M25P20-VMP6TGB - Numonyx - Datasheet.Directory

March 2010 Rev 14 1/55

M25P20

2 Mbit, low voltage, Serial Flash memory

with 75 MHz SPI bus interface

Feature summary

2 Mbit of Flash Memory

Page Program (u p to 256 Bytes) in 0.8 ms

(typical)

Sector Erase (512 Kbit) in 0.6 s (typical)

Bulk Erase (2 Mbit) in 3 s (typical)

2.3 to 3.6 V Single Supply Voltage

SPI Bus Compatible Serial Interface

75 MHz Clock Rate (maximum)

Deep Power-down Mode 1 μA (typical)

Hardware Write Protection: protected area

size defined by two non-volatile bits (BP0,

BP1)

Electronic Signatures

– JEDEC Standard two-Byte Signature

(2012h)

– Unique ID code (UID) with 16 bytes read-

only, available upon customer request

– RES Instruction, One-Byte, Signature

(11h), for backward compatibility

Packages

– ECOPACK® (RoHS compliant)

SO8 (MN)

150 mils width

VFQFPN8 (MP)

(MLP8 6 x 5 mm)

QFN8L (MS)

MLP8 6 x 5 mm

www.Numonyx.com

Contents M25P20
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Contents
Summary description  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1 Serial Data Output (Q)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
2 Serial Data Input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
3 Serial Clock (C)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
4 Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
5 Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
6 Write Protect (W)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
SPI modes  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Operating features   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1 Page Programming   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
2 Sector Erase and Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3 Polling During a Write, Program or Erase Cycle  . . . . . . . . . . . . . . . . . . . . 11
4 Active Power, Standby Power and Deep Power-Down Modes   . . . . . . . . .11
5 Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12
6 Protection Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12
7 Hold Condition  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13
Memory organization  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Instructions  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1 Write Enable (WREN)   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  17
2 Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18
3 Read Identification (RDID)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  19
4 Read Status Register (RDSR)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  20
4.1 WIP bit  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2 WEL bit   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.3 BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.4 SRWD bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5 Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  22

M25P20 Contents
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6 Read Data Bytes (READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  24
7 Read Data Bytes at Higher Speed (FAST_READ) . . . . . . . . . . . . . . . . . .  25
8 Page Program (PP)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  26
9 Sector Erase (SE)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  28
10 Bulk Erase (BE)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  29
11 Deep Power-down (DP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  30
12 Release from Deep Power-down and Read Electronic Signature (RES) .  31
Power-up and Power-down  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
DC and AC parameters  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Ordering Information, Standard Parts . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Ordering Information, Automotive Parts . . . . . . . . . . . . . . . . . . . . . . . . 51
Revision history   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

List of tables M25P20
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List of tables
Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 2. Protected Area Sizes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3. Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 4. Instruction Set. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 5. Read Identification (RDID) data-out sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 6. Status Register Format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 7. Protection Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 8. Power-Up Timing and VWI Threshold  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 9. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 10. Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 11. Data Retention and Endurance  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 12. Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 13. DC Characteristics (Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 14. DC Characteristics (Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 15. Instruc tio n Tim e s, pr oc ess technology  T9H X (D evice Grade 6). . . . . . . . . . . . . . . . . . . . . 38
Table 16. Instruc tio n Time s, pr oc ess technology T7Y,  Device Grade 6. . . . . . . . . . . . . . . . . . . . . . . 38
Table 17. Instruction Times (Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 18. AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 19. AC Characteristics (25MHz Operation, Device Grade 6 or 3)  . . . . . . . . . . . . . . . . . . . . . . 40
Table 20. AC Characteristics (40MHz Operation, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 21. AC Characteristics (50MHz Operation, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 22. AC charact er istic s, gr ad e 6 ( T 9 HX tec hn ology), 75 MHz operation, VCC min = 2.7 V  . . . 43
Table 23. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width,
package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 24. QFN8L (MLP8) 8-lead dual flat package no lead, 6 x 5 mm package mechanical data. . . 48
Table 25. VFQFPN8 (MLP8) 8-lead Very thin Fine Pitch Dual Flat Package No lead,
6x5mm, Package Mechanical Data  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 26. Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 27. Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Table 28. Document revision history  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

M25P20 List of figures
 5/55
List of figures
Figure 1. Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 2. SO and MLP8 Connections  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3. Bus Master and memory devices on the SPI Bus  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 4. SPI modes supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Hold Condition Activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 6. Block Diagram  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 7. Write Enable (WREN) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 8. Write Disable (WRDI) Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 9. Read Identification (RDID) Instruction Sequence and Data-Out Sequence . . . . . . . . . . . . 20
Figure 10. Read Status Register (RDSR) Instruction Sequence and Data-Out Sequence . . . . . . . . . 21
Figure 11. Write Status Register (WRSR) Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 12. Read Data Bytes (READ) instruction sequence and data-out sequence . . . . . . . . . . . . . . 24
Figure 13. Read Data Bytes at Higher Speed (FAST_READ) Instruction Sequence
and Data-Out Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 14. Page Program (PP) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 15. Sector Erase (SE) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 16. Bulk Erase (BE) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 17. Deep Power-down (DP) Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 18. Release from Deep Power-down and Read Electronic Signature (RES) Instruction
Sequence and Data-Out Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 19. Release from Deep Power-down (RES) Instruction Sequence  . . . . . . . . . . . . . . . . . . . . . 32
Figure 20. Power-up Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 21. AC Measurement I/O Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 22. Serial Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 23. Write Protect Setup and Hold Timing during WRSR when SRWD=1. . . . . . . . . . . . . . . . . 45
Figure 24. Hold Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 25. Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 26. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline. . . . . . 47
Figure 27. QFN8L (MLP8) 8-lead, dual flat package no lead, 6 × 5 mm, package outline . . . . . . . . . 48
Figure 28. VFQFPN8 (MLP8) 8-lead Very thin Fine Pitch Dual Flat Package No lead,
6x5mm, Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Summary description M25P20

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1 Summary description

The M25P20 is a 2 Mbit (256K x 8) Serial Flash Memory, wi th advan c e d writ e pr ot ect ion

mechanisms, accessed by a high speed SPI-compatible bus. The M25P20 features high

performance instructions allowing clock frequency operation up to 75 MHz(1)

The memory can be programmed 1 to 256 bytes at a time, using the Page Program

instruction.

The memory is organize d as 4 secto rs, each cont a ining 25 6 p ages. Ea ch p age is 256 bytes

wide. Thus, the whole memory can be viewed as consisting of 1024 pages, or 262,144

bytes.

The whole memory can be erased using the Bulk Erase instruction, or a sector at a time,

using the Sector Erase instruction.

In order to meet environmental requirements, Numonyx offers these devices in ECOP ACK®

packages. ECOPACK® pa ckages are Lead-free and RoHS complia nt. ECOPACK is an

Numonyx trademark. ECOPACK specifications are available at: www.Numonyx.com.

Important: This datasheet details the functionality of the M25P20 devices, based on the previous T7Y

process or based on the current T9HX process (available since August 2008). The new

device in T9HX is completely backward compatible with the old one in T7Y and it additionaly

features:

- extended Vcc range (2.3-3.6V)

- improved max frequency (Fast Read) to 75 MHz in the standard Vcc range 2.7-3.6 V

- max frequency (Fast Read) of 40 MHz in the extended Vcc range 2.3-2.7V

- UID/CFD protection feature

Figure 1. Logic Diagram

1. 75 MHz operation is available only on the VCC range 2.7 V - 3.6 V and for process technology T9HX devices,

identified by process identification digit "4" in the device marking and process letter "B" in the part number.

AI04080

VCC

M25P20

HOLD

VSS

M25P20 Summary description

7/55

Figure 2. SO and MLP8 Connections

1. There is an exposed die paddle on the underside of the MLP8 packages. This is pulled, internally, to VSS,

and must not be allowed to be connected to any other voltage or signal line o n the PCB.

2. See Package mechanical section for package dimensions, and how to identify pin-1.

Table 1. Signal Names

C Serial Clock

D Serial Data Input

Q Serial Data Output

SChip Select

WWrite Protect

HOLD Hold

VCC Supply Voltage

VSS Ground

AI04081B

5DVSS C

HOLDQ

M25P20

Signal description M25P20

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2 Signal description

2.1 Serial Data Output (Q)

This output signal is u sed to transfer dat a serially out of the device . Data is shif ted out on the

falling edge of Serial Clock (C).

2.2 Serial Data Input (D)

This input signal is used to transfer data serially into th e device. It receives instructions,

addresses, and the data to be programmed. Values are latched on the rising edge of Serial

Clock (C).

2.3 Serial Clock (C)

This input signal provides the timing of the serial interface. Instructions, addresses, or data

present at Serial Data Input (D) are latched on the rising edge of Serial Clock (C). Data on

Serial Data Output (Q) changes after the falling edge of Serial Clock (C).

2.4 Chip Select (S)

When this input signal is High, the device is deselected and Serial Data Output (Q) is at high

impedance. Unless an intern al Program, Erase or Write Status Register cycle is in pr ogress,

the device will be in the Standby mode (this is not the Deep Power-down mode). Driving

Chip Select (S) Low selects the device, placing it in the Active Power mode.

After Power-up, a falling edge on Chip Select (S) is required prior to the start of any

instruction.

2.5 Hold (HOLD)

The Hold (HOLD) signal is used to p ause any serial communica tions with the device without

deselecting the device.

During the Hold condition, the Serial Data Output (Q) is high impedance, and Serial Data

Input (D) and Serial Clock (C) are Don’t Care.

To start the Hold condition, the device must be selected, with Chip Select (S) driven Low.

2.6 Write Protect (W)

The main purpose of this input signal is to freeze the size of the area of memory that is

protected against program or erase instructions (as specified by the values in the BP1 and

BP0 bits of the Status Register).

M25P20 SPI modes

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3 SPI modes

These devices can be driven by a microcontroller with its SPI peripheral running in either of

the two following modes:

CPOL=0, CPHA=0

CPOL=1, CPHA=1

For these two modes, input data is latched in on the rising edge of Serial Clock (C), and

output data is available from the falling edge of Serial Clock (C).

