XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600245 Date Revised: 8/28/15
5% ANTI-SURGE THICK FILM CHIP RESISTORS AS-RC SERIES
Characteristics Limits Test Methods
(JIS C 5201-1)
Dielectric
withstanding
voltage
No evidence of ashover
mechanical damage, arcing or
insulation break down
Clamped in the trough of a 90ºC metallic v-block
and shall be tested at ac potential respectively specied
in the type for 60-70 seconds
Temperature
Coefcient
1Ω-10Ω : ≤±400PPM/ºC
11Ω-10MΩ : ≤±100PPM/ºC
(2010, 2512) 1Ω-10Ω : ≤±200PPM/ºC
Natural resistance change per temp.
degree centigrade.
R2-R1
x 10 (PPM/ºC)
R1(t2-t1)
R1: Resistance value at room temperature (T1)
R2: Resistance value at room temp. plus 100 ºC(T2)
Test Pattern: room temp. (T1), room temp. +100ºC(T2)
Short Time
Overload
Resistance change rate is
± (1.0% + 0.1Ω) Max.
Permanent resistance change after the
application of a potential of 2.5 times RCWV
for 5 seconds
Solderability 95% coverage Min. Wave Solder:
Test temperature of solder:
245ºC ± 3ºC dipping time in solder: 2-3 seconds
Soldering Heat Resistance change rate is:
+(1%+0.05Ω) Max.
Dip the resistor into a solder bath having a temperature of
260ºC±3ºC and hold it for 10±1 seconds.
Temperature cycling Resistance change rate is
± (0.5% + 0.05Ω) Max.
Resistance change after continuous
5 cycles for duty cycle specied below:
Humidity Resistance change rate is
± (3.0% + 0.1Ω) Max.
Temporary resistance change after 240 hours
exposure in a humidity test chamber controlled at
40±2ºC and 90-95% relative humidity
Load life in
humidity
Resistance change rate is
± (3.0% + 0.1Ω) Max.
Resistance change after 1000 hours
(1.5 hours "on", 0.5 hour "off") at RCWV
in a humidity controlled at 40ºC ± 2ºC
and 90 to 95% relative humidity
Load Life Resistance change rate is
± (3.0% + 0.1Ω) Max.
Permanent resistance change after 1,000 hours
operating at RCWV, with duty cycle of
(1.5 hours"on", 0.5 hour"off") at 70ºC + 2ºC ambient
Terminal bending Resistance change rate is
± (1.0% + 0.05Ω) Max.
Twist of Test Board:
Y/X = 3/90 mm for 60 seconds
Step Temperature Time
1 -55ºC ± 3ºC 30 mins
2 Room temp. 10~15 mins
3 +155ºC ± 2ºC 30 mins
4 Room temp. 10~15 mins
180ºC
150ºC
90 ± 30s
20 ± 10s
230ºC
245ºC - 250ºC
Solder Time
Hot Up Time
Warm Up Time
50
100
150
200
250
Peak Value Temperature:
Reflow: