BlueNRG-2N Datasheet Bluetooth(R) Low Energy wireless network coprocessor Features * * Product status link Low-power radio performance - Sleep current consumption down to 900 nA - TX current consumption 6.8 mA (@ -2 dBm, 3.0 V) - RX current consumption 6.2 mA (@ sensitivity level, 3.0 V) - Up to +8 dBm programmable output power level (@ antenna connector) - Excellent RF link budget (up to 96 dB) - Integrated DC-DC step-down converter and LDO regulators Compliant Bluetooth LE 4.2 - Multi-master to multi-slave communication guaranteed - 2 masters to 6 slaves simultaneously - Up to 8 simultaneous connections handled - LE data length extension (up to 700 kbps at application level) - Over-the-air firmware update is 2.5 times faster - LE Privacy 1.2 - Reduces the ability to be tracked over a period of time by changing the address on a frequent basis without involving the HOST and saving battery life - LE secure connections - The pairing mechanism is established with the elliptic curve Diffie-Hellman (ECDH) key agreement protocol enabling a secure key exchange mechanism preventing eavesdropping BlueNRG-2N Product summary Order codes Applications BlueNRG-232N BlueNRG-234N * * * * * * * * * * Watches Fitness, wellness and sports Consumer medical Security/proximity Remote control Home and industrial automation Assisted living Mobile phone peripherals Lighting PC peripherals Description The BlueNRG-2N is an ultra low power (ULP) network coprocessor solution for Bluetooth(R) low energy applications. It embeds the STMicroelectronics's state-of-the-art RF radio IPs combining unparalleled performance with extremely long battery lifetime. DS13280 - Rev 1 - July 2020 For further information contact your local STMicroelectronics sales office. www.st.com BlueNRG-2N It is fully compliant with Bluetooth core specification version 5.0 and supports enhanced features such as state-of-the-art security, privacy, and extended packet length for faster data transfer up to 700 kbps at application level. The BlueNRG-2N is Bluetooth(R) 5.0 certified ensuring interoperability with the latest generation of smartphones and other host devices. The Bluetooth low energy stack runs on the embedded ARM Cortex-M0 core. The STMicroelectronics BLE stack is stored into the on-chip non-volatile Flash memory and it can be easily upgraded via SPI/UART as well through the dedicated STMicroelectronics software tools. DS13280 - Rev 1 page 2/47 BlueNRG-2N High performance and benefits 1 High performance and benefits The BlueNRG-2N shows a reliable communication thanks to the best-in-class output power level assuring a robust communication even in a noisy corrupted scenario without compromising the overall power consumption. The BLUENRG-2N collaterals include comprehensive tools for developers such as a full featured SDK including: * Templates * High-level abstraction layer APIs (no BLE expertise required) * Real-time debug capabilities A dedicated firmware is provided to support the interface with an external application processor. The whole Bluetooth low energy stack runs in the BlueNRG-2N; the GATT profiles are provided to run in the application processor together with the application code. The figure below shows the network processor RF software layers. Figure 1. BlueNRG-2N network processor RF software layers DS13280 - Rev 1 page 3/47 BlueNRG-2N Functional details 2 Functional details The BlueNRG-2N integrates: * ARM Cortex-M0 core * Power management * Clocks * Bluetooth low energy radio * Random number generator (RNG) (reserved for Bluetooth low energy protocol stack, but user applications can read it) * External microcontroller interface (SPI/UART) * Public key cryptography (PKA) (reserved for Bluetooth low energy protocol stack) 2.1 Core The ARM(R) Cortex(R)-M0 processor has been developed to provide a low-cost platform that meets the needs of MCU implementation, with a reduced pin count and low-power consumption, while delivering outstanding computational performance and an advanced system response to interrupts. The ARM(R) Cortex(R)-M0 32-bit RISC processor features exceptional code-efficiency, delivering the highperformance expected from an ARM core in the memory size usually associated with 8-bit and 16-bit devices. The BlueNRG-2N has an embedded ARM core and is therefore compatible with all ARM tools and software. The ARM Cortex M0 processor is reserved for internal operations and it is not open to customer application developments. 2.2 Power management The BlueNRG-2N integrates both a low dropout voltage regulator (LDO) and a step-down DC-DC converter to supply the internal BlueNRG-2N circuitry. The BlueNRG-2N most efficient power management configuration is with DC-DC converter active where best power consumption is obtained without compromising performances. Nevertheless, a configuration based on LDO can also be used, if needed. A simplified version of the state machine is shown below. Figure 2. BlueNRG-2N power management state machine 2.2.1 DS13280 - Rev 1 State description page 4/47 BlueNRG-2N Clocks and reset management 2.2.1.1 Preactive state The preactive state is the default state after a POR event. In this state: * All the digital power supplies are stable. * The high frequency clock runs on internal fast clock RC oscillator (16 MHz). * The low frequency clock runs on internal RC oscillator (32.768 kHz). 2.2.1.2 Active state In this state: * The high frequency runs on the accurate clock (16 MHz 50 ppm) provided by the external XO. The internal fast clock RO oscillator is switched off. 2.2.1.3 Standby state In this state: * Only the digital power supplies necessary to keep the RAM in retention are used. 2.2.1.4 Sleep state In this state: * Only the digital power supplies necessary to keep the RAM in retention are used * The low frequency oscillator is switched on The wake-up from this low power state is driven by the following sources: * Internal timers * SPI CS (SPI mode only) 2.2.1.5 Power saving strategy The application power saving strategy is based on clock stopping, dynamic clock gating, digital power supply switch-off and analog current consumption minimization. A summary of functional blocks versus the BlueNRG-2N states is provided below. Table 1. Relationship between the BlueNRG-2N states and functional blocks Functional blocks RESET STANDBY SLEEP Preactive Active LOCK RX/ LOCK TX RX TX LDO_SOFT_1V2 or LDO_SOFT_0V9 OFF ON ON ON ON ON ON ON LDO_STRONG_1V2 OFF OFF OFF ON ON ON ON ON LDO_DIG_1V8 OFF OFF OFF ON ON ON ON ON SMPS OFF OFF OFF ON ON ON ON ON LDO_DIG_1V2 OFF OFF OFF ON ON ON ON ON BOR OFF OFF OFF ON ON ON ON ON 16 MHz RO OFF OFF OFF ON OFF OFF OFF OFF 16 MHz XO OFF OFF OFF OFF ON ON ON ON 32 kHz RO or XO OFF OFF ON ON ON ON ON ON 2.3 Clocks and reset management The BlueNRG-2N embeds an RC low-speed frequency oscillator at 32 kHz and an RO high-speed frequency oscillator at 16 MHz. The low-frequency clock is used in low power mode and can be supplied either by a 32.7 kHz oscillator that uses an external crystal and guarantees up to 50 ppm frequency tolerance, or by a ring oscillator, which does not require any external components. DS13280 - Rev 1 page 5/47 BlueNRG-2N Clocks and reset management The primary high-speed frequency clock is a 32 MHz crystal oscillator. A fast-starting 16 MHz ring oscillator provides the clock while the crystal oscillator is starting up. Frequency tolerance of the high-speed crystal oscillator is 50 ppm. Usage of the high-speed crystal usage is strictly necessary for RF communications. 