DATASHEET LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER Description Features The ICS552-02 is a low skew, single-input to eightoutput clock buffer. The device offers a dual input with pin select for switching between two clock sources. It is part of IDT's ClockBlocksTM family. See the ICS553 for a 1 to 4 low skew buffer. For more than 8 outputs see the MK74CBxxx BuffaloTM series of clock drivers. * * * * * * * * * * IDT makes many non-PLL and PLL based low skew output devices as well as Zero Delay Buffers to synchronize clocks. Contact us for all of your clocking needs. ICS552-02 Extremely low skew outputs (50ps maximum) Packaged in 16 pin TSSOP Available in Pb (lead) free package Low power CMOS technology Operating Voltages of 2.5 V to 5 V Output Enable pin tri-states outputs 5 V tolerant input clocks Input/Output clock frequency up to 200 MHz Input clock multiplexer simplifies clock selection Industrial temperature NOTE: EOL for non-green parts to occur on 5/13/10 per PDN U-09-01 Block Diagram Q0 Q1 Q2 IN A 1 Q3 IN B 0 Q4 Q5 Q6 Q7 S E LA IDTTM / ICSTM LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER OE 1 ICS552-02 REV K 092309 ICS552-02 LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER CLOCK MUX AND BUFFER Pin Assignment OE VDD Q0 Q1 Q2 Q3 GND INB 1 2 3 4 5 6 7 8 Input Source Select 16 15 14 13 12 11 10 9 SELA VDD Q7 Q6 Q5 Q4 GND INA SELA Input 0 INB 1 INA 16 Pin TSSOP Pin Descriptions Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin Name OE VDD Q0 Q1 Q2 Q3 GND INB INA GND Q4 Q5 Q6 Q7 VDD SELA Pin Type Input Power Output Output Output Output Power Input Input Power Output Output Output Output Power Input Pin Description Output Enable. Tri-states outputs when low. Internal pull-up resistor. Connect to +2.5V, +3.3V or +5.0V. Must be the same as pin 15. Clock Output 0 Clock Output 1 Clock Output 2 Clock Output 3 Connect to ground. Clock Input B. 5V tolerant input. Clock Input A. 5V tolerant input. Connect to ground. Clock Output 4 Clock Output 5 Clock Output 6 Clock Output 7 Connect to + 2.5V, +3.3V or +5.0V. Must be the same as pin 2. Selects either INA or INB. Internal pull-up resistor. External Components A minimum number of external components are required for proper operation. Decoupling capacitors of 0.01 F should be connected between VDD on pin 2 and GND on pin 7, and between VDD on pin 15 and GND on pin 10, as close to the device as possible. A 33 series terminating resistor should be used on each clock output if the trace is longer than 1 inch. To achieve the low output skews that the ICS552-02 is capable of, careful attention must be paid to board layout. Essentially, all 8 outputs must have identical terminations, identical loads, and identical trace geometries. If they do not, the output skew will be degraded. For example, using a 30 series termination on one output (with 33 on the others) will cause at least 15ps of skew. IDTTM / ICSTM LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER 2 ICS552-02 REV K 092309 ICS552-02 LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER CLOCK MUX AND BUFFER Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS552-02. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Supply Voltage, VDD 7V SELA, OE, and all Outputs -0.5 V to VDD+0.5 V INA and INB -0.5V to 5.5V Ambient Operating Temperature -40 to +85 C Storage Temperature -65 to +150 C Junction Temperature 175 C Soldering Temperature 260 C Recommended Operation Conditions Parameter Min. Typ. Max. Units -40 - +85 C +5.25 V Ambient Operating Temperature Power Supply Voltage (measured in respect to GND) +2.375 DC Electrical Characteristics VDD=2.5 V 5%, Ambient temperature -40 to +85 C, unless stated otherwise Parameter Operating Voltage Symbol Conditions VDD Min. Typ. Max. Units 2.375 2.625 V VDD/2+0.5 5.5 V VDD/2-0.5 V VDD V 0.7 V Input High Voltage, INA, INB VIH Note 1 Input Low Voltage, INA, INB VIL Note 1 Input High Voltage, OE, SELA VIH Input Low Voltage, OE, SELA VIL Output High Voltage VOH IOH = -16 mA Output Low Voltage VOL IOL = 16 mA Operating Supply Current IDD No load, 135 MHz 35 mA Short Circuit Current IOS Each output 60 mA IDTTM / ICSTM LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER 1.8 3 2 V 0.4 ICS552-02 V REV K 092309 ICS552-02 LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER CLOCK MUX AND BUFFER DC Electrical Characteristics (continued) VDD=3.3 V 5%, Ambient