The dif ference b etween the two modes, as shown in Figure 4, is the clock polarity when th e

bus master is in Stand-by mode and not transferring data:

C remains at 0 for (CPOL=0, CPHA=0)

C remains at 1 for (CPOL=1, CPHA=1)

Figure 3. Bus Master and memory devices on the SPI Bus

1. The Write Protect (W) and Hold (HOLD) signals should be driven, High or Low as appropriate.

2. These pull-up resistors, R, ensure that the memory devices are not selected if the Bus Master leaves the S line in the high-

impedance state. As the Bus Master may enter a state where all inputs/outputs are in high impedance at the same time

(e.g.: when the Bus Master is reset), the clock line (C) must be connected to an external pull-down resistor so that, when all

inputs/outputs become high impedance, S is pulled High while C is pulled Low (thus ensuring that S and C do not become

High at the same time, and so, that the tSHCH requirement is met).

AI12836

SPI Bus Master

SPI Memory

Device

SDO

SDI

SCK

CQD

SPI Memory

Device

CQD

SPI Memory

Device

CQD

CS3 CS2 CS1

SPI Interface with

(CPOL, CPHA) =

(0, 0) or (1, 1)

WHOLD WHOLD WHOLD

R(2) R(2) R(2)

VCC VCC VCC

VSS VSS VSS

R(2)

SPI modes M25P20

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Figure 4. SPI modes supported

AI01438

MSB

CPHA

CPOL

MSB

M25P20 Operating features

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4 Operating features

4.1 Page Programming

To program one data byte, two instructions are required: Write Enable (WREN), which is

one byte, and a Page Program (PP) sequence, which consists of four bytes plus data. This

is followed by the internal Program cycle (of duration tPP).

To spread this overhead, the Page Program (PP) instruction allows up to 256 bytes to be

programmed at a time (changing bits from 1 to 0), provided that they lie in consecutive

addresses on the same page of memory.

For optimized timings, it is recommended to use the Page Program (PP) instruction to

program all consecutive targeted Bytes in a single sequence versus u sing several Page

Program (PP) sequences with each containing only a few Bytes (see Page Program (PP),

Instruction Times, pro ce ss te chn ol og y T9HX (De vice Grade 6) and Table 17: Instruction

Times ( Device Grade 3)).

4.2 Sector Erase and Bulk Erase

The Page Program (PP) instru ction allows bits to be reset from 1 to 0. Before this can be

applied, the bytes of memory need to have been erased to all 1s (FFh). This can be

achieved either a sector at a tim e, using the Sector Erase (SE) instruction, or throughout the

entire memory, using the Bulk Erase (BE) instr uc tio n. This starts an internal Erase cycle (of

duration tSE or tBE).

The Erase inst ru ctio n mus t be preceded by a Write Enable (WRE N) ins tru ct ion .

4.3 Polling During a Write, Program or Erase Cycle

A further improvemen t in the time to Write Status Register (WRSR), Pr og ram (PP) or Era se

(SE or BE) can be achieved by not waiting for the worst case d elay (tW, tPP, tSE, or tBE). The

Write In Progress (WIP) bit is provided in the Status Register so that the application progr am

can monitor its value, polling it to est ablish when the previous Write cycle, Program cycle or

Erase cycle is complete.

4.4 Active Power, Standby Power and Deep Power-Down Modes

When Chip Select (S) is Low, the device is selected, and in the Active Power mode.

When Chip Select (S) is High, the device is deselected, but could remain in the Active

Power mode until all internal cycles have completed (Program, Erase, Write Status

drops to ICC1.

The Deep Power-down mode is entered when the specific instruction (the Deep Power-

down (DP) instruction) is executed. The device consumption drops further to ICC2. The

device remains in this mode until another specific instruction (the Release from Deep

Power-down and Read Electronic Signature (RES) instruction) is executed.

Operating features M25P20

12/55

All other instructions are ignored while the device is in the Deep Power-down mode. This

can be used as an extra software protection mechanism, when the device is not in active

use, to protect the device from inadvertent W rite, Program or Erase instructions.

4.5 Status Register

The Status Register contains a number of status and control bits, as shown in Table 6, that

can be read or set (as appr opriate ) by specific instructions. For a detailed descrip tion of the

Status Register bits, see Section 6.4: Read Status Register (RDSR).

4.6 Protection Modes

The environme nts where non -vo la tile memo ry de vice s ar e us ed can be very noisy. No SPI

device can operate correctly in the presence of excessive noise. To help combat this, the

M25P20 features the following data protection mechanisms:

Power On Reset and an internal timer (tPUW) can provide protection against

inadvertant changes while the power supply is outs ide the operating specification.

Program, Erase and Write S t atus Register instructions are checked that they consist of

a number of clock pulses that is a multiple of eight, before they are accepted for

execution.

All instructions that modify data must be preceded by a Write Enable (WREN)

instruction to set the Write Enable Latch (WEL) bit. This b it is retur ned to its reset state

by the following events:

–Power-up

– Write Disable (WRDI) instruction completion

– Write Status Register (WRSR) instruction completion

– Page Progra m (PP) instr uc tio n co mple tion

– Sector Erase (SE) instruction completion

– Bulk Erase (BE) instruction completion

The Block Protect (BP1, BP0) bits allow part of the memory to be configured as read-

only. This is the Software Protected Mode (SPM).

The Write Protect (W) signal, in co-operation with the Status Register Write Disable

(SRWD) bit, al lows the Block Protect (BP1, BP0) bits and S tatus Register Write Disable

(SRWD) bit to be write-protected. This is the Hardware Protected Mode (HPM).

In addition to the low power consumption feature, the Deep Power-down mode offers

extra software protection from inadvertant Write, Program and Erase instructions, as all

instructions are ignored except one particular in struction (the Release from Deep

Power-down instruction).

M25P20 Operating features

13/55

4.7 Hold Condition

The Hold (HOLD) signal is used to p ause any serial commun ications with the de vice without

resetting the clocking sequence. However, taking this signal Low does not terminate any

Write Status Register, Program or Erase cycle that is currently in progress.

To enter the Hold condition, the device must be selected, with Chip Select (S) Low.

The Hold condition starts on the falling edge of the Hold (HOLD) signal, provided that this

coincides with Serial Clock (C) being Low (as shown in Figure 5).

The Hold condition ends on the rising edge of the Hold (HOLD) signal, provided that this

coincides with Serial Clock (C) being Low.

If the falling edge does not coincide with Serial Clock (C) being Low, the Hold condition

starts after Serial Clock (C) next goes Low. Similarly, if the rising edge does not coincide

with Serial Clock (C) being Low, the Hold condition ends after Serial Clock (C) next goes

Low. (This is shown in Figure 5).

During the Hold condition, the Serial Data Output (Q) is high impedance, and Serial Data

Input (D) and Serial Clock (C) are Don’t Care.

Normally, the device is kept selected, with Chip Select (S) driven Low, for the whole duration

of the Hold condition. This is to ensure that the st ate of the internal logic remains unch anged

from the moment of entering the Hold condition.

If Chip Select (S) goes High while the device is in the Hold con dition, this has the effect of

resetting the internal logic of the device. To restart communication with the device, it is

necessary to drive Hold (HOLD) High, and then to drive Chip Select (S) Low. This prevents

the device from going back to the Hold condition.

Table 2. Protected Area Sizes

Status Register

Content Memory Cont ent

BP1 Bit BP0 Bit Protected Area Unprotected Area

0 0 none All sectors(1)(four sectors: 0, 1, 2 and 3)

1. The device is ready to accept a Bulk Erase instruction if, and only if, both Block Protect (BP1, BP0) are 0.

0 1 Upper quarter (Sector 3) Lower three-quarters (three sectors: 0 to

1 0 Upper half (two sectors: 2 and 3) Lower half (Sectors 0 and 1)

1 1 All sectors (four sectors: 0, 1, 2 and 3) none

Operating features M25P20

14/55

Figure 5. Hold Condition Activation

AI02029

HOLD

Hold

Condition

(standard use)

Hold

Condition

(non-standard use)

M25P20 Memory organization

15/55

5 Memory organization

The memory is organized as:

262,144 bytes (8 bits each)

4 sectors (512 Kbits, 65536 bytes each)

1024 pages (256 bytes each) .

Each pag e can be individually programme d (bits are progra mmed from 1 to 0). The device is

Sector or Bulk Erasable (bits are erased from 0 to 1) but not Page Erasable.

Figure 6. Block Diagram

Table 3. Memory Organization

Sector Address Range

3 30000h 3FFFFh

2 20000h 2FFFFh

1 10000h 1FFFFh

0 00000h 0FFFFh

AI04079

HOLD

WControl Logic High Voltage

Generator

I/O Shift Register

Address Register

and Counter 256 Byte

Data Buffer

256 Bytes (Page Size)

X Decoder

Y Decoder

Status

00000h

10000h

20000h

30000h

3FFFFh

000FFh

Size of the

read-only

memory area

Instructions M25P20

16/55

6 Instructions

All instructions, addresses and data are sh ifted in and out of the device, most significant bit

first.

Serial Data In put (D) is sampled on the fir st rising ed ge of Seria l Clock (C) after Chip Select

(S) is driven Low. Then, the one-byte instructi on code must be sh if ted in to the device, m ost

significant bit first, on Serial Data Input (D), each bit being latched on the rising edges of

Serial Clock (C).

The instruction set is listed in Table 4.

Every instruction sequence starts with a one-byte instruction code. Depending on the

instruction, this might be followed by address bytes, or by data bytes, or by both or none.

Chip Select (S) must be driven High after the last bit of the ins tru ct ion seq ue n ce ha s be en

shifted in.

In the case of a Read Data Bytes (READ), Read Data Bytes at Higher Speed (Fast_Read),

Read Identification (RDID), Read Status Register (RDSR) or Release from Deep Power-

down, and Read Electronic Signature (RES) instruction, the shifted-in instruction sequence

is followed by a data-out sequence. Chip Select (S) can be driven High after any bit of the

data-out sequence is being shifted out.

