TLV2361, TLV2362
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
DLow Supply-Voltage
Operation...V
CC = ±1 V Min
DWide Bandwidth ...7 MHz Typ at
VCC± = ±2.5 V
DHigh Slew Rate ...3 V/µs Typ at
VCC± = ±2.5 V
DWide Output Voltage Swing . . . ±2.4 V Typ
at VCC± = ±2.5 V, RL = 10 kΩ
DLow Noise ...8 nV/√Hz Typ at f = 1 kHz
description/ordering information
The TLV236x devices are high-performance dual
operational amplifiers built using an original
Texas Instruments bipolar process. These
devices can be operated at a very low supply
voltage (±1 V), while maintaining a wide output swing. The TLV236x devices offer a dramatically improved
dynamic range of signal conditioning in low-voltage systems. The TLV236x devices also provide higher
performance than other general-purpose operational amplifiers by combining higher unity-gain bandwidth and
faster slew rate. With their low distortion and low-noise performance, these devices are well suited for audio
applications.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
0°Cto70°C
SOT 23 5 (DBV)
Reel of 3000 TLV2361CDBVR
YC3
−0°C to 70°CSOT-23-5 (DBV) Reel of 250 TLV2361CDBVT YC3_
SOT 23 5 (DBV)
Reel of 3000 TLV2361IDBVR
YC4
SOT-23-5 (DBV) Reel of 250 TLV2361IDBVT YC4_
MSOP/VSSOP (DGK) Reel of 2500 TLV2362IDGKR YBS
PDIP (P) Tube of 50 TLV2362IP TLV2362IP
−40°C to 85°C
SOIC (D)
Tube of 75 TLV2362ID
2362I
40 C
to
85 C
SOIC (D) Reel of 2500 TLV2362IDR 2362I
SOP (PS) Reel of 2000 TLV2362IPSR TY2362
TSSOP (PW)
Tube of 150 TLV2362IPW
TY2362
TSSOP (PW) Reel of 2000 TLV2362IPWR TY2362
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
‡DBV: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
Copyright 2007, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
VCC−
VCC+
2OUT
2IN−
2IN+
TLV2361 . . . DBV PACKAGE
(TOP VIEW)
TLV2362 . . . D, DGK, P, PS, OR PW PACKAGE
(TOP VIEW)
1
2
3
5
4
IN+
VCC−
IN−
VCC+
OUT
TLV2361, TLV2362
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
equivalent schematic (each amplifier)
VCC−
IN−
IN+
VCC+
OUT
ACTUAL DEVICE COMPONENT COUNT
COMPONENT TLV2361 TLV2362
Transistors 30 46
Resistors 6 11
Diodes 1 1
Capacitors 2 4
JFET 1 1
TLV2361, TLV2362
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC+ (see Note 1) 3.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage, VCC− (see Note 1) −3.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2) ±3.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI (any input) (see Notes 1 and 3) VCC±. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage, VO ±3.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, IO 20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of short-circuit current at (or below) 25°C (output shorted to GND) Unlimited. . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 4 and 5): D package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
DBV package 206°C/W. . . . . . . . . . . . . . . . . . . . . . . .
DGK package 172°C/W. . . . . . . . . . . . . . . . . . . . . . . .
P package 85°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
PS package 95°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 149°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC−.
