Rev 1.0 10/13 Copyright © 2013 by Silicon Laboratories SiM3L1xx
SiM3L1xx
High-Performance, Low-Power, 32-Bit Precision32™
MCU Family with up to 256 kB of Flash
32-bit ARM Cortex-M3 CPU
-50 MHz maximum frequency
-Single-cycle multiplication, hardware division support
-Nested vectored interrupt control (NVIC) with 8 priority levels
Memory
-32–256 kB flash, in-system programmable
-8–32 kB SRAM with configurable low power retention
Clock Sources
-Internal oscillator with PLL: 23–50 MHz
-Low power internal oscillator: 20 MHz
-Low frequency internal oscillator (LFO): 16.4 kHz
-External real-time clock (RTC) crystal oscillator
-External oscillator: Crystal, RC, C, CMOS clock
Power Management
-Three adjustable low drop-out (LDO) regulators
-Power-on reset circuit and brownout detectors
-DC-DC buck converter allows dynamic voltage scaling for
maximum efficiency (250 mW output)
-Multiple power modes supported for low power optimization
Low Power Features
-75 nA typical current in Power Mode 8
-Low-current RTC (180 nA from LFO, 300 nA from crystal)
-4 μs wakeup, register state retention and no reset required from
lowest power mode
-175 μA/MHz at 3.6 V executing from flash
-140 μA/MHz at 3.6 V executing from SRAM
-Specialized on-chip charge pump reduces power consumption
-Process/Voltage/Temperature (PVT) Monitor
5 V Tolerant Flexible I/O
-Up to 62 contiguous 5 V tolerant GPIO with one priority cross-
bar providing flexibility in pin assignments
Temperature Range: –40 to +85 °C
Supply Voltage: 1.8 to 3.8 V
Analog Peripherals
-12-Bit Analog-to-Digital Converter: Up to 250 ksps 12-bit mode
or 1
Msps 10-bit mode
-10-Bit Current-mode Digital-to-Analog Converter
-2 x Low-current comparators
Digital and Communication Peripherals
-1 x USART with IrDA and ISO7816 Smartcard support
-1 x UART that operates in low power mode
-2 x SPIs, 1 x I2C, 16/32-bit CRC
-128/192/256-bit Hardware AES Encryption
-Encoder/Decoder: Manchester and Three-out-of-Six
-Integrated LCD Controller: up to 160 segments (40x4), auto-
contrast and low power operation
Timers/Counters
-3 x 32-bit or 6 x 16-bit timers with capture/compare
-16-bit, 6-channel counter with capture/compare/PWM and
dead-time controller with differential outputs
-16-bit low power timer/advanced capture counter operational in
the lowest power mode
-32-bit real time clock (RTC) with multiple alarms
-Watchdog timer
-Low power mode advanced capture counter (ACCTR)
Data Transfer Peripherals
-10-Channel DMA Controller
-3 Channel Data Transfer Manager manages complex DMA
transfers without core intervention
On-Chip Debugging
-Serial wire debug (SWD) with serial wire viewer (SWV) or JTAG
(no boundary scan) allow debug and programming
-Cortex-M3 embedded trace macrocell (ETM)
Package Options
-QFN options: 40-pin (6 x 6 mm), 64-pin (9 x 9 mm)
-TQFP options: 64-pin (10 x 10 mm), 80-pin (12 x 12 mm)
-TFBGA option: 80-ball (5.5 x 5.5 mm)
2 Rev 1.0
SiM3L1xx
Rev 1.0 3
Table of Contents
1. Related Documents and Conventions...............................................................................5
1.1. Related Documents........................................................................................................5
1.1.1. SiM3L1xx Reference Manual.................................................................................5
1.1.2. Hardware Access Layer (HAL) API Description ....................................................5
1.1.3. ARM Cortex-M3 Reference Manual.......................................................................5
1.2. Conventions ...................................................................................................................5
2. Typical Connection Diagrams ............................................................................................6
2.1. Power .............................................................................................................................6
3. Electrical Specifications......................................................................................................8
3.1. Electrical Characteristics ................................................................................................8
3.2. Thermal Conditions ......................................................................................................30
3.3. Absolute Maximum Ratings..........................................................................................31
4. Precision32™ SiM3L1xx System Overview.....................................................................32
4.1. Power ...........................................................................................................................34
4.1.1. DC-DC Buck Converter (DCDC0)........................................................................34
4.1.2. Three Low Dropout LDO Regulators (LDO0) ......................................................35
4.1.3. Voltage Supply Monitor (VMON0) .......................................................................35
4.1.4. Power Management Unit (PMU)..........................................................................35
4.1.5. Device Power Modes...........................................................................................35
4.1.6. Process/Voltage/Temperature Monitor (TIMER2 and PVTOSC0).......................38
4.2. I/O.................................................................................................................................39
4.2.1. General Features.................................................................................................39
4.2.2. Crossbar ..............................................................................................................39
4.3. Clocking........................................................................................................................40
4.3.1. PLL (PLL0)...........................................................................................................41
4.3.2. Low Power Oscillator (LPOSC0) .........................................................................41
4.3.3. Low Frequency Oscillator (LFOSC0)...................................................................41
4.3.4. External Oscillators (EXTOSC0)..........................................................................41
4.4. Integrated LCD Controller (LCD0)................................................................................42
4.5. Data Peripherals...........................................................................................................43
4.5.1. 10-Channel DMA Controller.................................................................................43
4.5.2. Data Transfer Managers (DTM0, DTM1, DTM2) .................................................43
4.5.3. 128/192/256-bit Hardware AES Encryption (AES0) ............................................43
4.5.4. 16/32-bit Enhanced CRC (ECRC0) .....................................................................44
4.5.5. Encoder / Decoder (ENCDEC0) ..........................................................................44
4.6. Counters/Timers...........................................................................................................45
4.6.1. 32-bit Timer (TIMER0, TIMER1, TIMER2)...........................................................45
4.6.2. Enhanced Programmable Counter Array (EPCA0) .............................................45
4.6.3. Real-Time Clock (RTC0) .....................................................................................46
4.6.4. Low Power Timer (LPTIMER0)............................................................................46
4.6.5. Watchdog Timer (WDTIMER0)............................................................................46
4.6.6. Low Power Mode Advanced Capture Counter (ACCTR0)...................................47
4.7. Communications Peripherals .......................................................................................48
4.7.1. USART (USART0) ...............................................................................................48
SiM3L1xx
4 Rev 1.0
4.7.2. UART (UART0)....................................................................................................48
4.7.3. SPI (SPI0, SPI1) ..................................................................................................49
4.7.4. I2C (I2C0) ............................................................................................................49
4.8. Analog ..........................................................................................................................50
4.8.1. 12-Bit Analog-to-Digital Converter (SARADC0)...................................................50
4.8.2. 10-Bit Digital-to-Analog Converter (IDAC0) .........................................................50
4.8.3. Low Current Comparators (CMP0, CMP1) ..........................................................50
4.9. Reset Sources..............................................................................................................51
4.10.Security ........................................................................................................................52
4.11.On-Chip Debugging .....................................................................................................52
5. Ordering Information.........................................................................................................53
6. Pin Definitions....................................................................................................................55
6.1. SiM3L1x7 Pin Definitions .............................................................................................55
6.2. SiM3L1x6 Pin Definitions .............................................................................................63
6.3. SiM3L1x4 Pin Definitions .............................................................................................70
6.4. TQFP-80 Package Specifications ................................................................................75
6.4.1. TQFP-80 Solder Mask Design.............................................................................78
6.4.2. TQFP-80 Stencil Design ......................................................................................78
6.4.3. TQFP-80 Card Assembly.....................................................................................78
6.5. TFBGA-80 Package Specifications ..............................................................................79
6.5.1. TFBGA-80 Solder Mask Design ..........................................................................82
6.5.2. TFBGA-80 Stencil Design....................................................................................82
6.5.3. TFBGA-80 Card Assembly ..................................................................................82
6.6. QFN-64 Package Specifications ..................................................................................83
6.6.1. QFN-64 Solder Mask Design...............................................................................85
6.6.2. QFN-64 Stencil Design ........................................................................................85
6.6.3. QFN-64 Card Assembly.......................................................................................85
6.7. TQFP-64 Package Specifications ................................................................................86
6.7.1. TQFP-64 Solder Mask Design.............................................................................89
6.7.2. TQFP-64 Stencil Design ......................................................................................89
6.7.3. TQFP-64 Card Assembly.....................................................................................89
6.8. QFN-40 Package Specifications ..................................................................................90
6.8.1. QFN-40 Solder Mask Design...............................................................................92
6.8.2. QFN-40 Stencil Design ........................................................................................92
6.8.3. QFN-40 Card Assembly.......................................................................................92
7. Revision Specific Behavior...............................................................................................93
7.1. Revision Identification ..................................................................................................93
Document Change List...........................................................................................................95
Contact Information................................................................................................................96
SiM3L1xx
Rev 1.0 5
1. Related Documents and Conventions
1.1. Related Documents
This data sheet accompanies several documents to provide the complete description of the SiM3L1xx devices.
1.1.1. SiM3L1xx Reference Manual
The Silicon Laboratories SiM3L1xx Reference Manual provides the detailed description for each peripheral on the
SiM3L1xx devices.
1.1.2. Hardware Access Layer (HAL) API Description
The Silicon Laboratories Hardware Access Layer (HAL) API provides C-language functions to modify and read
each bit in the SiM3L1xx devices. This description can be found in the SiM3xxxx HAL API Reference Manual.
1.1.3. ARM Cortex-M3 Reference Manual
The ARM-specific features like the Nested Vectored Interrupt Controller are described in the ARM Cortex-M3
reference documentation. The online reference manual can be found here:
http://infocenter.arm.com/help/topic/com.arm.doc.subset.cortexm.m3/index.html#cortexm3.
1.2. Conventions
The block diagrams in this document use the following formatting conventions:
Figure 1.1. Block Diagram Conventions
SiM3L1xx
6 Rev 1.0
2. Typical Connection Diagrams
This section provides typical connection diagrams for SiM3L1xx devices.
2.1. Power
Figure 2.1 shows a typical connection diagram for the power pins of the SiM3L1xx devices when the dc-dc buck
converter is not used.
Figure 2.1. Connection Diagram with DC-DC Converter Unused
Figure 2.2 shows a typical connection diagram for the power pins of the SiM3L1xx devices when the internal dc-dc
buck converter is in use and I/O are powered directly from the battery.
Figure 2.2. Connection Diagram with DC-DC Converter Used and I/O Powered from Battery
Figure 2.3 shows a typical connection diagram for the power pins of the SiM3L1xx devices when used with an
external radio device like the Silicon Labs EZRadio® or EZRadioPRO® devices.
SiM3L1xx
Rev 1.0 7
Figure 2.3. Connection Diagram with External Radio Device
Figure 2.4 shows a typical connection diagram for the power pins of the SiM3L1xx devices when the dc-dc buck
converter is used and the I/O are powered separately.
Figure 2.4. Connection Diagram with DC-DC Converter Used and I/O Powered Separately
SiM3L1xx
8 Rev 1.0
3. Electrical Specifications
3.1. Electrical Characteristics
Table 3.1. Recommended Operating Conditions
Parameter Symbol Test Condition Min Typ Max Unit
Operating Supply Voltage on
VBAT/VBATDC
VBAT 1.8 — 3.8 V
Operating Supply Voltage on VDC VDC 1.25 — 3.8 V
Operating Supply Voltage on VDRV VDRV 1.25 — 3.8 V
Operating Supply Voltage on VIO VIO 1.8 — VBAT V
Operation Supply Voltage on VIORF VIORF 1.8 — VBAT V
Operation Supply Voltage on VLCD VLCD 1.8 — 3.8 V
System Clock Frequency (AHB) fAHB 0 — 50 MHz
Peripheral Clock Frequency (APB) fAPB 0 — 50 MHz
Operating Ambient Temperature TA–40 — +85 °C
Operating Junction Temperature TJ–40 — 105 °C
Note: All voltages with respect to VSS.
All electrical parameters in all Tables are specified under the conditions listed in Table 3.1, unless stated otherwise.
SiM3L1xx
Rev 1.0 9
Table 3.2. Power Consumption
Parameter Symbol Test Condition Min Typ Max Unit
Digital Core Supply Current
Normal Mode1,2,3,4—Full speed
with code executing from flash,
peripheral clocks ON
IBAT FAHB = 49 MHz,
FAPB = 24.5 MHz
— 17.5 18.9 mA
FAHB = 20 MHz,
FAPB = 10 MHz
— 6.7 7.2 mA
FAHB = 2.5 MHz,
FAPB = 1.25 MHz
— 1.15 1.4 mA
Normal Mode1,2,3,4—Full speed
with code executing from flash,
peripheral clocks OFF
IBAT FAHB = 49 MHz,
FAPB = 24.5 MHz
— 13.3 14.5 mA
FAHB = 20 MHz,
FAPB = 10 MHz
— 5.4 5.9 mA
FAHB = 2.5 MHz,
FAPB = 1.25 MHz
— 980 1.2 μA
Normal Mode1,2,3,4—Full speed
with code executing from flash,
LDOs powered by dc-dc at 1.9 V,
peripheral clocks OFF
IBAT FAHB = 49 MHz,
FAPB = 24.5 MHz
VBAT = 3.3 V
— 9.7 — mA
FAHB = 49 MHz,
FAPB = 24.5 MHz
VBAT = 3.8 V
— 8.65 — mA
FAHB = 20 MHz,
FAPB = 10 MHz
VBAT = 3.3 V
— 4.15 — mA
FAHB = 20 MHz,
FAPB = 10 MHz
VBAT = 3.8 V
— 3.9 — mA
Notes:
1. Currents are additive. For example, where IBAT is specified and the mode is not mutually exclusive, enabling the
functions increases supply current by the specified amount.
2. Includes all peripherals that cannot have clocks gated in the Clock Control module.
3. Includes LDO and PLL0OSC (>20 MHz) or LPOSC0 (<20 MHz) supply current.
4. Internal Digital and Memory LDOs scaled to optimal output voltage.
5. Flash AHB clock turned off.
6. Running from internal LFO, Includes LFO supply current.
7. LCD0 current does not include switching currents for external load.
8. IDAC output current not included.
9. Does not include LC tank circuit.
10. Does not include digital drive current or pullup current for active port I/O. Unloaded IVIO is included in all IBAT PM8
production test measurements.
SiM3L1xx
10 Rev 1.0
Power Mode 11,2,3,4—Full speed
with code executing from RAM,
peripheral clocks ON
IBAT FAHB = 49 MHz,
FAPB = 24.5 MHz
— 13.4 16.6 mA
FAHB = 20 MHz,
FAPB = 10 MHz
— 4.7 — mA
FAHB = 2.5 MHz,
FAPB = 1.25 MHz
— 810 — μA
Power Mode 11,2,3,4—Full speed
with code executing from RAM,
peripheral clocks OFF
IBAT FAHB = 49 MHz,
FAPB = 24.5 MHz
— 9.4 12.5 mA
FAHB = 20 MHz,
FAPB = 10 MHz
— 3.3 — mA
FAHB = 2.5 MHz,
FAPB = 1.25 MHz
— 630 — μA
Power Mode 11,2,3,4—Full speed
with code executing from RAM,
LDOs powered by dc-dc at 1.9 V,
peripheral clocks OFF
IBAT FAHB = 49 MHz,
FAPB = 24.5 MHz
VBAT = 3.3 V
— 7.05 — mA
FAHB = 49 MHz,
FAPB = 24.5 MHz
VBAT = 3.8 V
— 6.3 — mA
FAHB = 20 MHz,
FAPB = 10 MHz
VBAT = 3.3 V
— 2.75 — mA
FAHB = 20 MHz,
FAPB = 10 MHz
VBAT = 3.8 V
— 2.6 — mA
Power Mode 21,2,3,4,5—Core halted
with peripheral clocks ON
IBAT FAHB = 49 MHz,
FAPB = 24.5 MHz
— 7.6 11.3 mA
FAHB = 20 MHz,
FAPB = 10 MHz
— 2.75 — mA
FAHB = 2.5 MHz,
FAPB = 1.25 MHz
— 575 — μA
Table 3.2. Power Consumption (Continued)
Parameter Symbol Test Condition Min Typ Max Unit
Notes:
1. Currents are additive. For example, where IBAT is specified and the mode is not mutually exclusive, enabling the
functions increases supply current by the specified amount.
