TD62002APG(5,J,S) - TOSHIBA - Datasheet.Directory

TD62003~004APG/AFG

2009-10-01

TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic

TD62003APG,TD62003AFG,TD62004APG,TD62004AFG

7-channel Darlington Sink Driver

The TD62003APG/AFG and TD62004APG/AFG are high-voltage,

high-current darlington drivers comprised of seven NPN

darlington pairs.

All units feature integral clamp diodes for switching inductive

loads.

Applications include relay, hammer, lamp and display (LED)

drivers.

Features

z Output current (single output): 500 mA (max)

z High sustaining voltage output: 50 V (min)

z Output clamp diodes

z Inputs compatible with various types of logic

z Package type

APG: DIP-16 pin

AFG: SOP-16 pin

Type Input base resistor Designation

TD62003APG/AFG 2.7 kΩ TTL, 5-V CMOS

TD62004APG/AFG 10.5 kΩ 6-V to 15-V PMOS, CMOS

Pin Connection (top view)

TD62003APG

TD62004APG

TD62003AFG

TD62004AFG

Weight

DIP16−P−300−2.54A : 1.11 g (typ.)

SOP16−P−225−1.27 : 0.16 g (typ.)

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Schematics (each driver)

TD62003APG/AFG TD62004APG/AFG

Note: The input and output parasitic diodes cannot be used as clamp diodes.

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Output sustaining voltage VCE (SUS) −0.5 to 50 V

Output current IOUT 500 mA/ch

Input voltage VIN −0.5 to 30 V

Clamp diode reverse voltage VR 50 V

Clamp diode forward current IF 500 mA

APG 1.47

Power dissipation

AFG

PD 0.625 (Note)

Operating temperature Topr −40 to 85 °C

Storage temperature Tstg −55 to 150 °C

Note: When mounted on a glass-epoxy PCB (30 mm × 30 mm × 1.6 mm, Cu area: 50%)

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Operating Ranges (Ta = −40°C to 85°C)

Characteristics Symbol Condition Min Typ. Max Unit

Output sustaining voltage VCE (SUS) ⎯ 0 ⎯ 50 V

Duty = 10% 0 ⎯ 370

APG

Duty = 50% 0 ⎯ 130

Duty = 10% 0 ⎯ 233

Output current

AFG

IOUT

tpw = 25 ms

7 circuits

Ta = 85°C

Tj = 120°C

Duty = 50% 0 ⎯ 70

mA/ch

Input voltage VIN ⎯ 0 ⎯ 24 V

TD62003 2.8 ⎯ 24

Input voltage

(output on) TD62004

VIN (ON) IOUT = 400 mA, hFE = 800

6.2 ⎯ 24

TD62003 0 ⎯ 0.7

Input voltage

(output off) TD62004

VIN (OFF) ⎯

0 ⎯ 1.0

Clamp diode reverse voltage VR ⎯ ⎯ ⎯ 50 V

Clamp diode forward current IF ⎯ ⎯ ⎯ 350 mA

APG Ta = 85°C ⎯ ⎯ 0.76

Power dissipation

AFG

PD Ta = 85°C (Note) ⎯ ⎯ 0.325

Note: When mounted on a glass-epoxy PCB (30 mm × 30 mm × 1.6 mm, Cu area: 50%)

Electrical Characteristics (Ta = 25°C unless otherwise noted)

Characteristics Symbol Test

Circuit Test Condition Min Typ. Max Unit

VCE = 50 V, Ta = 25°C ⎯ ⎯ 50

Ooutput leakage current ICEX 1

VCE = 50 V, Ta = 85°C ⎯ ⎯ 100

μA

IOUT = 350 mA, IIN = 500 μA ⎯ 1.3 1.6

IOUT = 200 mA, IIN = 350 μA ⎯ 1.1 1.3

Collector−emitter saturation voltage VCE (sat) 2

IOUT = 100 mA, IIN = 250 μA ⎯ 0.9 1.1

DC current transfer ratio hFE 2 VCE = 2 V, IOUT = 350 mA 1000 ⎯ ⎯

TD62003 VIN = 2.4 V, IOUT = 350 mA ⎯ 0.4 0.7

Input voltage (output on)

