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FEATURES
ADVANTAGES
AB
18
OUTPUT A (Comparator) V+
INVERTING INPUT B
NONINVERTING INPUT B
OUTPUT B (Operational Amplifier)
4
3
2
5
6
7
GND
NONINVERTING INPUT A
INVERTING INPUT A
−−
++
D, DGK, OR P PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
LM392LOW-POWER OPERATIONAL AMPLIFIER AND VOLTAGE COMPARATOR
SLOS466 – JANUARY 2006
•Wide Power-Supply Voltage Range •Additional Comparator Features– Single Supply: 3 V to 32 V – Low Output Saturation Voltage:250 mV at 4 mA– Dual Supply: ±1.5 V to ±16 V
– Output Voltage Compatible With All Types•Low Supply-Current Drain Essentially
of Logic SystemsIndependent of Supply Voltage: 600 µA•Low Input Biasing Current: 50 nA•Low Input Offset Voltage: 2 mV
•Eliminates Need for Dual Power Supplies•Low Input Offset Current: 5 nA
•An Internally Compensated Operational•Input Common-Mode Voltage Range Includes
Amplifier and a Precision Comparator in theGround
Same Package•Allows Sensing at or Near Ground•Differential Input Voltage Range Equals
xxxPower-Supply Voltage•Additional Operational Amplifier Features– Internally Frequency Compensated forUnity Gain– Large DC Voltage Gain: 100 dB– Wide Bandwidth (Unity Gain): 1 MHz– Large Output Voltage Swing:0 V to V+ – 1.5 V
The LM392 consists of two independent building-block circuits. One is a high-gaininternally-frequency-compensated operational amplifier, and the other is a precision voltage comparator. Both theoperational amplifier and the voltage comparator are designed to operate from a single power supply over a widerange of voltages. Both circuits have input stages that force the common-mode input down to ground whenoperating from a single power supply. Operation from split power supplies also is possible, and the lowpower-supply current is independent of the magnitude of the supply voltage.
Applications include transducer amplifiers with pulse shapers, DC gain blocks with level detectors, and VCOs, aswell as all conventional operational amplifier or voltage-comparator circuits. The LM392 can be operated directlyfrom the standard 5-V power-supply voltage used in digital systems, and the output of the comparator interfacesdirectly with either TTL or CMOS logic. In addition, the low-power drain makes the LM392 extremely useful in thedesign of portable equipment.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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V+
OUTPUT
+INPUT
–INPUT
3.5 µA 100 µA100 µA3.5 µA 6 µA
–INPUT
+INPUT
Comparator Amplifier
4 µA
OUTPUT
100 µA
50 µA
LM392
LOW-POWER OPERATIONAL AMPLIFIER AND VOLTAGE COMPARATOR
SLOS466 – JANUARY 2006
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
Reel of 250 LM392DGKTMSOP – DGK PREVIEWReel of 2500 LM392DGKR0°C to 70 °C PDIP – P Tube of 50 LM392P LM392PTube of 75 LM392DSOIC – D LM392Reel of 2500 LM392DR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
SCHEMATIC DIAGRAM
2
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Absolute Maximum Ratings
(1)
Recommended Operating Conditions
LM392LOW-POWER OPERATIONAL AMPLIFIER AND VOLTAGE COMPARATOR
SLOS466 – JANUARY 2006
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Single supply 32V+ Supply voltage VDual supply ±16V
ID
Differential input voltage 32 VV
IN
Input voltage range –0.3 32 VI
I
Input current
(2)
V
IN
< –0.3 V 50 mAt
short
Duration of output short circuit to ground
(3)
ContinuousD package 97θ
JA
Package thermal impedance, junction to free air
(4)
DGK package 172 °C/WP package 84T
lead
Lead temperature during soldering 10 s maximum 260 °CT
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) This input current exists only when the voltage at any of the input leads is driven negative. It is due to the collector-base junction of theinput PNP transistors becoming forward biased and thereby acting as input diode clamps. In addition to this diode action, there is alsolateral NPN parasitic transistor action on the device. This transistor action can cause the output voltages of the amplifiers to go to the V+voltage level (or to ground for a large overdrive) for the time duration that an input is driven negative. This is not destructive, and normaloutput states reestablish when the input voltage, which was negative, again returns to a value greater than –0.3 V (at 25°C).(3) Short circuits from the output to V+ can cause excessive heating and eventual destruction. When considering short circuits to ground,the maximum output current is approximately 40 mA for the operational amplifier and 30 mA for the comparator, independent of themagnitude of V+. At values of supply voltage in excess of 15 V, continuous short circuits can exceed the power dissipation ratings andcause eventual destruction.(4) Package thermal impedance is calculated in accordance with JESD 51-7.
MIN MAX UNIT
Single supply 3 32V+ Supply voltage VDual supply ±1.5 ±16T
A
Operating free-air temperature 0 70 °C
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Electrical Characteristics
Electrical Characteristics, Operational Amplifier Only
LM392
LOW-POWER OPERATIONAL AMPLIFIER AND VOLTAGE COMPARATOR
SLOS466 – JANUARY 2006
V+ = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS T
A
MIN TYP MAX UNIT
At output switch point, V
O
≈1.4 V, 25°C ±2±5V
IO
Input offset voltage R
S
= 0 Ω, V+ = 5 V to 30 V, mV0°C to 70 °C±7V
CM
= 0 V to (V+ – 1.5 V)IN(+) or IN(–), V
CM
= 0 V
(1)
25°C 50 205I
IB
Input bias current nAIN(+) or IN(–) 0 °C to 70 °C 40025°C ±5±50I
IO
Input offset current IN(+) – IN(–) nA0°C to 70 °C 15025°C 0 V+ – 1.5V
CM
Input common-mode voltage
(2)
V+ = 30 V V0°C to 70 °C 0 V+ – 2V+ = 30 V 1 2I+ Supply current R
L
=∞0°C to 70 °C mAV+ = 5 V 0.5 1Amplifier-to-amplifier coupling f = 1 kHz to 20 kHz, Input referred
(3)
25°C –100 dBV
DI
Differential input voltage All V
IN
≥0 V (or V–, if used)
(4)
0°C to 70 °C 32 V
(1) The direction of the input current is out of the device due to the PNP input stage. This current essentially is constant and independent ofthe state of the output, so no loading change exists on the input lines.(2) The input common-mode voltage or either input signal voltage should not be allowed to go negative by more than 0.3 V. The upper endof the common-mode voltage range is V+ – 1.5 V, but either or both inputs can go to 32 V without damage.(3) Due to proximity of external components, ensure that coupling is not originating via the stray capacitance between these external parts.This typically can be detected, as this type of capacitive coupling increases at higher frequencies.(4) Positive excursions of input voltage may exceed the power-supply level. As long as the other input voltage remains within thecommon-mode range, the comparator provides a proper output state. The input voltage to the operational amplifier should not exceedthe power-supply level. The input voltage state must not be less than –0.3 V (or 0.3 V below the magnitude of the negative powersupply, if used) on either amplifier.
V+ = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS T
A
MIN TYP MAX UNIT
V+ = 15 V, V
O
swing = 1 V to 11 V,A
VD
Large signal voltage gain 25°C 25 100 V/mVR
L
= 2 k ΩV
OS
Output voltage swing R
L
= 2 k Ω25°C 0 V+ – 1.5 VCommon-mode rejectionCMRR V
CM
= 0 V to (V+ – 1.5 V) 25°C 65 70 dBratio
Power-supply
k
SVR
25°C 65 100 dBrejection ratio
V
IN(+)
= 1 V, V
IN(–)
= 0 V, V+ = 15 V,I
source
Output source current 25°C 20 40 mAV
O
= 2 VV
IN(–)
= 1 V, V
O
= 2 V 10 20 mAI
sink
Output sink current V
IN(+)
= 0 V, 25°CV
O
= 200 mV 12 50 µAV+ = 15 VαV
IO
Input offset voltage drift R
S
= 0 Ω0°C to 70 °C 7 µV/ °CαI
IO
Input offset current drift R
S
= 0 Ω0°C to 70 °C 10 pA/ °C
4
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Electrical Characteristics, Comparator Only
LM392LOW-POWER OPERATIONAL AMPLIFIER AND VOLTAGE COMPARATOR
SLOS466 – JANUARY 2006
V+ = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS T
A
MIN TYP MAX UNIT
V
G
Voltage gain R
L
≥15 k Ω, V+ = 15 V 25°C 50 200 V/mVV
IN
= TTL logic swing, V
REF
= 1.4 V, V
RL
= 5 V,t
LSR
Large signal response time 25°C 300 nsR
L
= 5.1 k Ωt
R
Response time V
RL
= 5 V, R
L
= 5.1 k Ω25°C 1.3 µsI
sink
Output sink current V
IN(–)
= 1 V, V
IN(+)
= 0 V, V
O
≥1.5 V 25°C 6 16 mA25°C 250 400V
S
Saturation voltage V
IN(–)
≥1 V, V
IN(+)
= 0, I
SINK
≤4 mA mV0°C to 70 °C 700V
O
= 5 V 25°C 0.1 nAI
LO
Output leakage current V
IN(–)
= 0, V
IN(+)
≥1 V
V
O
= 30 V 0 °C to 70 °C 1 µA
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PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LM392D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM392DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM392DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM392DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM392DGKT ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM392DGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM392DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM392DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM392P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
LM392PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM392DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM392DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM392DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
LM392DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
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