temperature -40 to +85 C, unless stated otherwise Parameter Operating Voltage Symbol Conditions VDD Min. Typ. Max. Units 3.135 3.465 V VDD/2+0.7 5.5 V VDD/2-0.7 V VDD V 0.8 V Input High Voltage, INA, INB VIH Note 1 Input Low Voltage, INA, INB VIL Note 1 Input High Voltage, OE, SELA VIH Input Low Voltage, OE, SELA VIL Output High Voltage VOH IOH = -25 mA Output Low Voltage VOL IOH = 25 mA Output High Voltage (CMOS Level) VOH IOH = -12 mA Operating Supply Current IDD No load, 135 MHz 50 mA Short Circuit Current IOS Each output 80 mA 2 2.4 V 0.4 VDD-0.4 V V VDD=5 V 5%, Ambient temperature -40 to +85 C, unless stated otherwise Parameter Operating Voltage Symbol Conditions VDD Min. Typ. Max. Units 4.75 5.25 V VDD/2+1 5.5 V VDD/2-1 V VDD V 0.8 V Input High Voltage, INA, INB VIH Note 1 Input Low Voltage, INA, INB VIL Note 1 Input High Voltage, OE, SELA VIH Input Low Voltage, OE, SELA VIL Output High Voltage VOH IOH = -35 mA Output Low Voltage VOL IOL = 35 mA Output High Voltage (CMOS Level) VOH IOH = -12 mA Operating Supply Current IDD No load, 135 MHz 85 mA Short Circuit Current IOS Each output 100 mA 2 2.4 V 0.4 VDD-0.4 V V Note: 1. Nominal switching threshold is VDD/2 IDTTM / ICSTM LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER 4 ICS552-02 REV K 092309 ICS552-02 LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER CLOCK MUX AND BUFFER AC Electrical Characteristics VDD = 2.5V 5%, Ambient Temperature -40 to +85 C, unless stated otherwise Parameter Symbol Conditions Input Frequency Min. Typ. 0 Max. Units 200 MHz Output Rise Time tOR 0.8 to 2.0 V, CL=15 pF 1.0 1.5 ns Output Fall Time tOF 2.0 to 0.8 V, CL=15 pF 1.0 1.5 ns Propagation Delay Note 1 Output to output skew Note 2 Input A to Input B skew Note 3 3.5 Rising edges at VDD/2 ns 0 50 ps 0 50 ps VDD = 3.3V 5%, Ambient Temperature -40 to +85 C, unless stated otherwise Parameter Symbol Conditions Input Frequency Min. Typ. 0 Max. Units 200 MHz Output Rise Time tOR 0.8 to 2.0 V, CL=15 pF 0.6 1.0 ns Output Fall Time tOF 2.0 to 0.8 V, CL=15 pF 0.6 1.0 ns 3.0 5.5 ns 0 50 ps 0 50 ps 3.5 ns Propagation Delay Note 1 Output to output skew Note 2 Input A to Input B skew Note 3 2.0 Rising edges at VDD/2 Part to Part Skew VDD = 5.0V 5%, Ambient Temperature -40 to +85 C, unless stated otherwise Parameter Symbol Conditions Input Frequency Min. Typ. 0 Max. Units 200 MHz Output Rise Time tOR 0.8 to 2.0 V, CL=15 pF 0.3 0.7 ns Output Fall Time tOF 2.0 to 0.8 V, CL=15 pF 0.3 0.7 ns Propagation Delay Note 1 Output to output skew Note 2 Input A to Input B skew Note 3 2.8 Rising edges at VDD/2 ns 0 50 ps 0 50 ps Notes: 1. With rail-to-rail input clock. 2. Between any two outputs with equal loading. 3. Propagation delay matching through the part. 4. Duty cycle on outputs will match incoming clock duty cycle. Consult IDT for tight duty cycle clock generators. IDTTM / ICSTM LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER 5 ICS552-02 REV K 092309 ICS552-02 LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER CLOCK MUX AND BUFFER Package Outline and Package Dimensions (16 pin TSSOP, 4.40 mm Body, 0.65 mm Pitch) Package dimensions are kept current with JEDEC Publication No. 95, MO-153 16 Millimeters Symbol E1 E IN D EX AR EA 1 2 D A 2 Min A A1 A2 b C D E E1 e L aaa A Inches Max -1.20 0.05 0.15 0.80 1.05 0.19 0.30 0.09 0.20 4.90 5.1 6.40 BASIC 4.30 4.50 0.65 Basic 0.45 0.75 0 8 -0.10 Min Max -0.047 0.002 0.006 0.032 0.041 0.007 0.012 0.0035 0.008 0.193 0.201 0.252 BASIC 0.169 0.177 0.0256 Basic 0.018 0.030 0 8 -0.004 A 1 c -C e S E A T IN G P LAN E b L aaa C Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature 552G-02I* 552G-02I Tubes 16-pin TSSOP -40 to +85 C 552G-02IT* 552G-02I Tape and Reel 16-pin TSSOP -40 to +85 C 552G-02ILN 552G02IN Tubes 16-pin TSSOP -40 to +85 C 552G-02ILNT 552G02IN Tape and Reel 16-pin TSSOP -40 to +85 C *NOTE: EOL for non-green parts to occur on 5/13/10 per PDN U-09-01 Parts that are ordered with an "LN" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDTTM / ICSTM LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER 6 ICS552-02 REV K 092309 ICS552-02 LOW SKEW 2 INPUT MUX AND 1 TO 8 CLOCK BUFFER CLOCK MUX AND BUFFER Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales For Tech Support 800-345-7015 408-284-8200 Fax: 408-284-2775 www.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com (c) 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA