HLMP-EGxx, HLMP-ELxx
T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs
Data Sheet
Description
These Precision Optical Performance AlInGaP LEDs
provide superior light output for excellent readability in
sunlight and are extremely reliable. AlInGaP LED tech-
nology provides extremely stable light output over long
periods of time. Precision Optical Performance lamps
utilize the aluminum indium gallium phosphide (AlInGaP)
technology.
These LED lamps are untinted. T-1¾ packages incorpo-
rating second generation optics producing well dened
spatial radiation patterns at specic viewing cone angles.
These lamps are made with an advanced optical grade
epoxy oering superior high temperature and high
moisture resistance performance in outdoor signal and
sign application. The maximum LED junction tempera-
ture limit of +130° C enables high temperature operation
in bright sunlight conditions. The epoxy contains uv
inhibitor to reduce the eects of long term exposure to
direct sunlight.
Benets
• Superior performance for outdoor environment
• Suitable for auto-insertion onto PC board
Features
• Viewing angle: 15°, 23° and 30°
• Well dened spatial radiation pattern
• High brightness material
• Available in Red and Amber
– Red AlInGaP 626 nm
– Amber AlInGaP 590 nm
• Superior resistance to moisture
• Stando and non-stando Package
Applications
• Trac management:
– Trac signals
– Pedestrian signals
– Work zone warning lights
– Variable message signs
• Solar Power signs
• Commercial outdoor advertising
– Signs
– Marquee
2
Package Dimension
A: Non-stando B: Stando
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
2.35 (0.093)
MAX.
CATHODE
FLAT
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
CATHODE
FLAT
d
1.50 ± 0.15
(0.059 ± 0.006)
5.00 ± 0.20
(0.197 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
CATHODE ANODE
Part Number Dimension ‘d’
HLMP-EG1H-xxxxx 12.30 ± 0.25mm
HLMP-EL1H-xxxxx 12.64 ± 0.25mm
HLMP-EG2H-xxxxx 12.10 ± 0.25mm
HLMP-EL2H-xxxxx 12.14 ± 0.25mm
HLMP-EG3H-xxxxx/HLMP-EL3H-xxxxx 12.10 ± 0.25mm
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.20 mm unless other specied.
3. Leads are mild steel with tin plating.
4. The epoxy meniscus is 1.21 mm max.
5. For identication of polarity after the leads are trimmed o, please
refer to the illustration below:
3
Part Numbering System
Note: Refer to AB 5337 for complete information on the part numbering system.
Device Selection Guide
Part Number
Color and Dominant
Wavelength λd (nm)
Typ [3]
Luminous Intensity Iv (mcd) at
20 mA [1,2,5]
Stando
Typical Viewing
angle (°) [4]
Min Max
HLMP-EG1G-Y10DD Red 626 9300 21000 No 15
HLMP-EG1H-Y10DD Red 626 9300 21000 Yes
HLMP-EL1G-Y10DD Amber 590 9300 21000 No
HLMP-EL1H-Y10DD Amber 590 9300 21000 Yes
HLMP-EG2G-XZ0DD Red 626 7200 16000 No 23
HLMP-EG2H-XZ0DD Red 626 7200 16000 Yes
HLMP-EL2G-WY0DD Amber 590 5500 12000 No
HLMP-EL2H-WY0DD Amber 590 5500 12000 Yes
HLMP-EG3G-VX0DD Red 626 4200 9300 No 30
HLMP-EG3H-VX0DD Red 626 4200 9300 Yes
HLMP-EL3G-VX0DD Amber 590 4200 9300 No
HLMP-EL3H-VX0DD Amber 590 4200 9300 Yes
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ½ is the o-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is ± 15%
Packaging Option
DD: Ammopack
Color Bin Selection
0 : Full Distribution
K: Color bin 2 and 4
L: Color bin 4 and 6
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Lead Stando
1G : 15 without stando
1H : 15 with stando
2G : 23 without stando
2H : 23 with stando
3G : 30 without stando
3H : 30 with stando
Color
G : Red
L : Amber
Package
E: 5 mm Standard Round
HLMP – E x xx – x x x xx
4
Absolute Maximum Ratings
TJ = 25° C
Parameter Red/ Amber Unit
DC Forward Current [1] 50 mA
Peak Forward Current 100 [2] mA
Power Dissipation 120 mW
LED Junction Temperature 130 °C
Operating Temperature Range -40 to +100 °C
Storage Temperature Range -40 to +100 °C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty Factor 30%, frequency 1 kHz.
Electrical / Optical Characteristics
TJ = 25° C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage
Red & Amber
VF1.8 2.1 2.4 V IF = 20 mA
Reverse Voltage [3]
Red & Amber
VR5 V IR = 100 μA
Dominant Wavelength [1]
Red
Amber
ld
618.0
584.5
626.0
590.0
630.0
594.5
nm IF = 20 mA
Peak Wavelength
Red
Amber
lPEAK
634
594
nm Peak of Wavelength of Spec-
tral Distribution at IF = 20 mA
Thermal resistance RqJ-PIN 240 °C/W LED junction to pin
Luminous Ecacy [2]
Red
Amber
ηv
190
490
lm/W Emitted Luminous Power/
Emitted Radiant Power
Thermal coecient of ld
Red
Amber
0.05
0.09
nm/°C IF = 20 mA;
+25° C ≤ TJ ≤ +100° C
Notes:
1. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.
2. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / ηV where Iv is the luminous intensity in candela and ηV is
the luminous ecacy in lumens/ watt.
3. Indicates product nal testing condition, long term reverse bias is not recommended.
5
0.0
0.2
0.4
0.6
0.8
1.0
500 550 600 650 700
WAVELENGTH - nm
RELATIVE INTENSITY
Red
Amber
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 20 40 60 80 100
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
NORMALIZED INTENSITY
ANGULAR DISPLACEMENT - DEGREES
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
NORMALIZED INTENSITY
ANGULAR DISPLACEMENT - DEGREES
0
20
40
60
80
100
0 1 2 3
FORWARD VOLTAGE-V
FORWARD CURRENT-mA
0
10
20
30
40
50
0 20 40 60 80 100 120
TA - AMBIENT TEMPERATURE - ºC
IF - FORWARD CURRENT - mA
60
Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Intensity vs Forward Current Figure 4. Maximum Forward Current vs Ambient Temperature
Figure 5. Representative Radiation pattern for 15° Viewing Angle Lamp Figure 6. Representative Radiation pattern for 23° Viewing Angle Lamp
6
Figure 7. Representative Radiation pattern for 30° Viewing Angle Lamp Figure 8. Relative Light Output vs Junction Temperature
Figure 9. Forward Voltage Shift vs Junction Temperature
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
NORMALIZED INTENSITY
ANGULAR DISPLACEMENT - DEGREES
0.1
1
10
-40 -20 0 20 40 60 80 100 120 140
RELATIVE LIGHT OUTPUT
NORMALIZED AT TJ = 25° C
TJ - JUNCTION TEMPERATURE
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
-40 -20 0 20 40 60 80 100 120 140
FORWARD VOLTAGE SHIFT - V
TJ - JUNCTION TEMPERATURE
Red
Amber
Red
Amber
7
Avago Color Bin on CIE 1931 Chromaticity Diagram
Intensity Bin Limit Table (1.3 : 1 Iv Bin Ratio)
Bin
Intensity (mcd) at 20 mA
Min Max
U 3200 4200
V 4200 5500
W 5500 7200
X 7200 9300
Y 9300 12000
Z 12000 16000
1 16000 21000
Tolerance for each bin limit is ± 15%
VF Bin Table (V at 20 mA)
Bin ID Min Max
VD 1.8 2.0
VA 2.0 2.2
VB 2.2 2.4
Tolerance for each bin limit is ± 0.05 V
Red Color Range
Min
Dom
Max
Dom X min Y Min X max Y max
618.0 630.0 0.6872 0.3126 0.6890 0.2943
0.6690 0.3149 0.7080 0.2920
Tolerance for each bin limit is ± 0.5 nm
Amber Color Range
Bin
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
1 584.5 587.0 0.5420 0.4580 0.5530 0.4400
0.5370 0.4550 0.5570 0.4420
2 587.0 589.5 0.5570 0.4420 0.5670 0.4250
0.5530 0.4400 0.5720 0.4270
4 589.5 592.0 0.5720 0.4270 0.5820 0.4110
0.5670 0.4250 0.5870 0.4130
6 592.0 594.5 0.5870 0.4130 0.5950 0.3980
0.5820 0.4110 0.6000 0.3990
Tolerance for each bin limit is ± 0.5 nm
Note:
All bin categories are established for classication of products. Products
may not be available in all bin categories. Please contact your Avago
representative for further information.
0.280
0.300
0.320
0.340
0.360
0.380
0.400
0.420
0.440
0.460
0.480
0.500 0.550 0.600 0.650 0.700 0.750 0.800
X
Y
1
2
4
6
Amber
Red
8
1.59 mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave Soldering
[1, 2]
Manual Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 60 sec Max -
Peak temperature 260 °C Max. 260 °C Max.
Dwell time 5 sec Max. 5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering prole to ensure that it is always conforming
to recommended soldering conditions.
Anode
InGaN Device
Note:
1. PCB with dierent size and design (component density) will have
dierent heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
prole again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high eciency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 260°C and the solder
contact time does not exceeding 5sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
Avago Technologies LED Conguration
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment xture that is being applied during
wave soldering should be loosely tted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
Note: In order to further assist customer in designing jig accurately
that t Avago Technologies’ product, 3D model of the product is
available upon request.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment xture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause diculty inserting the TH LED.
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be eectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
9
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Prole for TH LED
Ammo Packs Drawing
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless stando or non-stando
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
60sec Max
TIME (sec)
260 °C Max
105 °C Max
TEMPERATURE (°C)
6.35 ±1.30
0.250 ±0.051
12.70 ±1.00
0.500 ±0.039
CATHODE
18.00 ±0.50
0.7085 ±0.0195
9.125 ±0.625
0.3595 ±0.0245
0.70 ±0.20
0.0275 ±0.0075
12.70 ±0.30
0.500 ±0.012
VIEW A-A
A A
4.00 ±0.20
0.1575 ±0.0075
ø TYP.
20.5 ±1.00
0.8070 ±0.0394
10
Packaging Box for Ammo Packs
Note: The dimension for ammo pack is applicable for the device with stando and without stando.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 260C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
260C
Lam
p
s Bab
y
Label
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved.
AV02-3139EN - April 3, 2014
DISCLAIMER: Avago’s products and software are not specically designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 260C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
260C
Lam
p
s Bab
y
Label
(ii) Avago Baby Label (Only available on bulk packaging)
Acronyms and Denition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but without
VF bin OR part number with VF bins and no color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2 VB
VB: VF bin “VB”
2: Color bin 2 only
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Avago Technologies:
HLMP-EG3H-VX0DD HLMP-EG2G-XZ0DD HLMP-EG2H-XZ0DD HLMP-EL3H-VW0DD HLMP-EG3G-VX0DD
HLMP-EL3G-VW0DD