In the case of a Page Program (PP), Sector Erase (SE), Bulk Erase (BE), Write Status

instruction, Chip Select (S) must be driven High exactly at a byte boundary, otherwise the

instruction is rejected, and is not executed. That is, Chip Select (S) must driven High when

the number of clock pu lse s after Chip Select ( S ) being driven Low is an exact multiple of

eight.

All attempts to access the memory array during a Write Status Register cycle, Program

cycle or Erase cycle are ignored, and the internal Write Status Register cycle, Program

cycle or Erase cycle continues unaffected.

M25P20 Instructions

17/55

6.1 Write Enable (WREN)

The Write Enable (WREN) instruction (Figure 7) sets the Write Enable Latch (WEL) bit.

The Write Enable Latch (WEL) bit must be set prior to every Page Program (PP), Sector

Erase (SE), Bulk Erase (BE) and Write Status Register (WRSR) instruction.

The Write Enable (WREN) instruction i s entered by driving Chip Select (S) Low , sending the

instruction code, and then driving Chip Select (S) High.

Figure 7. Write Enable (WREN) Instruction Sequence

Table 4. Instruction Set

Instruction Description One-byte Instruction

Code Address

Bytes Dummy

Bytes Data

Bytes

WREN Write Enable 0000 0110 06h 0 0 0

WRDI Write Disable 0000 0100 04h 0 0 0

RDID(1)

1. The Read Identification (RDID) instruction is available only in products with Process Technology code X

and 4 (see Application Note AN1995).

Read Identification 1001 1111 9Fh 0 0 1 to 3

RDSR Read Status Register 0000 0101 05h 0 0 1 to ∞

WRSR Write Status Register 0000 0001 01h 0 0 1

READ Read Data Bytes 0000 0011 03h 3 0 1 to ∞

FAST_READ Read Data Bytes at Higher

Speed 0000 1011 0Bh 3 1 1 to ∞

PP Page Program 0000 0010 02h 3 0 1 to 256

SE Sector Erase 1101 1000 D8h 3 0 0

BE Bulk Erase 1100 0111 C7h 0 0 0

DP Deep Power-down 1011 1001 B9h 0 0 0

RES

Release from Deep Power-

down, and Read Electronic

Signature 1010 1011 ABh 0 3 1 to ∞

Release from Deep Power-

down 0 0 0

AI02281E

21 34567

High Impedance

Instruction

Instructions M25P20

18/55

6.2 Write Disable (WRDI)

The Write Disable (WRDI) instruction (Figure 8) resets the Write Enable Latch (WEL) bit.

The Write Disable (WRDI) instruction is entered by driving Chip Select (S) Low, sending the

instruction code, and then driving Chip Select (S) High.

The Write Enable Latch (WEL) bit is reset under the following conditions:

Power-up

Write Disable (WRDI) instruction completion

Write Status Register (WRSR) instruction completion

Page Program (PP) instruction completion

Sector Erase (SE) instruction completion

Bulk Erase (BE) instruction completion

Figure 8. Write Disable (WRDI) Instruction Sequence

AI03750D

21 34567

High Impedance

Instruction

M25P20 Instructions

19/55

6.3 Read Identification (RDID)

The Read Identification (RDID) instruction allows to read the device identification data:

Manufacturer identification (1 byte)

Device identification (2 bytes)

A Unique ID code (UID) (17 bytes, of which 16 available upon customer request).(2)

The manufacturer ide ntificatio n is assigned by JEDEC, and has the value 20h for Numonyx.

The device identification is assigned by the device man ufacturer, and indicates the memory

type in the first byte (20h), and the memory capacity of the device in the second byte (12h).

The UID contains the length of the following data in the first byte (set to 10h), and 16 bytes

of the optional Customized Factory Data (CFD) content.

The CFD bytes are read-only and can be programmed with customers data upon their

demand. If the cust om e rs do not mak e re qu e sts, the device s ar e sh ipped wi th all the CFD

bytes programmed to zero (00h).

Any Read Identification (RDID) instruction while an Erase or Program cycle is in progress, is

not decoded, and has no effect on the cycle that is in progress. The device is first selected

by driving Chip Select (S) Low. Then, the 8-bit instruction code for the instruction is shifted

in. After this, the 24-bit device identification, stored in the memory, the 8-bit CFD length

followed by 16 bytes of CFD content will be shifted out on Serial Data output (Q). Each bit is

shifted out during the falling edge of Serial Clock (C).

The instruction sequence is shown in Figure 9.

The Read Identification (RDID) instr uction is terminated by driving Chip Select (S) High at

any time during data output.

When Chip Select (S) is driven High, the device is put in the S t and-by Power mode . Once in

the Stand-by Power mode, the device waits to be selected, so that it can receive, decode

and execute instructions.

2. The UID feature is available only for process technology T9HX devices, identified by with process identification

digit "4" in the device marking and process letter "B" in the par t number.

Table 5. Read Identification (RDID) data-out sequence

Manufacturer identification Device identification UID

Memory type Memory capacity CFD length CFD content

20h 20h 12h 10h 16 bytes

Instructions M25P20

20/55

Figure 9. Read Identification (RDID) Instruction Sequence and Data-Out Sequence

6.4 Read Status Register (RDSR)

The Read Status Register (RDSR) instruction allows the Status Register to be read. The

Status Register may be read at any time, even while a Program, Erase or Write Status

check the Write In Progress (WIP) bit before sending a new instruction to the device. It is

also possible to read th e Status Register continuo u sly, as shown in Figure 10.

The status and control bits of the Status Register are as follows:

6.4.1 WIP bit

The Write In Progress (WIP) bit indicates whether the memory is busy with a Write Status

0 no such cycle is in progress.

6.4.2 WEL bit

The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.

When set to 1 the internal Write Enable Latch is set, when set to 0 the internal Write Enable

Latch is reset and no Write Status Register, Program or Erase instruction is accepted.

21 3456789101112131415

Instruction

AI06809b

Manufacturer Identification

High Impedance

MSB

15 1413 3210

Device Identification

MSB

16 17 18 28 29 30 31

Table 6. Status Register Format

b7 b0

SRWD 0 0 0 BP1 BP0 WEL WIP

Status Register Write Protect

Block Protect Bits

Write Enable Latch Bit

Write In Progress Bit

M25P20 Instructions

21/55

6.4.3 BP1, BP0 bits

The Block Protect (BP1, BP0) bits are non-vola tile. They define the size of the area to be

software protected against Program and Erase instru ctions. These bits are written with the

Write Status Register (WRSR) instruction. When one or both of the Block Protect (BP1,

BP0) bits is set to 1, the relevant memory area (as defined in Table 2) becomes pr ot ected

against Page Program (PP) and Sector Erase (SE) instructions. The Block Protect (BP1,

BP0) bits can be written provided tha t the Hardware Protected mode has not been set. The

Bulk Erase (BE) instruction is executed if, and only if, both Block Protect (BP1, BP0) bits are

6.4.4 SRWD bit

The Status Register Write Disable (SRWD) bit is operated in conjunction with the Write

Protect (W) signal. The Status Register Write Disable (SRWD) bit and Write Protect (W)

signal allow the device to be put in the Hardware Protected mode (when the Status Register

Write Disable (SRWD) bit is se t to 1, and W rite Protect (W) is driven Lo w). In this mode , th e

non-volatile bits of the Status Register (SRWD, BP1, BP0) become read-only bits and the

Write Status Register (WRSR) instruction is no longer accepted for execution.

Figure 10. Read Status Register (RDSR) Instruction Sequence and Data-Out

Sequence

21 3456789101112131415

Instruction

AI02031E

Q76543210

Status Register Out

High Impedance

MSB

76543210

Status Register Out

MSB

Instructions M25P20

22/55

6.5 Write Status Register (WRSR)

The Write Status Register (WRSR) instruction allows new values to be written to the Status

have been executed. After the Write Enable (WREN) instruction has been decoded and

executed, the device sets the Write Enable Latch (WEL).

The Write Status Register (WRSR) instruction is entered by driving Chip Select (S) Low,

followed by the instruction code and the data byte on Serial Data Input (D).

The instruction sequence is shown in Figure 11.

The Write Status Register (WRSR) instruction has no effect on b6, b5, b4, b1 and b0 of the

Status Register. b6, b5 and b4 are always read as 0.

Chip Select (S) must be driven High after the eighth bi t of the dat a byte has been latched in.

If not, the Write S tatus Register (WRSR) instruction is not executed. As soon as Chip Select

(S) is driven High, the self-timed Wr ite Status Register cycle (whose duration is tW) is

initiated. While the Write Status Register cycle is in progress, the Status Register may still

be read to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP)

bit is 1 during the self-timed Write Status Register cycle, and is 0 when it is completed. At

some unspecified time before the cycle is completed, the Wr ite Enable Latch (WEL) is reset.

The Write Status Register (WRSR) instruction allows the user to change the values of the

Block Protect (BP1, BP0) bits, to define the size of the area that is to be treated as read-

only, as define d in Table 2. The Write Status Regis ter (WRSR ) inst ru ctio n also allows th e

user to set or reset the Status Register Write Disable (SRWD) bit in accordance with the

Write Protect (W) signal. The Status Register Write Disable (SRWD) bit and Write Protect

(W) signal allow the device to be put in the Hardware Protected Mode (HPM). The Write

Status Register (WRSR) instruction is not executed once the Hardware Protected Mode

(HPM) is entered.

Figure 11. Write Status Register (WRSR) Instruction Sequence

AI02282D

21 3456789101112131415

High Impedance

Instruction Status

765432 0

MSB

M25P20 Instructions

23/55

The protection features of the de vice are summarized in Table 7.

When the Status Register Write Disable (SRWD) bit of the Status Register is 0 (its initial

delivery state), it is possible to write to the Status Register provided that the Write Enable

Latch (WEL) bit has previo usly been set by a Write Enable (WREN) instruction, regardless

of the whether Write Protect ( W) is driven High or Low.