2. Includes all peripherals that cannot have clocks gated in the Clock Control module.
3. Includes LDO and PLL0OSC (>20 MHz) or LPOSC0 (<20 MHz) supply current.
4. Internal Digital and Memory LDOs scaled to optimal output voltage.
5. Flash AHB clock turned off.
6. Running from internal LFO, Includes LFO supply current.
7. LCD0 current does not include switching currents for external load.
8. IDAC output current not included.
9. Does not include LC tank circuit.
10. Does not include digital drive current or pullup current for active port I/O. Unloaded IVIO is included in all IBAT PM8
production test measurements.
SiM3L1xx
Rev 1.0 11
Power Mode 21,2,3,4,5—Core halted
with only Port I/O clocks on (wake
from pin).
IBAT FAHB = 49 MHz,
FAPB = 24.5 MHz
— 4 7.2 mA
FAHB = 20 MHz,
FAPB = 10 MHz
— 1.47 — mA
FAHB = 2.5 MHz,
FAPB = 1.25 MHz
— 430 — μA
Power Mode 31,2,6—Fast-Wake
Mode (PM3CLKEN = 1)
IBAT VBAT = 3.8 V — 320 530 μA
VBAT = 1.8 V — 225 — μA
Power Mode 41,2,4,6—Slower clock
speed with code executing from
flash, peripheral clocks ON
IBAT FAHB = FAPB = 16 kHz,
VBAT = 3.8 V
— 385 640 μA
FAHB = FAPB = 16 kHz,
VBAT = 1.8 V
— 330 — μA
Power Mode 51,2,4,6—Slower clock
speed with code executing from
RAM, peripheral clocks ON
IBAT FAHB = FAPB = 16 kHz,
VBAT = 3.8 V
— 320 490 μA
FAHB = FAPB = 16 kHz,
VBAT = 1.8 V
— 275 — μA
Power Mode 61,2,4,6—Core halted
with peripheral clocks ON
IBAT FAHB = FAPB = 16 kHz,
VBAT = 3.8 V
— 315 490 μA
FAHB = FAPB = 16 kHz,
VBAT = 1.8 V
— 270 — μA
Power Mode 81,2—Low Power
Sleep, powered through VBAT,
VIO, and VIORF at 2.4 V, 32kB of
retention RAM
IBAT RTC Disabled,
TA = 25 °C
— 75 400 nA
RTC w/ 16.4 kHz LFO,
TA = 25 °C
— 360 — nA
RTC w/ 32.768 kHz Crystal,
TA = 25 °C
— 670 — nA
Table 3.2. Power Consumption (Continued)
Parameter Symbol Test Condition Min Typ Max Unit
Notes:
1. Currents are additive. For example, where IBAT is specified and the mode is not mutually exclusive, enabling the
functions increases supply current by the specified amount.
2. Includes all peripherals that cannot have clocks gated in the Clock Control module.
3. Includes LDO and PLL0OSC (>20 MHz) or LPOSC0 (<20 MHz) supply current.
4. Internal Digital and Memory LDOs scaled to optimal output voltage.
5. Flash AHB clock turned off.
6. Running from internal LFO, Includes LFO supply current.
7. LCD0 current does not include switching currents for external load.
8. IDAC output current not included.
9. Does not include LC tank circuit.
10. Does not include digital drive current or pullup current for active port I/O. Unloaded IVIO is included in all IBAT PM8
production test measurements.
SiM3L1xx
12 Rev 1.0
Power Mode 81,2—Low Power
Sleep, powered by the low power
mode charge pump, 32kB of reten-
tion RAM
IBAT RTC w/ 16.4 kHz LFO,
VBAT = 2.4 V, TA = 25 °C
— 180 — nA
RTC w/ 32.768 kHz Crystal,
VBAT = 2.4 V, TA = 25 °C
— 300 — nA
RTC w/ 16.4 kHz LFO,
VBAT = 3.8 V, TA = 25 °C
— 245 — nA
RTC w/ 32.768 kHz Crystal,
VBAT = 3.8 V, TA = 25 °C
— 390 — nA
Unloaded VIO and VIORF Current10 IVIO — 2 — nA
Power Mode 8 Peripheral Currents
UART0 IUART0 VBAT = 3.8 V, TA = 25 °C — 195 600 nA
VBAT = 2.4 V, TA = 25 °C — 120 — nA
LCD07, No segments active ILCD0 VBAT = 3.8 V, TA = 25 °C — 495 660 nA
VBAT = 2.4 V, TA = 25 °C — 395 — nA
LCD07, All (4 x 40) segments active ILCD0 VBAT = 3.8 V, TA = 25 °C — 800 — nA
VBAT = 2.4 V, TA = 25 °C — 580 — nA
Advanced Capture Counter
(ACCTR0), LC Single-Ended
Mode, Relative to Sampling Fre-
quency9
IACCTR VBAT = 2.4 V, TA = 25 °C,
CPMD = 01
— 1.11 — nA/Hz
VBAT = 3.8 V, TA = 25 °C,
CPMD = 01
— 1.44 — nA/Hz
VBAT = 2.4 V, TA = 25 °C,
CPMD = 10
— 1.45 — nA/Hz
VBAT = 3.8 V, TA = 25 °C,
CPMD = 10
— 1.82 — nA/Hz
VBAT = 2.4 V, TA = 25 °C,
CPMD = 11
— 2.15 — nA/Hz
VBAT = 3.8 V, TA = 25 °C,
CPMD = 11
— 2.54 — nA/Hz
Table 3.2. Power Consumption (Continued)
Parameter Symbol Test Condition Min Typ Max Unit
Notes:
1. Currents are additive. For example, where IBAT is specified and the mode is not mutually exclusive, enabling the
functions increases supply current by the specified amount.
2. Includes all peripherals that cannot have clocks gated in the Clock Control module.
3. Includes LDO and PLL0OSC (>20 MHz) or LPOSC0 (<20 MHz) supply current.
4. Internal Digital and Memory LDOs scaled to optimal output voltage.
5. Flash AHB clock turned off.
6. Running from internal LFO, Includes LFO supply current.
7. LCD0 current does not include switching currents for external load.
8. IDAC output current not included.
9. Does not include LC tank circuit.
10. Does not include digital drive current or pullup current for active port I/O. Unloaded IVIO is included in all IBAT PM8
production test measurements.
SiM3L1xx
Rev 1.0 13
Advanced Capture Counter
(ACCTR0), LC Dual or Quadrature
Mode, Relative to Sampling Fre-
quency9
IACCTR VBAT = 2.4 V, TA = 25 °C,
CPMD = 01
— 1.39 — nA/Hz
VBAT = 3.8 V, TA = 25 °C,
CPMD = 01
— 1.89 — nA/Hz
VBAT = 2.4 V, TA = 25 °C,
CPMD = 10
— 2.08 — nA/Hz
VBAT = 3.8 V, TA = 25 °C,
CPMD = 10
— 2.59 — nA/Hz
VBAT = 2.4 V, TA = 25 °C,
CPMD = 11
— 3.47 — nA/Hz
VBAT = 3.8 V, TA = 25 °C,
CPMD = 11
— 4.03 — nA/Hz
Analog Peripheral Supply Currents
PLL0 Oscillator (PLL0OSC) IPLLOSC Operating at 49 MHz — 1.4 1.6 mA
Low-Power Oscillator (LPOSC0) ILPOSC Operating at 20 MHz — 25 — μA
Operating at 2.5 MHz — 25 — μA
Low-Frequency Oscillator
(LFOSC0)
ILFOSC Operating at 16.4 kHz — 190 310 nA
External Oscillator (EXTOSC0) IEXTOSC FREQCN = 111 — 3.8 4.5 mA
FREQCN = 110 — 840 960 μA
FREQCN = 101 — 185 230 μA
FREQCN = 100 — 65 80 μA
FREQCN = 011 — 25 30 μA
FREQCN = 010 — 10 13 μA
FREQCN = 001 — 5 7 μA
FREQCN = 000 — 3 5 μA
Table 3.2. Power Consumption (Continued)
Parameter Symbol Test Condition Min Typ Max Unit
Notes:
1. Currents are additive. For example, where IBAT is specified and the mode is not mutually exclusive, enabling the
functions increases supply current by the specified amount.
2. Includes all peripherals that cannot have clocks gated in the Clock Control module.
3. Includes LDO and PLL0OSC (>20 MHz) or LPOSC0 (<20 MHz) supply current.
4. Internal Digital and Memory LDOs scaled to optimal output voltage.
5. Flash AHB clock turned off.
6. Running from internal LFO, Includes LFO supply current.
7. LCD0 current does not include switching currents for external load.
8. IDAC output current not included.
9. Does not include LC tank circuit.
10. Does not include digital drive current or pullup current for active port I/O. Unloaded IVIO is included in all IBAT PM8
production test measurements.
SiM3L1xx
14 Rev 1.0
SARADC0 ISARADC Sampling at 1 Msps, Internal
VREF used
— 1.2 1.6 mA
Sampling at 250 ksps, lowest
power mode settings.
— 390 540 μA
Temperature Sensor ITSENSE — 75 110 μA
Internal SAR Reference IREFFS Normal Power Mode — 680 — μA
Normal Power Mode — 160 — μA
VREF0 IREFP — 80 — μA
Comparator 0 (CMP0),
Comparator 1 (CMP1)
ICMP CMPMD = 11 — 0.5 2 μA
CMPMD = 10 — 3 8 μA
CMPMD = 01 — 10 16 μA
CMPMD = 00 — 25 42 μA
IDAC08IIDAC — 70 100 μA
Voltage Supply Monitor (VMON0) IVMON — 10 22 μA
Flash Current on VBAT
Write Operation IFLASH-W — — 8 mA
Erase Operation IFLASH-E — — 15 mA
Table 3.2. Power Consumption (Continued)
Parameter Symbol Test Condition Min Typ Max Unit
Notes:
1. Currents are additive. For example, where IBAT is specified and the mode is not mutually exclusive, enabling the
functions increases supply current by the specified amount.
2. Includes all peripherals that cannot have clocks gated in the Clock Control module.
3. Includes LDO and PLL0OSC (>20 MHz) or LPOSC0 (<20 MHz) supply current.
4. Internal Digital and Memory LDOs scaled to optimal output voltage.
5. Flash AHB clock turned off.
6. Running from internal LFO, Includes LFO supply current.
7. LCD0 current does not include switching currents for external load.
8. IDAC output current not included.
9. Does not include LC tank circuit.
10. Does not include digital drive current or pullup current for active port I/O. Unloaded IVIO is included in all IBAT PM8
production test measurements.
Table 3.3. Power Mode Wake Up Times
Parameter Symbol Test Condition Min Typ Max Unit
Power Mode 2 or 6 Wake Time tPM2 4 — 5 clocks
Power Mode 3 Fast Wake Time
(using LFO as clock source)
tPM3FW — 425 — μs
Power Mode 8 Wake Time tPM8 — 3.8 — μs
Notes:
1. Wake times are specified as the time from the wake source to the execution phase of the first instruction following WFI.
This includes latency to recognize the wake event and fetch the first instruction (assuming wait states = 0).
Table 3.4. Reset and Supply Monitor
Parameter Symbol Test Condition Min Typ Max Unit
VBAT High Supply Monitor Threshold
(VBATHITHEN = 1)
VVBATMH Early Warning — 2.20 — V
Reset 1.95 2.05 2.1 V
VBAT Low Supply Monitor Threshold
(VBATHITHEN = 0)
VVBATML Early Warning — 1.85 — V
Reset 1.70 1.75 1.77 V
Power-On Reset (POR) Threshold VPOR Rising Voltage on VBAT — 1.4 — V
Falling Voltage on
VBAT
0.8 1 1.3 V
VBAT Ramp Time tRMP Time to VBAT > 1.8 V 10 — 3000 μs
Reset Delay from POR tPOR Relative to VBAT >
VPOR
3 — 100 ms
Reset Delay from non-POR source tRST Time between release
of reset source and
code execution
— 10 — μs
RESET Low Time to Generate Reset tRSTL 50 — — ns
Missing Clock Detector Response
Time (final rising edge to reset)
tMCD FAHB > 1 MHz — 0.5 1.5 ms
Missing Clock Detector Trigger
Frequency
FMCD — 2.5 10 kHz
VBAT Supply Monitor Turn-On Time tMON — 2 — μs
SiM3L1xx
Rev 1.0 15
SiM3L1xx
16 Rev 1.0
Table 3.5. On-Chip Regulators
Parameter Symbol Test Condition Min Typ Max Unit
DC-DC Buck Converter
Input Voltage Range VDCIN 1.8 — 3.8 V
Input Supply to Output Voltage Differ-
ential (for regulation)
VDCREG 0.45 — — V
Output Voltage Range VDCOUT 1.25 — 3.8 V
Output Voltage Accuracy VDCACC — ±25 — mV
Output Current IDCOUT — — 90 mA
Inductor Value1LDC 0.47 0.56 0.68 μH
Inductor Current Rating ILDC Iload < 50 mA 450 — — mA
Iload > 50 mA 550 — — mA
Output Capacitor Value CDCOUT 1 2.2 10 μF
Input Capacitor Value2CDCIN — 4.7 — μF
Load Regulation Rload — 0.03 — mV/mA
Maximum DC Load Current During
Startup
IDCMAX — — 5 mA
Switching Clock Frequency FDCCLK 1.9 2.9 3.8 MHz
Local Oscillator Frequency FDCOSC 2.4 2.9 3.4 MHz
LDO Regulators
Input Voltage Range3VLDOIN Sourced from VBAT 1.8 — 3.8 V
Sourced from VDC 1.9 — 3.8 V
Output Voltage Range4VLDO 0.8 — 1.9 V
LDO Output Voltage Accuracy VLDOACC — ±25 — mV
Output Settings in PM8 (All LDOs) VLDO 1.8 V < VBAT < 2.9 V 1.5 V
1.95 V < VBAT < 3.5 V 1.8 V
2.0 V < VBAT < 3.8 V 1.9 V
Notes:
1. See reference manual for recommended inductors.
2. Recommended: X7R or X5R ceramic capacitors with low ESR. Example: Murata GRM21BR71C225K with ESR < 10
m (@ frequency > 1 MHz).
3. Input voltage specification accounts for the internal LDO dropout voltage under the maximum load condition to ensure
that the LDO output voltage will remain at a valid level as long as VLDOIN is at or above the specified minimum.
4. The memory LDO output should always be set equal to or lower than the output of the analog LDO. When lowering both
LDOs (for example to go into PM8 under low supply conditions), first adjust the memory LDO and then the analog LDO.
When raising the output of both LDOs, adjust the analog LDO before adjusting the memory LDO.
5. Output range represents the programmable output range, and does not reflect the minimum voltage under all
conditions. Dropout when the input supply is close to the output setting is normal, and accounted for.
6. Analog peripheral specifications assume a 1.8 V output on the analog LDO.
SiM3L1xx
Rev 1.0 17
Memory LDO Output Setting5VLDOMEM During Programming 1.8 — 1.9 V
During Normal
Operation
1.5 — 1.9 V
Digital LDO Output Setting VLDODIG FAHB < 20 MHz 1.0 — 1.9 V
FAHB > 20 MHz 1.2 — 1.9 V
Analog LDO Output Setting During
Normal Operation6
VLDOANA 1.8 V
Table 3.5. On-Chip Regulators (Continued)
Parameter Symbol Test Condition Min Typ Max Unit
Notes:
1. See reference manual for recommended inductors.
2. Recommended: X7R or X5R ceramic capacitors with low ESR. Example: Murata GRM21BR71C225K with ESR < 10
m (@ frequency > 1 MHz).
3. Input voltage specification accounts for the internal LDO dropout voltage under the maximum load condition to ensure
that the LDO output voltage will remain at a valid level as long as VLDOIN is at or above the specified minimum.
4. The memory LDO output should always be set equal to or lower than the output of the analog LDO. When lowering both
LDOs (for example to go into PM8 under low supply conditions), first adjust the memory LDO and then the analog LDO.
When raising the output of both LDOs, adjust the analog LDO before adjusting the memory LDO.
5. Output range represents the programmable output range, and does not reflect the minimum voltage under all
conditions. Dropout when the input supply is close to the output setting is normal, and accounted for.
6. Analog peripheral specifications assume a 1.8 V output on the analog LDO.
Table 3.6. Flash Memory
Parameter Symbol Test Condition Min Typ Max Unit
Write Time1tWRITE One 16-bit Half Word 20 21 22 μs
Erase Time1tERASE One Page 20 21 22 ms
tERALL Full Device 20 21 22 ms
Endurance (Write/Erase Cycles) NWE 20k 100k — Cycles
Retention2tRET TA = 25 °C, 1k Cycles 10 100 — Years
Notes:
1. Does not include sequencing time before and after the write/erase operation, which may take up to 35 μs. During
sequential write operations, this extra time is only taken prior to the first write and after the last write.
