MC74VHC00 Quad 2-Input NAND Gate The MC74VHC00 is an advanced high speed CMOS 2-input NAND gate fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The inputs tolerate voltages up to 7 V, allowing the interface of 5 V systems to 3 V systems. * * * * * * * * * * * High Speed: tPD = 3.7 ns (Typ) at VCC = 5 V Low Power Dissipation: ICC = 2 A (Max) at TA = 25C High Noise Immunity: VNIH = VNIL = 28% VCC Power Down Protection Provided on Inputs Balanced Propagation Delays Designed for 2 V to 5.5 V Operating Range Low Noise: VOLP = 0.8 V (Max) Pin and Function Compatible with Other Standard Logic Families Latchup Performance Exceeds 300 mA ESD Performance: HBM > 2000 V; Machine Model > 200 V Chip Complexity: 32 FETs or 8 Equivalent Gates VCC B4 A4 Y4 B3 A3 Y3 14 13 12 11 10 9 8 http://onsemi.com MARKING DIAGRAMS 14 SO - 14 D SUFFIX CASE 751A - 03 VHC00 AWLYWW 1 14 VHC00 AWLYWW TSSOP - 14 DT SUFFIX CASE 948G - 01 1 14 VHC00 ALYW EIAJ SO - 14 M SUFFIX CASE 965 - 01 1 2 3 4 5 6 7 A1 B1 Y1 A2 B2 Y2 GND 1 A L, WL Y W, WW Figure 1. Pinout: 14 - Lead Packages (Top View) ORDERING INFORMATION FUNCTION TABLE Inputs = Assembly Location = Wafer Lot = Year = Work Week Output Device Package Shipping MC74VHC00DR2 SO-14 2500 Tape & Reel 96 Units/Rail A B Y MC74VHC00DT TSSOP-14 L L H H L H L H H H H L MC74VHC00DTR2 TSSOP-14 2500 Tape & Reel Semiconductor Components Industries, LLC, 2003 July, 2003 - Rev. 4 MC74VHC00MEL 1 EIAJ SO-14 2000 Tape & Reel Publication Order Number: MC74VHC00/D MC74VHC00 A1 B1 A2 B2 A3 B3 A4 B4 1 3 2 4 6 5 Y1 Y2 Y = AB 9 8 10 12 11 13 Y3 Y4 Figure 2. Logic Diagram MAXIMUM RATINGS (Note 1) Symbol Value Unit VCC Positive DC Supply Voltage Parameter - 0.5 to +7.0 V VIN Digital Input Voltage - 0.5 to +7.0 V VOUT DC Output Voltage - 0.5 to VCC +0.5 V IIK Input Diode Current - 20 mA IOK Output Diode Current 20 mA IOUT DC Output Current, per Pin 25 mA ICC DC Supply Current, VCC and GND Pins 75 mA PD Power Dissipation in Still Air 200 180 mW TSTG Storage Temperature Range - 65 to +150 C VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) >2000 >200 N/A V ILATCH-UP Latch- Up Performance Above VCC and Below GND at 125C (Note 5) 300 mA JA Thermal Resistance, Junction to Ambient 143 164 C/W SOIC Package TSSOP SOIC Package TSSOP 1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. 2. Tested to EIA/JESD22 - A114- A 3. Tested to EIA/JESD22 - A115- A 4. Tested to JESD22 - C101- A 5. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit 2.0 5.5 V VCC DC Supply Voltage VIN DC Input Voltage 0 5.5 V VOUT DC Output Voltage 0 VCC V TA Operating Temperature Range, All Package Types - 55 125 C tr, tf Input Rise or Fall Time 0 0 100 20 ns/V VCC = 3.3 V + 0.3 V VCC = 5.0 V + 0.5 V http://onsemi.com 2 MC74VHC00 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIII IIIIIII IIII IIIIIII IIIII IIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII IIII IIIIII IIIIIII IIII IIIII IIIII II III III III III III III III II IIII IIIIII IIIIIII IIII IIIIIII IIIII IIIII IIII IIIIII IIIIIII IIII III III III III III III III II IIIIIIIIIIIIIIIIIIIIIII IIII IIIIII IIIIIII IIII II IIII IIIIII IIIIIII IIII III III III III III III III III IIII IIIIII IIIIIII IIII III III III III III III II IIII IIIIII IIIIIII IIII III III III III III III III II III IIII IIIIII IIIIIII IIII III III III III III III II III II IIII IIIIII IIIIIII IIII III III III III III III IIII IIIIII IIIIIII IIII III III III III III III III II III IIII IIIIII IIIIIII IIII III III III III III III II II IIII IIIIII IIIIIII IIII III III III III III III III IIIIIIIIIIIIIIIIIIIIIII IIII IIIIII IIIIIII IIII II IIII IIIIII IIIIIII IIII III III III III III III III IIIIIIIIIIIIIIIIIIIIIII IIII IIIIII IIIIIII IIII II IIII IIIIII IIIIIII IIII III III III III III III III IIIIIIIIIIIIIIIIIIIIIII IIII IIIIII IIIIIII IIII II IIII IIIIII IIIIIII IIII III III III III III III III IIIIIIIIIIIIIIIIIIIIIII IIII