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Optimum Technology Matching® Applied
GaAs HBT
InGaP HBT
GaAs MESFET
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
Functional Block Diagram
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
Product Description
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Ordering Information
TXP
TXN
RXBN
SDN
VCC
ANT_SEL
ANT2
ANT
GND
VCC
VCC_BAIS
TXCT
RXBP
VCC
RXCT
CTL
GND
ANT1
NC
16
17
19
20
21 4
7
8
9
10
121315
18
5
6
11
3
NC
14
GND
RF6535
3.0V TO 4.2V, 2.4GHz FRONT END MODULE
The RF6535 integrates a complete solution in a single Front End Module (FEM) for
WiFi and ZigBee® applications in the 2.4GHz to 2.5GHz band. This FEM integrates
the PA plus harmonic filter in the transmit path and an LNA in the receive side. It
also integrates a diversity switch and provides balanced input and output signals
for both the TX and RX paths respectively.
The RF6535 FEM is ideal for ZigBee® systems operating with a minimum output
power of 20dBm and high efficiency requirements. On the receive path, the LNA
provides 11.5dB of typical gain with only 8mA of current and excellent NF down to
3dB. This FEM meets or exceeds the system requirements for WiFi and ZigBee®
applications operating in the 2.4GHz to 2.5GHz band. The device is provided in a
3.5mm x 3.5mm x 0.5mm, 20-pin QFN package.
Features
TX Output Power: 23dBm
TX Gain: 28dB
RX Gain: 11.5dB
RX NF: 3dB
Integrated LNA
Applications
ZigBee® 802.15.4 Based
Systems for Remote
Monitoring and Control
WiFi 802.11b/g
2.4GHz ISM band
applications
Smart Meters for Energy
Management
RF6535SQ Standard 25 piece bag
RF6535SR Standard 100 piece reel
RF6535TR13 Standard 2500 piece reel
RF6535PCK-410 Fully assembled evaluation board and 5 loose pieces
DS111110
Package Style: QFN, 20-Pin, 3.5mmx3.5mmx0.5mm
2 of 8
RF6535
DS111110
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Absolute Maximum Ratings
Parameter Rating Unit
DC Supply Voltage 5 V
Operating Case Temperature -40 to +85 °C
Storage Temperature -40 to +150 °C
ESD Human Body Model RF Pins 500 V
ESD Human Body Model All Other
Pins
500 V
ESD Charge Device Model All Pins 500 V
Moisture Sensitivity Level MSL 2
Maximum Input Power to PA +5 dBm
Maximum Input Power to LNA +10 dBm
Parameter Specification Unit Condition
Min. Typ. Max.
Overall
Specifications must be met across supply volt-
age, control voltage, and temperature ranges
unless otherwise noted. Typical conditions:
T=25°C, VCC=3.3V, CTL=High
Operating Frequency Range 2400 2483 MHz
Operating Voltage (VCC) 3.0 3.3 4.2 V
Operating Voltage (VCC_BIAS) 3 3.3 4.2 V
Leakage Current 45 60 uA VCC=3.3V, RF=OFF, CTL=Low
Transmit Parameters
Frequency 2400 2483 MHz
Input Return Loss 9
Balanced Input Impedance 200
Amplitude Imbalance -1 1 dB
Phase Imbalance -15 15 deg
Output Return Loss 10
Gain 24 28 dB At rated power
Gain Flatness -0.8 0.8 dB
Rated Output Power 23 dBm VCC=3.3, T = 25°C
22 dBm VCC greater than or equal to 3.3V; Temperature
less than or equal to 70°C
21 dBm All conditions
Supply current 240 260 mA PO=23dBm 802.15.4OQPSK
Supply current 230 250 mA PO=22dBm 802.15.4OQPSK
Supply current 220 240 mA PO=21dBm, All conditions
Thermal Resistance 55 °C/W VCC = 3.6V, POUT = 23dBm, TREF = 85°C
2nd through 5th harmonic level -45 -42 dBm/MHz Measured using standard 802.15.4OQPSK
modulation signal
VSWR Stability and load mismatch
susceptibility
4:1
VSWR No damage 8:1
Gain settling time 1 10 uS
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical perfor-
mance or functional operation of the device under Absolute Maximum Rating condi-
tions is not implied.
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended appli-
cation circuitry and specifications at any time without prior notice.
3 of 8
RF6535
DS111110
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Parameter Specification Unit Condition
Min. Typ. Max.
Transmit Parameters, cont.
Current sourced through TXCT pin 18.0 mA
Voltage drop from TXCT pin to
TXP/TXN
0.1 V
Receive Parameters
Frequency 2400 2483 MHz
Gain 9.5 11.5 13.5 dB From antenna to RX pin (entire RX path).
Noise Figure 3 4 dB From antenna to RX pin (entire RX path).