2. Additional Data Retention Information is published in the Quarterly Quality and Reliability Report.
SiM3L1xx
18 Rev 1.0
SiM3L1xx
Rev 1.0 19
Table 3.7. Internal Oscillators
Parameter Symbol Test Condition Min Typ Max Unit
Phase-Locked Loop (PLL0OSC)
Calibrated Output Frequency
(Free-running output mode,
RANGE = 2)
fPLL0OSC Full Temperature and
Supply Range
48.3 49 49.7 MHz
Power Supply Sensitivity
(Free-running output mode,
RANGE = 2)
PSSPLL0OSC TA = 25 °C,
Fout = 49 MHz
— 300 — ppm/V
Temperature Sensitivity
(Free-running output mode,
RANGE = 2)
TSPLL0OSC VBAT = 3.3 V,
Fout = 49 MHz
— 50 — ppm/°C
Adjustable Output Frequency
Range
fPLL0OSC 23 — 50 MHz
Lock Time tPLL0LOCK fREF = 20 MHz,
fPLL0OSC = 50 MHz
M=39, N=99,
LOCKTH = 0
— 2.75 — μs
fREF = 2.5 MHz,
fPLL0OSC = 50 MHz
M=19, N=399,
LOCKTH = 0
— 9.45 — μs
fREF = 32.768 kHz,
fPLL0OSC = 50 MHz
M=0, N=1524,
LOCKTH = 0
— 92 — μs
Low Power Oscillator (LPOSC0)
Oscillator Frequency fLPOSC Full Temperature and
Supply Range
19 20 21 MHz
Divided Oscillator Frequency fLPOSCD Full Temperature and
Supply Range
2.375 2.5 2.625 MHz
Power Supply Sensitivity PSSLPOSC TA = 25 °C — 0.5 — %/V
Temperature Sensitivity TSLPOSC VBAT = 3.3 V — 55 — ppm/°C
Low Frequency Oscillator (LFOSC0)
Oscillator Frequency fLFOSC Full Temperature and
Supply Range
13.4 16.4 19.7 kHz
TA = 25 °C,
VBAT = 3.3 V
15.8 16.4 17.3 kHz
Power Supply Sensitivity PSSLFOSC TA = 25 °C — 2.4 — %/V
Temperature Sensitivity TSLFOSC VBAT = 3.3 V — 0.2 — %/°C
SiM3L1xx
20 Rev 1.0
RTC0 Oscillator (RTC0OSC)
Missing Clock Detector Trigger
Frequency
fRTCMCD — 8 15 kHz
RTC External Input CMOS Clock
Frequency
fRTCEXTCLK 0 — 40 kHz
RTC Robust Duty Cycle Range DCRTC 25 — 55 %
Table 3.8. External Oscillator
Parameter Symbol Test Condition Min Typ Max Unit
External Input CMOS Clock
Frequency
fCMOS 0* — 50 MHz
External Crystal Frequency fXTAL 0.01 — 25 MHz
External Input CMOS Clock High Time tCMOSH 9 — — ns
External Input CMOS Clock Low Time tCMOSL 9 — — ns
Low Power Mode Charge Pump
Supply Range (input from VBAT)
VBAT 2.4 — 3.8 V
*Note: Minimum of 10 kHz when debugging.
Table 3.7. Internal Oscillators (Continued)
Parameter Symbol Test Condition Min Typ Max Unit
SiM3L1xx
Rev 1.0 21
Table 3.9. SAR ADC
Parameter Symbol Test Condition Min Typ Max Unit
Resolution Nbits 12 Bit Mode 12 Bits
10 Bit Mode 10 Bits
Supply Voltage Requirements
(VBAT)
VADC High Speed Mode 2.2 — 3.8 V
Low Power Mode 1.8 — 3.8 V
Throughput Rate
(High Speed Mode)
fS12 Bit Mode — — 250 ksps
10 Bit Mode — — 1 Msps
Throughput Rate
(Low Power Mode)
fS12 Bit Mode — — 62.5 ksps
10 Bit Mode — — 250 ksps
Tracking Time tTRK High Speed Mode 230 — — ns
Low Power Mode 450 — — ns
SAR Clock Frequency fSAR High Speed Mode — — 16.24 MHz
Low Power Mode — — 4 MHz
Conversion Time tCNV 10-Bit Conversion,
SAR Clock = 16 MHz,
APB Clock = 40 MHz
762.5 ns
Sample/Hold Capacitor CSAR Gain = 1 — 5 — pF
Gain = 0.5 — 2.5 — pF
Input Pin Capacitance CIN High Quality Inputs — 18 — pF
Normal Inputs — 20 — pF
Input Mux Impedance RMUX High Quality Inputs — 300 —
Normal Inputs — 550 —
Voltage Reference Range VREF 1 — VBAT V
Input Voltage Range* VIN Gain = 1 0 — VREF V
Gain = 0.5 0 — 2xVREF V
Power Supply Rejection Ratio PSRRADC — 70 — dB
DC Performance
Integral Nonlinearity INL 12 Bit Mode — ±1 ±1.9 LSB
10 Bit Mode — ±0.2 ±0.5 LSB
Differential Nonlinearity
(Guaranteed Monotonic)
DNL 12 Bit Mode –1 ±0.7 1.8 LSB
10 Bit Mode — ±0.2 ±0.5 LSB
Offset Error (using VREFGND) EOFF 12 Bit Mode, VREF = 2.4 V –2 0 2 LSB
10 Bit Mode, VREF = 2.4 V –1 0 1 LSB
SiM3L1xx
22 Rev 1.0
Offset Temperature Coefficient TCOFF — 0.004 — LSB/°C
Slope Error EM–0.07 –0.02 0.02 %
Dynamic Performance (10 kHz Sine Wave Input 1dB below full scale, Max throughput)
Signal-to-Noise SNR 12 Bit Mode 62 66 — dB
10 Bit Mode 58 60 — dB
Signal-to-Noise Plus Distortion SNDR 12 Bit Mode 62 66 — dB
10 Bit Mode 58 60 — dB
Total Harmonic Distortion (Up to
5th Harmonic)
THD 12 Bit Mode — 78 — dB
10 Bit Mode — 77 — dB
Spurious-Free Dynamic Range SFDR 12 Bit Mode — –79 — dB
10 Bit Mode — –74 — dB
*Note: Absolute input pin voltage is limited by the lower of the supply at VBAT and VIO.
Table 3.9. SAR ADC (Continued)
Parameter Symbol Test Condition Min Typ Max Unit
Table 3.10. IDAC
Parameter Symbol Test Condition Min Typ Max Unit
Static Performance
Resolution Nbits 10 Bits
Integral Nonlinearity INL — ±0.5 ±2 LSB
Differential Nonlinearity (Guaranteed
Monotonic)
DNL — ±0.5 ±1 LSB
Output Compliance Range VOCR — — VBAT –
1.0
V
Full Scale Output Current IOUT 2 mA Range,
TA = 25 °C
1.98 2.046 2.1 mA
1 mA Range,
TA = 25 °C
0.99 1.023 1.05 mA
0.5 mA Range,
TA = 25 °C
491 511.5 525 μA
Offset Error EOFF — 250 — nA
Full Scale Error Tempco TCFS 2 mA Range — 100 — ppm/°C
VBAT Power Supply Rejection Ratio 2 mA Range — –220 — ppm/V
Test Load Impedance (to VSS) RTEST — 1 — k
Dynamic Performance
Output Settling Time to 1/2 LSB min output to max
output
— 1.2 — μs
Startup Time — 3 — μs
SiM3L1xx
Rev 1.0 23
SiM3L1xx
24 Rev 1.0
Table 3.11. ACCTR (Advanced Capture Counter)
Parameter Symbol Test Condition Min Typ Max Unit
LC Comparator Response Time,
CMPMD = 11
(Highest Speed)
tRESP0 +100 mV Differential — 100 — ns
–100 mV Differential — 150 — ns
LC Comparator Response Time,
CMPMD = 00
(Lowest Power)
tRESP3 +100 mV Differential — 1.4 — μs
–100 mV Differential — 3.5 — μs
LC Comparator Positive Hysteresis
Mode 0 (CPMD = 11)
HYSCP+ CMPHYP = 00 — 0.37 — mV
CMPHYP = 01 — 7.9 — mV
CMPHYP = 10 — 16.7 — mV
CMPHYP = 11 — 32.8 — mV
LC Comparator Negative Hysteresis
Mode 0 (CPMD = 11)
HYSCP- CMPHYN = 00 — 0.37 — mV
CMPHYN = 01 — –7.9 — mV
CMPHYN = 10 — –16.1 — mV
CMPHYN = 11 — –32.7 — mV
LC Comparator Positive Hysteresis
Mode 1 (CPMD = 10)
HYSCP+ CMPHYP = 00 — 0.47 — mV
CMPHYP = 01 — 5.85 — mV
CMPHYP = 10 — 12 — mV
CMPHYP = 11 — 24.4 — mV
LC Comparator Negative Hysteresis
Mode 1 (CPMD = 10)
HYSCP- CMPHYN = 00 — 0.47 — mV
CMPHYN = 01 — –6.0 — mV
CMPHYN = 10 — –12.1 — mV
CMPHYN = 11 — –24.6 — mV
LC Comparator Positive Hysteresis
Mode 2 (CPMD = 01)
HYSCP+ CMPHYP = 00 — 0.66 — mV
CMPHYP = 01 — 4.55 — mV
CMPHYP = 10 — 9.3 — mV
CMPHYP = 11 — 19 — mV
LC Comparator Negative Hysteresis
Mode 2 (CPMD = 01)
HYSCP- CMPHYN = 00 — 0.6 — mV
CMPHYN = 01 — –4.5 — mV
CMPHYN = 10 — –9.5 — mV
CMPHYN = 11 — –19 — mV
SiM3L1xx
Rev 1.0 25
LC Comparator Positive Hysteresis
Mode 3 (CPMD = 00)
HYSCP+ CMPHYP = 00 — 1.37 — mV
CMPHYP = 01 — 3.8 — mV
CMPHYP = 10 — 7.8 — mV
CMPHYP = 11 — 15.6 — mV
LC Comparator Negative Hysteresis
Mode 3 (CPMD = 00)
HYSCP- CMPHYN = 00 — 1.37 — mV
CMPHYN = 01 — –3.9 — mV
CMPHYN = 10 — –7.9 — mV
CMPHYN = 11 — –16 — mV
LC Comparator Input Range
(ACCTR0_LCIN pin)
VIN –0.25 — VBAT +
0.25
V
LC Comparator Common-Mode
Rejection Ratio
CMRRCP — 75 — dB
LC Comparator Power Supply Rejec-
tion Ratio
PSRRCP — 72 — dB
LC Comparator Input Offset Voltage VOFF TA = 25 °C –10 0 10 mV
LC Comparator Input Offset Tempco TCOFF — 3.5 — μV/°C
Reference DAC Offset Error DACEOFF –1 — 1 LSB
Reference DAC Full Scale Output DACFS Low Range — VIO/8 — V
High Range — VIO — V
Reference DAC Step Size DACLSB Low Range (48 steps) — VIO/384 — V
High Range (64 steps) — VIO/64 — V
LC Oscillator Period TLCOSC — 25 — ns
LC Bias Output Impedance RLCBIAS 10 μA Load — 1 — k
LC Bias Drive Strength ILCBIAS — — 2 mA
Pull-Up Resistor Tolerance RTOL PUVAL[4:2] = 0 to 6 -15 — 15 %
PUVAL[4:2] = 7 -10 — 10 %
Table 3.11. ACCTR (Advanced Capture Counter) (Continued)
Parameter Symbol Test Condition Min Typ Max Unit
Table 3.12. Voltage Reference Electrical Characteristics
Parameter Symbol Test Condition Min Typ Max Unit
Internal Fast Settling Reference
Output Voltage VREFFS –40 to +85 °C,
VBAT = 1.8–3.8 V
1.6 1.65 1.7 V
Temperature Coefficient TCREFFS — 50 — ppm/°C
Turn-on Time tREFFS — — 1.5 μs
Power Supply Rejection PSRRREFFS — 400 — ppm/V
Internal Precision Reference
Valid Supply Range VBAT VREF2X = 0 1.8 — 3.8 V
VREF2X = 1 2.7 — 3.8 V
Output Voltage
VREFP 25 °C ambient,
VREF2X = 0
1.17 1.2 1.23 V
25 °C ambient,
VREF2X = 1
2.35 2.4 2.45 V
Short-Circuit Current ISC — — 10 mA
Temperature Coefficient TCVREFP — 35 — ppm/°C
Load Regulation LRVREFP Load = 0 to 200 μA to
VREFGND
— 4.5 — ppm/μA
Load Capacitor CVREFP Load = 0 to 200 μA to
VREFGND
0.1 — — μF
Turn-on Time
tVREFPON 4.7 μF tantalum, 0.1 μF
ceramic bypass
— 3.8 — ms
0.1 μF ceramic bypass — 200 — μs
Power Supply Rejection PSRRVREFP VREF2X = 0 — 320 — ppm/V
VREF2X = 1 — 560 — ppm/V
External Reference
Input Current IEXTREF Sample Rate = 250 ksps;
VREF = 3.0 V
— 5.25 — μA
Table 3.13. Temperature Sensor
Parameter Symbol Test Condition Min Typ Max Unit
Offset VOFF TA = 0 °C — 760 — mV
Offset Error* EOFF TA = 0 °C — ±14 — mV
Slope M — 2.77 — mV/°C
Slope Error* EM— ±25 — μV/°C
Linearity — 1 — °C
Turn-on Time — 1.8 — μs
*Note: Absolute input pin voltage is limited by the lower of the supply at VBAT and VIO.
SiM3L1xx
26 Rev 1.0
SiM3L1xx
Rev 1.0 27
Table 3.14. Comparator
Parameter Symbol Test Condition Min Typ Max Unit
Response Time, CMPMD = 00
(Highest Speed)
tRESP0 +100 mV Differential — 100 — ns
–100 mV Differential — 150 — ns
Response Time, CMPMD = 11
(Lowest Power)
tRESP3 +100 mV Differential — 1.4 — μs
–100 mV Differential — 3.5 — μs
Positive Hysteresis
Mode 0 (CPMD = 00)
HYSCP+ CMPHYP = 00 — 0.37 — mV
CMPHYP = 01 — 7.9 — mV
CMPHYP = 10 — 16.7 — mV
CMPHYP = 11 — 32.8 — mV
Negative Hysteresis
Mode 0 (CPMD = 00)
HYSCP- CMPHYN = 00 — 0.37 — mV
CMPHYN = 01 — –7.9 — mV
CMPHYN = 10 — –16.1 — mV
CMPHYN = 11 — –32.7 — mV
Positive Hysteresis
Mode 1 (CPMD = 01)
HYSCP+ CMPHYP = 00 — 0.47 — mV
CMPHYP = 01 — 5.85 — mV
CMPHYP = 10 — 12 — mV
CMPHYP = 11 — 24.4 — mV
Negative Hysteresis
Mode 1 (CPMD = 01)
HYSCP- CMPHYN = 00 — 0.47 — mV
CMPHYN = 01 — –6.0 — mV
CMPHYN = 10 — –12.1 — mV
CMPHYN = 11 — –24.6 — mV
Positive Hysteresis
Mode 2 (CPMD = 10)
HYSCP+ CMPHYP = 00 — 0.66 — mV
CMPHYP = 01 — 4.55 — mV
CMPHYP = 10 — 9.3 — mV
CMPHYP = 11 — 19 — mV
Negative Hysteresis
Mode 2 (CPMD = 10)
HYSCP- CMPHYN = 00 — 0.6 — mV
CMPHYN = 01 — –4.5 — mV
CMPHYN = 10 — –9.5 — mV
CMPHYN = 11 — –19 — mV
SiM3L1xx
28 Rev 1.0
Positive Hysteresis
Mode 3 (CPMD = 11)
HYSCP+ CMPHYP = 00 — 1.37 — mV
CMPHYP = 01 — 3.8 — mV
CMPHYP = 10 — 7.8 — mV
CMPHYP = 11 — 15.6 — mV
Negative Hysteresis
Mode 3 (CPMD = 11)
HYSCP- CMPHYN = 00 — 1.37 — mV
CMPHYN = 01 — –3.9 — mV
CMPHYN = 10 — –7.9 — mV
CMPHYN = 11 — –16 — mV
Input Range (CP+ or CP–) VIN –0.25 — VBAT +
0.25
V
Input Pin Capacitance CCP — 7.5 — pF
Common-Mode Rejection Ratio CMRRCP — 75 — dB
Power Supply Rejection Ratio PSRRCP — 72 — dB
Input Offset Voltage VOFF TA = 25 °C –10 0 10 mV
Input Offset Tempco TCOFF — 3.5 — μV/°C
Reference DAC Resolution NBits 6 bits
Table 3.15. LCD0
Parameter Symbol Test Condition Min Typ Max Unit
Charge Pump Output Voltage Error VCPERR — ±50 — mV
LCD Clock Frequency FLCD 16 — 33 kHz
Table 3.14. Comparator (Continued)
Parameter Symbol Test Condition Min Typ Max Unit
Table 3.16. Port I/O
Parameter Symbol Test Condition Min Typ Max Unit
Output High Voltage (PB0, PB1,
PB3, or PB4)
VOH Low Drive, IOH = –1 mA VIO – 0.7 — — V
Low Drive, IOH = –10 μA VIO – 0.1 — — V
High Drive, IOH = –3 mA VIO – 0.7 — — V
High Drive, IOH = –10 μA VIO – 0.1 — — V
Output High Voltage (PB2) VOH Low Drive, IOH = –1 mA VIORF – 0.7 — — V
Low Drive, IOH = –10 μA VIORF – 0.1 — — V
High Drive, IOH = –3 mA VIORF – 0.7 — — V
High Drive, IOH = –10 μA VIORF – 0.1 — — V
Output Low Voltage (any Port I/O
pin or RESET1)
VOL Low Drive, IOL = 1.4 mA — — 0.6 V
Low Drive, IOL = 10 μA — — 0.1 V
High Drive, IOL = 8.5 mA — — 0.6 V
High Drive, IOL = 10 μA — — 0.1 V
Input High Voltage (PB0, PB1,
PB3, PB4 or RESET)
VIH VIO – 0.6 — — V
Input High Voltage (PB2) VIH VIORF – 0.6 — — V
Input Low Voltage any Port I/O pin
or RESET)
VIL — — 0.6 V
Weak Pull-Up Current2 (per pin) IPU VIO or VIORF = 1.8 -6 -3.5 -2 μA
VIO or VIORF = 3.8 -32 -20 -10 μA
Input Leakage
(Pullups off or Analog)
ILK 0 < VIN < VIO or VIORF -1 — 1 μA
Notes:
1. Specifications for RESET VOL adhere to the low drive setting.
2. On the SiM3L1x6 and SiM3L1x4 devices, the SWV pin will have double the weak pull-up current specified whenever
the device is held in reset.
