MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com MIXED SIGNAL MICROCONTROLLER FEATURES 1 * * 2 * * * * Low Supply-Voltage Range: 1.8 V to 3.6 V Ultralow Power Consumption - Active Mode (AM): All System Clocks Active 290 A/MHz at 8 MHz, 3 V, Flash Program Execution (Typical) 150 A/MHz at 8 MHz, 3 V, RAM Program Execution (Typical) - Standby Mode (LPM3): Real Time Clock With Crystal , Watchdog, and Supply Supervisor Operational, Full RAM Retention, Fast Wake-Up: 1.9 A at 2.2 V, 2.1 A at 3 V (Typical) Low-Power Oscillator (VLO), General Purpose Counter, Watchdog, and Supply Supervisor Operational, Full RAM Retention, Fast Wake-Up: 1.4 A at 3 V (Typical) - Off Mode (LPM4): Full RAM Retention, Supply Supervisor Operational, Fast Wake-Up: 1.1 A at 3 V (Typical) - Shutdown Mode (LPM4.5): 0.18 A at 3 V (Typical) Wake-Up From Standby Mode in 3.5 s (Typical) 16-Bit RISC Architecture, Extended Memory, Up to 25-MHz System Clock Flexible Power Management System - Fully Integrated LDO With Programmable Regulated Core Supply Voltage - Supply Voltage Supervision, Monitoring, and Brownout Unified Clock System - FLL Control Loop for Frequency Stabilization - Low-Power/Low-Frequency Internal Clock Source (VLO) - Low-Frequency Trimmed Internal Reference Source (REFO) - 32-kHz Watch Crystals (XT1) - High-Frequency Crystals Up to 32 MHz (XT2) * * * * * * * * * * * * * * 16-Bit Timer TA0, Timer_A With Five Capture/Compare Registers 16-Bit Timer TA1, Timer_A With Three Capture/Compare Registers 16-Bit Timer TA2, Timer_A With Three Capture/Compare Registers 16-Bit Timer TB0, Timer_B With Seven Capture/Compare Shadow Registers Two Universal Serial Communication Interfaces - USCI_A0 and USCI_A1 Each Supporting - Enhanced UART supporting Auto-Baudrate Detection - IrDA Encoder and Decoder - Synchronous SPI - USCI_B0 and USCI_B1 Each Supporting - I2CTM - Synchronous SPI Integrated 3.3-V Power System 12-Bit Analog-to-Digital (A/D) Converter With Internal Reference, Sample-and-Hold, and Autoscan Feature Comparator Hardware Multiplier Supporting 32-Bit Operations Serial Onboard Programming, No External Programming Voltage Needed Three Channel Internal DMA Basic Timer With Real-Time Clock Feature Family Members are Summarized in Table 1 For Complete Module Descriptions, See the MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com DESCRIPTION The Texas Instruments MSP430 family of ultralow-power microcontrollers consists of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in 3.5 s (typical). The MSP430F5329, MSP430F5327, and MSP430F5325 are microcontroller configurations with an integrated 3.3-V LDO, four 16-bit timers, a high-performance 12-bit analog-to-digital converter (ADC), two universal serial communication interfaces (USCI), hardware multiplier, DMA, real-time clock module with alarm capabilities, and 63 I/O pins. The MSP430F5328, MSP430F5326, and MSP430F5324 include all of these peripherals but have 47 I/O pins. Typical applications include analog and digital sensor systems, data loggers, etc., and various general-purpose applications. Family members available are summarized in Table 1. Table 1. Family Members USCI Device Flash (KB) SRAM (KB) MSP430F5329 128 10 (2) 5, 3, 3 7 Channel A: UART/IrDA/ SPI Channel B: SPI/I2C ADC12_A (Ch) Comp_B (Ch) I/O Package Type 2 2 14 ext / 2 int 12 63 80 PN 64 RGC, 80 ZQE MSP430F5328 128 10 5, 3, 3 7 2 2 10 ext / 2 int 8 47 MSP430F5327 96 8 5, 3, 3 7 2 2 14 ext / 2 int 12 63 80 PN 64 RGC, 80 ZQE MSP430F5326 96 8 5, 3, 3 7 2 2 10 ext / 2 int 8 47 MSP430F5325 64 6 5, 3, 3 7 2 2 14 ext / 2 int 12 63 80 PN 47 64 RGC, 80 ZQE MSP430F5324 (1) Timer_A (1) Timer_B (2) 64 6 5, 3, 3 7 2 2 10 ext / 2 int 8 Each number in the sequence represents an instantiation of Timer_A with its associated number of capture compare registers and PWM output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_A, the first instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively. Each number in the sequence represents an instantiation of Timer_B with its associated number of capture compare registers and PWM output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_B, the first instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively. Ordering Information (1) TA -40C to 85C PACKAGED DEVICES (2) PLASTIC 80-PIN LQFP (PN) MSP430F5329IPN (3) MSP430F5327IPN (3) MSP430F5325IPN (3) (1) (2) (3) 2 PLASTIC 64-PIN VQFN (RGC) PLASTIC 80-BALL BGA (ZQE) MSP430F5328IRGC (3) MSP430F5328IZQE (3) MSP430F5326IRGC (3) MSP430F5326IZQE (3) MSP430F5324IRGC (3) MSP430F5324IZQE (3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/package. Product Preview Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Functional Block Diagram - MSP430F5329IPN, MSP430F5327IPN, MSP430F5325IPN XIN XOUT RST/NMI DVCC DVSS VCORE AVCC AVSS P1.x XT2IN XT2OUT Unified Clock System ACLK SMCLK 128KB 96KB 64KB 32KB 8KB+2KB 6KB+2KB 4KB+2KB Flash RAM MCLK CPUXV2 and Working Registers Power Management LDO SVM/SVS Brownout SYS Watchdog Port Map Control (P4) PA P2.x P3.x PB P4.x P5.x PC P6.x P7.x PD P8.x I/O Ports P1/P2 2x8 I/Os Interrupt & Wakeup I/O Ports P3/P4 2x8 I/Os I/O Ports P5/P6 2x8 I/Os I/O Ports P7/P8 1x8 I/Os 1x3 I/Os PA 1x16 I/Os PB 1x16 I/Os PC 1x16 I/Os PD 1x11 I/Os LDOO LDOI PU.0, PU.1 PU Port LDO MAB DMA MDB 3 Channel EEM (L: 8+2) JTAG/ SBW Interface MPY32 TA0 TA1 TA2 TB0 Timer_A 5 CC Registers Timer_A 3 CC Registers Timer_A 3 CC Registers Timer_B 7 CC Registers Copyright (c) 2010-2011, Texas Instruments Incorporated RTC_A CRC16 USCI0,1 ADC12_A USCI_Ax: UART, IrDA, SPI 12 Bit 200 KSPS USCI_Bx: SPI, I2C 16 Channels (14 ext/2 int) Autoscan REF COMP_B 12 Channels Submit Documentation Feedback 3 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Pin Designation - MSP430F5329IPN, MSP430F5327IPN, MSP430F5325IPN 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 P6.3/CB3/A3 P6.2/CB2/A2 P6.1/CB1/A1 P6.0/CB0/A0 RST/NMI/SBWTDIO PJ.3/TCK PJ.2/TMS PJ.1/TDI/TCLK PJ.0/TDO TEST/SBWTCK P5.3/XT2OUT P5.2/XT2IN AVSS2 NC LDOO LDOI PU.1 NC PU.0 VSSU PN PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 MSP430F5329IPN MSP430F5327IPN MSP430F5325IPN P7.7/TB0CLK/MCLK P7.6/TB0.4 P7.5/TB0.3 P7.4/TB0.2 P5.7/TB0.1 P5.6/TB0.0 P4.7/PM_NONE P4.6/PM_NONE P4.5/PM_UCA1RXD/PM_UCA1SOMI P4.4/PM_UCA1TXD/PM_UCA1SIMO DVCC2 DVSS2 P4.3/PM_UCB1CLK/PM_UCA1STE P4.2/PM_UCB1SOMI/PM_UCB1SCL P4.1/PM_UCB1SIMO/PM_UCB1SDA P4.0/PM_UCB1STE/PM_UCA1CLK P3.7/TB0OUTH/SVMOUT P3.6/TB0.6 P3.5/TB0.5 P3.4/UCA0RXD/UCA0SOMI P1.0/TA0CLK/ACLK P1.1/TA0.0 P1.2/TA0.1 P1.3/TA0.2 P1.4/TA0.3 P1.5/TA0.4 P1.6/TA1CLK/CBOUT P1.7/TA1.0 P2.0/TA1.1 P2.1/TA1.2 P2.2/TA2CLK/SMCLK P2.3/TA2.0 P2.4/TA2.1 P2.5/TA2.2 P2.6/RTCCLK/DMAE0 P2.7/UCB0STE/UCA0CLK P3.0/UCB0SIMO/UCB0SDA P3.1/UCB0SOMI/UCB0SCL P3.2/UCB0CLK/UCA0STE P3.3/UCA0TXD/UCA0SIMO 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 P6.4/CB4/A4 P6.5/CB5/A5 P6.6/CB6/A6 P6.7/CB7/A7 P7.0/CB8/A12 P7.1/CB9/A13 P7.2/CB10/A14 P7.3/CB11/A15 P5.0/A8/VREF+/VeREF+ P5.1/A9/VREF-/VeREF- AVCC1 P5.4/XIN P5.5/XOUT AVSS1 P8.0 P8.1 P8.2 DVCC1 DVSS1 VCORE 4 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Functional Block Diagram - MSP430F5328IRGC, MSP430F5326IRGC, MSP430F5324IRGC, MSP430F5328IZQE, MSP430F5326IZQE, MSP430F5324IZQE XIN XOUT RST/NMI DVCC DVSS VCORE AVCC AVSS P1.x XT2IN XT2OUT Unified Clock System ACLK SMCLK 128KB 96KB 64KB 32KB 8KB+2KB 6KB+2KB 4KB+2KB MCLK Flash CPUXV2 and Working Registers RAM Power Management LDO SVM/SVS Brownout SYS Watchdog Port Map Control (P4) PA P2.x P3.x PB P4.x P5.x PC P6.x I/O Ports P1/P2 2x8 I/Os Interrupt & Wakeup I/O Ports P3/P4 1x5 I/Os 1x8 I/Os I/O Ports P5/P6 1x6 I/Os 1x8 I/Os PA 1x16 I/Os PB 1x13 I/Os PC 1x14 I/Os LDOO LDOI PU.0, PU.1 PU Port LDO MAB DMA MDB 3 Channel EEM (L: 8+2) JTAG/ SBW Interface MPY32 TA0 TA1 TA2 TB0 Timer_A 5 CC Registers Timer_A 3 CC Registers Timer_A 3 CC Registers Timer_B 7 CC Registers Copyright (c) 2010-2011, Texas Instruments Incorporated RTC_A CRC16 USCI0,1 ADC12_A USCI_Ax: UART, IrDA, SPI 12 Bit 200 KSPS USCI_Bx: SPI, I2C 12 Channels (10 ext/2 int) Autoscan REF COMP_B 8 Channels Submit Documentation Feedback 5 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Pin Designation - MSP430F5328IRGC, MSP430F5326IRGC, MSP430F5324IRGC RST/NMI/SBWTDIO PJ.3/TCK PJ.2/TMS PJ.1/TDI/TCLK PJ.0/TDO TEST/SBWTCK P5.3/XT2OUT P5.2/XT2IN AVSS2 NC LDOO LDOI PU.1 NC PU.0 VSSU RGC PACKAGE (TOP VIEW) P6.0/CB0/A0 P6.1/CB1/A1 P6.2/CB2/A2 P6.3/CB3/A3 P6.4/CB4/A4 P6.5/CB5/A5 P6.6/CB6/A6 P6.7/CB7/A7 P5.0/A8/VREF+/VeREF+ P5.1/A9/VREF-/VeREF- AVCC1 2 47 3 46 4 45 5 44 6 43 7 8 9 42 MSP430F5328IRGC MSP430F5326IRGC MSP430F5324IRGC 41 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 P4.7/PM_NONE P4.6/PM_NONE P4.5/PM_UCA1RXD/PM_UCA1SOMI P4.4/PM_UCA1TXD/PM_UCA1SIMO P4.3/PM_UCB1CLK/PM_UCA1STE P4.2/PM_UCB1SOMI/PM_UCB1SCL P4.1/PM_UCB1SIMO/PM_UCB1SDA P4.0/PM_UCB1STE/PM_UCA1CLK DVCC2 DVSS2 P3.4/UCA0RXD/UCA0SOMI P3.3/UCA0TXD/UCA0SIMO P3.2/UCB0CLK/UCA0STE P3.1/UCB0SOMI/UCB0SCL P3.0/UCB0SIMO/UCB0SDA P2.7/UCB0STE/UCA0CLK VCORE P1.0/TA0CLK/ACLK P1.1/TA0.0 P1.2/TA0.1 P1.3/TA0.2 P1.4/TA0.3 P1.5/TA0.4 P1.6/TA1CLK/CBOUT P1.7/TA1.0 P2.0/TA1.1 P2.1/TA1.2 P2.2/TA2CLK/SMCLK P2.3/TA2.0 P2.4/TA2.1 P2.5/TA2.2 P2.6/RTCCLK/DMAE0 P5.4/XIN P5.5/XOUT AVSS1 DVCC1 DVSS1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 1 6 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Pin Designation - MSP430F5328IZQE, MSP430F5326IZQE, MSP430F5324IZQE ZQE PACKAGE (TOP VIEW) A1 A2 A3 A4 A5 A6 A7 A8 A9 B1 B2 B3 B4 B5 B6 B7 B8 B9 C1 C2 C4 C5 C6 C7 C8 C9 D1 D2 D3 D4 D5 D6 D7 D8 D9 E1 E2 E3 E4 E5 E6 E7 E8 E9 F1 F2 F3 F4 F5 F6 F7 F8 F9 G1 G2 G3 G4 G5 G6 G7 G8 G9 H1 H2 H3 H4 H5 H6 H7 H8 H9 J1 J2 J3 J4 J5 J6 J7 J8 J9 Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 7 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 2. Terminal Functions TERMINAL NAME I/O (1) NO. DESCRIPTION PN RGC ZQE P6.4/CB4/A4 1 5 C1 I/O General-purpose digital I/O Comparator_B input CB4 Analog input A4 - ADC P6.5/CB5/A5 2 6 D2 I/O General-purpose digital I/O Comparator_B input CB5 Analog input A5 - ADC P6.6/CB6/A6 3 7 D1 I/O General-purpose digital I/O Comparator_B input CB6 Analog input A6 - ADC P6.7/CB7/A7 4 8 D3 I/O General-purpose digital I/O Comparator_B input CB7 Analog input A7 - ADC P7.0/CB8/A12 5 N/A N/A I/O General-purpose digital I/O (not available on 'F5328, 'F5326, 'F5324 devices) Comparator_B input CB8 (not available on 'F5328, 'F5326, 'F5324 devices) Analog input A12 - ADC P7.1/CB9/A13 6 N/A N/A I/O General-purpose digital I/O (not available on 'F5328, 'F5326, 'F5324 devices) Comparator_B input CB9 (not available on 'F5328, 'F5326, 'F5324 devices) Analog input A13 - ADC P7.2/CB10/A14 7 N/A N/A I/O General-purpose digital I/O (not available on 'F5328, 'F5326, 'F5324 devices) Comparator_B input CB10 (not available on 'F5328, 'F5326, 'F5324 devices) Analog input A14 - ADC P7.3/CB11/A15 8 N/A N/A I/O General-purpose digital I/O (not available on 'F5328, 'F5326, 'F5324 devices) Comparator_B input CB11 (not available on 'F5328, 'F5326, 'F5324 devices) Analog input A15 - ADC I/O General-purpose digital I/O Analog input A8 - ADC Output of reference voltage to the ADC Input for an external reference voltage to the ADC I/O General-purpose digital I/O Analog input A9 - ADC Negative terminal for the ADC's reference voltage for both sources, the internal reference voltage, or an external applied reference voltage P5.0/A8/VREF+/VeREF+ 9 9 E1 P5.1/A9/VREF-/VeREF- 10 10 E2 AVCC1 11 11 F2 P5.4/XIN 12 12 F1 I/O General-purpose digital I/O Input terminal for crystal oscillator XT1 P5.5/XOUT 13 13 G1 I/O General-purpose digital I/O Output terminal of crystal oscillator XT1 AVSS1 14 14 G2 P8.0 15 N/A N/A I/O General-purpose digital I/O P8.1 16 N/A N/A I/O General-purpose digital I/O P8.2 17 N/A N/A I/O General-purpose digital I/O DVCC1 18 15 H1 Digital power supply DVSS1 19 16 J1 Digital ground supply (1) 8 Analog power supply Analog ground supply I = input, O = output, N/A = not available Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 2. Terminal Functions (continued) TERMINAL NAME I/O (1) NO. DESCRIPTION PN RGC ZQE 20 17 J2 P1.0/TA0CLK/ACLK 21 18 H2 I/O General-purpose digital I/O with port interrupt TA0 clock signal TA0CLK input ; ACLK output (divided by 1, 2, 4, or 8) P1.1/TA0.0 22 19 H3 I/O General-purpose digital I/O with port interrupt TA0 CCR0 capture: CCI0A input, compare: Out0 output BSL transmit output P1.2/TA0.1 23 20 J3 I/O General-purpose digital I/O with port interrupt TA0 CCR1 capture: CCI1A input, compare: Out1 output BSL receive input P1.3/TA0.2 24 21 G4 I/O General-purpose digital I/O with port interrupt TA0 CCR2 capture: CCI2A input, compare: Out2 output P1.4/TA0.3 25 22 H4 I/O General-purpose digital I/O with port interrupt TA0 CCR3 capture: CCI3A input compare: Out3 output P1.5/TA0.4 26 23 J4 I/O General-purpose digital I/O with port interrupt TA0 CCR4 capture: CCI4A input, compare: Out4 output P1.6/TA1CLK/CBOUT 27 24 G5 I/O General-purpose digital I/O with port interrupt TA1 clock signal TA1CLK input Comparator_B output P1.7/TA1.0 28 25 H5 I/O General-purpose digital I/O with port interrupt TA1 CCR0 capture: CCI0A input, compare: Out0 output P2.0/TA1.1 29 26 J5 I/O General-purpose digital I/O with port interrupt TA1 CCR1 capture: CCI1A input, compare: Out1 output P2.1/TA1.2 30 27 G6 I/O General-purpose digital I/O with port interrupt TA1 CCR2 capture: CCI2A input, compare: Out2 output P2.2/TA2CLK/SMCLK 31 28 J6 I/O General-purpose digital I/O with port interrupt TA2 clock signal TA2CLK input ; SMCLK output P2.3/TA2.0 32 29 H6 I/O General-purpose digital I/O with port interrupt TA2 CCR0 capture: CCI0A input, compare: Out0 output P2.4/TA2.1 33 30 J7 I/O General-purpose digital I/O with port interrupt TA2 CCR1 capture: CCI1A input, compare: Out1 output P2.5/TA2.2 34 31 J8 I/O General-purpose digital I/O with port interrupt TA2 CCR2 capture: CCI2A input, compare: Out2 output P2.6/RTCCLK/DMAE0 35 32 J9 I/O General-purpose digital I/O with port interrupt RTC clock output for calibration DMA external trigger input I/O General-purpose digital I/O with port interrupt Slave transmit enable - USCI_B0 SPI mode Clock signal input - USCI_A0 SPI slave mode Clock signal output - USCI_A0 SPI master mode VCORE (2) P2.7/UCB0STE/ UCA0CLK (2) 36 33 H7 Regulated core power supply output (internal usage only, no external current loading) VCORE is for internal usage only. No external current loading is possible. VCORE should only be connected to the recommended capacitor value, CVCORE. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 9 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 2. Terminal Functions (continued) TERMINAL NAME I/O (1) NO. DESCRIPTION PN RGC ZQE P3.0/UCB0SIMO/ UCB0SDA 37 34 H8 I/O General-purpose digital I/O Slave in, master out - USCI_B0 SPI mode I2C data - USCI_B0 I2C mode P3.1/UCB0SOMI/ UCB0SCL 38 35 H9 I/O General-purpose digital I/O Slave out, master in - USCI_B0 SPI mode I2C clock - USCI_B0 I2C mode General-purpose digital I/O Clock signal input - USCI_B0 SPI slave mode Clock signal output - USCI_B0 SPI master mode Slave transmit enable - USCI_A0 SPI mode P3.2/UCB0CLK/ UCA0STE 39 36 G8 I/O P3.3/UCA0TXD/ UCA0SIMO 40 37 G9 I/O P3.4/UCA0RXD/ UCA0SOMI 41 38 G7 I/O General-purpose digital I/O Receive data - USCI_A0 UART mode Slave out, master in - USCI_A0 SPI mode P3.5/TB0.5 42 N/A N/A I/O General-purpose digital I/O (not available on 'F5328, 'F5326, 'F5324 devices) TB0 CCR5 capture: CCI5A input, compare: Out5 output P3.6/TB0.6 43 N/A N/A I/O General-purpose digital I/O (not available on 'F5328, 'F5326, 'F5324 devices) TB0 CCR6 capture: CCI6A input, compare: Out6 output I/O General-purpose digital I/O (not available on 'F5328, 'F5326, 'F5324 devices) Switch all PWM outputs high-impedance input - TB0 (not available on 'F5328, 'F5326, 'F5324 devices) SVM output (not available on 'F5328, 'F5326, 'F5324 devices) I/O General-purpose digital I/O with reconfigurable port mapping secondary function Default mapping: Slave transmit enable - USCI_B1 SPI mode Default mapping: Clock signal input - USCI_A1 SPI slave mode Default mapping: Clock signal output - USCI_A1 SPI master mode I/O General-purpose digital I/O with reconfigurable port mapping secondary function Default mapping: Slave in, master out - USCI_B1 SPI mode Default mapping: I2C data - USCI_B1 I2C mode I/O General-purpose digital I/O with reconfigurable port mapping secondary function Default mapping: Slave out, master in - USCI_B1 SPI mode Default mapping: I2C clock - USCI_B1 I2C mode I/O General-purpose digital I/O with reconfigurable port mapping secondary function Default mapping: Clock signal input - USCI_B1 SPI slave mode Default mapping: Clock signal output - USCI_B1 SPI master mode Default mapping: Slave transmit enable - USCI_A1 SPI mode P3.7/TB0OUTH/ SVMOUT P4.0/PM_UCB1STE/ PM_UCA1CLK P4.1/PM_UCB1SIMO/ PM_UCB1SDA P4.2/PM_UCB1SOMI/ PM_UCB1SCL General-purpose digital I/O 44 45 46 47 N/A 41 42 43 N/A E8 E7 D9 Transmit data - USCI_A0 UART mode Slave in, master out - USCI_A0 SPI mode P4.3/PM_UCB1CLK/ PM_UCA1STE 48 44 DVSS2 49 39 F9 Digital ground supply DVCC2 50 40 E9 Digital power supply 10 Submit Documentation Feedback D8 Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 2. Terminal Functions (continued) TERMINAL NAME P4.4/PM_UCA1TXD/ PM_UCA1SIMO NO. PN 51 RGC 45 I/O (1) DESCRIPTION I/O General-purpose digital I/O with reconfigurable port mapping secondary function Default mapping: Transmit data - USCI_A1 UART mode Default mapping: Slave in, master out - USCI_A1 SPI mode ZQE D7 P4.5/PM_UCA1RXD/ PM_UCA1SOMI 52 46 C9 I/O General-purpose digital I/O with reconfigurable port mapping secondary function Default mapping: Receive data - USCI_A1 UART mode Default mapping: Slave out, master in - USCI_A1 SPI mode P4.6/PM_NONE 53 47 C8 I/O