2. Differential voltages are at IN+ with respect to IN−.
3. All input voltage values must not exceed VCC.
4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Selecting the maximum of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN MAX UNIT
VCC Supply voltage ±1±2.5 V
T
Operating free air temperature
TLV2361C 0 70 °
C
TAOperating free-air temperature TLV2361I, TLV2362I −40 85 °C
TLV2361, TLV2362
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
TLV2361 and TLV2362 electrical characteristics, VCC± = ±1.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT
V
Input offset voltage
V 0
V 0
25°C 1 6
mV
VIO Input offset voltage VO = 0, VIC = 0 Full range 7.5 mV
I
Input offset current
V 0
V 0
25°C 5 100
nA
IIO Input offset current VO = 0, VIC = 0 Full range 150 nA
I
Input bias current
V 0
V 0
25°C 20 150
nA
IIB Input bias current VO = 0, VIC = 0 Full range 250 nA
V
Common-mode input
|V | ≤75mV
25°C±0.5
V
VIC
Common mode
input
voltage |VIO| ≤ 7.5 mV Full range ±0.5 V
V
Maximum positive-peak RL = 10 kΩ25°C 1.2 1.4
V
VOM+
Maximum
positive peak
output voltage RL ≥ 10 kΩFull range 1.2 V
V
Maximum ne
g
ative-peak RL = 10 kΩ25°C −1.2 −1.4
V
VOM−
Maximum
negative peak
output voltage RL ≥ 10 kΩFull range −1.2 V
I
Suppl
y
current
V 0
No load
25°C 1.4 2.25 mA
ICC
Supply
current
(per amplifier) VO = 0, No load Full range 2.75 mA
A
Lar
g
e-si
g
nal differential
V±1V
R10 kΩ
TLV2361
25°C
60 80
dB
AVD
Large signal
differential
voltage amplification VO = ±1 V, RL = 10 kΩTLV2362 25°C55 dB
CMRR Common-mode rejection
ratio VIC = ±0.5 V 25°C 75 dB
kSVR
Supply-voltage rejection
ratio VCC± = ±1.5 V to ±2.5 V 25°C 80 dB
TLV2361 and TLV2362 operating characteristics, VCC± = ±1.5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
SR Slew rate AV = 1, VI = ±0.5 V 2.5 V/µs
B1Unity-gain bandwidth AV = 40, RL = 10 kΩ, CL = 100 pF 6 MHz
VnEquivalent input noise voltage RS = 100 Ω, RF = 10 kΩ,f = 1 kHz 9nV/√Hz
TLV2361, TLV2362
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
TLV2361 and TLV2362 electrical characteristics, VCC± = ±2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT
V
Input offset voltage
V 0
V 0
25°C 1 6
mV
VIO Input offset voltage VO = 0, VIC = 0 Full range 7.5 mV
I
Input offset current
V 0
V 0
25°C 5 100
nA
IIO Input offset current VO = 0, VIC = 0 Full range 150 nA
I
Input bias current
V 0
V 0
25°C 20 150
nA
IIB Input bias current VO = 0, VIC = 0 Full range 250 nA
V
Common-mode input
|V | ≤75mV
25°C±1.5
V
VIC
Common mode
input
voltage |VIO| ≤ 7.5 mV Full range ±1.4 V
V
Maximum positive-peak RL = 10 kΩ25°C 2 2.4
V
VOM+
Maximum
positive peak
output voltage RL ≥ 10 kΩFull range 2V
V
Maximum ne
g
ative-peak RL = 10 kΩ25°C −2 −2.4
V
VOM−
Maximum
negative peak
output voltage RL ≥ 10 kΩFull range −2 V
I
Suppl
y
current
V 0
No load
25°C 1.75 2.5
mA
ICC
Supply
current
(per amplifier) VO = 0, No load Full range 3mA
A
Lar
g
e-si
g
nal differential
V±1V
R10 kΩ
TLV2361
25°C
60 80
dB
AVD
Large signal
differential
voltage amplification VO = ±1 V, RL = 10 kΩTLV2362 25°C60 dB
CMRR Common-mode rejection
ratio VIC = ±0.5 V 25°C 85 dB
kSVR
Supply-voltage rejection
ratio VCC± = ±1.5 V to ±2.5 V 25°C 80 dB
TLV2361 and TLV2362 operating characteristics, VCC± = ±2.5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
SR Slew rate AV = 1, VI = ±0.5 V 3 V/µs
B1Unity-gain bandwidth AV = 40, RL = 10 kΩ, CL = 100 pF 7 MHz
VnEquivalent input noise voltage RS = 100 Ω, RF = 10 kΩ,f = 1 kHz 8nV/√Hz
THD + N Total harmonic distortion, plus noise AV = 1, VO = ±1.2 V, RL = 10 kΩ, f = 3 kHz 0.004 %
TLV2361, TLV2362
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
TYPICAL CHARACTERISTICS
Table of Graphs
GRAPH TITLE FIGURE
Supply current vs Free-air temperature 1
Supply current vs Supply voltage 2
Maximum positive output voltage vs Output current 3
Maximum negative output voltage vs Output current 4
Maximum peak-to-peak output voltage vs Frequency 5
Equivalent input noise voltage vs Frequency 6
Total harmonic distortion vs Frequency 7
Total harmonic distortion vs Output voltage 8
TLV2361, TLV2362
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
TYPICAL CHARACTERISTICS
Figure 1
1
0.5
0
− Supply Current − mA
1.5
2
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
2.5
ICC
TA − Free-Air Temperature − °C
VCC = ±2.5 V
VCC = ±1.5 V
VO = 0
No Load
Per Channel
−50 −25 0 25 50 75 100
Figure 2
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
1
0.5
0
1.5
2
2.5
0±1±2±3±4±5
VO = 0
No Load
Per Channel
TA = 25°C
TA = 0°C
TA = −40°C
TA = 85°C
TA = 75°C
VCC± − Supply Voltage − V
− Supply Current − mA
ICC
Figure 3
1.5
1
0.5
0
2
MAXIMUM POSITIVE OUTPUT VOLTAGE
vs
OUTPUT CURRENT
2.5
VCC± = ±2.5 V
VCC± = ±1.5 V
TA = 25°C
IO − Output Current − mA
