ABA-32563
2.5 GHz Broadband Silicon RFIC Amplifier
Data Sheet
Description
Avago’s ABA-32563 is an economical, easy-to-use,
internally 50Ω matched, silicon monolithic broadband
amplifier that offers excellent gain and broadband
response from DC to 2.5 GHz. Packaged in an ultra-
miniature SOT-363 package, it requires half the board
spaceof a SOT-143 package.
At 2 GHz, the ABA-32563 offers a small-signal gain of
19 dB, output P1dB of 8.4 dBm and 19.5 dBm output third
order intercept point. It is suitable for use as wideband
applications. They are designed for low cost gain blocks in
cellular applications, DBS tuners, LNB and other wireless
communication systems.
ABA-32563 is fabricated using Avago’s HP25 silicon
bipolar process, which employs a double-diffused single
polysilicon process with self-aligned submicron emitter
geometry. The process is capable of simultaneous high
fT and high NPN breakdown (25 GHz fT at 6V BVCEO). The
process utilizes industry standard device oxide isolation
technologies and submicron aluminum multilayer
interconnect to achieve superior performance, high
uniformity, and proven reliability.
Features
• Operating Frequency DC ~ 2.5 GHz
• 19 dB Gain
• VSWR < 2.0 throughout operating frequency
• 8.4 dBm Output P1dB
• 19.5 dBm Output IP3
• 3.5 dB Noise Figure
• Unconditionally Stable
• Single 3V Supply (Id = 37 mA)
• Lead-free
Applications
• Amplifier for Cellular, Cordless, Special Mobile Radio, PCS, ISM, Wireless
LAN, DBS, TVRO, and TV Tuner Applications
Attention:
Observe precautions for handling electrostatic
sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 1B)
Refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control.
Surface Mount Package: SOT-363/SC70
Pin Connections and Package Marking Simplified Schematic
Note:
Top View. Package marking provides orientation and identification.
“x” is the date code.
Vcc
GND 3
2Kx
Input
GND 1
GND 2 Output
& Vcc
Vcc
Ground 1
Ground 2
Ground 3
RF
Input
RF
Output
& Vcc
2
ABA-32563 Absolute Maximum Ratings[1]
Symbol Parameter Units Absolute Max.
Vcc Device Voltage, RF output to ground (T = 25°C) V 6
Pin CW RF Input Power (Vcc = 3V) dBm 15
Pdiss Total Power Dissipation[3] W 0.6
Tj Junction Temperature °C 150
TSTG Storage Temperature °C -65 to 150
Notes:
1.
Operation of this device in excess of any of
these limits may cause permanent damage.
2. Thermal resistance measured using 150°C
Liquid Crystal Measurement Technique.
3. Board (package belly) temperature, Tc, is
25°C. Derate 8.1 mW/°C for Tc > 120.8°C.
Electrical Specifications
Tc = +25°C, Zo = 50 Ω, Pin = -30 dBm, Vcc = 3V, Freq = 2 GHz, unless stated otherwise.
Symbol Parameter and Test Condition Units Min. Typ. Max. Std Dev.
Gp[1] Power Gain (|S21|2) dB 17.5 19.0
∆Gp Power Gain Flatness, f = 0.1 ~ 1.5 GHz dB 1.0
f = 0.1 ~ 2.5 GHz 3.0
NF[1] Noise Figure dB 3.5 4.4
P1dB[1] Output Power at 1dB Gain Compression dBm 8.4
OIP3[1] Output Third Order Intercept Point dBm 19.5
VSWRin[1] Input VSWR <1.5
VSWRout[1] Output VSWR <1.5
Icc[1] Device Current mA 37 42.5
Td[1] Group Delay ps 140
Notes:
1. Measurements taken on 50Ω test board shown on Figure 1. Excess circuit losses had been de-embedded from actual measurements. Standard
deviation and typical data based on at least 500 parts sample size from 2 wafer lots. Future wafers allocated to this product may have nominal
values anywhere within the upper and lower spec limits.
Figure 1. ABA-32563 Production Test Circuit.
Thermal Resistance[2] (Vcc = 3V)
θj-c = 124.3°C/W
RF Outpu
t
RF Input Vcc
2Kx
C
bypass
100 pF
C
bypass
1000 pF
RFC
33 nH
C
block
1 nF
C
block
1 nF
3
ABA-32563 Typical Performance
Tc = +25°C, Zo = 50Ω, Vcc = 3V unless stated otherwise.
FREQUENCY (GHz)
Figure 2. Gain vs. Frequency and Voltage.
