CYStech Electronics Corp.
Spec. No. : C302C2-A
Issued Date : 2004.02.11
Revised Date :
Page No. : 1/3
RB520S-30C2 CYStek Product Specification
Small Signal Schottky diode
RB520S-30C2
Description
These devices are designed for high speed switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for
hand held and portable applications where space is limited.
Features
•Extremely small surface mounting type.(SC-79/SOD523)
•Extremely fast switching speed
•Low reverse current
•Extremely low forward voltage.(VF=0.6V max. at 200mA)
Symbol Outline
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature Tstg .................................................................................................... -55~+150°C
Junction Temperature Tj .............................................................................................................. +150°C
• Maximum Voltages and Currents (Ta=25°C)
DC Reverse Voltage VR...................................................................................................................... 30 V
Mean Rectifying Current IF......................................................................................................... 200 mA
• Thermal Characteristics
Total Device Dissipation @ TA=25°C (Note) PD……………………………………………….200mW
Thermal Resistance, Junction to Ambient RθJA……………………………………………625°C/W
Note: FR-5 board minimum pad.
CYStech Electronics Corp.
Spec. No. : C302C2-A
Issued Date : 2004.02.11
Revised Date :
Page No. : 2/3
RB520S-30C2 CYStek Product Specification
Characteristics (Ta=25°C)
Characteristic Symbol Condition Min. Max. Unit
Forward Voltage VF I
F=200mA - 600 mV
Reverse Leakage Current IR V
R=10V - 1 µA
Characteristic Curves
Forward Current Derating Curve
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175 200
Ambient Temperature---TA(℃)
Percentage of Rated Forward Current---(%)
Mounting on glass
epoxy PCBs
Forward Current vs Forward Voltage
0.1
1
10
100
1000
0 0.1 0.2 0.3 0.4 0.5 0.6
Forward Voltage---VF(V)
Forward Current---I F(mA)
- 55℃
25℃
85℃
125℃
Reverse Leakage Current vs Reverse Voltage
0.001
0.01
0.1
1
10
100
1000
0102030
Reverse Voltage---VR(V)
Reverse Leakage Current---I R(μA)
Ta= 85℃
Ta= 25℃
Ta= 125℃
Capacitance vs Reverse Voltage
0
2
4
6
8
10
12
14
16
18
20
0 5 10 15 20 25 30
Reverse Voltage---VR(V)
Capacitance between terminals---C T(pF)
f=1MHz
Ta=25℃
CYStech Electronics Corp.
Spec. No. : C302C2-A
Issued Date : 2004.02.11
Revised Date :
Page No. : 3/3
RB520S-30C2 CYStek Product Specification
SOD-523 Dimension
*: Typical
Millimeters Millimeters
DIM Min .Max.
DIM Min. Max.
A 0.5 0.7 E 0.7 0.9
bp 0.25 0.35 HE 1.5 1.7
c 0.1 0.2 V 0.15(typ)
D 1.1 1.3
Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
2.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Marking Code :
5J
2-lead SOD-523 Plastic Package
CYStek Packa
g
e Code : C2
Style : Pin 1. Cathode 2. Anode
2 1
2
1