Current 8 11 mA LNA + Switches
Input IP3 7 dBm
Gain flatness -0.5 0.5 dB
Input return loss 6 8.5 dB
Output return loss 7.5 dB
Balanced Output Impedance 200
Amplitude imbalance -1 1 dB
Phase imbalance -15 15 deg
Current sourced through RXCT pin 1 mA
Voltage drop from RXCT pin to
RXP/RXN
0.1 V
Antenna Switch
RF-to-Control Isolation 50 dB Measured at any control pin while in TX or RX
mode.
RF-to-ANT Isolation 17 20 dB Measured from Antenna to RX port while in
Transmit mode. Measured from Antenna to TX
port while in Receive mode.
RF-to-RF Isolation 18 20 dB Measured from TX port to RX port while in
receive or transmit modes.
Antenna Select Switch Speed 1 uS ANT1 or ANT2 path, TX or RX mode
Control Logic
Control Logic = HIGH =VCC-0.3 =VCC VSDN and ANT_SEL
Control Logic = HIGH 1.7 1.8 3.6 V CTL
Control Logic = LOW 0 0.2 V All Logic I/O’s
Control Current. Logic HIGH 10 A All Logic I/O’s
Control Current. Logic LOW 0.1 A All Logic I/O’s
4 of 8
RF6535
DS111110
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Pin Function Description
1SDN
Enable/Shutdown pin for entire module. See logic table for operation.
2VCC
Voltage Supply. An external 1uF capacitor might be needed for low frequency decoupling.
3ANT_SEL
Control pin for Antenna select. See logic table for operation.
4CTL
Enable voltage pin for both PA/Transmit Switch and LNA/Receive Switch. See logic table for operation.
5NC
No connect pin. Must be left floating.
6ANT2
This is the common port (antenna). It is matched to 50Ω and DC-block is provided internally.
7GND
Ground.
8ANT1
This is the common port (antenna). It is matched to 50Ω and DC-block is provided internally
9GND
Ground.
10 VCC Voltage Supply. An external 1uF capacitor might be needed for low frequency decoupling
11 NC No connect pin. Must be left floating.
12 VCC Voltage Supply. An external 1uF capacitor might be needed for low frequency decoupling
13 VCC_BIAS Voltage Supply. An external 1 uF capacitor might be needed for low frequency decoupling
14 GND Ground.
15 TXCT Center tap for pass-thru DC voltage to TXN and TXP pins that connect to the TXVR SOIC.
16 TXN 100 Ω single ended, 200Ω differential.
17 TXP 100 Ω single ended, 200Ω differential.
18 RXCT Center tap for pass-thru DC voltage to RXBN and RXBP pins that connect to the TXVR SOIC.
19 RXBN 100 Ω single ended, 200Ω differential.
20 RXBP 100 Ω single ended, 200Ω differential.
6 of 8
RF6535
DS111110
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
RF6535 Biasing Instructions
TX Mode
• With the RF source disabled, apply 3.3V to VCC with other controls set to 0V
• Apply 3.0V to SDN and 1.8V to CTL
• Apply 0V to ANT_SEL to select the ANT1 port, or 3.0V to select the ANT2 port
• Vcc current should rise to 70mA to 80mA quiescent current
• Enable the RF source; Vcc current should rise to a maximum of 200mA depending on output power
RX Mode
• With the RF source disabled, apply 3.3V to VCC with other controls set to 0V
• Apply 3.0V to SDN, keeping CTL at 0V
• Apply 0V to ANT_SEL to select the ANT1 port, or 3.0V to select the ANT2 port
• Vcc current should rise to 7mA to 8mA
• Enable the RF source; VCC current may increase a few mA depending on output power
Logic Table
Mode SDN CTL ANT_SEL
TX-ANT1 3.0V 1.8V 0V
TX_ANT2 3.0V 1.8V 3.0V
RX-ANT1 3.0V 0 0V
RX-ANT1 3.0V 0 3.0V
All OFF 000
7 of 8
RF6535
DS111110
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Evaluation Board Schematic
1 2 3 4
CTL
U1
RF6535
100 strip
J1
TX
100 strip
C1
0.1F
L2
3.6nH
C2
0.9pF
50 strip J4
ANT2
50 strip
SDN
5
VCC
L1
3.0nH
ANT_SEL
L4
3.6nH
L3
1.3nH
6
7
8
9
10
20
19
18
17
16
15 14 13 12 11
L7
3.6nH
C3
0.9pF
50 strip J3
ANT1
L5
3.6nH
L6
1.3nH
L8
1.8nH
C4
1.0F
VCC
L9
4.3nH
C6
0.1F
C5
0.1F
CT
4
5
6
3
2
1
100 strip
100 strip
50 strip
1
2
3
6
5
4
J2
RX
CT
BALUN
2450MHz
50 - 200
BALUN
2450MHz
50 - 200
8 of 8
RF6535
DS111110
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch
to 8 inch gold over 180inch nickel.
PCB Land Pattern Recommendation
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land and Solder Mask Pattern
Thermal vias for center slug “C” should be incorporated into the PCB design. The number and size of thermal vias will depend
on the application, the power dissipation, and this electrical requirements. Example of the number and size of vias can be
found on the RFMD evaluation board layout.