TD62004

IIN (ON) 3

VIN = 9.5 V, IOUT = 350 mA ⎯ 0.8 1.2

Input current (output off) IIN (OFF) 4 IOUT = 500 μA, Ta = 85°C 50 65 ⎯ μA

IOUT = 350 mA ⎯ ⎯ 2.6

TD62003

IOUT = 200 mA ⎯ ⎯ 2.0

IOUT = 350 mA ⎯ ⎯ 4.7

Input voltage (output on)

TD62004

VIN (ON) 5 VCE = 2 V

hFE = 800

IOUT = 200 mA ⎯ ⎯ 4.4

VR = 50 V, Ta = 25°C ⎯ ⎯ 50

Clamp diode reverse current IR 6

VR = 50 V, Ta = 85°C ⎯ ⎯ 100

μA

Clamp diode forward voltage VF 7 IF = 350 mA ⎯ ⎯ 2.0 V

Input capacitance CIN ⎯ ⎯ ⎯ 15 ⎯ pF

Turn−ON delay tON ⎯ 0.1 ⎯

Turn−OFF delay tOFF

8 VOUT = 50 V, RL = 125 Ω

CL = 15 pF ⎯ 0.2 ⎯

μs

TD62003~004APG/AFG

2009-10-01

Test Circuit

1. ICEX 2. VCE (sat), hFE 3. IIN (ON)

4. IIN (OFF) 5. VIN (ON) 6. IR

7. VF

TD62003~004APG/AFG

2009-10-01

8. tON, tOFF

Note 1: Pulse width 50 μs, duty cycle 10%

Output impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns

Note 2: Input condition

Type Number VIH

TD62003APG/AFG 3 V

TD62004APG/AFG 8 V

Note 3: CL includes probe and jig capacitance.

Precautions for Using

This IC does not include built-in protection circuits for excess current or overvoltage.

If this IC is subjected to excess current or overvoltage, it may be destroyed.

Hence, the utmost care must be taken when systems which incorporate this IC are designed.

Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed

due to short−circuit between outputs, air contamination fault, or fault by improper grounding.

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TD62003~004APG/AFG

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TD62003~004APG/AFG

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TD62003~004APG/AFG

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Package Dimensions

Weight: 1.11 g (Typ.)

TD62003~004APG/AFG

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Package Dimensions

Weight: 0.16 g (Typ.)

TD62003~004APG/AFG

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Notes on Contents

1. Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory

purposes.

2. Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These

components and circuits are not guaranteed to prevent malfunction or failure from occurring in the

application equipment.

IC Usage Considerations

Notes on Handling of ICs

(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be

exceeded, even for a moment. Do not exceed any of these ratings.

Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in

case of over current and/or IC failure. The IC will fully break down when used under conditions that

exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal

pulse noise occurs from the wiring or load, causing a large current to continuously flow and the

breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of

breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are

required.

(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the

design to prevent device malfunction or breakdown caused by the current resulting from the inrush

current at power ON or the negative current resulting from the back electromotive force at power OFF.

IC breakdown may cause injury, smoke or ignition.

Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,

the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,

smoke or ignition.

(4) Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.

Otherwise, the current or power consumption may exceed the absolute maximum rating, and

exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

In addition, do not use any device that is applied the current with inserting in the wrong orientation

or incorrectly even just one time.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load

components (such as speakers), for example, power amp and regulator.

If there is a large amount of leakage current such as input or negative feedback condenser, the IC

output DC voltage will increase. If this output voltage is connected to a speaker with low input

withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause

smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied

Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.

TD62003~004APG/AFG

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Points to Remember on Handling of ICs

(1) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the

device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at

any time and condition. These ICs generate heat even during normal use. An inadequate IC heat

radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In

addition, please design the device taking into considerate the effect of IC heat radiation with

peripheral components.

(2) Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to

the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power

supply is small, the device’s motor power supply and output pins might be exposed to conditions

beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into

consideration in system design.

About solderability, following conditions were confirmed

• Solderability

(1) Use of Sn-37Pb solder Bath

· solder bath temperature = 230°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

(2) Use of Sn-3.0Ag-0.5Cu solder Bath

· solder bath temperature = 245°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

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