IIIIII IIIIIII IIII IIII IIIIII IIIIIII IIII III III III III III III III II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIII IIIIIIIIII IIIIIII IIIII IIIII II IIII IIIIII IIIIIIIIII IIIIIII IIIII IIIII II III III III III III III III II IIII IIIIII IIIIIIIIII IIIIIII IIIII IIIII IIII IIIIII IIIIIIIIII III III III III III III III II IIII IIIIII IIIIIIIIII III III III III III III IIIII II IIII IIIIII IIIIIIIIII III III III III III III III IIII IIIIII IIIIIIIIII III III III III III III III II IIII IIIIII IIIIIIIIII III III III III III III III II IIII IIIIII IIIIIIIIII III III III III III III IIIII DC ELECTRICAL CHARACTERISTICS TA = 25C VCC V Min High- Level Input Voltage 2.0 3.0 to 5.5 1.50 VCC x 0.7 VIL Low - Level Input Voltage 2.0 3.0 to 5.5 VOH High- Level Output Voltage Symbol Parameter VIH Test Conditions Vin = VIH or VIL IOH = - 50 A Vin = VIH or VIL IOH = - 4 mA IOH = - 8 mA VOL Low - Level Output Voltage Vin = VIH or VIL IOL = 50 A Typ Max TA = - 40 to 85C TA = - 55 to +125C Min Min 1.50 VCC x 0.7 0.50 VCC x 0.3 2.0 3.0 4.5 1.9 2.9 4.4 3.0 4.5 2.58 3.94 Max 2.0 3.0 4.5 2.0 3.0 4.5 0.0 0.0 0.0 Max 1.50 VCC x 0.7 V 0.50 VCC x 0.3 0.50 VCC x 0.3 1.9 2.9 4.4 1.9 2.9 4.4 2.48 3.80 2.40 3.70 Unit V V 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Vin = VIH or VIL IOL = 4 mA IOL = 8 mA 3.0 4.5 0.36 0.36 0.44 0.44 0.55 0.55 V Iin Input Leakage Current Vin = 5.5 V or GND 0 to 5.5 0.1 1.0 2.0 A ICC Quiescent Supply Current Vin = VCC or GND 5.5 2.0 20 40 A TA = - 40 to 85C TA = - 55 to +125C AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) TA = 25C Symbol Parameter tPLH, tPHL Propagation Delay, A or B to Y Cin Min Test Conditions Typ Max Min Max Min Max Unit ns VCC = 3.3 0.3 V CL = 15 pF CL = 50 pF 5.5 8.0 7.9 11.4 1.0 1.0 9.5 13.0 1.0 1.0 10 14.5 VCC = 5.0 0.5 V CL = 15 pF CL = 50 pF 3.7 5.2 5.5 7.5 1.0 1.0 6.5 8.5 1.0 1.0 7.0 9.5 4.0 10 Input Capacitance 10 10 pF Typical @ 25C, VCC = 5.0 V CPD 19 Power Dissipation Capacitance (Note 6) pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 4 (per gate). CPD is used to determine the no - load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. NOISE CHARACTERISTICS (Input tr = tf = 3.0 ns, CL = 50 pF, VCC = 5.0 V, Measured in SOIC Package) TA = 25C Symbol Characteristic Typ Max Unit VOLP Quiet Output Maximum Dynamic VOL 0.3 0.8 V VOLV Quiet Output Minimum Dynamic VOL - 0.3 - 0.8 V VIHD Minimum High Level Dynamic Input Voltage 3.5 V VILD Maximum Low Level Dynamic Input Voltage 1.5 V http://onsemi.com 3 MC74VHC00 TEST POINT A or B VCC 50% tPLH Y OUTPUT DEVICE UNDER TEST GND tPHL CL* 50% VCC *Includes all probe and jig capacitance Figure 3. Switching Waveforms Figure 4. Test Circuit INPUT Figure 5. Input Equivalent Circuit http://onsemi.com 4 MC74VHC00 PACKAGE DIMENSIONS SOIC - 14 D SUFFIX CASE 751A - 03 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. -A14 8 -B1 P 7 PL 0.25 (0.010) 7 G M B M F R X 45 C -TSEATING PLANE 0.25 (0.010) M T B J M K D 14 PL S A S http://onsemi.com 5 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.228 0.244 0.010 0.019 MC74VHC00 PACKAGE DIMENSIONS TSSOP - 14 DT SUFFIX CASE 948G - 01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 0.25 (0.010) 8 M B -U- L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A -V- CCC EE CCC EE CCC K1 J J1 SECTION N - N -W- C 0.10 (0.004) -T- SEATING PLANE D G H DETAIL E http://onsemi.com 6 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 MC74VHC00 PACKAGE DIMENSIONS SO - 14 M SUFFIX CASE 965 - 01 ISSUE O 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 8 Q1 E HE L 7 1 M DETAIL P Z D VIEW P A e c A1 b 0.13 (0.005) M 0.10 (0.004) http://onsemi.com 7 DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 --- 1.42 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 --- 0.056 MC74VHC00 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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