SiM3L1xx
Rev 1.0 29
SiM3L1xx
30 Rev 1.0
3.2. Thermal Conditions
Table 3.17. Thermal Conditions
Parameter Symbol Test Condition Min Typ Max Unit
Thermal Resistance* JA TQFP-80 Packages — 40 — °C/W
TFBGA-80 Packages — 50 — °C/W
QFN-64 Packages — 25 — °C/W
TQFP-64 Packages — 30 — °C/W
QFN-40 Packages — 30 — °C/W
*Note: Thermal resistance assumes a multi-layer PCB with the exposed pad soldered to a topside PCB pad.
SiM3L1xx
Rev 1.0 31
3.3. Absolute Maximum Ratings
Table 3.18. Absolute Maximum Ratings
Parameter Symbol Test Condition Min Max Unit
Ambient Temperature Under Bias TBIAS –55 125 °C
Storage Temperature TSTG –65 150 °C
Voltage on VBAT/VBATDC VBAT VSS–0.3 4.2 V
Voltage on VDC VDC VSSDC–0.3 4.2 V
Voltage on VDRV VDRV VSS–0.3 4.2 V
Voltage on VIO VIO VSS–0.3 4.2 V
Voltage on VIORF VIORF VSS–0.3 4.2 V
Voltage on VLCD VLCD VSS–0.3 4.2 V
Voltage on I/O (PB0, PB1, PB3, PB4) or
RESET1
VIN VIO > 3.3 V VSS–0.3 5.8 V
VIO < 3.3 V VSS–0.3 VIO+2.5 V
Voltage on PB2 I/O Pins1VIN VIORF > 3.3 V VSS–0.3 5.8 V
VIORF < 3.3 V VSS–0.3 VIORF+2.5 V
Total Current Sunk into Supply Pins ISUPP VBAT/VBATDC, VIO,
VIORF, VDRV, VDC,
VLCD
— 400 mA
Total Current Sourced out of
Ground Pins2
IVSS VSS, VSSDC 400 — mA
Current Sourced or Sunk by any I/O Pin IPIO All I/O and RESET –100 100 mA
Power Dissipation at TA = 85 °C PDTQFP-80 Packages — 500 mW
TFBGA-80 Packages — 400 mW
QFN-64 Packages — 800 mW
TQFP-64 Packages — 650 mW
QFN-40 Packages — 650 mW
Notes:
1. Exceeding the minimum VIO voltage may cause current to flow through adjacent device pins.
2. VSS and VSSDC provide separate return current paths for device supplies, but are not isolated. They must always be
connected to the same potential on board.
Stresses above those listed under Table 3.18 may cause permanent damage to the device. This is a stress rating
only and functional operation of the devices at those or any other conditions above those indicated in the operation
listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect
device reliability.
SiM3L1xx
32 Rev 1.0
4. Precision32™ SiM3L1xx System Overview
The SiM3L1xx Precision32™ devices are fully integrated, mixed-signal system-on-a-chip MCUs. Highlighted
features are listed below. Refer to Table 5.1 for specific product feature selection and part ordering numbers.
Core:
32-bit ARM Cortex-M3 CPU.
50 MHz maximum operating frequency.
Branch target cache and prefetch buffers to minimize wait states.
Memory: 32–256 kB flash; in-system programmable, 8–32 kB SRAM configurable to retention mode in
4 kB blocks. Blocks configured to retention mode preserve state in the low power PM8 mode.
Power:
Three adjustable low drop-out (LDO) regulators.
DC-DC buck converter allows dynamic voltage scaling for maximum efficiency (250 mW output).
Power-on reset circuit and brownout detectors.
Power Management Unit (PMU).
Specialized charge pump reduces power consumption in low power modes.
Process/Voltage/Temperature (PVT) Monitor.
Register state retention in lowest power mode.
I/O: Up to 62 contiguous 5 V tolerant I/O pins and one flexible peripheral crossbar.
Clock Sources:
Internal oscillator with PLL: 23–50 MHz with ± 1.5% accuracy in free-running mode.
Low-power internal oscillator: 20 MHz.
Low-frequency internal oscillator: 16.4 kHz.
External RTC crystal oscillator: 32.768 kHz.
External oscillator: Crystal, RC, C, CMOS clock.
Integrated LCD Controller (4x40).
Data Peripherals:
10-Channel DMA Controller.
3 x Data Transfer Managers.
128/192/256-bit Hardware AES Encryption.
CRC with programmable 16-bit polynomial, one 32-bit polynomial, and bus snooping capability.
Encoder / Decoder.
Timers/Counters:
3 x 32-bit Timers.
1 x Enhanced Programmable Counter Array (EPCA).
Real Time Clock (RTC0).
Low Power Timer.
Watchdog Timer.
Low Power Mode Advanced Capture Counter (ACCTR).
Communications Peripherals:
1 x USART with IrDA and ISO7816 SmartCard support.
1 x UART that operates in low power mode (PM8).
2 x SPIs.
1 x I2C.
Analog:
1 x 12-Bit Analog-to-Digital Converter (SARADC).
1 x 10-Bit Digital-to-Analog Converter (IDAC).
2 x Low-Current Comparators (CMP).
On-Chip Debugging
With on-chip power-on reset, voltage supply monitor, watchdog timer, and clock oscillators, the SiM3L1xx devices
are truly stand-alone system-on-a-chip solutions. The flash memory is reprogrammable in-circuit, providing non-
volatile data storage and allowing field upgrades of the firmware. User firmware has complete control of all
SiM3L1xx
Rev 1.0 33
peripherals and may individually shut down and gate the clocks of any or all peripherals for power savings.
The on-chip debugging interface (SWJ-DP) allows non-intrusive (uses no on-chip resources), full speed, in-circuit
debugging using the production MCU installed in the final application. This debug logic supports inspection and
modification of memory and registers, setting breakpoints, single stepping, and run and halt commands. All analog
and digital peripherals are fully functional while debugging.
Each device is specified for 1.8 to 3.8 V operation over the industrial temperature range (–40 to +85 °C). The
SiM3L1xx devices are available in 40-pin or 64-pin QFN, 64-pin or 80-pin TQFP, and 80-pin TFBGA packages. All
package options are lead-free and RoHS compliant. See Table 5.1 for ordering information. A block diagram is
included in Figure 4.1.
Figure 4.1. Precision32™ SiM3L1xx Family Block Diagram
SiM3L1xx
34 Rev 1.0
4.1. Power
The SiM3L1xx devices include a dc-dc buck converter that can take an input from 1.8–3.8 V and create an output
from 1.25–3.8 V. In addition, SiM3L1xx devices include three low dropout regulators as part of the LDO0 module:
one LDO powers the analog subsystems, one LDO powers the flash and SRAM memory at 1.8 V, and one LDO
powers the digital and core circuitry. Each of these regulators can be independently powered from the dc-dc
converter or directly from the battery voltage, and their outputs are adjustable to conserve system power. SiM3L1xx
devices also include a low power charge pump in the PMU module for use in low power modes (PM8) to further
reduce the power consumption of the device.
Figure 4.2 shows the power system configuration of these devices.
Figure 4.2. SiM3L1xx Power
4.1.1. DC-DC Buck Converter (DCDC0)
SiM3L1xx devices include an on-chip step-down dc-dc converter to efficiently utilize the energy stored in the
battery, thus extending the operational life time. The dc-dc converter is a switching buck converter with a
programmable output voltage that should be at least 0.45 V lower than the input battery voltage; if this criteria is not
met and the converter can no longer operate, the output of the dc-dc converter automatically connects to the
battery. The dc-dc converter can supply up to 100 mA and can be used to power the MCU and/or external devices
in the system.
The dc-dc converter has a built in voltage reference and oscillator and will automatically limit or turn off the
switching activity in case the peak inductor current rises beyond a safe limit or the output voltage rises above the
programmed target value. This allows the dc-dc converter output to be safely overdriven by a secondary power
source (when available) in order to preserve battery life. When enabled, the dc-dc converter can source current
into the output capacitor, but cannot sink current.
The dc-dc converter includes the following features:
Efficiently utilizes the energy stored in a battery, extending its operational lifetime.
Input range: 1.8 to 3.8 V.
Output range: 1.25 to 3.8 V in 50 mV (1.25–1.8 V) or 100 mV (1.8–3.8 V) steps.
Supplies up to 100 mA.
Includes a voltage reference and an oscillator.
SiM3L1xx
Rev 1.0 35
Supports synchronizing the regulator switching with the system clock.
Automatically limits the peak inductor current if the load current rises beyond a safe limit.
Automatically goes into bypass mode if the battery voltage cannot provide sufficient headroom.
Sources current, but cannot sink current.
4.1.2. Three Low Dropout LDO Regulators (LDO0)
The SiM3L1xx devices include one LDO0 module with three low dropout regulators. Each of these regulators have
independent switches to select the battery voltage or the output of the dc-dc converter as the input to each LDO,
and an adjustable output voltage.
The LDOs consume little power and provide flexibility in choosing a power supply for the system. Each regulator
can be independently adjusted between 0.8 and 1.9 V output.
4.1.3. Voltage Supply Monitor (VMON0)
The SiM3L1xx devices include a voltage supply monitor that can monitor the main supply voltage. This module
includes the following features:
Main supply “VBAT Low” (VBAT below the early warning threshold) notification.
Holds the device in reset if the main VBAT supply drops below the VBAT Reset threshold.
The voltage supply monitor allows devices to function in known, safe operating conditions without the need for
external hardware.
4.1.4. Power Management Unit (PMU)
The Power Management Unit on the SiM3L1xx manages the power systems of the device. It manages the power-
up sequence during power on and the wake up sources for PM8. On power-up, the PMU ensures the core voltages
are a proper value before core instruction execution begins.
The VDRV pin powers external circuitry from either the VBAT battery input voltage or the output of the dc-dc
converter on VDC. The PMU includes an internal switch to select one of these sources for the VDRV pin.
The PMU has a specialized VBAT-divided-by-2 charge pump that can power some internal modules while in PM8
to save power.
The PMU module includes the following features:
Provides the enable or disable for the analog power system, including the three LDO regulators.
Up to 14 pin wake inputs can wake the device from Power Mode 8.
The Low Power Timer, RTC0 (alarms and oscillator failure), Comparator 0, Advanced Capture Counter,
LCD0 VBAT monitor, UART0, low power mode charge pump failure, and the RESET pin can also serve as
wake sources for Power Mode 8.
Controls which 4 kB RAM blocks are retained while in Power Mode 8.
Provides a PMU_Asleep signal to a pin as an indicator that the device is in PM8.
Specialized charge pump to reduce power consumption in PM8.
Provides control for the internal switch between VBAT and VDC to power the VDRV pin for external circuitry.
4.1.5. Device Power Modes
The SiM3L1xx devices feature seven low power modes in addition to normal operating mode. Several peripherals
provide wake up sources for these low power modes, including the Low Power Timer (LPTIMER0), RTC0 (alarms
and oscillator failure notification), Comparator 0 (CMP0), Advanced Capture Counter (ACCTR0), LCD VBAT
monitor (LCD0), UART0, low power mode charge pump failure, and PMU Pin Wake.
In addition, all peripherals can have their clocks disabled to reduce power consumption whenever a peripheral is
not being used using the clock control (CLKCTRL) registers.
4.1.5.1. Normal Mode (Power Mode 0) and Power Mode 4
Normal Mode and Power Mode 4 are fully operational modes with code executing from flash memory. PM4 is the
same as Normal Mode, but with the clocks operating at a lower speed. This enables power to be conserved by
reducing the LDO regulator outputs.
SiM3L1xx
36 Rev 1.0
4.1.5.2. Power Mode 1 and Power Mode 5
Power Mode 1 and Power Mode 5 are fully operational modes with code executing from RAM. PM5 is the same as
PM1, but with the clocks operating at a lower speed. This enables power to be conserved by reducing the LDO
regulator outputs. Compared with the corresponding flash operational mode (Normal or PM4), the active power
consumption of the device in these modes is reduced. Additionally, at higher speeds in PM1, the core throughput
can also be increased because RAMdoesnot require additional wait states that reduce the instruction fetch speed.
4.1.5.3. Power Mode 2 and Power Mode 6
In Power Mode 2 and Power Mode 6, the core halts and the peripherals continue to run at the selected clock
speed. PM6 is the same as PM2, but with the clocks operating at a lower speed. This enables power to be
conserved by reducing the LDO regulator outputs. To place the device in PM2 or PM6, the core should execute a
wait-for-interrupt (WFI) or wait-for-event (WFE) instruction. If the WFI instruction is called from an interrupt service
routine, the interrupt that wakes the device from PM2 or PM6 must be of a sufficient priority to be recognized by the
core. It is recommended to perform both a DSB (Data Synchronization Barrier) and an ISB (Instruction
Syncronization Barrier) operation prior to the WFI to ensure all bus accesses complete. When operating from the
LFOSC0, PM6 can achieve similar power consumption to PM3, but with faster wake times and the ability to wake
on any interrupt.
4.1.5.4. Power Mode 3
In Power Mode 3 the core and peripheral clocks are halted. The available sources to wake from PM3 are controlled
by the Power Management Unit (PMU). A special Fast Wake option allows the core to wake faster by keeping the
LFOSC0 or RTC0 clock active. Because the current consumption of these blocks is minimal, it is recommended to
use the fast wake option.
Before entering PM3, the DMA controller should be disabled, and the desired wake source(s) should be configured
in the PMU. The SLEEPDEEP bit in the ARM System Control Register should be set, and the PMSEL bit in the
CLKCTRL0_CONFIG register should be cleared to indicate that PM3 is the desired power mode. For fast wake,
the core clocks (AHB and APB) should be configured to run from the LPOSC, and the PM3 Fast wake option and
clock source should be selected in the PM3CN register.
The device will enter PM3 on a WFI or WFE instruction. If the WFI instruction is called from an interrupt service
routine, the interrupt that wakes the device from PM3 must be of a sufficient priority to be recognized by the core. It
is recommended to perform both a DSB (Data Synchronization Barrier) and an ISB (Instruction Synchronization
Barrier) operation prior to the WFI to ensure all bus access is complete.