General-purpose digital I/O with reconfigurable port mapping secondary function Default mapping: no secondary function. P4.7/PM_NONE 54 48 C7 I/O General-purpose digital I/O with reconfigurable port mapping secondary function Default mapping: no secondary function. P5.6/TB0.0 55 N/A N/A I/O General-purpose digital I/O (not available on 'F5328, 'F5326, 'F5324 devices) TB0 CCR0 capture: CCI0A input, compare: Out0 output (not available on 'F5328, 'F5326, 'F5324 devices) P5.7/TB0.1 56 N/A N/A I/O General-purpose digital I/O (not available on 'F5328, 'F5326, 'F5324 devices) TB0 CCR1 capture: CCI1A input, compare: Out1 output (not available on 'F5328, 'F5326, 'F5324 devices) P7.4/TB0.2 57 N/A N/A I/O General-purpose digital I/O (not available on 'F5328, 'F5326, 'F5324 devices) TB0 CCR2 capture: CCI2A input, compare: Out2 output (not available on 'F5328, 'F5326, 'F5324 devices) P7.5/TB0.3 58 N/A N/A I/O General-purpose digital I/O (not available on 'F5328, 'F5326, 'F5324 devices) TB0 CCR3 capture: CCI3A input, compare: Out3 output (not available on 'F5328, 'F5326, 'F5324 devices) P7.6/TB0.4 59 N/A N/A I/O General-purpose digital I/O (not available on 'F5328, 'F5326, 'F5324 devices) TB0 CCR4 capture: CCI4A input, compare: Out4 output (not available on 'F5328, 'F5326, 'F5324 devices) P7.7/TB0CLK/MCLK 60 N/A N/A I/O General-purpose digital I/O (not available on 'F5328, 'F5326, 'F5324 devices) TB0 clock signal TBCLK input (not available on 'F5328, 'F5326, 'F5324 devices) MCLK output (not available on 'F5328, 'F5326, 'F5324 devices) VSSU 61 49 B8, B9 PU.0 62 50 A9 I/O General-purpose digital I/O - controlled by PU control register NC 63 51 B7 I/O No connect PU.1 64 52 A8 I/O General-purpose digital I/O - controlled by PU control register LDOI 65 53 A7 LDO input LDOO 66 54 A6 LDO output NC 67 55 B6 No connect AVSS2 68 56 A5 Analog ground supply P5.2/XT2IN 69 57 B5 I/O General-purpose digital I/O Input terminal for crystal oscillator XT2 P5.3/XT2OUT 70 58 B4 I/O General-purpose digital I/O Output terminal of crystal oscillator XT2 Copyright (c) 2010-2011, Texas Instruments Incorporated PU ground supply Submit Documentation Feedback 11 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 2. Terminal Functions (continued) TERMINAL NAME I/O (1) NO. DESCRIPTION PN RGC ZQE TEST/SBWTCK (3) 71 59 A4 I PJ.0/TDO (4) 72 60 C5 I/O General-purpose digital I/O JTAG test data output port PJ.1/TDI/TCLK (4) 73 61 C4 I/O General-purpose digital I/O JTAG test data input or test clock input PJ.2/TMS (4) 74 62 A3 I/O General-purpose digital I/O JTAG test mode select PJ.3/TCK (4) 75 63 B3 I/O General-purpose digital I/O JTAG test clock RST/NMI/SBWTDIO (3) 76 64 A2 I/O Reset input active low Non-maskable interrupt input Spy-Bi-Wire data input/output when Spy-Bi-Wire operation activated. P6.0/CB0/A0 77 1 A1 I/O General-purpose digital I/O Comparator_B input CB0 Analog input A0 - ADC P6.1/CB1/A1 78 2 B2 I/O General-purpose digital I/O Comparator_B input CB1 Analog input A1 - ADC P6.2/CB2/A2 79 3 B1 I/O General-purpose digital I/O Comparator_B input CB2 Analog input A2 - ADC P6.3/CB3/A3 80 4 C2 I/O General-purpose digital I/O Comparator_B input CB3 Analog input A3 - ADC Reserved N/A N/A (3) (4) (5) 12 Test mode pin - Selects four wire JTAG operation. Spy-Bi-Wire input clock when Spy-Bi-Wire operation activated (5) See Bootstrap Loader (BSL) and JTAG Operation for usage with BSL and JTAG functions See JTAG Operation for usage with JTAG function. C6, D4, D5, D6, E3, E4, E5, E6, F3, F4, F5, F6, F7, F8, G3 are reserved and should be connected to ground. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com SHORT-FORM DESCRIPTION CPU The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All operations, other than program-flow instructions, are performed as register operations in conjunction with seven addressing modes for source operand and four addressing modes for destination operand. The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-to-register operation execution time is one cycle of the CPU clock. Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and constant generator, respectively. The remaining registers are general-purpose registers. Peripherals are connected to the CPU using data, address, and control buses, and can be handled with all instructions. The instruction set consists of the original 51 instructions with three formats and seven address modes and additional instructions for the expanded address range. Each instruction can operate on word and byte data. Program Counter PC/R0 Stack Pointer SP/R1 Status Register Constant Generator SR/CG1/R2 CG2/R3 General-Purpose Register R4 General-Purpose Register R5 General-Purpose Register R6 General-Purpose Register R7 General-Purpose Register R8 General-Purpose Register R9 General-Purpose Register R10 General-Purpose Register R11 General-Purpose Register R12 General-Purpose Register R13 General-Purpose Register R14 General-Purpose Register R15 Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 13 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Operating Modes The MSP430 has one active mode and six software selectable low-power modes of operation. An interrupt event can wake up the device from any of the low-power modes, service the request, and restore back to the low-power mode on return from the interrupt program. The following seven operating modes can be configured by software: * Active mode (AM) - All clocks are active * Low-power mode 0 (LPM0) - CPU is disabled - ACLK and SMCLK remain active, MCLK is disabled - FLL loop control remains active * Low-power mode 1 (LPM1) - CPU is disabled - FLL loop control is disabled - ACLK and SMCLK remain active, MCLK is disabled * Low-power mode 2 (LPM2) - CPU is disabled - MCLK and FLL loop control and DCOCLK are disabled - DCO's dc-generator remains enabled - ACLK remains active * Low-power mode 3 (LPM3) - CPU is disabled - MCLK, FLL loop control, and DCOCLK are disabled - DCO's dc generator is disabled - ACLK remains active * Low-power mode 4 (LPM4) - CPU is disabled - ACLK is disabled - MCLK, FLL loop control, and DCOCLK are disabled - DCO's dc generator is disabled - Crystal oscillator is stopped - Complete data retention * Low-power mode 4.5 (LPM4.5) - Internal regulator disabled - No data retention - Wakeup from RST/NMI, P1, and P2 14 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Interrupt Vector Addresses The interrupt vectors and the power-up start address are located in the address range 0FFFFh to 0FF80h. The vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence. Table 3. Interrupt Sources, Flags, and Vectors INTERRUPT SOURCE System Reset Power-Up External Reset Watchdog Timeout, Password Violation Flash Memory Password Violation PMM Password Violation INTERRUPT FLAG WDTIFG, KEYV (SYSRSTIV) (1) (2) SYSTEM INTERRUPT WORD ADDRESS PRIORITY Reset 0FFFEh 63, highest System NMI PMM Vacant Memory Access JTAG Mailbox SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG, VLRLIFG, VLRHIFG, VMAIFG, JMBNIFG, JMBOUTIFG (SYSSNIV) (1) (Non)maskable 0FFFCh 62 User NMI NMI Oscillator Fault Flash Memory Access Violation NMIIFG, OFIFG, ACCVIFG, BUSIFG (SYSUNIV) (1) (2) (Non)maskable 0FFFAh 61 Maskable 0FFF8h 60 Maskable 0FFF6h 59 Comp_B Comparator B interrupt flags (CBIV) (1) TB0 TB0CCR0 CCIFG0 (3) (3) TB0 TB0CCR1 CCIFG1 to TB0CCR6 CCIFG6, TB0IFG (TB0IV) (1) (3) Maskable 0FFF4h 58 Watchdog Timer_A Interval Timer Mode WDTIFG Maskable 0FFF2h 57 USCI_A0 Receive/Transmit UCA0RXIFG, UCA0TXIFG (UCA0IV) (1) 0FFF0h 56 Maskable 0FFEEh 55 Maskable 0FFECh 54 Maskable 0FFEAh 53 Maskable 0FFE8h 52 Maskable 0FFE6h 51 Maskable 0FFE4h 50 Maskable 0FFE2h 49 Maskable 0FFE0h 48 UCB0RXIFG, UCB0TXIFG (UCB0IV) ADC12_A ADC12IFG0 to ADC12IFG15 (ADC12IV) (1) TA0 LDO-PWR DMA TA0CCR0 CCIFG0 (3) (4) (3) TA0CCR1 CCIFG1 to TA0CCR4 CCIFG4, TA0IFG (TA0IV) (1) (3) LDOOFFIG, LDOONIFG, LDOOVLIFG DMA0IFG, DMA1IFG, DMA2IFG (DMAIV) (1) TA1 TA1CCR0 CCIFG0 (3) TA1 TA1CCR1 CCIFG1 to TA1CCR2 CCIFG2, TA1IFG (TA1IV) (1) (3) I/O Port P1 USCI_A1 Receive/Transmit USCI_B1 Receive/Transmit P1IFG.0 to P1IFG.7 (P1IV) (1) (3) Maskable 0FFDEh 47 (3) Maskable 0FFDCh 46 (1) (3) UCA1RXIFG, UCA1TXIFG (UCA1IV) (1) Maskable 0FFDAh 45 TA2CCR0 CCIFG0 (3) Maskable 0FFD8h 44 TA2 TA2CCR1 CCIFG1 to TA2CCR2 CCIFG2, TA2IFG (TA2IV) (1) (3) Maskable 0FFD6h 43 Maskable 0FFD4h 42 Maskable 0FFD2h 41 RTC_A UCB1RXIFG, UCB1TXIFG (UCB1IV) (3) TA2 I/O Port P2 (3) (4) Maskable USCI_B0 Receive/Transmit TA0 (1) (2) (3) (1) (3) P2IFG.0 to P2IFG.7 (P2IV) (1) (3) RTCRDYIFG, RTCTEVIFG, RTCAIFG, RT0PSIFG, RT1PSIFG (RTCIV) (1) (3) Multiple source flags A reset is generated if the CPU tries to fetch instructions from within peripheral space or vacant memory space. (Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot disable it. Interrupt flags are located in the module. Only on devices with ADC, otherwise reserved. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 15 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 3. Interrupt Sources, Flags, and Vectors (continued) (5) INTERRUPT SOURCE INTERRUPT FLAG Reserved Reserved (5) SYSTEM INTERRUPT WORD ADDRESS PRIORITY 0FFD0h 40 0FF80h 0, lowest Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To maintain compatibility with other devices, it is recommended to reserve these locations. Memory Organization Table 4. Memory Organization (1) Memory (flash) Main: interrupt vector MSP430F5325 MSP430F5324 MSP430F5327 MSP430F5326 MSP430F5329 MSP430F5328 64 KB 00FFFFh-00FF80h 96 KB 00FFFFh-00FF80h 128 KB 00FFFFh-00FF80h N/A N/A 32 KB 0243FFh-01C400h N/A 32 KB 01C3FFh-014400h 32 KB 01C3FFh-014400h Bank B 32 KB 0143FFh-00C400h 32 KB 0143FFh-00C400h 32 KB 0143FFh-00C400h Bank A 32 KB 00C3FFh-004400h 32 KB 00C3FFh-004400h 32 KB 00C3FFh-004400h Sector 3 N/A N/A 2 KB 0043FFh-003C00h Sector 2 N/A 2 KB 003BFFh-003400h 2 KB 003BFFh-003400h Sector 1 2 KB 0033FFh-002C00h 2 KB 0033FFh-002C00h 2 KB 0033FFh-002C00h Sector 0 2 KB 002BFFh-002400h 2 KB 002BFFh-002400h 2 KB 002BFFh-002400h Sector 7 2 KB 0023FFh-001C00h 2 KB 0023FFh-001C00h 2 KB 0023FFh-001C00h Info A 128 B 0019FFh-001980h 128 B 0019FFh-001980h 128 B 0019FFh-001980h Info B 128 B 00197Fh-001900h 128 B 00197Fh-001900h 128 B 00197Fh-001900h Info C 128 B 0018FFh-001880h 128 B 0018FFh-001880h 128 B 0018FFh-001880h Info D 128 B 00187Fh-001800h 128 B 00187Fh-001800h 128 B 00187Fh-001800h BSL 3 512 B 0017FFh-001600h 512 B 0017FFh-001600h 512 B 0017FFh-001600h BSL 2 512 B 0015FFh-001400h 512 B 0015FFh-001400h 512 B 0015FFh-001400h BSL 1 512 B 0013FFh-001200h 512 B 0013FFh-001200h 512 B 0013FFh-001200h BSL 0 512 B 0011FFh-001000h 512 B 0011FFh-001000h 512 B 0011FFh-001000h 4 KB 000FFFh-0h 4 KB 000FFFh-0h 4 KB 000FFFh-0h Total Size Bank D Bank C Main: code memory RAM Information memory (flash) Bootstrap loader (BSL) memory (flash) Peripherals (1) 16 Size N/A = Not available. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Bootstrap Loader (BSL) The BSL enables users to program the flash memory or RAM using a UART serial interface. Access to the device memory via the BSL is protected by an user-defined password. Usage of the BSL requires four pins as shown in Table 5. BSL entry requires a specific entry sequence on the RST/NMI/SBWTDIO and TEST/SBWTCK pins. For complete description of the features of the BSL and its implementation, see MSP430 Programming Via the Bootstrap Loader (SLAU319). Table 5. BSL Pin Requirements and Functions DEVICE SIGNAL BSL FUNCTION RST/NMI/SBWTDIO Entry sequence signal TEST/SBWTCK Entry sequence signal P1.1 Data transmit P1.2 Data receive VCC Power supply VSS Ground supply JTAG Operation JTAG Standard Interface The MSP430 family supports the standard JTAG interface which requires four signals for sending and receiving data. The JTAG signals are shared with general-purpose I/O. The TEST/SBWTCK pin is used to enable the JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface with MSP430 development tools and device programmers. The JTAG pin requirements are shown in Table 6. For further details on interfacing to development tools and device programmers, see the MSP430 Hardware Tools User's Guide (SLAU278). Table 6. JTAG Pin Requirements and Functions DEVICE SIGNAL DIRECTION FUNCTION PJ.3/TCK IN JTAG clock input PJ.2/TMS IN JTAG state control PJ.1/TDI/TCLK IN JTAG data input/TCLK input PJ.0/TDO OUT JTAG data output TEST/SBWTCK IN Enable JTAG pins RST/NMI/SBWTDIO IN External reset VCC Power supply VSS Ground supply Spy-Bi-Wire Interface In addition to the standard JTAG interface, the MSP430 family supports the two wire Spy-Bi-Wire interface. Spy-Bi-Wire can be used to interface with MSP430 development tools and device programmers. The Spy-Bi-Wire interface pin requirements are shown in Table 7. For further details on interfacing to development tools and device programmers, see the MSP430 Hardware Tools User's Guide (SLAU278). Table 7. Spy-Bi-Wire Pin Requirements and Functions DEVICE SIGNAL DIRECTION FUNCTION TEST/SBWTCK IN Spy-Bi-Wire clock input RST/NMI/SBWTDIO IN, OUT Spy-Bi-Wire data input/output VCC Power supply VSS Ground supply Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 17 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Flash Memory The flash memory can be programmed via the JTAG port, Spy-Bi-Wire (SBW), the BSL, or in-system by the CPU. The CPU can perform single-byte, single-word, and long-word writes to the flash memory. Features of the flash memory include: * Flash memory has n segments of main memory and four segments of information memory (A to D) of 128 bytes each. Each segment in main memory is 512 bytes in size. * Segments 0 to n may be erased in one step, or each segment may be individually erased. * Segments A to D can be erased individually. Segments A to D are also called information memory. * Segment A can be locked separately. RAM Memory The RAM memory is made up of n sectors. Each sector can be completely powered down to save leakage, however all data is lost. Features of the RAM memory include: * RAM memory has n sectors. The size of a sector can be found in the Memory Organization section. * Each sector 0 to n can be complete disabled, however data retention is lost. * Each sector 0 to n automatically enters low power retention mode when possible. Peripherals Peripherals are connected to the CPU through data, address, and control buses and can be handled using all instructions. For complete module descriptions, see the MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208). Digital I/O There are up to eight 8-bit I/O ports implemented: For 80-pin options, P1, P2, P3, P4, P5, P6, and P7 are complete, and P8 is reduced to 3-bit I/O. For 64-pin options, P3 and P5 are reduced to 5-bit I/O and 6-bit I/O, respectively, and P7 and P8 are completely removed. Port PJ contains four individual I/O ports, common to all devices. * All individual I/O bits are independently programmable. * Any combination of input, output, and interrupt conditions is possible. * Pullup or pulldown on all ports is programmable. * Drive strength on all ports is programmable. * Edge-selectable interrupt and LPM4.5 wakeup input capability is available for all bits of ports P1 and P2. * Read/write access to port-control registers is supported by all instructions. * Ports can be accessed byte-wise (P1 through P8) or word-wise in pairs (PA through PD). 18 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port Mapping Controller The port mapping controller allows the flexible and reconfigurable mapping of digital functions to port P4. Table 8. Port Mapping, Mnemonics and Functions Value PxMAPy Mnemonic Input Pin Function 0 PM_NONE None DVSS PM_CBOUT0 - Comparator_B output PM_TB0CLK TB0 clock input 1 PM_ADC12CLK - PM_DMAE0 DMAE0 input PM_SVMOUT - PM_TB0OUTH TB0 high-impedance input TB0OUTH 4 PM_TB0CCR0A TB0 CCR0 capture input CCI0A TB0 CCR0 compare output Out0 5 PM_TB0CCR1A TB0 CCR1 capture input CCI1A TB0 CCR1 compare output Out1 6 PM_TB0CCR2A TB0 CCR2 capture input CCI2A TB0 CCR2 compare output Out2 7 PM_TB0CCR3A TB0 CCR3 capture input CCI3A TB0 CCR3 compare output Out3 8 PM_TB0CCR4A TB0 CCR4 capture input CCI4A TB0 CCR4 compare output Out4 9 PM_TB0CCR5A TB0 CCR5 capture input CCI5A TB0 CCR5 compare output Out5 10 PM_TB0CCR6A TB0 CCR6 capture input CCI6A TB0 CCR6 compare output Out6 2 3 11 12 13 14 15 16 ADC12CLK SVM output PM_UCA1RXD USCI_A1 UART RXD (Direction controlled by USCI - input) PM_UCA1SOMI USCI_A1 SPI slave out master in (direction controlled by USCI) PM_UCA1TXD USCI_A1 UART TXD (Direction controlled by USCI - output) PM_UCA1SIMO USCI_A1 SPI slave in master out (direction controlled by USCI) PM_UCA1CLK USCI_A1 clock input/output (direction controlled by USCI) PM_UCB1STE USCI_B1 SPI slave transmit enable (direction controlled by USCI) PM_UCB1SOMI USCI_B1 SPI slave out master in (direction controlled by USCI) PM_UCB1SCL USCI_B1 I2C clock (open drain and direction controlled by USCI) PM_UCB1SIMO USCI_B1 SPI slave in master out (direction controlled by USCI) PM_UCB1SDA USCI_B1 I2C data (open drain and direction controlled by USCI) PM_UCB1CLK USCI_B1 clock input/output (direction controlled by USCI) PM_UCA1STE USCI_A1 SPI slave transmit enable (direction controlled by USCI) 17 PM_CBOUT1 None Comparator_B output 18 PM_MCLK None MCLK None DVSS 19 - 30 31 (0FFh) (1) Output Pin Function Reserved (1) PM_ANALOG Disables the output driver as well as the input Schmitt-trigger to prevent parasitic cross currents when applying analog signals. The value of the PMPAP_ANALOG mnemonic is set to 0FFh. The port mapping registers are only 5 bits wide and the upper bits are ignored resulting in a read out value of 31. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 19 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 9. Default Mapping Pin PxMAPy Mnemonic Input Pin Function Output Pin Function P4.0/P4MAP0 PM_UCB1STE/PM_UCA1CLK USCI_B1 SPI slave transmit enable (direction controlled by USCI) USCI_A1 clock input/output (direction controlled by USCI) P4.1/P4MAP1 PM_UCB1SIMO/PM_UCB1SDA USCI_B1 SPI slave in master out (direction controlled by USCI) USCI_B1 I2C data (open drain and direction controlled by USCI) P4.2/P4MAP2 PM_UCB1SOMI/PM_UCB1SCL USCI_B1 SPI slave out master in (direction controlled by USCI) USCI_B1 I2C clock (open drain and direction controlled by USCI) P4.3/P4MAP3 PM_UCB1CLK/PM_UCA1STE USCI_A1 SPI slave transmit enable (direction controlled by USCI) USCI_B1 clock input/output (direction controlled by USCI) P4.4/P4MAP4 PM_UCA1TXD/PM_UCA1SIMO USCI_A1 UART TXD (Direction controlled by USCI - output) USCI_A1 SPI slave in master out (direction controlled by USCI) P4.5/P4MAP5 PM_UCA1RXD/PM_UCA1SOMI USCI_A1 UART RXD (Direction controlled by USCI - input) USCI_A1 SPI slave out master in (direction controlled by USCI) P4.6/P4MAP6 PM_NONE None DVSS P4.7/P4MAP7 PM_NONE None DVSS Oscillator and System Clock The clock system in the MSP430F532x family of devices is supported by the Unified Clock System (UCS) module that includes support for a 32-kHz watch crystal oscillator (XT1 LF mode only; XT1 HF mode is not supported), an internal very-low-power low-frequency oscillator (VLO), an internal trimmed low-frequency oscillator (REFO), an integrated internal digitally-controlled oscillator (DCO), and a high-frequency crystal oscillator XT2. The UCS module is designed to meet the requirements of both low system cost and low power consumption. The UCS module features digital frequency-locked loop (FLL) hardware that, in conjunction with a digital modulator, stabilizes the DCO frequency to a programmable multiple of the selected FLL reference frequency. The internal DCO provides a fast turn-on clock source and stabilizes in 3.5 s (typical). The UCS module provides the following clock signals: * Auxiliary clock (ACLK), sourced from a 32-kHz watch crystal (XT1), a high-frequency crystal (XT2), the internal low-frequency oscillator (VLO), the trimmed low-frequency oscillator (REFO), or the internal DCO. * Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources made available to ACLK. * Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be sourced by same sources made available to ACLK. * ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32. Power Management Module (PMM) The PMM includes an integrated voltage regulator that supplies the core voltage to the device and contains programmable output levels to provide for power optimization. The PMM also includes supply voltage supervisor (SVS) and supply voltage monitoring (SVM) circuitry, as well as brownout protection. The brownout circuit is implemented to provide the proper internal reset signal to the device during power-on and power-off. The SVS/SVM circuitry detects if the supply voltage drops below a user-selectable level and supports both supply voltage supervision (the device is automatically reset) and supply voltage monitoring (the device is not automatically reset). SVS and SVM circuitry are available on the primary supply and core supply. Hardware Multiplier The multiplication operation is supported by a dedicated peripheral module. The module performs operations with 32-bit, 24-bit, 16-bit, and 8-bit operands. The module is capable of supporting signed and unsigned multiplication as well as signed and unsigned multiply and accumulate operations. Real-Time Clock (RTC_A) The RTC_A module can be used as a general-purpose 32-bit counter (counter mode) or as an integrated real-time clock (RTC) (calendar mode). In counter mode, the RTC_A also includes two independent 8-bit timers that can be cascaded to form a 16-bit timer/counter. Both timers can be read and written by software. Calendar mode integrates an internal calendar which compensates for months with less than 31 days and includes leap year correction. The RTC_A also supports flexible alarm functions and offset-calibration hardware. 20 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Watchdog Timer (WDT_A) The primary function of the watchdog timer (WDT_A) module is to perform a controlled system restart after a software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed in an application, the module can be configured as an interval timer and can generate interrupts at selected time intervals. System Module (SYS) The SYS module handles many of the system functions within the device. These include power on reset and power up clear handling, NMI source selection and management, reset interrupt vector generators, boot strap loader entry mechanisms, as well as, configuration management (device descriptors). It also includes a data exchange mechanism via JTAG called a JTAG mailbox that can be used in the application. Table 10. System Module Interrupt Vector Registers INTERRUPT VECTOR REGISTER ADDRESS INTERRUPT EVENT VALUE SYSRSTIV , System Reset 019Eh No interrupt pending 00h Brownout (BOR) 02h RST/NMI (POR) 04h PMMSWBOR (BOR) 06h Wakeup from LPMx.5 08h SYSSNIV , System NMI SYSUNIV, User NMI 019Ch 019Ah Copyright (c) 2010-2011, Texas Instruments Incorporated Security violation (BOR) 0Ah SVSL (POR) 0Ch SVSH (POR) 0Eh SVML_OVP (POR) 10h SVMH_OVP (POR) 12h PMMSWPOR (POR) 14h WDT timeout (PUC) 16h WDT password violation (PUC) 18h KEYV flash password violation (PUC) 1Ah FLL unlock (PUC) 1Ch Peripheral area fetch (PUC) 1Eh PMM password violation (PUC) 20h Reserved 22h to 3Eh No interrupt pending 00h SVMLIFG 02h SVMHIFG 04h SVSMLDLYIFG 06h SVSMHDLYIFG 08h VMAIFG 0Ah JMBINIFG 0Ch JMBOUTIFG 0Eh SVMLVLRIFG 10h SVMHVLRIFG 12h Reserved 14h to 1Eh No interrupt pending 00h NMIFG 02h OFIFG 04h ACCVIFG 06h Reserved 08h Reserved 0Ah to 1Eh PRIORITY Highest Lowest Highest Lowest Highest Lowest Submit Documentation Feedback 21 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com DMA Controller The DMA controller allows movement of data from one memory address to another without CPU intervention. For example, the DMA controller can be used to move data from the ADC12_A conversion memory to RAM. Using the DMA controller can increase the throughput of peripheral modules. The DMA controller reduces system power consumption by allowing the CPU to remain in sleep mode, without having to awaken to move data to or from a peripheral. Table 11. DMA Trigger Assignments (1) Trigger (1) 22 Channel 0 1 2 0 DMAREQ DMAREQ DMAREQ 1 TA0CCR0 CCIFG TA0CCR0 CCIFG TA0CCR0 CCIFG 2 TA0CCR2 CCIFG TA0CCR2 CCIFG TA0CCR2 CCIFG 3 TA1CCR0 CCIFG TA1CCR0 CCIFG TA1CCR0 CCIFG 4 TA1CCR2 CCIFG TA1CCR2 CCIFG TA1CCR2 CCIFG 5 TA2CCR0 CCIFG TA2CCR0 CCIFG TA2CCR0 CCIFG 6 TA2CCR2 CCIFG TA2CCR2 CCIFG TA2CCR2 CCIFG 7 TB0CCR0 CCIFG TB0CCR0 CCIFG TB0CCR0 CCIFG 8 TB0CCR2 CCIFG TB0CCR2 CCIFG TB0CCR2 CCIFG 9 Reserved Reserved Reserved 10 Reserved Reserved Reserved 11 Reserved Reserved Reserved 12 Reserved Reserved Reserved 13 Reserved Reserved Reserved 14 Reserved Reserved Reserved 15 Reserved Reserved Reserved 16 UCA0RXIFG UCA0RXIFG UCA0RXIFG 17 UCA0TXIFG UCA0TXIFG UCA0TXIFG 18 UCB0RXIFG UCB0RXIFG UCB0RXIFG 19 UCB0TXIFG UCB0TXIFG UCB0TXIFG 20 UCA1RXIFG UCA1RXIFG UCA1RXIFG 21 UCA1TXIFG UCA1TXIFG UCA1TXIFG 22 UCB1RXIFG UCB1RXIFG UCB1RXIFG 23 UCB1TXIFG UCB1TXIFG UCB1TXIFG 24 ADC12IFGx ADC12IFGx ADC12IFGx 25 Reserved Reserved Reserved 26 Reserved Reserved Reserved 27 Reserved Reserved Reserved 28 Reserved Reserved Reserved 29 MPY ready MPY ready MPY ready 30 DMA2IFG DMA0IFG DMA1IFG 31 DMAE0 DMAE0 DMAE0 If a reserved trigger source is selected, no trigger is generated. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Universal Serial Communication Interface (USCI) The USCI modules are used for serial data communication. The USCI module supports synchronous communication protocols such as SPI (3 or 4 pin) and I2C, and asynchronous communication protocols such as UART, enhanced UART with automatic baudrate detection, and IrDA. Each USCI module contains two portions, A and B. The USCI_An module provides support for SPI (3 pin or 4 pin), UART, enhanced UART, or IrDA. The USCI_Bn module provides support for SPI (3 pin or 4 pin) or I2C. The MSP430F532x series includes two complete USCI modules (n = 0, 1). TA0 TA0 is a 16-bit timer/counter (Timer_A type) with five capture/compare registers. It can support multiple capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers. Table 12. TA0 Signal Connections INPUT PIN NUMBER RGC/ZQE PN DEVICE INPUT SIGNAL MODULE INPUT SIGNAL 18/H2-P1.0 21-P1.0 TA0CLK TACLK ACLK (internal) ACLK SMCLK (internal) SMCLK MODULE BLOCK MODULE OUTPUT SIGNAL DEVICE OUTPUT SIGNAL Timer NA NA OUTPUT PIN NUMBER RGC/ZQE PN 19/H3-P1.1 22-P1.1 18/H2-P1.0 21-P1.0 TA0CLK TACLK 19/H3-P1.1 22-P1.1 TA0.0 CCI0A DVSS CCI0B DVSS GND DVCC VCC TA0.1 CCI1A 20/J3-P1.2 23-P1.2 CBOUT (internal) CCI1B ADC12 (internal) ADC12SHSx = {1} ADC12 (internal) ADC12SHSx = {1} DVSS GND 21/G4-P1.3 24-P1.3 22/H4-P1.4 25-P1.4 23/J4-P1.5 26-P1.5 20/J3-P1.2 21/G4-P1.3 22/H4-P1.4 23/J4-P1.5 23-P1.2 24-P1.3 25-P1.4 26-P1.5 DVCC VCC TA0.2 CCI2A ACLK (internal) CCI2B DVSS GND DVCC VCC TA0.3 CCI3A DVSS CCI3B DVSS GND DVCC VCC TA0.4 CCI4A DVSS CCI4B DVSS GND DVCC VCC Copyright (c) 2010-2011, Texas Instruments Incorporated CCR0 CCR1 CCR2 CCR3 CCR4 TA0 TA1 TA2 TA3 TA4 TA0.0 TA0.1 TA0.2 TA0.3 TA0.4 Submit Documentation Feedback 23 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com TA1 TA1 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. It can support multiple capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers. Table 13. TA1 Signal Connections INPUT PIN NUMBER RGC/ZQE PN DEVICE INPUT SIGNAL MODULE INPUT SIGNAL 24/G5-P1.6 27-P1.6 TA1CLK TACLK ACLK (internal) ACLK SMCLK (internal) SMCLK 24/G5-P1.6 27-P1.6 TA1CLK TACLK 25/H5-P1.7 28-P1.7 TA1.0 CCI0A DVSS CCI0B DVSS GND 26/J5-P2.0 27/G6-P2.1 24 29-P2.0 30-P2.1 DVCC VCC TA1.1 CCI1A CBOUT (internal) CCI1B DVSS GND DVCC VCC TA1.2 CCI2A ACLK (internal) CCI2B DVSS GND DVCC VCC Submit Documentation Feedback MODULE BLOCK MODULE OUTPUT SIGNAL DEVICE OUTPUT SIGNAL Timer NA NA CCR0 CCR1 CCR2 TA0 TA1 TA2 OUTPUT PIN NUMBER RGC/ZQE PN 25/H5-P1.7 28-P1.7 26/J5-P2.0 29-P2.0 27/G6-P2.1 30-P2.1 TA1.0 TA1.1 TA1.2 Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com TA2 TA2 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. It can support multiple capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers. Table 14. TA2 Signal Connections INPUT PIN NUMBER RGC/ZQE PN DEVICE INPUT SIGNAL MODULE INPUT SIGNAL 28/J6-P2.2 31-P2.2 TA2CLK TACLK ACLK (internal) ACLK SMCLK (internal) SMCLK 28/J6-P2.2 31-P2.2 TA2CLK TACLK 29/H6-P2.3 32-P2.3 TA2.0 CCI0A DVSS CCI0B DVSS GND 30/J7-P2.4 31/J8-P2.5 33-P2.4 34-P2.5 DVCC VCC TA2.1 CCI1A CBOUT (internal) CCI1B DVSS GND DVCC VCC TA2.2 CCI2A ACLK (internal) CCI2B DVSS GND DVCC VCC Copyright (c) 2010-2011, Texas Instruments Incorporated MODULE BLOCK MODULE OUTPUT SIGNAL DEVICE OUTPUT SIGNAL Timer NA NA CCR0 CCR1 CCR2 TA0 TA1 TA2 OUTPUT PIN NUMBER RGC/ZQE PN 29/H6-P2.3 32-P2.3 30/J7-P2.4 33-P2.4 31/J8-P2.5 34-P2.5 TA2.0 TA2.1 TA2.2 Submit Documentation Feedback 25 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com TB0 TB0 is a 16-bit timer/counter (Timer_B type) with seven capture/compare registers. It can support multiple capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers. Table 15. TB0 Signal Connections INPUT PIN NUMBER RGC/ZQE (1) PN DEVICE INPUT SIGNAL MODULE INPUT SIGNAL 60-P7.7 TB0CLK TBCLK ACLK (internal) ACLK SMCLK (internal) SMCLK 60-P7.7 TB0CLK TBCLK 55-P5.6 TB0.0 CCI0A 55-P5.6 56-P5.7 26 CCI0B DVSS GND DVCC VCC TB0.1 CCI1A CBOUT (internal) CCI1B DVSS GND DVCC VCC 57-P7.4 TB0.2 CCI2A 57-P7.4 TB0.2 CCI2B DVSS GND DVCC VCC 58-P7.5 TB0.3 CCI3A 58-P7.5 TB0.3 CCI3B DVSS GND DVCC VCC 59-P7.6 TB0.4 CCI4A 59-P7.6 TB0.4 CCI4B DVSS GND DVCC VCC 42-P3.5 TB0.5 CCI5A 42-P3.5 TB0.5 CCI5B DVSS GND 43-P3.6 (1) TB0.0 DVCC VCC TB0.6 CCI6A ACLK (internal) CCI6B DVSS GND DVCC VCC MODULE BLOCK MODULE OUTPUT SIGNAL DEVICE OUTPUT SIGNAL Timer NA NA OUTPUT PIN NUMBER RGC/ZQE (1) PN ADC12 (internal) ADC12SHSx = {2} ADC12 (internal) ADC12SHSx = {2} 55-P5.6 CCR0 TB0 TB0.0 56-P5.7 CCR1 TB1 TB0.1 ADC12 (internal) ADC12SHSx = {3} ADC12 (internal) ADC12SHSx = {3} 57-P7.4 CCR2 TB2 TB0.2 58-P7.5 CCR3 TB3 TB0.3 59-P7.6 CCR4 TB4 TB0.4 42-P3.5 CCR5 TB5 TB0.5 43-P3.6 CCR6 TB6 TB0.6 Timer functions selectable via the port mapping controller. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x www.ti.com SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 Comparator_B The primary function of the Comparator_B module is to support precision slope analog-to-digital conversions, battery voltage supervision, and monitoring of external analog signals. ADC12_A The ADC12_A module supports fast, 12-bit analog-to-digital conversions. The module implements a 12-bit SAR core, sample select control, reference generator and a 16 word conversion-and-control buffer. The conversion-and-control buffer allows up to 16 independent ADC samples to be converted and stored without any CPU intervention. CRC16 The CRC16 module produces a signature based on a sequence of entered data values and can be used for data checking purposes. The CRC16 module signature is based on the CRC-CCITT standard. REF Voltage Reference The reference module (REF) is responsible for generation of all critical reference voltages that can be used by the various analog peripherals in the device. Embedded Emulation Module (EEM) The Embedded Emulation Module (EEM) supports real-time in-system debugging. The L version of the EEM implemented on all devices has the following features: * Eight hardware triggers/breakpoints on memory access * Two hardware trigger/breakpoint on CPU register write access * Up to ten hardware triggers can be combined to form complex triggers/breakpoints * Two cycle counters * Sequencer * State storage * Clock control on module level Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 27 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Peripheral File Map Table 16. Peripherals 28 MODULE NAME BASE ADDRESS OFFSET ADDRESS RANGE Special Functions (see Table 17) 0100h 000h - 01Fh PMM (see Table 18) 0120h 000h - 010h Flash Control (see Table 19) 0140h 000h - 00Fh CRC16 (see Table 20) 0150h 000h - 007h RAM Control (see Table 21) 0158h 000h - 001h Watchdog (see Table 22) 015Ch 000h - 001h UCS (see Table 23) 0160h 000h - 01Fh SYS (see Table 24) 0180h 000h - 01Fh Shared Reference (see Table 25) 01B0h 000h - 001h Port Mapping Control (see Table 26) 01C0h 000h - 002h Port Mapping Port P4 (see Table 26) 01E0h 000h - 007h Port P1/P2 (see Table 27) 0200h 000h - 01Fh Port P3/P4 (see Table 28) 0220h 000h - 00Bh Port P5/P6 (see Table 29) 0240h 000h - 00Bh Port P7/P8 (see Table 30) 0260h 000h - 00Bh Port PJ (see Table 31) 0320h 000h - 01Fh TA0 (see Table 32) 0340h 000h - 02Eh TA1 (see Table 33) 0380h 000h - 02Eh TB0 (see Table 34) 03C0h 000h - 02Eh TA2 (see Table 35) 0400h 000h - 02Eh Real Timer Clock (RTC_A) (see Table 36) 04A0h 000h - 01Bh 32-bit Hardware Multiplier (see Table 37) 04C0h 000h - 02Fh DMA General Control (see Table 38) 0500h 000h - 00Fh DMA Channel 0 (see Table 38) 0510h 000h - 00Ah DMA Channel 1 (see Table 38) 0520h 000h - 00Ah DMA Channel 2 (see Table 38) 0530h 000h - 00Ah USCI_A0 (see Table 39) 05C0h 000h - 01Fh USCI_B0 (see Table 40) 05E0h 000h - 01Fh USCI_A1 (see Table 41) 0600h 000h - 01Fh USCI_B1 (see Table 42) 0620h 000h - 01Fh ADC12_A (see Table 43) 0700h 000h - 03Eh Comparator_B (see Table 44) 08C0h 000h - 00Fh LDO-PWR and Port U configuration (see Table 45) 0900h 000h - 014h Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 17. Special Function Registers (Base Address: 0100h) REGISTER DESCRIPTION REGISTER OFFSET SFR interrupt enable SFRIE1 00h SFR interrupt flag SFRIFG1 02h SFR reset pin control SFRRPCR 04h Table 18. PMM Registers (Base Address: 0120h) REGISTER DESCRIPTION REGISTER OFFSET PMM Control 0 PMMCTL0 00h PMM control 1 PMMCTL1 02h SVS high side control SVSMHCTL 04h SVS low side control SVSMLCTL 06h PMM interrupt flags PMMIFG 0Ch PMM interrupt enable PMMIE 0Eh PMM power mode 5 control PM5CTL0 10h Table 19. Flash Control Registers (Base Address: 0140h) REGISTER DESCRIPTION REGISTER OFFSET Flash control 1 FCTL1 00h Flash control 3 FCTL3 04h Flash control 4 FCTL4 06h Table 20. CRC16 Registers (Base Address: 0150h) REGISTER DESCRIPTION REGISTER OFFSET CRC data input CRC16DI 00h CRC data input reverse byte CRCDIRB 02h CRC initialization and result CRCINIRES 04h CRC result reverse byte CRCRESR 06h Table 21. RAM Control Registers (Base Address: 0158h) REGISTER DESCRIPTION RAM control 0 REGISTER RCCTL0 OFFSET 00h Table 22. Watchdog Registers (Base Address: 015Ch) REGISTER DESCRIPTION Watchdog timer control REGISTER WDTCTL OFFSET 00h Table 23. UCS Registers (Base Address: 0160h) REGISTER DESCRIPTION REGISTER OFFSET UCS control 0 UCSCTL0 00h UCS control 1 UCSCTL1 02h UCS control 2 UCSCTL2 04h UCS control 3 UCSCTL3 06h UCS control 4 UCSCTL4 08h UCS control 5 UCSCTL5 0Ah UCS control 6 UCSCTL6 0Ch UCS control 7 UCSCTL7 0Eh UCS control 8 UCSCTL8 10h Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 29 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 24. SYS Registers (Base Address: 0180h) REGISTER DESCRIPTION REGISTER OFFSET System control SYSCTL 00h Bootstrap loader configuration area SYSBSLC 02h JTAG mailbox control SYSJMBC 06h JTAG mailbox input 0 SYSJMBI0 08h JTAG mailbox input 1 SYSJMBI1 0Ah JTAG mailbox output 0 SYSJMBO0 0Ch JTAG mailbox output 1 SYSJMBO1 0Eh Bus Error vector generator SYSBERRIV 18h User NMI vector generator SYSUNIV 1Ah System NMI vector generator SYSSNIV 1Ch Reset vector generator SYSRSTIV 1Eh Table 25. Shared Reference Registers (Base Address: 01B0h) REGISTER DESCRIPTION