PC3ST21NSZ
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. 3ST21)
2. Approved by CSA, file No. CA95323 (as model No.
3ST21)
3. Package resin : UL flammability grade (94V-0)
DIN EN60747-5-2 (successor standard of DIN VDE0884)
approved type is also available. (PC3SH21YFZ Series)
Features
Agency approvals/Compliance
1. Triggering for Triacs used to switch on and off
devices which require AC Loads.
For example heaters, fans, motors, solenoids, and
valves.
2. AC line control in power supply applications.
Applications
VDRM : 600V, Zero cross type
DIP 4pin
Phototriac Coupler for triggering
1. High repetitive peak off-state voltage (VDRM : 600V)
2. Zero crossing functionality (VOX : MAX. 20V)
3. IFT ranks available (see Model Line-up section in this
datasheet)
4. 4 pin DIP package
5. Superior noise immunity (dV/dt : MIN. 1 000V/µs)
6. Lead-free components are also available (see Model
Line-up section in this datasheet)
7. Double transfer mold construction (Ideal for Flow
Soldering)
8. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
Non-zero cross type is also available.
(PC3ST11NSZ Series)
Description
PC3ST21NSZ Series Phototriac Coupler include an
infrared emitting diode (IRED) optically coupled to an
output Phototriac.
These devices feature full wave control and are
ideal isolated drivers for medium to high current Triacs.
DIP package provides 5.0kV isolation from input to
output with superior commutative noise immunity.
1
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC3ST21NSZ Series
Sheet No.: D2-A07101EN
Date Mar. 31. 2004
© SHARP Corporation
Internal Connection Diagram
1
4
3
1
2
2
3
4
Anode
Cathode
Anode/Cathode
Cathode/Anode
Zero Crossing Circuit
2
Outline Dimensions (Unit : mm)
1. Through-Hole [ex. PC3ST21NSZ] 2. Wide Through-Hole Lead-Form [ex. PC3ST21NFZ]
3. SMT Gullwing Lead-Form [ex. PC3ST21NIP]4. Wide SMT Gullwing Lead-Form [ex. PC3ST21NUP]
6.5±0.5
7.62±0.3 4.58±0.5
θθ
θ : 0 to 13˚
Epoxy resin
3.5±0.5
3.0±0.5
0.5TYP.
0.6±0.2
1.2±0.3
1
2
4.58±0.5
2.54±0.25
4
3
Anode mark Rank mark
Factory identification mark
Date code (2 digit)
3ST21
2.7±0.5
0.5±0.1
0.26±0.1
Model No.
Date code (2 digit)
3ST21
4.58±0.5
0.6±0.2
1.2±0.3
1.0±0.1
2.54±0.25
6.5±0.5
Anode mark
Factory identification mark
4
3
7.62±0.3
10.16±0.5
0.26±0.1
4.58±0.5
0.5±0.1
Epoxy resin
3.5±0.5
2.7MIN.
Rank mark
1
2
Model No.
0.6±0.2
1.2±0.3
6.5±0.5
7.62±0.3
0.26±0.1
4.58±0.5
2.54±0.25
Epoxy resin
3.5±0.5
4.58±0.5
2.54±0.25
4
3
Anode mark Rank mark
Factory identification mark
Date code (2 digit)
1.0+0.4
0
1.0+0.4
0
10.0+0
0.5
0.35±0.25
1
23ST21
Model No.
Date code (2 digit)
3ST21
0.6±0.2
1.2±0.3
1.0±0.1
6.5±0.5
10.16±0.5 0.75±0.25
0.75±0.25
4.58±0.5
2.54±0.25
Anode mark
Rank mark
Factory identification mark
4
3
7.62±0.3
12.0MAX
4.58±0.5
Epoxy resin
3.5±0.5
0.26±0.1
0.5±0.1
0.25±0.25
1
2
Model No.
PC3ST21NSZ Series
Sheet No.: D2-A07101EN
Product mass : approx. 0.23g Product mass : approx. 0.23g
Product mass : approx. 0.21g Product mass : approx. 0.22g
Date code (2 digit)
Rank mark
Refer to the Model Line-up table
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
Factory identification mark
Factory identification Mark
no mark
Country of origin
Japan
Indonesia
Philippines
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
3
repeats in a 20 year cycle
PC3ST21NSZ Series
Sheet No.: D2-A07101EN
Electro-optical Characteristics
Parameter Symbol Unit
Input
Output
(Ta=25˚C)
Forward voltage
Reverse current
Repentitive peak OFF-state current
ON-state voltage
Holding current
Critical rate of rise of OFF-state voltage
Zero cross voltage
Minimum trigger current
Isolation resistance
Turn-on time
VF
IR
IDRM
VT
IH
dV/dt
VOX
IFT
RISO
ton
V
µA
µA
V
mA
V/µs
V
mA
µs
IF=20mA
VR=3V
VD=VDRM
IT=0.1A
VD=4V
VD=1/
2 ·VDRM
IF=15mA, Resistance load
IF=8mA, Resistance load
VD=4V, RL=100
DC500V,40 to 60%RH
V
D=
4V, R
L=
100, I
F=
20mA
Conditions MIN. TYP. MAX.