When the Status Register Write Disable (SRWD) bit of the Status Register is set to 1, two

cases need to be considered, depending on the state of Write Protect (W):

If Write Protect (W) is driven High, it is possible to write to the Status Register provided

that the Write Enable Latch (WEL) bit has previously been set by a Write Enable

(WREN) instruction.

If Write Protect (W) is driven Low, it is not possible to write to the Status Register even

if the Write Ena ble Latch (WEL) bit has prev iously been set by a W rite Enable (WREN)

instruction. (Attempts to write to the Status Register are rejected, and are not accepted

for execution). As a consequence, all the data bytes in the memory area that are

software protected (SPM) by the Block Protect (BP1, BP0) bits of the Status Register,

are also hardware protected against data modification.

Regardless of the order of the two events, the Hardware Protected Mode (HPM) can be

entered:

by setting the Status Register Write Disable (SRWD) bit after driving Write Protect (W)

Low

or by driving Write Protect (W) Low after setting the Status Register Write Disable

(SRWD) bit.

The only way to exit the Hardware Protected Mode (HPM) once entered is to pull Write

Protect (W) High.

If Write Protect (W) is permanently tied High, the Hardware Protected Mode (HPM) can

never be activat ed , an d on ly the Software Protected Mode (SPM), using the Block Protect

(BP1, BP0) bits of the Status Register, can be used.

Table 7. Protection Modes

Signal SRWD

Bit Mode Write Protection of the

Status Register

Memory Content

Protected Area(1)

1. As defined by the values in the Block Protect (BP1, BP0) bits of the Status Register, as shown in Table 2.

Unprotected

Area(1)

Software

Protected

(SPM)

S tatus Register is Writable

(if the WREN instruction

has set the WEL bit)

The values in the SRWD,

BP1 and BP0 bit s ca n be

changed

Protected against

Page Program,

Sector Erase and

Bulk Erase

Ready to accept

Page Program and

Sector Erase

instructions

Hardware

Protected

(HPM)

Status Register is

Hardware write protected

The values in the SRWD,

BP1 and BP0 bits cannot

be changed

Protected against

Page Program,

Sector Erase and

Bulk Erase

Ready to accept

Page Program and

Sector Erase

instructions

Instructions M25P20

24/55

6.6 Read Data Bytes (READ)

The device is first selected by driving Chip Select (S) Low . The instruction code for the Read

Data Bytes (READ) instruction is followed b y a 3- byte address (A23-A0), each bit being

latched-in during the rising edge of Serial Clock (C). Then the memory contents, at that

address, is shifted out on Serial Data Output (Q), each bit being shifted out, at a maximum

frequency fR, during the falling edge of Serial Clock (C).

The instruction sequence is shown in Figure 12.

The first byte addressed can be at any location. The address is automatically incremented

to the next higher address after each byte of data is shifted out. The whole memory can,

therefore, be read with a single Read Data Bytes (READ) instruction. When the highest

address is reached, the address counter rolls over to 000000h, allowing the read sequence

to be continued indefinitely.

The Read Data Bytes (READ) instruction is terminated by driving Chip Select (S) High. Chip

Select (S) can be driven High at any time during dat a outp ut. Any Read Dat a Bytes (READ)

instruction, while an Erase, Program or Write cycle is in progress, is rejecte d without havi ng

any effects on the cycle that is in progress.

Figure 12. Read Data Bytes (READ) instruction sequence and data-out sequence

1. Address bits A23 to A18 are Don’t Care.

AI03748

21 345678910 2829303132333435

2221 3210

36 37 38

76543 1 7

High Impedance Data Out 1

Instruction 24-Bit Address

MSB

M25P20 Instructions

25/55

6.7 Read Data Bytes at Higher Speed (FAST_READ)

The device is first selected by driving Chip Select (S) Low . The instruction code for the Read

Data Bytes at Higher S peed (FAST_READ) instruction is followed by a 3-byte address (A23-

A0) and a dummy byte, each bit being latched-in during the rising edge of Serial Clock (C).

Then the memory contents, at that address, is shifted out on Serial Data Output (Q), each

bit being shifted out, at a maximum frequency fC, during the falling edge of Serial Clock (C).

The instruction sequence is shown in Figure 13.

The first byte addressed can be at any location. The address is automatically incremented

to the next higher address after each byte of data is shifted out. The whole memory can,

therefore, be read wi th a single Read Data Bytes at Higher Speed (FAST_READ)

instruction. When the highest address is reached, the address counter rolls over to

000000h, allowing the read sequence to be continued indefinitely.

The Read Data Bytes at Higher Speed (FAST_READ) instruction is terminated by driving

Chip Select (S) High. Chip Select (S) can be driven High at any time d uring dat a output. Any

Read Data Bytes at Higher Speed (FAST_READ) instruction, while an Erase, Program or

Write cycle is in progress, is rejected without having any effects on the cycle that is in

progress.

Figure 13. Read Data Bytes at Higher Speed (FAST_READ) Instruction Sequence

and Data-Out Sequence

1. Address bits A23 to A18 are Don’t Care.

AI04006

21 345678910 28293031

2221 3210

High Impedance

Instruction 24 BIT ADDRESS

32 33 34 36 37 38 39 40 41 42 43 44 45 46

765432 0

DATA OUT 1

Dummy Byte

MSB

76543210

DATA OUT 2

MSB MSB

765432 0

Instructions M25P20

26/55

6.8 Page Program (PP)

The Page Program (PP) instruction allows bytes to be programmed in the memory

(changing bits from 1 to 0). Befo re it can be acce p ted , a Write Enable (WREN) instruction

must previously have been executed. After the Write Enable (WREN) instruction has been

decoded, the device sets the Write Enable Latch (WEL).

The Page Program (PP) instruction is entered by driving Chip Select (S) Low, followed by

the instruction code, th ree address bytes and at least one data byte on Serial Data Input (D) .

If the 8 least significant ad dr ess bits (A7-A0) are not all zero, all tran sm itt ed data that goes

beyond the end of the current page are programmed from the start address of the same

page (from the ad dress whose 8 least significant bits (A7-A0) are all zero). Chip Select (S)

must be driven Low for the entire duration of the sequence.

The instruction sequence is shown in Figure 14.

If more than 25 6 bytes are sent to the device, previo usly latched dat a are d iscarded and the

last 256 dat a bytes are guaranteed to be programmed correctly within the same page. If less

than 256 Data bytes are sent to device, they are correctly programmed at the requested

addresses without having any effects on the other bytes of the same page.

For optimized timings, it is recommended to use the Page Program (PP) instruction to

program all consecutive targeted Bytes in a single sequence versus u sing several Page

Program (PP) sequences with each containing only a few Bytes (see Instruction Times,

process technology T9HX (Device Grade 6) and Table 17: Instruction Times (Device Grade

3)).

Chip Select (S) must be driven High after the eighth bit of the last data byte has be en

latched in, otherwise the Page Program (PP) instruction is not executed.

As soon as Chip Select (S) is driven High, the self-timed Page Program cycle (whose

duration is tPP) is initiated. While the Page Progr am cycle is in progress, the S tatus Register

may be read to check the value of the Write In Progress (WIP) bit. T h e Write In Progress

(WIP) bit is 1 during the self -t im e d Pa ge Prog ra m cycle, and is 0 when it is completed. At

some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is

reset.

A Page Program (PP) instruction applied to a page which is protected by the Block Protect

(BP1, BP0) bits (see Table 3 and Table 2) is not executed.

M25P20 Instructions

27/55

Figure 14. Page Program (PP) Instruction Sequence

1. Address bits A23 to A18 are Don’t Care.

AI04082B

4241 43 44 45 46 47 48 49 50 52 53 54 5540

21 345678910 2829303132333435

2221 3210

36 37 38

Instruction 24-Bit Address

765432 0

Data Byte 1

765432 0

Data Byte 2

765432 0

Data Byte 3 Data Byte 256

2079

2078

2077

2076

2075

2074

2073

765432 0

2072

MSB MSB

MSB MSB MSB

Instructions M25P20

28/55

6.9 Sector Erase (SE)

The Sector Erase (SE) instruction sets to 1 (FFh) all bits inside the chosen sector. Before it

can be accepted, a Write Enable (WREN) instru ction must previously have been executed.

After the Write Enable (WREN) instruction has been decod ed, the device sets the Write

Enable Latch (WEL).

The Sector Erase (SE) instruction is entered by driving Chip Select (S) Low, followed by the

instruction code, and three address bytes on Serial Data Input (D). Any address inside the

Sector (see Table 3) is a valid address for the Sector Erase (SE) instruction. Chip Select (S)

must be driven Low for the entire duration of the sequence.

The instruction sequence is shown in Figure 15.

Chip Select (S) must be driven High after the eighth bit of the last addre ss by te ha s be en

latched in, otherwise the Sector Erase (SE) instruction is not executed. As soon as Chip

Select (S) is driven High, the self-timed Sector Erase cycle (whose duration is tSE) is

initiated. While the Sector Erase cycle is in progress, the Status Register may be read to

check the value of the Write In Progr ess (WIP) bit. The Write In Progress (WIP) bit is 1

during the self-timed Sector Erase cycle , and is 0 when it is completed. At some unspecified

time before the cycle is completed, the W rite Enable Latch (WEL) bit is reset.

A Sector Erase (SE) instruction applied to a page which is protected by the Block Protect

(BP1, BP0) bits (see Table 3 and Table 2) is not executed.

Figure 15. Sector Erase (SE) Instruction Sequence

1. Address bits A23 to A18 are Don’t Care.

24 Bit Address

AI03751D

21 3456789 293031

Instruction

23 22 2 0

MSB

M25P20 Instructions

29/55

6.10 Bulk Erase (BE)

The Bulk Erase (BE) instruction sets all bits to 1 (FFh). Before it can be accepted, a Write

Enable (WREN) instruction must previously have been executed. After the Write Enable

(WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).

The Bulk Erase (BE) instruction is entered by driving Chip Select (S) Low, followed by the

instruction code on Serial Data Input (D). Chip Select (S) must be driven Low for the entire

duration of the sequence.

The instruction sequence is shown in Figure 16.

