pd
A or B Y4.5 V 18 25 37 31 ns
tpd
A or B
Y
6 V 14 21 32 27
ns
2 V 28 75 110 95
t
t
Any 4.5 V 8 15 22 19 ns
tt
Any
6 V 6 13 19 16
ns
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per gate No load 20 pF
SCLS034F − DECEMBER 1982 − REVISED NOVEMBER 2004
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
50%50% 10%10% 90% 90% VCC
0 V
trtf
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50% 10%10% 90% 90%
V
CC
VOH
VOL
0 V
trtf
Input
In-Phase
Output
50%
tPLH tPHL
50% 50%
10% 10% 90%90% VOH
VOL
tr
tf
tPHL tPLH
Out-of-Phase
Output
Test
Point
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time, with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-89845022A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-8984502CA ACTIVE CDIP J 14 1 TBD Call TI Call TI
5962-8984502DA ACTIVE CFP W 14 1 TBD Call TI Call TI
5962-8984502VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
5962-8984502VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN54HC132J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN74HC132D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74HC132DBR ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132DT ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132DTE4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132DTG4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC132NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74HC132NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132PW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74HC132PWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132PWT ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC132PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54HC132FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54HC132J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54HC132W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2012
Addendum-Page 3
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC132, SN54HC132-SP, SN74HC132 :
•Catalog: SN74HC132, SN54HC132
•Automotive: SN74HC132-Q1, SN74HC132-Q1
•Military: SN54HC132
•Space: SN54HC132-SP
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC132DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74HC132DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC132DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC132DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC132NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74HC132PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC132PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC132DBR SSOP DB 14 2000 367.0 367.0 38.0
SN74HC132DR SOIC D 14 2500 367.0 367.0 38.0
SN74HC132DR SOIC D 14 2500 333.2 345.9 28.6
SN74HC132DT SOIC D 14 250 367.0 367.0 38.0
SN74HC132NSR SO NS 14 2000 367.0 367.0 38.0
SN74HC132PWR TSSOP PW 14 2000 367.0 367.0 35.0
SN74HC132PWT TSSOP PW 14 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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