GAIN (dB)
0
22
20
18
16
14
12 41
0.5 2 2.5 31.5 3.5
3.5V
3V
2.7V
FREQUENCY (GHz)
Figure 3. Gain vs. Frequency and Temperature.
GAIN (dB)
0
22
20
18
16
14
12 41
0.5 2 2.5 31.5 3.5
+85C
+25C
-40C
FREQUENCY (GHz)
Figure 4. Noise Figure vs. Frequency and Voltage.
NF (dB)
0
5
4.5
4
3.5
3
2.5
241
0.5 2 2.5 31.5 3.5
3.5V
3V
2.7V
FREQUENCY (GHz)
Figure 5. Noise Figure vs. Frequency and Temperature.
NF (dB)
0
5
4.5
4
3.5
3
2.5
241
0.5 2 2.5 31.5 3.5
+85C
+25C
-40C
FREQUENCY (GHz)
Figure 6. Output Power for 1 dB Gain Compression vs.
Frequency and Voltage.
P1dB (dBm)
0
13
11
9
7
5
341
0.5 2 2.5 31.5 3.5
3.5V
3V
2.7V
FREQUENCY (GHz)
Figure 7. Output Power for 1 dB Gain Compression vs.
Frequency and Temperature.
P1dB (dBm)
0
13
11
9
7
5
341
0.5 2 2.5 31.5 3.5
+85C
+25C
-40C
4
ABA-32563 Typical Performance, continued
Tc = +25°C, Zo = 50Ω, Vcc = 3V unless stated otherwise.
FREQUENCY (GHz)
Figure 8. Output IP3 vs. Frequency and Voltage.
OIP3 (dBm)
0
32
28
24
20
16
12
41
0.5 2 2.5 31.5 3.5
3.5V
3V
2.7V
FREQUENCY (GHz)
Figure 9. Output IP3 vs. Frequency and Temperature.
OIP3 (dBm)
0
32
28
24
20
16
12
41
0.5 2 2.5 31.5 3.5
+85C
+25C
-40C
FREQUENCY (GHz)
Figure 10. Input and Output VSWR vs. Frequency.
VSWR
1.8
1.6
1.4
1.2
1.0
VSWR IN
VWSR OUT
0 41
0.5 2 2.5 31.5 3.5
VOLTAGE (V)
Figure 11. Supply Current vs. Voltage and
Temperature.
Icc (mA)
0
120
100
80
60
40
20
02
14563 7
+85C
+25C
-40C
5
ABA-32563 Typical Scattering Parameters
TC = +25°C, ZO = 50Ω, VCC = 3V, unless stated otherwise
Freq S11 S
11 S
21 S
21 S
21 S
12 S
12 S
22 S
22 K
(GHz) Mag. Ang. dB Mag. Ang. Mag. Ang. Mag. Ang. Factor
0.10 0.12 171.5 20.0 10.00 -5.6 0.02 2.6 0.28 -6.5 2.70
0.20 0.11 167.2 20.0 10.04 -11.0 0.02 6.0 0.27 -12.9 2.70
0.30 0.11 162.7 20.1 10.07 -16.7 0.02 9.5 0.27 -18.8 2.70
0.40 0.10 158.0 20.1 10.09 -22.5 0.02 12.8 0.27 -24.8 2.70
0.50 0.10 139.9 20.0 10.02 -28.8 0.02 15.7 0.26 -27.6 2.60
0.60 0.10 129.4 20.0 9.95 -34.7 0.02 18.6 0.26 -31.7 2.60
0.70 0.10 121.2 19.9 9.88 -40.6 0.02 21.2 0.25 -35.9 2.50
0.80 0.09 111.6 19.8 9.79 -46.4 0.02 23.5 0.25 -40.4 2.40
0.90 0.09 102.0 19.7 9.69 -52.2 0.02 25.5 0.25 -45.0 2.40
1.00 0.09 93.3 19.6 9.58 -58.1 0.02 26.9 0.24 -49.8 2.30
1.10 0.08 84.1 19.5 9.48 -63.7 0.02 28.6 0.24 -54.5 2.30
1.20 0.08 75.4 19.4 9.35 -69.5 0.02 29.6 0.23 -59.4 2.20
1.30 0.08 66.5 19.3 9.24 -75.2 0.03 30.2 0.22 -64.5 2.10
1.40 0.08 55.2 19.2 9.12 -80.8 0.03 30.9 0.22 -69.8 2.10
1.50 0.08 45.2 19.1 8.99 -86.5 0.03 31.4 0.21 -75.2 2.10
1.60 0.07 34.1 19.0 8.86 -92.3 0.03 31.8 0.20 -80.7 2.00