2.3.1 Reset management Figure 3. Reset and wake-up generation shows the general principle of reset. Releasing the reset pin takes the chip out of shutdown state. The wake-up logic is powered and receives the POR. Each time the wake-up controller decides to exit sleep or standby modes, it generates a reset for the core logic. The core logic can also be reset by: * Watchdog * Reset request from the processor (system reset) * LOCKUP state of the Cortex-M0 The SWD logic is reset by the POR. It is important to highlight that the reset pin actually powers down the chip, so it is not possible to perform debug access with system under reset. Figure 3. Reset and wake-up generation If, for any reason, the user would like to power off the device there are two options: 1. Force RESETN pin to ground, keeping VBAT level 2. To put VBAT pins to ground (e.g. via a transistor) In the second option, care must be taken to ensure that no voltage is applied to any of the other pins as the device can be powered and have an anomalous power consumption. The ST recommendation is to use RESETN whenever it is possible. 2.3.1.1 Power-on-Reset The Power-on-Reset (POR) signal is the combination of the POR signal and the BOR signal generated by the analog circuitry contained in the BlueNRG-2N device. The combination of these signals is used to generate the input to the Cortex-M0, which is used to reset the debug access port (DAP) of the processor. It is also used to generate the signal, which resets the debug logic of the Cortex-M0. The POR signal also resets the TAP controller of the BlueNRG-2N and a part of the Flash controller (managing the Flash memory boot, which does not need to be impacted by system resets). The BOR reset is enabled by default. At software level, it can be decided to change the default values after reset. 2.3.1.2 Power-up sequence The starting sequence of the BlueNRG-2N supply and reset signal is shown below. DS13280 - Rev 1 page 6/47 BlueNRG-2N Clocks and reset management Figure 4. BlueNRG-2N power-up sequence VBATx X=1,2,3 30 s RESETN 1.82 ms max. Internal POR System clock CPU activity * * * * * Note: CPU under reset CPU is running on RCO 16 MHz CPU can switch on XO 16/32 MHz by SW The VBATx power must only be raised when RESETN pin is low. The different VBATx (x=1,2,3) power can be raised separately or together. Once the VBATx (x=1,2,3) reaches the nominal value, the RESETN pin could be driven high after a 30 us. The internal POR is released once internal LDOs are established and RCO clock is ready. The system starts on RCO 16 MHz clock system. The software is responsible for configuring the XO 16/32 MHz when necessary. The minimum negative pulse to reset the system must be at least 30 s. The POR circuit is powered by a 1.2 V regulator, which must also be powered up with the correct startup sequence. Before VBAT has reached the nominal value, RESETN line must be kept low. An external RC circuit on RESETN pin adds a delay that can prevent RESETN signal from going high before VBAT has reached the nominal value. Figure 5. Reset circuit DS13280 - Rev 1 page 7/47 BlueNRG-2N TX/RX event alert If the above conditions are not satisfied, ST cannot guarantee the correct operation of the device. The BlueNRG-2N could inform the external microcontroller via the host interface protocol on the internal reset reason, which includes: POR, BOR, watchdog, lockup. 2.4 TX/RX event alert The BlueNRG-2N is provided with the ANATEST1 (pin 14 for QFN32 package, pin D4 for WCSP34 package) signal which alerts forthcoming transmission or reception event. The ANATEST1 pin switches to high level about 18 s before transmission before reception. Then, it switches to low level at the end of the event. The signal can be used for controlling external antenna switching and supporting coexistence with other wireless technologies. 2.5 SWD debug feature The BlueNRG-2N embeds the ARM serial wire debug (SWD) port. It is two pins (clock and single bi-directional data) debug interface, providing all the debug functionality plus real-time access to system memory without halting the processor or requiring any target resident code. The SWD interface is provided to allow firmware upgrade on the device in the production lines. Table 2. SWD port Pin functionality Pin name Pin description SWCLK IO9 SWD clock signal SWDIO IO10 SWD data signal The Cortex-M0 subsystem of the BlueNRG-2N embeds four breakpoints and two watchpoints. 2.6 Bluetooth low energy radio The BlueNRG-2N integrates an RF transceiver compliant to the Bluetooth specification and to the standard national regulations in the unlicensed 2.4 GHz ISM band. The RF transceiver requires very few external discrete components. It provides 96 dB link budgets with excellent link reliability, keeping the maximum peak current below 15 mA. In transmit mode, the power amplifier (PA) drives the signal generated by the frequency synthesizer out to the antenna terminal through a very simple external network. The power delivered as well as the harmonic content depends on the external impedance seen by the PA. 2.6.1 Radio operating modes Several operating modes are defined for the BlueNRG-2N radio: * Reset mode * Sleep mode * Active mode * Radio mode - RX mode - TX mode In Reset mode, the BlueNRG-2N is in ultra-low power consumption: all voltage regulators, clocks and the RF interface are not powered. The BlueNRG-2N enters Reset mode by asserting the external Reset signal. As soon as it is de-asserted, the device follows the normal activation sequence to transit to active mode. In sleep mode either the low speed crystal oscillator or the low speed ring oscillator are running, whereas the high speed oscillators are powered down as well as the RF interface. The state of the BlueNRG-2N is retained and the content of the RAM is preserved. While in sleep mode, the BlueNRG-2N waits until an internal timer expires and then it goes into active mode. In active mode the BlueNRG-2N is fully operational: all interfaces, including RF, are active as well as all internal power supplies together with the high speed frequency oscillator. The MCU core is also running. DS13280 - Rev 1 page 8/47 BlueNRG-2N Pre-programmed bootloader Radio mode differs from active mode as the RF transceiver is also active and is capable of either transmitting or receiving. 2.7 Pre-programmed bootloader The BlueNRG-2N device has a pre-programmed bootloader supporting UART protocol with automatic baud rate detection. The main features of the embedded bootloader are: * Auto baud rate detection up to 460 kbps * Flash mass erase, section erase * Flash programming * Flash readout protection enable/disable The pre-programmed bootloader is an application which is stored on the BlueNRG-2N internal ROM at manufacturing time by STMicroelectronics. This application allows upgrading the device Flash with a user application using a serial communication channel (UART). Bootloader is activated by hardware by forcing IO7 high during power-up or hardware Reset, otherwise, the application residing in Flash is launched. Note: The customer application must ensure that IO7 is forced low during power-up. Bootloader protocol is described in a separate application note. 2.8 Firmware image The Bluetooth Low Energy stack runs on the embedded ARM Cortex-M0 core. The stack is stored on the on-chip non-volatile Flash memory and can be easily upgraded via SPI. The device comes pre-programmed with a production-ready stack image (version may change at any time without notice). A different or more up-to-date stack image can be downloaded from the ST website and programmed on the device through the ST provided software tools. 