− Maximum Positive Output Voltage − V
VOM+
0 −0.4 −0.8 −1.2 −1.8 −2
Figure 4
0 4 8 121620
IO − Output Current − mA
VCC± = ±1.5 V
MAXIMUM NEGATIVE OUTPUT VOLTAGE
vs
OUTPUT CURRENT
VCC± = ±2.5 V
− Maximum Positive Output Voltage − V
VOM−
−1
−1.5
−2
−2.5
−0.5
0
TLV2361, TLV2362
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
SLOS195H − FEBRUARY 1997 − REVISED JUNE 2007
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
TYPICAL CHARACTERISTICS
Figure 5
3
2
1
01 k 10 k 100 k
4
f − Frequency − Hz
MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE
vs
FREQUENCY
5
1 M 10 M
VCC± = ±2.5 V
TA = 25°C
RL = 10 kΩ
VCC± = ±1.5 V
− Maximum Peak-to-Peak Output Voltage − V
V
O(PP)
Figure 6
40
20
10
0
50
30
10 100 1 k 10 k
− Equivalent Input Noise Voltage −
f − Frequency − Hz
EQUIVALENT INPUT NOISE VOLTAGE
vs
FREQUENCY
VnnV/ Hz
VCC± = ±2.5 V
TA = 25°C
RS = 100 Ω
Figure 7
1
0.1
0.01
0.001
02040
THD − Total Harmonic Distortion − %
10
f − Frequency − kHz
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
60 80
AV = 100
100
AV = 10
AV = 1
VCC± = ±2.5 V
RS = 10 kΩ
RL = 10 kΩ
VO = ±1.2 V
Figure 8
0.1
0.01
0.001
0.0001
0 0.5 1
THD − Total Harmonic Distortion − %
1
TOTAL HARMONIC DISTORTION
vs
OUTPUT VOLTAGE
1.5 2
20 kHz
1 kHz
20 Hz
VCC± = ±3 V
RS = 10 kΩ
RL = 4 kΩ
AV = 10 V
VO(rms) − Output Voltage − V
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TLV2361CDBV OBSOLETE SOT-23 DBV 5 TBD Call TI Call TI
TLV2361CDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2361CDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2361CDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2361CDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2361CDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2361CDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2361IDBV OBSOLETE SOT-23 DBV 5 TBD Call TI Call TI
TLV2361IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2361IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2361IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2361IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2361IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2361IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2362ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2362IDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2362IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2362IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TLV2362IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2362IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2362IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2362IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2362IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLV2362IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLV2362IPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2362IPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2362IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2362IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI
TLV2362IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2362IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLV2362IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 3
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TLV2361CDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TLV2361CDBVR SOT-23 DBV 5 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
TLV2361CDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TLV2361CDBVT SOT-23 DBV 5 250 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
TLV2361IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TLV2361IDBVR SOT-23 DBV 5 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
TLV2361IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TLV2361IDBVT SOT-23 DBV 5 250 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
TLV2362IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TLV2362IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLV2362IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2361CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TLV2361CDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0
TLV2361CDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TLV2361CDBVT SOT-23 DBV 5 250 205.0 200.0 33.0
TLV2361IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TLV2361IDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0
TLV2361IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TLV2361IDBVT SOT-23 DBV 5 250 205.0 200.0 33.0
TLV2362IDGKR VSSOP DGK 8 2500 332.0 358.0 35.0
TLV2362IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2362IPWR TSSOP PW 8 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
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