PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) 5962-87621012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596287621012A SNJ54LS 592FK 5962-8762101EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101EA SNJ54LS592J 5962-8762101EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101EA SNJ54LS592J 5962-8762101FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101FA SNJ54LS592W 5962-8762101FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101FA SNJ54LS592W SN54LS592J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS592J SN54LS592J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS592J SN54LS593J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS593J SN54LS593J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS593J SN74LS592D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592 SN74LS592D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592 SN74LS592DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592 SN74LS592DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592 SN74LS592DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592 SN74LS592DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS592 SN74LS592DR OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 LS592 SN74LS592DR OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 LS592 SN74LS592DRE4 OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) SN74LS592DRE4 OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 SN74LS592DRG4 OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 SN74LS592DRG4 OBSOLETE SOIC D 16 TBD Call TI Call TI 0 to 70 SN74LS592N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS592N SN74LS592N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS592N SN74LS592N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS592N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS592NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS592N SN74LS592NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS592N SN74LS592NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592 SN74LS592NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592 SN74LS592NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592 SN74LS592NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592 SN74LS592NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592 SN74LS592NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS592 SN74LS593DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593 SN74LS593DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593 SN74LS593DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593 SN74LS593DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593 SN74LS593DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) SN74LS593DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593 SN74LS593DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593 SN74LS593DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593 SN74LS593DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593 SN74LS593DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593 SN74LS593DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593 SN74LS593DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS593 SN74LS593N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS593N SN74LS593N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS593N SN74LS593N3 OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70 SN74LS593N3 OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 70 SN74LS593NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS593N SN74LS593NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS593N SNJ54LS592FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596287621012A SNJ54LS 592FK SNJ54LS592FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596287621012A SNJ54LS 592FK SNJ54LS592J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101EA SNJ54LS592J SNJ54LS592J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101EA SNJ54LS592J Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 25-Sep-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) SNJ54LS592W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101FA SNJ54LS592W SNJ54LS592W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762101FA SNJ54LS592W SNJ54LS593FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS 593FK SNJ54LS593FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS 593FK SNJ54LS593J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS593J SNJ54LS593J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS593J SNJ54LS593W OBSOLETE 20 TBD Call TI Call TI -55 to 125 SNJ54LS593W OBSOLETE 20 TBD Call TI Call TI -55 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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OTHER QUALIFIED VERSIONS OF SN54LS592, SN54LS593, SN74LS592, SN74LS593 : * Catalog: SN74LS592, SN74LS593 * Military: SN54LS592, SN54LS593 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 5 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS592NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74LS593DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS592NSR SO NS 16 2000 367.0 367.0 38.0 SN74LS593DWR SOIC DW 20 2000 367.0 367.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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