2.9 Unique device serial number The BlueNRG-2N device has a unique six-byte serial number stored at address 0x100007F4: it is stored as two words (8 bytes) at addresses 0x100007F4 and 0x100007F8 with unique serial number padded with 0xAA55. Specific API allows such locations to get access. DS13280 - Rev 1 page 9/47 BlueNRG-2N Pin description 3 Pin description The BlueNRG-2N comes in two package versions: WCSP34 offering 14 GPIOs, QFN32 offering 15 GPIOs. Figure 6. BlueNRG-2N pinout top view (QFN32) shows the QFN32 pinout, and Figure 7. BlueNRG-2N ball out top view (WCSP34) shows the WCSP34 ball out. RSSETN SMPSFILT1 SMPSFILT2 VDD1V2 DIO13 DIO12 32 31 30 29 28 27 26 25 24 VBAT1 2 23 SXTAL0 DIO8 3 22 SXTAL1 DIO7 4 21 RF0 DIO6 5 20 RF1 VBAT3 6 19 VBAT2 DIO5 7 18 FXTAL0 DIO4 8 17 10 11 12 13 14 15 16 FXTAL1 ADC2 ADC1 ANATEST1 9 ANATEST0/DIO14 GND pad DIO0 DIO9 DIO1 1 DIO2 DIO10 DIO3 DS13280 - Rev 1 TEST DIO11 Figure 6. BlueNRG-2N pinout top view (QFN32) page 10/47 BlueNRG-2N Pin description Figure 7. BlueNRG-2N ball out top view (WCSP34) DS13280 - Rev 1 page 11/47 BlueNRG-2N Pin description Figure 8. BlueNRG-2N ball out bottom view (WCSP34) Table 3. Pinout description Pins DS13280 - Rev 1 Name I/O F1 DIO10 I/O SWDIO, not connected 2 E1 DIO9 I/O SWCLK, not connected 3 D3 DIO8 I/O UART_TXD 4 D2 DIO7/BOOT(1) I/O 5 D1 DIO6 I/O 6 A3 - - VBAT3 VDD 7 C2 DIO5 I/O Reserved, put to ground 8 C3 DIO4 I/O Reserved, put to ground 9 B1 DIO3(2) I/O SPI_IN 10 A1 DIO2 I/O SPI_OUT 11 B2 DIO1 I/O Reserved, put to ground 12 A2 DIO0 I/O SPI_CLK 13 A5 DIO14 I/O Reserved, not connected ANATEST0 O Analog output QFN32 WCSP34 1 Description Bootloader pin SPI_IRQ Reserved, put to ground Battery voltage input page 12/47 BlueNRG-2N Pin description Pins Name I/O D4 ANATEST1 O Analog output, not connected 15 B4 ADC1 I Connect to ground 16 D5 ADC2 I Connect to ground 17 A6 FXTAL1 I 32 MHz crystal 18 B5 FXTAL0 I 32 MHz crystal 19 - VBAT2 VDD 20 C6 RF1 I/O Antenna + matching circuit connection 21 D6 RF0 I/O Antenna + matching circuit connection 22 E4 SXTAL1 I 32 kHz crystal 23 E5 SXTAL0 I 32 kHz crystal 24 E6 VBAT1 VDD 25 B3 RESETN I System reset 26 F6 SMPSFILT1 I SMPS output to external filter 27 F4 SMPSFILT2 I/O SMPS output to external filter/battery voltage input 28 F3 VDD1V2 O 1.2V digital core output 29 - DIO13 I/O Reserved, put to ground by a pull-down resistor 30 F2 DIO12 I/O 31 E3 TEST I Test pin put to GND 32 E2 DIO11 I/O UART_RXD/SPI_CS - A4 - B6 - C1 GND GND - F5 QFN32 WCSP34 14 Description Battery voltage input Battery voltage input Connect to VDD for UART interface by a pull-up resistor Connect to ground for SPI interface by a pull-down resistor Ground 1. The pin IO7/BOOT is monitored by bootloader after power-up or hardware reset and it should be low to prevent unwanted bootloader activation. 2. The pin IO3 is monitored by start-up FW after power-up or hardware reset and it should be low to prevent unwanted start-up FW activation. DS13280 - Rev 1 page 13/47 BlueNRG-2N Application circuit 4 Application circuit The schematics below are purely indicative. Figure 9. Application circuit: active DC-DC converter QFN32 package C2 1.7 V to 3.6 V power supply UART RXD i/f TXD SPI_IN SPI_OUT SPI SPI_CLK i/f SPI_CS SPI_IRQ DIO12 C1 C19 UART_RXD/SPI_CS UART_TXD L6 C4 SPI_IN UART_RXD/SPI_CS SPI_OUT SPI_CLK UART_RXD/SPI_CS U1 DIO7 Microcontroller i/f 1 2 UART_TXD 3 4 DIO7 1.7 V to 3.6 V power supply 5 6 7 C15 8 DIO10 DIO9 DIO8 GND pad DIO7 DIO6 VBAT3 DIO5 DIO4 L1 C7 C6 VBAT1 SXTAL0 SXTAL1 RF0 RF1 VBAT2 FXTAL0 FXTAL1 24 23 22 21 20 19 18 17 C8 XTAL1 L4 C10 L5 C11 C9 C13 C18 L3 C12 XTAL2 C14 9 10 11 12 13 14 15 16 BlueNRG-232N C5 R1 33 SPI/UART C3 GND i/f sel RESETN 32 DIO3 DIO11 DIO2 TEST 31 DIO1 DIO12 30 DIO12 DIO0 DIO13 29 ANATEST0/DIO14 VDD1V2 28 ANATEST1 SMPSFILT2 27 ADC1 SMPSFILT1 26RESETN ADC2 RESETN 25 RESET RESET & C16 SPI_CLK SPI_IN SPI_OUT C17 L2 Figure 10. Application circuit: non-active DC-DC converter QFN32 package 1.7 V to 3.6 V power supply C2 C4 UART_RXD/SPI_CS SPI_CLK UART_RXD/SPI_CS SPI_CS DIO7 SPI_IRQ Microcontroller i/f U1 1 1.7 V to 3.6 V power supply UART_TXD DIO7 4 5 6 7 8 DIO10 DIO9 DIO8 GND pad DIO7 DIO6 VBAT3 DIO5 DIO4 L1 C7 C6 VBAT1 SXTAL0 SXTAL1 RF0 RF1 VBAT2 FXTAL0 FXTAL1 24 23 22 21 20 19 18 17 XTAL1 C8 L4 C10 L5 C11 C9 C13 C18 L3 C12 XTAL2 C14 9 DIO3 C15 2 3 C5 R1 33 UART_TXD SPI_IN SPI_OUT SPI_CLK GND SPI i/f C1 DIO12 UART_RXD/SPI_CS ADC2 TXD SPI_IN SPI_OUT C3 DIO11 32 TEST 31 DIO12 30 DIO12 DIO13 29 VDD1V2 28 SMPSFILT2 27 SMPSFILT1 26 RESETN RESETN 25 RXD UART i/f RESETN 10 DIO2 11 DIO1 12 DIO0 13 ANATEST0/DIO14 14 ANATEST1 15 ADC1 16 RESET & RESET i/f sel SPI/UART BlueNRG-232N DS13280 - Rev 1 SPI_CLK SPI_IN SPI_OUT C17 C16 L2 page 14/47 BlueNRG-2N Application circuit Figure 11. Application circuit: active DC-DC converter WCSP34 package C2 1.7 V to 3.6 V power supply C1 C19 C4 C5 L1 L6 RESETN SPI_CLK SPI_CS SPI_IRQ Microcontroller i/f DIO0 DIO1 DIO2 DIO3 DIO4 DIO5 DIO6 DIO7 DIO8 DIO9 DIO10 DIO11 DIO12 B2 SPI_OUT A1 SPI_IN B1 C3 C2 D1 UART_RXD/SPI_CS DIO7 D2 UART_TXD D3 DIO7 E1 F1 UART_RXD/SPI_CS E2 DIO12 F2 XTAL1 SXTAL0 E5 SXTAL1 E4 RF1 RF0 C8 L4 C10 C6 L5 C11 C9 D6 C13 FXTAL1 A6 FXTAL0 B5 L3 C12 XTAL2 C17 C14 C16 RESETN BlueNRG-234N ADC2 ADC1 ANATEST1 ANATEST0/DIO14 SPI i/f SPI_CLK A2 UART_TXD SPI_IN SPI_OUT SPI_CLK D5 B4 D4 A5 SPI_IN SPI_OUT UART_RXD/SPI_CS C7 C6 L7 L8 VBAT3 A3 VBAT1 E6 VDD1V2 F3 GND_ANA A4 GND_ANA B6 GND_DIG C1 SMPSFILT2 F4 SMPSGND F5 SMPSFILT1 F6 TXD U5 FTEST RESETN RXD C15 DIO12 E3 B3 RESET & RESET i/f sel SPI/UART UART i/f C3 L2 Figure 12. Application circuit: non active DC-DC converter WCSP34 package 1.7 V to 3.6 V power supply C1 C2 C4 C5 L1 SPI_IRQ Microcontroller i/f DS13280 - Rev 1 F4 F5 F6 SMPSFILT2 SMPSGND SMPSFILT1 A4 B6 C1 GND_ANA GND_ANA GND_DIG A3 E6 F3 RESETN BlueNRG-234N ADC2 ADC1 ANATEST1 ANATEST0/DIO14 SPI_CLK SPI_CS DIO0 DIO1 DIO2 DIO3 DIO4 DIO5 DIO6 DIO7 DIO8 DIO9 DIO10 DIO11 DIO12 D5 B4 D4 A5 SPI i/f A2 B2 SPI_OUT A1 SPI_IN B1 C3 C2 D1 UART_RXD/SPI_CS DIO7 D2 D3 UART_TXD DIO7 E1 F1 UART_RXD/SPI_CS E2 DIO12 F2 SPI_CLK VBAT3 VBAT1 VDD1V2 TXD SPI_IN SPI_OUT U5 UART_RXD/SPI_CS UART_TXD SPI_IN SPI_OUT SPI_CLK C7 C6 C15 DIO12 FTEST RESETN RXD UART i/f RESETN E3 B3 RESET & RESET i/f sel SPI/UART C3 XTAL1 SXTAL0 E5 SXTAL1 E4 L4 C8 C10 RF1 C6 RF0 D6 L5 C11 C9 C13 FXTAL1 A6 FXTAL0 B5 C17 L3 XTAL2 C12 C14 C16 L2 page 15/47 BlueNRG-2N Application circuit Figure 13. Application circuit: active DC-DC converter QFN32 package with BALF-NRG-02D3 balun C2 1.7 V to 3.6 V power supply UART i/f TXD SPI_IN SPI_OUT SPI i/f C3 DIO12 C1 C19 UART_RXD/SPI_CS UART_TXD SPI_IN SPI_OUT SPI_CLK L6 C4 UART_RXD/SPI_CS SPI_CLK UART_RXD/SPI_CS SPI_CS DIO7 SPI_IRQ U1 Microcontroller i/f 1 UART_TXD 2 3 4 1.7 V to 3.6 V power supply DIO7 5 6 7 C15 8 BlueNRG-232N C5 L1 R1 DIO10 DIO9 DIO8 GND pad DIO7 DIO6 VBAT3 DIO5 DIO4 VBAT1 SXTAL0 SXTAL1 RF0 RF1 VBAT2 FXTAL0 FXTAL1 C7 C6 GND 33 RXD RESETN 9 DIO3 DIO11 32 10 DIO2 TEST 31 11 DIO1 DIO12 30 DIO12 12 DIO0 DIO13 29 13 ANATEST0/DIO14 VDD1V2 28 14 ANATEST1 SMPSFILT2 27 15 ADC1 SMPSFILT1 26 16 ADC2 RESETN 25 RESETN RESET RESET & i/f sel SPI/UART 24 23 22 21 