PCF8576DT/S400/2 - NXP Semiconductors

1. General description

The PCF8576D is a peripheral device which interfaces to almost any Liquid Crystal

Display (LCD)1 with low multiplex rates. It generates the drive signals for any static or

multiplexed LCD cont aining up to four backplan es and up to 40 segments . It can be easily

cascaded for larger LCD applications. The PCF8576D is compatible with most

microcontrollers and communica tes via the two-li ne bidirectio nal I2C-bus. Communication

overheads are minimized by a display RAM with auto-incremented addressing, by

hardware subaddressing and by display memory switching (static and du p lex dr ive

modes).

•PCF8576DT/2 sh ou ld not be use d fo r new design-ins. Replacement part is

PCF85176T/1 for industrial applications

•PCF8576DT/S400/2 should not be used for new design-ins. Replacement part is

PCA85176T/Q900/1 for automotive applications

2. Features and benefits

AEC-Q100 compliant (PCF8576DT/S400/2) for automotive applications

Single chip LCD controller and driver

Selectable backplane drive configuration: static or 2, 3, 4 backplane multiplexing

Selectable display bias configuration: static, 1⁄2, or 1⁄3

Internal LCD bias generation with voltage-follower buffers

40 s eg m en t dr ive s:

Up to 20 7-segment numeric characters

Up to 10 14-segment alphanumeric characters

Any graphics of up to 160 elements

40 × 4-bit RAM for display data storage

Auto-incremented display data loading across device subaddress boundaries

Display memory bank switching in static and duplex drive modes

Versatile blinking modes

Independent supplies possible for LCD and logic voltages

Wide power supply range: from 1.8 V to 5.5 V

Wide logic LCD supply range:

From 2.5 V for low-threshold LCDs

Up to 6.5 V for high-threshold twisted nematic LCDs

Low power consum ption

400 kHz I2C-bu s in te r fac e

PCF8576D

Universal LCD driver for low multiplex rates

Rev. 13 — 10 May 2012 Product data sheet

1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 20.

Product data sheet Rev. 13 — 10 May 2012 2 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

May be cascaded for large LCD applications (up to 2560 elements possible)

No external components required

Compatible with chip-on-glass and chip-on-board technology

Manufactured in silicon gate CMOS process

3. Ordering information

[1] Not to be used for new designs. Replacement part is PCF85176T/1 for industrial applications.

[2] Not to be used for new designs. Replacement part is PCA85176T/Q900/1 for automotive applications.

[3] Chips in tray.

[4] Chips with bumps in tray.

4. Marking

Table 1. Ordering information

Type number Package

Name Description Version

PCF8576DT/2[1] TSSOP56 plastic thin shrink small outline package, 56 leads;

body width 6.1 mm SOT364-1

PCF8576DT/S400/2[2] TSSOP56 plastic thin shrink small outline package, 56 leads;

body width 6.1 mm SOT364-1

PCF8576DU/DA/2 wire bond die 59 bonding pads[3] PCF8576DU/DA

PCF8576DU/2DA/2 bare die 59 bumps[4] PCF8576DU/2DA

Table 2. Marking codes

Type number Marking code

PCF8576DT/2 PCF8576DT

PCF8576DT/S400/2 PCF8576DT/S400

PCF8576DU/DA/2 PC8576D-2

PCF8576DU/2DA/2 PC8576D-2

Product data sheet Rev. 13 — 10 May 2012 3 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

5. Block diagram

Fig 1. Block diagram of PCF8576D

001aai900

LCD BIAS

GENERATOR

LCD

VOLTAGE

SELECTOR

PCF8576D

BACKPLANE

OUTPUTS

DISPLAY

CONTROLLER

COMMAND

DECODER WRITE DATA

CONTROL

DISPLAY RAM

40 × 4-BIT

OUTPUT BANK SELECT

AND BLINK CONTROL

DISPLAY

DISPLAY SEGMENT

OUTPUTS

DATA POINTER AND

AUTO INCREMENT

SUBADDRESS

COUNTER

CLOCK SELECT

AND TIMING

OSCILLATOR

INPUT

FILTERS

BLINKER

TIMEBASE

POWER-ON

RESET

I2C-BUS

CONTROLLER

BP0 BP2 BP1 BP3

A2A1A0SA0

SDA

SCL

VDD

OSC

SYNC

CLK

VSS

VLCD

S0 to S39

Product data sheet Rev. 13 — 10 May 2012 4 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

6. Pinning information

6.1 Pinning

Top view. For mechanical details, see Figure 25.

Fig 2. Pinning diagram for PCF8576DT (T SSOP56)

PCF8576DT

BP2 BP0

BP1 VLCD

BP3 VSS

S0 SA0

S1 A2

S2 A1

S3 A0

S4 OSC

S5 VDD

S6 CLK

S7 SYNC

S8 SCL

S9 SDA

S10 S39

S11 S38

S12 S37

S13 S36

S14 S35

S15 S34

S16 S33

S17 S32

S18 S31

S19 S30

S20 S29

S21 S28

S22 S27

S23 S26

S24 S25

001aaf646

Product data sheet Rev. 13 — 10 May 2012 5 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

Viewed from active side. C1 and C2 are alignment marks. For mechanical details, see Figure 26

and Figure 27.

Fig 3. Pinning diagram for PCF8576DU (bare die)

S25

S26

S27

S28

S29

S30

S31

S32

S33

S10

S11

S12

S13

S15

S14

S16

S17

OSC

SYNC

SCL

CLK

SDA

SCL

S39

S38

S36

S37

S35

S34

SA0

VSS

BP2

BP0

VLCD

BP1

BP3

PCF8576DU

VDD

001aag424

S18

S19

S20

S21

S22

S23

S24

Product data sheet Rev. 13 — 10 May 2012 6 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

6.2 Pin description

[1] The substrate (rear side of the die) is connected to VSS and should be electrically isolated.

Tabl e 3. Pin description

Symbol Pin Description

PCF8576DT PCF8576DU

SDA 44 1, 58, 59 I2C-bus serial data input and output

SCL 45 2, 3 I2C-bus serial clock input

CLK 47 5 external clock input or output

VDD 48 6 supply voltage

SYNC 46 4 cascade synchronization input or output

OSC 49 7 internal oscillator enable input

A0 to A2 50 to 52 8 to 10 subaddress inputs

SA0 53 11 I2C-bus address input; bit 0

VSS 54 12[1] ground supply voltage

VLCD 55 13 LCD supply voltage

BP0, BP2,

BP1, BP3 56, 1, 2, 3 14 to 17 LCD backplane outputs

S0 to S39 4 to 43 18 to 57 LCD segment outputs

n.c. - - not connected

Product data sheet Rev. 13 — 10 May 2012 7 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

7. Functional description

The PCF8576D is a versatile peripheral device designed to interface between any

microcontroller to a wide variety of LCD segment or dot matrix displays (see Figure 4). It

can directly drive any static or multiplexed LCD containing up to four backplanes and up to

40 segments.

The possible display configurations of the PCF8576D depend on the number of active

backplane outputs required. A selection of display configurations is shown in Table 4. All

of these configurations can be implemented in the typical system shown in Figure 5.

[1] 7 segment display has 8 elements including the decimal point.

[2] 14 segment display has 16 elements including decimal point and accent dot.

Fig 4. Example of displays suitable for PCF8576D

Table 4. Selection of possi ble display configurations

Number of

Backplanes Icons Digits/Characters Dot matrix/

Elements

7-segment[1] 14-segment[2]

4 160 20 10 160 (4 × 40)

3 120 15 7 120 (3 × 40)

2 80105 80 (2 × 40)

1405240 (1 × 40)

7-segment with dot 14-segment with dot and accent

013aaa312

dot matrix

Product data sheet Rev. 13 — 10 May 2012 8 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

The host microcontroller maintains the 2-line I2C-bus communication channel with the

PCF8576D. The internal oscillator is enabled by connecting pin OSC to pin VSS. The

appropriate biasing voltages for the multiplexed LCD waveforms are generated inte rn ally.

The only other connections required to complete the system are to the po we r su pp lies

(VDD, VSS, and VLCD) and the LCD panel chosen for the application.

7.1 Power-On Reset (POR)

At power-on the PCF8576D resets to the following starting conditions:

•All backplane and segment outputs are set to VLCD

•The selected drive mode is: 1:4 multiplex with 1⁄3 bias

•Blinking is switched off

•Input and output bank selectors are reset

•The I2C-bus interface is initialized

•The data pointer and the subaddress counter are cleared (set to logic 0)

•The display is disabled (bit E = 0, see Table 11)

Remark: Do not transfer data on the I2C-bus for at least 1 ms after a powe r-on to allow

the reset action to complete.

7.2 LCD bias generator

Fractional LCD biasing voltages are obtained from an internal voltage divider of three

impedances connected between pins VLCD and VSS. The center impedance is bypassed

by switch if the 1⁄2bias voltage level for the 1:2 multiplex drive mode configuration is

selected. The LCD voltage can be temperature compensated externally using the supp ly

to pin VLCD.

The resistance of the power lines must be kept to a minimum.

For chip-on-glass applications, due to the Indium Tin Oxide (ITO ) track resistance, each supply line

must be routed separately between the chip and the connector.

