TLV2361, TLV2362 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H - FEBRUARY 1997 - REVISED JUNE 2007 D Low Supply-Voltage TLV2361 . . . DBV PACKAGE (TOP VIEW) Operation . . . VCC = 1 V Min D Wide Bandwidth . . . 7 MHz Typ at D D D IN+ VCC- IN- VCC = 2.5 V High Slew Rate . . . 3 V/s Typ at VCC = 2.5 V Wide Output Voltage Swing . . . 2.4 V Typ at VCC = 2.5 V, RL = 10 k Low Noise . . . 8 nV/Hz Typ at f = 1 kHz 1 5 VCC+ 4 OUT 2 3 TLV2362 . . . D, DGK, P, PS, OR PW PACKAGE (TOP VIEW) 1OUT 1IN- 1IN+ VCC- description/ordering information 1 8 2 7 3 6 VCC+ 2OUT 2IN- 2IN+ The TLV236x devices are high-performance dual 4 5 operational amplifiers built using an original Texas Instruments bipolar process. These devices can be operated at a very low supply voltage (1 V), while maintaining a wide output swing. The TLV236x devices offer a dramatically improved dynamic range of signal conditioning in low-voltage systems. The TLV236x devices also provide higher performance than other general-purpose operational amplifiers by combining higher unity-gain bandwidth and faster slew rate. With their low distortion and low-noise performance, these devices are well suited for audio applications. ORDERING INFORMATION -0C 0C to 70C TOP-SIDE MARKING Reel of 3000 TLV2361CDBVR Reel of 250 TLV2361CDBVT Reel of 3000 TLV2361IDBVR Reel of 250 TLV2361IDBVT MSOP/VSSOP (DGK) Reel of 2500 TLV2362IDGKR YBS PDIP (P) Tube of 50 TLV2362IP TLV2362IP Tube of 75 TLV2362ID Reel of 2500 TLV2362IDR Reel of 2000 TLV2362IPSR Tube of 150 TLV2362IPW Reel of 2000 TLV2362IPWR SOT 23 5 (DBV) SOT-23-5 SOT 23 5 (DBV) SOT-23-5 -40C 40 C to 85C 85 C ORDERABLE PART NUMBER PACKAGE TA SOIC (D) SOP (PS) TSSOP (PW) YC3 YC3_ YC4 YC4_ 2362I TY2362 TY2362 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV: The actual top-side marking has one additional character that designates the wafer fab/assembly site. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2007, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * 1 TLV2361, TLV2362 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H - FEBRUARY 1997 - REVISED JUNE 2007 equivalent schematic (each amplifier) VCC+ IN+ IN- OUT VCC- ACTUAL DEVICE COMPONENT COUNT COMPONENT TLV2361 TLV2362 30 46 Resistors 6 11 Diodes 1 1 Capacitors 2 4 JFET 1 1 Transistors 2 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * TLV2361, TLV2362 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H - FEBRUARY 1997 - REVISED JUNE 2007 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VCC+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 V Supply voltage, VCC- (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -3.5 V Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 V Input voltage, VI (any input) (see Notes 1 and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC Output voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 V Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Duration of short-circuit current at (or below) 25C (output shorted to GND) . . . . . . . . . . . . . . . . . . . Unlimited Package thermal impedance, JA (see Notes 4 and 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97C/W DBV package . . . . . . . . . . . . . . . . . . . . . . . . 206C/W DGK package . . . . . . . . . . . . . . . . . . . . . . . . 172C/W P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85C/W PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . 149C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC-. 2. Differential voltages are at IN+ with respect to IN-. 3. All input voltage values must not exceed VCC. 4. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JA. Selecting the maximum of 150C can affect reliability. 5. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions VCC Supply voltage TA free air temperature Operating free-air TLV2361C TLV2361I, TLV2362I * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * MIN MAX UNIT 1 2.5 V 0 70 -40 85 C 3 TLV2361, TLV2362 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H - FEBRUARY 1997 - REVISED JUNE 2007 TLV2361 and TLV2362 electrical characteristics, VCC = 1.