Chip Select (S) must be driven High after the eighth bit of the instruction code has been

latched in, otherwise the Bulk Erase instructio n is not executed. As soon as Chip Select (S)

is driven High, the self-timed Bulk Erase cycle (whose duration is tBE) is initiated. While the

Bulk Erase cycle is in progress, the Status Register may be read to check the value of the

Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Bulk

Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is

completed, the Write Enable Latch (W EL) bit is res et .

The Bulk Erase (BE) instruction is executed only if both Block Protect (BP1, BP0) bits are 0.

The Bulk Erase (BE) instruction is ignored if one, or more, sectors are protected.

Figure 16. Bulk Erase (BE) Instruction Sequence

AI03752D

21 345670

Instruction

Instructions M25P20

30/55

6.11 Deep Power-down (DP)

Executing the Deep Power-down (DP) instruction is the only way to put the device in the

lowest consumption mode (the Deep Power-down mode). It can also be used as an extra

software protection mechanism, while the device is not in active use, since in this mode, th e

device ignores all Write, Program and Erase instructions.

Driving Chip Select (S) High deselects the device, and put s th e device in the Standby mode

(if there is no internal cycle currently in progress). But this mode is not the Deep Power-

down mode. The Deep Power-down mode can only be entered by executing the Deep

Power-down (DP) instruction, su bsequently redu cing the st andby current (fro m ICC1 to ICC2,

as specified in Table 13).

Once the device has entered the Deep Power-down mode, all instructions are ignored

except the Release from Deep Power-down and Read Electronic Signature (RES)

instruction. This releases the device from this mode.

The Release from Deep Power-down and Read Electronic Signature (RES) instruction and

the Read Identification (RDID) instruction also allow the Electronic Signature of the device

to be output on Serial Data Output (Q).

The Deep Power-down mode automatically stops at Power-down, and the device always

Powers-up in the Standby mode.

The Deep Power-down (DP) instruction is entered by driving Chip Select (S) Low, followed

by the instruction code on Serial Data Input (D). Chip Select (S) must be driven Low for the

entire duration of the sequence.

The instruction sequence is shown in Figure 17.

Chip Select (S) must be driven High after the eighth bit of the instruction code has been

latched in, otherwise th e Deep Power-down (DP) instruction is not executed. As soon as

Chip Select (S) is driven High, it requires a delay of tDP before the supp ly curren t is reduced

to ICC2 and the Deep Power-down mode is entered.

Any Deep Power-down (DP) instruction, while an Erase, Program or Write cycle is in

progress, is rejected without having any effects on the cycle that is in progress.

Figure 17. Deep Power-down (DP) Instruction Sequence

AI03753D

21 345670t

Deep Power-down Mode

Stand-by Mode

Instruction

M25P20 Instructions

31/55

6.12 Release from Deep Power-down and Read Electronic

Signature (RES)

Once the device has entered the Deep Power-down mode, all instructions are ignored

except the Release from Deep Power-down and Read Electronic Signature (RES)

instruction. Executing this instruction takes the device out of the Deep Power-down mode.

The instruction can also be used to read, on Serial Data Output (Q), the 8-bit Electronic

Signature, whose value for the M25P20 is 11h.

Except while an Erase, Program or Write Status Register cycle is in progress, the Release

from Deep Power-down and Read Electronic Signature (RES) instruction always provides

access to the 8-bit Electronic Signature of the device, and can be applied even if the Deep

Power-down mode has not been entered.

Any Release from Deep Power-down and Re ad Electronic Signature (RES) instruction while

an Erase, Program or Wr ite Status Register cycle is in progress, is not deco ded, and has no

effect on the cycle that is in progress.

The device is first selected by driving Chip Select (S) Low. The instruction code is followed

by 3 dummy bytes, each bit being latched-in on Serial Data Input (D) during the rising edge

of Serial Clock (C). Then, the 8- bit Electronic Signature , stored in the me mory, is shifted out

on Serial Data Output (Q), each bit being shifted out during the falling edge of Serial Clock

(C).

The instruction sequence is shown in Figure 18.

The Release from Deep Power-down and Read Electronic Signature (RES) instruction is

terminated by driving Chip Select (S) High after the Electronic Signature has been read at

least once. Sending additional clock cycles on Serial Clock (C), while Chip Select (S) is

driven Low, cause the Electronic Signature to be output repeatedly.

When Chip Select (S) is driven High, the device is put in the Standby Power mode. If the

device was not previously in the Deep Power-down mode, the transition to the Standby

Power mode is immediate. If the device was previously in the Deep Power-down mode,

though, the transition to the Standby Power mode is delayed by tRES2, and Chip Select (S)

must remain High for at least tRES2(max), as specified in Table 19. Once in the Standby

Power mode, the device waits to be selected, so that it can receive, decode and execute

instructions.

Instructions M25P20

32/55

Figure 18. Release from Deep Power-down and Read Electronic Signature (RES) Instruction

Sequence and Data-Out Sequence

1. The value of the 8-bit Electronic Signature, for the M25P20, is 11h.

Figure 19. Release from Deep Power-down (RES) Instruction Sequence

Driving Chip Select (S) High af ter the 8-bit instruction byte h as been received by the de vice,

but before the whole of the 8-bit Electronic Signature has been transmitted for the first time

(as shown in Figure 19), still ensures that the device is put into Standby Power mode. If the

device was not previously in the Deep Power-down mode, the transition to the Standby

Power mode is immediate. If the device was previously in the Deep Power-down mode,

though, the transition to the Standby Power mode is delayed by tRES1, and Chip Select (S)

must remain High for at least tRES1(max), as specified in Table 19. Once in the Standby

Power mode, the device waits to be selected, so that it can receive, decode and execute

instructions.

AI04047C

21 345678910 2829303132333435

2221 3210

36 37 38

765432 0

High Impedance Electronic Signature Out

Instruction 3 Dummy Bytes

MSB

Stand-by Mode

Deep Power-down Mode

MSB

tRES2

AI04078B

21 345670tRES1

Stand-by Mode

Deep Power-down Mode

QHigh Impedance

Instruction

M25P20 Power-up and Power-down

33/55

7 Power-up and Power-down

At Power-up and Power-do wn, the device must not be selecte d (that is Chip Select (S) must

follow the voltage applied on VCC) until VCC reaches the correct value:

VCC(min) at Power-up, and then for a further delay of tVSL

VSS at Power-down

Usually a simple pull-up resistor on Chip Select (S) can be used to ensure safe and proper

Power-up and Power-down.

To avoid data corruption and inadvertent write operations during power up, a Power On

Reset (POR) circuit is included. The logic inside the device is held reset while VCC is less

than the Power On Reset (POR) threshold voltage, VWI – all operations are disabled, and

the device does not respond to any instruction.

Moreover, the device ignores all Write Enable (WREN), Page Program (PP), Sector Erase

(SE), Bulk Erase (BE) and W rite Status Register (WRSR) instructions until a time delay of

tPUW has elapsed after the moment that VCC rises above th e VWI threshold. However, the

correct operation of the de vice is not guaran teed if, by this time , VCC is still below VCC(min).

No Write Status Register, Program or Erase instructions should be sent until the later of:

tPUW after VCC passed the VWI threshold

tVSL after VCC passed the VCC(min) level

These values are sp ec ified in Table 8.

If the delay, tVSL, has elapsed, after VCC has risen above VCC(min), the device can be

selected for READ instructions even if the tPUW delay is not yet fully elapsed.

At Power-up, the device is in the following state:

The device is in the Standby mode (not the Deep Power-down mode).

The Write Enable Latch (WEL) bit is reset.

Normal precautions must be taken for supply rail decoupling, to stabilize the VCC supply.

Each device in a system should have the VCC rail decoupled by a suit able capacitor close to

the package pins. (Generally, this capacitor is of the order of 0.1µF).

At Power-down, when VCC drops from the operating voltage, to below the Power On Reset

(POR) threshold voltage, VWI, all operations are disabled and the device does not respond

to any instruction. (The designer needs to be aware that if a Power-down occurs while a

Write, Program or Erase cycle is in progress, some data corruption can result.)

Power-up and Power-down M25P20

34/55

Figure 20. Power-up Ti ming

Table 8. Power-Up Timing and VWI Threshold

Symbol Parameter Min. Max. Unit

tVSL(1)

1. These parameters are characterized only.

VCC(min) to S low 10 µs

tPUW(1) Time delay to Write instruction 1 10 ms

VWI(1) Write Inhibit Voltage (Device grade 6) 1.0 2.1 V

Write Inhibit Voltage (Device grade 3) 1.0 2.1 V

VCC

AI04009C

VCC(min)

VWI

Reset State

of the

Device

Chip Selection Not Allowed

Program, Erase and Write Commands are Rejected by the Device

tVSL

tPUW

time

Read Access allowed Device fully

accessible

VCC(max)

M25P20 Initial delivery state

35/55

8 Initial delivery state

The device is delivered with the memory array erased: all bits are set to 1 (each byte

contains FFh). The Status Register contains 00h (all Status Register bits are 0).

9 Maximum rating

Stressing the device above the r ating listed in the Absolute Maximum Ratings" table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any ot he r co nd itio ns abo ve tho se ind i ca te d in th e Op er at ing sec tion s of

this specification is not implied. Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability. Refer also to the Numonyx SURE Program

and other relevant quality documents.

Table 9. Absolute maximum ratings

Symbol Parameter Min. Max. Unit

TSTG Storage temperature –65 150 °C

TLEAD Lead te mp erature during solderin g see (1)

1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the Numonyx

ECOPACK® 7191395 specification, and the European directive on Restrictions on Hazardous Substances

(RoHS) 2002/95/EU.

°C

VIO Input and output voltage (with respect to Ground)(2)

2. The minimum voltage may reach the value of -2 V for no more than 20 ns during transitions; The maximum

voltage may reach the value of VCC+2 V for no more than 20 ns during transitions..

