Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Power 1 Form A DC High Capacity (AQZ192)
ASCTB308E 201209-T
5. LED current vs. ambient
temperature characteristics
Please keep the LED current to within the
range given below.
6. Ripple in the input power supply
If ripple is present in the input power
supply, observe the following:
1) For LED current at Emin, please
maintain 5 to 10 mA.
2) Please make sure for Emax. is no higher
the LED current at than 50 mA.
7. Output spike voltages
1) If an inductive load generates spike
voltages which exceed the absolute
maximum rating, the spike voltage must
be limited.
Power type
2) Even if spike voltages generated at the
load are limited with a clamp diode if the
circuit wires are long, spike voltages will
occur by inductance. Keep wires as short
as possible to minimize inductance.
8. Cleaning solvents compatibility
We recommend cleaning with an organic
solvent. If you cannot avoid using
ultrasonic cleansing, please ensure that
the following conditions are met, and
check beforehand for defects.
•Frequency: 27 to 29 kHz
•Ultrasonic output:
No greater than 0.25W/cm2 (Note)
•Cleaning time:
No longer than 30 s
• Cleanser used: Asahiklin AK-225
• Other:
Submerge in solvent in order to prevent
the PCB and elements from being
contacted directly by the ultrasonic
vibrations.
Note: Applies to unit area ultrasonic output for
ultrasonic baths.
9. Notes for mounting
1) If many different packages are
combined on a single substrate, then
lead temperature rise is highly dependent
on package size. For this reason, please
make sure that the temperature of the
terminal solder area of the PhotoMOS
falls within the temperature conditions of
item 10 before mounting.
2) If the mounting conditions exceed the
recommended solder conditions in item
10, resin strength will fall and the
nonconformity of the heat expansion
coefficient of each constituent material
will increase markedly, possibly causing
cracks in the package, severed bonding
wires, and the like. For this reason,
please inquire with us about whether this
use is possible.
10. Soldering
When soldering PC board terminals,
keep soldering time to within 10 s at
260°C 500°F.
• When using lead-free solder, we
recommend a type with an alloy
composition of Sn 3.0 Ag 0.5 Cu. Please
inquire about soldering conditions and
other details.
11. Packing format
Tube packing
Devices are packaged in a tube so that
pin No. 1 is on the stopper B side.
Observe correct orientation when
mounting them on PC boards.
(Power type)
12. Transportation and storage
1) Extreme vibration during transport will
warp the lead or damage the device.
Handle the outer and inner boxes with
care.
2) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended:
• Temperature: 0 to 45°C 32 to 113°F
• Humidity: Less than 70% R.H.
• Atmosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
13. Input LED current (Power standard
type)
For rising and dropping ratio of input LED
current (di/dt), maintain min. 100 µA/s.
14. Adjacent mounting (Power type)
1) When devices are mounted close
together with the heat-generated devices,
ambient temperature may rise
abnormally. Mounting layout and
ventilation should be considered.
2) When many devices are mounted
close together, load current should be
reduced. (Refer to the date of “Load
current vs. ambient temperature
characteristics in adjacent mounting.”)
15. Recommended load voltage
As a guide in selecting PhotoMOS ,
please refer to the following table.
100
LED current, mA
100
80
60
40
20
0
Ambient temperature, °C
-40 -20 0 20 40 60
8580
Emin. Emax.
1234
Load
Add a clamp diode
to the load
1234
Load
Add a CR snubber
circuit to the load
1234
Load Add a varistor to the
PhotoMOS®
®
Stopper B Stopper A
Part No.
Absolute maximum
rating Recommended
load voltage
Load
voltage
Load
current
AQZ192 60 V DC 10 A DC 5, 12, 24 V DC
®