Fig 5. Typical system configuration

HOST

MICRO-

PROCESSOR/

MICRO-

CONTROLLER

2CB

SDA

SCL

OSC

40 segment drives

4 backplanes

LCD PANEL

(up to 160

elements)

PCF8576D

A0 A1 A2 SA0

VDD

VSS

VDD VLCD

mdb079

R ≤

Product data sheet Rev. 13 — 10 May 2012 9 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

7.3 LCD voltage selector

The LCD voltage selector coord ina te s th e mu ltiplexing of the LCD in accordance with the

selected LCD drive configuration. The operation of the voltage selector is controlled by the

mode-set command from the command decoder. The biasing configurations that apply to

the preferred modes of o per ation, to gether with the biasing cha racteri stics as functions o f

VLCD and the resulting discrimination ratios (D) are given in Table 5.

Discrimination is a term which is defined as the ratio of the on a nd off RMS volt age across

a segment. It can be thought of as a measurement of contrast.

A practical value for VLCD is determined by equating Voff(RMS) with a defined LCD

threshold volt age (Vth(off)) , typically when the LCD exhibits appr oximately 10 % contrast. In

the static drive mode a suitable choice is VLCD >3V

th(off).

Multiplex drive modes of 1:3 and 1:4 with 1⁄2 bias are possible but the discrimination and

hence the contrast ratios are smaller.

Bias is calculated by , where the values for a are

a = 1 for 1⁄2 bias

a = 2 for 1⁄3 bias

The RMS on-state voltage (Von(RMS)) for the LCD is calculated with Equation 1:

(1)

where the values for n are

n = 1 for static drive mode

n = 2 for 1:2 multiplex drive mode

n = 3 for 1:3 multiplex drive mode

n = 4 for 1:4 multiplex drive mode

The RMS off-state voltage (Voff(RMS)) for the LCD is calculated with Equation 2:

(2)

Discrimination is the ratio of Von(RMS) to Voff(RMS) and is determined from Equation 3:

Table 5. Biasing characteristics

LCD drive

mode Number of: LCD bias

configuration

Backplanes Levels

static 1 2 static 0 1 ∞

1:2 multiplex 2 3 1⁄20.354 0.791 2.236

1:2 multiplex 2 4 1⁄30.333 0.745 2.236

1:3 multiplex 3 4 1⁄30.333 0.638 1.915

1:4 multiplex 4 4 1⁄30.333 0.577 1.732

Voff RMS()

VLCD

-------------------------

Von RMS()

VLCD

------------------------

DVon RMS()

Voff RMS()

-------------------------=

1a+

-------------

Von RMS() a22a n++

n1a+()

------------------------------

VLCD

Voff RMS() a22a–n+

n1a+()

------------------------------

VLCD

Product data sheet Rev. 13 — 10 May 2012 10 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

(3)

Using Equation 3, the discrimination for an LCD drive mode of 1:3 multiplex with

1⁄2bias is and the discrimination for an L CD drive mode of 1:4 multiple x with

1⁄2bias is .

The advanta ge of these LCD drive modes is a reduction of the LCD full scale volta ge VLCD

as follows:

•1:3 multiplex (1⁄2 bias):

•1:4 multiplex (1⁄2 bias):

These compare with when 1⁄3 bias is used.

It should be noted that VLCD is sometimes referred as the LCD operating voltage.

7.3.1 Electro-optical performance

Suitable values for Von(RMS) and Voff(RMS) are dependent on the LCD liquid used. The

RMS voltage, at which a pixel will be switched on or off, determine the transmissibility of

the pixel.

For any given liquid, there are two threshold values defined. One point is at 10 % relative

transmission (at Vth(off)) and the other at 90 % relat ive tran sm iss i on (at V th(on)), see

Figure 6. For a good contrast performance, the following rules should be followed:

(4)

(5)

Von(RMS) and Voff(RMS) are properties of the display driver and are af fected by the selection

of a, n (see Equation 1 to Equation 3) and the VLCD voltage.

Vth(off) and Vth(on) are properties of the LCD liquid and can be provided by the module

manufacturer. Vth(off) is sometimes just named Vth. Vth(on) is sometimes named saturation

voltage Vsat.

It is important to match the module properties to those of the driver in order to achieve

optimum performance.

DVon RMS()

Voff RMS()

-----------------------a22a n++

a22a–n+

---------------------------==

3 1.732=

---------- 1.528=

VLCD 6V

off RMS()

×2.449Voff RMS()

VLCD 43×()

----------------------2.309Voff RMS()

VLCD 3Voff RMS()

Von RMS()

Vth on()

≥

Voff RMS()

Vth off()

≤

Product data sheet Rev. 13 — 10 May 2012 11 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

Fig 6. Electro-optical characteristic: relative transmission curve of the liquid

VRMS [V]

100 %

90 %

10 %

OFF

SEGMENT GREY

SEGMENT ON

SEGMENT

Vth(off) Vth(on)

Relative T ransmission

013aaa494

Product data sheet Rev. 13 — 10 May 2012 12 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

7.4 LCD drive mode waveforms

7.4.1 Static drive mode

The static LCD drive mode is used when a single backplane is provided in the LCD. The

backplane (BPn) and segment drive (Sn) waveforms for this mode are shown in Figure 7.

(1) Vstate1(t) = VSn(t) − VBP0(t).

(2) Von(RMS) = VLCD.

(3) Vstate2(t) = VSn+1(t) − VBP0(t).

(4) Voff(RMS) = 0 V.

Fig 7. Static drive mode wavefo rms

mgl745

VSS

VLCD

VSS

VLCD

VSS

VLCD

−VLCD

VLCD

state 1 0 V

BP0

Sn+1

state 2 0 V

(a) Waveforms at driver.

(b) Resultant waveforms

at LCD segment.

LCD segments

state 1

(on) state 2

(off)

Tfr

Product data sheet Rev. 13 — 10 May 2012 13 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

7.4.2 1:2 Multiplex drive mode

The 1:2 multiplex drive mo de is used when two b ackplanes are pr ovided in the LCD. This

mode allows fractional LCD bias voltages of 1⁄2 bias or 1⁄3 bias as shown in Figure 8 and

Figure 9.

(1) Vstate1(t) = VSn(t) − VBP0(t).

(2) Von(RMS) = 0.791VLCD.

(3) Vstate2(t) = VSn+1(t) − VBP1(t).

(4) Voff(RMS) = 0.354VLCD.

Fig 8. W aveforms for the 1:2 multiplex drive mode with 1⁄2 bias

mgl746

state 1

BP0

(a) Waveforms at driver.

(b) Resultant waveforms

at LCD segment.

LCD segments

state 2

BP1

state 2

state 1

VSS

VLCD

VLCD / 2

VSS

VLCD

VSS

VLCD

0 V

VLCD / 2

−VLCD

−VLCD / 2

Sn+1

Tfr

Product data sheet Rev. 13 — 10 May 2012 14 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

(1) Vstate1(t) = VSn(t) − VBP0(t).

(2) Von(RMS) = 0.745VLCD.

(3) Vstate2(t) = VSn+1(t) − VBP1(t).

(4) Voff(RMS) = 0.333VLCD.

Fig 9. W aveforms for the 1:2 multiplex drive mode with 1⁄3 bias

mgl747

state 1

BP0

(a) Waveforms at driver.

(b) Resultant waveforms

at LCD segment.

LCD segments

state 2

BP1

state 1

state 2

VSS

VLCD

2VLCD / 3

VLCD / 3

VSS

VLCD

2VLCD / 3

VLCD / 3

VSS

VLCD

2VLCD / 3

VLCD / 3

0 V

VLCD

2VLCD / 3

−2VLCD / 3

VLCD / 3

−VLCD / 3

−VLCD

0 V

VLCD

2VLCD / 3

−2VLCD / 3

VLCD / 3

−VLCD / 3

Sn+1

Tfr

VSS

VLCD

2VLCD / 3

VLCD / 3

Product data sheet Rev. 13 — 10 May 2012 15 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

7.4.3 1:3 Multiplex drive mode

When three backplanes are provided in the LCD, the 1:3 multiplex drive mode applies

(see Figure 10).

(1) Vstate1(t) = VSn(t) − VBP0(t).

(2) Von(RMS) = 0.638VLCD.

(3) Vstate2(t) = VSn+1(t) − VBP1(t).

(4) Voff(RMS) = 0.333VLCD.

Fig 10. Waveforms for the 1:3 multiplex drive mode with 1⁄3 bias

mgl748

state 1

BP0

(b) Resultant waveforms

at LCD segment.

LCD segments

state 2

BP1

state 1

state 2

(a) Waveforms at driver.

BP2

Sn+1

Sn+2

Tfr

VSS

VLCD

2VLCD / 3

VLCD / 3

VSS

VLCD

2VLCD / 3

VLCD / 3

VSS

VLCD

2VLCD / 3

VLCD / 3

VSS

VLCD

2VLCD / 3

VLCD / 3

VSS

VLCD

2VLCD / 3

VLCD / 3

0 V

VLCD

2VLCD / 3

−2VLCD / 3

VLCD / 3

−VLCD / 3

−VLCD

0 V

VLCD

2VLCD / 3

−2VLCD / 3

VLCD / 3

−VLCD / 3

−VLCD

VSS

VLCD

2VLCD / 3

VLCD / 3

Product data sheet Rev. 13 — 10 May 2012 16 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

7.4.4 1:4 Multiplex drive mode

When four backplanes are pr ovided in the LCD, the 1:4 multiple x drive mode applies (see

Figure 11).

(1) Vstate1(t) = VSn(t) − VBP0(t).

(2) Von(RMS) = 0.577VLCD.

(3) Vstate2(t) = VSn+1(t) − VBP1(t).

(4) Voff(RMS) = 0.333VLCD.

Fig 11. Waveforms for the 1:4 multiplex drive mode with 1⁄3 bias

mgl749

state 1

BP0

(b) Resultant waveforms

at LCD segment.

LCD segments

state 2

BP1

state 1

state 2

BP2

(a) Waveforms at driver.

BP3

Sn+1

Sn+2

Sn+3

LCD

/ 3

LCD

/ 3

LCD

/ 3

LCD

/ 3

LCD

/ 3

LCD

/ 3

LCD

/ 3

LCD

/ 3

LCD

/ 3

LCD

/ 3

LCD

/ 3

LCD

/ 3

LCD

/ 3

LCD

/ 3

0 V

LCD

/ 3

−2V

LCD

/ 3

LCD

/ 3

−V

LCD

/ 3

−V

LCD

0 V

LCD

/ 3

−2V

LCD

/ 3

LCD

/ 3

−V

LCD

/ 3

−V

LCD

/ 3

LCD

/ 3

Product data sheet Rev. 13 — 10 May 2012 17 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

7.5 Oscillator

7.5.1 Internal clock

The internal logic of the PCF8576D and its LCD drive signals are timed either by its

internal oscillator or by an external clock. The internal oscillator is enabled by connecting

pin OSC to pin VSS. If the internal oscillator is used, the output from pin CLK can be used

as the clock signal for several PCF8576Ds in the system that are connected in cascade.

7.5.2 External clock

Pin CL K is ena ble d as an ext er nal cloc k inpu t by conn e ctin g pin OSC to VDD. The LCD

frame signal frequency is determined by the clock frequency (fclk).

Remark: A clock signal must always be supplied to the device; removing the clock may

freeze the LCD in a DC state, which is not suitable for the liquid crystal.

7.6 Timing

The PCF8576D timing controls the internal data flow of the device. This includ es the

transfer of display dat a from the display RAM to the display seg ment outputs. In cascaded

applications, the correct timing relationship betwe en each PCF8576D in the system is

mainta ined by the synchronization signal at pin SYNC. The timing also genera tes the LCD

frame signal whose frequency is derived from the clock frequency. The frame signal

frequency is a fixed division of the clock frequency from either the internal or an external

clock: .

7.7 Display register

The display latch holds the display data while the corresponding multiplex signals are

generated.

7.8 Segment outputs

The LCD drive section includes 40 segment output s S0 to S39 which should be

connected dir ec tly to the LC D. Th e segm e nt output signals are generated in accordance

with the multiplexed backplane signals and with data residing in the display latch. When

less than 40 segment output s are required, the unused segment output s should be left

open-circuit.

ffr fclk

-------

Product data sheet Rev. 13 — 10 May 2012 18 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

7.9 Backplane outputs

The LCD drive section includes four backplane outputs BP0 to BP3 which must be

connected directly to the LCD. The backplane output signals are generated in accordance

with the selected LCD drive mode. If less than four backplane outputs are required, the

unused outputs can be left open-c ircu it.

•In 1:3 multiplex drive mode, BP3 carries the same signal as BP1, there fore these two

adjacent outputs can be tied together to give enhanced drive capabilities.

•In 1:2 multiplex drive mode, BP0 and BP2, respectively, BP1 and BP3 all carry the

same signals and may also be paired to increase the drive capabilities.

•In static drive mode the same signal is carried by all four backplane outputs and they

can be connected in parallel for very high drive requirements.

7.10 Display RAM

The display RAM is a static 40 × 4-bit RAM which stores LCD data.

There is a one-to-one correspondence between

•the bits in the RAM bitmap and the LCD elements

•the RAM columns and the se gm e nt outp u ts

•the RAM rows and the backplane outputs.

A logic 1 in the RAM bitmap indicates the on-state of the corresponding LCD element;

similarly, a log ic 0 indicat es th e off-state.

The display RAM bit map, Figure 12, shows the rows 0 to 3 which correspond with the

backplane outputs BP0 to BP3, and the columns 0 to 39 which correspond with the

segment outputs S0 to S39. In multiplexed LCD applications the segment data of the first,

second, third and fourth row of the display RAM are time-multiplexed with BP0, BP1, BP2,

and BP3 respectively.

When display data is transmitted to the PCF8576D, the receive d display bytes are stored

in the display RAM in accordance with the selected LCD drive mode. The data is stored as

it arrives and depending o n the current multip lex drive mode the bits are stored singular ly,

The display RAM bitmap shows the direct relationship between the display RAM column and the

segment outputs; and between the bits in a RAM row and the backplane outputs.

Fig 12. Display RAM bit map

1 2 3 4 35 36 37 38 39

display RAM addresses (columns)/segment outputs (S)

display RAM bits

(rows)/

backplane outputs

(BP)

mbe525

Product data sheet Rev. 13 — 10 May 2012 19 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

in pairs, triples, or quadruples. To illustrate the filling order, an example of a 7-segment

display showing all drive modes is given in Figure 13; the RAM filling organization

depicted applies equally to other LCD types.

The following applies to Figure 13:

•In static drive mode the eight transmitted data bits are placed into row 0 as one byte.

•In 1:2 multiplex drive mode the eight transmitted data bits are placed in pairs into

row 0 and 1 as two successive 4-bit RAM words.

•In 1:3 multiplex drive mode the eight bits are pla ce d in triples into row 0, 1, and 2 as

three successive 3-bit RAM words, with bit 3 of the third address left unchanged. It is

not recommended to use this bit in a display because of the difficult addressing. This

last bit may, if necessary, be controlled by an additional transfer to this address, but

care should be t aken to avoid overwriting adjace nt data because al ways full bytes are

transmitted (see Section 7.10.3).

•In 1:4 multiplex drive mode, the eight transmitted data bits are placed in quadruples

into row 0, 1, 2, and 3 as two successive 4-bit RAM words.

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx

xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx

xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx

Product data sheet Rev. 13 — 10 May 2012 20 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

x = data bit unchanged.

Fig 13. Relationship betwee n LCD layout, drive mode, display RAM filling order and display data transmit ted over the I2C-bus

001aaj646

acbDPfegd

MSB LSB

bDPcadgfe

MSB LSB

abfgecdDP

MSB LSB

cbafgedDP

MSB LSB

drive mode

static

1:2

multiplex

1:3

multiplex

1:4

multiplex

LCD segments LCD backplanes display RAM filling order transmitted display byte

BP0

BP1

BP0

BP1 BP2

BP1

BP2

BP3

BP0

n + 1 n + 2 n + 3 n + 4 n + 5 n + 6 n + 7

rows

display RAM

rows/backplane

outputs (BP)

byte1

columns

display RAM address/segment outputs (s)

n + 1 n + 2 n + 3

byte1 byte2

rows

display RAM

rows/backplane

outputs (BP)

columns

display RAM address/segment outputs (s)

n + 1 n + 2

byte1 byte2 byte3

rows

display RAM

rows/backplane

outputs (BP)

columns

display RAM address/segment outputs (s)

n + 1

byte1 byte2 byte3 byte4 byte5

rows

display RAM

rows/backplane

outputs (BP)

columns

display RAM address/segment outputs (s)

Sn+2

Sn+3

Sn+1

Sn+2

Sn+1

Sn+7

Sn+3

Sn+5

Sn+6

Sn+4

Sn+1

Sn+2

Sn+1

Product data sheet Rev. 13 — 10 May 2012 21 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

7.10.1 Dat a pointer

The addressing mechanism for the display RAM is realized using the data pointer. This

allows the loading of an individual display da t a byte, or a series of display dat a bytes, into

any location of the display RAM. The sequence commences with the initialization of the

data pointer by the load-data-pointer command (see Table 12). Following this command,

an arriving data byte is stored at the display RAM address indicated by the data pointer.

The filling order is shown in Figure 13. After each byte is stored, the content of the data

pointer is automatically incremented by a value dependent on the selected LCD drive

mode:

•In static drive mode by eight.

•In 1:2 multiplex drive mode by four.

•In 1:3 multiplex drive mode by three.

•In 1:4 multiplex drive mode by two.

If an I2C-bus data access terminates early then the state of the data pointer is unknown.

Consequently, the data pointer must be rewritten prior to further RAM accesses.

7.10.2 Subaddress counter

The storage of display data is determined by the contents of the subaddress counter.

Storage is allowed only when the content of the subaddress counter match with the

hardware subaddr ess applied to A0, A1, and A2. The subaddress co unter value is defined

by the device-select command (see Table 13). If the content of the subaddress counter

and the hardware subaddress do not match then data storage is inhibited but the data

pointer is incremented a s if data stor age had t ake n place. The su baddress co unter is also

incremented when the data pointer overflows.

The storage arrange men ts described lead to extremely ef ficien t data loading in cascaded

applications. When a series of display bytes are sent to the display RAM, automatic

wrap-over to the ne xt PCF8 576D occurs when the last RAM address is exceeded.

Subaddressing across device boundaries is successful even if the change to the next

device in the cascade occurs within a transmitted character.

The hardware subadd ress must not be changed while the device is b eing accessed on the

I2C-bus interface.

7.10.3 RAM writing in 1:3 multiplex drive mode

In 1:3 multiplex drive mode, the RAM is written as shown in Table 6 (see Figure 13 as

well).

Table 6. Standard RAM filling in 1:3 multiplex drive mode

Assumption: BP2/S2, BP2/S5, BP2/S8 etc. are not connected to any elemen ts on the display.