Transfer
charac-
teristics
Rank B
Rank C
Rank B
Rank C
0.1
1 000
5
×
1010
1.2
2 000
1011
1.4
10
1
3.0
3.5
20
7
5
50
Absolute Maximum Ratings
Parameter Symbol Rating Unit
Input
Output
(Ta=25˚C)
Forward current
Reverse voltage
RMS ON-state current
Peak one cycle surge current
Repetitive peak OFF-state voltage
Isolation voltage
Operating temperature
Storage temperature
Soldering temperature
*2
*1
IF
VR
IT(rms)
Isurge
VDRM
Viso(rms)
Topr
Tstg
Tsol
mA
V
A
A
V
kV
˚C
˚C
˚C
*3
*4
50
6
0.1
1.2
600
5.0
30 to +100
55 to +125
270
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 f=50Hz sine wave
*4 Lead solder plating models: 260˚C
4
PC3ST21NSZ Series
1mm
Soldering area
Sheet No.: D2-A07101EN
Lead Form
Shipping Package
DIN
EN60747-5-2
Model No.
Through-Hole
PC3ST21NSZCF
-
MAX.5
MAX.7
Sleeve
100pcs/sleeve
-
Approved
Wide Through-Hole
PC3ST21NFZCF
-
-
Approved
SMT Gullwing
PC3ST21NIZCF
-
-
PC3ST21NSZBF
-
PC3ST21NFZBF
-
PC3ST21NIZBF
-
Approved
C
B
IFT[mA]
(VD=4V,
RL=100)
Rank mark
Lead Form
Shipping Package
DIN
EN60747-5-2
Model No.
Wide SMT Gullwing
PC3ST21NUZCF
-
MAX.5
MAX.7
Taping
2 000pcs/reel
Sleeve
100pcs/sleeve
-
Approved
SMT Gullwing
PC3ST21NIPCF
-
-
Approved
Wide SMT Gullwing
PC3ST21NUPCF
-
-
PC3ST21NUZBF
-
PC3ST21NIPBF
-
PC3ST21NUPBF
-
Approved
C
B
IFT[mA]
(VD=4V,
RL=100)
Rank mark
5
Please contact a local SHARP sales representative to inquire about production status.
PC3ST21NSZ Series
Sheet No.: D2-A07101EN
Model Line-up (1) (Lead-free components)
Model Line-up (2) (Lead solder plating components)
Lead Form
Shipping Package
DIN
EN60747-5-2
Model No.
Through-Hole
PC3ST21NSZC
-
MAX.5
MAX.7
Sleeve
100pcs/sleeve
-
Approved
Wide Through-Hole
PC3ST21NFZC
-
-
Approved
SMT Gullwing
PC3ST21NIZC
-
-
PC3ST21NSZB
-
PC3ST21NFZB
-
PC3ST21NIZB
-
Approved
C
B
IFT[mA]
(VD=4V,
RL=100)
Rank mark
Lead Form
Shipping Package
DIN
EN60747-5-2
Model No.
Wide SMT Gullwing
PC3ST21NUZC
-
MAX.5
MAX.7
Taping
2 000pcs/reel
Sleeve
100pcs/sleeve
-
Approved
SMT Gullwing
PC3ST21NIPC
-
-
Approved
Wide SMT Gullwing
PC3ST21NUPC
-
-
PC3ST21NUZB
-
PC3ST21NIPB
-
PC3ST21NUPB
-
Approved
C
B
IFT[mA]
(VD=4V,
RL=100)
Rank mark
6
PC3ST21NSZ Series
0
10
20
30
40
50
60
70
30 0 50 100
Forward current IF (mA)
Ambient temperature Ta (˚C)
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 RMS ON-state Current vs.
Ambient Temperature
Sheet No.: D2-A07101EN
0
25
50
75
100
125
150
175
30 0 50 100
RMS ON-state current Ir (rms) (mA)
Ambient temperature Ta (˚C)
1
5
10
0.9 1.11 1.2 1.3 1.4 1.5
50
100
Forward current IF (mA)
Forward voltage VF (V)
Ta=75˚C
50˚C
25˚C
0˚C
25˚C
Fig.3-b Forward Current vs. Forward Voltage
(Rank C)
Fig.3-a Forward Current vs. Forward Voltage
(Rank B)
Fig.4-a
Minimum Trigger Current vs.
Ambient Temperature (Rank B)
Fig.4-b
Minimum Trigger Current vs.
Ambient Temperature (Rank C)
0
1
2
3
4
6
5
7
40 020 20 40 60 80 100
Minimum trigger current IFT (mA)
Ambient temperature Ta (˚C)
VD=4V
RL=100
0
1
2
3
4
6
5
7
40 020 20 40 60 80 100
Minimum trigger current IFT (mA)
Ambient temperature Ta (˚C)
VD=4V
RL=100
0 0.5 1 1.5 2 2.5 3
Forward current IF (mA)
Forward voltage VF (V)
1
5
10
50
100
Ta=100°C
75°C
50°C
25°C
0°C
30°C
Fig.7 Holding Current vs.