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TA 25C TYP 1 MAX UNIT 6 VIO Input offset voltage VO = 0 0, VIC = 0 IIO Input offset current VO = 0 0, VIC = 0 IIB Input bias current VO = 0 0, VIC = 0 VIC Common-mode Common mode input voltage |VIO| 7 5 mV 7.5 VOM+ Maximum positive-peak positive peak output voltage VOM- Maximum negative negative-peak peak output voltage ICC Supply current (per amplifier) AVD Large signal differential Large-signal voltage amplification VO = 1 V V, CMRR Common-mode rejection ratio VIC = 0.5 V 25C 75 dB kSVR Supply-voltage rejection ratio VCC = 1.5 V to 2.5 V 25C 80 dB Full range 7.5 25C 5 Full range 20 Full range 25C 0.5 0.5 RL = 10 k 25C 1.2 RL 10 k Full range 1.2 RL = 10 k 25C -1.2 RL 10 k Full range -1.2 25C No load 1.4 V -1.4 V Full range RL = 10 k TLV2362 60 25C nA V 1.4 TLV2361 nA 150 250 Full range VO = 0 0, 100 150 25C mV 2.25 mA 2.75 mA 80 dB 55 TLV2361 and TLV2362 operating characteristics, VCC = 1.5 V, TA = 25C PARAMETER 4 TEST CONDITIONS SR Slew rate AV = 1, VI = 0.5 V B1 Unity-gain bandwidth AV = 40, RL = 10 k, Vn Equivalent input noise voltage RS = 100 , RF = 10 k, * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * TYP UNIT 2.5 V/s CL = 100 pF 6 MHz f = 1 kHz 9 nV/Hz TLV2361, TLV2362 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H - FEBRUARY 1997 - REVISED JUNE 2007 TLV2361 and TLV2362 electrical characteristics, VCC = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA MIN TYP 25C 1 MAX UNIT 6 VIO Input offset voltage VO = 0 0, VIC = 0 IIO Input offset current VO = 0 0, VIC = 0 IIB Input bias current VO = 0 0, VIC = 0 VIC Common-mode Common mode input voltage |VIO| 7 5 mV 7.5 Maximum positive-peak positive peak output voltage RL = 10 k 25C 2 VOM+ RL 10 k Full range 2 Maximum negative negative-peak peak output voltage RL = 10 k 25C -2 VOM- RL 10 k Full range -2 ICC Supply current (per amplifier) VO = 0 0, No load AVD Large signal differential Large-signal voltage amplification VO = 1 V V, RL = 10 k CMRR Common-mode rejection ratio VIC = 0.5 V 25C 85 dB kSVR Supply-voltage rejection ratio VCC = 1.5 V to 2.5 V 25C 80 dB Full range 7.5 25C 5 Full range 20 Full range 25C 1.5 1.4 25C 2.4 V -2.4 V 1.75 2.5 3 60 25C nA V Full range TLV2361 nA 150 250 Full range TLV2362 100 150 25C mV mA 80 dB 60 TLV2361 and TLV2362 operating characteristics, VCC = 2.5 V, TA = 25C PARAMETER TEST CONDITIONS SR Slew rate AV = 1, VI = 0.5 V B1 Unity-gain bandwidth AV = 40, RL = 10 k, Vn Equivalent input noise voltage RS = 100 , THD + N Total harmonic distortion, plus noise AV = 1, * UNIT 3 V/s CL = 100 pF 7 MHz RF = 10 k, f = 1 kHz 8 nV/Hz VO = 1.2 V, RL = 10 k, f = 3 kHz POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * TYP 0.004 % 5 TLV2361, TLV2362 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H - FEBRUARY 1997 - REVISED JUNE 2007 TYPICAL CHARACTERISTICS Table of Graphs GRAPH TITLE 6 FIGURE Supply current vs Free-air temperature 1 Supply current vs Supply voltage 2 Maximum positive output voltage vs Output current 3 Maximum negative output voltage vs Output current 4 Maximum peak-to-peak output voltage vs Frequency 5 Equivalent input noise voltage vs Frequency 6 Total harmonic distortion vs Frequency 7 Total harmonic distortion vs Output voltage 8 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * TLV2361, TLV2362 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H - FEBRUARY 1997 - REVISED JUNE 2007 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs FREE-AIR TEMPERATURE SUPPLY CURRENT vs SUPPLY VOLTAGE 2.5 2.5 VO = 0 No Load Per Channel I CC - Supply Current - mA I CC - Supply Current - mA 2 VCC = 2.5 V 1.5 VCC = 1.5 V 1 0.5 TA = 25C TA = 0C 2 TA = -40C 1.5 1 0.5 0 -50 0 -25 0 25 50 75 0 100 1 Figure 1 VOM- - Maximum Positive Output Voltage - V VOM+ - Maximum Positive Output Voltage - V 1.5 VCC = 1.5 V 1 0.5 0 -1.2 5 0 TA = 25C 2 -0.8 4 MAXIMUM NEGATIVE OUTPUT VOLTAGE vs OUTPUT CURRENT 2.5 -0.4 3 Figure 2 MAXIMUM POSITIVE OUTPUT VOLTAGE vs OUTPUT CURRENT VCC = 2.5 V 2 VCC - Supply Voltage - V TA - Free-Air Temperature - C 0 TA = 85C TA = 75C VO = 0 No Load Per Channel -1.8 -0.5 -1 VCC = 1.5 V -1.5 -2 VCC = 2.5 V -2.5 -2 0 IO - Output Current - mA 4 8 12 16 20 IO - Output Current - mA Figure 3 Figure 4 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * 7 TLV2361, TLV2362 