Display RAM

bits (rows)/

backplane

outputs (BPn)

Display RAM address es (columns)/segment outpu ts (Sn)

0123456789:

0a7 a4 a1 b7 b4 b1 c7 c4 c1 d7 :

1a6 a3 a0 b6 b3 b0 c6 c3 c0 d6 :

2a5 a2 - b5 b2 - c5 c2 - d5 :

3----------:

Product data sheet Rev. 13 — 10 May 2012 22 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

If the bit at position BP2/S2 would be written by a second byte transmitted, then the

mapping of the segment bits would change as illustrated in Table 7.

In the case described in Table 7 the RAM has to be written entirely and BP2/S2, BP2/S5,

BP2/S8 etc. have to be connected to elements on the display. This can be achieved by a

combination of writing and rewriting the RAM like follows:

•In the first write to the RAM, bits a7 to a0 are written.

•In the second write, bits b7 to b0 are written, overwriting bits a1 and a0 with bits b7

and b6.

•In the third write, bits c7 to c0 are written, overwriting bits b1 and b0 with bits c7 and

c6.

Depending on the method of writing to the RAM (standard or entire filling by rewriting),

some elements remain unused or can be used, but it has to be considered in the module

layout process as well as in the driver software design.

7.10.4 Writing over the RAM address boundary

In all multiplex drive modes, depending on the setting of the data pointer, it is possible to

fill the RAM over the RAM address boundary. If the PCF8576D is part of a cascade the

additional bits fall into the next device that also generates the acknowledge signal. If the

PCF8576D is a single device or the last device in a cascade the additional bits will be

discarded and no acknowledge signal will be generated.

7.10.5 Output bank selector

The output bank selector (see Table 14) selects one of the four rows per display RAM

address for transfer to the display register. The actual row selected depends on the

selected LCD drive mode in operation and on the instant in the multiplex sequence.

•In 1:4 multiplex mode, all RAM addresses of row 0 are selected, thes e are followed by

the contents of row 1, 2, and then 3

•In 1:3 multiplex mode, rows 0, 1, and 2 are selected sequentially

•In 1:2 multiplex mode, rows 0 and 1 are selected

•In static mode, row 0 is selected

The PCF8576D includes a RAM bank switching feature in the static and 1:2 multiplex

drive modes. In the static drive mode, the bank-select command may request the contents

of row 2 to be selected for display instead of the contents of row 0. In the 1:2 multiplex

Table 7. Entire RAM filling by rewriting in 1:3 multiplex drive mode

Assumption: BP2/S2, BP2/S5, BP2/S8 etc. are connected to elements on the display.

Display RAM

bits (rows)/

backplane

outputs (BPn)

Display RAM address es (columns)/segment outpu ts (Sn)

0123456789:

0a7 a4 a1/b7 b4 b1/c7 c4 c1/d7 d4 d1/e7 e4 :

1a6 a3 a0/b6 b3 b0/c6 c3 c0/d6 d3 d0/e6 e3 :

2a5 a2 b5 b2 c5 c2 d5 d2 e5 e2 :

3----------:

Product data sheet Rev. 13 — 10 May 2012 23 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

mode, the contents of rows 2 and 3 may be selected instead of rows 0 and 1. This gives

the provision for preparing display information in an alternative bank and to be able to

switch to it once it is assembled.

7.10.6 Input bank selector

The input bank sele cto r loa ds disp lay da ta into the dis play RAM in accordance with the

selected LCD drive configuration. Display dat a can be loaded in row 2 in static drive mode

or in rows 2 and 3 in 1:2 multiplex drive mode by using th e bank-select command (see

Table 14). The input bank selector functions independently to the output bank selector.

7.11 Blinking

The display blinking capabilities of the PCF8576D are very versatile. The whole display

can blink at frequen cie s selected by the blink-select command (see Table 15). The blink

frequencies are derived from the clock frequency. The ratio between the clock and blink

frequencies depends on the blink mode selected (see Table 15).

An additional feature is for an arbitrary select ion of LCD eleme nts to blink. This applies to

the static and 1:2 multiplex drive mo de s and ca n be imple m en te d witho ut any

communication overheads. By means of the output bank selector, the displayed RAM

banks are exchanged with alternate RAM banks at the blink frequency. This mode can

also be specified by the blink-select command.

In the 1:3 and 1:4 multiplex modes, where no alternative RAM bank is available, groups of

LCD elements can blink by selectively changing the display RAM data at fixed time

intervals.

The entire display can blink at a frequency other than the nominal blink frequency. This

can be effectively performed by resetting and setting the display enable bit E at the

required rate using the mode-set command (see Table 11).

[1] Blink modes 1, 2 and 3 and the nominal blink frequencies 0.5 Hz, 1 Hz and 2 Hz correspond to an oscillator

frequency (fclk) of 1536 Hz (see Section 12).

Table 8. Blinking frequ en cies[1]

Blink mode Normal operating mode ra tio Nominal blink frequency

off - blinking off

12 Hz

21 Hz

3 0.5 Hz

fclk

768

----------

fclk

1536

-------------

fclk

3072

-------------

Product data sheet Rev. 13 — 10 May 2012 24 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

7.12 Command decoder

The command decoder identifies command bytes that arrive on the I2C-bus. The

commands availa ble to th e PCF8576D are de fin ed in Table 9.

[1] Not used.

All available commands carry a continuation bit C in their most significant bit position as

shown in Figure 19. When this bit is set logic 1, it indicates that the next byte of the

transfer to arrive will also represent a command. If this bit is set logic 0, it indicates that

the command byte is the last in the transfer . Further bytes will be regarded as display data

(see Table 10).

Table 9. Definition of PCF8576D commands

Command Operation code Reference

Bit 76543210

mode-set C 1 0 -[1] E B M[1:0] Table 11

load-data-pointer C 0 P[5:0] Table 12

device-select C1100A[2:0] Table 13

bank-select C11110I OTable 14

blink-select C1110ABBF[1:0] Table 15

Table 10. C bit description

Bit Symbol Value Description

7C continue bit

0 last control byte in the transfer; next byte will be regarded

as display data

1 control bytes continue; next byte will be a command too

Product data sheet Rev. 13 — 10 May 2012 25 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

[1] The possibility to disable the display allows implementation of blinking under external control.

[2] Default value.

[3] The display is disabled by setting all backplane and segment outputs to VLCD.

[4] Not applicable for static drive mode.

[1] Default value.

Table 11. Mode-set command bit description

Bit Symbol Value Description

7C0, 1see Table 10

6, 5 - 10 fixed value

4 - - unused

3E display status[1]

0[2] disabled (blank)[3]

1 enabled

2B LCD bias configuration[4]

0[2] 1⁄3 bias

11⁄2 bias

1 to 0 M[1:0] LCD drive mode selection

01 static; BP0

10 1:2 multiplex; BP0, BP1

11 1:3 multiplex; BP0, BP1, BP2

00[2] 1:4 multiplex; BP0, BP1, BP2, BP3

Table 12. Load-data-pointer command bit description

See Section 7.10.1.

Bit Symbol Value Description

7C0, 1see Table 10

6 - 0 fixed value

5 to 0 P[5:0] 000000[1] to

100111 6 bit binary value, 0 to 39; transferred to the data pointer to

define one of forty display RAM addresses

Table 13. Device-select comman d bit description

See Section 7.10.2.

Bit Symbol Value Description

7C0, 1see Table 10

6 to 3 - 1100 fixed value

2 to 0 A[2:0] 000[1] to 111 3 bit binary value, 0 to 7; transferred to the subaddress

counter to define one of eight hardware subaddresses

Product data sheet Rev. 13 — 10 May 2012 26 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

[1] The bank-select command has no effect in 1:3 and 1:4 multiplex drive modes.

[2] Default value.

[1] Normal blinking is assumed when the LCD multiplex drive modes 1:3 or 1:4 are selected.

[2] Default value.

[3] Alternate RAM bank blinking does not apply in 1:3 and 1:4 multiplex drive modes.

7.13 Display controller

The display controller executes the commands identified by the command decoder. It

contains the device’s status registers and coordinates their effects. The display controller

is also responsible for loading display dat a into the display RAM in the correct filling order.

Table 14. Bank-select command bit description

See Section 7.10.5 and Section 7.10.6.

Bit Symbol Value Description

Static 1:2 multiplex[1]

7 C 0, 1 see Table 10

6 to 2 - 11110 fixed value

1I input bank selection; storage of arriving display data

0[2] RAM row 0 RAM rows 0 and 1

1 RAM row 2 RAM rows 2 and 3

0O output bank sele c tion ; retrieval of LCD display data

0[2] RAM row 0 RAM rows 0 and 1

1 RAM row 2 RAM rows 2 and 3

Table 15. Blink-select command bit description

See Section 7.11.

Bit Symbol Value Description

7C0, 1see Table 10

6 to 3 - 1110 fixed value

2AB blink mode selection

0[2] normal blinking[1]

1 alternate RAM bank blinking[3]

1 to 0 BF[1:0] blink frequency selection

00[2] off

01 1

10 2

11 3

Product data sheet Rev. 13 — 10 May 2012 27 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

8. Characteristics of the I2C-bus

The I2C-bus is for bidirection al, two-line communication between diff erent ICs or modules.

The two lines are a Serial DAt a line (SDA) and a Serial CLock line (SCL). Both lines must

be connected to a positive supply via a pull-up resistor when connected to the output

stages of a device. Data transfer may be initiated only when the bus is not busy.

8.1 Bit transfer

One data bi t is transferred durin g each clock pulse . The data o n the SDA line must remain

stable during the HIGH period of the clock pulse as changes in the data line at this time

will be interpreted as a control signal (see Figure 14).

8.1.1 START and STOP conditions

Both data and clock lines remain HIGH when the bus is not busy.