4.1.5.5. Power Mode 8
In Power Mode 8, the core and most peripherals are completely powered down, but all registers and selected RAM
blocks retain their state. The LDO regulators are disabled, so all active circuitry operates directly from VBAT.
Alternatively, the PMU has a specialized VBAT-divided-by-2 charge pump that can power some internal modules
while in PM8 to save power. The fully operational functions in this mode are: LPTIMER0 , RTC0, UART0 running
from RTC0TCLK, PMU Pin Wake, the advanced capture counter, and the LCD controller.
This mode provides the lowest power consumption for the device, but requires an appropriate wake up source or
reset to exit. The available wake up or reset sources to wake from PM8 are controlled by the Power Management
Unit (PMU). The available wake up sources are: Low Power Timer (LPTIMER0), RTC0 (alarms and oscillator
failure notification), Comparator 0 (CMP0), advanced capture counter (ACCTR0), LCD VBAT monitor (LCD0),
UART0, low power mode charge pump failure, and PMU Pin Wake. The available reset sources are: RESET pin,
VBAT supply monitor, Comparator 0, Comparator 1, low power mode charge pump failure, RTC0 oscillator failure,
or a PMU wake event.
Before entering PM8, the desired wake source(s) should be configured in the PMU. The SLEEPDEEP bit in the
ARM System Control Register should be set, and the PMSEL bit in the CLKCTRL0_CONFIG register should be set
to indicate that PM8 is the desired power mode.
The device will enter PM8 on a WFI or WFE instruction, and remain in PM8 until a reset configured by the PMU
occurs. It is recommended to perform both a DSB (Data Synchronization Barrier) and an ISB (Instruction
Synchronization Barrier) operation prior to the WFI to ensure all bus access is complete.
Table 4.1. SiM3L1xx Power Modes
Mode Description Notes
SiM3L1xx
Rev 1.0 37
4.1.5.6. Power Mode Summary
The power modes described above are summarized in Table 4.1. Table 3.2 and Table 3.3 provide more information
on the power consumption and wake up times for each mode.
Normal Core operating at full speed
Code executing from flash
Full device operation
Power Mode 1 (PM1)
Core operating at full speed
Code executing from RAM
Full device operation
Higher CPU bandwidth than PM0 (RAM
can operate with zero wait states at any
frequency)
Power Mode 2 (PM2)
Core halted
AHB, APB and all peripherals
operational at full speed
Fast wakeup from any interrupt source
Power Mode 3 (PM3)
All clocks to core and peripherals
stopped
Faster wake enabled by keeping
LFOSC0 or RTC0TCLK active
Wake on any wake source or reset
source defined in the PMU
Power Mode 4 (PM4)
Core operating at low speed
Code executing from flash
Same capabilities as PM0, operating at
lower speed
Lower clock speed enables lower LDO
output settings to save power
Power Mode 5 (PM5)
Core operating at low speed
Code executing from RAM
Same capabilities as PM1, operating at
lower speed
Lower clock speed enables lower LDO
output settings to save power
Power Mode 6 (PM6)
Core halted
AHB, APB and all peripherals
operational at low speed
Same capabilities as PM2, operating at
lower speed
Lower clock speed enables lower LDO
output settings to save power
When running from LFOSC0, power is
similar to PM3, but the device wakes
much faster
Power Mode 8 (PM8)
Low power sleep
LDO regulators are disabled and all
active circuitry operates directly from
VBAT
The following functions are available:
ACCTR0, RTC0, UART0 running
from RTC0TCLK, LPTIMER0, port
match, and the LCD controller
Register and RAM state retention
Lowest power consumption
Wake on any wake source or reset
source defined in the PMU
SiM3L1xx
38 Rev 1.0
4.1.6. Process/Voltage/Temperature Monitor (TIMER2 and PVTOSC0)
The Process/Voltage/Temperature monitor consists of two modules (TIMER2 and PVTOSC0) designed to monitor
the digital circuit performance of the SiM3L1xx device.
The PVT oscillator (PVTOSC0) consists of two oscillators, one operating from the memory LDO and one operating
from the digital LDO. These oscillators have two independent speed options and provide the clocks for two 16-bit
timers in the TIMER2 module using the EX input. By monitoring the resulting counts of the TIMER2 timers,
firmware can monitor the current device performance and increase the scalable LDO regulator (LDO0) output
voltages as needed or decrease the output voltages to save power.
The PVT monitor has the following features:
Two separate oscillators and timers for the memory and digital logic voltage domains.
Two oscillator output divider settings.
Provides a method for monitoring digital performance to allow firmware to adjust the scalable LDO
regulator output voltages to the lowest level possible, saving power.
SiM3L1xx
Rev 1.0 39
4.2. I/O
4.2.1. General Features
The SiM3L1xx ports have the following features:
5 V tolerant.
Push-pull or open-drain output modes to the VIO or VIORF voltage level.
Analog or digital modes.
Option for high or low output drive strength.
Port Match allows the device to recognize a change on a port pin value.
Internal pull-up resistors are enabled or disabled on a port-by-port basis.
Two external interrupts with up to 16 inputs each provide monitoring capability for external signals.
Internal Pulse Generator Timer (PB0 only) to generate simple square waves and pulses.
4.2.2. Crossbar
The SiM3L1xx devices have one crossbar with the following features:
Flexible peripheral assignment to port pins.
Pins can be individually skipped to move peripherals as needed for design or layout considerations.
The crossbar has a fixed priority for each I/O function and assigns these functions to the port pins. When a digital
resource is selected, the least-significant unassigned port pin is assigned to that resource. If a port pin is assigned,
the crossbar skips that pin when assigning the next selected resource. Additionally, the crossbar will skip port pins
whose associated bits in the PBSKIPEN registers are set. This provides flexibility when designing a system: pins
involved with sensitive analog measurements can be moved away from digital I/O, and peripherals can be moved
around the chip as needed to ease layout constraints.
SiM3L1xx
40 Rev 1.0
4.3. Clocking
The SiM3L1xx devices have two system clocks: AHB and APB. The AHB clock services memory peripherals and is
derived from one of seven sources: the RTC timer clock (RTC0TCLK), the Low Frequency Oscillator, the Low
Power Oscillator, the divided Low Power Oscillator, the External Oscillator, the PLL0 Oscillator, and the VIORFCLK
pin input. In addition, a divider for the AHB clock provides flexible clock options for the device. The APB clock
services data peripherals and is synchronized with the AHB clock. The APB clock can be equal to the AHB clock or
set to the AHB clock divided by two.
The Clock Control module on SiM3L1xx devices allows the AHB and APB clocks to be turned off to unused
peripherals to save system power. Any registers in a peripheral with disabled clocks will be unable to be accessed
until the clocks are enabled. Most peripherals have clocks off by default after a power-on reset.
Figure 4.3. SiM3L1xx Clocking
SiM3L1xx
Rev 1.0 41
4.3.1. PLL (PLL0)
The PLL module consists of a dedicated Digitally-Controlled Oscillator (DCO) that can be used in Free-Running
mode without a reference frequency, Frequency-Locked to a reference frequency, or Phase-Locked to a reference
frequency. The reference frequency for Frequency-Lock and Phase-Lock modes can use one of multiple sources
(including the external oscillator) to provide maximum flexibility for different application needs. Because the PLL
module generates its own clock, the DCO can be locked to a particular reference frequency and then moved to
Free-Running mode to reduce system power and noise.
The PLL module includes the following features:
Three output ranges with output frequencies ranging from 23 to 50 MHz.
Multiple reference frequency inputs, including the RTC0 oscillator, Low Power Oscillator, and external
oscillator.
Three output modes: Free-Running Digitally-Controlled Oscillator, Frequency-Locked, and Phase-Locked.
Able to sense the rising edge or falling edge of the reference source.
DCO frequency LSB dithering to provide finer average output frequencies.
Spectrum spreading to reduce generated system noise.
Low jitter and fast lock times.\
All output frequency updates (including dithering and spectrum spreading) can be temporarily suspended
using the STALL bit during noise-sensitive measurements.
4.3.2. Low Power Oscillator (LPOSC0)
The Low Power Oscillator is the default AHB oscillator on SiM3L1xx devices and enables or disables automatically,
as needed.
The default output frequency of this oscillator is factory calibrated to 20 MHz, and a divided 2.5 MHz version of this
clock is also available as an AHB clock source.
The Low Power Oscillator has the following features:
20 MHz and divided 2.5 MHz frequencies available for the AHB clock.
Automatically starts and stops as needed.
4.3.3. Low Frequency Oscillator (LFOSC0)
The low frequency oscillator (LFOSC) provides a low power internal clock source for the RTC0 timer and other
peripherals on the device. No external components are required to use the low frequency oscillator, and the RTC1
and RTC2 pins do not need to be shorted together.
The Low Frequency Oscillator has the following features:
16.4 kHz output frequency.
4.3.4. External Oscillators (EXTOSC0)
The EXTOSC0 external oscillator circuit may drive an external crystal, ceramic resonator, capacitor, or RC
network. A CMOS clock may also provide a clock input. The external oscillator output may be selected as the AHB
clock or used to clock other modules independent of the AHB clock selection.
The External Oscillator control has the following features:
Support for external crystal, resonator, RC, C, or CMOS oscillators.
Support for external CMOS frequencies from 10 kHz to 50 MHz.
Support for external crystal frequencies from 10 kHz to 25 MHz.
Various drive strengths for flexible crystal oscillator support.
Internal frequency divide-by-two option available.
SiM3L1xx
42 Rev 1.0
4.4. Integrated LCD Controller (LCD0)
SiM3L1xx devices contain an LCD segment driver and on-chip bias generation that supports static, 2-mux, 3-mux
and 4-mux LCDs with 1/2 or 1/3 bias. The on-chip charge pump with programmable output voltage allows software
contrast control which is independent of the supply voltage. LCD timing is derived from the RTC timer clock
(RTC0TCLK) to allow precise control over the refresh rate.
The SiM3L1xx devices use registers to store the enabled/disabled state of individual LCD segments. All LCD
waveforms are generated on-chip based on the contents of these registers with flexible waveform control to reduce
power consumption wherever possible. An LCD blinking function is also supported on a subset of LCD segments.
The LCD0 module has the following features:
Up to 40 segment pins and 4 common pins.
Supports LCDs with 1/2 or 1/3 bias.
Includes an on-chip charge pump with programmable output that allows firmware to control the contrast
independent of the supply voltage.
The RTC timer clock (RTC0TCLK) determines the LCD timing and refresh rate.
All LCD waveforms are generated on-chip based on the contents of the LCD0 registers with flexible
waveform control.
LCD segments can be placed in a discharge state for a configurable number of RTC clock cycles before
switching to the next state to reduce power consumption due to display loading.
Includes a VBAT monitor that can serve as a wakeup source for Power Mode 8.
Supports four hardware auto-contrast modes: bypass, constant, minimum, and auto-bypass.
Supports hardware blinking for up to 8 segments.
SiM3L1xx
Rev 1.0 43
4.5. Data Peripherals
4.5.1. 10-Channel DMA Controller
The DMA facilitates autonomous peripheral operation, allowing the core to finish tasks more quickly without
spending time polling or waiting for peripherals to interrupt. This helps reduce the overall power consumption of the
system, as the device can spend more time in low-power modes.
The DMA controller has the following features:
Utilizes ARM PrimeCell uDMA architecture.
Implements 10 channels.
DMA crossbar supports DTM0, DTM1, DTM2, SARADC0, IDAC0, I2C0, SPI0, SPI1, USART0, AES0,
ENCDEC0, EPCA0, external pin triggers, and timers.
Supports primary, alternate, and scatter-gather data structures to implement various types of transfers.
Access allowed to all AHB and APB memory space.
4.5.2. Data Transfer Managers (DTM0, DTM1, DTM2)
The Data Transfer Manager is a module that collects DMA request signals from various peripherals and generates
a series of master DMA requests based on a state-driven configuration. This master request drives a set of DMA
channels to perform functions such as assembling and transferring communication packets to external devices.
This capability saves power by allowing the core to remain in a low power mode during complex transfer
operations. A combination of simple and peripheral scatter-gather DMA configurations can be used to perform
complex operations while reducing memory requirements.
The DTM acts as a side channel for the peripheral’s DMA control signals. When active, it manages the DMA
control signals for the peripherals. When the DTMn module is inactive, the peripherals communicate directly to the
DMA module.
The DTMn module has the following features:
State descriptions stored in RAM with up to 15 states supported per module.
Supports up to 15 source peripherals and up to 15 destination peripherals per module, in addition to
memory or peripherals that do not require a data request.
Includes error detection and an optional transfer timeout.
Includes notifications for state transitions.
4.5.3. 128/192/256-bit Hardware AES Encryption (AES0)
The basic AES block cipher is implemented in hardware. The integrated hardware support for Cipher Block
Chaining (CBC) and Counter (CTR) algorithms results in identical performance, memory bandwidth, and memory
footprint between the most basic Electronic Codebook (ECB) algorithm and these more complex algorithms. This
hardware accelerator translates to more core bandwidth available for other functions or a power savings for low-
power applications.
The AES module includes the following features:
Operates on 4-word (16-byte) blocks.
Supports key sizes of 128, 192, and 256 bits for both encryption and decryption.
Generates the round key for decryption operations.
All cipher operations can be performed without any firmware intervention for multiple 4-word blocks (up to
32 kB).
Support for various chained and stream-ciphering configurations with XOR paths on both the input and
output.
Internal 4-word FIFOs to facilitate DMA operations.
Integrated key storage.
Hardware acceleration for Electronic Codebook (ECB), Cipher-Block Chaining (CBC), and Counter (CTR)
algorithms utilizing integrated counterblock generation and previous-block caching.
SiM3L1xx
44 Rev 1.0
4.5.4. 16/32-bit Enhanced CRC (ECRC0)
The ECRC module is designed to provide hardware calculations for flash memory verification and communications
protocols. In addition to calculating a result from direct writes from firmware, the ECRC module can automatically
snoop the APB bus and calculate a result from data written to or read from a particular peripheral. This allows for
an automatic CRC result without directly feeding data through the ECRC module.
The supported 32-bit polynomial is 0x04C11DB7 (IEEE 802.3). The 16-bit polynomial is fully programmable.
The ECRC module includes the following features:
Support for a programmable 16-bit polynomial and one fixed 32-bit polynomial.
Byte-level bit reversal for the CRC input.
Byte-order reorientation of words for the CRC input.
Word or half-word bit reversal of the CRC result.
Ability to configure and seed an operation in a single register write.
Support for single-cycle parallel (unrolled) CRC computation for 32-, 16-, or 8-bit blocks.
Capability to CRC 32 bits of data per peripheral bus (APB) clock.
Automatic APB bus snooping.
Support for DMA writes using firmware request mode.
4.5.5. Encoder / Decoder (ENCDEC0)
The encoder / decoder module supports Manchester and Three-out-of-Six encoding and decoding from either
firmware or DMA operations.
This module has the following features:
Supports Manchester and Three-out-of-Six encoding and decoding.
Automatic flag clearing when writing the input or reading the output data registers.
Writing to the input data register automatically initiates an encode or decode operation.
Optional output in one’s complement format.
Hardware error detection for invalid input data during decode operations, which helps reduce power
consumption and packet turn-around time.
Flexible byte swapping on the input or output data.
SiM3L1xx
Rev 1.0 45
4.6. Counters/Timers
4.6.1. 32-bit Timer (TIMER0, TIMER1, TIMER2)
Each timer module is independent, and includes the following features:
Operation as a single 32-bit or two independent 16-bit timers.
Clocking options include the APB clock, the APB clock scaled using an 8-bit prescaler, the external
oscillator, or falling edges on an external input pin (synchronized to the APB clock).
Auto-reload functionality in both 32-bit and 16-bit modes.
TIMER0 and TIMER1 have the following features:
Up/Down count capability, controlled by an external input pin.
Rising and falling edge capture modes.
Low or high pulse capture modes.
Period and duty cycle capture mode.
Square wave output mode, which is capable of toggling an external pin at a given rate with 50% duty cycle.
32- or 16-bit pulse-width modulation mode.
TIMER2 does not support the standard input/output features of TIMER0 and TIMER1. The TIMER2 EX signal is
internally connected to the outputs of the PVTOSC0 oscillators. TIMER2 can use any of the counting modes that
use EX as an input, including up/down mode, edge capture mode, and pulse capture mode. The TIMER2 CT signal
is disconnected.
4.6.2. Enhanced Programmable Counter Array (EPCA0)
The Enhanced Programmable Counter Array (EPCA) module is a timer/counter system allowing for complex timing
or waveform generation. Multiple modules run from the same main counter, allowing for synchronous output
waveforms.
This module includes the following features:
Three sets of channel pairs (six channels total) capable of generating complementary waveforms.
Center- and edge-aligned waveform generation.
Programmable dead times that ensure channel pairs are never active at the same time.
Programmable clock divisor and multiple options for clock source selection.
Waveform update scheduling.
Option to function while the core is inactive.
Multiple synchronization triggers.
Pulse-Width Modulation (PWM) waveform generation.
SiM3L1xx
46 Rev 1.0
4.6.3. Real-Time Clock (RTC0)
The RTC module includes a 32-bit timer that allows up to 36 hours of independent time-keeping when used with a
32.768 kHz watch crystal. The RTC provides three alarm events in addition to a missing clock event, which can
also function as interrupt, reset, or wakeup sources on SiM3L1xx devices.
The RTC module includes internal loading capacitors that are programmable to 16 discrete levels, allowing
compatibility with a wide range of crystals.
The RTC timer clock can be buffered and routed to a port bank pin to provide an accurate, low frequency clock to
other devices while the core is in its lowest power down mode. The module also includes a low power internal low
frequency oscillator that reduces low power mode current and is available for other modules to use as a clock
source.
The RTC module includes the following features:
32-bit timer (supports up to 36 hours) with three separate alarms.
Option for one alarm to automatically reset the RTC timer.
Missing clock detector.
Can be used with the internal Low Frequency Oscillator or with an external 32.768 kHz crystal (no
additional resistors or capacitors necessary).
Programmable internal loading capacitors support a wide range of external 32.768 kHz crystals.
The RTC timer clock (RTC0CLK) can be buffered and routed to an I/O pin to provide an accurate, low
frequency clock to other devices while the core is in its lowest power down mode.
The RTC module can be powered from the low power mode charge pump for lowest possible power
consumption while in PM8.
4.6.4. Low Power Timer (LPTIMER0)
The Low Power Timer (LPTIMER) module runs from the RTC timer clock (RTC0CLK), allowing the LPTIMER to
operate even if the AHB and APB clocks are disabled. The LPTIMER counter can increment using one of two clock
sources: the clock selected by the RTC0 module, or rising or falling edges of an external signal.
The Low Power Timer includes the following features:
Runs on low-frequency RTC timer clock (RTC0TCLK).
The LPTIMER counter can increment using one of two clock sources: the RTC0TCLK or rising or falling
edges of an external signal.
Overflow and threshold-match detection.
Timer reset on threshold-match allows square-wave generation at a variable output frequency.
Supports PWM with configurable period and duty cycle.
The LPTIMER module can be powered from the low power mode charge pump for lowest possible power
consumption while in PM8.
4.6.5. Watchdog Timer (WDTIMER0)
The WDTIMER module includes a 16-bit timer, a programmable early warning interrupt, and a programmable reset
period. The timer registers are protected from inadvertent access by an independent lock and key interface.
The watchdog timer runs from the low frequency oscillator (LFOSC0).
The Watchdog Timer has the following features:
Programmable timeout interval.
Optional interrupt to warn when the Watchdog Timer is nearing the reset trip value.
Lock-out feature to prevent any modification until a system reset.
SiM3L1xx
Rev 1.0 47
4.6.6. Low Power Mode Advanced Capture Counter (ACCTR0)
The SiM3L1xx devices contain a low-power Advanced Capture Counter module that runs from the RTC0 clock
domain and can be used with digital inputs, switch topology circuits (reed switches), or with LC resonant circuits.
For switch topology circuits, the module charges one or two external lines by pulsing internal pull-up resistors and
detecting whether the reed switch is open or closed. For LC resonant circuits, the inputs are periodically energized
to produce a dampened sine wave and configurable discriminator circuits detect the resulting decay time-constant.
The advanced capture counter has the following general features:
Single or differential inputs supporting single, dual, and quadrature modes of operation.
Variety of interrupt and PM8 wake up sources.
Provides feedback of the direction history, current and previous states, and condition flags.
The advanced capture counter has the following features for switch circuit topologies:
Ultra low power input comparators.
Supports a wide range of pull-up resistor values with a self-calibration engine.
Asymmetrical integrators for low-pass filtering and switch debounce.
Two 24-bit counters and two 24-bit digital threshold comparators.
Supports switch flutter detection.
For LC resonant circuit topologies, the advanced capture counter includes:
Separate minimum and maximum count registers and polarity, pulse, and toggle controls.
Zone-based programmable timing.
Two input comparators with support for a positive side input bias at VIO divided by 2.
Supports a configurable excitation pulse width based on a 40 MHz oscillator and timer or an external digital
stop signal.
Two 8-bit peak counters that saturate at full scale for detecting the number of LC resonant peaks.
Two discriminators with programmable thresholds.
Supports a sample and hold mode for Wheatstone bridges.
All devices in the SiM3L1xx family include the low power mode advanced capture counter (ACCTR0). Table 4.2
lists the supported inputs and outputs for each of the packages.
Table 4.2. SiM3L1xx Supported Advanced Capture Counter Inputs and Outputs
Input/Output SiM3L1x7 SiM3L1x6 SiM3L1x4
ACCTR0_IN0
ACCTR0_IN1
ACCTR0_LCIN0
ACCTR0_LCIN1
ACCTR0_STOP0
ACCTR0_STOP1
ACCTR0_LCPUL0
ACCTR0_LCPUL1
ACCTR0_LCBIAS0
ACCTR0_LCBIAS1
ACCTR0_DBG0
ACCTR0_DBG1
SiM3L1xx
48 Rev 1.0
4.7. Communications Peripherals
4.7.1. USART (USART0)
The USART uses two signals (TX and RX) to communicate serially with an external device. In addition to these
signals, the USART module can optionally use a clock (UCLK) or hardware handshaking (RTS and CTS).
The USART module provides the following features:
Independent transmitter and receiver configurations with separate 16-bit baud rate generators.
Synchronous or asynchronous transmissions and receptions.
Clock master or slave operation with programmable polarity and edge controls.
Up to 5 Mbaud (synchronous or asynchronous, TX or RX, and master or slave) or 1 Mbaud Smartcard (TX
or RX).
Individual enables for generated clocks during start, stop, and idle states.
Internal transmit and receive FIFOs with flush capability and support for byte, half-word, and word reads
and writes.
Data bit lengths from 5 to 9 bits.
Programmable inter-packet transmit delays.
Auto-baud detection with support for the LIN SYNC byte.
Automatic parity generation (with enable).
Automatic start and stop generation (with separate enables).
Transmit and receive hardware flow-control.
Independent inversion correction for TX, RX, RTS, and CTS signals.
IrDA modulation and demodulation with programmable pulse widths.
Smartcard ACK/NACK support.
Parity error, frame error, overrun, and underrun detection.
Multi-master and half-duplex support.
Multiple loop-back modes supported.
Multi-processor communications support.
4.7.2. UART (UART0)
The low-power UART uses two signals (TX and RX) to communicate serially with an external device.
The UART0 module can operate in PM8 mode by taking the clock directly from the RTC0 time clock (RTC0TCLK)
and running from the low power mode charge pump. This will allow the system to conserve power while
transmitting or receiving UART traffic. The UART supports standard baud-rates of 9600, 4800, 2400 and 1200 in
this low power mode.
The UART0 module provides the following features:
Independent transmitter and receiver configurations with separate 16-bit baud rate generators.
Asynchronous transmissions and receptions.
Up to 5 Mbaud (TX or RX).
Internal transmit and receive FIFOs with flush capability and support for byte, half-word, and word reads
and writes.
Data bit lengths from 5 to 9 bits.
Programmable inter-packet transmit delays.
Auto-baud detection with support for the LIN SYNC byte.
Automatic parity generation (with enable).
Automatic start and stop generation (with separate enables).
Independent inversion correction for TX and RX signals.
Parity error, frame error, overrun, and underrun detection.
Half-duplex support.
SiM3L1xx
Rev 1.0 49
Multiple loop-back modes supported.
Multi-processor communications support.
Operates at 9600, 4800, 2400, or 1200 baud in Power Mode 8.
4.7.3. SPI (SPI0, SPI1)
SPI is a 3- or 4-wire communication interface that includes a clock, input data, output data, and an optional select
signal.
The SPI0 and SPI1 modules include the following features:
Supports 3- or 4-wire master or slave modes.
Supports up to 10 MHz clock in master mode and 5 MHz clock in slave mode.
Support for all clock phase and slave select (NSS) polarity modes.
16-bit programmable clock rate.
Programmable MSB-first or LSB-first shifting.
8-byte FIFO buffers for both transmit and receive data paths to support high speed transfers.
Support for multiple masters on the same data lines.
In addition, the SPI modules include several features to support autonomous DMA transfers:
Hardware NSS control.
Programmable FIFO threshold levels.
Configurable FIFO data widths.
Master or slave hardware flow control for the MISO and MOSI signals.
SPI1 is on fixed pins and supports additional flow control options using a fixed input (SPI1CTS). Neither SPI1 nor
the flow control input are on the crossbar.
4.7.4. I2C (I2C0)
The I2C interface is a two-wire, bi-directional serial bus. The clock and data signals operate in open-drain mode
with external pull-ups to support automatic bus arbitration.
Reads and writes to the interface are byte oriented with the I2C interface autonomously controlling the serial
transfer of the data. Data can be transferred at up to 1/8th of the APB clock as a master or slave, which can be
faster than allowed by the I2C specification, depending on the clock source used. A method of extending the clock-
low duration is available to accommodate devices with different speed capabilities on the same bus.
The I2C interface may operate as a master and/or slave, and may function on a bus with multiple masters. The I2C
provides control of SDA (serial data), SCL (serial clock) generation and synchronization, arbitration logic, and start/
stop control and generation.
The I2C0 module includes the following features:
Standard (up to 100 kbps) and Fast (400 kbps) transfer speeds.
Can operate down to APB clock divided by 32768 or up to APB clock divided by 8.
Support for master, slave, and multi-master modes.
Hardware synchronization and arbitration for multi-master mode.
Clock low extending (clock stretching) to interface with faster masters.
Hardware support for 7-bit slave and general call address recognition.
Firmware support for 10-bit slave address decoding.
Ability to disable all slave states.
Programmable clock high and low period.
Programmable data setup/hold times.
Spike suppression up to 2 times the APB period.
SiM3L1xx
50 Rev 1.0
4.8. Analog
4.8.1. 12-Bit Analog-to-Digital Converter (SARADC0)
The SARADC0 module on SiM3L1xx devices implements the Successive Approximation Register (SAR) ADC
architecture. The key features of the module are as follows:
Single-ended 12-bit and 10-bit modes.
Supports an output update rate of 250 k samples per second in 12-bit mode or 1 M samples per second in
10-bit mode.
Operation in low power modes at lower conversion speeds.
Selectable asynchronous hardware conversion trigger with hardware channel select.
DC offset cancellation.
Automatic result notification with multiple programmable thresholds.
Support for Burst Mode, which produces one set of accumulated data per conversion-start trigger with
programmable power-on settling and tracking time.
Non-burst mode operation can also automatically accumulate multiple conversions, but a conversion start
is required for each conversion.
Conversion complete, multiple conversion complete, and FIFO overflow and underflow flags and interrupts
supported.
Flexible output data formatting.
Sequencer allows up to eight sources to be automatically scanned using one of four channel characteristic
profiles without software intervention.
Eight-word conversion data FIFO for DMA operations.
Includes two internal references (1.65 V fast-settling, 1.2/2.4 V precision), support for an external
reference, and support for an external signal ground.
4.8.2. 10-Bit Digital-to-Analog Converter (IDAC0)
The IDAC module takes a digital value as an input and outputs a proportional constant current on a pin. The IDAC
module includes the following features:
10-bit current DAC with support for four timer, up to seven external I/O and on demand output update
triggers.
Ability to update on rising, falling, or both edges for any of the external I/O trigger sources.
Supports an output update rate greater than 600 k samples per second.
Support for three full-scale output modes: 0.5 mA, 1.0 mA and 2.0 mA.
Four-word FIFO to aid with high-speed waveform generation or DMA interactions.
Individual FIFO overrun, underrun, and went-empty interrupt status sources.
Support for multiple data packing formats, including: single 10-bit sample per word, dual 10-bit samples per
word, or four 8-bit samples per word.
Support for left- and right-justified data.
4.8.3. Low Current Comparators (CMP0, CMP1)
The Comparators take two analog input voltages and output the relationship between these voltages (less than or
greater than) as a digital signal. The low power comparator module includes the following features:
Multiple sources for the positive and negative inputs, including VBAT, VREF, and 8 I/O pins.
Two outputs available: a digital synchronous latched output and a digital asynchronous raw output.
Programmable hysteresis and response time.
Falling or rising edge interrupt options on the comparator output.
6-bit programmable reference divider.
SiM3L1xx
Rev 1.0 51
4.9. Reset Sources
Reset circuitry allows the controller to be easily placed in a predefined default condition. On entry to this reset
state, the following occur:
The core halts program execution.
Module registers are initialized to their defined reset values unless the bits reset only with a power-on
reset.
External port pins are forced to a known state.
Interrupts and timers are disabled.
AHB peripheral clocks to flash and RAM are enabled.
Clocks to all APB peripherals other than the Watchdog Timer and DMAXBAR are disabled.
All registers are reset to the predefined values noted in the register descriptions unless the bits only reset with a
power-on reset. The contents of RAM are unaffected during a reset; any previously stored data is preserved as
long as power is not lost.
The Port I/O latches are reset to 1 in open-drain mode. Weak pullups are enabled during and after the reset. For
VBAT Supply Monitor and power-on resets, the RESET pin is driven low until the device exits the reset state.
On exit from the reset state, the program counter (PC) is reset, and the system clock defaults to the internal low-
power oscillator. The Watchdog Timer is enabled with the low frequency oscillator as its clock source. Program
execution begins at location 0x00000000.
All RSTSRC0 registers may be locked against writes by setting the CLKRSTL bit in the LOCK0_PERIPHLOCK0
register to 1.
The reset sources can also optionally reset individual modules, including the low power mode charge pump,
UART0, LCD0, advanced capture counter (ACCTR0), and RTC0.
Figure 4.4. SiM3L1xx Reset Sources Block Diagram
SiM3L1xx
52 Rev 1.0
4.10. Security
The peripherals on the SiM3L1xx devices have a register lock and key mechanism that prevents undesired
accesses of the peripherals from firmware. Each bit in the PERIPHLOCKx registers controls a set of peripherals. A
key sequence must be written to the KEY register to modify bits in PERIPHLOCKx. Any subsequent write to KEY
will then inhibit accesses of PERIPHLOCKx until it is unlocked again through KEY. Reading the KEY register
indicates the current status of the PERIPHLOCKx lock state.
If a peripheral’s registers are locked, all writes will be ignored. The registers can be read, regardless of the
peripheral’s lock state.
Figure 4.5. SiM3L1xx Security Block Diagram
4.11. On-Chip Debugging
The SiM3L1xx devices include JTAG and Serial Wire programming and debugging interfaces and ETM for
instruction trace. The JTAG interface is supported on SiM3L1x7 devices only, and does not include boundary scan
capabilites. The ETM interface is supported on SiM3L1x7, and SiM3L1x6 devices only. The JTAG and ETM
interfaces can be optionally enabled to provide more visibility while debugging at the cost of using several Port I/O
pins. Additionally, if the core is configured for Serial Wire (SW) mode and not JTAG, then the Serial Wire Viewer
(SWV) is available to provide a single pin to send out TPIU messages. Serial Wire Viewer is supported on all
SiM3Lxxx devices.
Most peripherals on SiM3L1xx devices have the option to halt or continue functioning when the core halts in debug
mode.
SiM3L1xx
Rev 1.0 53
5. Ordering Information
Figure 5.1. SiM3L1xx Part Numbering
All devices in the SiM3L1xx family have the following features:
Core: ARM Cortex-M3 with maximum operating frequency of 50 MHz.
PLL.
10-Channel DMA Controller.
128/192/256-bit AES.
16/32-bit CRC.
Encoder/Decoder.
DC-DC Buck Converter.
Timers: 3 x 32-bit (6 x 16-bit).
Real-Time Clock.
Low-Power Timer.
PCA: 1 x 6 channels (Enhanced)
ADC: 12-bit 250 ksps (10-bit 1 Msps) SAR.
DAC: 10-bit IDAC.
Temperature Sensor.
Internal VREF.
Comparator: 2 x low current.
Serial Buses: 2 x USART, 2 x SPI, 1 x I2C
Additionally, all devices in the SiM3L1xx family include the low power mode advanced capture counter (ACCTR0),
though the smaller packages (SiM3L1x4) only support some of the external inputs and outputs.
Table 5.1. Product Selection Guide
Ordering Part Number
Flash Memory (kB)
RAM (kB)
LCD Segments
Digital Port I/Os
Digital Port I/Os on the Crossbar
Number of SARADC0 Channels
Number of Comparator 0/1 Inputs (+/-)
Number of PMU Pin Wake Sources
Number of ACCTR0 Inputs and Outputs
JTAG Debugging Interface
ETM Debugging Interface
Serial Wire Debugging Interface
Lead-free (RoHS Compliant)
Package
SiM3L167-C-GQ 256 32 160 (4x40) 62 38 24 15/15 14 12 TQFP-80
SiM3L167-C-GL 256 32 160 (4x40) 62 38 24 15/15 14 12 TFBGA-80
SiM3L166-C-GM 256 32 128 (4x32) 51 34 23 14/12 11 12 QFN-64
SiM3L166-C-GQ 256 32 128 (4x32) 51 34 23 14/12 11 12 TQFP-64
SiM3L164-C-GM 256 32 28 26 20 9/10 11 5 QFN-40
SiM3L157-C-GQ 128 32 160 (4x40) 62 38 24 15/15 14 12 TQFP-80
SiM3L157-C-GL 128 32 160 (4x40) 62 38 24 15/15 14 12 TFBGA-80
SiM3L156-C-GM 128 32 128 (4x32) 51 34 23 14/12 11 12 QFN-64
SiM3L156-C-GQ 128 32 128 (4x32) 51 34 23 14/12 11 12 TQFP-64
SiM3L154-C-GM 128 32 28 26 20 9/10 11 5 QFN-40
SiM3L146-C-GM 64 16 128 (4x32) 51 34 23 14/12 11 12 QFN-64
SiM3L146-C-GQ 64 16 128 (4x32) 51 34 23 14/12 11 12 TQFP-64
SiM3L144-C-GM 64 16 28 26 20 9/10 11 5 QFN-40
SiM3L136-C-GM 32 8 128 (4x32) 51 34 23 14/12 11 12 QFN-64
SiM3L136-C-GQ 32 8 128 (4x32) 51 34 23 14/12 11 12 TQFP-64
SiM3L134-C-GM 32 8 28 26 20 9/10 11 5 QFN-40
SiM3L1xx
54 Rev 1.0
SiM3L1xx
Rev 1.0 55
6. Pin Definitions
6.1. SiM3L1x7 Pin Definitions
Figure 6.1. SiM3L1x7-GQ Pinout
SiM3L1xx
56 Rev 1.0
Figure 6.2. SiM3L1x7-GL Pinout
SiM3L1xx
Rev 1.0 57
Table 6.1. Pin Definitions and Alternate Functions for SiM3L1x7
Pin Name Type
Pin Numbers (TQFP-80)
Pin Numbers (TFBGA-80)
I/O Voltage Domain
Crossbar Capability
Port Match
LCD Interface
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
VSS Ground 12
31
52
71
C7
E3
G3
H5
VSSDC Ground (DC-
DC)
12 G3
VIO Power (I/O) 7
30
68
D3
D8
H7
VIORF Power (RF I/O) 8 C1
VBAT/
VBATDC
10 E1
VDRV 9 D1
VDC 13 G1
VLCD Power (LCD
Charge Pump)
67 A6
IND DC-DC Inductor 11 F1
RESET Active-low
Reset
72 C4
TCK/
SWCLK
JTAG / Serial
Wire
6 E2
TMS/
SWDIO
JTAG / Serial
Wire
5 F2
RTC1 RTC Oscillator
Input
70 C5
RTC2 RTC Oscillator
Output
69 C6
SiM3L1xx
58 Rev 1.0
PB0.0 Standard I/O 4 D2 VIO INT0.0
WAKE.0
ADC0.20
VREF
CMP0P.0
PB0.1 Standard I/O 3 C2 VIO INT0.1
WAKE.1
ADC0.21
VREFGND
CMP0N.0
PB0.2 Standard I/O 2 B1 VIO INT0.2
WAKE.2
ADC0.22
CMP1P.0
XTAL2
PB0.3 Standard I/O 1 A1 VIO INT0.3
WAKE.3
ADC0.23
CMP1N.0
XTAL1
PB0.4 Standard I/O 80 B2 VIO INT0.4
WAKE.4
ADC0.0
CMP0P.1
IDAC0
PB0.5 Standard I/O 79 A2 VIO INT0.5
WAKE.5
ACCTR0_STOP0
ACCTR0_IN0
PB0.6 Standard I/O 78 B3 VIO INT0.6
WAKE.6
ACCTR0_STOP1
ACCTR0_IN1
PB0.7 Standard I/O 77 A3 VIO INT0.7
WAKE.7
ACCTR0_LCIN0
PB0.8 Standard I/O 76 B4 VIO LPT0T0
LPT0OUT0
INT0.8
WAKE.8
ACCTR0_LCIN1
Table 6.1. Pin Definitions and Alternate Functions for SiM3L1x7 (Continued)
Pin Name Type
Pin Numbers (TQFP-80)
Pin Numbers (TFBGA-80)
I/O Voltage Domain
Crossbar Capability
Port Match
LCD Interface
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
SiM3L1xx
Rev 1.0 59
PB0.9 Standard I/O 75 A4 VIO LPT0T1
INT0.9
WAKE.9
ACCTR0_LCPUL0
ADC0.1
CMP0N.1
PB0.10 Standard I/O 74 B5 VIO LPT0T2
INT0.10
WAKE.10
ACCTR0_LCPUL1
ADC0.2
CMP1P.1
PB0.11/
TDO/SWV
Standard I/O /
JTAG / Serial
Wire Viewer
73 A5 VIO LPT0T3
LPT0OUT1
INT0.11
WAKE.11
ADC0.3
CMP1N.1
PB1.0 Standard I/O 66 B6 VIO LCD0.39 LPT0T4
INT0.12
ACCTR0_LCBIAS0
CMP0P.2
PB1.1 Standard I/O 65 A7 VIO LCD0.38 LPT0T5
INT0.13
ACCTR0_LCBIAS1
CMP0N.2
PB1.2 Standard I/O 64 B7 VIO LCD0.37 LPT0T6
INT0.14
UART0_TX
CMP1P.2
PB1.3 Standard I/O 63 A8 VIO LCD0.36 LPT0T7
INT0.15
UART0_RX
CMP1N.2
PB1.4 Standard I/O 62 B8 VIO LCD0.35 ACCTR0_DBG0 ADC0.4
PB1.5 Standard I/O 61 A9 VIO LCD0.34 ACCTR0_DBG1 ADC0.5
PB1.6/TDI Standard I/O /
JTAG
60 A10 VIO LCD0.33 ADC0.6
PB1.7 Standard I/O 59 B9 VIO LCD0.32 RTC0TCLK_OUT ADC0.7
Table 6.1. Pin Definitions and Alternate Functions for SiM3L1x7 (Continued)
Pin Name Type
Pin Numbers (TQFP-80)
Pin Numbers (TFBGA-80)
I/O Voltage Domain
Crossbar Capability
Port Match
LCD Interface
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
SiM3L1xx
60 Rev 1.0
PB1.8 Standard I/O 58 B10 VIO LCD0.31 CMP0P.3
PB1.9 Standard I/O 57 C9 VIO LCD0.30 CMP0N.3
PB1.10 Standard I/O 56 C10 VIO LCD0.29 CMP1P.3
PB1.11 Standard I/O 55 D9 VIO LCD0.28 CMP1N.3
PB2.0 Standard I/O 54 D10 VIORF LPT0T8
INT1.0
WAKE.12
SPI1_CTS
ADC0.8
CMP0P.4
PB2.1 Standard I/O 53 E9 VIORF LPT0T9
INT1.1
WAKE.13
VIORFCLK
ADC0.9
CMP0N.4
PB2.4 Standard I/O 51 E10 VIORF LPT0T12
INT1.4
SPI1_SCLK
ADC0.10
CMP0P.5
PB2.5 Standard I/O 50 E8 VIORF LPT0T13
INT1.5
SPI1_MISO
ADC0.11
CMP0N.5
PB2.6 Standard I/O 49 F8 VIORF LPT0T14
INT1.6
SPI1_MOSI
ADC0.12
CMP1P.5
PB2.7 Standard I/O 48 F10 VIORF INT1.7
SPI1_NSS
ADC0.13
CMP1N.5
PB3.0 Standard I/O 47 G8 VIO LCD0.27 INT1.8 ADC0.14
PB3.1 Standard I/O 46 F9 VIO LCD0.26 INT1.9 ADC0.15
PB3.2 Standard I/O 45 G10 VIO LCD0.25 INT1.10 ADC0.16
PB3.3 Standard I/O 44 G9 VIO LCD0.24 INT1.11 ADC0.17
Table 6.1. Pin Definitions and Alternate Functions for SiM3L1x7 (Continued)
Pin Name Type
Pin Numbers (TQFP-80)
Pin Numbers (TFBGA-80)
I/O Voltage Domain
Crossbar Capability
Port Match
LCD Interface
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
SiM3L1xx
Rev 1.0 61
PB3.4 Standard I/O 43 H10 VIO LCD0.23 INT1.12 CMP0P.6
PB3.5 Standard I/O 42 H9 VIO LCD0.22 INT1.13 CMP0N.6
PB3.6 Standard I/O 41 J10 VIO LCD0.21 INT1.14 CMP1P.6
PB3.7 Standard I/O 40 J9 VIO LCD0.20 INT1.15 CMP1N.6
PB3.8 Standard I/O 39 K10 VIO LCD0.19 CMP0P.7
PB3.9 Standard I/O 38 K9 VIO LCD0.18 CMP0N.7
PB3.10 Standard I/O 37 J8 VIO LCD0.17 CMP1P.7
PB3.11 Standard I/O 36 K8 VIO LCD0.16 CMP1N.7
PB3.12 Standard I/O 35 J7 VIO LCD0.15 ADC0.18
PB3.13 Standard I/O 34 K7 VIO LCD0.14 ADC0.19
PB3.14 Standard I/O 33 J6 VIO COM0.3
PB3.15 Standard I/O 32 K6 VIO COM0.2
PB4.0 Standard I/O 29 H6 VIO COM0.1
PB4.1 Standard I/O 28 K5 VIO COM0.0
PB4.2 Standard I/O 27 J5 VIO LCD0.13
PB4.3 Standard I/O 26 K4 VIO LCD0.12
PB4.4 Standard I/O 25 J4 VIO LCD0.11
PB4.5 Standard I/O 24 H4 VIO LCD0.10
PB4.6 Standard I/O 23 K3 VIO LCD0.9 PMU_Asleep
PB4.7 Standard I/O 22 J3 VIO LCD0.8
PB4.8 Standard I/O 21 K2 VIO LCD0.7
Table 6.1. Pin Definitions and Alternate Functions for SiM3L1x7 (Continued)
Pin Name Type
Pin Numbers (TQFP-80)
Pin Numbers (TFBGA-80)
I/O Voltage Domain
Crossbar Capability
Port Match
LCD Interface
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
SiM3L1xx
62 Rev 1.0
PB4.9 Standard I/O 20 J2 VIO LCD0.6
PB4.10 Standard I/O 19 K1 VIO LCD0.5
PB4.11/
ETM3
Standard I/O /
ETM
18 H2 VIO LCD0.4
PB4.12/
ETM2
Standard I/O /
ETM
17 J1 VIO LCD0.3
PB4.13/
ETM1
Standard I/O /
ETM
16 H1 VIO LCD0.2
PB4.14/
ETM0
Standard I/O /
ETM
15 G2 VIO LCD0.1
PB4.15/
TRACE-
CLK
Standard I/O /
ETM
14 F3 VIO LCD0.0
Table 6.1. Pin Definitions and Alternate Functions for SiM3L1x7 (Continued)
Pin Name Type
Pin Numbers (TQFP-80)
Pin Numbers (TFBGA-80)
I/O Voltage Domain
Crossbar Capability
Port Match
LCD Interface
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
SiM3L1xx
Rev 1.0 63
6.2. SiM3L1x6 Pin Definitions
Figure 6.3. SiM3L1x6-GQ Pinout
SiM3L1xx
64 Rev 1.0
Figure 6.4. SiM3L1x6-GM Pinout
SiM3L1xx
Rev 1.0 65
Table 6.2. Pin Definitions and Alternate Functions for SiM3L1x6
Pin Name Type
Pin Numbers
I/O Voltage Domain
Crossbar Capability
Port Match
LCD Interface
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
VSS Ground 10
41
VSSDC Ground (DC-DC) 10
VIO Power (I/O) 6
VIORF /
VDRV
Power (RF I/O) 7
VBAT /
VBATDC
8
VDC 11
VLCD Power (LCD
Charge Pump)
54
IND DC-DC Inductor 9
RESET Active-low Reset 57
SWCLK Serial Wire 5
SWDIO Serial Wire 4
RTC1 RTC Oscillator
Input
56
RTC2 RTC Oscillator
Output
55
PB0.0 Standard I/O 3 VIO XBR
0
INT0.0
WAKE.0
ADC0.20
VREF
CMP0P.0
PB0.1 Standard I/O 2 VIO XBR
0
INT0.1
WAKE.2
ADC0.22
CMP0N.0
CMP1P.0
XTAL2
SiM3L1xx
66 Rev 1.0
PB0.2 Standard I/O 1 VIO XBR
0
INT0.2
WAKE.3
ADC0.23
CMP1N.0
XTAL1
PB0.3 Standard I/O 64 VIO XBR
0
INT0.3
WAKE.4
ADC0.0
CMP0P.1
IDAC0
PB0.4 Standard I/O 63 VIO XBR
0
INT0.4
WAKE.5
ACCTR0_STOP0
ACCTR0_IN0
PB0.5 Standard I/O 62 VIO XBR
0
INT0.5
WAKE.6
ACCTR0_STOP1
ACCTR0_IN1
PB0.6 Standard I/O 61 VIO XBR
0
INT0.6
WAKE.7
ACCTR0_LCIN0
PB0.7 Standard I/O 60 VIO XBR
0
LPT0T0
LPT0OUT0
INT0.7
WAKE.8
ACCTR0_LCIN1
PB0.8 Standard I/O 59 VIO XBR
0
LPT0T1
INT0.8
WAKE.9
ACCTR0_LCPUL0
ADC0.1
CMP0N.1
PB0.9/SWV Standard I/O
/Serial Wire
Viewer
58 VIO XBR
0
LPT0T2
INT0.9
WAKE.10
LPT0OUT1
ACCTR0_LCPUL1
ADC0.2
CMP1P.1
PB1.0 Standard I/O 53 VIO XBR
0
LCD0.31 LPT0T4
INT0.12
ACCTR0_LCBIAS0
CMP0P.2
Table 6.2. Pin Definitions and Alternate Functions for SiM3L1x6 (Continued)
Pin Name Type
Pin Numbers
I/O Voltage Domain
Crossbar Capability
Port Match
LCD Interface
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
SiM3L1xx
Rev 1.0 67
PB1.1 Standard I/O 52 VIO XBR
0
LCD0.30 LPT0T5
INT0.13
ACCTR0_LCBIAS1
CMP0N.2
PB1.2 Standard I/O 51 VIO XBR
0
LCD0.29 LPT0T6
INT0.14
UART0_TX
CMP1P.2
PB1.3 Standard I/O 50 VIO XBR
0
LCD0.28 LPT0T7
INT0.15
UART0_RX
CMP1N.2
PB1.4 Standard I/O 49 VIO XBR
0
LCD0.27 ACCTR0_DBG0 ADC0.3
PB1.5 Standard I/O 48 VIO XBR
0
LCD0.26 ACCTR0_DBG1 ADC0.4
PB1.6 Standard I/O 47 VIO XBR
0
LCD0.25 RTC0TCLK_OUT ADC0.5
PB1.7 Standard I/O 46 VIO XBR
0
LCD0.24 CMP0P.3
PB1.8 Standard I/O 45 VIO XBR
0
LCD0.23 CMP0N.3
PB1.9 Standard I/O 44 VIO XBR
0
LCD0.22 CMP1P.3
PB1.10 Standard I/O 43 VIO XBR
0
LCD0.21 CMP1N.3
PB2.0 Standard I/O 42 VIOR
F
XBR
0
LPT0T8
INT1.0
WAKE.12
SPI1_CTS
ADC0.6
CMP0P.4
PB2.4 Standard I/O 40 VIOR
F
XBR
0
LPT0T12
INT1.4
SPI1_SCLK
ADC0.7
CMP0P.5
Table 6.2. Pin Definitions and Alternate Functions for SiM3L1x6 (Continued)
Pin Name Type
Pin Numbers
I/O Voltage Domain
Crossbar Capability
Port Match
LCD Interface
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
SiM3L1xx
68 Rev 1.0
PB2.5 Standard I/O 39 VIOR
F
XBR
0
LPT0T13
INT1.5
SPI1_MISO
ADC0.8
CMP0N.5
PB2.6 Standard I/O 38 VIOR
F
XBR
0
LPT0T14
INT1.6
SPI1_MOSI
ADC0.9
CMP1P.5
PB2.7 Standard I/O 37 VIOR
F
XBR
0
INT1.7
SPI1_NSS
ADC0.10
CMP1N.5
PB3.0 Standard I/O 36 VIO XBR
0
LCD0.20 INT1.8 ADC0.11
PB3.1 Standard I/O 35 VIO XBR
0
LCD0.19 INT1.9 ADC0.12
PB3.2 Standard I/O 34 VIO XBR
0
LCD0.18 INT1.10 CMP0P.6
PB3.3 Standard I/O 33 VIO XBR
0
LCD0.17 INT1.11 CMP0N.6
PB3.4 Standard I/O 32 VIO XBR
0
LCD0.16 INT1.12 CMP0P.7
PB3.5 Standard I/O 31 VIO XBR
0
LCD0.15 INT1.13 CMP0N.7
PB3.6 Standard I/O 30 VIO XBR
0
LCD0.14 INT1.14 CMP1P.7
PB3.7 Standard I/O 29 VIO XBR
0
LCD0.13 INT1.15 CMP1N.7
PB3.8 Standard I/O 28 VIO LCD0.12 ADC0.13
PB3.9 Standard I/O 27 VIO LCD0.11 ADC0.14
PB3.10 Standard I/O 26 VIO COM0.3
PB3.11 Standard I/O 25 VIO COM0.2
Table 6.2. Pin Definitions and Alternate Functions for SiM3L1x6 (Continued)
Pin Name Type
Pin Numbers
I/O Voltage Domain
Crossbar Capability
Port Match
LCD Interface
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
SiM3L1xx
Rev 1.0 69
PB4.0 Standard I/O 24 VIO COM0.1
PB4.1 Standard I/O 23 VIO COM0.0