20 19 18 17 XTAL1 1 2 C18 U2 B1 A1 4 3 B2 A2 BALF-NRG-02D3 L3 C10 C13 XTAL2 SPI_IN SPI_OUT SPI_CLK C17 C16 L2 Table 4. External component list DS13280 - Rev 1 Component Description C1 Decoupling capacitor C2 DC-DC converter output capacitor C3 Decoupling capacitor for 1.2 V digital regulator C4 Decoupling capacitor for 1.2 V digital regulator C5 Decoupling capacitor C6 32 kHz crystal loading capacitor C7 32 kHz crystal loading capacitor C8 RF balun/matching network capacitor C9 RF balun/matching network capacitor C10 RF balun/matching network capacitor C11 RF balun/matching network capacitor C12 RF balun/matching network capacitor C13 RF balun/matching network capacitor C14 RF balun/matching network capacitor C15 Decoupling capacitor C16 32 MHz crystal loading capacitor C17 32 MHz crystal loading capacitor C18 Decoupling capacitor C19 DC-DC converter output capacitor L1 32 kHz crystal filter inductor L2 32 MHz crystal filter inductor page 16/47 BlueNRG-2N Application circuit DS13280 - Rev 1 Component Description L3 RF balun/matching network inductor L4 RF balun/matching network inductor L5 RF balun/matching network inductor L6 SMPS inductor L7 SMPS noise filter inductor (15 nH) L8 SMPS ground noise filter inductor (3.4 nH) XTAL1 32 kHz crystal (optional) XTAL2 32 MHz crystal page 17/47 BlueNRG-2N Application controller interface 5 Application controller interface The application controller interface (ACI) is based on a standard UART/SPI module. The ACI defines a protocol providing access to all services offered by the layers of the embedded Bluetooth stack. ACI commands are described in the BlueNRG-232N ACI command interface documentation. In addition, ACI provides a set of commands that allow the BlueNRG-232N firmware to be programmed from an external device connected to SPI or UART. The complete description of updater commands and procedures is provided in a separate application note. DS13280 - Rev 1 page 18/47 BlueNRG-2N External microcontroller interface 6 External microcontroller interface The BlueNRG-2N provides a hardware interface to external microcontroller based on two very common protocols: * SPI slave protocol with interrupt signal * UART The selection between SPI or UART mode is done through the DIO12 pin. Refer to Table 3. Pinout description, DIO12 description for UART, SPI selection options. The physical layer (SPI or UART) is used to transfer commands and events between the external microcontroller and the BlueNRG-2N. The commands and events are collectively named application control interface (ACI) and they are described in the BlueNRG-2N ACI documentation. In addition, ACI provides a set of commands that allow the BlueNRG-2N firmware to be programmed/updated from an external device connected to SPI or UART. 6.1 UART interface The characteristics of the UART interface are as follows: * Baud rate: 115200 * Data bits: 8 * Parity: N * Stop bits: 1 * Full duplex The interface operates with logic levels as specified in Table 12. Digital I/O specifications. The UART interface does not allow the device to go to sleep state. The pins dedicated to the UART interface are: * DIO11 (UART RX) * DIO8 (UART TX) 6.2 SPI interface The characteristics of the SPI interface are the following: * SPI clock: 1 MHz (max.) * Data bits: 8 * Polarity: 0 (clock to 0 when idle) * Phase: second edge * Full duplex * Slave mode A dedicated IRQ pin is used to inform the external microcontroller that an event has occurred and the device needs attention. The interface operates with logic levels as specified in Table 11. Electrical characteristics. The SPI interface allows the device to go into sleep state achieving the optimal power consumption. 6.3 SPI protocol specificatons This section describes the features and details of the SPI protocol provided by the BlueNRG-2N network coprocessor. The features provided by the SPI protocol are: * Power efficient * Code efficient * Fast data transfer DS13280 - Rev 1 page 19/47 BlueNRG-2N SPI protocol hardware details 6.4 SPI protocol hardware details The SPI port requires five pins: * SPI clock * SPI MOSI * SPI MISO * SPI CS * SPI IRQ The maximum SPI baud rate supported is 1 MHz. The timing diagram adopted is CPOL 0 and CPHA 1, which means data are captured on the SPI clock falling edge and data are changed on the rising edge. The SPI CS acts also as wake-up pin for the BlueNRG-2N, so that if the SPI CS pin is low (external uC selects the BlueNRG-2N for communication) the BlueNRG-2N is woken up if it was asleep.The BlueNRG-2N notifies event pending to the external uC through the SPI IRQ pin. If the SPI IRQ pin is high, the BlueNRG-2N has at least an event for the external uC. Table 5. BlueNRG-2N SPI lines 6.5 Pin function Pin name SPI clock Pin number Information QFN32 WCSP34 IO0 12 A2 SPI clock signal SPI MOSI IO2 10 A1 SPI master output slave input signal SPI MISO IO3 9 B1 SPI master input slave output signal SPI CS IO11 32 E2 SPI chip select signal/ wake-up signal SPI IRQ IO7 4 D2 SPI IRQ request for event pending signal SPI communication protocol To communicate with the BlueNRG-2N, the data on the SPI bus must be formatted as described in this section. An SPI transaction is defined from a falling edge of the SPI CS signal to the next rising edge of the SPI CS signal. Each SPI transaction must contain one data frame only. Each data frame should contain at least five bytes of header, and may have from 0 to N bytes of data. Figure 14. Generic SPI transaction Figure 14. Generic SPI transaction shows a generic SPI transaction. The list of steps is as follows: 1. The external uC lowers the SPI CS signal to start the communication. 2. The BlueNRG-2N raises the SPI IRQ signal to indicate that it is ready for the communication. The time t1 changes according to the state of the BlueNRG-2N. This time t1 can include wakeup of the BlueNRG-2N and preparation of the header part of the frame. DS13280 - Rev 1 page 20/47 BlueNRG-2N SPI communication protocol 3. The external uC must wait for the SPI IRQ signal to become high and then start to transfer the five bytes of the header that includes the control field with the intended operation. In addition, the external uC reads five bytes from the BlueNRG-2N, which include information about the actual size of the read and write buffer. 4. The external uC, after checking the five bytes of header, performs data transaction. 5. The BlueNRG-2N lowers SPI IRQ signal after the five byte headers are transferred, but due to internal processing, this could be done also during the data transfer phase. 