1.70 0.08 24.4 18.8 8.71 -98.1 0.03 31.9 0.18 -86.4 2.00
1.80 0.08 10.6 18.6 8.54 -103.6 0.03 31.7 0.17 -92.0 2.00
1.90 0.08 -2.2 18.5 8.41 -109.3 0.03 31.9 0.16 -98.5 2.00
2.00 0.08 -12.5 18.4 8.27 -115.0 0.03 31.9 0.15 -105.6 2.00
2.20 0.08 -34.6 17.9 7.87 -126.4 0.03 31.8 0.12 -120.6 2.00
2.40 0.09 -57.6 17.5 7.51 -137.5 0.04 31.9 0.10 -139.2 2.00
2.60 0.10 -77.3 17.0 7.08 -148.8 0.04 32.3 0.08 -163.9 2.00
2.80 0.12 -93.3 16.4 6.64 -159.3 0.04 32.4 0.07 167.4 2.10
3.00 0.13 -108.3 15.9 6.21 -169.6 0.04 32.4 0.07 137.7 2.10
3.20 0.15 -124.9 15.3 5.81 -179.7 0.04 32.1 0.08 115.7 2.10
3.40 0.16 -137.7 14.6 5.39 170.6 0.05 32.2 0.09 98.7 2.10
3.60 0.19 -150.1 14.0 5.04 161.4 0.05 31.5 0.10 86.3 2.10
3.80 0.20 -162.9 13.5 4.71 152.1 0.05 31.0 0.12 78.9 2.10
4.00 0.22 -175.0 12.8 4.38 142.9 0.05 30.5 0.13 71.9 2.10
4.20 0.23 175.0 12.1 4.04 134.4 0.06 30.0 0.14 65.2 2.10
4.40 0.26 166.1 11.6 3.79 126.2 0.06 28.2 0.15 59.1 2.10
4.60 0.27 155.3 11.0 3.54 117.3 0.06 26.7 0.15 55.0 2.10
4.80 0.28 145.8 10.2 3.25 108.7 0.07 25.2 0.16 50.2 2.10
5.00 0.29 138.3 9.5 2.99 101.3 0.07 23.2 0.16 45.0 2.20
5.20 0.30 131.7 8.8 2.77 94.2 0.08 20.8 0.16 40.1 2.20
5.40 0.31 126.2 8.2 2.57 87.6 0.08 18.4 0.16 35.1 2.20
5.60 0.32 120.9 7.7 2.42 81.0 0.09 15.6 0.16 30.3 2.20
5.80 0.34 115.6 7.2 2.28 74.3 0.09 12.7 0.16 25.3 2.20
6.00 0.35 110.4 6.6 2.14 67.7 0.09 9.6 0.15 23.8 2.20
6
Device Models
Refer to Avago’s web site
www.avagotech.com/view/rf
Ordering Information
Part Number Devices per Container Container
ABA-32563-TR1G 3000 7" reel
ABA-32563-TR2G 10000 13" reel
ABA-32563-BLKG 100 antistatic bag
Note: Only lead-free option available.
Package Dimensions
Outline 63 (SOT-363/SC-70)
Recommended PCB Pad Layout for
Avago's SC70 6L/SOT-363 Products
E
HE
D
e
A1
b
A
A2
Q1
L
c
DIMENSIONS (mm)
MIN.
1.15
1.80
1.80
0.80
0.80
0.00
0.10
0.15
0.10
0.10
MAX.
1.35
2.25
2.40
1.10
1.00
0.10
0.40
0.30
0.20
0.30
SYMBOL
E
D
HE
A
A2
A1
Q1
e
b
c
L
NOTES:
1. All dimensions are in mm.
2. Dimensions are inclusive of plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to EIAJ SC70.
5. Die is facing up for mold and facing down for trim/form,
ie: reverse trim/form.
6. Package surface to be mirror finish.
0.650 BCS
0.026
0.079
0.018
0.039
Dimensions in inches.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes 5989-1969EN
AV02-1783EN - February 11, 2009
Device Orientation
Tape Dimensions and Product Orientation for Outline 63
USER
FEED
DIRECTION
COVER TAPE
CARRIER
TAPE
REEL
END VIEW
8 mm
4 mm
TOP VIEW
(Package marking example orientation shown.)
2Kx 2Kx 2Kx 2Kx