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195H - FEBRUARY 1997 - REVISED JUNE 2007 TYPICAL CHARACTERISTICS EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY 50 5 V n - Equivalent Input Noise Voltage - nV/ Hz VO(PP) - Maximum Peak-to-Peak Output Voltage - V MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE vs FREQUENCY VCC = 2.5 V 4 3 VCC = 1.5 V 2 1 TA = 25C RL = 10 k 0 1k 10 k 1M 100 k VCC = 2.5 V TA = 25C RS = 100 40 30 20 10 0 10 10 M f - Frequency - Hz Figure 5 Figure 6 10 k TOTAL HARMONIC DISTORTION vs OUTPUT VOLTAGE 10 1 1 THD - Total Harmonic Distortion - % VCC = 2.5 V RS = 10 k RL = 10 k VO = 1.2 V AV = 100 0.1 AV = 10 0.01 AV = 1 VCC = 3 V RS = 10 k RL = 4 k AV = 10 V 0.1 0.01 20 kHz 20 Hz 0.001 1 kHz 0.0001 0.001 0 20 40 60 80 100 0 0.5 1 1.5 VO(rms) - Output Voltage - V f - Frequency - kHz Figure 7 8 1k f - Frequency - Hz TOTAL HARMONIC DISTORTION vs FREQUENCY THD - Total Harmonic Distortion - % 100 Figure 8 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * 2 PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) TBD Lead/ Ball Finish OBSOLETE SOT-23 DBV 5 TLV2361CDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2361CDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2361CDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2361CDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2361CDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2361CDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Call TI TLV2361IDBV OBSOLETE SOT-23 DBV 5 TLV2361IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2361IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2361IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2361IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2361IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2361IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2362ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2362IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2362IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2362IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Call TI (3) Samples (Requires Login) TLV2361CDBV TBD Call TI MSL Peak Temp Call TI PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2362IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2362IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2362IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2362IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2362IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2362IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2362IPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2362IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2362IPWLE OBSOLETE TSSOP PW 8 TLV2362IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2362IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2362IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Call TI Samples (Requires Login) TLV2362IDGKRG4 TBD (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TLV2361CDBVR SOT-23 DBV 5 3000 178.0 9.0 TLV2361CDBVR SOT-23 DBV 5 3000 180.0 TLV2361CDBVT SOT-23 DBV 5 250 178.0 TLV2361CDBVT SOT-23 DBV 5 250 TLV2361IDBVR SOT-23 DBV 5 TLV2361IDBVR SOT-23 DBV TLV2361IDBVT SOT-23 DBV TLV2361IDBVT SOT-23 TLV2362IDGKR TLV2362IDR TLV2362IPWR 3.23 3.17 1.37 4.0 8.0 Q3 9.2 3.17 3.23 1.37 4.0 8.0 Q3 9.0 3.23 3.17 1.37 4.0 8.0 Q3 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 5 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 DBV 5 250 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV2361CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV2361CDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0 TLV2361CDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV2361CDBVT SOT-23 DBV 5 250 205.0 200.0 33.0 TLV2361IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV2361IDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0 TLV2361IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV2361IDBVT SOT-23 DBV 5 250 205.0 200.0 33.0 TLV2362IDGKR VSSOP DGK 8 2500 332.0 358.0 35.0 TLV2362IDR SOIC D 8 2500 340.5 338.1 20.6 TLV2362IPWR TSSOP PW 8 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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