6. The external uC must wait for the SPI IRQ to be low before raising the SPI CS signal to mark the end of the communication. Some important notes are: * Setting the SPI CS signal low wakes up the BlueNRG-2N if the device is asleep * If the SPI IRQ signal is low before setting the SPI CS signal low, the BlueNRG-2N has no data events for the external uC, so the read buffer size is zero (RBUF=0) * The time t1 is the time between wake-up (point a in Figure 14. Generic SPI transaction) and the BlueNRG-2N ready to perform the SPI transaction (point b in Figure 14. Generic SPI transaction). The t1 time range is from minimal value (the BlueNRG-2N already awakes when the SPI CS is asserted), to a maximum value that involves wake-up sequence and software boot * Even if there are events pending after the end of the transaction, the SPI IRQ signal goes low to allow the BlueNRG-2N to update five byte headers and to re-arm the SPI for the next transaction (after this delay the SPI IRQ signal goes high again if events are pending) * The SPI CS signal marks the beginning and end of the transaction * The SPI CS high marks the end of the transaction and must be set to high only when IRQ line is low * The gap between the header and the data is not mandatory, but it is normally required by the external uC to process the header and check if there is enough space in the buffers to perform the wanted transaction * When the SPI IRQ signal is high, the five byte headers are locked and cannot be modified by the BlueNRG-2N firmware Figure 15. SPI header format * The header of the external uC (the SPI master) is on the MOSI line, which is composed of one control byte (CTRL) and four bytes 0x00. CTRL field can have only the value of 0x0A (SPI write) or 0x0B (SPI read). The BlueNRG-2N returns the header on the MISO line at the same time. When the BlueNRG-2N asserts the SPI IRQ signal, it is ready. Otherwise, the BlueNRG-2N is still not initialized. The external uC must wait for the IRQ line to become high and perform a five bytes transaction. The five bytes in the MISO line gives one byte of starting frame, two bytes with the size of the write buffer (WBUF) and two bytes with the size of the read buffer (RBUF). The endianness for WBUF and RBUF is LSB first. The value in WBUF means how many bytes the master can write to the BlueNRG-2N. The value in RBUF means how many bytes in the BlueNRG-2N are waiting to be read by the external uC Read transaction A read transaction is performed when the BlueNRG-2N raises the SPI IRQ line before the SPI CS signal is lowered by the external uC. DS13280 - Rev 1 page 21/47 BlueNRG-2N SPI communication protocol Figure 16. SPI read transaction * In this case, the SPI IRQ signal is high indicating the BlueNRG-2N is awake and ready to perform the SPI transaction, after a hardware dependent set-up time t2 (>=0.5 us). The transaction is performed as follows: 1. An event has been generated by the BlueNRG-2N (point a in Figure 16. SPI read transaction ). 2. The external uC lowers the SPI CS signal to initiate a transaction (point b in Figure 16. SPI read transaction). 3. Since the SPI IRQ signal is high, the external uC initiates a data transfer after t2. The external uC transfers five bytes as follows [0x0B, XX, XX, XX, XX]. The WBUF and RBUF sizes are read by the SPI MISO signal. 4. The external uC performs the read data transaction for RBUF bytes. (Note: if RBUF is 0, this is an unexpected condition since the BlueNRG-2N is indicating that data is available; in any case the transaction needs to be completed by reading no bytes). 5. The BlueNRG-2N lowers SPI IRQ signal after the five bytes header are transferred, but due to internal processing, this could be done also during the data transfer phase. 6. The external uC must wait for the SPI IRQ to be low before raising the SPI CS signal to mark the end of the communication. Write transaction * A write transaction is performed by the external uC to send a command to the BlueNRG-2N. The BlueNRG-2N can be awakened or put to sleep when the SPI CS signal is lowered by the external uC. The assertion of the SPI CS signal wakes up the BlueNRG-2N, if asleep Figure 17. SPI write transaction * The transaction is performed as follows: 1. The external uC lowers the SPI CS signal to initiate a transaction. 2. The BlueNRG-2N raises the SPI IRQ signal to indicate that it is ready with t1 >= 0. 3. The external uC waits for SPI IRQ signal to become high and start a transfer of five bytes sending the code of the intended operation and reading the read buffer and write buffer size. The external uC transfers five bytes as follows: [0x0A, XX, XX, XX, XX]. The WBUF and RBUF values are sampled in the SPI MISO signal. 4. The BlueNRG-2N lowers the SPI IRQ after the five byte headers are transferred, but due to internal processing, this could be done also during the data transfer phase. 5. The external uC checks if the WBUF allows sending the command. If yes, it performs the data transaction, otherwise it performs no data transfer (it would be possible to retry later.) 6. The external uC must wait for the SPI IRQ signal to be low before the communication is closed 7. The external uC must raise the SPI CS to mark the end of the transaction. Error transaction DS13280 - Rev 1 page 22/47 BlueNRG-2N SPI communication protocol * This section lists the BlueNRG-2N firmware behavior when some error transactions are performed: - Incomplete header transaction (0 to 4): the BlueNRG-2N ignores the transaction - The external uC does not wait for the SPI IRQ signal to be low before raising the SPI CS signal: the BlueNRG-2N lowers the SPI IRQ signal when the SPI CS signal is high - The external uC does not wait for the SPI IRQ signal to be high before SPI clock starts: the result is acquisition of corrupted data both master and slave side - Incomplete read transaction: the master loses the event - Incomplete write transaction: the BlueNRG-2N stores the bytes written by the external uC. During the next write operation the BlueNRG-2N gets the new bytes trying to get a complete frame according to Bluetooth protocol - Two commands in a row without reading event for command: the BlueNRG-2N parses the two commands and then it generates the corresponding events SPI state machine * Hereafter the description of the BlueNRG-2N SPI state machine Table 6. BlueNRG-2N SPI state machine states State Init Description Boot/transient state Hardware initialization Input Output Next state - IRQ=0 Configured CS=0 IRQ=1 Waiting_Header IRQ=0 Sleep IRQ=1 Configured IRQ=0 Sleep IRQ=0 Configured CS=0 IRQ=0 Configured CS=0 IRQ=1 When 5-byte are received goes to Header_Received CS=1 IRQ=1 Transaction_Complete CS=0 IRQ=0 Waiting_Data CS=1 IRQ=0 Transaction_Complete CS=0 IRQ=0 Waiting_Data nCS=1 IRQ=0 Transaction_Complete nCS=1 IRQ=0 Configured CS=1 Configured Ready to transfer information, 5 byte header frozen Event pending=0 CS=1 Event pending=1 CS=1 Event pending=0 Sleep Sleep state with almost all logic off CS=1 Event pending=1 Waiting_Header DS13280 - Rev 1 Receiving 5 byte header from SPI master Header_Received 5 byte header received Waiting_Data Receiving payload Transaction_Complete Transitional page 23/47 BlueNRG-2N SPI communication protocol Figure 18. SPI protocol state machine Init O:IRQ=0 Configured I:nCS=1,EV_Pending=1 O:IRQ=1 I:nCS=0 I:nCS=1, EV_Pending=0 I:nCS=0I:EV_Pending=1 O:IRQ=1 Waiting_Header Header not complete Sleep I:nCS=1 O:IRQ=0 Header_Received Timeout expired I:nCS=1 O:IRQ=0 I:nCS=1 Waiting_Data I:nCS=0 I:nCS=1 Transaction_Complete External uC behavior * The external uC must act according to the information from the BlueNRG-2N: - SPI IRQ signal - Information from header frame WBUF and RBUF Table 7. BlueNRG-2N SPI inputs DS13280 - Rev 1 Input from BlueNRG-1 Meaning External uC IRQ=1, RBUF is not 0 Read operation is required, at least one event pending Read operation can be performed IRQ=0, RBUF is 0 No event pending Nothing to do IRQ=0, RBUF is 0, WBUF is N No event pending If the number of bytes to write is lesser or equal than N, then write operation is acceptable. Otherwise, the extent uC must wait page 24/47 BlueNRG-2N SPI communication protocol Figure 19. Expected uC SPI protocol state machine Init Ready I:IRQ=1 I:CMD_Pending=1 O:CS=0, CTRL=0x0B O:CS=0, CTRL=0x0A Get_Header