A HIGH-to-LOW transition of the dat a line while the clock is HIGH is defined as the START

condition - S.

A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP

condition - P.

The START and STOP conditions are illustrated in Figure 15.

8.2 System configuration

A device generating a message is a transmitter, a device receiving a message is the

receiver. The device that controls the message is the master and the devices which are

controlled by the master are the slaves. The system configuration is shown in Figure 16.

Fig 14. Bit transfer

mba607

data line

stable;

data valid

change

of data

allowed

SDA

SCL

Fig 15. Definition of START and STOP conditions

mbc622

SDA

SCL P

STOP condition

SDA

SCL

START condition

Product data sheet Rev. 13 — 10 May 2012 28 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

8.3 Acknowledge

The number of data bytes tran sf er re d be tween the START and STOP conditions from

transmitter to receiver is unlimited. Each byte of eight bits is followed by an acknowledge

cycle.

•A slave receiver, which is addressed, must generate an acknowledge after the

reception of each byte.

•A master receiver must generate an acknowledge af ter the reception of e ach byte that

has been clocke d ou t of th e sl av e tra n sm i tte r.

•The device that acknowledges must pull-down the SDA line during the acknowledge

clock pulse, so that the SDA line is stable LOW during the HIGH period of the

acknowledge related clock pulse (set-up and hold times must be taken into

consideration).

•A master receiver must signal an end of data to the transmitter by not generating an

acknowledge on the last byte that has been clocked out of the slave. In this event, the

transmitter mus t leave the data line HIGH to enable the master to generate a STOP

condition.

Acknowledgement on the I2C-bus is illustrated in Figure 17.

Fig 16. System configuration

mga807

SDA

SCL

MASTER

TRANSMITTER/

RECEIVER

MASTER

TRANSMITTER

SLAVE

TRANSMITTER/

RECEIVER

SLAVE

RECEIVER

MASTER

TRANSMITTER/

RECEIVER

Fig 17. Acknowledgement of the I2C-bus

mbc602

START

condition

9821

clock pulse for

acknowledgement

not acknowledge

acknowledge

data output

by transmitter

data output

by receiver

SCL from

master

Product data sheet Rev. 13 — 10 May 2012 29 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

8.4 I2C-bus controller

The PCF8576D acts as an I2C-bus slave receiver. It does not initiate I2C-bus transfers or

transmit data to an I2C-bus master receiver. The only dat a output from the PCF8576D are

the acknowledge signals of the selected devices. Device selection depends on the

I2C-bus slave address, on the transferred command data and on the hardware

subaddress.

In single device applications, the hardware subaddress inputs A0, A1, and A2 are

normally tied to VSS which defines the hardware subaddress 0. In multiple device

applications A0, A1, and A2 are tied to VSS or VDD using a binary coding scheme, so that

no two devices with a common I2C-bus slave address have the same hardware

subaddress.

8.5 Input filters

To enhance noise immunity in electrically adverse environments, RC low-pass filters are

provided on the SDA and SCL lines.

8.6 I2C-bus protocol

Two I2C-bus slave addresses (0111 000 and 0111 001) are used to address the

PCF8576D. Th e en tir e I2C-bus slave address byte is shown in Table 16.

The PCF8576D is a write-only device and will not respond to a read access, therefore bit

0 should always be logic 0. Bit 1 of the slave address byte that a PCF8576D will respond

to, is defined by the level tied to its SA0 input (VSS for logic 0 and VDD for logic 1).

Having two reserved slave addresses allows the following on the same I2C-bus:

•Up to 16 PCF8576D for very large LCD applications

•The use of two types of LCD multiplex drive

The I2C-bus protocol is shown in Figure 18. The sequence is initiated with a START

condition (S) from the I2C-bus master which is followed by one of two possib le PCF8576D

slave addresses available. All PCF8576Ds whose SA0 inputs correspond to bit 0 of the

slave address respond by asserting an acknowledge in parallel. This I2C-bus transfer is

ignored by all PCF8576Ds whose SA0 inputs are set to the alternative level.

Table 16. I2C slave address byte

Slave address

Bit 7 6 5 4 3 2 1 0

MSB LSB

011100SA0R/W

Product data sheet Rev. 13 — 10 May 2012 30 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

After an acknowledgement, one or more command bytes follow, that define the status of

each addressed PCF8576D.

The last command byte sent is identified by resetting its most significant bit, continuation

bit C, (see Figure 19). The command bytes are also acknowledged by all add ressed

PCF8576D on the bus.

After the last command byte, one or more display data bytes may follow. Display data

bytes are stored in the display RAM at the address specified by the data pointer and the

subaddress counter. Both data p ointer and subadd ress counter are auto matically updated

and the data directed to the intended PCF8576D device.

An acknowledgement after each byte is asserted only by the PCF8576Ds that are

addressed via address lines A0, A1, and A2. After the last display byte, the I2C-bus

master asserts a STOP condition (P). Alternately a START may be asserted to restart an

I2C-bus access.

Fig 18. I2C-bus protocol

Fig 19. Format of command byte

mdb078

S011100 0AC COMMAND A P

ADISPLAY DATA

slave address R/W

acknowledge by

all addressed

PCF8576Ds

acknowledge

by A0, A1 and A2

selected

PCF8576D only

1 byte

update data pointers

and if necessary,

subaddress counter

n ≥ 1 byte(s) n ≥ 0 byte(s)

msa833

REST OF OPCODE

MSB LSB

Product data sheet Rev. 13 — 10 May 2012 31 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

9. Internal circuitry

Fig 20. Device protection circuits

SA0

VDD VDD

VSS VSS

VLCD

VSS

SDA

mdb076

VSS

SCL

VSS

CLK

VDD

VSS

OSC

VDD

VSS

SYNC

VDD

VSS

A0, A1 A2

VDD

VSS

BP0, BP1,

BP2, BP3

VLCD

VSS

S0 to S39

VLCD

VSS

Product data sheet Rev. 13 — 10 May 2012 32 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

10. Limiting values

[1] Pass level; Human Body Model (HBM) according to Ref. 8 “JESD22-A114”.

[2] Pass level; Machine Model (MM), according to Ref. 9 “JESD22-A115”.

[3] Pass level; Charged-Device Model (CDM), according to Ref. 10 “JESD22-C101”.

[4] Pass level; latch-up testing according to Ref. 11 “JESD78” at maximum ambient temperature (Tamb(max)).

[5] According to the NXP store and transport requirements (see Ref. 13 “NX3-00092”) the devices have to be

stored at a temperature of +8 °C to +45 °C and a humidity of 25 % to 75 %. For long-term storage products,

divergent conditions are described in that document.

CAUTION

Static voltages across the liquid crystal display can build up when the LCD supply voltage

(VLCD) is on while the IC supply voltage (VDD) is off, or vice versa. This may cause unwanted

display artifacts. To avoid such artifacts, VLCD and VDD must be applied or removed together.

Table 17. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDD supply voltage −0.5 +6.5 V

VLCD LCD supply voltage −0.5 +7.5 V

VIinput voltage on each of the pins CLK,

SDA, SCL, SYNC, SA0,

OSC, A0 to A2

−0.5 +6.5 V

VOoutput voltage on each of the pins S0 to

S39, BP0 to BP3 −0.5 +7.5 V

IIinput current −10 +10 mA

IOoutput current −10 +10 mA

IDD supply current −50 +50 mA

IDD(LCD) LCD supply current −50 +50 mA

ISS ground supply current −50 +50 mA

Ptot total power dissipation - 400 mW

Pooutput power - 100 mW

VESD electrostatic discharge

voltage HBM [1] -±5000 V

MM [2] -±200 V

CDM [3] -±1500 V

Ilu latch-up current [4] - 200 mA

Tstg storage temperature [5] −65 +150 °C

Tamb ambient temperature operating device −40 +85 °C

Product data sheet Rev. 13 — 10 May 2012 33 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

11. Static characteristics

[1] VLCD > 3 V for 1⁄3 bias.

[2] LCD outputs are open-circuit; inputs at VSS or VDD; external clock with 50 % duty factor; I2C-bus inactive.

[3] The I2C-bus interface of PCF8576D is 5 V tolerant.

[4] When tested, I2C pins SCL and SDA have no diode to VDD and may be driven to the VI limiting values given in Table 17.

[5] Propagation delay of driver between clock (CLK) and LCD driving signals.

[6] Periodically sampled, not 100 % tested.

[7] Outputs measured one at a time.

Table 18. Static characteristics

VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 2.5 V to 6.5 V; Tamb =

−

C to +85

C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Supplies

VDD supply voltage 1.8 - 5.5 V

VLCD LCD supply voltage [1] 2.5 - 6.5 V

IDD supply current fclk(ext) = 1536 Hz [2] -620μA

VDD =3.0V;

Tamb =25°C-2.7-μA

IDD(LCD) LCD supply current fclk(ext) = 1536 Hz [2] -1830μA

VDD(LCD) =3.0V;

Tamb =25°C- 17.5 - μA

Logic[3]

VP(POR) power-on reset supply voltage 1.0 1.3 1.6 V

VIL LOW-level input voltage on pins CLK, SYNC,

OSC, A0 to A2, SA0,

SCL, SDA

VSS -0.3V

DD V

VIH HIGH-level input voltage on pins CLK, SYNC,

OSC, A0 to A2, SA0,

SCL, SDA

[4][5] 0.7VDD -V

DD V

IOL LOW-level output current output sink current;

VOL = 0.4 V; VDD =5V

on pins CLK and SYNC 1- - mA

on pin SDA 3 - - mA

IOH(CLK) HIGH-level output current on pin CLK output source current;

VOH =4.6V; V

DD =5V 1- - mA

ILleakage current VI=V

DD or VSS;

on pins CLK, SCL, SDA,

A0 to A2 and SA0

−1- +1μA

IL(OSC) leakage current on pin OSC VI=V

DD −1- +1μA

CIinput capacitance [6] --7pF

LCD outputs

ΔVOoutput voltage variation on pins BP0 to BP3 and

S0 to S39 −100 - +100 mV

ROoutput resistance VLCD = 5 V [7]

on pins BP0 to BP3 - 1.5 - kΩ

on pins S0 to S39 - 6.0 - kΩ

Product data sheet Rev. 13 — 10 May 2012 34 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

12. Dynamic characteristics

[1] Typical output duty factor: 50 % m easured at the CLK output pin.

[2] Not tested in production.

[3] All timing values are valid within the operating supply voltage and ambient temperature range and are referenced to VIL and VIH with an

input voltage swing of VSS to VDD.

Table 19. Dynamic characteristics

VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 2.5 V to 6.5 V; Tamb =

−

C to +85

C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Clock

fclk(int) internal clock frequency [1] 1440 1850 2640 Hz

fclk(ext) external clock frequen cy 960 - 2640 Hz

tclk(H) HIGH-level clock time 60 - - μs

tclk(L) LOW-level clock time 60 - - μs

Synchronization

tPD(SYNC_N) SYNC propagation delay - 30 - ns

tSYNC_NL SYNC LOW time 1 - - μs

tPD(drv) driver propagation delay VLCD = 5 V [2] --30μs

I2C-bus[3]

Pin SCL

fSCL SCL clock frequency - - 400 kHz

tLOW LOW period of the SCL clock 1.3 - - μs

tHIGH HIGH period of the SCL clock 0.6 - - μs

Pin SDA

tSU;DAT data set-up time 100 - - ns

tHD;DAT data hol d ti me 0 - - ns

Pins SCL and SDA

tBUF bus free time between a STOP and

START condition 1.3 - - μs

tSU;STO set-up time for ST OP condition 0.6 - - μs

tHD;STA hold time (repeated) START condition 0.6 - - μs

tSU;STA set-up time for a repeated START

condition 0.6 - - μs

trrise time of both SDA and SCL signals fSCL = 400 kHz - - 0.3 μs

fSCL < 125 kHz - - 1.0 μs

tffall time of both SDA and SCL signals - - 0.3 μs

Cbcapacitive load for each bus line - - 400 pF

tw(spike) spike pulse width on the I2C-bus - - 50 ns

Product data sheet Rev. 13 — 10 May 2012 35 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

Fig 21. Driver timing waveforms

Fig 22. I2C-bus timing waveforms

001aai163

tPD(drv)

tSYNC_NL

tPD(SYNC_N)

CLK

SYNC

BP0 to BP3,

and S0 to S39

tclk(H) tclk(L)

1 / fCLK

0.7 VDD

0.3 VDD

0.7 VDD

0.3 VDD

0.5 V

(VDD = 5 V)

0.5 V

SDA

mga728

SDA

SCL

tSU;STA tSU;STO

tHD;STA

tBUF tLOW

tHD;DAT tHIGH

tSU;DAT

Product data sheet Rev. 13 — 10 May 2012 36 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

13. Application information

13.1 Cascaded operation

In large display configurations, up to 16 PCF8576Ds can be differentiated on the same

I2C-bus by using the 3-bit hardware subaddresses (A0, A1 and A2) and the

programmable I2C-bus slave address (SA0).

PCF8576Ds connected in cascade are synchronized to allow the backplane signals from

only one device in the cascade to be shared. This arrangement is cost-effective in large

LCD applications since the backplane outputs of only one device need to be

through-plated to the backplane electrodes of the display. The other cascaded

PCF8576Ds contribute additional segment outputs but their backplane outputs are left

open-circuit (see Figure 23).

All PCF8576Ds connected in cascade are correctly synchronized by the SYNC signal.

This synchronization is guaranteed after the power-on reset. The only time that SYNC is

likely to be needed is if synchronization is lost accidentally, for example, by noise in

adverse electrical environments, or if the LCD multiplex drive mode is changed in an

application using several cascaded PCF8576Ds, as the drive mode cannot be changed

on all of the cascaded devices simultaneously. SYNC can be either an input or an output

signal; a SYNC output is implemented as an open-drain driver with an internal pull-up

resistor. The PCF8576D asserts SYNC at the start of its last active backplane signal and

monitors the SYNC line at all other times. If cascade synchronization is lost, it is restored

by the first PCF8576D to assert SYNC. The timing relationship between the backplane

waveforms and the SYNC signal for each LCD drive mode is shown in Figure 24.

Table 20. Addressing cascaded PCF8576D

Cluster Bit SA0 Pin A2 Pin A1 Pin A0 Device

100000

0011

0102

0113

1004

1015

1106

1117

210008

0019

01010

01111

10012

10113

11014

11115

Product data sheet Rev. 13 — 10 May 2012 37 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

The contact resistance between the SYNC on each cascaded device must be controlled.

If the resistance is too high, the device is not able to synchronize properly; this is

particularly applicable to chip-on-glass applications. The maximum SYNC contact

resistance allowed for the number of devices in cascade is given in Table 21.

The PCF8576D can be cascaded with the PCF8562. This allows optimal drive selection

for a given number of pixels to display. Figure 21 and Figure 22 show the timing o f the

synchronization signals.

Table 21. SYNC contact resistance

Number of devices Maximum contact resist ance

26 kΩ

3 to 5 2.2 kΩ

6 to 10 1.2 kΩ

10 to 16 700 Ω

Fig 23. Cascaded PCF8576D configuration

HOST

MICRO-

PROCESSOR/

MICRO-

CONTROLLER

SDA

SCL

CLK

OSC

SYNC

1, 58, 59

2, 3

8 9 10 11 12

10 11 12

40 segment drives

4 backplanes

40 segment drives

LCD PANEL

(up to 2560

elements)

PCF8576DU

A0 A1 A2 SA0

VDD

VLCD

mdb077

SDA

SCL

SYNC

CLK

OSC

1, 58, 59

613

2, 3

7BP0 to BP3

(open-circuit)

A0 A1 A2 SA0 VSS

VSS

VDD VLCD

PCF8576DU

BP0 to BP3

Rtr

2CB

≤

Product data sheet Rev. 13 — 10 May 2012 38 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

14. Test information

The following quality information corresponds with the product type: PCF8576DT/S400/2

14.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q100 - Failure mechanism based stress test qualification for integrated

circuits, and is suitable for use in automotive applications.

Fig 24. Synchronization of the cascade for the various PCF8576D drive modes

Tfr =ffr

BP0

SYNC

BP0

(1/2 bias)

SYNC

BP0

(1/3 bias)

(a) static drive mode.

(b) 1:2 multiplex drive mode.

(d) 1:4 multiplex drive mode.

BP0

(1/3 bias)

SYNC

BP0

(1/3 bias)

mgl755

Product data sheet Rev. 13 — 10 May 2012 39 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

15. Package outline

Fig 25. Package outline SOT364-1 (TSSOP56)

UNIT A1A2A3bpcD

(1) E(2) eH

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.05 0.2

0.1 8

0.1

DIMENSIONS (mm are the original dimensions).

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

SOT364-1 99-12-27

03-02-19

detail X

(A )

0.25

128

56 29

pin 1 index

1.05

0.85 0.28

0.17 0.2

0.1 14.1

13.9 6.2

6.0 0.5 1

8.3

7.9 0.50

0.35 0.5

0.1

0.080.25

0.8

0.4

EvMA

TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1

max.

1.2

2.5

5 mm

scale

MO-153

Product data sheet Rev. 13 — 10 May 2012 40 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

16. Bare die outline

Fig 26. Bare die outline PCF8576DU/DA (for dimensions see Table 22)

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

PCF8576DU/DA

pcf8576du_da_do

08-12-10

10-12-20

Notes

1. Marking code: PC8576D-2

Wire bond die; 59 bonding pads PCF8576DU/DA

0 0.5 1 mm

scale

(1)

00y

C2 59 152 8 C1

2235

51 9

detail X

P4P3

Product data sheet Rev. 13 — 10 May 2012 41 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

Fig 27. Bare die outline PCF8576DU/2DA (for dimensions see Table 23)

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

PCF8576DU/2DA

pcf8576du_2da_do

08-12-10

10-12-20

Bare die; 59 bumps PCF8576DU/2DA

(1)

00y

C2 59 152 8 C1

2235

51 9

detail X

Notes

1. Marking code: PC8576D-2

0 0.5 1 mm

scale

detail Y

Product data sheet Rev. 13 — 10 May 2012 42 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

[1] Dimension not drawn to scale.

[2] Pad size.

[3] Passivation opening.

[1] Dimension not drawn to scale.

Table 22. Dimensions of PCF8576DU/DA

Original dimensions are in mm.

Unit (mm) A D E e[1] P1[2] P2[3] P3[2] P4[3]

max--------

nom 0.38 2.2 2.0 - 0.09 0.08 0.066 0.056

min - - - 0.072 - - - -

Table 23. Dimensions of PCF8576DU/2DA

Original dimensions are in mm.

Unit (mm) A A1A2b D E e[1] L

max--------

nom 0.40 0.015 0.381 0.052 2.2 2.0 - 0.077

min------0.072-

Table 24. Bonding pad location for PCF8576DU/x

All x/y coordinates represent the position of the center of each pad with respect to the center

(x/y = 0) of the chip (see Figure 3, Figure 26 and Figure 27).

Symbol Pad X (μm) Y (μm) Description

SDA 1 −34.38 −876.6 I2C-bus serial data input/output

SCL 2 109.53 −876.6 I2C-bus serial clock input

SCL 3 181.53 −876.6

SYNC 4 365.58 −876.6 cascade synchronization input/output

CLK 5 469.08 −876.6 external clo ck input/output

VDD 6 577.08 −876.6 supply voltage

OSC 7 740.88 −876.6 internal oscillator enable input

A0 8 835.83 −876.6 subaddress inputs

A1 9 1005.48 −630.9

A2 10 1005.48 −513.9

SA0 11 1005.48 −396.9 I2C-bus address input; bit 0

VSS 12 1005.48 −221.4 ground suppl y voltage

VLCD 13 1005.48 10.71 LCD supply voltage

BP0 14 1005.48 156.51 LCD backplane outputs

BP2 15 1005.48 232.74

BP1 16 1005.48 308.97

BP3 17 1005.48 385.2

S0 18 1005.48 493.2 LCD segment outputs

S1 19 1005.48 565.2

S2 20 1005.48 637.2

S3 21 1005.48 709.2

Product data sheet Rev. 13 — 10 May 2012 43 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

S4 22 347.22 876.6 LCD segment outputs

S5 23 263.97 876.6

S6 24 180.72 876.6

S7 25 97.47 876.6

S8 26 14.22 876.6

S9 27 −69.03 876.6

S10 28 −152.28 876.6

S11 29 −235.53 876.6

S12 30 −318.78 876.6

S13 31 −402.03 876.6

S14 32 −485.28 876.6

S15 33 −568.53 876.6

S16 34 −651.78 876.6

S17 35 −735.03 876.6

S18 36 −1005.5 625.59

S19 37 −1005.5 541.62

S20 38 −1005.5 458.19

S21 39 −1005.5 374.76

S22 40 −1005.5 291.33

S23 41 −1005.5 207.9

S24 42 −1005.5 124.47

S25 43 −1005.5 41.04

S26 44 −1005.5 −42.39

S27 45 −1005.5 −125.8

S28 46 −1005.5 −209.3

S29 47 −1005.5 −292.7

S30 48 −1005.5 −376.1

S31 49 −1005.5 −459.5

S32 50 −1005.5 −543

S33 51 −1005.5 −625.6

S34 52 −735.03 −876.6

S35 53 −663.03 −876.6

S36 54 −591.03 −876.6

S37 55 −519.03 −876.6

S38 56 −447.03 −876.6

S39 57 −375.03 −876.6

SDA 58 −196.38 −876.6 I2C-bus serial data input/output

SDA 59 −106.38 −876.6

Table 24. Bonding pad location for PCF8576DU/x …continued

All x/y coordinates represent the position of the center of each pad with respect to the center

(x/y = 0) of the chip (see Figure 3, Figure 26 and Figure 27).

Symbol Pad X (μm) Y (μm) Description

Product data sheet Rev. 13 — 10 May 2012 44 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

17. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under

normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that

all normal precautions are taken as described in JESD625-A, IEC61340-5 or equivalent

standards.

18. Packing information

18.1 Tray information

Table 25. Alignment marks

All x/y coordinates represent the position of the center of each alignment mark with respect to the

center (x/y = 0) of the chip (see Figure 3, Figure 26 and Figure 27).

Symbol Location Dimension

X (μm) Y (μm) Diameter (μm)

C1 930.42 −870.3 72

C2 −829.98 −870.3 72

Fig 28. Tray details

013aaa508

x.1

1.2

1.3

2.2

3.1

1.y

2.11.1

Product data sheet Rev. 13 — 10 May 2012 45 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

Table 26. Tray dimensions (see Figure 28)

Symbol Description Value Unit

A pocket pitch in x directio n 5 .59 mm

B pocket pitch in y directio n 6 .35 mm

C pocket width in x direction 3.16 mm

D pocket width in y direction 2.91 mm

E tray width in x direction 50.8 mm

F tray width in y direction 50.8 mm

G cut corner to pocket 1.1 center 5.83 mm

H cut corner to pocket 1.1 center 6.35 mm

x number of pocket s, x direction 8 -

y number of pocket s, y direction 7 -

Fig 29. Tray alignment

013aaa509

marking code

Product data sheet Rev. 13 — 10 May 2012 46 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

18.2 Carrier tape information

Fig 30. Tape details

Table 27. Carrier tape dimensions

Symbol Description Value Unit

A0 pocket width in x direction 8.6 mm

B0 pocket width in y direction 14.5 mm

K0 pocket height 1.8 mm

P1 sprocket hole pitch 12 mm

W t ape width in y direction 24 mm

001aaj314

direction of feed

K04A0

pin 1 index

Product data sheet Rev. 13 — 10 May 2012 47 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

19. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

19.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

19.2 Wave and reflow soldering

W ave soldering is a joinin g technology in which the joint s are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

•Board specifications, including the board finish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering versus SnPb soldering

19.3 Wave soldering

Key characteristics in wave soldering are:

•Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath specifications, including temperature and impurities

Product data sheet Rev. 13 — 10 May 2012 48 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

19.4 Reflow soldering

Key characteristics in reflow soldering are:

•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to

higher minimum peak temperatures (see Figure 31) than a SnPb process, thus

reducing the process window

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enoug h for the solder to make reliable solder joint s (a solder paste

characteristic). In addition, the peak temperature must be low en ough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 28 and 29

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 31.

Table 28. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Packag e reflow temperature (°C)

Volume (mm3)

< 350 ≥ 350

< 2.5 235 220

≥ 2.5 220 220

Table 29. Lead-free pr ocess (from J-STD-020C)

Package thickness (mm) Packag e reflow temperature (°C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 13 — 10 May 2012 49 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

20. Abbreviations

MSL: Moisture Sensitivity Level

Fig 31. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 30. Abbreviations

Acronym Description

CDM Charged -Device Model

CMOS Comp lementary Metal-Oxide Semiconductor

HBM Huma n Body Model

ITO Indium Tin Oxide

LCD Liquid Crystal Display

LSB Least Significant Bit

MM Machine Model

MSB Most Significant Bit

MSL Moisture Sensitivity Level

PCB Printed Circu i t Boa r d

RAM Random Access Memory

RMS Root Mean Square

SCL Serial CLock line

SDA Serial DAta line

SMD Surface Mount Device

Product data sheet Rev. 13 — 10 May 2012 50 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

21. References

[1] AN10170 — Design guidelines for COG modules with NXP monochrome LCD

drivers

[2] AN10365 — Surface mount reflow soldering description

[3] AN10706 — Handling bare die

[4] AN10853 — ESD and EMC sensitivity of IC

[5] IEC 60134 — Rating systems for electronic tubes and valves and analogous

semiconductor devices

[6] IEC 61340-5 — Protection of electronic devices from electrostatic phenomena

[7] IPC/JEDEC J-STD-020D — Moisture/Reflow Sensitivity Classification for

Nonhermetic Solid State Surface Mount Devices

[8] JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body

Model (HBM)

[9] JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model

(MM)

[10] JESD22-C101 — Field-Induced Char ged-Device Model Test Method for

Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components

[11] JESD78 — IC Latch-Up Test

[12] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive

(ESDS) Devices

[13] NX3-00092 — NXP store and transport requirements

[14] UM10204 — I2C-bus specification and user manual

Product data sheet Rev. 13 — 10 May 2012 51 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

22. Revision history

Table 31. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PCF8576D v.13 2012 0510 Product data sheet - PCF8576D v.12

Modifications: •Fixed typos

PCF8576D v.12 2012 0413 Product data sheet - PCF8576D v.11

PCF8576D v.11 20110627 Product data sheet PCF8576D v.10

PCF8576D v.10 20110214 Product data sheet - PCF8576 D_9

PCF8576D_9 20090825 Product data sheet - PCF8576D_8

PCF8576D_8 20090319 Product data sheet - PCF8576D_7

PCF8576D_7 20081218 Product data sheet - PCF8576D_6

PCF8576D_6 20081202 Product data sheet - PCF8576D_5

PCF8576D_5 20041222 Product specification - PCF8576D_4

PCF8576D_4 20041008 Product specification - PCF8576D_3

PCF8576D_3 20040617 Product specification - PCF8576D_2

PCF8576D_2 20030623 Product specification - PCF8576D_1

PCF8576D_1 20030401 Objective specification - -

Product data sheet Rev. 13 — 10 May 2012 52 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

23. Legal information

23.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

23.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short dat a sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

23.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect , incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, lif e-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe propert y or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applic ations that are described herein for any of these

products are for il lustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Not hing in this document may be interpret ed or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyri ghts, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product develop ment.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 13 — 10 May 2012 53 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever cust omer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive appl ications beyond NXP Semiconductors’

standard warrant y and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English version s.

Bare die — All die are tested on compliance with their related te chnical

specifications as stated in this data sheet up to the point of wafer sawing and

are handled in accordance with the NXP Semiconductors storage and

transportation conditions. If there are data sheet limits not guaranteed, these

will be separately indicated in the data sheet. There are no post-packing tests

performed on individual die or wafers.

NXP Semiconductors has no control of third party procedures in the sawing,

handling, packing or assembly of the die. Accordingly, NXP Semiconductors

assumes no liability for device functionality or performance of the die or

systems after third party sawing, handling, packing or assembly of the die. It

is the responsibility of the customer to test and qualify their application in

which the die is used.

All die sales are conditione d upon and sub ject to the custo mer enter ing into a

written die sale agreement with NXP Semiconductors through its legal

department.

23.4 Trademarks

Notice: All refe renced brands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

I2C-bus — logo is a trademark of NXP B.V.

24. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 13 — 10 May 2012 54 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

25. Tables

Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .2

Table 2. Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2

Table 3. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .6

Table 4. Selection of possible display configurations. . . .7

Table 5. Biasing characteristics . . . . . . . . . . . . . . . . . . . .9

Table 6. Standard RAM filling in 1:3 multiplex

drive mode . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

Table 7. Entire RAM filling by rewriting in 1:3

multiplex drive mode. . . . . . . . . . . . . . . . . . . . .22

Table 8. Blinking frequencies[1] . . . . . . . . . . . . . . . . . . .23

Table 9. Definition of PCF8576D commands . . . . . . . .24

Table 10. C bit description . . . . . . . . . . . . . . . . . . . . . . . .24

Table 11. Mode-set command bit description . . . . . . . . .25

Table 12. Load-data-pointer command bit description . . .25

Table 13. Device-select command bit description . . . . . .2 5

Table 14. Bank-select command bit description . . . . . . .26

Table 15. Blink-select command bit description . . . . . . . .26

Table 16. I2C slave address byte . . . . . . . . . . . . . . . . . . .29

Table 17. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .32

Table 18. Static characteristics . . . . . . . . . . . . . . . . . . . .33

Table 19. Dynamic characteristics . . . . . . . . . . . . . . . . . .34

Table 20. Addressing cascaded PCF8576D . . . . . . . . . .36

Table 21. SYNC contact resistance . . . . . . . . . . . . . . . . .37

Table 22. Dimensions of PCF8576DU/DA . . . . . . . . . . . .42

Table 23. Dimensions of PCF8576DU/2DA . . . . . . . . . . .42

Table 24. Bonding pad location for PCF8576DU/x . . . . .42

Table 25. Alignment marks. . . . . . . . . . . . . . . . . . . . . . . .44

Table 26. Tray dimensions (see Figure 28) . . . . . . . . . . .45

Table 27. Carrier tape dimensions . . . . . . . . . . . . . . . . . .46

Table 28. SnPb eutectic process (from J-STD-020C) . . .48

Table 29. Lead-free process (from J-STD-020C) . . . . . .48

Table 30. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .4 9

Table 31. Revision history . . . . . . . . . . . . . . . . . . . . . . . .51

Product data sheet Rev. 13 — 10 May 2012 55 of 56

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

26. Figures

Fig 1. Block diagram of PCF8576D . . . . . . . . . . . . . . . . .3

Fig 2. Pinning diagram for PCF8576DT (TSSOP56). . . .4

Fig 3. Pinning diagram for PCF8576DU (bare die) . . . . .5

Fig 4. Example of displays suitable for PCF8576D . . . . .7

Fig 5. Typical system configuration . . . . . . . . . . . . . . . . .8

Fig 6. Electro-optical characteristic: relative

transmission curve of the liquid . . . . . . . . . . . . . .11

Fig 7. Static drive mode waveforms. . . . . . . . . . . . . . . .12

Fig 8. Waveforms for the 1:2 multiplex drive

mode with 1⁄2 bias . . . . . . . . . . . . . . . . . . . . . . . .13

Fig 9. Waveforms for the 1:2 multiplex drive

mode with 1⁄3 bias . . . . . . . . . . . . . . . . . . . . . . . .14

Fig 10. Waveforms for the 1:3 multi plex drive

mode with 1⁄3 bias . . . . . . . . . . . . . . . . . . . . . . . .15

Fig 11. Waveforms for the 1:4 multiplex drive

mode with 1⁄3 bias . . . . . . . . . . . . . . . . . . . . . . . .16

Fig 12. Display RAM bit map. . . . . . . . . . . . . . . . . . . . . .18

Fig 13. Relationship between LCD layout, drive mode,

display RAM filling order and display data

transmitte d ove r th e I 2C-bus . . . . . . . . . . . . . . . .20

Fig 14. Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 7

Fig 15. Definition of START and STOP conditions. . . . . .27

Fig 16. System configuration . . . . . . . . . . . . . . . . . . . . . .28

Fig 17. Acknowledgement of the I2C-bus . . . . . . . . . . . .28

Fig 18. I2C-bus protocol. . . . . . . . . . . . . . . . . . . . . . . . . .3 0

Fig 19. Format of command byte. . . . . . . . . . . . . . . . . . .30

Fig 20. Device protection circuits. . . . . . . . . . . . . . . . . . .31

Fig 21. Driver timing waveforms . . . . . . . . . . . . . . . . . . .35

Fig 22. I2C-bus timing waveforms . . . . . . . . . . . . . . . . . .35

Fig 23. Cascaded PCF8576D configuration . . . . . . . . . .37

Fig 24. Synchronization of the cascade for the various

PCF8576D drive modes . . . . . . . . . . . . . . . . . . .38

Fig 25. Package outline SOT364-1 (TSSOP56) . . . . . . .39

Fig 26. Bare die outline PCF8576DU/DA

(for dimensions see Table 22) . . . . . . . . . . . . . . .40

Fig 27. Bare die outline PCF8576DU/2DA

(for dimensions see Table 23) . . . . . . . . . . . . . . .41

Fig 28. Tray details . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44

Fig 29. Tray alignment . . . . . . . . . . . . . . . . . . . . . . . . . . .45

Fig 30. Tape details . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46

Fig 31. Temperature profiles for large and small

components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

NXP Semiconductors PCF8576D

Universal LCD driver for low multiplex rates

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 10 May 2012

Document identifier: P C F8576D

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

27. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6

7 Functional description . . . . . . . . . . . . . . . . . . . 7

7.1 Power-On Reset (POR) . . . . . . . . . . . . . . . . . . 8

7.2 LCD bias generator . . . . . . . . . . . . . . . . . . . . . 8

7.3 LCD voltage select or . . . . . . . . . . . . . . . . . . . . 9

7.3.1 Electro-optical performance . . . . . . . . . . . . . . 10

7.4 LCD drive mode waveforms. . . . . . . . . . . . . . 12

7.4.1 Static drive mode . . . . . . . . . . . . . . . . . . . . . . 12

7.4.2 1:2 Multiplex drive mode. . . . . . . . . . . . . . . . . 13

7.4.3 1:3 Multiplex drive mode. . . . . . . . . . . . . . . . . 15

7.4.4 1:4 Multiplex drive mode. . . . . . . . . . . . . . . . . 16

7.5 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.5.1 Internal clock . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.5.2 External clock. . . . . . . . . . . . . . . . . . . . . . . . . 17

7.6 Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.7 Display register. . . . . . . . . . . . . . . . . . . . . . . . 17

7.8 Segment outputs. . . . . . . . . . . . . . . . . . . . . . . 17

7.9 Backplane outputs . . . . . . . . . . . . . . . . . . . . . 18

7.10 Display RAM. . . . . . . . . . . . . . . . . . . . . . . . . . 18

7.10.1 Data pointer . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.10.2 Subaddress counter . . . . . . . . . . . . . . . . . . . . 21

7.10.3 RAM writing in 1:3 multiplex drive mode. . . . . 21

7.10.4 Writing over the RAM address boundary . . . . 22

7.10.5 Output bank selector . . . . . . . . . . . . . . . . . . . 22

7.10.6 Input bank selector . . . . . . . . . . . . . . . . . . . . . 23

7.11 Blinking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

7.12 Command decoder. . . . . . . . . . . . . . . . . . . . . 24

7.13 Display controller . . . . . . . . . . . . . . . . . . . . . . 26

8 Characte ristics of the I2C-bus . . . . . . . . . . . . 27

8.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

8.1.1 START and STOP conditions. . . . . . . . . . . . . 27

8.2 System configuration . . . . . . . . . . . . . . . . . . . 27

8.3 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 28

8.4 I2C-bus controller . . . . . . . . . . . . . . . . . . . . . . 29

8.5 Input filters . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

8.6 I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 29

9 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 31

10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 32

11 Static characteristics. . . . . . . . . . . . . . . . . . . . 33

12 Dynamic ch aracteristics. . . . . . . . . . . . . . . . . 34

13 Application information . . . . . . . . . . . . . . . . . 36

13.1 Cascaded operation. . . . . . . . . . . . . . . . . . . . 36

14 Test information . . . . . . . . . . . . . . . . . . . . . . . 38

14.1 Quality information. . . . . . . . . . . . . . . . . . . . . 38

15 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 39

16 Bare die outline. . . . . . . . . . . . . . . . . . . . . . . . 40

17 Handling information . . . . . . . . . . . . . . . . . . . 44

18 Packing information . . . . . . . . . . . . . . . . . . . . 44

18.1 Tray information. . . . . . . . . . . . . . . . . . . . . . . 44

18.2 Carrier tape information. . . . . . . . . . . . . . . . . 46

19 Soldering of SMD packages. . . . . . . . . . . . . . 47

19.1 Introduction to soldering. . . . . . . . . . . . . . . . . 47

19.2 Wave and reflow soldering. . . . . . . . . . . . . . . 47

19.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 47

19.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 48

20 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 49

21 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

22 Revision history . . . . . . . . . . . . . . . . . . . . . . . 51

23 Legal information . . . . . . . . . . . . . . . . . . . . . . 52

23.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 52

23.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

23.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 52

23.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 53

24 Contact information . . . . . . . . . . . . . . . . . . . . 53

25 Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

26 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

27 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56