PB4.2 Standard I/O 22 VIO LCD0.10 ADC0.19
PB4.3 Standard I/O 21 VIO LCD0.9
PB4.4 Standard I/O 20 VIO LCD0.8
PB4.5 Standard I/O 19 VIO LCD0.7
PB4.6 Standard I/O 18 VIO LCD0.6 PMU_Asleep
PB4.7 Standard I/O 17 VIO LCD0.5
PB4.8/ETM3 Standard I/O /
ETM
16 VIO LCD0.4
PB4.9/ETM2 Standard I/O /
ETM
15 VIO LCD0.3
PB4.10/
ETM1
Standard I/O /
ETM
14 VIO LCD0.2
PB4.11/
ETM0
Standard I/O /
ETM
13 VIO LCD0.1
PB4.12/
TRACECLK
Standard I/O /
ETM
12 VIO LCD0.0
Table 6.2. Pin Definitions and Alternate Functions for SiM3L1x6 (Continued)
Pin Name Type
Pin Numbers
I/O Voltage Domain
Crossbar Capability
Port Match
LCD Interface
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
SiM3L1xx
70 Rev 1.0
6.3. SiM3L1x4 Pin Definitions
Figure 6.5. SiM3L1x4-GM Pinout
SiM3L1xx
Rev 1.0 71
Table 6.3. Pin Definitions and Alternate Functions for SiM3L1x4
Pin Name Type
Pin Numbers
I/O Voltage Domain
Crossbar Capability
Port Match
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
VSS Ground 9
25
VSSDC Ground (DC-DC) 9
VIO Power (I/O) 5
VIORF /
VDRV
Power (RF I/O) 6
VBAT /
VBATDC
7
VDC 10
IND DC-DC Inductor 8
RESET Active-low Reset 35
SWCLK Serial Wire 4
SWDIO Serial Wire 3
RTC1 RTC Oscillator Input 34
RTC2 RTC Oscillator
Output
33
PB0.0 Standard I/O 2 VIO XBR0 INT0.0
WAKE.0
ADC0.20
VREF
CMP0P.0
PB0.1 Standard I/O 1 VIO XBR0 INT0.1
WAKE.2
ADC0.22
CMP0N.0
CMP1P.0
XTAL2
SiM3L1xx
72 Rev 1.0
PB0.2 Standard I/O 40 VIO XBR0 INT0.2
WAKE.3
ADC0.23
CMP0N.1
CMP1N.0
XTAL1
PB0.3 Standard I/O 39 VIO XBR0 INT0.3
WAKE.4
ADC0.0
CMP0P.1
IDAC0
PB0.4 Standard I/O 38 VIO XBR0 INT0.4
WAKE.5
ACCTR0_IN0
PB0.5 Standard I/O 37 VIO XBR0 INT0.5
WAKE.6
ACCTR0_IN1
PB0.6/SWV Standard I/O
/Serial Wire Viewer
36 VIO XBR0 LPT0T0
LPT0OUT0
INT0.6
WAKE.8
PB0.7 Standard I/O 32 VIO XBR0 LPT0T6
INT0.7
UART0_TX
CMP1P.2
PB0.8 Standard I/O 31 VIO XBR0 LPT0T7
INT0.8
UART0_RX
CMP1N.2
PB0.9 Standard I/O 30 VIO XBR0 LPT0T1
INT0.9
RTC0TCLK_OUT
ADC0.1
PB2.0 Standard I/O 29 VIORF XBR0 LPT0T8
INT1.0
WAKE.12
SPI1_CTS
ADC0.2
CMP0P.4
Table 6.3. Pin Definitions and Alternate Functions for SiM3L1x4 (Continued)
Pin Name Type
Pin Numbers
I/O Voltage Domain
Crossbar Capability
Port Match
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
SiM3L1xx
Rev 1.0 73
PB2.1 Standard I/O 28 VIORF XBR0 LPT0T9
INT1.1
WAKE.13
VIORFCLK
ADC0.3
CMP0N.4
PB2.2 Standard I/O 27 VIORF XBR0 LPT0T10
INT1.2
WAKE.14
ADC0.4
CMP1P.4
PB2.3 Standard I/O 26 VIORF XBR0 LPT0T11
INT1.3
WAKE.15
ADC0.5
CMP1N.4
PB2.4 Standard I/O 24 VIORF XBR0 LPT0T12
INT1.4
SPI1_SCLK
ADC0.6
CMP0P.5
PB2.5 Standard I/O 23 VIORF XBR0 LPT0T13
INT1.5
SPI1_MISO
ADC0.7
CMP0N.5
PB2.6 Standard I/O 22 VIORF XBR0 LPT0T14
INT1.6
SPI1_MOSI
ADC0.8
CMP1P.5
PB2.7 Standard I/O 21 VIORF XBR0 INT1.7
SPI1_NSS
ADC0.9
CMP1N.5
PB3.0 Standard I/O 20 VIO XBR0 INT1.8 CMP0N.7
PB3.1 Standard I/O 19 VIO XBR0 INT1.9 CMP1P.7
PB3.2 Standard I/O 18 VIO XBR0 INT1.10 CMP1N.7
PB3.3 Standard I/O 17 VIO XBR0 INT1.11 ADC0.10
PB3.4 Standard I/O 16 VIO XBR0 INT1.12 ADC0.11
PB3.5 Standard I/O 15 VIO XBR0 INT1.13 ADC0.12
Table 6.3. Pin Definitions and Alternate Functions for SiM3L1x4 (Continued)
Pin Name Type
Pin Numbers
I/O Voltage Domain
Crossbar Capability
Port Match
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
SiM3L1xx
74 Rev 1.0
PB3.6 Standard I/O 14 VIO XBR0 INT1.14 ADC0.13
PB3.7 Standard I/O 13 VIO XBR0 INT1.15 ADC0.14
PB3.8 Standard I/O 12 VIO ADC0.15
PB3.9 Standard I/O 11 VIO ADC0.16
Table 6.3. Pin Definitions and Alternate Functions for SiM3L1x4 (Continued)
Pin Name Type
Pin Numbers
I/O Voltage Domain
Crossbar Capability
Port Match
Output Toggle Logic
External Trigger Inputs /
Digital Functions
Analog Functions
SiM3L1xx
Rev 1.0 75
6.4. TQFP-80 Package Specifications
Figure 6.6. TQFP-80 Package Drawing
Table 6.4. TQFP-80 Package Dimensions
Dimension Min Nominal Max
A — — 1.20
A1 0.05 — 0.15
A2 0.95 1.00 1.05
b 0.17 0.20 0.27
c 0.09 — 0.20
D 14.00 BSC
D1 12.00 BSC
e 0.50 BSC
E 14.00 BSC
E1 12.00 BSC
L 0.45 0.60 0.75
L1 1.00 Ref
0° 3.5° 7°
aaa 0.20
bbb 0.20
ccc 0.08
ddd 0.08
eee 0.05
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This package outline conforms to JEDEC MS-026, variant ADD.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
SiM3L1xx
76 Rev 1.0
SiM3L1xx
Rev 1.0 77
Figure 6.7. TQFP-80 Landing Diagram
Table 6.5. TQFP-80 Landing Diagram Dimensions
Dimension Min Max
C1 13.30 13.40
C2 13.30 13.40
E 0.50 BSC
X 0.20 0.30
Y 1.40 1.50
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise
noted.
2. This land pattern design is based on the IPC-7351 guidelines.
SiM3L1xx
78 Rev 1.0
6.4.1. TQFP-80 Solder Mask Design
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad
is to be 60 μm minimum, all the way around the pad.
6.4.2. TQFP-80 Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
6.4.3. TQFP-80 Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
SiM3L1xx
Rev 1.0 79
6.5. TFBGA-80 Package Specifications
Figure 6.8. TFBGA-80 Package Drawing
Table 6.6. TFBGA-80 Package Dimensions
Dimension Min Nominal Max
A— — 1.20
A1 0.16 0.21 0.26
A2 0.84 0.89 0.94
b0.25 0.30 0.35
c0.32 0.36 0.40
D5.40 5.50 5.60
E5.40 5.50 5.60
E1 — 4.50 —
D1 — 4.50 —
e— 0.50 —
aaa 0.15
bbb 0.10
ddd 0.08
eee 0.15
fff 0.05
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. Recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
SiM3L1xx
80 Rev 1.0
SiM3L1xx
Rev 1.0 81
Figure 6.9. TFBGA-80 Landing Diagram
Table 6.7. TFBGA-80 Landing Diagram Dimensions
Dimension Min Nom Max
X0.25 0.30 0.35
C1 4.50
C2 4.50
E1 0.50
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This land pattern design is based on the IPC-7351 guidelines.
SiM3L1xx
82 Rev 1.0
6.5.1. TFBGA-80 Solder Mask Design
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad
is to be 60 μm minimum, all the way around the pad.
6.5.2. TFBGA-80 Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
6.5.3. TFBGA-80 Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
SiM3L1xx
Rev 1.0 83
6.6. QFN-64 Package Specifications
Figure 6.10. QFN-64 Package Drawing
Table 6.8. QFN-64 Package Dimensions
Dimension Min Nominal Max
A 0.80 0.85 0.90
A1 0.00 0.02 0.05
b 0.18 0.25 0.30
D 9.00 BSC
D2 3.95 4.10 4.25
e 0.50 BSC
E 9.00 BSC
E2 3.95 4.10 4.25
L 0.30 0.40 0.50
aaa 0.10
bbb 0.10
ccc 0.08
ddd 0.10
eee 0.05
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This package outline conforms to JEDEC MO-220.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
SiM3L1xx
84 Rev 1.0
Figure 6.11. QFN-64 Landing Diagram
Table 6.9. QFN-64 Landing Diagram Dimensions
Dimension mm
C1 8.90
C2 8.90
E 0.50
X1 0.30
Y1 0.85
X2 4.25
Y2 4.25
Notes:
1. All dimensions shown are in millimeters (mm).
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC).
Least Material Condition (LMC) is calculated based on a
Fabrication Allowance of 0.05 mm.
SiM3L1xx
Rev 1.0 85
6.6.1. QFN-64 Solder Mask Design
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad
is to be 60 μm minimum, all the way around the pad.
6.6.2. QFN-64 Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
4. A 3x3 array of 1.0 mm square openings on a 1.5 mm pitch should be used for the center ground pad.
6.6.3. QFN-64 Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
SiM3L1xx
86 Rev 1.0
6.7. TQFP-64 Package Specifications
Figure 6.12. TQFP-64 Package Drawing
Table 6.10. TQFP-64 Package Dimensions
Dimension Min Nominal Max
A — — 1.20
A1 0.05 — 0.15
A2 0.95 1.00 1.05
b 0.17 0.22 0.27
c 0.09 — 0.20
D 12.00 BSC
D1 10.00 BSC
e 0.50 BSC
E 12.00 BSC
E1 10.00 BSC
L 0.45 0.60 0.75
0° 3.5° 7°
aaa — — 0.20
bbb — — 0.20
ccc — — 0.08
ddd — — 0.08
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This package outline conforms to JEDEC MS-026, variant ACD.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
SiM3L1xx
Rev 1.0 87
SiM3L1xx
88 Rev 1.0
Figure 6.13. TQFP-64 Landing Diagram
Table 6.11. TQFP-64 Landing Diagram Dimensions
Dimension Min Max
C1 11.30 11.40
C2 11.30 11.40
E 0.50 BSC
X 0.20 0.30
Y 1.40 1.50
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise
noted.
2. This land pattern design is based on the IPC-7351 guidelines.
SiM3L1xx
Rev 1.0 89
6.7.1. TQFP-64 Solder Mask Design
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad
is to be 60 μm minimum, all the way around the pad.
6.7.2. TQFP-64 Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
6.7.3. TQFP-64 Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
SiM3L1xx
90 Rev 1.0
6.8. QFN-40 Package Specifications
Figure 6.14. QFN-40 Package Drawing
Table 6.12. QFN-40 Package Dimensions
Dimension Min Nominal Max
A 0.80 0.85 0.90
A1 0.00 0.02 0.05
b 0.18 0.25 0.30
D 6.00 BSC
D2 4.35 4.50 4.65
e 0.50 BSC
E 6.00 BSC
E2 4.35 4.5 4.65
L 0.30 0.40 0.50
aaa 0.10
bbb 0.10
ccc 0.08
ddd 0.10
eee 0.05
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This package outline conforms to JEDEC MO-220.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
SiM3L1xx
Rev 1.0 91
Figure 6.15. QFN-40 Landing Diagram
Table 6.13. QFN-40 Landing Diagram Dimensions
Dimension mm
C1 5.90
C2 5.90
E 0.50
X1 0.30
Y1 0.85
X2 4.65
Y2 4.65
Notes:
1. All dimensions shown are in millimeters (mm).
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC).
Least Material Condition (LMC) is calculated based on a
Fabrication Allowance of 0.05 mm.
SiM3L1xx
92 Rev 1.0
6.8.1. QFN-40 Solder Mask Design
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad
is to be 60 μm minimum, all the way around the pad.
6.8.2. QFN-40 Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
4. A 3x3 array of 1.1 mm square openings on a 1.6 mm pitch should be used for the center ground pad.
6.8.3. QFN-40 Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
SiM3L1xx
Rev 1.0 93
7. Revision Specific Behavior
This chapter describes any differences between released revisions of the device.
7.1. Revision Identification
The Lot ID Code on the top side of the device package can be used for decoding device revision information.
Figures 7.1, 7.2, and 7.3 show how to find the Lot ID Code on the top side of the device package.
In addition, firmware can determine the revision of the device by checking the DEVICEID registers.
Figure 7.1. SiM3L1x7-GQ Revision Information
Figure 7.2. SiM3L1x6-GM and SiM3L1x6-GQ Revision Information
SiM3L1xx
94 Rev 1.0
Figure 7.3. SiM3L1x7-GL and SiM3L1x4-GM Revision Information
SiM3L1xx
Rev 1.0 95
DOCUMENT CHANGE LIST
Revision 0.5 to Revision 1.0
Updated Electrical Specifications Tables with latest characterization data and production test limits.
Added missing signal ACCTR0_LCPUL1 to Table 6.2, “Pin Definitions and Alternate Functions for SiM3L1x6,”
on page 65.
Removed ACCTR0_LCIN1 and ACCTR0_STOP0/1 signals from Table 6.3, “Pin Definitions and Alternate
Functions for SiM3L1x4,” on page 71.
Updated Figure 6.8, “TFBGA-80 Package Drawing,” on page 79.
SiM3L1xx
96 Rev 1.0
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