Header not complete I:CTRL=0x0A I:CMD_len<=WBUF O:Read RBUF bytes O:Write WBUF bytes Get_Data Transfert not complete Send_Data I:IRQ=0 O:CS=1 Transfert not complete I:CMD_len>WBUF, IRQ=0 O: CS=1 I:IRQ=0 O:CS=1 Transaction_Complete Figure 20. HCI_READ_LOCAL_VERSION_INFORMATION SPI waveform Figure 21. HCI_READ_LOCAL_VERSION_INFORMATION SPI waveform zoom DS13280 - Rev 1 page 25/47 BlueNRG-2N SPI communication protocol Figure 22. HCI_COMMAND_COMPLETE_EVENT SPI waveform DS13280 - Rev 1 page 26/47 BlueNRG-2N Absolute maximum ratings and thermal data 7 Absolute maximum ratings and thermal data Table 8. Absolute maximum ratings Pin Parameter VBAT3, VBAT2, VBAT1, RESETN, SMPSFILT1, SMPSFILT2 Note: Value Unit DC-DC converter supply voltage input and output -0.3 to +3.9 V VDD1V2 DC voltage on linear voltage regulator -0.3 to +1.3 V DIO0 to DIO25, TEST DC voltage on digital input/output pins -0.3 to +3.9 V ANATEST0, ANATEST1, ADC1, ADC2 DC voltage on analog pins -0.3 to +3.9 V FXTAL0, FXTAL1, SXTAL0, SXTAL1 DC voltage on XTAL pins -0.3 to +1.4 V RF0, RF1 DC voltage on RF pins -0.3 to +1.4 V TSTG Storage temperature range -40 to +125 C VESD-HBM Electrostatic discharge voltage 2.0 kV Absolute maximum ratings are those values above which damage to the device may occur. Functional operation under these conditions is not implied. All voltages are referred to GND. Table 9. Thermal data DS13280 - Rev 1 Symbol Parameter Rthj-amb Thermal resistance junction-ambient Rthj-c Thermal resistance junction-case Value 34 (QFN32) 50 (WLCSP34) 2.5 (QFN32) 25 (WLCSP34) Unit C/W C/W page 27/47 BlueNRG-2N General characteristics 8 General characteristics Table 10. Operating conditions DS13280 - Rev 1 Symbol Parameter Min. VBAT Operating battery supply voltage TA Operating Ambient temperature range Typ. Max. Unit 1.7 3.6 V -40 +105 C page 28/47 BlueNRG-2N Electrical specifications 9 Electrical specifications 9.1 Electrical characteristics Characteristics measured over recommended operating conditions unless otherwise specified. Typical values are referred to TA = 25 C, VBAT = 3.0 V. All performance data are referred to a 50 antenna connector, via reference design, QFN32 package version. Table 11. Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Reset - 5 - nA Standby - 500 - nA - A Power consumption when DC-DC converter active Sleep mode: 32 kHz XO ON (24 KB retention RAM) Sleep mode: 32 kHZ RO ON (24 KB retention RAM) IBAT Supply current - 0.9 2.1 Active mode: CPU, Flash and RAM on - 1.9 - mA RX - 7.7 - mA - mA TX +8 dBm 15.1 TX +4 dBm 10.9 TX +2 dBm 9 TX -2 dBm TX -5 dBm - 8.3 7.7 TX -8 dBm 7.1 TX -11 dBm 6.8 TX -14 dBm 6.6 Power consumption when DC-DC converter not active IBAT IBAT Supply current Supply current Reset - 5 - nA Standby - 500 - nA Sleep mode: 32 kHz XO ON (24 KB retention RAM) - 0.9 - Sleep mode: 32 kHZ RO ON (24 KB retention RAM) - 2.1 - Active mode: CPU, Flash and RAM on - 3.3 - RX - 14.5 TX +8 dBm 28.8 TX +4 dBm 20.5 TX +2 dBm 17.2 TX -2 dBm TX -5 dBm DS13280 - Rev 1 - 15.3 14 TX -8 dBm 13 TX -11 dBm 12.3 TX -14 dBm 12 A mA mA - mA page 29/47 BlueNRG-2N RF general characteristics Table 12. Digital I/O specifications Symbol Test conditions Min. Typ. Unit T(RST)L 1.5 ms TC 3.3 V TC1 2.5 V TC2 1.8 V VIL 0.3*VDD VIH 0.65*VDD VOL IOL = 3 mA VOH IOH = 3 mA IOL (low drive strength) IOL (high drive strength) IOL (Very high drive strength) IOH (low drive strength) IOH (high drive strength) IOH (very high drive strength) IPUD (current sourced/sinked from IOs with pull enabled) 9.2 Max. V V 0.4 0.7*VDD V V TC (VOL = 0.4 V) 5.6 mA TC1 (VOL = 0.42 V) 6.6 mA TC2 (VOL = 0.45 V) 3 mA TC (VOL = 0.4 V) 11.2 mA TC1 (VOL = 0.42 V) 13.2 mA TC2 (VOL = 0.45 V) 6 mA TC (VOL = 0.4 V) 16.9 mA TC1 (VOL = 0.42 V) 19.9 mA TC2 (VOL = 0.45 V) 9.2 mA TC (VOH = 2.4 V) 10.6 mA TC1 (VOH = 1.72 V) 7.2 mA TC2 (VOH = 1.35 V) 3 mA TC (VOH = 2.4 V) 19.2 mA TC1 (VOH = 1.72 V) 12.9 mA TC2 (VOH = 1.35 V) 5.5 mA TC (VOH = 2.4 V) 29.4 mA TC1 (VOH = 1.72 V) 19.8 mA TC2 (VOH = 1.35 V) 8.4 mA Static supply 1.7 V 5 10 A Static supply 3.6 V 40 60 A RF general characteristics Characteristics measured over recommended operating conditions unless otherwise specified. Typical values are referred to TA= 25 C, VBAT = 3.0 V. All performance data are referred to a 50 antenna connector, via reference design, QFN32 package version. Table 13. RF general characteristics DS13280 - Rev 1 Symbol Parameter FREQ Test conditions Min. Typ. Max. Unit Frequency range 2400 - 2483.5 MHz FCH Channel spacing - 2 - MHz RFch RF channel center frequency 2402 - 2480 MHz page 30/47 BlueNRG-2N RF transmitter characteristics 9.3 RF transmitter characteristics Characteristics measured over recommended operating conditions unless otherwise specified. Typical values are referred to TA = 25 C, VBAT = 3.0 V. All performance data are referred to a 50 antenna connector, via reference design, QFN32 package version. Table 14. RF transmitter characteristics Symbol MOD BT Mindex DR Parameter Test conditions Min. Typ. Modulation scheme Max. Unit GFSK Bandwidth-bit period product - 0.5 - Modulation index - 0.5 - Air data rate - 1 - Mbps - +8 +10 dBm - -16.5 - dBm PMAX Maximum output power PRFC Minimum output power At antenna connector 6 dB bandwidth for modulated carrier (1 Mbps) Using resolution bandwidth of 100 kHz 500 - - kHz PRF1 1st adjacent channel transmit power 2 MHz Using resolution bandwidth of 100 kHz and average detector - -35 - dBm PRF2 2nd Adjacent channel transmit power >3 MHz Using resolution bandwidth of 100 kHz and average detector - -40 - dBm @ 2440 MHz - 25.4 + j20.8 (1) - PBW1M ZLOAD Optimum differential load 1. Simulated value. 9.4 RF receiver characteristics Characteristics measured over recommended operating conditions unless otherwise specified. Typical values are referred to TA = 25 C, VBAT = 3.0 V. All performance data are referred to a 50 antenna connector, via reference design, QFN32 package version. Table 15. RF receiver characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit RXSENS Sensitivity BER <0.1% -88 dBm PSAT Saturation BER <0.1% 11 dBm Input differential impedance @ 2440 MHz 25.5-j14.2 zIN RF selectivity with BLE equal modulation on interfering signal C/ICO- Co-channel interference Wanted signal = -67 dBm, BER 0.1% 6 dBc C/I1 MHz Adjacent (+1 MHz) interference Wanted signal = -67 dBm, BER0.1% 0 dBc C/I2 MHz Adjacent (+2 MHz) interference Wanted signal = -67 dBm, BER 0.1% -40 dBc C/I3 MHz Adjacent (+3 MHz) interference Wanted signal = -67 dBm, BER 0.1% -47 dBc C/I4 MHz Adjacent ( 4 MHz) interference Wanted signal = -67 dBm, BER 0.1% -46 dBc C/I6 MHz Adjacent ( 6 MHz) interference Wanted signal = -67 dBm BER 0.1% -48 dBc channel DS13280 - Rev 1 page 31/47 BlueNRG-2N High speed crystal oscillator characteristics Symbol Parameter C/I25 MHz Adjacent ( 25 MHz) interference Image frequency interference C/IImage -2 MHz Adjacent (1 MHz) interference to inband image frequency C/IImage1 MHz -1 MHz Test conditions Min. Typ. Max. Unit Wanted signal = -67 dBm, BER 0.1% -70 dBc Wanted signal = -67 dBm, BER 0.1% -16 dBc 0 Wanted signal = -67 dBm, BER 0.1% dBc -23 -3 MHz Intermodulation characteristics (CW signal at f1, BLE interfering signal at f2) 9.5 P_IM(3) Input power of IM interferes at 3 and 6 MHz distance from wanted signal Wanted signal = -64 dBm, BER 0.1% -34 dBm P_IM(-3) Input power of IM interferes at -3 and -6 MHz distance from wanted signal Wanted signal = -64 dBm, BER 0.1% -48 dBm P_IM(4) Input power of IM interferes at 4 and Wanted signal = -64 dBm, BER 8 MHz distance from wanted signal 0.1% -34 dBm P_IM(5) Input power of IM interferes at 5 and Wanted signal = -64 dBm, BER 10 MHz distance from wanted signal 0.1% -34 dBm High speed crystal oscillator characteristics Characteristics measured over recommended operating conditions unless otherwise specified. Typical values are referred to TA = 25 C, VBAT = 3.0 V. Table 16. High speed crystal oscillator characteristics 9.6 Symbol Parameter fNOM Nominal frequency fTOL Frequency tolerance ESR PD Test conditions Min. Typ. - 16/32 - MHz - - 50 ppm Equivalent series resistance - - 100 Drive level - - 100 W Includes initial accuracy, stability over temperature, aging and frequency pulling due to incorrect load capacitance Max. Unit High speed crystal oscillator The BlueNRG-2N includes a fully integrated low power 16/32 MHz Xtal oscillator with an embedded amplitude regulation loop. In order to achieve low power operation and good frequency stability of the XTAL oscillator, certain considerations with respect to the quartz load capacitance C0 need to be taken into account. Figure 23. High speed oscillator block diagram shows a simplified block diagram of the amplitude regulated oscillator used on the BlueNRG-2N. DS13280 - Rev 1 page 32/47 BlueNRG-2N High speed crystal oscillator Figure 23. High speed oscillator block diagram Low power consumption and fast start-up time is achieved by choosing a quartz crystal with a low load capacitance C0. A reasonable choice for capacitor C0 is 12 pF. To achieve good frequency stability, the following equation needs to be satisfied: 0 = 1 *2 1 + 2 (1) Where C1'=C1+CPCB1+CPAD, C2'= C2+CPCB2+CPAD, where C1 and C2 are external (SMD) components, CPCB1 and CPCB2 are PCB routing parasites and CPAD is the equivalent small-signal pad-capacitance. The value of CPAD is around 0.5 pF for each pad. The routing parasites should be minimized by placing quartz and C1/C2 capacitors close to the chip, not only for an easier matching of the load capacitance C0, but also to ensure robustness against noise injection. Connect each capacitor of the Xtal oscillator to ground by a separate vias. DS13280 - Rev 1 page 33/47 BlueNRG-2N Low speed crystal oscillator characteristics 9.7 Low speed crystal oscillator characteristics Characteristics measured over recommended operating conditions unless otherwise specified. Typical values are referred to TA = 25 C, VBAT = 3.0 V. Table 17. Low speed crystal oscillator characteristics Symbol Parameter Test conditions Min. Typ. fNOM Nominal frequency fTOL Frequency tolerance - 32.768 - kHz - - 50 ppm ESR Equivalent series resistance - - 90 k PD Drive level - - 0.1 W Includes initial accuracy, stability over temperature, aging and frequency pulling due to incorrect load capacitance. Note: These values are the correct ones for NX3215SA-32.768 kHz-EXS00A-MU00003. 9.8 High speed ring oscillator characteristics Max. Unit Characteristics measured over recommended operating conditions unless otherwise specified. Typical values are referred to TA= 25 C, VBAT = 3.0 V. Table 18. High speed ring oscillator characteristics 9.9 Symbol Parameter fNOM Nominal frequency Test conditions Min. Typ. Max. Unit - 14 - MHz Low speed ring oscillator characteristics Characteristics measured over recommended operating conditions unless otherwise specified. Typical values are referred to TA = 25 C, VBAT = 3.0 V, QFN32 package version. Table 19. Low speed ring oscillator characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit - 32 - kHz 32 kHz ring oscillator (LSROSC) fNOM 9.10 Nominal frequency N-fractional frequency synthesizer characteristics Characteristics measured over recommended operating conditions unless otherwise specified. Typical values are referred to TA = 25 C, VBAT = 3.0 V, fc = 2440 MHz. Table 20. N-Fractional frequency synthesizer characteristics DS13280 - Rev 1 Symbol Parameter PNSYNTH RF carrier phase noise LOCKTIME PLL lock time TOTIME PLL turn-on / hop time Test conditions Min. Typ. Max. Unit At 1 MHz offset from carrier - -113 - dBc/Hz At 3 MHz offset from carrier - -119 - dBc/Hz - - 40 s - - 150 s Including calibration page 34/47 BlueNRG-2N Package information 10 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DS13280 - Rev 1 page 35/47 BlueNRG-2N QFN32 package information 10.1 QFN32 package information Figure 24. QFN32 (5 x 5 x 1 pitch 0.5 mm) package outline QFN32_POA_8362854_B DS13280 - Rev 1 page 36/47 BlueNRG-2N QFN32 package information Table 21. QFN32 (5 x 5 x 1 pitch 0.5 mm) mechanical data Dim. mm Min. Typ. Max. A 0.80 0.85 1.00 A1 0 0.02 0.05 A3 b 0.20 REF 0.18 0.25 D 5.00 BSC E 5.00 BSC 0.30 D2 3.2 3.70 E2 3.2 3.70 e 0.5 BSC L 0.30 0 K 0.20 0.40 0.50 14 Figure 25. QFN32 (5 x 5 x 1 pitch 0.5 mm) package detail "A" DS13280 - Rev 1 page 37/47 BlueNRG-2N WLCSP34 package information 10.2 WLCSP34 package information Figure 26. WLCSP34 (2.66 x 2.56 x 0.5 pitch 0.4 mm) package outline See Note 1 WLCSP34_POA_8165249 1. DS13280 - Rev 1 The corner of terminal A1 must be identified on the top surface by using a laser marking dot. page 38/47 BlueNRG-2N WLCSP34 package information Table 22. WLCSP34 (2.66 x 2.56 x 0.5 pitch 0.4 mm) mechanical data Dim. mm. Min. Typ. A 0.50 A1 0.20 b 0.27 D 2.50 D1 E Notes Max. 2.56 (1) 2.58 (2) 2.68 (3) 2.00 2.60 2.66 E1 2.00 e 0.40 f 0.28 g 0.33 ccc 0.05 1. The typical ball diameter before mounting is 0.25 mm. 2. D = f + D1 + f. 3. E = g + E1 + g. DS13280 - Rev 1 page 39/47 BlueNRG-2N PCB assembly guidelines 11 PCB assembly guidelines For Flip Chip mounting on the PCB, STMicroelectronics recommends the use of a solder stencil aperture of 330 x 330 m maximum and a typical stencil thickness of 125 m. Flip Chips are fully compatible with the use of near eutectic 95.8% Sn, 3.5% Ag, 0.7% Cu solder paste with noclean flux. ST's recommendations for Flip-Chip board mounting are illustrated on the soldering reflow profile shown in Figure 27. Flip Chip CSP (2.71 x 2.58 x 0.5 pitch 0.4 mm) package reflow profile recommendation. Figure 27. Flip Chip CSP (2.71 x 2.58 x 0.5 pitch 0.4 mm) package reflow profile recommendation Table 23. Flip Chip CSP (2.71 x 2.58 x 0.5 pitch 0.4 mm) package reflow profile recommendation Profile Value Typ. Max. Temp. gradient in preheat (T = 70 - 180 C/s 0.9 C/s 3 C/s Temp. gradient (T = 200 - 225 C) 2 C/s 3 C/s Peak temp. in reflow 240 - 245 C 260 C Time above 200 C 60 s 90 s Temp. gradient in cooling -2 to -3 C -6 C/s Time from 50 to 220 C 160 to 220 C Dwell time in the soldering zone (with temperature higher than 220 C) has to be kept as short as possible to prevent component and substrate damage. Peak temperature must not exceed 260 C. Controlled atmosphere (N2 or N2H2) is recommended during the whole reflow, especially above 150 C. Flip Chips are able to withstand three times the previous recommended reflow profile to be compatible with a double reflow when SMDs are mounted on both sides of the PCB plus one additional repair. A maximum of three soldering reflows are allowed for these lead-free packages (with repair step included). The use of a no-clean paste is highly recommended to avoid any cleaning operation. To prevent any bump cracks, ultrasonic cleaning methods are not recommended. DS13280 - Rev 1 page 40/47 BlueNRG-2N Ordering information 12 Ordering information Table 24. Ordering information DS13280 - Rev 1 Order code Package BlueNRG-232N QFN32 (5x5 mm) BlueNRG-234N WLCSP34 (2.66x2.56 mm) Packing Tape and reel page 41/47 BlueNRG-2N Revision history Table 25. Document revision history DS13280 - Rev 1 Date Version 09-Jul-2020 1 Changes Initial release. page 42/47 BlueNRG-2N Contents Contents 1 High performance and benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Functional details. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2.1 2.3 State description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Clocks and reset management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.3.1 Reset management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.4 TX/RX event alert . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.5 SWD debug feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.6 Bluetooth low energy radio. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.6.1 Radio operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.7 Pre-programmed bootloader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.8 Firmware image. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.9 Unique device serial number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 4 Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 5 Application controller interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 6 External microcontroller interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 6.1 UART interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6.2 SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6.3 SPI protocol specificatons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6.4 SPI protocol hardware details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 6.5 SPI communication protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7 Absolute maximum ratings and thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 8 General characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 9 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 9.1 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 9.2 RF general characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 9.3 RF transmitter characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 DS13280 - Rev 1 page 43/47 BlueNRG-2N Contents 10 9.4 RF receiver characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 9.5 High speed crystal oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 9.6 High speed crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 9.7 Low speed crystal oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 9.8 High speed ring oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 9.9 Low speed ring oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 9.10 N-fractional frequency synthesizer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 10.1 [Package name] package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 10.2 WLCSP34 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 11 PCB assembly guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 12 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 DS13280 - Rev 1 page 44/47 BlueNRG-2N List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Relationship between the BlueNRG-2N states and functional blocks. . . . . . . . . . . . . . SWD port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinout description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External component list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BlueNRG-2N SPI lines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BlueNRG-2N SPI state machine states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BlueNRG-2N SPI inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digital I/O specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RF general characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RF transmitter characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RF receiver characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . High speed crystal oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Low speed crystal oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . High speed ring oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Low speed ring oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . N-Fractional frequency synthesizer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . QFN32 (5 x 5 x 1 pitch 0.5 mm) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . WLCSP34 (2.66 x 2.56 x 0.5 pitch 0.4 mm) mechanical data . . . . . . . . . . . . . . . . . . . Flip Chip CSP (2.71 x 2.58 x 0.5 pitch 0.4 mm) package reflow profile recommendation Ordering information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DS13280 - Rev 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 . 8 12 16 20 23 24 27 27 28 29 30 30 31 31 32 34 34 34 34 37 39 40 41 42 page 45/47 BlueNRG-2N List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. DS13280 - Rev 1 BlueNRG-2N network processor RF software layers . . . . . . . . . . . . . . . . . . . . . . . . . . BlueNRG-2N power management state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reset and wake-up generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BlueNRG-2N power-up sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BlueNRG-2N pinout top view (QFN32). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BlueNRG-2N ball out top view (WCSP34) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BlueNRG-2N ball out bottom view (WCSP34) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Application circuit: active DC-DC converter QFN32 package. . . . . . . . . . . . . . . . . . . . . Application circuit: non-active DC-DC converter QFN32 package . . . . . . . . . . . . . . . . . Application circuit: active DC-DC converter WCSP34 package . . . . . . . . . . . . . . . . . . . Application circuit: non active DC-DC converter WCSP34 package . . . . . . . . . . . . . . . . Application circuit: active DC-DC converter QFN32 package with BALF-NRG-02D3 balun Generic SPI transaction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI header format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI read transaction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI write transaction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI protocol state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Expected uC SPI protocol state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HCI_READ_LOCAL_VERSION_INFORMATION SPI waveform . . . . . . . . . . . . . . . . . . HCI_READ_LOCAL_VERSION_INFORMATION SPI waveform zoom . . . . . . . . . . . . . . HCI_COMMAND_COMPLETE_EVENT SPI waveform . . . . . . . . . . . . . . . . . . . . . . . . High speed oscillator block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . QFN32 (5 x 5 x 1 pitch 0.5 mm) package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . QFN32 (5 x 5 x 1 pitch 0.5 mm) package detail "A" . . . . . . . . . . . . . . . . . . . . . . . . . . . WLCSP34 (2.66 x 2.56 x 0.5 pitch 0.4 mm) package outline . . . . . . . . . . . . . . . . . . . . . Flip Chip CSP (2.71 x 2.58 x 0.5 pitch 0.4 mm) package reflow profile recommendation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 . 4 . 6 . 7 . 7 10 11 12 14 14 15 15 16 20 21 22 22 24 25 25 25 26 33 36 37 38 40 page 46/47 BlueNRG-2N IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2020 STMicroelectronics - All rights reserved DS13280 - Rev 1 page 47/47