Ambient Temperature
7
PC3ST21NSZ Series
Fig.8 Repetitive Peak OFF-state Current vs.
Ambient Temperature
Fig.6 ON-state Voltage vs.
Ambient Temperature
Sheet No.: D2-A07101EN
1
1.5
2
2.5
40 020 20 40 60 80 100
ON-state voltage VT (V)
Ambient temperature Ta (˚C)
IT=0.1A
109
107
105
020406080100
Repetitive peak OFF-state current IDRM (A)
Ambient temperature Ta (˚C)
106
108
VD=600V
0.01
0.1
1
40 020 20 40 60 80 100
Holding current IH (mA)
Ambient temperature Ta (˚C)
VD=4V
Fig.9-a
Zero-cross Voltage vs. Ambient
Temperature (Rank B)
Remarks : Please be aware that all data in the graph are just for reference.
Fig.9-b
Zero-cross Voltage vs. Ambient
Temperature (Rank C)
Resistance load,
IF=15mA
0
10
15
5
20
40 20 100806040200
Zero-cross voltage VOX (V)
Ambient temperature Ta (˚C)
0
10
15
5
20
40 20 100806040200
Zero-cross voltage VOX (V)
Ambient temperature Ta (˚C)
Resistance load,
IF=8mA
Fig.5 Relative Repetitive Peak OFF-state
Voltage vs. Ambient Temperature
Relative repetitive peak OFF-state voltage
VDRM (Tj=Ta) / VDRM (Tj=25°C)
0.7
1.3
1.2
1.1
1
0.9
0.8
40 20 0 20 40 60 80 100
Ambient temperature Ta (°C)
Recommended Foot Print (reference)
8
SMT Gullwing Lead-form Wide SMT Gullwing Lead-form
10.2
2.54
1.7
2.2
8.2
2.54
1.7
2.2
(Unit : mm)
PC3ST21NSZ Series
Design Considerations
Sheet No.: D2-A07101EN
In order for the Phototriac to turn off, the triggering current (IF) must be 0.1mA or less.
Please refrain from using these devices in a direct drive configuration. These Phototriac Coupler are
intended to be used as triggering device for main Triacs. Please ensure that the output rating of these
devices will be sufficient for triggering the main output Triac of your choice. Failure to do may result in
malfunctions.
For applications with inductive loads such as motors,please use caution in utilizing a zero crossing type
Phototraiac Coupler as this may cause undesired operations due to the phase difference between voltage
and current of load.
For designs that will experience excessive noise or sudden changes in load voltage, please include an
appropriate snubber circuit as shown in the below circuit. Please keep in mind the Sharp Phototriac Coupler
incorporate superrior dV/dt ratings which can eliminate the need for a snubber circuit.
For over voltage protection, a Varistor may be used.
Degradation
In general, the emission of the IRED used in Phototriac Couplers will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should
provide at least twice the minimum required triggering current from initial operation.
Design guide
9
PC3ST21NSZ Series
Sheet No.: D2-A07101EN
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Standard Circuit (Medium/High Power Triac Drive Circuit)
Triac
Load
PC3ST21NSZ
Note) Please add the snubber circuit according to a condition.
Any snubber or varistor used for the above mentioned scenarios should be located
as close to the main output triac as possible.
4
3
1
2
AC Line
Zero Crossing
Circuit
Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC3ST21NSZ Series
Sheet No.: D2-A07101EN
11
PC3ST21NSZ Series
Sheet No.: D2-A07101EN
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Presence of ODC
Package specification
12
12.0
6.7
5.8
10.8
15.0
6.35
5.9
10.8
520
±2
520
±2
Sleeve package
1. Through-Hole or SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
(Unit : mm)
(Unit : mm)
2. Wide Through-Hole or Wide SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
PC3ST21NSZ Series
Sheet No.: D2-A07101EN
13
Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
D J
G
B
H
H
A
C
MAX.
Dimensions List (Unit : mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
8.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
5.1±0.1
F
4.0±0.1
G
φ1.5+0.1
0
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 2 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC3ST21NSZ Series
Sheet No.: D2-A07101EN
2. Wide SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
14
Dimensions List
A
24.0±0.3
B
11.5±0.1
C
1.75±0.1
D
8.0±0.1
E
2.0±0.1
H
12.4±0.1
I
0.4±0.05
J
4.1±0.1
K
5.1±0.1
F
4.0±0.1
G
φ1.5+0.1
0
(Unit : mm)
J
GI
EC
B
A
H
H
MAX.
F D
K
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
25.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 2 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC3ST21NSZ Series
Sheet No.: D2-A07101EN
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
15
Important Notices
PC3ST21NSZ Series
Sheet No.: D2-A07101EN