–0.6 VCC +

0.6 V

VCC Supply voltage –0.6 4.0 V

VESD Electrostatic Discharge voltage (Human Body model)(3)

3. JEDEC Std JESD22-A114A (C1 = 100 pF, R1 = 1500 Ω, R2 = 500 Ω).

–2000 2000 V

DC and AC parameters M25P20

36/55

10 DC and AC parameters

This section summarizes the operating and measurement conditions, and the DC and AC

characteristics of the device. The parameters in the DC and AC Characteristic tables that

follow are derived from tests performed under the Measurement Conditions summarized in

the relevant tables. Designers should check that the operating conditions in their circuit

match the measurement conditions when relying on the quoted parameters.

The operation at Vcc = 2.3 V is available only for pro cess technology T9HX devices,

identified by with process identification digit "4" in the d evice ma rking an d pr ocess letter "B"

in the part number, for the other devices the minimum Supply Voltage is 2.7 V.

1. Sampled only, not 100% tested, at TA=25°C and a frequency of 20MHz.

Table 10. Operating Conditions

Symbol Parameter Min. Max. Unit

VCC Supply Voltage 2.3(1)

1. The operation at Vcc = 2.3 V is available only for process technology T9HX devices, identified by process

identification digit "4" in the device marking and process letter "B" in the part number; for the other devices,

the minimum Supply Voltage is 2.7 V.

3.6 V

TAAmbient Operating Temperature (Device Grade 6) –40 85 °C

Ambient Operating Temperature (Device Grade 3) –40 125

Table 11. Data Retention and Endurance

Parameter Condition Min. Max. Unit

Erase/Program

Cycles Device Grade 6 100,000 cycles per

sector

Device Grade 3 10,000

Data Retention a t 55°C 20 years

Table 12. Capacitance

Symbol Parameter Test Condition Min. Max. Unit

COUT Output Capacitance (Q) VOUT = 0V 8 pF

CIN Input Capacitance (other pins) VIN = 0V 6 pF

M25P20 DC and AC parameters

37/55

Table 13. DC Characteristics (Device Grade 6)

Symbol Parameter T est Condition (in addition to

those in Table 10)Min. Max. Unit

ILI Input Leakage Current ± 2 µA

ILO Output Leakage

Current ± 2 µA

ICC1, Grade 6 Standby Current S = VCC, VIN = VSS or VCC 50 µA

ICC1, Grade 3 100

ICC2, Grade 6 Deep Power-down

Current S = VCC, VIN = VSS or VCC 5µA

ICC2, Grade 3 50

ICC3 Operating Current

(READ)

C = 0.1VCC / 0.9.VCC at

40MHz and 75 MHz, Q = open 8mA

C = 0.1VCC / 0.9.VCC at

20MHz, Q = open 4mA

ICC4 Operating Current

(PP) S = VCC 15 mA

ICC5 Operating Current

(WRSR) S = VCC 15 mA

ICC6 Operating Current

(SE) S = VCC 15 mA

ICC7 Operating Current

(BE) S = VCC 15 mA

VIL Input Low Voltage – 0.5 0.3VCC V

VIH Input High Voltage 0.7VCC VCC+0.4 V

VOL Output Low Voltage IOL = 1.6 mA 0.4 V

VOH Output High Voltage IOH = –100 μAV

CC–0.2 V

DC and AC parameters M25P20

38/55

2. This is preliminary data

, Pro

Table 14. DC Characteristics (Device Grade 3)

Symbol Parameter Test Condition (in addition to

those in Table 10)Min.(1) Max.(1) Unit

ILI Input Leakage Current ± 2 µA

ILO Output Leakage Current ± 2 µA

ICC1 Standby Current S = VCC, VIN = VSS or VCC 100 µA

ICC2 Deep Power-down Current S = VCC, VIN = VSS or VCC 50 µA

ICC3 Operating Current (READ)

C = 0.1VCC / 0.9.VCC at 25MHz,

Q = open 8mA

C = 0.1VCC / 0.9.VCC at 20MHz,

Q = open 4mA

ICC4 Operating Current (PP) S = VCC 15 mA

ICC5 Operating Current (WRSR) S = VCC 15 mA

ICC6 Operating Current (SE) S = VCC 15 mA

ICC7 Operating Current (BE) S = VCC 15 mA

VIL Input Low V oltage – 0.5 0.3VCC V

VIH Input High Voltage 0.7VCC VCC+0.4 V

VOL Output Low Voltage IOL = 1.6 mA 0.4 V

VOH Output High Voltage IOH = –100 μAVCC–

0.2 V

Table 15. Instruction Times, process technology T9HX(1) (Device Grade 6)

1. Technology T9HX devices are identified by process identification digit "4" in the device marking and

process letter "B" in the part number.

Test cond itions specified in Table 10 and Table 18

Symbol Alt. Parameter Min. Typ. Max. Unit

tWWrite Status Register Cycle Time 1.3 15 ms

tPP(2)

2. When using the Page Program (PP) instruction to program consecutive Bytes, optimized timings are

obtained with one sequence including all Bytes, not several sequences of only a few Bytes (1 ≤ n ≤ 256).

Page Program Cycle Time (256 Bytes) 0.8 5ms

Page Program Cycle Time (n Bytes) int(n/8) × 0. 025

tSE Sector Erase Cycle Time 0.6 3 s

tBE Bulk Erase Cycle Time 2.5 6 s

Table 16. Instruction Times, process technology T7Y, Device Grade 6(1)

1. Technology T7Y devices are identified by process identification digit "X" in the device marking.

Test cond itions specified in Table 10 and Table 18

Symbol Alt. Parameter Min. Typ. Max. Unit

tWWrite Status Register Cycle Time 5 15 ms

M25P20 DC and AC parameters

39/55

1. Output Hi-Z is defined as the point where data out is no longer driven.

Figure 21. AC Measurement I/O Waveform

Table 17. Instruction Times (Device Grade 3)

Test cond itions specified in Table 10 and Table 18

Symbol Alt. Parameter Min. Typ(1) (2)

1. At 85°C

2. Preliminary data.

Max(2) Unit

tWWrite Status Register Cycle Time 8 15 ms

tPP(3)

3. When using the Page Program (PP) instruction to program consecutive Bytes, optimized timings are

obtained with one sequence including all the Bytes versus several sequences of only a few Bytes. (1 ≤ n ≤

256)

Page Program Cycle Time (256 Bytes) 1.5 5ms

Page Program Cycle Time (n Bytes) 0.4+

n*1.1/256

tSE Sector Erase Cycle Time 1 3 s

tBE Bulk Erase Cycle Time 2.8 6 s

Table 18. AC Measurement Conditions

Symbol Parameter Min. Max. Unit

CLLoad Capacitance 30 pF

Input Rise and Fall Times 5 ns

Input Pulse Voltages 0.2VCC to 0.8VCC V

Input Timing Reference Voltages 0.3VCC to 0.7VCC V

Output Timing Reference Voltages VCC / 2 V

AI07455

0.8VCC

0.2VCC

0.7VCC

0.3VCC

Input and Outpu

Timing Reference Level

Input Levels

0.5VCC

DC and AC parameters M25P20

40/55

Table 19. AC Characteristics (25MHz Operation, Device Grade 6 or 3)

Test conditions specified in Table 10 and Table 18

Symbol Alt. Parameter Min. Typ. Max. Unit

fCfC

Clock Frequency for the following

instructions: FAST_READ, PP, SE, BE,

DP, RES, WREN, WRDI, RDSR, WRSR D.C. 25 MHz

fRClock Frequency for READ instructions D.C. 20 MHz

tCH(1)

1. tCH + tCL must be greater than or equal to 1/ fC

tCLH Clock High Time 18 ns

tCL(1) tCLL Clock Low Time 18 ns

tCLCH(2)

2. Value guaranteed by characterization, not 100% tested in production.

Clock Rise T i me(3) (peak to peak)

3. Expressed as a slew-rate.

0.1 V/ns

tCHCL(2) Clock Fall Time(3) (peak to peak) 0.1 V/ns

tSLCH tCSS S Active Setup Time (relative to C) 10 ns

tCHSL S Not Active Hold Time (relative to C) 10 ns

tDVCH tDSU Data In Setup Time 5 ns

tCHDX tDH Data In Hold Time 5 ns

tCHSH S Active Hold Time (relative to C) 10 ns

tSHCH S Not Active Setup Time (relative to C) 10 ns

tSHSL tCSH S Deselect Time 100 ns

tSHQZ(2) tDIS Output Disable Time 15 ns

tCLQV tVClock Low to Output Valid 15 ns

tCLQX tHO Output Hold Time 0 ns

tHLCH HOLD Setup Time (relative to C) 10 ns

tCHHH HOLD Hold Time (relative to C) 10 ns

tHHCH HOLD Setup Time (relative to C) 10 ns

tCHHL HOLD Hold Time (relative to C) 10 ns

tHHQX(2) tLZ HOLD to Output Low-Z 15 ns

tHLQZ(2) tHZ HOLD to Output High-Z 20 ns

tWHSL(4)

4. Only applicable as a constraint for a WRSR instruction when SRWD is set at 1.

Write Protect Setup Time 20 ns

tSHWL(4) Write Protect Hold Time 100 ns

tDP(2) S High to Deep Power-down Mode 3 µs

tRES1(2) S High to Standby Mode without

Electronic Signature Read 3 or 30(5)

5. It is 30µs in devices produced with the “X” process technology (grade 3 devices are only produced using

the “X” process technology). Details of how to find the process letter on the device marking are given in the

Application note AN1995.

µs

tRES2(2) S High to Standby Mode with Electronic

Signature Read 1.8 or 30(5) µs

M25P20 DC and AC parameters

41/55

Table 20. AC Characteristics (40MHz Operation, Device Grade 6)(1)

1. 40MHz is the maximum frequency for T9HX device operation in the extended Vcc range 2.3 V to 2.7 V.

40MHz available for products marked since week 20 of 2004, only(2)

Test conditions specified in Table 10 and Table 18

2. Details of how to find the date of marking are given in Application Note, AN1995.

Symbol Alt. Parameter Min. Typ. Max. Unit

fCfC

Clock Frequency for the following

instructions: FAST_READ, PP, SE, BE,

DP, RES, WREN, WRDI, RDSR, WRSR D.C. 40 MHz

fRClock Frequency for READ instructions D.C. 20 MHz

tCH (3)

3. tCH + tCL must be greater than or equal to 1/ fC

tCLH Clock High Time 11 ns

tCL(3) tCLL Clock Low Time 11 ns

tCLCH(4)

4. Value guaranteed by characterization, not 100% tested in production.

Clock Rise Time(5) (peak to peak)

5. Expressed as a slew-rate.

0.1 V/ns

tCHCL(4) Clock Fall Time(5) (peak to peak) 0.1 V/ns

tSLCH tCSS S Active Setup Time (relative to C) 5 ns

tCHSL S Not Active Hold Time (relative to C) 5 ns

tDVCH tDSU Data In Setup Time 2 ns

tCHDX tDH Data In Hold Time 5 ns

tCHSH S Active Hold Time (relative to C) 5 ns

tSHCH S Not Active Setup Time (relative to C) 5 ns

tSHSL tCSH S Deselect Time 100 ns

tSHQZ(4) tDIS Output Disable Time 9 ns

tCLQV tVClock Low to Output Valid 9 ns

tCLQX tHO Output Hold Time 0 ns

tHLCH HOLD Setup Time (relative to C) 5 ns

tCHHH HOLD Hold Time (relative to C) 5 ns

tHHCH HOLD Setup Time (relative to C) 5 ns

tCHHL HOLD Hold Time (relative to C) 5 ns

tHHQX(4) tLZ HOLD to Output Low-Z 9 ns

tHLQZ(4) tHZ HOLD to Output High-Z 9 ns

tWHSL(6)

6. Only applicable as a constraint for a WRSR instruction when SRWD is set at 1.

Write Protect Setup Time 20 ns

tSHWL(6) Write Protect Hold Time 100 ns

tDP(4) S High to Deep Power-down Mode 3 μs

tRES1(4) S High to Standby Mode without

Electronic Signature Read 3 or 30(7) μs

tRES2(4) S High to Standby Mode with Electronic

Signature Read 1.8 or 30(7) μs

DC and AC parameters M25P20

42/55

7. It is 30µs in devices produced with the “X” process technology. Details of how to find the process letter on

the device marking are given in the Application note AN1995.

Table 21. AC Characteristics (50MHz Operation, Device Grade 6)(1)

1. 50 MHz operation is available only on the VCC range 2.7 V to 3.6 V; the maximu m frequency in the

extended Vcc range 2.3 V to 2.7 V is 40 MHz.

50MHz available only in product s with Process Technology code X(2) and 4

Test conditions specified in Table 10 and Table 18

2. Details of how to find the date of marking are given in Application Note, AN1995.

Symbol Alt. Parameter Min. Typ. Max. Unit

fCfC

Clock Frequency for the following

instructions: FAST_READ, PP, SE, BE, DP,

RES, WREN, RDID, WRDI, RDSR, WRSR D.C. 50 MHz

fRClock Frequency for READ instructions D.C. 20 MHz

tCH(3) tCLH Clock High Time 9 ns

tCL(3) tCLL Clock Low Time 9 ns

tCLCH(4) Clock Rise T ime (5) (peak to peak) 0.1 V/ns

tCHCL(4) Clock Fall Time(5) (peak to peak) 0.1 V/ns

tSLCH tCSS S Active Setup Time (relative to C) 5 ns

tCHSL S Not Active Hold Time (relative to C) 5 ns

tDVCH tDSU Data In Setup Time 2 ns

tCHDX tDH Data In Hold Time 5 ns

tCHSH S Active Hold Time (relative to C) 5 ns

tSHCH S Not Active Setup Time (relative to C) 5 ns

tSHSL tCSH S Deselect Time 100 ns

tSHQZ(4) tDIS Output Disable Time 8 ns

tCLQV tVClock Low to Output Valid 8 ns

tCLQX tHO Output Hold Time 0 ns

tHLCH HOLD Setup Time (relative to C) 5 ns

tCHHH HOLD Hold Time (relative to C) 5 ns

tHHCH HOLD Setup Time (relative to C) 5 ns

tCHHL HOLD Hold Time (relative to C) 5 ns

tHHQX(4) tLZ HOLD to Output Low-Z 8 ns

tHLQZ(4) tHZ HOLD to Output High-Z 8 ns

tWHSL(6) Write Protect Setup Time 20 ns

tSHWL(6) Write Protect Hold Time 100 ns

tDP(4) S High to Deep Power-down Mode 3 μs

tRES1(4) S High to Standby Power mode without

Electronic Signature Read 30 μs

tRES2(4) S High to Standby Power mode with

Electronic Signature Read 30 μs

M25P20 DC and AC parameters

43/55

3. tCH + tCL must be greater than or equal to 1/ fC

4. Value guaranteed by characterization, not 100% tested in production.

5. Expressed as a slew-rate.

6. Only applicable as a constraint for a WRSR instruction when SRWD is set at 1.

Table 22. AC characteristics, grade 6 (T9HX technology), 75 MHz op eration, VCC min

= 2.7 V

Applies only to products made with T9HX technology, identified with process digit ‘4’(1) and

process letter “B” in the part number(2)

Test conditions sp e ci f ie d in Table 10 and Table 18

Symbol Alt. Parameter Min Typ(3) Max Unit

fCfC

Clock frequency for the following instructions:

FAST_READ, PP, SE, BE, DP, RES, WREN,

WRDI, RDID, RDSR, WRSR D.C. 75 MHz

fRClock frequency for READ instructions D.C. 33 MHz

tCH(4) tCLH Clock High time 6 ns

tCL(3) tCLL Clock Low time 6 ns

tCLCH(5) Clock Rise time(6) (peak to peak) 0.1 V/ns

tCHCL(5) Clock Fall time (6) (peak to peak) 0.1 V/ns

tSLCH tCSS S Active Setup time (relative to C) 5 ns

tCHSL S Not Active Hold time (relative to C) 5 ns

tDVCH tDSU Data In Setup time 2 ns

tCHDX tDH Data In Hold time 5 ns

tCHSH S Active Hold time (relative to C) 5 ns

tSHCH S Not Active Setup time (rela tive to C) 5 ns

tSHSL tCSH S Deselect time 1 00 ns

tSHQZ(5) tDIS Output Disable time 8 ns

tCLQV tVClock Low to Output Valid under 30 pF/10 pF 8/6 ns

tCLQX tHO Output Hold time 0 ns

tHLCH HOLD Setup time (relative to C) 5 ns

tCHHH HOLD Hold time (relative to C) 5 ns

tHHCH HOLD Setup time (relative to C) 5 ns

tCHHL HOLD Hold time (relative to C) 5 ns

tHHQX(5) tLZ HOLD to Output Low-Z 8 ns

tHLQZ(5) tHZ HOLD to Output High-Z 8 ns

tWHSL(7) Write Protect Setup time 20 ns

tSHWL(7) Write Protect Hold time 100 ns

tDP(5) S High to Deep Power-down mode 3 µs

DC and AC parameters M25P20

44/55

Figure 22. Serial Input Timing

tRES1(5) S High to Standby mode without Read Elec-

tronic Signature 30 µs

tRES2(5) S High to Standby mode with Read Electronic

Signature 30 µs

1. Details of how to find the technology process in the marking are given in AN1995, see also Section 12: Or-

dering Information, Standard Parts.

2. 75 MHz operation is available only on the VCC range 2.7 V to 3.6 V; the maximum frequency in the

extended Vcc range 2.3 V to 2.7 V is 40 MHz.

3. Typical values given for TA = 25 °C.

4. tCH + tCL must be greater than or equal to 1/ fC.

5. Value guaranteed by characterization, not 100% tested in production.

6. Expressed as a slew-rate.

7. Only applicable as a constraint for a WRSR instruction when SRWD is set at ‘1’.

Table 22. AC characteristics, grade 6 (T9HX technology), 75 MHz op eration, VCC min

= 2.7 V (continued)

Applies only to products made with T9HX technology, identified with process digit ‘4’(1) and

process letter “B” in the part number(2)

Test conditions sp e ci f ie d in Table 10 and Table 18

Symbol Alt. Parameter Min Typ(3) Max Unit

AI01447C

MSB IN

tDVCH

High Impedance

LSB IN

tSLCH

tCHDX

tCHCL

tCLCH

tSHCH

tSHSL

tCHSHtCHSL

M25P20 DC and AC parameters

45/55

Figure 23. Write Protect Setup and Hold Timing during WRSR when SRWD=1

Figure 24. Hold Timing

High Impedance

tWHSL tSHWL

AI07439

AI02032

HOLD

tCHHL

tHLCH

tHHCH

tCHHH

tHHQXtHLQZ

DC and AC parameters M25P20

46/55

Figure 25. Output T iming

AI01449

LSB OUT

DADDR.

LSB IN

tSHQZ

tCH

tCL

tQLQH

tQHQL

tCLQX

tCLQV

tCLQX

tCLQV

M25P20 Package mechanical

47/55

11 Package mechanical

Figure 26. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package

Outline

1. Drawing is not to scale.

2. The ‘1’ that appears in the top view of the package shows the position of pin 1.

Table 23. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width,

package mechanical data

Symbol millimeters inches

Typ Min Max Typ Min Max

A1.750.069

A1 0.10 0.25 0.004 0.010

A2 1.25 0.049

b 0.28 0.48 0.011 0.019

c 0.17 0.23 0.007 0.009

ccc 0.10 0.004

D 4.90 4.80 5.00 0.193 0.189 0.197

E 6.00 5.80 6.20 0.236 0.228 0.244

E1 3.90 3.80 4.00 0.154 0.150 0.157

e1.27– –0.050– –

h 0.25 0.50 0.010 0.020

k 0°8° 0°8°

L 0.40 1.27 0.016 0.050

L1 1.04 0.041

SO-A

ccc

h x 45˚

0.25 mm

GAUGE PLANE

Package mechanical M25P20

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Figure 27. QFN8L (MLP8) 8-lead, dual flat package no lead, 6 × 5 mm, package

outline

1. Drawing is not to scale.

Table 24. QFN8L (MLP8) 8-lead dual flat package no lead, 6 x 5 mm package

mechanical data

Symbol millimeters inches

Typ Min Max Typ Min Max

A 0.90 0.80 1.00 0.035 0.031 0.039

A1 0.02 0.00 0.05 0.001 0.000 0.002

A3 0.20 0.008

b 0.40 0.35 0.48 0.016 0.014 0.019

D6.00 0.236

D2 3.00 2.80 3.20 0.118 0.110 0.126

E5.00 0.197

E2 3.00 2.80 3.20 0.118 0.110 0.126

e1.27 0.050

L 0.60 0.50 0.75 0.024 0.020 0.030

0.08

5X_ME

AA3 A1 E2/2

0PIN 1 ID OPTION

M25P20 Package mechanical

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Figure 28. VFQFPN8 (MLP8) 8-lead Very thin Fine Pitch Dual Flat Package No lead,

6x5mm, Package Outline

1. Drawing is not to scale.

2. The circle in the top view of the package indicates the position of pin 1.

Table 25. VFQFPN8 (MLP8) 8-lead Very thin Fine Pitch Dual Flat Package No lead,

6x5mm, Package Mechanical Data

Symbol millimeters inches

Typ. Min. Max. Typ. Min. Max.

A 0.85 1.00 0.0335 0.0394

A1 0.00 0.05 0.0000 0.0020

A2 0.65 0.0256

A3 0.20 0.0079

b 0.40 0.35 0.48 0.0157 0.0138 0.0189

D6.00 0.2362

D1 5.75 0.2264

D2 3.40 3.20 3.60 0.1339 0.1260 0.1417

E5.00 0.1969

E1 4.75 0.1870

E2 4.00 3.80 4.20 0.1575 0.1496 0.1654

e1.27 0.0500

L 0.60 0.50 0.75 0.0236 0.0197 0.0295

θ12° 12°

VFQFPN-01

eE2

Ordering Information, Standard Parts M25P20

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12 Ordering Information, Standard Parts

For a list of available options (speed, p ackage, etc.) or for fu rther informa tion on any aspect

of this device, please co ntact your nearest Numonyx Sales Office.

The category of Second-L evel Interconne ct is marked on the package and on the inner box

label, in compliance with JEDEC Standard JESD97. The maximum ratings related to

soldering conditions are also marked on th e inner box label.

Table 26. Ordering Information Scheme

Example: M25P20 – V MN 6 T P B

Device Type

M25P = Serial Flash Memory for Code Storage

Device Fu nc tion

20 = 2 Mbit (256K x 8)

Security features(1)

– = no extra security

S = CFD programmed with UID

Operating Voltage

V = VCC = 2.3 to 3.6V

Package

MN = SO8 (150 mil width)

MS = QFN8L (MLP8)(2), 6 x 5 mm

MP = VFQFPN8 6x5mm (MLP8)

Device Gr ade

6 = Industrial temperature range, –40 to 85 °C.

Device tested with standard test flow

3(3)= Device tested with High Reliability Certified Flow(4).

Automotive temperature range (–40 to 125 °C)

Option

blank = Standard Packing

T = Tape and Reel Packing

Plating Te chnology

P or G = ECOPACK® (RoHS compliant)

Process(5)

/X = T7Y

B = T9HX

1. Secure options are available upon customer request.

2. Exposed pad of 3 x 3 mm.

3. Device grade 3 available in SO8 ECOPACK® (RoHS compliant) package.

4. Numonyx strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High

Reliability Certified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest Numonyx sales

office for a copy.

5. The process letter (/X) is specified in the ordering information of Grade 3 devices only.

For Grade 6 devices, the process letter does not appear in the Ordering Information, it only appears on the device package

(marking) and on the shipment box. Please co ntact your nearest Numonyx Sales Office.

For more information on how to identify products by the Process Identification Letter, please refer to AN1995: Serial Flash

Memory Device Marking.

M25P20 Ordering Information, Automotive Parts

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13 Ordering Information, Automotive Parts

Note: Numonyx strongly recommends the use of the Automotive Grade devices (Auto Grade 6

and 3) in an automotive envirnoment. The high reliability certified flow (HRCF) is described

in the quality note QNEE9801. Please ask your Numonyx sales office for a copy.

Table 27. Ordering Information Scheme

Example: M25P20 – V MN 6 T P B A

Device Type

M25P = Serial Flash Memory for Code Storage

Device Fu nc tion

20 = 2 Mbit (256K x 8)

Security features

– = no extra security

Operating Voltage

V = VCC = 2.3 to 3.6 V

Package

MN = SO8 (150 mil width)

Device Gr ade

6 = Industrial temperature range, –40 to 85 °C.

Device tested with high reliability certified flow

3 = Automotive temperature range (–40 to 125 °C)

Device tested with high reliability certified flow.

Option

blank = Standard Packing

T = Tape and Reel Packing

Plating Te chnology

P or G = RoHS compliant

Lithography

/X = T7Y, 150 nm technology (not suggested fo r new design)

B = 110 nm, Fab 2 Diffusion Plant

Automotive Grade

<blank> = Automotive, –40 to 125 °C part.

A = Automotive , –40 to 85 °C part (used ONLY in

conjunction with Device Grade 6 to distinguish the Auto

Tested Parts from the non Auto Tested parts).

Revision history M25P20

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14 Revision history

Table 28. Document revision history

Date Revision Changes

12-Apr-2001 1.0 Document written

25-May-2001 1.1 Serial Paged Flash Memory renamed as Serial Flash Memory

11-Sep-2001 1.2

Changes to text: Signal Description/Chip Select; Hold Condition/1st para;

Protection modes; Release from Power-down and Read Electronic

Signature (RES); Power-up

Repositioning of several tables and illustra tions without changing their

contents

Power-up timing illustration; SO8W package removed

Changes to tables: Abs Max Ratings/VIO; DC Characteristics/VIL

16-Jan-2002 1.3

F AST_READ instruction added. Document revised with new timings, VWI,

ICC3 and clock slew rate. Descriptions of Polling, Hold Condition, Page

Programming, Release for Deep Power-down made more precise. Value

of tW(max) modified.

16-May-2002 1.4 Cla rification of descriptions of entering Standby Power mode from Deep

Power-down mode, and of terminating an instruction sequence or data-

out sequence.

12-Sep-2002 1.5 VFQFPN8 package (MLP8) added. Document promoted to full datasheet.

13-Dec-2002 1.6

Typical Page Program time improved. Write Protect setup and hold times

specified, for applications that switch Write Protect to exit the Hardware

Protection mode immediately before a WRSR, and to enter the Hardware

Protection mode again immediately after.

24-Nov-2003 2.0

Table of contents, warning about exposed paddle on MLP8, an d Pb-free

options added.

40MHz AC Characte ristics table included as well as 25MHz. ICC3(max),

tSE(typ) and tBE(typ) values improved. Change of naming for VDFPN8

package

26-Apr-2004 3.0 Automotive range added. Soldering temperature information clarified for

RoHS compliant devices. Device Grade clarified

05-Aug-2004 4.0 Device Grade information clarified. Data-retention measurement

temperature corrected. Details of how to find the date of marking added.

21-Dec-2004 5.0 2 Notes removed from Table 26 : Ord ering Information Scheme. Small

text changes. End timing line of tSHQZ modified in Figure 25: Output

Timing.

01-Aug-2005 6.0 Up dated Page Program (PP) instructions in Page Programming, Page

Program (PP), Instruction Times, process technology T9HX (Device

Grade 6) and Instruction Times (Device Grade 3).

M25P20 Revision history
 53/55
01-Dec-2005 7.0
50MHz operation added (see Table 21: AC Characteristics (50MHz 
Operation, Device Grade 6)). All packages are ECOPACK®. Blank option 
removed from under Pla ting Technology in Table 26: Ordering 
Information Scheme. MLP package renamed as VFQFPN, silhouette and 
package mechanical drawing updated (see package silhouette on page 1 
and Figure 28: VFQFPN8 (MLP8) 8-lead Very th in Fine Pitch Dual Flat 
Package No lead, 6x5mm, Package Outline. Note added to <Blue>Figure 
26. and Figure 28 Read Identification (RDID) instruction added.
22-Dec-2005 8.0 tRES1 and tRES2 modified in Table 21: AC Characteri stics (50MHz 
Operation, Device Grade 6) . Titles of Figure 28 and Table 25 corrected.
14-Apr-2006 9
The data contained in Table 11, Table 17 and Table 19 is no longer 
preliminary data.
Figure 3: Bus Ma ster and memory devices on the SPI Bus modified and 
Note 2 added.
40MHz frequency condition modified for ICC3 in Table 14: DC 
Characteristics (Device Grade 3). 
Table 17: Instruction Times (Device Grade 3) shows preliminary data.
Device Grade distinction removed, Condition changed for the Data 
Retention parameter in Table 11: Data Retention and Endurance.
VWI parameter for Device Grade 3 added to Table 8: Power-Up Timing 
and VWI Threshold.
SO8 package specifications updated (see Figure 26 and Table 23).
/X Process added to Table 26: Ordering Information Scheme.
05-Jun-2006 10
tRES1 and tRES2 parameter timings changed for devices produced with  
the “X” process techno l ogy  in  Table 19 and Table 20.
SO8 Narrow package specifications updated (see Figure 26 and 
Table 23).
10-Dec-2008 11 Applied Numonyx branding.
12-Oct-2008 12
Changed frequency up  to 75MHz (only in the standard Vcc range).
Added new package.
Added UID/CFD protection.
Extended Vcc range to 2.3 V.
14-Oct-2009 13 Created separate order information for standard parts and automotive 
parts.
8-March-2010 14
Minor text edits.
Made the following changes:
Created Icc1, Grade 6 and Grade 3 and  Icc2, Grade 6 and Grade 3 in 
Table 13.: DC Characteristics (Device Grade 6).
Removed tPP, tSE, and tBE in Table 16.: Instruction Times, process 
technology T7Y, Device Grade 6.
Table 28. Document revision history (continued)
Date Revision Changes

M25P20

54/55

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