Shared reference control REGISTER REFCTL OFFSET 00h Table 26. Port Mapping Registers (Base Address of Port Mapping Control: 01C0h, Port P4: 01E0h) REGISTER DESCRIPTION REGISTER OFFSET Port mapping key/ID register PMAPKEYID 00h Port mapping control register PMAPCTL 02h Port P4.0 mapping register P4MAP0 00h Port P4.1 mapping register P4MAP1 01h Port P4.2 mapping register P4MAP2 02h Port P4.3 mapping register P4MAP3 03h Port P4.4 mapping register P4MAP4 04h Port P4.5 mapping register P4MAP5 05h Port P4.6 mapping register P4MAP6 06h Port P4.7 mapping register P4MAP7 07h 30 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 27. Port P1/P2 Registers (Base Address: 0200h) REGISTER DESCRIPTION REGISTER OFFSET Port P1 input P1IN 00h Port P1 output P1OUT 02h Port P1 direction P1DIR 04h Port P1 pullup/pulldown enable P1REN 06h Port P1 drive strength P1DS 08h Port P1 selection P1SEL 0Ah Port P1 interrupt vector word P1IV 0Eh Port P1 interrupt edge select P1IES 18h Port P1 interrupt enable P1IE 1Ah Port P1 interrupt flag P1IFG 1Ch Port P2 input P2IN 01h Port P2 output P2OUT 03h Port P2 direction P2DIR 05h Port P2 pullup/pulldown enable P2REN 07h Port P2 drive strength P2DS 09h Port P2 selection P2SEL 0Bh Port P2 interrupt vector word P2IV 1Eh Port P2 interrupt edge select P2IES 19h Port P2 interrupt enable P2IE 1Bh Port P2 interrupt flag P2IFG 1Dh Table 28. Port P3/P4 Registers (Base Address: 0220h) REGISTER DESCRIPTION REGISTER OFFSET Port P3 input P3IN 00h Port P3 output P3OUT 02h Port P3 direction P3DIR 04h Port P3 pullup/pulldown enable P3REN 06h Port P3 drive strength P3DS 08h Port P3 selection P3SEL 0Ah Port P4 input P4IN 01h Port P4 output P4OUT 03h Port P4 direction P4DIR 05h Port P4 pullup/pulldown enable P4REN 07h Port P4 drive strength P4DS 09h Port P4 selection P4SEL 0Bh Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 31 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 29. Port P5/P6 Registers (Base Address: 0240h) REGISTER DESCRIPTION REGISTER OFFSET Port P5 input P5IN 00h Port P5 output P5OUT 02h Port P5 direction P5DIR 04h Port P5 pullup/pulldown enable P5REN 06h Port P5 drive strength P5DS 08h Port P5 selection P5SEL 0Ah Port P6 input P6IN 01h Port P6 output P6OUT 03h Port P6 direction P6DIR 05h Port P6 pullup/pulldown enable P6REN 07h Port P6 drive strength P6DS 09h Port P6 selection P6SEL 0Bh Table 30. Port P7/P8 Registers (Base Address: 0260h) REGISTER DESCRIPTION REGISTER OFFSET Port P7 input P7IN 00h Port P7 output P7OUT 02h Port P7 direction P7DIR 04h Port P7 pullup/pulldown enable P7REN 06h Port P7 drive strength P7DS 08h Port P7 selection P7SEL 0Ah Port P8 input P8IN 01h Port P8 output P8OUT 03h Port P8 direction P8DIR 05h Port P8 pullup/pulldown enable P8REN 07h Port P8 drive strength P8DS 09h Port P8 selection P8SEL 0Bh Table 31. Port J Registers (Base Address: 0320h) REGISTER DESCRIPTION REGISTER OFFSET Port PJ input PJIN 00h Port PJ output PJOUT 02h Port PJ direction PJDIR 04h Port PJ pullup/pulldown enable PJREN 06h Port PJ drive strength PJDS 08h 32 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 32. TA0 Registers (Base Address: 0340h) REGISTER DESCRIPTION REGISTER OFFSET TA0 control TA0CTL 00h Capture/compare control 0 TA0CCTL0 02h Capture/compare control 1 TA0CCTL1 04h Capture/compare control 2 TA0CCTL2 06h Capture/compare control 3 TA0CCTL3 08h Capture/compare control 4 TA0CCTL4 0Ah TA0 counter register TA0R 10h Capture/compare register 0 TA0CCR0 12h Capture/compare register 1 TA0CCR1 14h Capture/compare register 2 TA0CCR2 16h Capture/compare register 3 TA0CCR3 18h Capture/compare register 4 TA0CCR4 1Ah TA0 expansion register 0 TA0EX0 20h TA0 interrupt vector TA0IV 2Eh Table 33. TA1 Registers (Base Address: 0380h) REGISTER DESCRIPTION REGISTER OFFSET TA1 control TA1CTL 00h Capture/compare control 0 TA1CCTL0 02h Capture/compare control 1 TA1CCTL1 04h Capture/compare control 2 TA1CCTL2 06h TA1 counter register TA1R 10h Capture/compare register 0 TA1CCR0 12h Capture/compare register 1 TA1CCR1 14h Capture/compare register 2 TA1CCR2 16h TA1 expansion register 0 TA1EX0 20h TA1 interrupt vector TA1IV 2Eh Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 33 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 34. TB0 Registers (Base Address: 03C0h) REGISTER DESCRIPTION REGISTER OFFSET TB0 control TB0CTL 00h Capture/compare control 0 TB0CCTL0 02h Capture/compare control 1 TB0CCTL1 04h Capture/compare control 2 TB0CCTL2 06h Capture/compare control 3 TB0CCTL3 08h Capture/compare control 4 TB0CCTL4 0Ah Capture/compare control 5 TB0CCTL5 0Ch Capture/compare control 6 TB0CCTL6 0Eh TB0 register TB0R 10h Capture/compare register 0 TB0CCR0 12h Capture/compare register 1 TB0CCR1 14h Capture/compare register 2 TB0CCR2 16h Capture/compare register 3 TB0CCR3 18h Capture/compare register 4 TB0CCR4 1Ah Capture/compare register 5 TB0CCR5 1Ch Capture/compare register 6 TB0CCR6 1Eh TB0 expansion register 0 TB0EX0 20h TB0 interrupt vector TB0IV 2Eh Table 35. TA2 Registers (Base Address: 0400h) REGISTER DESCRIPTION REGISTER OFFSET TA2 control TA2CTL 00h Capture/compare control 0 TA2CCTL0 02h Capture/compare control 1 TA2CCTL1 04h Capture/compare control 2 TA2CCTL2 06h TA2 counter register TA2R 10h Capture/compare register 0 TA2CCR0 12h Capture/compare register 1 TA2CCR1 14h Capture/compare register 2 TA2CCR2 16h TA2 expansion register 0 TA2EX0 20h TA2 interrupt vector TA2IV 2Eh 34 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 36. Real Time Clock Registers (Base Address: 04A0h) REGISTER DESCRIPTION REGISTER OFFSET RTC control 0 RTCCTL0 00h RTC control 1 RTCCTL1 01h RTC control 2 RTCCTL2 02h RTC control 3 RTCCTL3 03h RTC prescaler 0 control RTCPS0CTL 08h RTC prescaler 1 control RTCPS1CTL 0Ah RTC prescaler 0 RTCPS0 0Ch RTC prescaler 1 RTCPS1 0Dh RTC interrupt vector word RTCIV 0Eh RTC seconds/counter register 1 RTCSEC/RTCNT1 10h RTC minutes/counter register 2 RTCMIN/RTCNT2 11h RTC hours/counter register 3 RTCHOUR/RTCNT3 12h RTC day of week/counter register 4 RTCDOW/RTCNT4 13h RTC days RTCDAY 14h RTC month RTCMON 15h RTC year low RTCYEARL 16h RTC year high RTCYEARH 17h RTC alarm minutes RTCAMIN 18h RTC alarm hours RTCAHOUR 19h RTC alarm day of week RTCADOW 1Ah RTC alarm days RTCADAY 1Bh Table 37. 32-bit Hardware Multiplier Registers (Base Address: 04C0h) REGISTER DESCRIPTION REGISTER OFFSET 16-bit operand 1 - multiply MPY 00h 16-bit operand 1 - signed multiply MPYS 02h 16-bit operand 1 - multiply accumulate MAC 04h 16-bit operand 1 - signed multiply accumulate MACS 06h 16-bit operand 2 OP2 08h 16 x 16 result low word RESLO 0Ah 16 x 16 result high word RESHI 0Ch 16 x 16 sum extension register SUMEXT 0Eh 32-bit operand 1 - multiply low word MPY32L 10h 32-bit operand 1 - multiply high word MPY32H 12h 32-bit operand 1 - signed multiply low word MPYS32L 14h 32-bit operand 1 - signed multiply high word MPYS32H 16h 32-bit operand 1 - multiply accumulate low word MAC32L 18h 32-bit operand 1 - multiply accumulate high word MAC32H 1Ah 32-bit operand 1 - signed multiply accumulate low word MACS32L 1Ch 32-bit operand 1 - signed multiply accumulate high word MACS32H 1Eh 32-bit operand 2 - low word OP2L 20h 32-bit operand 2 - high word OP2H 22h 32 x 32 result 0 - least significant word RES0 24h 32 x 32 result 1 RES1 26h 32 x 32 result 2 RES2 28h 32 x 32 result 3 - most significant word RES3 2Ah MPY32 control register 0 MPY32CTL0 2Ch Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 35 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 38. DMA Registers (Base Address DMA General Control: 0500h, DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h) REGISTER DESCRIPTION REGISTER OFFSET DMA channel 0 control DMA0CTL 00h DMA channel 0 source address low DMA0SAL 02h DMA channel 0 source address high DMA0SAH 04h DMA channel 0 destination address low DMA0DAL 06h DMA channel 0 destination address high DMA0DAH 08h DMA channel 0 transfer size DMA0SZ 0Ah DMA channel 1 control DMA1CTL 00h DMA channel 1 source address low DMA1SAL 02h DMA channel 1 source address high DMA1SAH 04h DMA channel 1 destination address low DMA1DAL 06h DMA channel 1 destination address high DMA1DAH 08h DMA channel 1 transfer size DMA1SZ 0Ah DMA channel 2 control DMA2CTL 00h DMA channel 2 source address low DMA2SAL 02h DMA channel 2 source address high DMA2SAH 04h DMA channel 2 destination address low DMA2DAL 06h DMA channel 2 destination address high DMA2DAH 08h DMA channel 2 transfer size DMA2SZ 0Ah DMA module control 0 DMACTL0 00h DMA module control 1 DMACTL1 02h DMA module control 2 DMACTL2 04h DMA module control 3 DMACTL3 06h DMA module control 4 DMACTL4 08h DMA interrupt vector DMAIV 0Eh Table 39. USCI_A0 Registers (Base Address: 05C0h) REGISTER DESCRIPTION REGISTER OFFSET USCI control 1 UCA0CTL1 00h USCI control 0 UCA0CTL0 01h USCI baud rate 0 UCA0BR0 06h USCI baud rate 1 UCA0BR1 07h USCI modulation control UCA0MCTL 08h USCI status UCA0STAT 0Ah USCI receive buffer UCA0RXBUF 0Ch USCI transmit buffer UCA0TXBUF 0Eh USCI LIN control UCA0ABCTL 10h USCI IrDA transmit control UCA0IRTCTL 12h USCI IrDA receive control UCA0IRRCTL 13h USCI interrupt enable UCA0IE 1Ch USCI interrupt flags UCA0IFG 1Dh USCI interrupt vector word UCA0IV 1Eh 36 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 40. USCI_B0 Registers (Base Address: 05E0h) REGISTER DESCRIPTION REGISTER OFFSET USCI synchronous control 1 UCB0CTL1 00h USCI synchronous control 0 UCB0CTL0 01h USCI synchronous bit rate 0 UCB0BR0 06h USCI synchronous bit rate 1 UCB0BR1 07h USCI synchronous status UCB0STAT 0Ah USCI synchronous receive buffer UCB0RXBUF 0Ch USCI synchronous transmit buffer UCB0TXBUF 0Eh USCI I2C own address UCB0I2COA 10h USCI I2C slave address UCB0I2CSA 12h USCI interrupt enable UCB0IE 1Ch USCI interrupt flags UCB0IFG 1Dh USCI interrupt vector word UCB0IV 1Eh Table 41. USCI_A1 Registers (Base Address: 0600h) REGISTER DESCRIPTION REGISTER OFFSET USCI control 1 UCA1CTL1 00h USCI control 0 UCA1CTL0 01h USCI baud rate 0 UCA1BR0 06h USCI baud rate 1 UCA1BR1 07h USCI modulation control UCA1MCTL 08h USCI status UCA1STAT 0Ah USCI receive buffer UCA1RXBUF 0Ch USCI transmit buffer UCA1TXBUF 0Eh USCI LIN control UCA1ABCTL 10h USCI IrDA transmit control UCA1IRTCTL 12h USCI IrDA receive control UCA1IRRCTL 13h USCI interrupt enable UCA1IE 1Ch USCI interrupt flags UCA1IFG 1Dh USCI interrupt vector word UCA1IV 1Eh Table 42. USCI_B1 Registers (Base Address: 0620h) REGISTER DESCRIPTION REGISTER OFFSET USCI synchronous control 1 UCB1CTL1 00h USCI synchronous control 0 UCB1CTL0 01h USCI synchronous bit rate 0 UCB1BR0 06h USCI synchronous bit rate 1 UCB1BR1 07h USCI synchronous status UCB1STAT 0Ah USCI synchronous receive buffer UCB1RXBUF 0Ch USCI synchronous transmit buffer UCB1TXBUF 0Eh USCI I2C own address UCB1I2COA 10h USCI I2C slave address UCB1I2CSA 12h USCI interrupt enable UCB1IE 1Ch USCI interrupt flags UCB1IFG 1Dh USCI interrupt vector word UCB1IV 1Eh Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 37 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 43. ADC12_A Registers (Base Address: 0700h) REGISTER DESCRIPTION REGISTER OFFSET Control register 0 ADC12CTL0 00h Control register 1 ADC12CTL1 02h Control register 2 ADC12CTL2 04h Interrupt-flag register ADC12IFG 0Ah Interrupt-enable register ADC12IE 0Ch Interrupt-vector-word register ADC12IV 0Eh ADC memory-control register 0 ADC12MCTL0 10h ADC memory-control register 1 ADC12MCTL1 11h ADC memory-control register 2 ADC12MCTL2 12h ADC memory-control register 3 ADC12MCTL3 13h ADC memory-control register 4 ADC12MCTL4 14h ADC memory-control register 5 ADC12MCTL5 15h ADC memory-control register 6 ADC12MCTL6 16h ADC memory-control register 7 ADC12MCTL7 17h ADC memory-control register 8 ADC12MCTL8 18h ADC memory-control register 9 ADC12MCTL9 19h ADC memory-control register 10 ADC12MCTL10 1Ah ADC memory-control register 11 ADC12MCTL11 1Bh ADC memory-control register 12 ADC12MCTL12 1Ch ADC memory-control register 13 ADC12MCTL13 1Dh ADC memory-control register 14 ADC12MCTL14 1Eh ADC memory-control register 15 ADC12MCTL15 1Fh Conversion memory 0 ADC12MEM0 20h Conversion memory 1 ADC12MEM1 22h Conversion memory 2 ADC12MEM2 24h Conversion memory 3 ADC12MEM3 26h Conversion memory 4 ADC12MEM4 28h Conversion memory 5 ADC12MEM5 2Ah Conversion memory 6 ADC12MEM6 2Ch Conversion memory 7 ADC12MEM7 2Eh Conversion memory 8 ADC12MEM8 30h Conversion memory 9 ADC12MEM9 32h Conversion memory 10 ADC12MEM10 34h Conversion memory 11 ADC12MEM11 36h Conversion memory 12 ADC12MEM12 38h Conversion memory 13 ADC12MEM13 3Ah Conversion memory 14 ADC12MEM14 3Ch Conversion memory 15 ADC12MEM15 3Eh 38 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 44. Comparator_B Registers (Base Address: 08C0h) REGISTER DESCRIPTION REGISTER OFFSET Comp_B control register 0 CBCTL0 00h Comp_B control register 1 CBCTL1 02h Comp_B control register 2 CBCTL2 04h Comp_B control register 3 CBCTL3 06h Comp_B interrupt register CBINT 0Ch Comp_B interrupt vector word CBIV 0Eh Table 45. LDO and Port U Configuration Registers (Base Address: 0900h) REGISTER DESCRIPTION REGISTER OFFSET LDO key/ID register LDOKEYPID 00h PU port control PUCTL 04h LDO power control LDOPWRCTL 08h Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 39 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) -0.3 V to 4.1 V Voltage applied at VCC to VSS Voltage applied to any pin (excluding VCORE, LDOI) (2) -0.3 V to VCC + 0.3 V 2 mA Diode current at any device pin Storage temperature range, Tstg (1) (2) (3) (3) -55C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages referenced to VSS. VCORE is for internal device usage only. No external DC loading or voltage should be applied. Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels. Thermal Packaging Characteristics Low-K board (JESD51-3) JA Junction-to-ambient thermal resistance, still air High-K board (JESD51-7) JC JB 40 Junction-to-case thermal resistance Junction-to-board thermal resistance Submit Documentation Feedback LQFP (PN) 70 VQFN (RGC) 55 BGA (ZQE) 84 LQFP (PN) 45 VQFN (RGC) 25 BGA (ZQE) 46 LQFP (PN) 12 VQFN (RGC) 12 BGA (ZQE) 30 LQFP (PN) 22 VQFN (RGC) 6 BGA (ZQE) 20 C/W C/W C/W Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Recommended Operating Conditions MIN V PMMCOREVx = 0, 1 2.0 3.6 V PMMCOREVx = 0, 1, 2 2.2 3.6 V PMMCOREVx = 0, 1, 2, 3 2.4 3.6 V 85 C VSS Supply voltage (AVSSx = DVSSx = VSS) TA Operating free-air temperature -40 TJ Operating junction temperature -40 CVCORE Recommended capacitor at VCORE CDVCC/ CVCORE Capacitor ratio of DVCC to VCORE (2) UNIT 3.6 Supply voltage during program execution and flash programming(AVCCx = DVCCx = VCC) (1) (1) MAX 1.8 VCC fSYSTEM NOM PMMCOREVx = 0 0 V 85 470 C nF 10 Processor frequency (maximum MCLK frequency) (2) (see Figure 1) PMMCOREVx = 0 1.8 V VCC 3.6 V (default condition) 0 8.0 PMMCOREVx = 1 2.0 V VCC 3.6 V 0 12.0 PMMCOREVx = 2 2.2 V VCC 3.6 V 0 20.0 PMMCOREVx = 3 2.4 V VCC 3.6 V 0 25.0 MHz It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be tolerated during power up and operation. Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet. 25 System Frequency - MHz 3 20 2 2, 3 1 1, 2 1, 2, 3 0, 1 0, 1, 2 0, 1, 2, 3 12 8 0 0 1.8 2.0 2.2 2.4 3.6 Supply Voltage - V The numbers within the fields denote the supported PMMCOREVx settings. Figure 1. Maximum System Frequency Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 41 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Electrical Characteristics Active Mode Supply Current Into VCC Excluding External Current over recommended operating free-air temperature (unless otherwise noted) (1) (2) (3) FREQUENCY (fDCO = fMCLK = fSMCLK) PARAMETER IAM, IAM, (1) (2) (3) 42 Flash RAM EXECUTION MEMORY Flash RAM VCC 3V 3V PMMCOREVx 1 MHz 8 MHz 12 MHz TYP MAX 2.65 4.0 4.4 2.90 20 MHz TYP MAX TYP MAX 0 0.36 0.47 2.32 2.60 1 0.40 2 0.44 3 0.46 0 0.20 1 0.22 1.35 2.0 2 0.24 1.50 2.2 3.7 3 0.26 1.60 2.4 3.9 3.10 0.24 1.20 TYP MAX 4.3 7.1 7.7 4.6 7.6 25 MHz TYP UNIT MAX mA 10.1 11.0 1.30 2.2 mA 4.2 5.3 6.2 All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current. The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load capacitance are chosen to closely match the required 12.5 pF. Characterized with program executing typical data processing. LDO disabled (LDOEN = 0). fACLK = 32786 Hz, fDCO = fMCLK = fSMCLK at specified frequency. XTS = CPUOFF = SCG0 = SCG1 = OSCOFF = SMCLKOFF = 0. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Low-Power Mode Supply Currents (Into VCC) Excluding External Current over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) PARAMETER ILPM0,1MHz Low-power mode 0 (3) (4) ILPM2 Low-power mode 2 (5) (4) ILPM4 0 73 77 85 80 85 97 3V 3 79 83 92 88 95 105 2.2 V 0 6.5 6.5 12 10 11 17 3V 3 7.0 7.0 13 11 12 18 0 1.60 1.90 2.6 5.6 1 1.65 2.00 2.7 5.9 2 1.75 2.15 2.9 6.1 0 1.8 2.1 2.8 5.8 1 1.9 2.3 2.9 6.1 2 2.0 2.4 3.0 6.3 3 2.0 2.5 3.9 3.1 6.4 9.3 0 1.1 1.4 2.7 1.9 4.9 7.4 1 1.1 1.4 2.0 5.2 2 1.2 1.5 2.1 5.3 3 1.3 1.6 3.0 2.2 5.4 8.5 0 0.9 1.1 1.5 1.8 4.8 7.3 1 1.1 1.2 2.0 5.1 2 1.2 1.2 2.1 5.2 3 1.3 1.3 1.6 2.2 5.3 8.1 ILPM4.5 0.15 0.18 0.35 0.26 0.5 1.0 (1) (2) (3) (4) (5) (6) (7) (8) (9) 3V Low-power mode 4 (8) Low-power mode 4.5 (4) (9) 85C 2.2 V Low-power mode 3, crystal mode (6) (4) Low-power mode 3, VLO mode (7) (4) 60 C PMMCOREVx 3V ILPM3,VLO 25 C VCC 2.2 V ILPM3,XT1LF -40 C (2) 3V 3V TYP MAX TYP MAX 2.9 TYP MAX TYP MAX 8.3 UNIT A A A A A A All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current. The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load capacitance are chosen to closely match the required 12.5 pF. Current for watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0). CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz LDO disabled (LDOEN = 0). Current for brownout, high side supervisor (SVSH) normal mode included. Low side supervisor and monitors disabled (SVSL, SVML). High side monitor disabled (SVMH). RAM retention enabled. Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0). CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 0 MHz; DCO setting = 1 MHz operation, DCO bias generator enabled.) LDO disabled (LDOEN = 0). Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0). CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz LDO disabled (LDOEN = 0). Current for watchdog timer and RTC clocked by ACLK included. ACLK = VLO. CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = fVLO, fMCLK = fSMCLK = fDCO = 0 MHz LDO disabled (LDOEN = 0). CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz LDO disabled (LDOEN = 0). Internal regulator disabled. No data retention. CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF = 1 (LPM4.5); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 43 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Schmitt-Trigger Inputs - General Purpose I/O (1) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VIT+ Positive-going input threshold voltage VIT- Negative-going input threshold voltage Vhys Input voltage hysteresis (VIT+ - VIT-) RPull Pullup/pulldown resistor (2) For pullup: VIN = VSS For pulldown: VIN = VCC CI Input capacitance VIN = VSS or VCC (1) (2) VCC MIN 1.8 V 0.80 TYP 1.40 3V 1.50 2.10 1.8 V 0.45 1.00 3V 0.75 1.65 1.8 V 0.3 0.8 3V 0.4 1.0 20 35 MAX 50 5 UNIT V V V k pF Same parametrics apply to clock input pin when crystal bypass mode is used on XT1 (XIN) or XT2 (XT2IN). Also applies to RST pin when pullup/pulldown resistor is enabled. Inputs - Ports P1 and P2 (1) (P1.0 to P1.7, P2.0 to P2.7) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER t(int) (1) (2) External interrupt timing TEST CONDITIONS (2) VCC External trigger pulse width to set interrupt flag MIN 2.2 V/3 V MAX 20 UNIT ns Some devices may contain additional ports with interrupts. See the block diagram and terminal function descriptions. An external signal sets the interrupt flag every time the minimum interrupt pulse width t(int) is met. It may be set by trigger signals shorter than t(int). Leakage Current - General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER Ilkg(Px.x) (1) (2) TEST CONDITIONS VCC (1) (2) High-impedance leakage current MIN 1.8 V/3 V MAX UNIT 50 nA The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted. The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup/pulldown resistor is disabled. Outputs - General Purpose I/O (Full Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS I(OHmax) = -3 mA (1) VOH High-level output voltage I(OHmax) = -10 mA (2) I(OHmax) = -5 mA (1) I(OHmax) = -15 mA (2) I(OLmax) = 3 mA (1) VOL Low-level output voltage I(OLmax) = 10 mA (2) I(OLmax) = 5 mA (2) 44 1.8 V 3V 1.8 V (1) I(OLmax) = 15 mA (2) (1) VCC 3V MIN MAX VCC - 0.25 VCC VCC - 0.60 VCC VCC - 0.25 VCC VCC - 0.60 VCC UNIT V VSS VSS + 0.25 VSS VSS + 0.60 VSS VSS + 0.25 V VSS VSS + 0.60 The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed 48 mA to hold the maximum voltage drop specified. The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed 100 mA to hold the maximum voltage drop specified. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Outputs - General Purpose I/O (Reduced Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) PARAMETER TEST CONDITIONS I(OHmax) = -1 mA (2) VOH High-level output voltage 1.8 V I(OHmax) = -3 mA (3) I(OHmax) = -2 mA (2) 3V I(OHmax) = -6 mA (3) I(OLmax) = 1 mA (2) VOL Low-level output voltage (3) MIN MAX VCC - 0.25 VCC VCC - 0.60 VCC VCC - 0.25 VCC VCC - 0.60 VCC 1.8 V I(OLmax) = 3 mA (3) I(OLmax) = 2 mA (2) 3V I(OLmax) = 6 mA (3) (1) (2) VCC UNIT V VSS VSS + 0.25 VSS VSS + 0.60 VSS VSS + 0.25 V VSS VSS + 0.60 Selecting reduced drive strength may reduce EMI. The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed 48 mA to hold the maximum voltage drop specified. The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed 100 mA to hold the maximum voltage drop specified. Output Frequency - General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER fPx.y (2) Clock output frequency MIN ACLK, SMCLK, MCLK, CL = 20 pF (2) MAX 16 VCC = 3 V, PMMCOREVx = 3 25 VCC = 1.8 V, PMMCOREVx = 0 16 VCC = 3 V, PMMCOREVx = 3 25 VCC = 1.8 V, PMMCOREVx = 0 Port output frequency (with load) fPort_CLK (1) TEST CONDITIONS (1) (2) UNIT MHz MHz A resistive divider with 2 x R1 between VCC and VSS is used as load. The output is connected to the center tap of the divider. For full drive strength, R1 = 550 . For reduced drive strength, R1 = 1.6 k. CL = 20 pF is connected to the output to VSS. The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 45 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Typical Characteristics - Outputs, Reduced Drive Strength (PxDS.y = 0) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE 8.0 VCC = 3.0 V Px.y IOL - Typical Low-Level Output Current - mA IOL - Typical Low-Level Output Current - mA 25.0 TA = 25C 20.0 TA = 85C 15.0 10.0 5.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 7.0 TA = 85C 6.0 5.0 4.0 3.0 2.0 1.0 0.0 0.0 3.5 1.0 1.5 Figure 2. Figure 3. TYPICAL HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE TYPICAL HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE IOH - Typical High-Level Output Current - mA VCC = 3.0 V Px.y -5.0 -10.0 -15.0 TA = 85C -20.0 2.0 0.0 0.0 IOH - Typical High-Level Output Current - mA 0.5 VOL - Low-Level Output Voltage - V VOL - Low-Level Output Voltage - V TA = 25C VCC = 1.8 V Px.y -1.0 -2.0 -3.0 -4.0 TA = 85C -5.0 -6.0 TA = 25C -7.0 -8.0 -25.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 VOH - High-Level Output Voltage - V Figure 4. 46 TA = 25C VCC = 1.8 V Px.y Submit Documentation Feedback 3.5 0.0 0.5 1.0 1.5 VOH - High-Level Output Voltage - V 2.0 Figure 5. Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Typical Characteristics - Outputs, Full Drive Strength (PxDS.y = 1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE TA = 25C VCC = 3.0 V Px.y 55.0 50.0 IOL - Typical Low-Level Output Current - mA IOL - Typical Low-Level Output Current - mA 60.0 TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE TA = 85C 45.0 40.0 35.0 30.0 25.0 20.0 15.0 10.0 5.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 24 VCC = 1.8 V Px.y 20 TA = 85C 16 12 8 4 0 0.0 3.5 0.5 1.0 1.5 Figure 6. Figure 7. TYPICAL HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE TYPICAL HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE 0 0.0 IOH - Typical High-Level Output Current - mA VCC = 3.0 V Px.y -5.0 -10.0 -15.0 -20.0 -25.0 -30.0 -35.0 -40.0 -45.0 TA = 85C -50.0 -55.0 TA = 25C -60.0 0.0 2.0 VOL - Low-Level Output Voltage - V VOL - Low-Level Output Voltage - V IOH - Typical High-Level Output Current - mA TA = 25C 0.5 VCC = 1.8 V Px.y -4 -8 -12 TA = 85C -16 TA = 25C -20 1.0 1.5 2.0 2.5 3.0 VOH - High-Level Output Voltage - V Figure 8. Copyright (c) 2010-2011, Texas Instruments Incorporated 3.5 0.0 0.5 1.0 1.5 2.0 VOH - High-Level Output Voltage - V Figure 9. Submit Documentation Feedback 47 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Crystal Oscillator, XT1, Low-Frequency Mode (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 1, TA = 25C IDVCC.LF Differential XT1 oscillator crystal current consumption from lowest drive setting, LF mode fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 2, TA = 25C fXT1,LF,SW XT1 oscillator logic-level square-wave input frequency, LF mode XTS = 0, XT1BYPASS = 1 (2) (3) 10 Integrated effective load capacitance, LF mode (5) fFault,LF tSTART,LF (1) (2) (3) (4) (5) (6) (7) (8) 48 32.768 XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 0, fXT1,LF = 32768 Hz, CL,eff = 6 pF 210 XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 1, fXT1,LF = 32768 Hz, CL,eff = 12 pF 300 Hz 50 kHz k XTS = 0, XCAPx = 0 (6) CL,eff UNIT A 0.170 32768 XTS = 0, XT1BYPASS = 0 Oscillation allowance for LF crystals (4) 3V 0.290 XT1 oscillator crystal frequency, LF mode MAX 0.075 fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 3, TA = 25C fXT1,LF0 OALF TYP 2 XTS = 0, XCAPx = 1 5.5 XTS = 0, XCAPx = 2 8.5 XTS = 0, XCAPx = 3 12.0 pF Duty cycle, LF mode XTS = 0, Measured at ACLK, fXT1,LF = 32768 Hz 30 70 % Oscillator fault frequency, LF mode (7) XTS = 0 (8) 10 10000 Hz Startup time, LF mode fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 0, TA = 25C, CL,eff = 6 pF fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 3, TA = 25C, CL,eff = 12 pF 1000 3V ms 500 To improve EMI on the XT1 oscillator, the following guidelines should be observed. (a) Keep the trace between the device and the crystal as short as possible. (b) Design a good ground plane around the oscillator pins. (c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT. (d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins. (e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins. (f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins. When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in the Schmitt-trigger Inputs section of this datasheet. Maximum frequency of operation of the entire device cannot be exceeded. Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following guidelines, but should be evaluated based on the actual crystal selected for the application: (a) For XT1DRIVEx = 0, CL,eff 6 pF (b) For XT1DRIVEx = 1, 6 pF CL,eff 9 pF (c) For XT1DRIVEx = 2, 6 pF CL,eff 10 pF (d) For XT1DRIVEx = 3, CL,eff 6 pF Includes parasitic bond and package capacitance (approximately 2 pF per pin). Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal. Requires external capacitors at both terminals. Values are specified by crystal manufacturers. Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies in between might set the flag. Measured with logic-level input frequency but also applies to operation with crystals. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Crystal Oscillator, XT2 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) PARAMETER TEST CONDITIONS VCC MIN fOSC = 4 MHz, XT2OFF = 0, XT2BYPASS = 0, XT2DRIVEx = 0, TA = 25C IDVCC.XT2 XT2 oscillator crystal current consumption fOSC = 12 MHz, XT2OFF = 0, XT2BYPASS = 0, XT2DRIVEx = 1, TA = 25C fOSC = 20 MHz, XT2OFF = 0, XT2BYPASS = 0, XT2DRIVEx = 2, TA = 25C (2) TYP MAX UNIT 200 260 A 3V 325 fOSC = 32 MHz, XT2OFF = 0, XT2BYPASS = 0, XT2DRIVEx = 3, TA = 25C 450 fXT2,HF0 XT2 oscillator crystal frequency, mode 0 XT2DRIVEx = 0, XT2BYPASS = 0 (3) 4 8 MHz fXT2,HF1 XT2 oscillator crystal frequency, mode 1 XT2DRIVEx = 1, XT2BYPASS = 0 (3) 8 16 MHz fXT2,HF2 XT2 oscillator crystal frequency, mode 2 XT2DRIVEx = 2, XT2BYPASS = 0 (3) 16 24 MHz fXT2,HF3 XT2 oscillator crystal frequency, mode 3 XT2DRIVEx = 3, XT2BYPASS = 0 (3) 24 32 MHz fXT2,HF,SW XT2 oscillator logic-level square-wave input frequency, bypass mode XT2BYPASS = 1 (4) 0.7 32 MHz OAHF tSTART,HF CL,eff Oscillation allowance for HF crystals (5) Startup time Integrated effective load capacitance, HF mode (6) (2) (3) (4) (5) (6) XT2DRIVEx = 0, XT2BYPASS = 0, fXT2,HF0 = 6 MHz, CL,eff = 15 pF 450 XT2DRIVEx = 1, XT2BYPASS = 0, fXT2,HF1 = 12 MHz, CL,eff = 15 pF 320 XT2DRIVEx = 2, XT2BYPASS = 0, fXT2,HF2 = 20 MHz, CL,eff = 15 pF 200 XT2DRIVEx = 3, XT2BYPASS = 0, fXT2,HF3 = 32 MHz, CL,eff = 15 pF 200 fOSC = 6 MHz, XT2BYPASS = 0, XT2DRIVEx = 0, TA = 25C, CL,eff = 15 pF 0.5 fOSC = 20 MHz, XT2BYPASS = 0, XT2DRIVEx = 2, TA = 25C, CL,eff = 15 pF 3V ms 0.3 1 (1) Duty cycle, HF mode (1) (3) Measured at ACLK, fXT2,HF2 = 20 MHz 40 50 pF 60 % Requires external capacitors at both terminals. Values are specified by crystal manufacturers. In general, an effective load capacitance of up to 18 pF can be supported. To improve EMI on the XT2 oscillator the following guidelines should be observed. (a) Keep the traces between the device and the crystal as short as possible. (b) Design a good ground plane around the oscillator pins. (c) Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT. (d) Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins. (e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XT2IN and XT2OUT pins. (f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins. This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation. When XT2BYPASS is set, the XT2 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined in the Schmitt-trigger Inputs section of this datasheet. Oscillation allowance is based on a safety factor of 5 for recommended crystals. Includes parasitic bond and package capacitance (approximately 2 pF per pin). Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 49 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Crystal Oscillator, XT2 (continued) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (2) PARAMETER fFault,HF (7) (8) Oscillator fault frequency TEST CONDITIONS (7) XT2BYPASS = 1 VCC (8) MIN TYP 30 MAX UNIT 300 kHz Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies in between might set the flag. Measured with logic-level input frequency but also applies to operation with crystals. Internal Very-Low-Power Low-Frequency Oscillator (VLO) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC fVLO VLO frequency Measured at ACLK 1.8 V to 3.6 V dfVLO/dT VLO frequency temperature drift Measured at ACLK (1) 1.8 V to 3.6 V Measured at ACLK (2) 1.8 V to 3.6 V Measured at ACLK 1.8 V to 3.6 V dfVLO/dVCC VLO frequency supply voltage drift Duty cycle (1) (2) MIN TYP MAX 6 9.4 14 0.5 kHz %/C 4 40 UNIT %/V 50 60 TYP MAX % Calculated using the box method: (MAX(-40 to 85C) - MIN(-40 to 85C)) / MIN(-40 to 85C) / (85C - (-40C)) Calculated using the box method: (MAX(1.8 to 3.6 V) - MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V - 1.8 V) Internal Reference, Low-Frequency Oscillator (REFO) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER IREFO fREFO TEST CONDITIONS VCC MIN 3 REFO frequency calibrated Measured at ACLK 1.8 V to 3.6 V 32768 Full temperature range 1.8 V to 3.6 V 3.5 % 3V 1.5 % REFO absolute tolerance calibrated TA = 25C (1) REFO frequency temperature drift Measured at ACLK 1.8 V to 3.6 V 0.01 dfREFO/dVCC REFO frequency supply voltage drift Measured at ACLK (2) 1.8 V to 3.6 V 1.0 Duty cycle Measured at ACLK 1.8 V to 3.6 V REFO startup time 40%/60% duty cycle 1.8 V to 3.6 V (1) (2) 50 A 1.8 V to 3.6 V dfREFO/dT tSTART UNIT REFO oscillator current consumption TA = 25C 40 50 25 Hz %/C %/V 60 % s Calculated using the box method: (MAX(-40 to 85C) - MIN(-40 to 85C)) / MIN(-40 to 85C) / (85C - (-40C)) Calculated using the box method: (MAX(1.8 to 3.6 V) - MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V - 1.8 V) Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com DCO Frequency over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT fDCO(0,0) DCO frequency (0, 0) DCORSELx = 0, DCOx = 0, MODx = 0 0.07 0.20 MHz fDCO(0,31) DCO frequency (0, 31) DCORSELx = 0, DCOx = 31, MODx = 0 0.70 1.70 MHz fDCO(1,0) DCO frequency (1, 0) DCORSELx = 1, DCOx = 0, MODx = 0 0.15 0.36 MHz fDCO(1,31) DCO frequency (1, 31) DCORSELx = 1, DCOx = 31, MODx = 0 1.47 3.45 MHz fDCO(2,0) DCO frequency (2, 0) DCORSELx = 2, DCOx = 0, MODx = 0 0.32 0.75 MHz fDCO(2,31) DCO frequency (2, 31) DCORSELx = 2, DCOx = 31, MODx = 0 3.17 7.38 MHz fDCO(3,0) DCO frequency (3, 0) DCORSELx = 3, DCOx = 0, MODx = 0 0.64 1.51 MHz fDCO(3,31) DCO frequency (3, 31) DCORSELx = 3, DCOx = 31, MODx = 0 6.07 14.0 MHz fDCO(4,0) DCO frequency (4, 0) DCORSELx = 4, DCOx = 0, MODx = 0 1.3 3.2 MHz fDCO(4,31) DCO frequency (4, 31) DCORSELx = 4, DCOx = 31, MODx = 0 12.3 28.2 MHz fDCO(5,0) DCO frequency (5, 0) DCORSELx = 5, DCOx = 0, MODx = 0 2.5 6.0 MHz fDCO(5,31) DCO frequency (5, 31) DCORSELx = 5, DCOx = 31, MODx = 0 23.7 54.1 MHz fDCO(6,0) DCO frequency (6, 0) DCORSELx = 6, DCOx = 0, MODx = 0 4.6 10.7 MHz fDCO(6,31) DCO frequency (6, 31) DCORSELx = 6, DCOx = 31, MODx = 0 39.0 88.0 MHz fDCO(7,0) DCO frequency (7, 0) DCORSELx = 7, DCOx = 0, MODx = 0 8.5 19.6 MHz fDCO(7,31) DCO frequency (7, 31) DCORSELx = 7, DCOx = 31, MODx = 0 60 135 MHz SDCORSEL Frequency step between range DCORSEL and DCORSEL + 1 SRSEL = fDCO(DCORSEL+1,DCO)/fDCO(DCORSEL,DCO) 1.2 2.3 ratio SDCO Frequency step between tap DCO and DCO + 1 SDCO = fDCO(DCORSEL,DCO+1)/fDCO(DCORSEL,DCO) 1.02 1.12 ratio Duty cycle Measured at SMCLK dfDCO/dT dfDCO/dVCC (1) (2) DCO frequency temperature drift (1) DCO frequency voltage drift (2) 40 50 60 % fDCO = 1 MHz 0.1 %/C fDCO = 1 MHz 1.9 %/V Calculated using the box method: (MAX(-40 to 85C) - MIN(-40 to 85C)) / MIN(-40 to 85C) / (85C - (-40C)) Calculated using the box method: (MAX(1.8 to 3.6 V) - MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V - 1.8 V) Typical DCO Frequency, VCC = 3.0 V, TA = 25C 100 fDCO - MHz 10 DCOx = 31 1 0.1 DCOx = 0 0 1 2 3 4 5 6 7 DCORSEL Figure 10. Typical DCO Frequency Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 51 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com PMM, Brown-Out Reset (BOR) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS V(DVCC_BOR_IT-) BORH on voltage, DVCC falling level | dDVCC/dt | < 3 V/s V(DVCC_BOR_IT+) BORH off voltage, DVCC rising level | dDVCC/dt | < 3 V/s V(DVCC_BOR_hys) BORH hysteresis tRESET Pulse length required at RST/NMI pin to accept a reset MIN TYP 0.80 1.30 60 MAX UNIT 1.45 V 1.50 V 250 mV s 2 PMM, Core Voltage over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VCORE3(AM) Core voltage, active mode, PMMCOREV = 3 2.4 V DVCC 3.6 V 1.90 V VCORE2(AM) Core voltage, active mode, PMMCOREV = 2 2.2 V DVCC 3.6 V 1.80 V VCORE1(AM) Core voltage, active mode, PMMCOREV = 1 2.0 V DVCC 3.6 V 1.60 V VCORE0(AM) Core voltage, active mode, PMMCOREV = 0 1.8 V DVCC 3.6 V 1.40 V VCORE3(LPM) Core voltage, low-current mode, PMMCOREV = 3 2.4 V DVCC 3.6 V 1.94 V VCORE2(LPM) Core voltage, low-current mode, PMMCOREV = 2 2.2 V DVCC 3.6 V 1.84 V VCORE1(LPM) Core voltage, low-current mode, PMMCOREV = 1 2.0 V DVCC 3.6 V 1.64 V VCORE0(LPM) Core voltage, low-current mode, PMMCOREV = 0 1.8 V DVCC 3.6 V 1.44 V 52 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com PMM, SVS High Side over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN SVSHE = 0, DVCC = 3.6 V I(SVSH) V(SVSH_IT-) V(SVSH_IT+) tpd(SVSH) t(SVSH) dVDVCC/dt (1) SVS current consumption SVSH on voltage level (1) SVSH off voltage level (1) SVSH propagation delay SVSH on/off delay time TYP MAX 0 UNIT nA SVSHE = 1, DVCC = 3.6 V, SVSHFP = 0 200 nA SVSHE = 1, DVCC = 3.6 V, SVSHFP = 1 1.5 A SVSHE = 1, SVSHRVL = 0 1.57 1.68 1.78 SVSHE = 1, SVSHRVL = 1 1.79 1.88 1.98 SVSHE = 1, SVSHRVL = 2 1.98 2.08 2.21 SVSHE = 1, SVSHRVL = 3 2.10 2.18 2.31 SVSHE = 1, SVSMHRRL = 0 1.62 1.74 1.85 SVSHE = 1, SVSMHRRL = 1 1.88 1.94 2.07 SVSHE = 1, SVSMHRRL = 2 2.07 2.14 2.28 SVSHE = 1, SVSMHRRL = 3 2.20 2.30 2.42 SVSHE = 1, SVSMHRRL = 4 2.32 2.40 2.55 SVSHE = 1, SVSMHRRL = 5 2.52 2.70 2.88 SVSHE = 1, SVSMHRRL = 6 2.90 3.10 3.23 SVSHE = 1, SVSMHRRL = 7 2.90 3.10 3.23 SVSHE = 1, dVDVCC/dt = 10 mV/s, SVSHFP = 1 2.5 SVSHE = 1, dVDVCC/dt = 1 mV/s, SVSHFP = 0 20 V s SVSHE = 0 1, dVDVCC/dt = 10 mV/s, SVSHFP = 1 12.5 SVSHE = 0 1, dVDVCC/dt = 1 mV/s, SVSHFP = 0 100 DVCC rise time V s 0 1000 V/s The SVSH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208) on recommended settings and usage. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 53 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com PMM, SVM High Side over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP SVMHE = 0, DVCC = 3.6 V I(SVMH) SVMH current consumption V(SVMH) SVMH on/off voltage level (1) 0 t(SVMH) (1) SVMH propagation delay SVMH on/off delay time UNIT nA SVMHE = 1, DVCC = 3.6 V, SVMHFP = 0 200 nA SVMHE = 1, DVCC = 3.6 V, SVMHFP = 1 1.5 A SVMHE = 1, SVSMHRRL = 0 1.62 1.74 1.85 SVMHE = 1, SVSMHRRL = 1 1.88 1.94 2.07 SVMHE = 1, SVSMHRRL = 2 2.07 2.14 2.28 SVMHE = 1, SVSMHRRL = 3 2.20 2.30 2.42 SVMHE = 1, SVSMHRRL = 4 2.32 2.40 2.55 SVMHE = 1, SVSMHRRL = 5 2.52 2.70 2.88 SVMHE = 1, SVSMHRRL = 6 2.90 3.10 3.23 SVMHE = 1, SVSMHRRL = 7 2.90 3.10 3.23 SVMHE = 1, SVMHOVPE = 1 tpd(SVMH) MAX V 3.75 SVMHE = 1, dVDVCC/dt = 10 mV/s, SVMHFP = 1 2.5 SVMHE = 1, dVDVCC/dt = 1 mV/s, SVMHFP = 0 20 s SVMHE = 0 1, dVDVCC/dt = 10 mV/s, SVMHFP = 1 12.5 SVMHE = 0 1, dVDVCC/dt = 1 mV/s, SVMHFP = 0 100 s The SVMH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208) on recommended settings and usage. PMM, SVS Low Side over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN SVSLE = 0, PMMCOREV = 2 I(SVSL) SVSL current consumption tpd(SVSL) SVSL propagation delay t(SVSL) SVSL on/off delay time TYP MAX 0 UNIT nA SVSLE = 1, PMMCOREV = 2, SVSLFP = 0 200 nA SVSLE = 1, PMMCOREV = 2, SVSLFP = 1 1.5 A SVSLE = 1, dVCORE/dt = 10 mV/s, SVSLFP = 1 2.5 SVSLE = 1, dVCORE/dt = 1 mV/s, SVSLFP = 0 20 SVSLE = 0 1, dVCORE/dt = 10 mV/s, SVSLFP = 1 12.5 SVSLE = 0 1, dVCORE/dt = 1 mV/s, SVSLFP = 0 100 s s PMM, SVM Low Side over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN SVMLE = 0, PMMCOREV = 2 I(SVML) SVML current consumption tpd(SVML) SVML propagation delay t(SVML) SVML on/off delay time 54 Submit Documentation Feedback TYP MAX UNIT 0 nA SVMLE = 1, PMMCOREV = 2, SVMLFP = 0 200 nA SVMLE = 1, PMMCOREV = 2, SVMLFP = 1 1.5 A SVMLE = 1, dVCORE/dt = 10 mV/s, SVMLFP = 1 2.5 SVMLE = 1, dVCORE/dt = 1 mV/s, SVMLFP = 0 20 SVMLE = 0 1, dVCORE/dt = 10 mV/s, SVMLFP = 1 12.5 SVMLE = 0 1, dVCORE/dt = 1 mV/s, SVMLFP = 0 100 s s Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Wake-Up From Low Power Modes and Reset over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT fMCLK 4.0 MHz 3.5 7.5 1.0 MHz < fMCLK < 4.0 MHz 4.5 9 150 165 s tWAKE-UP-FAST Wake-up time from LPM2, LPM3, or LPM4 to active mode (1) PMMCOREV = SVSMLRRL = n (where n = 0, 1, 2, or 3), SVSLFP = 1 tWAKE-UP-SLOW Wake-up time from LPM2, LPM3 or LPM4 to active mode (2) PMMCOREV = SVSMLRRL = n (where n = 0, 1, 2, or 3), SVSLFP = 0 tWAKE-UP-LPM5 Wake-up time from LPM4.5 to active mode (3) 2 3 ms tWAKE-UP-RESET Wake-up time from RST or BOR event to active mode (3) 2 3 ms (1) (2) (3) s This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance mode of the low side supervisor (SVSL) and low side monitor (SVML). Fastest wakeup times are possible with SVSLand SVML in full performance mode or disabled when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208). This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance mode of the low side supervisor (SVSL) and low side monitor (SVML). In this case, the SVSLand SVML are in normal mode (low current) mode when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208). This value represents the time from the wakeup event to the reset vector execution. Timer_A over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC fTA Timer_A input clock frequency Internal: SMCLK, ACLK, External: TACLK, Duty cycle = 50% 10% 1.8 V/3 V tTA,cap Timer_A capture timing All capture inputs. Minimum pulse width required for capture. 1.8 V/3 V MIN TYP MAX UNIT 25 MHz 20 ns Timer_B over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS fTB Timer_B input clock frequency Internal: SMCLK, ACLK, External: TBCLK, Duty cycle = 50% 10% tTB,cap Timer_B capture timing All capture inputs, Minimum pulse width required for capture. Copyright (c) 2010-2011, Texas Instruments Incorporated VCC 1.8 V/3 V 1.8 V/3 V MIN TYP MAX UNIT 25 MHz 20 Submit Documentation Feedback ns 55 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com USCI (UART Mode) Recommended Operating Conditions PARAMETER CONDITIONS VCC MIN TYP Internal: SMCLK, ACLK, External: UCLK, Duty cycle = 50% 10% fUSCI USCI input clock frequency fBITCLK BITCLK clock frequency (equals baud rate in MBaud) MAX UNIT fSYSTEM MHz 1 MHz MAX UNIT USCI (UART Mode) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER UART receive deglitch time (1) t (1) TEST CONDITIONS VCC MIN 2.2 V 50 TYP 600 3V 50 600 ns Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are correctly recognized their width should exceed the maximum specification of the deglitch time. USCI (SPI Master Mode) Recommended Operating Conditions PARAMETER fUSCI CONDITIONS VCC MIN TYP Internal: SMCLK, ACLK, Duty cycle = 50% 10% USCI input clock frequency MAX UNIT fSYSTEM MHz MAX UNIT fSYSTEM MHz USCI (SPI Master Mode) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note (1), Figure 11 and Figure 12) PARAMETER fUSCI TEST CONDITIONS PMMCOREV = 0 SOMI input data setup time PMMCOREV = 3 PMMCOREV = 0 tHD,MI SOMI input data hold time PMMCOREV = 3 tVALID,MO SIMO output data valid time (2) (2) (3) 56 55 3V 38 2.4 V 30 3V 25 1.8 V 0 3V 0 2.4 V 0 3V 0 ns ns ns ns 1.8 V 20 3V 18 UCLK edge to SIMO valid, CL = 20 pF, PMMCOREV = 3 2.4 V 16 3V 15 SIMO output data hold time (3) CL = 20 pF, PMMCOREV = 3 (1) 1.8 V TYP UCLK edge to SIMO valid, CL = 20 pF, PMMCOREV = 0 CL = 20 pF, PMMCOREV = 0 tHD,MO MIN SMCLK, ACLK Duty cycle = 50% 10% USCI input clock frequency tSU,MI VCC 1.8 V -10 3V -8 2.4 V -10 3V -8 ns ns ns ns fUCxCLK = 1/2tLO/HI with tLO/HI max(tVALID,MO(USCI) + tSU,SI(Slave), tSU,MI(USCI) + tVALID,SO(Slave)). For the slave's parameters tSU,SI(Slave) and tVALID,SO(Slave) see the SPI parameters of the attached slave. Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams in Figure 11 and Figure 12. Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in Figure 11 and Figure 12. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com 1/fUCxCLK CKPL = 0 UCLK CKPL = 1 tLO/HI tLO/HI tSU,MI tHD,MI SOMI tHD,MO tVALID,MO SIMO Figure 11. SPI Master Mode, CKPH = 0 1/fUCxCLK CKPL = 0 UCLK CKPL = 1 tLO/HI tLO/HI tSU,MI tHD,MI SOMI tHD,MO tVALID,MO SIMO Figure 12. SPI Master Mode, CKPH = 1 Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 57 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com USCI (SPI Slave Mode) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note (1), Figure 13 and Figure 14) PARAMETER TEST CONDITIONS PMMCOREV = 0 tSTE,LEAD STE lead time, STE low to clock PMMCOREV = 3 PMMCOREV = 0 tSTE,LAG STE lag time, Last clock to STE high PMMCOREV = 3 PMMCOREV = 0 tSTE,ACC STE access time, STE low to SOMI data out PMMCOREV = 3 PMMCOREV = 0 STE disable time, STE high to SOMI high impedance tSTE,DIS PMMCOREV = 3 PMMCOREV = 0 tSU,SI SIMO input data setup time PMMCOREV = 3 PMMCOREV = 0 tHD,SI SIMO input data hold time PMMCOREV = 3 tVALID,SO tHD,SO (1) (2) (3) 58 SOMI output data valid time (2) SOMI output data hold time (3) VCC MIN 1.8 V 11 3V 8 2.4 V 7 3V 6 1.8 V 3 3V 3 2.4 V 3 3V 3 TYP MAX ns ns ns ns 1.8 V 66 3V 50 2.4 V 36 3V 30 1.8 V 30 3V 23 2.4 V 16 3V 13 1.8 V 5 3V 5 2.4 V 2 3V 2 1.8 V 5 3V 5 2.4 V 5 3V 5 UNIT ns ns ns ns ns ns ns ns UCLK edge to SOMI valid, CL = 20 pF PMMCOREV = 0 1.8 V 76 3V 60 UCLK edge to SOMI valid, CL = 20 pF PMMCOREV = 3 2.4 V 44 3V 40 CL = 20 pF PMMCOREV = 0 1.8 V 18 3V 12 CL = 20 pF PMMCOREV = 3 2.4 V 10 3V 8 ns ns ns ns fUCxCLK = 1/2tLO/HI with tLO/HI max(tVALID,MO(Master) + tSU,SI(USCI), tSU,MI(Master) + tVALID,SO(USCI)). For the master's parameters tSU,MI(Master) and tVALID,MO(Master) see the SPI parameters of the attached slave. Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams in Figure 11 and Figure 12. Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure 11 and Figure 12. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com tSTE,LEAD tSTE,LAG STE 1/fUCxCLK CKPL = 0 UCLK CKPL = 1 tLO/HI tSU,SI tLO/HI tHD,SI SIMO tHD,SO tVALID,SO tSTE,ACC tSTE,DIS SOMI Figure 13. SPI Slave Mode, CKPH = 0 tSTE,LAG tSTE,LEAD STE 1/fUCxCLK CKPL = 0 UCLK CKPL = 1 tLO/HI tLO/HI tHD,SI tSU,SI SIMO tSTE,ACC tHD,MO tVALID,SO tSTE,DIS SOMI Figure 14. SPI Slave Mode, CKPH = 1 Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 59 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com USCI (I2C Mode) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 15) PARAMETER TEST CONDITIONS VCC MIN TYP Internal: SMCLK, ACLK, External: UCLK, Duty cycle = 50% 10% MAX UNIT fSYSTEM MHz 400 kHz fUSCI USCI input clock frequency fSCL SCL clock frequency tHD,STA Hold time (repeated) START tSU,STA Setup time for a repeated START tHD,DAT Data hold time 2.2 V/3 V 0 ns tSU,DAT Data setup time 2.2 V/3 V 250 ns 2.2 V/3 V fSCL 100 kHz fSCL > 100 kHz fSCL 100 kHz fSCL > 100 kHz fSCL 100 kHz tSU,STO Setup time for STOP tSP Pulse width of spikes suppressed by input filter fSCL > 100 kHz tSU,STA tHD,STA 2.2 V/3 V 2.2 V/3 V 2.2 V/3 V 0 4.0 s 0.6 4.7 s 0.6 4.0 s 0.6 2.2 V 50 600 3V 50 600 tHD,STA ns tBUF SDA tLOW tHIGH tSP SCL tSU,DAT tSU,STO tHD,DAT Figure 15. I2C Mode Timing 60 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com 12-Bit ADC, Power Supply and Input Range Conditions over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) PARAMETER TEST CONDITIONS AVCC Analog supply voltage AVCC and DVCC are connected together, AVSS and DVSS are connected together, V(AVSS) = V(DVSS) = 0 V V(Ax) Analog input voltage range (2) All ADC12 analog input pins Ax IADC12_A Operating supply current into AVCC terminal (3) fADC12CLK = 5.0 MHz (4) CI Input capacitance Only one terminal Ax can be selected at one time RI Input MUX ON resistance 0 V VAx AVCC (1) (2) (3) (4) VCC MIN TYP MAX UNIT 2.2 3.6 V 0 AVCC V 2.2 V 125 155 3V 150 220 2.2 V 20 25 pF 200 1900 10 A The leakage current is specified by the digital I/O input leakage. The analog input voltage range must be within the selected reference voltage range VR+ to VR- for valid conversion results. If the reference voltage is supplied by an external source or if the internal reference voltage is used and REFOUT = 1, then decoupling capacitors are required (see REF, External Reference and REF, Built-In Reference). The internal reference supply current is not included in current consumption parameter IADC12_A. ADC12ON = 1, REFON = 0, SHT0 = 0, SHT1 = 0, ADC12DIV = 0 12-Bit ADC, Timing Parameters over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC For specified performance of ADC12 linearity parameters using an external reference voltage or AVCC as reference (1) fADC12CLK ADC conversion clock For specified performance of ADC12 linearity parameters using the internal reference (2) 2.2 V/3 V For specified performance of ADC12 linearity parameters using the internal reference (3) fADC12OSC tCONVERT tSample (1) (2) (3) (4) (5) (6) Internal ADC12 oscillator (4) Conversion time Sampling time MIN TYP MAX 0.45 4.8 5.0 0.45 2.4 4.0 0.45 2.4 2.7 4.8 5.4 ADC12DIV = 0, fADC12CLK = fADC12OSC 2.2 V/3 V 4.2 REFON = 0, Internal oscillator, ADC12OSC used for ADC conversion clock 2.2 V/3 V 2.4 MHz MHz 3.1 s External fADC12CLK from ACLK, MCLK, or SMCLK, ADC12SSEL 0 RS = 400 , RI = 1000 , CI = 20 pF, = [RS + RI] x CI (6) UNIT (5) 2.2 V/3 V 1000 ns REFOUT = 0, external reference voltage: SREF2 = 0, SREF1 = 1, SREF0 = 0. AVCC as reference voltage: SREF2 = 0, SREF1 = 0, SREF0 = 0. The specified performance of the ADC12 linearity is ensured when using the ADC12OSC. For other clock sources, the specified performance of the ADC12 linearity is ensured with fADC12CLK maximum of 5.0 MHz. SREF2 = 0, SREF1 = 1, SREF0 = 0, ADC12SR = 0, REFOUT = 1 SREF2 = 0, SREF1 = 1, SREF0 = 0, ADC12SR = 0, REFOUT = 0. The specified performance of the ADC12 linearity is ensured when using the ADC12OSC divided by 2. The ADC12OSC is sourced directly from MODOSC inside the UCS. 13 x ADC12DIV x 1/fADC12CLK Approximately ten Tau () are needed to get an error of less than 0.5 LSB: tSample = ln(2n+1) x (RS + RI) x CI + 800 ns, where n = ADC resolution = 12, RS = external source resistance Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 61 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com 12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference Voltage over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER EI Integral linearity error (1) ED Differential linearity error (1) EO Offset error (3) EG Gain error (3) ET (1) (2) (3) TEST CONDITIONS 1.4 V dVREF 1.6 V (2) 1.6 V < dVREF (2) Total unadjusted error VCC MIN TYP MAX 2.0 2.2 V/3 V 1.7 (2) 2.2 V/3 V dVREF 2.2 V (2) 2.2 V/3 V 1.0 2.0 dVREF > 2.2 V (2) 2.2 V/3 V 1.0 2.0 (2) 2.2 V/3 V 1.0 2.0 dVREF 2.2 V (2) 2.2 V/3 V 1.4 3.5 dVREF > 2.2 V (2) 2.2 V/3 V 1.4 3.5 1.0 UNIT LSB LSB LSB LSB LSB Parameters are derived using the histogram method. The external reference voltage is selected by: SREF2 = 0 or 1, SREF1 = 1, SREF0 = 0. dVREF = VR+ - VR-, VR+ < AVCC, VR- > AVSS. Unless otherwise mentioned, dVREF > 1.5 V. Impedance of the external reference voltage R < 100 and two decoupling capacitors, 10 F and 100 nF, should be connected to VREF to decouple the dynamic current. See also the MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208). Parameters are derived using a best fit curve. 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) TEST CONDITIONS (1) PARAMETER EI ADC12SR = 0, REFOUT = 1 Integral linearity error (2) ADC12SR = 0, REFOUT = 0 fADC12CLK 4.0 MHz fADC12CLK 4.0 MHz ED ADC12SR = 0, REFOUT = 1 Differential ADC12SR = 0, REFOUT = 1 linearity error (2) ADC12SR = 0, REFOUT = 0 ADC12SR = 0, REFOUT = 1 fADC12CLK 4.0 MHz ADC12SR = 0, REFOUT = 0 fADC12CLK 2.7 MHz ADC12SR = 0, REFOUT = 1 fADC12CLK 4.0 MHz ADC12SR = 0, REFOUT = 0 fADC12CLK 2.7 MHz ADC12SR = 0, REFOUT = 1 fADC12CLK 4.0 MHz EO Offset error (3) EG Gain error (3) ET Total unadjusted error (1) (2) (3) (4) 62 ADC12SR = 0, REFOUT = 0 fADC12CLK 2.7 MHz fADC12CLK 2.7 MHz VCC TYP 2.2 V/3 V 2.2 V/3 V 2.2 V/3 V 2.5 -1.0 +2.0 -1.0 +1.5 -1.0 +2.5 1.0 2.0 1.0 2.0 1.0 2.0 UNIT LSB LSB LSB LSB 1.5% (4) VREF 1.4 2.2 V/3 V MAX 1.7 2.2 V/3 V fADC12CLK 2.7 MHz fADC12CLK 2.7 MHz MIN 3.5 LSB 1.5% (4) VREF The internal reference voltage is selected by: SREF2 = 0 or 1, SREF1 = 1, SREF0 = 1. dVREF = VR+ - VR-. Parameters are derived using the histogram method. Parameters are derived using a best fit curve. The gain error and total unadjusted error are dominated by the accuracy of the integrated reference module absolute accuracy. In this mode the reference voltage used by the ADC12_A is not available on a pin. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com 12-Bit ADC, Temperature Sensor and Built-In VMID (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER VSENSOR See TEST CONDITIONS ADC12ON = 1, INCH = 0Ah, TA = 0C (2) TCSENSOR tSENSOR(sample) ADC12ON = 1, INCH = 0Ah Sample time required if channel 10 is selected (3) ADC12ON = 1, INCH = 0Ah, Error of conversion result 1 LSB AVCC divider at channel 11, VAVCC factor ADC12ON = 1, INCH = 0Bh AVCC divider at channel 11 ADC12ON = 1, INCH = 0Bh Sample time required if channel 11 is selected (4) ADC12ON = 1, INCH = 0Bh, Error of conversion result 1 LSB VMID tVMID(sample) (1) (2) (3) (4) VCC MIN TYP 2.2 V 680 3V 680 2.2 V 2.25 3V 2.25 2.2 V 30 3V 30 MAX UNIT mV mV/C s 0.48 AVCC 0.5 AVCC 0.52 AVCC 2.2 V 1.06 1.1 1.14 3V 1.44 1.5 1.56 2.2 V/3 V 1000 V V ns The temperature sensor is provided by the REF module. See the REF module parametric, IREF+, regarding the current consumption of the temperature sensor. The temperature sensor offset can be as much as 20C. A single-point calibration is recommended in order to minimize the offset error of the built-in temperature sensor. The TLV structure contains calibration values for 30C 3C and 85C 3C for each of the available reference voltage levels. The sensor voltage can be computed as VSENSE = TCSENSOR * (Temperature,C) + VSENSOR, where TCSENSOR and VSENSOR can be computed from the calibration values for higher accuracy. See also the MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208). The typical equivalent impedance of the sensor is 51 k. The sample time required includes the sensor-on time tSENSOR(on). The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed. Typical Temperature Sensor Voltage - mV 1000 950 900 850 800 750 700 650 600 550 500 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Ambient Temperature - C Figure 16. Typical Temperature Sensor Voltage Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 63 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com REF, External Reference over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT VeREF+ Positive external reference voltage input VeREF+ > VREF-/VeREF- (2) 1.4 AVCC V VREF-/VeREF- Negative external reference voltage input VeREF+ > VREF-/VeREF- (3) 0 1.2 V (VeREF+ - VREF-/VeREF-) Differential external reference voltage input VeREF+ > VREF-/VeREF- (4) 1.4 AVCC V IVeREF+, IVREF-/VeREF- CVREF+/(1) (2) (3) (4) (5) 64 Static input current Capacitance at VREF+/- terminal 1.4 V VeREF+ VAVCC, VeREF- = 0 V, fADC12CLK = 5 MHz, ADC12SHTx = 1h, Conversion rate 200 ksps 2.2 V/3 V -26 26 A 1.4 V VeREF+ VAVCC, VeREF- = 0 V, fADC12CLK = 5 MHz, ADC12SHTx = 8h, Conversion rate 20 ksps 2.2 V/3 V -1 1 A (5) 10 F The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, Ci, is also the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy. The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced accuracy requirements. The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced accuracy requirements. The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with reduced accuracy requirements. Two decoupling capacitors, 10F and 100nF, should be connected to VREF to decouple the dynamic current required for an external reference source if it is used for the ADC12_A. See also the MSP430x5xx/MSP430x6xx Family User's Guide (SLAU208). Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com REF, Built-In Reference over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) PARAMETER VREF+ AVCC(min) IREF+ Positive built-in reference voltage output AVCC minimum voltage, Positive built-in reference active Operating supply current into AVCC terminal (2) (3) TEST CONDITIONS VCC MIN REFVSEL = {2} for 2.5 V, REFON = REFOUT = 1, IVREF+= 0 A 3V 2.4625 2.50 2.5375 REFVSEL = {1} for 2.0 V, REFON = REFOUT = 1, IVREF+= 0 A 3V 1.9503 1.98 2.0097 REFVSEL = {0} for 1.5 V, REFON = REFOUT = 1, IVREF+= 0 A 2.2 V/3 V 1.4677 1.49 1.5124 REFVSEL = {0} for 1.5 V 2.2 REFVSEL = {1} for 2.0 V 2.3 REFVSEL = {2} for 2.5 V 2.8 A ADC12SR = 1 (4), REFON = 1, REFOUT = 1, REFBURST = 0 3V 0.45 0.75 mA ADC12SR = 0 , REFON = 1, REFOUT = 0, REFBURST = 0 3V 210 310 A ADC12SR = 0 (4), REFON = 1, REFOUT = 1, REFBURST = 0 3V 0.95 1.7 mA (4) Capacitance at VREF+ terminals REFON = REFOUT = 1 TCREF+ Temperature coefficient of built-in reference (6) IVREF+ = 0 A, REFVSEL = (0, 1, 2}, REFON = 1, REFOUT = 0 or 1 PSRR_DC Power supply rejection ratio (DC) PSRR_AC Power supply rejection ratio (AC) (3) (4) (5) (6) (7) V 100 CVREF+ (2) V 70 IL(VREF+) (1) UNIT 3V REFVSEL = (0, 1, 2}, IVREF+ = +10 A/-1000 A, AVCC = AVCC(min) for each reference level, REFVSEL = (0, 1, 2}, REFON = REFOUT = 1 Settling time of reference voltage (7) MAX ADC12SR = 1 (4), REFON = 1, REFOUT = 0, REFBURST = 0 Load-current regulation, VREF+ terminal (5) tSETTLE TYP 2500 V/mA 100 pF 30 50 ppm/ C AVCC = AVCC(min) - AVCC(max), TA = 25C, REFVSEL = (0, 1, 2}, REFON = 1, REFOUT = 0 or 1 120 300 V/V AVCC = AVCC(min) - AVCC(max), TA = 25C, f = 1 kHz, Vpp = 100 mV, REFVSEL = (0, 1, 2}, REFON = 1, REFOUT = 0 or 1 6.4 AVCC = AVCC(min) - AVCC(max), REFVSEL = (0, 1, 2}, REFOUT = 0, REFON = 0 1 75 AVCC = AVCC(min) - AVCC(max), CVREF = CVREF(max), REFVSEL = (0, 1, 2}, REFOUT = 1, REFON = 0 1 20 mV/V s 75 The reference is supplied to the ADC by the REF module and is buffered locally inside the ADC. The ADC uses two internal buffers, one smaller and one larger for driving the VREF+ terminal. When REFOUT = 1, the reference is available at the VREF+ terminal, as well as, used as the reference for the conversion and utilizes the larger buffer. When REFOUT = 0, the reference is only used as the reference for the conversion and utilizes the smaller buffer. The internal reference current is supplied via terminal AVCC. Consumption is independent of the ADC12ON control bit, unless a conversion is active. REFOUT = 0 represents the current contribution of the smaller buffer. REFOUT = 1 represents the current contribution of the larger buffer without external load. The temperature sensor is provided by the REF module. Its current is supplied via terminal AVCC and is equivalent to IREF+ with REFON =1 and REFOUT = 0. For devices without the ADC12, the parametric with ADC12SR = 0 are applicable. Contribution only due to the reference and buffer including package. This does not include resistance due to PCB trace, etc. Calculated using the box method: (MAX(-40 to 85C) - MIN(-40 to 85C)) / MIN(-40 to 85C)/(85C - (-40C)). The condition is that the error in a conversion started after tREFON is less than 0.5 LSB. The settling time depends on the external capacitive load when REFOUT = 1. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 65 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Comparator B over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER VCC TEST CONDITIONS VCC Supply voltage MIN TYP 1.8 3.6 1.8 V IAVCC_COMP Comparator operating supply current into AVCC. Excludes reference resistor ladder. IAVCC_REF Quiescent current of local reference voltage amplifier into AVCC VIC Common mode input range VOFFSET Input offset voltage CIN Input capacitance RSIN 50 40 65 CBPWRMD = 01 2.2/3 V 10 30 CBPWRMD = 10 2.2/3 V 0.1 0.5 CBREFACC = 1, CBREFLx = 01 22 0 VCC-1 V ON - switch closed 3 A A V 20 mV 10 mV 4 k 5 pF 30 M CBPWRMD = 00, CBF = 0 450 ns Propagation delay, response time CBPWRMD = 01, CBF = 0 600 ns CBPWRMD = 10, CBF = 0 50 s CBPWRMD = 00, CBON = 1, CBF = 1, CBFDLY = 00 0.35 0.6 1.0 s CBPWRMD = 00, CBON = 1, CBF = 1, CBFDLY = 01 0.6 1.0 1.8 s CBPWRMD = 00, CBON = 1, CBF = 1, CBFDLY = 10 1.0 1.8 3.4 s CBPWRMD = 00, CBON = 1, CBF = 1, CBFDLY = 11 1.8 3.4 6.5 s 1 2 s 1 1.5 s tEN_CMP Comparator enable time, settling time CBON = 0 to CBON = 1 CBPWRMD = 00, 01, 10 tEN_REF Resistor reference enable time CBON = 0 to CBON = 1 VCB_REF 30 3V CBPWRMD = 01, 10 Propagation delay with filter active tPD,filter 2.2 V OFF - switch opened UNIT 40 CBPWRMD = 00 Series input resistance tPD CBPWRMD = 00 MAX Reference voltage for a given tap VIN x (n+1) / 32 VIN = reference into resistor ladder (n = 0 to 31) V Ports PU.0 and PU.1 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VOH High-level output voltage VLDOO = 3.3 V 10%, IOH = -25 mA, See Figure 18 for typical characteristics VOL Low-level output voltage VLDOO = 3.3 V 10%, IOL = 25 mA, See Figure 17 for typical characteristics VIH High-level input voltage VLDOO = 3.3 V 10%, See Figure 19 for typical characteristics VIL Low-level input voltage VLDOO = 3.3 V 10%, See Figure 19 for typical characteristics 66 Submit Documentation Feedback VCC MIN TYP MAX 2.4 UNIT V 0.4 2.0 V V 0.8 V Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE 90 VCC = 3.0 V TA = 25 C IOL - Typical Low-Level Output Current - mA 80 VCC = 3.0 V TA = 85 C VCC = 1.8 V TA = 25 C 70 60 50 VCC = 1.8 V TA = 85 C 40 30 20 10 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 VOL - Low-Level Output Voltage - V Figure 17. Ports PU.0, PU.1 Typical Low-Level Output Characteristics TYPICAL HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE 0 IOH - Typical High-Level Output Current - mA -10 -20 -30 VCC = 1.8 V TA = 85 C -40 -50 VCC = 3.0 V TA = 85 C -60 VCC = 1.8 V TA = 25 C -70 VCC = 3.0 V TA = 25 C -80 -90 0.5 1 1.5 2 2.5 3 VOH - High-Level Output Voltage - V Figure 18. Ports PU.0, PU.1 Typical High-Level Output Characteristics TYPICAL PU.0, PU.1 INPUT THRESHOLD 2.0 T A = 25 C, 85 C 1.8 VIT+ , postive-going input threshold Input Threshold - V 1.6 1.4 1.2 VIT- , negative-going input threshold 1.0 0.8 0.6 0.4 0.2 0.0 1.8 2.2 2.6 3 3.4 LDOO Supply Voltage, VLDOO - V Figure 19. Ports PU.0, PU.1 Typical Input Threshold Characteristics Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 67 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com LDO-PWR (LDO Power System) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VLAUNCH LDO input detection threshold VLDOI LDO input voltage VLDO LDO output voltage VLDO_EXT LDOO terminal input voltage with LDO disabled LDO disabled ILDOO Maximum external current from LDOO terminal LDO is on IDET LDO current overload detection (1) CLDOI LDOI terminal recommended capacitance CLDOO LDOO terminal recommended capacitance tENABLE (1) MIN TYP MAX UNIT 3.75 V 5.5 V 9% V 1.8 3.6 V 20 mA 60 100 mA 3.76 3.3 4.7 F 220 nF Within 2%, recommended capacitances Settling time VLDO 2 ms MAX UNIT A current overload is detected when the total current supplied from the LDO exceeds this value. Flash Memory over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS DVCC(PGM/ERASE) Program and erase supply voltage IPGM Average supply current from DVCC during program IERASE Average supply current from DVCC during erase IMERASE, IBANK Average supply current from DVCC during mass erase or bank erase tCPT Cumulative program time MIN TYP 1.8 3.6 3 See (1) mA 2 mA 2 mA 16 104 Program/erase endurance V 5 105 ms cycles tRetention Data retention duration TJ = 25C tWord Word or byte program time See (2) 64 85 s tBlock, 0 Block program time for first byte or word See (2) 49 65 s tBlock, 1-(N-1) Block program time for each additional byte or word, except for last byte or word See (2) 37 49 s Block program time for last byte or word See (2) 55 73 s tErase Erase time for segment, mass erase, and bank erase (when available) See (2) 23 32 ms fMCLK,MGR MCLK frequency in marginal read mode (FCTL4.MGR0 = 1 or FCTL4. MGR1 = 1) 0 1 MHz tBlock, (1) (2) 68 N 100 years The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming methods: individual word/byte write and block write modes. These values are hardwired into the flash controller's state machine. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com JTAG and Spy-Bi-Wire Interface over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER VCC MIN TYP MAX UNIT fSBW Spy-Bi-Wire input frequency 2.2 V/3 V 0 20 MHz tSBW,Low Spy-Bi-Wire low clock pulse length 2.2 V/3 V 0.025 15 s tSBW, Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge) (1) 2.2 V/3 V 1 s 100 s En tSBW,Rst Spy-Bi-Wire return to normal operation time fTCK TCK input frequency, 4-wire JTAG (2) Rinternal Internal pulldown resistance on TEST (1) (2) 15 2.2 V 0 5 MHz 3V 0 10 MHz 2.2 V/3 V 45 80 k 60 Tools accessing the Spy-Bi-Wire interface need to wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying the first SBWTCK clock edge. fTCK may be restricted to meet the timing requirements of the module selected. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 69 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com INPUT/OUTPUT SCHEMATICS Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger Pad Logic P1REN.x P1DIR.x 0 From module 1 P1OUT.x 0 From module 1 0 DVCC 1 1 Direction 0: Input 1: Output P1DS.x 0: Low drive 1: High drive P1SEL.x P1IN.x EN To module DVSS P1.0/TA0CLK/ACLK P1.1/TA0.0 P1.2/TA0.1 P1.3/TA0.2 P1.4/TA0.3 P1.5/TA0.4 P1.6/TA1CLK/CBOUT P1.7/TA1.0 D P1IE.x EN P1IRQ.x Q P1IFG.x P1SEL.x P1IES.x 70 Submit Documentation Feedback Set Interrupt Edge Select Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 46. Port P1 (P1.0 to P1.7) Pin Functions PIN NAME (P1.x) P1.0/TA0CLK/ACLK P1.1/TA0.0 P1.2/TA0.1 P1.3/TA0.2 P1.4/TA0.3 x 0 1 2 3 4 FUNCTION P1DIR.x P1SEL.x P1.0 (I/O) I: 0; O: 1 0 TA0CLK 0 1 ACLK 1 1 I: 0; O: 1 0 TA0.CCI0A 0 1 TA0.0 1 1 I: 0; O: 1 0 TA0.CCI1A 0 1 TA0.1 1 1 I: 0; O: 1 0 TA0.CCI2A 0 1 TA0.2 1 1 I: 0; O: 1 0 0 1 P1.1 (I/O) P1.2 (I/O) P1.3 (I/O) P1.4 (I/O) TA0.CCI3A TA0.3 P1.5/TA0.4 5 P1.5 (I/O) TA0.CCI4A TA0.4 P1.6/TA1CLK/CBOUT 6 7 1 1 I: 0; O: 1 0 0 1 1 1 P1.6 (I/O) I: 0; O: 1 0 TA1CLK 0 1 CBOUT comparator B P1.7/TA1.0 CONTROL BITS/SIGNALS 1 1 I: 0; O: 1 0 TA1.CCI0A 0 1 TA1.0 1 1 P1.7 (I/O) Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 71 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger Pad Logic P2REN.x P2DIR.x 0 From module 1 P2OUT.x 0 From module 1 0 DVCC 1 1 Direction 0: Input 1: Output P2DS.x 0: Low drive 1: High drive P2SEL.x P2IN.x EN To module DVSS P2.0/TA1.1 P2.1/TA1.2 P2.2/TA2CLK/SMCLK P2.3/TA2.0 P2.4/TA2.1 P2.5/TA2.2 P2.6/RTCCLK/DMAE0 P2.7/UB0STE/UCA0CLK D P2IE.x EN To module Q P2IFG.x P2SEL.x P2IES.x 72 Submit Documentation Feedback Set Interrupt Edge Select Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 47. Port P2 (P2.0 to P2.7) Pin Functions PIN NAME (P2.x) P2.0/TA1.1 P2.1/TA1.2 P2.2/TA2CLK/SMCLK P2.3/TA2.0 P2.4/TA2.1 x 0 1 2 3 4 FUNCTION P2.0 (I/O) 0 0 1 TA1.1 1 1 I: 0; O: 1 0 TA1.CCI2A 0 1 TA1.2 1 1 P2.2 (I/O) I: 0; O: 1 0 TA2CLK 0 1 SMCLK 1 1 I: 0; O: 1 0 TA2.CCI0A 0 1 TA2.0 1 1 I: 0; O: 1 0 0 1 P2.1 (I/O) P2.3 (I/O) P2.4 (I/O) P2.5 (I/O) TA2.CCI2A TA2.2 P2.6/RTCCLK/DMAE0 6 7 1 0 0 1 1 1 0 0 1 RTCCLK 1 1 P2.7 (I/O) I: 0; O: 1 0 X 1 UCB0STE/UCA0CLK (2) (1) (2) (3) 1 I: 0; O: 1 I: 0; O: 1 P2.6 (I/O) DMAE0 P2.7/UCB0STE/UCA0CLK P2SEL.x I: 0; O: 1 TA2.1 5 P2DIR.x TA1.CCI1A TA2.CCI1A P2.5/TA2.2 CONTROL BITS/SIGNALS (1) (3) X = Don't care The pin direction is controlled by the USCI module. UCA0CLK function takes precedence over UCB0STE function. If the pin is required as UCA0CLK input or output, USCI A0/B0 is forced to 3-wire SPI mode if 4-wire SPI mode is selected. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 73 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger Pad Logic P3REN.x P3DIR.x 0 From module 1 P3OUT.x 0 From module 1 DVSS 0 DVCC 1 Direction 0: Input 1: Output P3DS.x 0: Low drive 1: High drive P3SEL.x P3IN.x EN To module 1 P3.0/UCB0SIMO/UCB0SDA P3.1/UCB0SOMI/UCB0SCL P3.2/UCB0CLK/UCA0STE P3.3/UCA0TXD/UCA0SIMO P3.4/UCA0RXD/UCA0SOMI P3.5/TB0.5 P3.6/TB0.6 P3.7/TB0OUTH/SVMOUT D Table 48. Port P3 (P3.0 to P3.7) Pin Functions PIN NAME (P3.x) x P3.0/UCB0SIMO/UCB0SDA 0 FUNCTION P3.0 (I/O) UCB0SIMO/UCB0SDA P3.1/UCB0SOMI/UCB0SCL 1 (2) (3) P3.1 (I/O) UCB0SOMI/UCB0SCL (2) P3.2/UCB0CLK/UCA0STE 2 P3.2 (I/O) UCB0CLK/UCA0STE P3.3/UCA0TXD/UCA0SIMO 3 (2) (4) 4 P3.6/TB0.6 (5) 5 6 (1) (2) (3) (4) (5) 74 X 1 I: 0; O: 1 0 X 1 I: 0; O: 1 0 0 X 1 I: 0; O: 1 0 X 1 I: 0; O: 1 0 TB0.CCI5A 0 1 TB0.5 1 1 I: 0; O: 1 0 0 1 P3.4 (I/O) P3.5 (I/O) P3.6 (I/O) TB0.6 7 0 1 TB0.CCI6A P3.7/TB0OUTH/SVMOUT (5) P3SEL.x X UCA0RXD/UCA0SOMI (2) P3.5/TB0.5 (5) P3DIR.x I: 0; O: 1 I: 0; O: 1 P3.3 (I/O) UCA0TXD/UCA0SIMO (2) P3.4/UCA0RXD/UCA0SOMI (3) CONTROL BITS/SIGNALS (1) 1 1 P3.7 (I/O) I: 0; O: 1 0 TB0OUTH 0 1 SVMOUT 1 1 X = Don't care The pin direction is controlled by the USCI module. If the I2C functionality is selected, the output drives only the logical 0 to VSS level. UCB0CLK function takes precedence over UCA0STE function. If the pin is required as UCB0CLK input or output, USCI A0/B0 is forced to 3-wire SPI mode if 4-wire SPI mode is selected. 'F5329, 'F5327, 'F5325 devices only. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger Pad Logic P4REN.x P4DIR.x 0 from Port Mapping Control 1 P4OUT.x 0 from Port Mapping Control 1 DVSS 0 DVCC 1 1 Direction 0: Input 1: Output P4.0/P4MAP0 P4.1/P4MAP1 P4.2/P4MAP2 P4.3/P4MAP3 P4.4/P4MAP4 P4.5/P4MAP5 P4.6/P4MAP6 P4.7/P4MAP7 P4DS.x 0: Low drive 1: High drive P4SEL.x P4IN.x EN D to Port Mapping Control Table 49. Port P4 (P4.0 to P4.7) Pin Functions PIN NAME (P4.x) P4.0/P4MAP0 x 0 FUNCTION P4.0 (I/O) Mapped secondary digital function P4.1/P4MAP1 1 P4.2/P4MAP2 2 P4.1 (I/O) Mapped secondary digital function P4.2 (I/O) Mapped secondary digital function P4.3/P4MAP3 3 P4.3 (I/O) Mapped secondary digital function P4.4/P4MAP4 4 P4.5/P4MAP5 5 P4.4 (I/O) Mapped secondary digital function P4.5 (I/O) Mapped secondary digital function P4.6/P4MAP6 6 P4.7/P4MAP7 7 P4.6 (I/O) Mapped secondary digital function P4.7 (I/O) Mapped secondary digital function (1) CONTROL BITS/SIGNALS P4DIR.x (1) P4SEL.x I: 0; O: 1 0 X X 1 30 I: 0; O: 1 0 X 30 P4MAPx X 1 I: 0; O: 1 0 X X 1 30 I: 0; O: 1 0 X X 1 30 I: 0; O: 1 0 X 30 X 1 I: 0; O: 1 0 X X 1 30 I: 0; O: 1 0 X 30 X 1 I: 0; O: 1 0 X X 1 30 The direction of some mapped secondary functions are controlled directly by the module. See Table 8 for specific direction control information of mapped secondary functions. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 75 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger Pad Logic to/from Reference to ADC12 INCHx = x P5REN.x P5DIR.x DVSS 0 DVCC 1 1 0 1 P5OUT.x 0 From module 1 P5.0/A8/VREF+/VeREF+ P5.1/A9/VREF-/VeREF- P5DS.x 0: Low drive 1: High drive P5SEL.x P5IN.x Bus Keeper EN To module D Table 50. Port P5 (P5.0 and P5.1) Pin Functions PIN NAME (P5.x) P5.0/A8/VREF+/VeREF+ P5.1/A9/VREF-/VeREF- (1) (2) (3) (4) (5) (6) 76 x 0 1 FUNCTION P5.0 (I/O) (2) CONTROL BITS/SIGNALS (1) P5DIR.x P5SEL.x REFOUT I: 0; O: 1 0 X A8/VeREF+ (3) X 1 0 A8/VREF+ (4) X 1 1 P5.1 (I/O) (2) I: 0; O: 1 0 X A9/VeREF- (5) X 1 0 A9/VREF- (6) X 1 1 X = Don't care Default condition Setting the P5SEL.0 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying analog signals. An external voltage can be applied to VeREF+ and used as the reference for the ADC12_A. Channel A8, when selected with the INCHx bits, is connected to the VREF+/VeREF+ pin. Setting the P5SEL.0 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying analog signals. The VREF+ reference is available at the pin. Channel A8, when selected with the INCHx bits, is connected to the VREF+/VeREF+ pin. Setting the P5SEL.1 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying analog signals. An external voltage can be applied to VeREF- and used as the reference for the ADC12_A. Channel A9, when selected with the INCHx bits, is connected to the VREF-/VeREF- pin. Setting the P5SEL.1 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying analog signals. The VREF- reference is available at the pin. Channel A9, when selected with the INCHx bits, is connected to the VREF-/VeREF- pin. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port P5, P5.2, Input/Output With Schmitt Trigger Pad Logic To XT2 P5REN.2 P5DIR.2 DVSS 0 DVCC 1 1 0 1 P5OUT.2 0 Module X OUT 1 P5DS.2 0: Low drive 1: High drive P5SEL.2 P5.2/XT2IN P5IN.2 EN Module X IN Bus Keeper D Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 77 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port P5, P5.3, Input/Output With Schmitt Trigger Pad Logic To XT2 P5REN.3 P5DIR.3 DVSS 0 DVCC 1 1 0 1 P5OUT.3 0 Module X OUT 1 P5.3/XT2OUT P5DS.3 0: Low drive 1: High drive P5SEL.3 P5IN.3 Bus Keeper EN Module X IN D Table 51. Port P5 (P5.2, P5.3) Pin Functions PIN NAME (P5.x) P5.2/XT2IN P5.3/XT2OUT (1) (2) (3) 78 x 2 3 FUNCTION P5.2 (I/O) CONTROL BITS/SIGNALS (1) P5DIR.x P5SEL.2 P5SEL.3 XT2BYPASS I: 0; O: 1 0 X X XT2IN crystal mode (2) X 1 X 0 XT2IN bypass mode (2) X 1 X 1 I: 0; O: 1 0 X X XT2OUT crystal mode (3) X 1 X 0 P5.3 (I/O) (3) X 1 X 1 P5.3 (I/O) X = Don't care Setting P5SEL.2 causes the general-purpose I/O to be disabled. Pending the setting of XT2BYPASS, P5.2 is configured for crystal mode or bypass mode. Setting P5SEL.2 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.3 can be used as general-purpose I/O. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port P5, P5.4 and P5.5 Input/Output With Schmitt Trigger Pad Logic to XT1 P5REN.4 P5DIR.4 DVSS 0 DVCC 1 1 0 1 P5OUT.4 0 Module X OUT 1 P5DS.4 0: Low drive 1: High drive P5SEL.4 P5.4/XIN P5IN.4 EN Module X IN Bus Keeper D Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 79 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Pad Logic to XT1 P5REN.5 P5DIR.5 DVSS 0 DVCC 1 1 0 1 P5OUT.5 0 Module X OUT 1 P5.5/XOUT P5DS.5 0: Low drive 1: High drive P5SEL.5 XT1BYPASS P5IN.5 Bus Keeper EN Module X IN D Table 52. Port P5 (P5.4 and P5.5) Pin Functions PIN NAME (P5.x) P5.4/XIN x 4 FUNCTION P5DIR.x P5SEL.4 P5SEL.5 XT1BYPASS I: 0; O: 1 0 X X X 1 X 0 X 1 X 1 I: 0; O: 1 0 X X XOUT crystal mode (3) X 1 X 0 P5.5 (I/O) (3) X 1 X 1 P5.4 (I/O) XIN crystal mode (2) XIN bypass mode (2) P5.5/XOUT (1) (2) (3) 80 5 CONTROL BITS/SIGNALS (1) P5.5 (I/O) X = Don't care Setting P5SEL.4 causes the general-purpose I/O to be disabled. Pending the setting of XT1BYPASS, P5.4 is configured for crystal mode or bypass mode. Setting P5SEL.4 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.5 can be used as general-purpose I/O. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port P5, P5.6 to P5.7, Input/Output With Schmitt Trigger Pad Logic P5REN.x P5DIR.x 0 From Module 1 P5OUT.x 0 DVSS 0 DVCC 1 1 Direction 0: Input 1: Output 1 P5DS.x 0: Low drive 1: High drive P5SEL.x P5.6/TB0.0 P5.7/TB0.1 P5IN.x EN D To module Table 53. Port P5 (P5.6 to P5.7) Pin Functions PIN NAME (P5.x) P5.6/TB0.0 P5.7/TB0.1 (1) (1) (1) x 6 7 FUNCTION P5.6 (I/O) CONTROL BITS/SIGNALS P5DIR.x P5SEL.x I: 0; O: 1 0 TB0.CCI0A 0 1 TB0.0 1 1 TB0.CCI1A 0 1 TB0.1 1 1 'F5329, 'F5327, 'F5325 devices only. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 81 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger Pad Logic to ADC12 INCHx = x to Comparator_B from Comparator_B CBPD.x P6REN.x P6DIR.x 0 0 From module 1 0 DVCC 1 P6DS.x 0: Low drive 1: High drive P6SEL.x P6IN.x EN To module 82 1 Direction 0: Input 1: Output 1 P6OUT.x DVSS D Submit Documentation Feedback Bus Keeper P6.0/CB0/A0 P6.1/CB1/A1 P6.2/CB2/A2 P6.3/CB3/A3 P6.4/CB4/A4 P6.5/CB5/A5 P6.6/CB6/A6 P6.7/CB7/A7 Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 54. Port P6 (P6.0 to P6.7) Pin Functions PIN NAME (P6.x) P6.0/CB0/(A0) x 0 FUNCTION P6.0 (I/O) A0 CB0 (1) P6.1/CB1/(A1) P6.2/CB2/(A2) P6.3/CB3/(A3) P6.4/CB4/(A4) 1 2 3 4 P6.1 (I/O) (1) X X X 1 I: 0; O: 1 0 0 1 X 1 I: 0; O: 1 0 0 P6.2 (I/O) A2 X 1 X CB2 (1) X X 1 I: 0; O: 1 0 0 P6.3 (I/O) A3 X 1 X CB3 (1) X X 1 I: 0; O: 1 0 0 X 1 X 1 P6.4 (I/O) P6.5 (I/O) P6.6 (I/O) CB6 (1) 7 0 1 X A6 P6.7/CB7/(A7) 0 X X CB5 (1) 6 I: 0; O: 1 X A5 P6.6/CB6/(A6) CBPD CB1 (1) CB4 (1) 5 P6SEL.x A1 A4 P6.5/CB5/(A5) CONTROL BITS/SIGNALS P6DIR.x X X I: 0; O: 1 0 0 X 1 X 1 X X I: 0; O: 1 0 0 X 1 X 1 X X I: 0; O: 1 0 0 A7 X 1 X CB7 (1) X X 1 P6.7 (I/O) Setting the CBPD.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying analog signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input buffer for that pin, regardless of the state of the associated CBPD.x bit. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 83 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port P7, P7.0 to P7.3, Input/Output With Schmitt Trigger Pad Logic to ADC12 INCHx = x to Comparator_B from Comparator_B CBPD.x P7REN.x P7DIR.x 0 0 From module 1 0 DVCC 1 1 Direction 0: Input 1: Output 1 P7OUT.x DVSS P7DS.x 0: Low drive 1: High drive P7SEL.x P7.0/CB8/A12 P7.1/CB9/A13 P7.2/CB10/A14 P7.3/CB11/A15 P7IN.x EN To module 84 Bus Keeper D Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 55. Port P7 (P7.0 to P7.3) Pin Functions PIN NAME (P7.x) P7.0/CB8/(A12) x 0 FUNCTION P7.0 (I/O) A12 (2) CB8 (3) P7.1/CB9/(A13) 1 0 1 X 1 0 0 (2) X 1 X X X 1 I: 0; O: 1 0 0 X 1 X X X 1 I: 0; O: 1 0 0 X 1 X X X 1 (1) P7.2 (I/O) (1) (2) (1) P7.3 (I/O) (1) A15 (2) CB11 (3) (1) (2) (3) 0 X X CB10 (3) 3 I: 0; O: 1 X A14 P7.3/CB11/(A15) CBPD I: 0; O: 1 CB9 (3) 2 (1) P7SEL.x P7.1 (I/O) (1) A13 P7.2/CB10/(A14) (1) CONTROL BITS/SIGNALS P7DIR.x (1) 'F5329, 'F5327, 'F5325 devices only. 'F5329, 'F5327, 'F5325 devices only. Setting the CBPD.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying analog signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input buffer for that pin, regardless of the state of the associated CBPD.x bit. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 85 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port P7, P7.4 to P7.7, Input/Output With Schmitt Trigger Pad Logic P7REN.x P7DIR.x 0 From module 1 P7OUT.x 0 DVSS 0 DVCC 1 1 Direction 0: Input 1: Output 1 P7DS.x 0: Low drive 1: High drive P7SEL.x P7.4/TB0.2 P7.5/TB0.3 P7.6/TB0.4 P7.7/TB0CLK/MCLK P7IN.x EN To module D Table 56. Port P7 (P7.4 to P7.7) Pin Functions PIN NAME (P7.x) P7.4/TB0.2 P7.5/TB0.3 (1) (1) P7.6/TB0.4 (1) P7.7/TB0CLK/MCLK (1) x 4 5 6 7 FUNCTION P7.4 (I/O) CONTROL BITS/SIGNALS P7DIR.x P7SEL.x I: 0; O: 1 0 TB0.CCI2A 0 1 TB0.2 1 1 P7.5 (I/O) I: 0; O: 1 0 TB0.CCI3A 0 1 TB0.3 1 1 I: 0; O: 1 0 TB0.CCI4A 0 1 TB0.4 1 1 P7.7 (I/O) I: 0; O: 1 0 TB0CLK 0 1 MCLK 1 1 P7.6 (I/O) (1) 'F5329, 'F5327, 'F5325 devices only. 86 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port P8, P8.0 to P8.2, Input/Output With Schmitt Trigger Pad Logic P8REN.x P8DIR.x 0 from Port Mapping Control 1 P8OUT.x 0 from Port Mapping Control 1 DVSS 0 DVCC 1 1 Direction 0: Input 1: Output P8.0 P8.1 P8.2 P8DS.x 0: Low drive 1: High drive P8SEL.x P8IN.x EN D to Port Mapping Control Table 57. Port P8 (P8.0 to P8.2) Pin Functions PIN NAME (P8.x) x FUNCTION CONTROL BITS/SIGNALS P8DIR.x P8SEL.x P8.0 (1) 0 P8.0(I/O) I: 0; O: 1 0 P8.1 (1) 1 P8.1(I/O) I: 0; O: 1 0 P8.2 (1) 2 P8.2(I/O) I: 0; O: 1 0 (1) 'F5329, 'F5327, 'F5325 devices only. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 87 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port PU.0, PU.1 Ports LDOO VSSU Pad Logic PUOPE PU.0 PUOUT0 PUIN0 PUIPE PUIN1 PU.1 PUOUT1 Table 58. Port PU.0, PU.1 Output Functions (1) CONTROL BITS (1) PIN NAME PUOPE PUOUT1 PUOUT0 PU.1/DM PU.0/DP 0 X X Output disabled Output disabled 1 0 0 Output low Output low 1 0 1 Output low Output high 1 1 0 Output high Output low 1 1 1 Output high Output high PU.1 and PU.0 inputs and outputs are supplied from LDOO. LDOO can be generated by the device using the integrated 3.3V LDO when enabled. LDOO can also be supplied externally when the 3.3V LDO is not being used and is disabled. Table 59. Port PU.0, PU.1 Input Functions (1) CONTROL BITS (1) 88 PIN NAME PUIPE PU.1/DM PU.0/DP 0 Input disabled Input disabled 1 Input enabled Input enabled PU.1 and PU.0 inputs and outputs are supplied from LDOO. LDOO can be generated by the device using the integrated 3.3V LDO when enabled. LDOO can also be supplied externally when the 3.3V LDO is not being used and is disabled. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output Pad Logic PJREN.0 PJDIR.0 0 DVCC 1 PJOUT.0 0 From JTAG 1 DVSS 0 DVCC 1 1 PJ.0/TDO PJDS.0 0: Low drive 1: High drive From JTAG PJIN.0 EN D Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output Pad Logic PJREN.x PJDIR.x 0 DVSS 1 PJOUT.x 0 From JTAG 1 DVSS 0 DVCC 1 1 PJDS.x 0: Low drive 1: High drive From JTAG PJ.1/TDI/TCLK PJ.2/TMS PJ.3/TCK PJIN.x EN To JTAG D Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 89 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 60. Port PJ (PJ.0 to PJ.3) Pin Functions PIN NAME (PJ.x) x CONTROL BITS/ SIGNALS (1) FUNCTION PJDIR.x PJ.0/TDO 0 (2) I: 0; O: 1 PJ.1 (I/O) (2) I: 0; O: 1 PJ.0 (I/O) TDO (3) PJ.1/TDI/TCLK 1 X TDI/TCLK (3) PJ.2/TMS 2 PJ.2 (I/O) TMS (3) PJ.3/TCK 3 (1) (2) (3) (4) 90 X I: 0; O: 1 (4) PJ.3 (I/O) TCK (3) (4) (2) X (2) I: 0; O: 1 (4) X X = Don't care Default condition The pin direction is controlled by the JTAG module. In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are do not care. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com DEVICE DESCRIPTORS Table 61 lists the complete contents of the device descriptor tag-length-value (TLV) structure for each device type. Table 61. 'F532x Device Descriptor Table (1) Info Block Die Record ADC12 Calibration REF Calibration Peripheral Descriptor Description Address Size bytes 'F5329 'F5328 'F5327 'F5326 'F5325 'F5324 Value Value Value Value Value Value 06h Info length 01A00h 1 06h 06h 06h 06h 06h CRC length 01A01h 1 06h 06h 06h 06h 06h 06h CRC value 01A02h 2 per unit per unit per unit per unit per unit per unit Device ID 01A04h 1 1Bh 1Ah 19h 18h 17h 16h Device ID 01A05h 1 81h 81h 81h 81h 81h 81h Hardware revision 01A06h 1 per unit per unit per unit per unit per unit per unit Firmware revision 01A07h 1 per unit per unit per unit per unit per unit per unit Die Record Tag 01A08h 1 08h 08h 08h 08h 08h 08h Die Record length 01A09h 1 0Ah 0Ah 0Ah 0Ah 0Ah 0Ah Lot/Wafer ID 01A0Ah 4 per unit per unit per unit per unit per unit per unit Die X position 01A0Eh 2 per unit per unit per unit per unit per unit per unit Die Y position 01A10h 2 per unit per unit per unit per unit per unit per unit Test results 01A12h 2 per unit per unit per unit per unit per unit per unit ADC12 Calibration Tag 01A14h 1 11h 11h 11h 11h 11h 11h ADC12 Calibration length 01A15h 1 10h 10h 10h 10h 10h 10h ADC Gain Factor 01A16h 2 per unit per unit per unit per unit per unit per unit ADC Offset 01A18h 2 per unit per unit per unit per unit per unit per unit ADC 1.5-V Reference Temp. Sensor 30C 01A1Ah 2 per unit per unit per unit per unit per unit per unit ADC 1.5-V Reference Temp. Sensor 85C 01A1Ch 2 per unit per unit per unit per unit per unit per unit ADC 2.0-V Reference Temp. Sensor 30C 01A1Eh 2 per unit per unit per unit per unit per unit per unit ADC 2.0-V Reference Temp. Sensor 85C 01A20h 2 per unit per unit per unit per unit per unit per unit ADC 2.5-V Reference Temp. Sensor 30C 01A22h 2 per unit per unit per unit per unit per unit per unit ADC 2.5-V Reference Temp. Sensor 85C 01A24h 2 per unit per unit per unit per unit per unit per unit REF Calibration Tag 01A26h 1 12h 12h 12h 12h 12h 12h REF Calibration length 01A27h 1 06h 06h 06h 06h 06h 06h REF 1.5-V Reference Factor 01A28h 2 per unit per unit per unit per unit per unit per unit REF 2.0-V Reference Factor 01A2Ah 2 per unit per unit per unit per unit per unit per unit REF 2.5-V Reference Factor 01A2Ch 2 per unit per unit per unit per unit per unit per unit Peripheral Descriptor Tag 01A2Eh 1 02h 02h 02h 02h 02h 02h Peripheral Descriptor Length 01A2Fh 1 62h 60h 62h 60h 62h 60h 2 08h 8Ah 08h 8Ah 08h 8Ah 08h 8Ah 08h 8Ah 08h 8Ah Memory 1 (1) NA = Not applicable, blank = unused and reads FFh. Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 91 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 61. 'F532x Device Descriptor Table(1) (continued) Description 92 Address Size bytes 'F5329 'F5328 'F5327 'F5326 'F5325 'F5324 Value Value Value Value Value Value Memory 2 2 0Ch 86h 0Ch 86h 0Ch 86h 0Ch 86h 0Ch 86h 0Ch 86h Memory 3 2 0Eh 2Fh 0Eh 2Fh 0Eh 2Eh 0Eh 2Eh 0Eh 2Dh 0Eh 2Dh Memory 4 2 2Ah 22h 2Ah 22h 22h 95h 22h 95h 2Ah 22h 2Ah 22h Memory 5 1 96h 96h 92h 92h 94h 94h delimiter 1 00h 00h 00h 00h 00h 00h Peripheral count 1 21h 20h 21h 20h 21h 20h MSP430CPUXV2 2 00h 23h 00h 23h 00h 23h 00h 23h 00h 23h 00h 23h JTAG 2 00h 09h 00h 09h 00h 09h 00h 09h 00h 09h 00h 09h SBW 2 00h 0Fh 00h 0Fh 00h 0Fh 00h 0Fh 00h 0Fh 00h 0Fh EEM-L 2 00h 05h 00h 05h 00h 05h 00h 05h 00h 05h 00h 05h TI BSL 2 00h FCh 00h FCh 00h FCh 00h FCh 00h FCh 00h FCh SFR 2 10h 41h 10h 41h 10h 41h 10h 41h 10h 41h 10h 41h PMM 2 02h 30h 02h 30h 02h 30h 02h 30h 02h 30h 02h 30h FCTL 2 02h 38h 02h 38h 02h 38h 02h 38h 02h 38h 02h 38h CRC16 2 01h 3Ch 01h 3Ch 01h 3Ch 01h 3Ch 01h 3Ch 01h 3Ch CRC16_RB 2 00h 3Dh 00h 3Dh 00h 3Dh 00h 3Dh 00h 3Dh 00h 3Dh RAMCTL 2 00h 44h 00h 44h 00h 44h 00h 44h 00h 44h 00h 44h WDT_A 2 00h 40h 00h 40h 00h 40h 00h 40h 00h 40h 00h 40h UCS 2 01h 48h 01h 48h 01h 48h 01h 48h 01h 48h 01h 48h SYS 2 02h 42h 02h 42h 02h 42h 02h 42h 02h 42h 02h 42h REF 2 03h A0h 03h A0h 03h A0h 03h A0h 03h A0h 03h A0h Port Mapping 2 01h 10h 01h 10h 01h 10h 01h 10h 01h 10h 01h 10h Port 1/2 2 04h 51h 04h 51h 04h 51h 04h 51h 04h 51h 04h 51h Port 3/4 2 02h 52h 02h 52h 02h 52h 02h 52h 02h 52h 02h 52h Port 5/6 2 02h 53h 02h 53h 02h 53h 02h 53h 02h 53h 02h 53h Port 7/8 2 02h 54h N/A 02h 54h N/A 02h 54h N/A JTAG 2 0Ch 5Fh 0Eh 5Fh 0Ch 5Fh 0Eh 5Fh 0Ch 5Fh 0Eh 5Fh TA0 2 02h 62h 02h 62h 02h 62h 02h 62h 02h 62h 02h 62h Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com Table 61. 'F532x Device Descriptor Table(1) (continued) Description Interrupts Address Size bytes 'F5329 'F5328 'F5327 'F5326 'F5325 'F5324 Value Value Value Value Value Value TA1 2 04h 61h 04h 61h 04h 61h 04h 61h 04h 61h 04h 61h TB0 2 04h 67h 04h 67h 04h 67h 04h 67h 04h 67h 04h 67h TA2 2 04h 61h 04h 61h 04h 61h 04h 61h 04h 61h 04h 61h RTC 2 0Ah 68h 0Ah 68h 0Ah 68h 0Ah 68h 0Ah 68h 0Ah 68h MPY32 2 02h 85h 02h 85h 02h 85h 02h 85h 02h 85h 02h 85h DMA-3 2 04h 47h 04h 47h 04h 47h 04h 47h 04h 47h 04h 47h USCI_A/B 2 0Ch 90h 0Ch 90h 0Ch 90h 0Ch 90h 0Ch 90h 0Ch 90h USCI_A/B 2 04h 90h 04h 90h 04h 90h 04h 90h 04h 90h 04h 90h ADC12_A 2 10h D1h 10h D1h 10h D1h 10h D1h 10h D1h 10h D1h COMP_B 2 1Ch A8h 1Ch A8h 1Ch A8h 1Ch A8h 1Ch A8h 1Ch A8h LDO 2 04h 5Ch 04h 5Ch 04h 5Ch 04h 5Ch 04h 5Ch 04h 5Ch COMP_B 1 A8h A8h A8h A8h A8h A8h TB0.CCIFG0 1 64h 64h 64h 64h 64h 64h TB0.CCIFG1..6 1 65h 65h 65h 65h 65h 65h WDTIFG 1 40h 40h 40h 40h 40h 40h USCI_A0 1 90h 90h 90h 90h 90h 90h USCI_B0 1 91h 91h 91h 91h 91h 91h ADC12_A 1 D0h D0h D0h D0h D0h D0h TA0.CCIFG0 1 60h 60h 60h 60h 60h 60h TA0.CCIFG1..4 1 61h 61h 61h 61h 61h 61h LDO-PWR 1 5Ch 5Ch 5Ch 5Ch 5Ch 5Ch DMA 1 46h 46h 46h 46h 46h 46h TA1.CCIFG0 1 62h 62h 62h 62h 62h 62h TA1.CCIFG1..2 1 63h 63h 63h 63h 63h 63h P1 1 50h 50h 50h 50h 50h 50h USCI_A1 1 92h 92h 92h 92h 92h 92h USCI_B1 1 93h 93h 93h 93h 93h 93h TA1.CCIFG0 1 66h 66h 66h 66h 66h 66h TA1.CCIFG1..2 1 67h 67h 67h 67h 67h 67h P2 1 51h 51h 51h 51h 51h 51h RTC_A 1 68h 68h 68h 68h 68h 68h delimiter 1 00h 00h 00h 00h 00h 00h Copyright (c) 2010-2011, Texas Instruments Incorporated Submit Documentation Feedback 93 MSP430F532x SLAS678C - AUGUST 2010 - REVISED NOVEMBER 2011 www.ti.com REVISION HISTORY REVISION SLAS678 94 DESCRIPTION Product Preview release SLAS678A Updated Product Preview release SLAS678B Production Data release SLAS678C Added Device Descriptors. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 27-Jul-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) (Requires Login) MSP430F5324IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR MSP430F5324IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR MSP430F5324IZQE PREVIEW BGA MICROSTAR JUNIOR ZQE 80 360 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR MSP430F5324IZQER ACTIVE BGA MICROSTAR JUNIOR ZQE 80 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR MSP430F5325IPN ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR MSP430F5325IPNR ACTIVE LQFP PN 80 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR MSP430F5326IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR MSP430F5326IRGCT PREVIEW VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR MSP430F5326IZQE PREVIEW BGA MICROSTAR JUNIOR ZQE 80 360 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR MSP430F5326IZQER ACTIVE BGA MICROSTAR JUNIOR ZQE 80 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR MSP430F5327IPN PREVIEW LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR MSP430F5327IPNR ACTIVE LQFP PN 80 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR MSP430F5328IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR MSP430F5328IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR MSP430F5328IZQE PREVIEW BGA MICROSTAR JUNIOR ZQE 80 360 Green (RoHS & no Sb/Br) Addendum-Page 1 SNAGCU Samples Level-3-260C-168 HR PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 27-Jul-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish SNAGCU MSL Peak Temp (3) Samples (Requires Login) MSP430F5328IZQER ACTIVE BGA MICROSTAR JUNIOR ZQE 80 2500 Green (RoHS & no Sb/Br) Level-3-260C-168 HR MSP430F5329IPN ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR MSP430F5329IPNR ACTIVE LQFP PN 80 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MTQF010A - JANUARY 1995 - REVISED DECEMBER 1996 PN (S-PQFP-G80) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 0,08 M 41 60 61 40 80 21 0,13 NOM 1 20 Gage Plane 9,50 TYP 12,20 SQ 11,80 14,20 SQ 13,80 0,25 0,05 MIN 0- 7 0,75 0,45 1,45 1,35 Seating Plane 0,08 1,60 MAX 4040135 / B 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MS-026 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated