PRODUCT SELECTION GUIDE LCD, Memory and Storage | 1H 2012 + Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers--from ultra-mobile notebooks to powerful servers--and in a wide range of handheld devices such as smartphones and tablets. Samsung also delivers the industry's widest line of storage products from the consumer to the enterprise level. These include optical disk drives as well as flash storage, such as Solid State Drives, and a range of embedded and removable flash storage products. Markets DRAM Mobile / Wireless SSD FLASH ASIC LOGIC TFT/LCD N/A Notebook PCs/ Ultrabooks Desktop PCs / Workstations Servers Networking / Communications Consumer Electronics samsung.com/us/oem-solutions N/A N/A ODD DRAM Pages 3-12 * * * * DDR3 SDRAM DDR2 SDRAM DDR SDRAM SDRAM * Mobile DRAM * Graphics DDR SDRAM * DRAM Ordering Information FLASH - SSD Pages 13-15 samsung.com/semi/flash * * * * SLC Flash MLC Flash SD and microSD Cards moviNANDTM (eMMC) * Solid State Drive * Flash Ordering Information MULTI-CHIP PACKAGE Page 17 samsung.com/semi/mcp * NAND + MDDR * moviNAND + LPDDR2 * NOR + UtRAM storage Pages 18-19 samsung.com/greenmemory * Solid State Drive samsungodd.com * Optical Disc Drive LCD Pages 20-22 samsung.com/us/lcdpanels * Exclusive Digital Information Display (E-DID) * Performance Digital Information Display (P-DID) * Basic Digital Information Display (B-DID) * Tablets * Notebooks/PCs * Monitors CONTACTs Page 23 samsung.com/us/oemsolutions * Sales Representatives and Distributors samsung.com/semi/dram 1H 2012 3 DRAM samsung.com/semi/dram DDR3 SDRAM REGISTERED MODULES Density Voltage Organization Part Number Composition Compliance 1GB M393B2873GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 9 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now M393B5673GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now 2GB 4GB 1.5V 1.5V 1.5V 128Mx72 256Mx72 512Mx72 1.5V 1Gx72 16GB 1.5V 2Gx72 8GB 1.5V 1Gx72 M393B5670GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x4) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now M393B5773DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M393B5170GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x4) * 36 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now M393B5273CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now M393B5273DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M393B5270DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M393B1K73CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1K73DH0-C(F8/H9)(08/09) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1K70CH0-C(F8/H9)(04/05) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333 2 Now M393B1K70DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M393B2K70CM0-C(F8/H9)(04/05) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B2K70DM0-C(F8/H9)(08/09) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M393B1G73BH0-C(F8/H9/K0/MA)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M393B2G70AH0-C(F8/H9)(04/05) 16GB 1.5V 2Gx72 32GB 1.5V 4Gx72 2GB 1.35V 256Mx72 4GB 8GB 1.35V 1.35V 512Mx72 1Gx72 16GB 1.35V 2Gx72 8GB 1.35V 1Gx72 16GB 1.35V 2Gx72 4Gx72 Ranks Production M393B5773CH0-C(F8/H9)(04/05) M393B5270CH0-C(F8/H9)(04/05) 8GB Speed (Mbps) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1066/1333 2 Now M393B2G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M393B2G73AH0-C(F8/H9)(04/05) 4Gb (512M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B2G73BH0-C(F8/H9)(08/09) 4Gb (512M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B4G70AM0-C(F8/H9)(04/05) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B4G70BM0-C(F8/H9)(08/09) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B5773CH0-Y(F8/H9)(04/05) 2Gb (256M x4) * 9 Lead Free & Halogen Free 1066/1333 1 Now M393B5773DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x4) * 9 Lead Free & Halogen Free 1066/1333/1600 1 Now M393B5173GB0-Y(F8/H9)(08/09) 1Gb (128M x8) * 36 Lead Free & Halogen Free, Flip Chip 1066/1333 4 Now M393B5170GB0-Y(F8/H9/K0)(08/09) 1Gb (256M x4) * 36 Lead Free & Halogen Free, Flip Chip 1066/1333/1600 2 Now M393B5273CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now M393B5273DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M393B5270CH0-Y(F8/H9)(04/05) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M393B5270DH0-Y(F8/H9/K0)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now M393B1K73CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1K73DH0-Y(F8/H9)(08/09) 2Gb (256M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1K70CH0-Y(F8/H9)(04/05) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333 2 Now M393B1K70DH0-Y(F8/H9/K0)(08/09) 2Gb (512M x4) * 36 Lead Free & Halogen Free 1066/1333/1600 2 Now M393B2K70CM0-Y(F8/H9)(04/05) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B2K70DM0-Y(F8/H9)(08/09) 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B1G70BH0-Y(F8/H9/K0)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now M393B1G73BH0-Y(F8/H9/K0)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M393B2G70AH0-Y(F8/H9)(04/05) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1066/1333/1600 2 Now M393B2G70BH0-Y(F8/H9/K0)(08/09) 4Gb (1G x4) * 36 Lead Free & Halogen Free 1066/1333/1600 2 Now M393B2G73AH0-Y(F8/H9)(04/05) 4Gb (512M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B2G73BH0-Y(F8/H9)(08/09) 4Gb (512M x8) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B4G70AM0-Y(F8/H9)(04/05) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now M393B4G70BM0-Y(F8/H9)(08/09) 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1066/1333 4 Now 32GB 1.35V Notes: 04 = IDT B0 register F8 = DDR3-1066 (7-7-7) 05 = Inphi C0 register 09 = Inphi UV GS02 MA = DDR3-1866 (13-13-13) * K0 (1600Mbps) available in ES only H9 = DDR3-1333 (9-9-9) 08 = IDT A1 K0 = DDR3-1600 (11-11-11) DDR3 SDRAM Load Reduced REGISTERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 16GB 1.35V 2Gx72 M386B2K70DM0-YH90 2Gb DDP (1G x4) * 36 Lead Free & Halogen Free 1333 4 Now 32GB 1.35V 4Gx72 M386B4G70BM0-YH90 4Gb DDP (2G x4) * 36 Lead Free & Halogen Free 1333 4 Now Notes: 4 0 = Inphi iMB GS02A DDR3 SDRAM 1H 2012 samsung.com/semi/dram samsung.com/semi/dram Density Voltage Organization Part Number Composition Compliance 1GB 1.5V M392B2873GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 9 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now M392B5673GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 2 Now M392B5670GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x8) * 18 Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1 Now M392B5773CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now M392B5773DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M392B5273CH0-C(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B5273DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M392B5270CH0-C(F8/H9)(04/05) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M392B5270DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M392B1K73CM0-C(F8/H9)(04/05) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B1K73DM0-C(F8/H9)(08/09) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B1K70CM0-C(F8/H9)(04/05) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B1K70DM0-C(F8/H9/K0/MA)(08/09) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M392B1G73BH0-C(F8/H9/K0/MA)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M392B1G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 1 Now M392B2G70AM0-C(F8/H9)(04/05) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B2G70BM0-C(F8/H9/K0/MA)(08/09) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free 1066/1333/1600/1866 2 Now M392B2G73AM0-C(F8/H9)(04/05) 4Gb DDP (1G x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B2G73BM0-C(F8/H9)(08/09) 4Gb DDP (1G x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B5773CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333 1 Now M392B5773DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x8) * 9 Lead Free & Halogen Free 1066/1333/1600 1 Now M392B5273CH0-Y(F8/H9)(04/05) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B5273DH0-Y(F8/H9/K0)(08/09) 2Gb (256M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M392B5270CH0-Y(F8/H9)(04/05) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333 1 Now M392B5270DH0-Y(F8/H9/K0)(08/09) 2Gb (512M x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now M392B1K73CM0-Y(F8/H9)(04/05) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now 2GB 4GB 8GB 16GB 2GB 4GB 8GB 1.5V 1.5V 1.5V 1.5V 1.35V 1.35V 1.35V 128Mx72 256Mx72 512Mx72 1Gx72 2Gx72 256Mx72 512Mx72 1Gx72 Speed (Mbps) Ranks Production M392B1K73DM0-Y(F8/H9)(08/09) 2Gb DDP (512M x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B1K70CM0-Y(F8/H9)(04/05) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B1K70DM0-Y(F8/H9/K0)(08/09) 2Gb DDP (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M392B1G73BH0-Y(F8/H9/K0)(08/09) 4Gb (512M x8) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M392B1G70BH0-Y(F8/H9/K0)(08/09) 4Gb (1G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 1 Now M392B2G70AM0-Y(F8/H9)(04/05) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free 1066/1333 2 Now M392B2G70BM0-Y(F8/H9/K0)(08/09) 4Gb DDP (2G x4) * 18 Lead Free & Halogen Free 1066/1333/1600 2 Now M392B2G70AM0-Y(F8/H9)(04/05) 4Gb DDP (1G x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now 16GB 1.35V 2Gx72 32GB 1.35V 4Gx72 Notes: 04 = IDT B0 register F8 = DDR3-1066 (7-7-7) 05 = Inphi C0 register H9 = DDR3-1333 (9-9-9) M392B2G70BM0-Y(F8/H9)(08/09) 4Gb DDP (1G x8) * 18 Lead Free & Halogen Free 1066/1333 4 Now M392B4G70BE0-Y(F8/H9)(08) 4Gb QDP (4G x4) * 18 Lead Free & Halogen Free 1066/1333 4 Now 08 = IDT A1 K0 = DDR3-1600 (11-11-11) 09 = Inphi UV GS02 MA = DDR3-1866 (13-13-13) samsung.com/semi/dram 1H 2012 DDR3 SDRAM 5 DRAM DDR3 SDRAM VLP REGISTERED MODULES DDR3 SDRAM UNBUFFERED MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 1GB 1.5V 128Mx64 2GB 1.5V 256Mx64 4GB 1.5V 512Mx64 8GB 1.5V 1024Mx64 M378B2873GB0-C(F8/H9/K0/MA) M378B5673GB0-C(F8/H9/K0/MA) M378B5773CH0-C(F8/H9) M378B5773DH0-C(F8/H9/K0/MA) M378B5273CH0-C(F8/H9) M378B5273DH0-C(F8/H9/K0/MA) M378B1G73AH0-C(F8/H9) M378B1G73BH0-C(F8/H9/K0/MA) 1Gb (128M x8) * 8 1Gb (128M x8) * 16 2Gb (256M x8) * 8 2Gb (256M x8) * 8 2Gb (256M x8) * 16 2Gb (256M x8) * 16 4Gb (512M x8) * 16 4Gb (512M x8) * 16 Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free 1066/1333/1600/1866 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1 2 1 1 2 2 2 2 Now Now Now Now Now Now Now Now DDR3 SDRAM UNBUFFERED MODULES (ECC) Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 1GB 1.5V 128Mx72 2GB 1.5V 256Mx72 4GB 1.5V 512Mx72 8GB 1.5V 1024Mx72 1GB 1.35V 128Mx72 2GB 1.35V 256Mx72 4GB 1.35V 512Mx72 8GB 1.35V 1024Mx72 M391B2873GB0-C(F8/H9/K0/MA) M391B5673GB0-C(F8/H9/K0/MA) M391B5773CH0-C(F8/H9) M391B5773DH0-C(F8/H9/K0/MA) M391B5273CH0-C(F8/H9) M391B5273DH0-C(F8/H9/K0/MA) M391B1G73AH0-C(F8/H9) M391B1G73BH0-C(F8/H9/K0/MA) M391B2873GB0-Y(F8/H9/K0) M391B5673GB0-Y(F8/H9/K0) M391B5773CH0-Y(F8/H9) M391B5773DH0-Y(F8/H9/K0) M391B5273CH0-Y(F8/H9) M391B5273DH0-Y(F8/H9/K0) M391B1G73AH0-Y(F8/H9) M391B1G73BH0-Y(F8/H9/K0) 1Gb (128M x8) * 9 1Gb (128M x8) * 18 2Gb (256M x8) * 9 2Gb (256M x8) * 9 2Gb (256M x8) * 18 2Gb (256M x8) * 18 4Gb (512M x8) * 18 4Gb (512M x8) * 18 1Gb (128M x8) * 9 1Gb (128M x8) * 18 2Gb (256M x8) * 9 2Gb (256M x8) * 9 2Gb (256M x8) * 18 2Gb (256M x8) * 18 4Gb (512M x8) * 18 4Gb (512M x8) * 18 Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free,Flip Chip Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free,Flip Chip Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free 1066/1333/1600/1866 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333/1600 1066/1333/1600 1066/1333 1066/1333/1600 1066/1333 1066/1333/1600 1066/1333 1066/1333/1600 1 2 1 1 2 2 2 2 1 2 1 1 2 2 2 2 Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now NOTES: F8 = DDR3-1066 (7-7-7) H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) DDR3 SDRAM SODIMM MODULES Density Voltage Organization Part Number Composition Compliance Speed (Mbps) Ranks Production 1GB 1.5V 128Mx64 2GB 1.5V 256Mx64 4GB 1.5V 512Mx64 8GB 1.5V 1024Mx64 1GB 1.35V 128Mx64 2GB 1.35V 256Mx64 4GB 1.35V 512Mx64 8GB 1.35V 1024Mx64 M471B2873GB0-C(F8/H9/K0/MA) M471B5673GB0-C(F8/H9/K0/MA) M471B5773CHS-C(F8/H9) M471B5773DH0-C(F8/H9/K0/MA) M471B5273CH0-C(F8/H9) M471B5273DH0-C(F8/H9/K0/MA) M471B5173BH0-C(F8/H9/K0/MA) M471B1G73AH0-C(F8/H9/K0) M471B1G73BH0-C(F8/H9/K0/MA) M471B2873GB0-Y(F8/H9/K0) M471B5673GB0-Y(F8/H9/K0) M471B5773CHS-Y(F8/H9) M471B5773DH0-Y(F8/H9/K0) M471B5273CH0-Y(F8/H9) M471B5273DH0-Y(F8/H9/K0) M471B5173BH0-Y(F8/H9/K0) M471B1G73AH0-Y(F8/H9) M471B1G73BH0-Y(F8/H9/K0) 1Gb (128M x8) * 8 1Gb (128M x8) * 16 2Gb (256M x8) * 8 2Gb (256M x8) * 8 2Gb (256M x8) * 16 2Gb (256M x8) * 16 4Gb (512M x8) * 8 4Gb (512M x8) * 16 4Gb (512M x8) * 16 1Gb (128M x8) * 8 1Gb (128M x8) * 16 2Gb (256M x8) * 8 2Gb (256M x8) * 8 2Gb (256M x8) * 16 2Gb (256M x8) * 16 4Gb (512M x8) * 8 4Gb (512M x8) * 16 4Gb (512M x8) * 16 Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free, Flip Chip Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free Lead Free & Halogen Free 1066/1333/1600/1866 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333/1600/1866 1066/1333 1066/1333/1600/1866 1066/1333/1600/1866 1066/1333/1600 1066/1333 1066/1333/1600 1066/1333 1066/1333/1600 1066/1333/1600 1066/1333 1066/1333/1600 1 2 1 1 2 2 1 2 2 1 2 1 1 2 2 1 2 2 Notes: F8 = DDR3-1066 (7-7-7) 6 DDR3 SDRAM H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) 1H 2012 Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now MA = DDR3-1866 (13-13-13) samsung.com/semi/dram Density Voltage Organization Part Number # Pins-Package Compliance Speed (Mbps) Dimensions Production K4B1G0446F-HC(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B1G0446G-BC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 7.5x11mm Now 7.5x11mm Now 1Gb 1.5V 256M x4 1Gb 1.5V 128M x8 K4B1G0846G-BC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866 1Gb 1.5V 128M x16 K4B1G1646G-BC(F8/H9/K0/MA/NB) 96 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866/2133 7.5x13.3mm Now K4B2G0446C-HC(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B2G0446D-HC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 7.5x11mm Now K4B2G0846C-HC(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B2G0846D-HC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 7.5x11mm Now K4B2G1646C-HC(F8/H9/K0/MA) 96 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 7.5x13.3mm Now K4B4G0446A-HC(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 10x12.5mm Now K4B4G0446B-HC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 10x11mm Now K4B4G0846A-HC(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 10x12.5mm Now 2Gb 1.5V 512M x4 2Gb 1.5V 256M x8 2Gb 1.5V 128M x16 4Gb 1.5V 1G x4 4Gb 1.5V 512M x8 1Gb 1.35V 256M x4 1Gb 1.35V 128M x8 2Gb 2Gb 1.35V 1.35V 512M x4 256M x8 4Gb 1.35V 1G x4 4Gb 1.35V 512M x8 K4B4G0846B-HC(F8/H9/K0/MA) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600/1866 10x11mm Now K4B1G0446F-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B1G0446G-BY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600 7.5x11mm Now K4B1G0846F-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B1G0846G-BY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free, Flip Chip 1066/1333/1600 7.5x11mm Now K4B2G0446C-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B2G0446D-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B2G0846C-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B2G0846D-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 7.5x11mm Now K4B4G0446A-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 10x12.5mm Now K4B4G0446B-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 10x11mm Now K4B4G0846A-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 10x12.5mm Now K4B4G0846B-HY(F8/H9/K0) 78 Ball -FBGA Lead Free & Halogen Free 1066/1333/1600 10x11mm Now NOTES: F8 = DDR3-1066 (7-7-7) H9 = DDR3-1333 (9-9-9) NB = DDR3-2133 (14-14-14) * MA, and NB are available in ES only K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13) DDR2 SDRAM REGISTERED MODULES Density Organization Part Number Composition Compliance Speed (Mbps) Register Rank Production 1GB 128Mx72 M393T2863FBA-C(E6/F7) (128M x8)*9 Lead free 667/800 Y 1 Now 2GB 256Mx72 M393T5660FBA-C(E6/F7) (256M x4)*18 Lead free 667/800 Y 1 Now M393T5663FBA-C(E6/E7) (128M x8)*18 Lead free 667/800 Y 2 Now M393T5160FBA-C(E6/F7) (256M x4)*36 Lead free 667/800 Y 2 4GB 512Mx72 Notes: E6 = PC2-5300 (DDR2-667 @ CL=5) F7 = PC2-6400 (DDR2-800 @ CL=6) E7 = PC2-6400 (DDR2-800 @ CL=5) Now Voltage = 1.8V DDR2 SDRAM VLP REGISTERED MODULES Density Organization Part Number Composition Compliance Speed (Mbps) Register Rank Production 2GB 256Mx72 M392T5660FBA-CE6 (256M x4)*18 Lead free 667 Y 1 Now DDR2 SDRAM FULLY BUFFERED MODULES Density Organization Part Number Composition Compliance Speed (Mbps) Voltage Rank Production 2GB 256Mx72 M395T5663FB4-CE68 (128M x8)*18 Lead free 667 1.8V 2 Now M395T5160FB4-CE68 (256M x4)*36 Lead free 667 1.8V 2 Now (128M x8)*36 Lead free 667 1.8V 4 Now 4GB 512Mx72 Notes: E6 = PC2-5300 (DDR2-667 @ CL=5) M395T5163FB4-CE68 samsung.com/semi/dram Voltage = 1.8V (AMB Voltage = 1.5V) 1H 2012 AMB = IDT L4 DDR3 & DDR2 SDRAM 7 DRAM DDR3 SDRAM COMPONENTS DDR2 SDRAM UNBUFFERED MODULES Density Organization Part Number Composition Compliance Speed (Mbps) Rank Production 1GB 128Mx64 M378T2863FBS-C(E6/F7/E7) (128M x8)*8 Lead free 667/800 1 Now 2GB 256Mx64 M378T5663FB3-C(E6/F7/E7) (128M x8)*16 Lead free 667/800 2 Now Notes: E6 = PC2-5300 (DDR2-667 @ CL=5) E7 = PC2-6400 (DDR2-800 @ CL=5) F7 = PC2-6400 (DDR2-800 @ CL=6) Voltage = 1.8V DDR2 SDRAM UNBUFFERED MODULES (ECC) Density Organization Part Number Composition Compliance Speed (Mbps) Rank Production 1GB 128Mx72 M391T2863FB3-C(E6/F7) (128Mx8)*9 Lead free 667/800 1 Now 2GB 256Mx64 M391T5663FB3-C(E6/F7) (128Mx8)*18 Lead free 667/800 2 Now Notes: E6 = PC2-5300 (DDR2-667 @ CL=5) F7 = PC2-6400 (DDR2-800 @ CL=6) E7 = PC2-6400 (DDR2-800 @ CL=5) Voltage = 1.8V DDR2 SDRAM SODIMM MODULES Density Organization Part Number Composition Compliance Speed (Mbps) Rank Production 1GB 128Mx64 M470T2863FB3-C(E6/F7/E7) (64Mx16)*8 Lead free 667/800 2 Now 2GB 256Mx64 M470T5663FB3-C(E6/F7/E7) (128M x8)*8 Lead free 667/800 2 Now Notes: E6 = PC2-5300 (DDR2-667 @ CL=5) F7 = PC2-6400 (DDR2-800 @ CL=6)) E7 = PC2-6400 (DDR2-800 @ CL=5) Voltage = 1.8V DDR2 SDRAM COMPONENTS Density Organization Part Number # Pins-Package Dimensions Package Speed (Mbps) Production 256Mb 16Mx16 K4T56163QN-HC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free 667/800/1066 Now 128M x4 K4T51043QJ-HC(E6/F7/E7) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800 Now 512Mb 64M x8 K4T51083QJ-HC(E6/F7/E7/F8) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800/1066 Now 1Gb 32M x16 K4T51163QJ-HC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free 667/800/1066 Now 256M x4 K4T1G044QF-BC(E6/F7/E7) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800 Now 128M x8 K4T1G084QF-BC(E6/F7/E7/F8) 60-FBGA 7.5x9.5mm Lead free & Halogen free 667/800/1066 Now 64M x16 K4T1G164QF-BC(E6/F7/E7/F8) 84-FBGA 7.5x12.5mm Lead free & Halogen free 667/800/1066 Now DDR SDRAM COMPONENTS Density Organization Part Number # Pins - Package Speed (Mbps) K4H510438J-LCB3/B0 66-TSOP 266/333 K4H510438J-BCCC/B3 60-FBGA 333/400 K4H510838J-LCCC/B3 66-TSOP 333/400 K4H510838J-BCCC/B3 60-FBGA 333/400 32Mx16 K4H511638J-LCCC/B3 66-TSOP 333/400 64Mx4 K4H560438N-LCB3/B0 66-TSOP 266/333 32Mx8 K4H560838N-LCCC/B3 66-TSOP 333/400 16Mx16 K4H561638N-LCCC/B3 66-TSOP 333/400 128Mb 8Mx16 K4H281638O-LCCC 66-TSOP 400 Notes: B0 = DDR266 (133MHz @ CL=2.5) A2 = DDR266 (133MHz @ Cl=2) B3 = DDR333 (166MHz @ CL=2.5) CC = DDR400 (200MHz @ CL=3) 128Mx4 512Mb 256Mb 64Mx8 SDRAM COMPONENTS Density 256Mb 128Mb Notes: 8 Organization Part Number # Pins - Package Speed (Mbps) Refresh Remarks 64Mx4 K4S560432N-LC(L)75 54-TSOP 133 8K EOL end of 2011 32Mx8 K4S560832N-LC(L)75 54-TSOP 133 8K EOL end of 2011 16Mx16 K4S561632N-LC(L)(75/60) 54-TSOP 133/166 8K EOL end of 2011 16Mx8 K4S280832O-LC(L)75 54-TSOP 133 4K EOL end of 2011 8Mx16 K4S281632O-LC(L)(75/60) 54-TSOP 133/166 4K Voltage: 3.3V All products are Lead Free Speed: PC133 (133MHz CL=3/PC100 CL2) L = Commercial Temp., Low Power For Industrial Temperature, check with SSI Marketing DDR2, DDR & SDRAM COMPONENTS 1H 2012 EOL end of 2011 Banks: 4 samsung.com/semi/dram Type Density 512Mb 1Gb MDDR 2Gb 4Gb 2Gb 4Gb LPDDR2 6Gb 8Gb 16Gb Organization Part Number Package Power DRAM MOBILE DRAM COMPONENTS Production 32Mx16 K4X51163PK-FG(1) 60-FBGA 1.8V Now 16Mx32 K4X51323PK-8G(1) 90-FBGA 1.8V Now 32Mx32 K4X1G323PF-8G(1) 90-FBGA 1.8V Now 64Mx32 K4X2G323PC-8G(1) 90-FBGA 1.8V Now 64Mx32 K4X2G323PD-8G(1) 90-FBGA 1.8V ES Q1'12, CS in Q2'12 x32 (2CS, 2CKE) K4X4G303PC-AG(1) 168-FBGA, 12x12 PoP, DDP 1.8V Now x32 (2CS, 2CKE) K4X4G303PC-7G(1) 240-FBGA, 14x14 PoP, DDP 1.8V Now 1CH x32 K4P2G324EC-AG(1) 168-FBGA, 12x12 PoP, MONO, 1.2V EOL by end of 2012. (LBO '12 June, LTS Dec) 1CH x32 K4P2G324ED-AG(1) 168-FBGA, 12x12 PoP, MONO, 1.2V Now 1CH x32 K4P4G304EC-AG(1) 168-FBGA, 12x12 PoP, DDP, 64Mx32*2 1.2V EOL by end of 2012. (LBO '12 June, LTS Dec) 1CH x32 K4P4G304EC-FG(1) 134-FBGA, 11x11.5 PoP, DDP, 128x16*2 1.2V Now 1CH x32 K4P4G324EB-AG(1,2) 168-FBGA, 12x12 PoP, MONO, 128Mx32 1.2V Now 2CH x32/ch K3PE4E400M-XG(1) 216-FBGA, 12x12 PoP, DDP, 64Mx32*2 1.2V EOL by end of 2012. (LBO '12 June, LTS Dec) 2CH x32/ch K3PE4E400A-XG(1) 240-FBGA, 14x14 PoP, DDP, 64Mx32*2 1.2V EOL by end of 2012. (LBO '12 June, LTS Dec) 2CH x32/ch K3PE4E400P-XG(2) 216FBGA,12x12 PoP, DDP, 64Mx32*2 1.2V Now 2CH x32/ch K3PE4E400D-XGC(2) 220FBGA, 14x14 PoP, DDP, 64Mx32*2 1.2V CS 2CH x32/ch K3PE4E400K-XG(2) 240-FBGA, 14x14 PoP, DDP, 64Mx32*2 1.2V Now 2CH x32/ch K3PE8E400C-XG(2) 240FBGA, 14x14 PoP, TDP 1.2V Now 2CH x32/ch K3PE4E700A-XG(2) 220FBGA, 14x14 PoP, DDP 1.2V Now 1CH x32 K4P8G304EB-FG(1,2) 134-FBGA, 11x11.5 PoP, DDP, 128x16*4 1.2V Now 1CH x32 K4P8G304EB-AG(1) 168-FBGA, 12x12 PoP, DDP, 128x16*4 1.2V Now 1CH x32 K4P8G304EB-GG(2) 216FBGA, 12x12 PoP, DDP, 128x16*4 1.2V ES 2CH x32/ch K3PE7E700M-XG(2) 216-FBGA, 12x12 PoP, DDP, 128Mx32*2 1.2V Now 2CH x32/ch K3PE7E700D-XG(2) 220-FBGA, 14x14 PoP, DDP, 128Mx32*2 1.2V Now 1CH x32 K4PAG304EB-FG(2) 134-FBGA, 11x11.5 PoP, QDP 1.2V Now 2CH x32/ch K3PE0E000M-XG(2) 216-FBGA, 12x12 PoP, QDP, 128Mx32*4 1.2V Now 2CH x32/ch K3PE0E000A-XG(2) 220-FBGA, 14x14 PoP, QDP, 128Mx32*4 1.2V Now 2CH x32/ch K3PE0E000B-XG(2) 240-FBGA, 14x14 PoP, QDP, 128Mx32*4 1.2V Now Notes: (1,2) Speed: Mobile DDR (1) 60: 166MHz, CL3 (1) 75: 133MHz, CL3 (1) D8: 200MHz, CL3 LPDDR2 (2) C1: 800Mbps All products offered at Extended, Low, i-TCSR & PASR & DS (Temp, Power) (2) C2: 1066Mbps All products offered at Extended, Low, i-TCSR & PASR & DS (Temp, Power) GRAPHICS DRAM COMPONENTS Type Density 2Gb Organization 64Mx32 GDDR5 1Gb 32Mx32 Part Number Package VDD/VDDQ Speed Bin (MHz) Production K4G20325FD-FC(04/03/28) 170-FBGA 1.5V/1.5V 1250/1500/1750 Now K4G20325FD-FC(04/03) 170-FBGA 1.35V/1.35V 900/1050 Now K4G20325FC-HC(05/04/03) 170-FBGA 1.5V/1.5V 1000/1250/1500 Now K4G20325FC-HC04 170-FBGA 1.35V/1.35V 900 Now K4G10325FG-HC03 170-FBGA 1.5/1.5V (1.6V/1.6V) 1500 Now K4G10325FG-HC(05/04) 170-FBGA 1.5V/1.5V 1000/1250 Now K4G10325FG-HC(04/03) 170-FBGA 1.35V/1.35V 900/1050 Now 1Gb 32Mx32 K4J10324KG-HC(14/1A) 136-FBGA 1.8V/1.8V 700/1000 Now 512Mb 16Mx32 K4J52324KI-HC(1) 136-FBGA 1.8/1.8V 700/800/1000 Now 4Gb 256Mx16 K4W4G1646B-HC(12/11/1A) 96-FBGA 1.5V/1.5V 800/933/1066 Now 2Gb 128Mx16 K4W2G1646C-HC(15/12/11/1A) 96-FBGA 1.5V/1.5V 667/800/900/1000 Now 1Gb 64Mx16 K4W1G1646G-BC(15/12/11/1A/08) 96-FBGA 1.5V/1.5V 667/800/933/1066/1200 Now gDDR2 1Gb 64Mx16 K4N1G164QF-BC(1) 84-FBGA 1.8/1.8V 400/500 Notes: Package (1) Speeds (clock cycle - speed bin) H: FBGA (Halogen Free & Lead Free) B: FBGA (Halogen Free & Lead Free) 03: 0.3ns (3000MHz) 04: 0.4ns (2500MHz) 05: 0.5ns (2000MHz) 5C: 0.555 (1800MHz) GDDR3 gDDR3 samsung.com/semi/dram 1H 2012 08: 0.83ns (1200MHz) 1A: 1ns (1000MHz GDDR3) 1A: 1ns (1066MHz gDDR3) 11: 1.1ns (933MHz) 12: 1.25ns (800MHz) 14: 1.429ns (700MHz) 20: 2.0ns (500MHz) 25: 2.5ns (400MHz) Mobile & Graphics DRAM Components 9 COMPONENT DRAM ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 K 4 T XX XX X X X X X XX Speed Temp & Power Package Type Revision Interface (VDD, VDDQ) Number of Internal Banks SAMSUNG Memory DRAM DRAM Type Density Bit Organization 1. Memory (K) 2. DRAM: 4 3. DRAM Type B: DDR3 SDRAM D: GDDR SDRAM G: GDDR5 SDRAM H: DDR SDRAM J: GDDR3 SDRAM M: Mobile SDRAM N: SDDR2 SDRAM S: SDRAM T: DDR SDRAM U: GDDR4 SDRAM V: Mobile DDR SDRAM Power Efficient Address W: SDDR3 SDRAM X: Mobile DDR SDRAM Y: XDR DRAM Z: Value Added DRAM 4. Density 10: 1G, 8K/32ms 16: 16M, 4K/64ms 26: 128M, 4K/32ms 28: 128M, 4K/64ms 32: 32M, 2K/32ms 50: 512M, 32K/16ms 51: 512M, 8K/64ms 52: 512M, 8K/32ms 54: 256M, 16K/16ms 55: 256M, 4K/32ms 56: 256M, 8K/64ms 62: 64M, 2K/16ms 64: 64M, 4K/64ms 68: 768M, 8K/64ms 1G: 1G, 8K/64ms 2G: 2G, 8K/64ms 4G: 4G, 8K/64ms 5. Bit Organization 02: x2 04: x4 06: x4 Stack (Flexframe) 07: x8 Stack (Flexframe) 10 DRAM Ordering Information 08: x8 15: x16 (2CS) 16: x16 26: x4 Stack (JEDEC Standard) 27: x8 Stack (JEDEC Standard) 30: x32 (2CS, 2CKE) 31: x32 (2CS) 32: x32 6. # of Internal Banks 2: 2 Banks 3: 4 Banks 4: 8 Banks 5: 16 Banks 7. Interface ( VDD, VDDQ) 2: LVTTL, 3.3V, 3.3V 4: LVTTL, 2.5V, 2.5V 5: SSTL-2 1.8V, 1.8V 6: SSTL-15 1.5V, 1.5V 8: SSTL-2, 2.5V, 2.5V A: SSTL, 2.5V, 1.8V F: POD-15 (1.5V,1.5V) H: SSTL_2 DLL, 3.3V, 2.5V M: LVTTL, 1.8V, 1.5V N: LVTTL, 1.5V, 1.5V P: LVTTL, 1.8V, 1.8V Q: SSTL-2 1.8V, 1.8V R: SSTL-2, 2.8V, 2.8V U: DRSL, 1.8V, 1.2V 8. Revision A: 2nd Generation B: 3rd Generation C: 4th Generation D: 5th Generation E: 6th Generation F: 7th Generation G: 8th Generation H: 9th Generation I: 10th Generation J: 11th Generation K: 12th Generation M: 1st Generation N: 14th Generation Q: 17th Generation 1H 2012 9. Package Type DDR2 DRAM L: TSOP II (Lead-free & Halogen-free) H: FBGA (Lead-free & Halogen-free) F: FBGA for 64Mb DDR (Lead-free & Halogen-free) 6: sTSOP II (Lead-free & Halogen-free) T: TSOP II N: sTSOP II G: FBGA U: TSOP II (Lead-free) V: sTSOP II (Lead-free) Z: FBGA (Lead-free) DDR2 SDRAM Z: FBGA (Lead-free) J: FBGA DDP (Lead-free) Q: FBGA QDP (Lead-free) H: FBGA (Lead-free & Halogen-free) M: FBGA DDP (Lead-free & Halogen-free) E: FBGA QDP (Lead-free & Halogen-free) T: FBGA DSP (Lead-free & Halogen-free, Thin) DDR3 SDRAM Z: FBGA (Lead-free) H: FBGA (Halogen-free & Lead-free) Graphics Memory Q: TQFP U: TQFP (Lead Free) G: 84/144 FBGA V: 144 FBGA (Lead Free) Z: 84 FBGA(Lead Free) T: TSOP L: TSOP (Lead Free) A: 136 FBGA B: 136 FBGA(Lead Free) H: FBGA(Hologen Free & Lead Free) E: 100 FBGA(Hologen Free & Lead Free) SDRAM L TSOP II (Lead-free & Halogen-free) N: STSOP II T: TSOP II U: TSOP II (Lead-free) V: sTSOP II (Lead-free) samsung.com/semi/dram 1 2 3 4 5 6 7 8 9 10 11 K 4 T XX XX X X X X X XX Speed Temp & Power Package Type Revision Interface (VDD, VDDQ) Number of Internal Banks SAMSUNG Memory DRAM DRAM Type Density Bit Organization XDR DRAM J: BOC(LF) P: BOC Mobile DRAM Leaded / Lead Free G/A: 52balls FBGA Mono R/B: 54balls FBGA Mono X /Z: 54balls BOC Mono J /V: 60(72)balls FBGA Mono 0.5pitch L /F: 60balls FBGA Mono 0.8pitch S/D: 90balls FBGA Monolithic (11mm x 13mm) F/H: Smaller 90balls FBGA Mono Y/P: 54balls CSP DDP M/E: 90balls FBGA DDP 10. Temp & Power - COMMON (Temp, Power) C: Commercial, Normal (0'C - 95'C) & Normal Power C: (Mobile Only) Commercial (-25 ~ 70'C), Normal Power J: Commercial, Medium L: Commercial, Low (0'C - 95'C) & Low Power L: (Mobile Only) Commercial, Low, i-TCSR F: Commercial, Low, i-TCSR & PASR & DS E: Extended (-25~85'C), Normal N: Extended, Low, i-TCSR G: Extended, Low, i-TCSR & PASR & DS I: Industrial, Normal (-40'C - 85'C) & Normal Power P: Industrial, Low (-40'C - 85'C) & Low Power H: Industrial, Low, i-TCSR & PASR & DS 11. Speed (Wafer/Chip Biz/BGD: 00) DDR SDRAM CC: DDR400 (200MHz @ CL=3, tRCD=3, tRP=3) B3: DDR333 (166MHz @ CL=2.5, tRCD=3, tRP=3) *1 A2: DDR266 (133MHz @ CL=2 , tRCD=3, tRP=3) B0: DDR266 (133MHz @ CL=2.5, tRCD=3, tRP=3) Note 1: "B3" has compatibility with "A2" and "B0" samsung.com/semi/dram DRAM COMPONENT DRAM ORDERING INFORMATION DDR2 SDRAM CC: DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3) D5: DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4) E6: DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5) F7: DDR2-800 (400MHz @ CL=6, tRCD=6, tRP=6) E7: DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5) 1 : 1.1ns (900MHz) 55: 5.5ns (183MHz) 12: 1.25ns (800MHz) 60: 6.0ns (166MHz) 14: 1.4ns (700MHz) 16: 1.6ns (600MHz) DDR3 SDRAM F7: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6) F8: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7) G8: DDR3-1066 (533MHz @ CL=8, tRCD=8, tRP=8) H9: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9) K0: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11) XDR DRAM A2: 2.4Gbps, 36ns, 16Cycles B3: 3.2Gbps, 35ns, 20Cycles C3: 3.2Gbps, 35ns, 24Cycles C4: 4.0Gbps, 28ns, 24Cycles DS: Daisychain Sample Graphics Memory 18: 1.8ns (550MHz) 04: 0.4ns (2500MHz) 20: 2.0ns (500MHz) 05: 0.5ns (2000MHz) 22: 2.2ns (450MHz) 5C: 0.56ns (1800MHz) 25: 2.5ns (400MHz) 06: 0.62ns (1600MHz) 2C: 2.66ns (375MHz) 6A: 0.66ns (1500MHz) 2A: 2.86ns (350MHz) 07: 0.71ns (1400MHz) 33: 3.3ns (300MHz) 7A: 0.77ns (1300MHz) 36: 3.6ns (275MHz) 08: 0.8ns (1200MHz) 40: 4.0ns (250MHz) 09: 0.9ns (1100MHz) 45: 4.5ns (222MHz) 1 : 1.0ns (1000MHz) 50/5A: 5.0ns (200MHz) 1H 2012 SDRAM (Default CL=3) 50: 5.0ns (200MHz CL=3) 60: 6.0ns (166MHz CL=3) 67: 6.7ns 75: 7.5ns PC133 (133MHz CL=3) Mobile-SDRAM 60: 166MHz, CL 3 75: 133MHz, CL 3 80: 125MHz, CL 3 1H: 105MHz, CL 2 1L: 105MHz, CL 3 15: 66MHz, CL 2 & 3 Mobile-DDR C3: 133MHz, CL 3 C2: 100MHz, CL 3 C0: 66MHz, CL 3 Note: All of Lead-free or Halogen-free product are in compliance with RoHS DRAM Ordering Information 11 Module DRAM Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 13 M X XX T XX X X X X X X XX X AMB Vendor Speed Temp & Power PCB Revision Package Component Revision SAMSUNG Memory DIMM Data bits DRAM Component Type Depth Number of Banks Bit Organization 1. Memory Module: M 2. DIMM Type 3: DIMM 4: SODIMM 3. Data bits 12: x72 184pin Low Profile Registered DIMM 63: x63 PC100 / PC133 SODIMM with SPD for 144pin 64: x64 PC100 / PC133 SODIMM with SPD for 144pin (Intel/JEDEC) 66: x64 Unbuffered DIMM with SPD for 144pin/168pin (Intel/JEDEC) 68: x64 184pin Unbuffered DIMM 70: x64 200pin Unbuffered SODIMM 71: x64 204pin Unbuffered SODIMM 74: x72 /ECC Unbuffered DIMM with SPD for 168pin (Intel/JEDEC) 77: x72 /ECC PLL + Register DIMM with SPD for 168pin (Intel PC100) 78: x64 240pin Unbuffered DIMM 81: x72 184pin ECC unbuffered DIMM 83: x72 184pin Registered DIMM 90: x72 /ECC PLL + Register DIMM 91: x72 240pin ECC unbuffered DIMM 92: x72 240pin VLP Registered DIMM 93: x72 240pin Registered DIMM 95: x72 240pin Fully Buffered DIMM with SPD for 168pin (JEDEC PC133) 4. DRAM Component Type B: DDR3 SDRAM (1.5V VDD) L: DDR SDRAM (2.5V VDD) S: SDRAM T: DDR2 SDRAM (1.8V VDD) 5. Depth 9. Package 09: 8M (for 128Mb/512Mb) 17: 16M (for 128Mb/512Mb) 16: 16M 28: 128M 29: 128M (for 128Mb/512Mb) 32: 32M 33: 32M (for 128Mb/512Mb) 51: 512M 52: 512M (for 512Mb/2Gb) 56: 256M 57: 256M (for 512Mb/2Gb) 59: 256M (for 128Mb/512Mb) 64: 64M 65: 64M (for 128Mb/512Mb) 1G: 1G 1K: 1G (for 2Gb) 6. # of Banks in Comp. & Interface 1: 4K/64mxRef., 4Banks & SSTL-2 2 : 8K/ 64ms Ref., 4Banks & SSTL-2 2: 4K/ 64ms Ref., 4Banks & LVTTL (SDR Only) 5: 8K/ 64ms Ref., 4Banks & LVTTL (SDR Only) 5: 4Banks & SSTL-1.8V 6: 8Banks & SSTL-1.8V 7. Bit Organization 0: x 4 3: x 8 4: x16 6: x 4 Stack (JEDEC Standard) 7: x 8 Stack (JEDEC Standard) 8: x 4 Stack 9: x 8 Stack 8. Component Revision A: 2nd Gen. B: 3rd Gen. C: 4th Gen. D: 5th Gen. E: 6th Gen. F: 7th Gen. G: 8th Gen. M: 1st Gen. Q: 17th Gen. 12 DRAM Ordering Information E: FBGA QDP (Lead-free & Halogen-free) G: FBGA H: FBGA (Lead-free & Halogen-free) J: FBGA DDP (Lead-free) M: FBGA DDP (Lead-free & Halogen-free) N: sTSOP Q: FBGA QDP (Lead-free) T: TSOP II (400mil) U: TSOP II (Lead-Free) V: sTSOP II (Lead-Free) Z: FBGA(Lead-free) 10. PCB Revision 0: Mother PCB 1: 1st Rev 2: 2nd Rev. 3: 3rd Rev. 4: 4th Rev. A: Parity DIMM S: Reduced PCB U: Low Profile DIMM 11. Temp & Power C: Commercial Temp. (0C ~ 95C) & Normal Power L: Commercial Temp. (0C ~ 95C) & Low Power 12. Speed CC: (200MHz @ CL=3, tRCD=3, tRP=3) D5: (266MHz @ CL=4, tRCD=4, tRP=4) E6: (333MHz @ CL=5, tRCD=5, tRP=5) F7: (400MHz @ CL=6, tRCD=6, tRP=6) E7: (400MHz @ CL=5, tRCD=5, tRP=5) F8: (533MHz @ CL=7, tRCD=7, tRP=7) G8: (533MHz @ CL=8, tRCD=8, tRP=8) H9: (667MHz @ CL=9, tRCD=9, tRP=9) K0: (800MHz @ CL=10, tRCD=10, tRP=10) 7A: (133MHz CL=3/PC100 CL2) 13. AMB Vendor for FBDIMM 0, 5: Intel 1, 6, 8: IDT 9: Montage Note: All of Lead-free or Halogen-free product are in compliance with RoHS 1H 2012 samsung.com/semi/dram Density Technology 32nm DDR 128Gb ODP 32nm SDR 32Gb DDP 64Gb QDP 32nm SDR 32nm DDR 32Gb DDP 32nm SDR 16Gb Mono 32nm SDR 16Gb QDP 42nm 8Gb DDP 42nm 4Gb 42nm 2Gb 42nm 1Gb 42nm Part Number Package Type Org. Vol(V) Status K9QDGD8S5M-HCB* BGA x8 1.8 MP K9QDGD8U5M-HCB* BGA x8 3.3 MP K9QDG08U5M-HCB* BGA x8 3.3 MP K9WCGD8S5M-HCB* BGA x8 1.8 MP K9WCGD8U5M-HCB* BGA x8 3.3 MP K9WCG08U5M-HCB* BGA x8 3.3 MP K9WCG08U5M-HIB* BGA x8 3.3 MP K9KBGD8S1M-HCB* BGA x8 1.8 MP K9KBGD8U1M-HCB* BGA x8 3.3 MP K9KBGD8U1M-HIB* BGA x8 3.3 MP K9KBG08U1M-HCB* BGA x8 3.3 MP K9KBG08U1M-HIB* BGA x8 3.3 MP K9FAG08U0M-HCB* BGA x8 3.3 MP K9FAG08U0M-HIB* BGA x8 3.3 MP K9WAG08U1D-SCB0* TSOP1 x8 3.3 MP K9WAG08U1D-SIB0* TSOP1 x8 3.3 MP K9K8G08U0D-SCB0* TSOP-LF/HF x8 3.3 MP K9K8G08U0D-SIB0* TSOP-LF/HF x8 3.3 MP K9F4G08U0D-SCB0* TSOP1 HF & LF x8 3.3 MP K9F4G08U0D-SIB0* TSOP1 HF & LF x8 3.3 MP K9F2G08U0C-SCB0* TSOP-LF/HF x8 3.3 MP K9F2G08U0C-SIB0* TSOP-LF/HF x8 3.3 MP K9F1G08U0D-SCB0* TSOP-LF/HF x8 3.3 MP K9F1G08U0D-SIB0* TSOP-LF/HF x8 3.3 MP Please contact your local Samsung sales representative for latest product offerings. F L A SH - SSD SLC Flash Note: All parts are lead free MLC Flash Type 2bit 3bit Density Technology Part Number Package Type Org. Vol(V) Status 256Gb ODP 32nm Ep-MLC K9PFGD8U5M-HCE0000 BGA x8 3.3 MP 128Gb QDP 32nm Ep-MLC K9HDGD8U5M-HCE0000 BGA x8 3.3 MP 64Gb DDP 32nm Ep-MLC K9LCGD8U1M-HCE0000 BGA x8 3.3 MP 512Gb ODP 21nm Ep-MLC K9PHGY8S5A-HCE0000 BGA x8 3.3 MP 256Gb QDP 21nm Ep-MLC K9HFGY8S5A-HCE0000 BGA x8 3.3 MP 128Gb DDP 21nm Ep-MLC K9LDGY8S1A-HCE0000 BGA x8 3.3 MP 256Gb QDP 3bit_27nm DDR K9CFGD8U1M-SCB* TSOP x8 3.3 MP 128Gb DDP 3bit_27nm DDR K9BDGD8U0M-SCB* TSOP x8 3.3 MP 64Gb mono 3bit_27nm DDR K9ACGD8U0M-SCB* TSOP x8 3.3 MP 32Gb mono 3bit_27nm DDR K9ABGD8U0B-SCB* TSOP x8 3.3 MP Please contact your local Samsung sales representative for latest product offerings. samsung.com/semi/flash 1H 2012 Note: All parts are lead-free & halogen-free SLC & MLC FLASH 13 SD and MicroSD FLASH CARDS Application SD Cards uSD Cards Density Part Number 2GB MMAGF02GWFCA-2MN00 4GB MMBTF04GWBCA-QME00 8GB MMBTF08GWBCA-RME00 16GB MMBTF16GWBCA-RME00 32GB MMBTF32GWBCA-SAB00 2GB MMAGR02GUFCA-2MN00 4GB MMBTR04GUBCA-2ME00 8GB MMBTR08GUBCA-2ME00 16GB MMBTR16GUBCA-2ME00 32GB MMBTR32GUBCA-2AB00 Please contact your local Samsung sales representative for part numbers and latest product offerings. moviNANDTM (eMMC) Density Flash Part Number mmC Version Package Type Org. Vol (V) Status 2GB 16Gb*1 KLM2G1HE3F-B001xxx v4.41 11.5x13 BGA x8 1.8/3.3 MP 4GB 32Gb*1 KLM4G1FE3B-B001xxx v4.41 11.5x13 BGA x8 1.8/3.3 MP 8GB 32Gb*2 KLM8G2FE3B-B001xxx v4.41 11.5x13 BGA x8 1.8/3.3 MP 16GB 64Gb*2 KLMAG2GE4A-A001xxx v4.41 12x16 BGA x8 1.8/3.3 MP 16GB 32Gb*4 KLMAG4FE3B-A001xxx v4.41 11.5x13 BGA x8 1.8/3.3 MP 32GB 64Gb*4 KLMBG4GE4A-A001xxx v4.41 12x16 BGA x8 1.8/3.3 MP 64GB 64Gb*8 KLMCG8GE4A-A001xxx v4.41 12x16 BGA x8 1.8/3.3 MP Please contact your local Samsung sales representative for part numbers and latest product offerings. SOLID STATE DRIVES (SSD) Interface Size 2.5" 7mmT Connector Thin SATA Controller PM830 Component 32Gb SATA 6Gb/s - MLC mSATA SATA 3Gb/s - E-MLC 2.5" 15mmT PCIe Thin SATA PM830 SM825 32Gb 32Gb Density Part Number Comments 64GB MZ7PC064HADR-00000 Mass production 128GB MZ7PC128HAFU-00000 Mass production 256GB MZ7PC256HAFU-00000 Mass production 512GB MZ7PC512HAGH-00000 Mass production 32GB MZMPC032HBCD-00000 Mass production 64GB MZMPC064HBDR-00000 Mass production 128GB MZMPC128HBFU-00000 Mass production 256GB MZMPC256HBGJ-00000 Mass production 100GB MZ5EA100HMDR-00003 Mass production 200GB MZ5EA200HMDR-00003 Mass production 400GB MZ5EA400HMFP-00003 Mass production Please contact your local Samsung sales representative for latest product offerings. Note: All parts are lead free 14 SD/MicroSD Flash, moviNAND & SSD 1H 2012 samsung.com/semi/flash 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 K 9 X X X X X X X X - X X X X Pre-Program Version Customer Bad Block Temp Package --Generation Mode SAMSUNG Memory NAND Flash Small Classification Density Density Organization Organization Vcc 1. Memory (K) 2. NAND Flash : 9 3. Small Classification (SLC : Single Level Cell, MLC : Multi Level Cell) 7 : SLC moviNAND 8 : MLC moviNAND F : SLC Normal G : MLC Normal H : MLC QDP K : SLC DDP L : MLC DDP M : MLC DSP N : SLC DSP P : MLC 8 Die Stack Q : SLC 8 Die Stack S : SLC Single SM T : SLC SINGLE (S/B) U : 2 Stack MSP W : SLC 4 Die Stack 4~5. Density 12 : 512M 56 : 256M 1G : 1G 2G : 2G 4G : 4G 8G : 8G AG : 16G BG : 32G CG : 64G DG : 128G EG : 256G LG : 24G NG : 96G ZG : 48G 00 : NONE 6~7. Organization 00 : NONE 08 : x8 16 : x16 samsung.com/semi/flash 8. Vcc A : 1.65V~3.6V B : 2.7V (2.5V~2.9V) C : 5.0V (4.5V~5.5V) D : 2.65V (2.4V~2.9V) E : 2.3V~3.6V R : 1.8V (1.65V~1.95V) Q : 1.8V (1.7V~1.95V) T : 2.4V~3.0V U : 2.7V~3.6V V : 3.3V (3.0V~3.6V) W : 2.7V~5.5V, 3.0V~5.5V 0 : NONE 9. Mode 0 : Normal 1 : Dual nCE & Dual R/nB 3 : Tri /CE & Tri R/B 4 : Quad nCE & Single R/nB 5 : Quad nCE & Quad R/nB 9 : 1st block OTP A : Mask Option 1 L : Low grade 13. Temp C : Commercial I : Industrial 0 : NONE (Containing Wafer, CHIP, BIZ, Exception handling code) 14. Customer Bad Block B : Include Bad Block D : Daisychain Sample L : 1~5 Bad Block N : ini. 0 blk, add. 10 blk S : All Good Block 0 : NONE (Containing Wafer, CHIP, BIZ, Exception handling code) 15. Pre-Program Version 0 : None Serial (1~9, A~Z) 10. Generation M : 1st Generation A : 2nd Generation B : 3rd Generation C : 4th Generation D : 5th Generation 11. " ----" 12. Package A : COB B : FBGA (Halogen-Free, Lead-Free) C : CHIP BIZ D : 63-TBGA F : WSOP (Lead-Free) G : FBGA H : TBGA (Lead-Free) I : ULGA (Lead-Free) (12*17) J : FBGA (Lead-Free) L : ULGA (Lead-Free) (14*18) M : TLGA N : TLGA2 P : TSOP1 (Lead-Free) Q : TSOP2 (Lead-Free) S : TSOP1 (Halogen-Free, Lead-Free) T : TSOP2 U : COB (MMC) V : WSOP W : Wafer Y : TSOP1 Z : WELP (Lead-Free) 1H 2012 15 F L A SH - SSD FLASH Product Ordering Information Samsung has a vast portfolio of MCP products for a variety of solutions, such as mobile phones, PMPs, and tablet computers. The following illustration shows Samsung's lineup of MCP memory solutions, which can be deployed in almost any application. Samsung MCP products' suite with different values and types of RAM and ROM ROM eMCP=eMMC+LPDDR1 or LPDDR2 64GB 32GB 16GB 8GB 4GB 2GB NAND + LPDDR1 8G 4G 2G 1G 32 M 64M 128M 256M 512M 1G 2G 4G 6G 8G RAM mSDR LPDDR1 LPDDR2 16 Multi-Chip Packages 1H 2012 samsung.com/semi/mcp MCP: NAND + MDDR Memory NAND Density DRAM Density/Organization Voltage (NAND-DRAM) Package 256Mb (x16) 1.8V - 1.8V 130FBGA 512Mb (x16) 1.8V - 1.8V 130FBGA 2Gb (x16) 1Gb (x16) 1.8V - 1.8V 130FBGA/137FBGA 2Gb (x16) 1Gb (x32) 1.8V - 1.8V 130FBGA/137FBGA 2Gb (x32) 1.8V - 1.8V 137FBGA 2Gb*2 (x32, 2CS/2CKE) 1.8V - 1.8V 137FBGA 2Gb*2 (x32, 2CS/2CKE) 1.8V - 1.8V 137FBGA 1Gb (x16) NAND & MDRAM 4Gb (x16) 4Gb*2 (x16) Memory moviNAND Density DRAM Density/Organization Voltage Package 4GB 4Gb*2 (x32, 1ch, 2CS) 1.8V - 1.8V 162FBGA 8GB 4Gb*2 (x32, 1ch, 2CS) 1.8V - 1.8V 186FBGA 16GB 4Gb*2 (x32, 1ch, 2CS) 1.8V - 1.8V 186FBGA 32GB 4Gb*2 (x32, 1ch, 2CS) 1.8V - 1.8V 186FBGA 64GB 4Gb*2 (x32, 1ch, 2CS) 1.8V - 1.8V 186FBGA DRAM Density/Organization Voltage Package 512Mb (x32) 1.8V - 1.8V 153FBG MCP MCP: moviNAND + LPDDR2 MCP: moviNAND + MDDR Memory moviNAND Density 4GB moviNAND & MDRAM 2Gb*2 (x32, 2CS/CKE) 1.8V - 1.8V 153FBGA 512Mb (x32) 1.8V - 1.8V 169FBGA 2Gb*2 (x32, 2ch, 2CS/CKE) 1.8V - 1.8V 169FBGA 16GB 512Mb (x32) 1.8V - 1.8V 169FBGA 32GB 512Mb (x32) 1.8V - 1.8V 169FBGA 64GB 512Mb(x32) 1.8V - 1.8V 169FBGA 8GB samsung.com/semi/mcp 1H 2012 Multi-Chip Packages 17 Samsung Solid State Drives Data Center EDITION High-Write Environments Client/Mobile EDITION High-Read Environments Samsung SM825 Samsung PM830 2.5 inches 2.5 inches mSATA Capacity (GB) 100, 200, 400 64, 128, 256, 512 32, 64, 128, 256 Host Interface SATA Gen 2.0 - 3Gb/s SATA Gen 3.0 - 6Gb/s E-MLC 30nm-class MLC 20nm-class AES-256 AES-256 2 mm hours 1.5 mm hours 1 in 1017 1 in 1015 Active: 1.8W Idle: 1.3W Active: 0.127W Idle: 0.078W Up to 7,000TBW Up to 60-1250TBW Yes No Sequential R/W (MB/s) 250 / 220 500 / 400 500 / 400 Random R/W (IOPs) 43K / 11K 80K / 36K 50K / 29K 100 x 69.85 x 15mm 100 x 69.85 x 7mm 50.95 x 30 x 3.8mm 140 -146g 61g - 62.5g 9 - 10g Form Factor Flash Encryption MTBF Uncorrectable Bit Error Rate (UBER) Power Consumption Write Endurance (Terabytes Written) Cache Power Protection Physical Dimensions Weight 1 mm hours Up to 30-60TBW Which SSD is right for you? For more information, email: SSD@ssi.samsung.com 18 SSDs 1H 2012 samsung.com/us/business/ssd SOLID STATE DRIVES (SSD) Interface Size 2.5" 7mmT Connector Thin SATA Controller PM830 Component 32Gb SATA 6Gb/s - MLC mSATA SATA 3Gb/s - E-MLC 2.5" 15mmT PCIe PM830 Thin SATA SM825 32Gb 32Gb Density Part Number Comments 64GB MZ7PC064HADR-00000 Mass production 128GB MZ7PC128HAFU-00000 Mass production 256GB MZ7PC256HAFU-00000 Mass production 512GB MZ7PC512HAGH-00000 Mass production 32GB MZMPC032HBCD-00000 Mass production 64GB MZMPC064HBDR-00000 Mass production 128GB MZMPC128HBFU-00000 Mass production 256GB MZMPC256HBGJ-00000 Mass production 100GB MZ5EA100HMDR-00003 Mass production 200GB MZ5EA200HMDR-00003 Mass production 400GB MZ5EA400HMFP-00003 Mass production Please contact your local Samsung sales representative for latest product offerings. Note: All parts are lead free Optical SmartHub Interface Speed Type Loading Lightscribe Model Wi-Fi DVD Write 8X Slim Tray X SE-208BW Blu-ray Slim Interface SATA Speed Type Loading Lightscribe Model BD Combo 6X Slim Tray X SN-406AB BD Writer 6X Slim Tray X SN-506AB Model Interface Speed Type Loading Lightscribe USB 2.0 BD Writer 6X Slim Tray X Interface Speed Type Loading Lightscribe Model SATA DVD Write 22X H/H Tray X SH-222BB Model STOR AGE Blu-ray writer Slim external SE-506AB SE-506BB DVD-W H/H DVD-W SLIM Interface Speed Type Loading Lightscribe SATA DVD Write 8X Slim Tray X SN-208BB SN-208DB DVD-W Slim External Interface USB 2.0 Speed DVD Write 8X samsungodd.com Type Loading Lightscribe Model Ultra Slim Tray X SE-218BB Slim Tray X SE-208AB 1H 2012 OPTICAL SMARTHUB & DVD 19 DID Product Classification E-DID: Exclusive DID Outdoor: High Luminance Super Narrow 1500 - 2000nit Wall-mounted Narrow P-DID: Performance DID Thin/Light (Edge LED) Narrow Black Bezel B-DID: Basic DID Large Format Display 70" / 82" Landscape / Portrait convertible Why DID Instead of TV? Commercial (DID) Consumer (TV) Warranty 18 months to 2 years 90 days to 1 year Reliability Designed for continuous use in different environments Turned on for 20 hours + Variety of temperatures & location Designed for in-home use in controlled environment Turned on for 6-8 hours In-home living room Picture Quality Designed for PC signals LCD backlight covers a wider color spectrum necessary for PC source integration giving better picture quality Designed for TV signals Location Can be oriented in either portrait or landscape mode Can only be oriented in landscape mode Product Segmentation HEAVY USE E-DID: Exclusive All features of P-DID plus Specialty: SNB, High Brightness Robust design P-DID: Performance All features of B-DID plus Narrow & Black Bezel Typ. Brightness: 700 (cd/m2) B-DID: Basic Landscape/Portrait High reliability Pol. (Haze 44%) Long lifetime: more than 2 years Professional Outdoor Events Billboard * Control Room * Simulation * Scoreboard * Sports Broadcasting * Billboard Entertainment Transportation Communication Rental * Casino * Theatre * Poster * Menu * Airport * Train/Bus Station * Conference Room * Rental * Staging Commercial Education * Kiosk * Mart Board * E-Board LIGHT USE Product Segmentation Type Abbr Warranty Bezel Suggested Run Time Brightness Usage Applications Pricing E-DID Exclusive 2 years Narrow and Super Narrow 20 hours + 450 to 2000 nits Heavy Outdoor, Video Walls High-price range P-DID Performance 2 years Narrow 20 hours + 600/700 nits Medium Semi-Outdoor Mid-price range B-DID Basic 18 months Normal 12 hours 450 nits Light Indoor, e-Board Low-price range; comparable to consumer panels 20 DID PRODUCT CLASSIFICATION 1H 2012 samsung.com/us/lcdpanels Samsung Digital Information Display (DID) Panel Lineup E-DID P-DID B-DID Current Model Size Model resolution Bezel Backlight Brightness (typical) Contrast Ratio Response Time Frequency MP* Comment LTI460AA03 46" HD Narrow + Black CCFL 1500 nits 3,000:1 8ms 60Hz Now High Bright LTI460HN03 46" FHD Narrow + Black CCFL 1500 nits 3,000:1 8ms 60Hz Now High Bright, Hi Temp LC, 1/4 Pol. LTI460HN01 46" FHD Super narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 5.7mm Active to Active LTI460AA04 46" HD Super narrow CCFL 700 nits 3,000:1 8ms 60Hz Now 7.3mm Active to Active LTI460AA05 46" HD Super narrow CCFL 450 nits 4,000:1 8ms 60Hz Now 7.3mm Active to Active LTI550HN01 55" FHD Super narrow D-LED 700 nits 3,000:1 8ms 60Hz Now 5.7mm Active to Active LTI700HD02 70" FHD Normal D-LED 2000 nits 2,500:1 8ms 60Hz Now High Bright LTI400HA02 40" FHD Narrow CCFL 700 nits 3,000:1 8ms 60Hz Now LTI400HA08-N 40" FHD Narrow CCFL 700 nits 3,000:1 8ms 60Hz Now CCFL 700 nits 3,000:1 8ms 60Hz LTI400HA08-V 40" FHD Narrow + Black LTI460HN05 46" FHD Narrow + Black CCFL 700 nits 3,500:1 8ms 60Hz Now LTI460HJ01 46" FHD Narrow E-LED 600 nits 3,000:1 10ms 120Hz Now LTI550HN03 55" FHD Narrow CCFL 700 nits 4,000:1 8ms 60Hz Now LTI550HJ02 55" FHD Narrow E-LED 600 nits 4,000:1 10ms 120Hz Now LTI700HD01 70" FHD Normal CCFL 600 nits 2,000:1 8ms 60Hz Now LTI820HT-L01 82" FHD Normal CCFL 600 nits 2,000:1 8ms 60Hz Now LTI320AP02 32" HD Normal CCFL 450 nits 3,500:1 8ms 60Hz Now LTI400HA07 40" FHD Normal CCFL 450 nits 4,000:1 8ms 60Hz Now LTI460HN04 46" FHD Normal CCFL 450 nits 3,000:1 8ms 60Hz Now LTI550HN02 55" FHD Normal CCFL 450 nits 3,500:1 8ms 60Hz Now LTI700HA01 70" FHD Normal CCFL 450 nits 2,000:1 8ms 60Hz Now E-Board; Landscape mode only LTI820HD03 82" FHD Normal CCFL 450 nits 2,000:1 8ms 60Hz Now E-Board; Landscape mode only LTI460AP01 46" HD Narrow Transparent / No BLU 4,500:1 8ms 60Hz Now LTI220MT02 46" WSXGA+ Narrow Transparent / No BLU 500:1 5ms 60Hz Now Transparent NOTES: High Tni 85C HD = 1366 x 768 FHD = 1920 x 1080 *MP Date subject to change LCD Type Please contact your local Samsung Rep for more information. samsung.com/us/lcdpanels 1H 2012 DID PANEL LINEUP 21 Tablets Size PN Mode Resolution H(RGB) V Aspect Ratio PPI Brightness (nits) MP 7" LTN070AL01-0 PLS WXGA 1280 800 16:10 216 400 Now 10.1" LTL101AL02-D PLS WXGA 1280 800 16:10 149 400 Now H(RGB) V Aspect Ratio PPI Brightness (nits) MP Notebooks / Personal Computers Size 10.1" 11.6" PN Mode Resolution LTN101NT08 TN WSVGA 1024 600 16:10 118 200 Now LTN101AT03 TN HD 1366 768 16:9 155 200 Now LTN116AT01 TN HD 1366 768 16:9 135 200 Now 13.3" LTN133AT20 TN HD 1366 768 16:9 118 200 Mar '12 14" LTN140AT20-6 TN HD 1366 768 16:9 112 200 Mar '12 15.6" LTN156AT17 TN HD 1366 768 16:9 100 200 Now MONITORs Size PN Mode Resolution H(RGB) V Aspect Ratio PPI Brightness (nits) MP 17" LTM170ET01 TN SXGA 1280 1024 5:4 96 250 Now 18.5" 19" 20" 21.5" 22" 23" 24" 27" 22 LTM185AT01 TN HD 1366 768 16:9 85 250 Now LTM185AT05-Q TN HD 1366 768 16:9 85 250 Now LTM190ET01 TN SXGA 1280 1024 5:4 86 250 Now LTM190BT07 TN WXGA+ 1440 900 16:9 96 250 Now LTM200KT03 TN HD+ 1600 900 16:9 92 250 Now LTM200KT010 TN HD+ 1600 900 16:9 92 250 Now LTM215HT04 TN FHD 1920 1080 16:9 103 250 Now LTM220MT05-M TN WSXGA+ 1680 1050 16:10 90 250 Now LTM220MT09 TN WSXGA+ 1680 1050 16:10 90 250 Now LTM230HT10-Q TN FHD 1920 1080 16:9 96 300 Now LTM230HL01 PLS FHD 1920 1080 16:9 96 300 Now LTM240CT06 TN WUXGA 1920 1200 16:10 94 250 Now LTM240CL01 PLS WUXGA 1920 1200 16:9 94 300 Now LTM270HT03 TN FHD 1920 1080 16:9 82 300 Now LTM270DL02 PLS QHD 2560 1440 16:9 109 300 Now TABLETS, NOTEBOOKS & MONITORS 1H 2012 samsung.com/us/lcdpanels CONTACTS Feel free to contact your local distributor or sales representative with any Samsung sales inquiries. Representatives Name Location Phone Name Location Phone Adelsa Ciudad Juarez 52-656-613-3517 InTELaTECH Calgary 905-629-0082 Adelsa Monterrey 52-818-214-0011 InTELaTECH Montreal 905-629-0082 Adelsa Mexico City (HQ) 52-555-560-5002 InTELaTECH Ottawa 905-629-0082 Adelsa Guadalajara 52-333-122-3054 InTELaTECH Toronto 905-629-0082 ATMI Washington 425-869-7636 I-Squared San Jose 408-988-3400 ATMI Oregon 503-643-8307 I-Squared Petaluma 707-773-3108 Bear / VAI Ohio 440-526-1991 Neptune Electr. (NECCO) NY, PA, MD 631-234-2525 Bear / VAI Western PA 440-526-1991 New Elpis (LCD) Ontario 1-905-275-3516 Bear / VAI Indiana/Kentucky 440-832-7637 New Tech Solutions Massachusetts 781-229-8888 Bear / VAI Michigan 440-526-1991 New Tech Solutions CT/NY 585-204-2183 Bestronics San Diego 858-673-4300 Platinum (SLSI) Los Angeles 818-879-5905 Beta Technology Illinois 630-250-9586 Platinum (SLSI) Orange County 949-266-2900 Beta Technology Wisconsin 262-547-6933 Platinum (SLSI) San Diego 858-777-1614 Crestone Colorado 303-280-7202 Rep One Associates Alabama 256-539-7371 Crestone Utah 303-280-7202 Rep One Associates Charlotte, NC 704-846-5744 Customer 1st Iowa 319-393-1351 Rep One Associates Georgia 770-209-9242 Customer 1st Kansas 913-390-9119 Rep One Associates Raleigh, NC 919-424-3804 Customer 1st Minnesota 952-851-7909 Rep One Associates Florida 256-539-7371 Digit-Tech Sales Sao Paulo, Brazil 5511-3165-2218 Summit Sales Phoenix/El Paso 480-998-4850 Digit-Tech Sales Puerto Rico 787-892-4260 West Associates Dallas 972-680-2800 Digit-Tech Sales Miami (export) 305-591-2400 West Associates Austin 512-343-1199 Infinity Sales Los Angeles 818-880-6480 West Associates Houston 512-343-1199 Infinity Sales Orange County 714-669-8520 Company Name Location Contact Edge Electronics, Inc. Headquarters 75 Orville Dr., Unit 2 Bohemia, NY 11716 Phone: 800.647.EDGE (3343) Fax: 631.471.3405 www.edgeelectronics.com Email: edge@edgeelectronics.com Avnet, Inc. Phoenix, Arizona Headquarters 2211 South 47th Street Phoenix, AZ 85034 www.avnet.com For sales inquiries: (800)332-8638 www.avnetexpress.com WPG Americas Inc. Corporate Office 5285 Hellyer Avenue Suite 150 San Jose, CA 95138 Tel 408-392-8100 Tel 888-WPG-8881 Fax 408-436-9551 www.wpgamericas.com For sales inquiries: inquiry@wpgamericas.com Arrow Electronics, Inc. Corporate Headquarters Corporate Headquarters 7459 S. Lima Street Englewood, CO 80112-5816 Phone: (303) 824-4000 www.arrow.com For sales inquiries: www.arrownac.com / onlinesales@arrow.com / (800) 833-3557 For all product information please visit: samsung.com/us/oem-solutions samsung.com/us/oem-solutions 1H 2012 CONTACTS 23 CO NTA CTS Distributors Memory DRAM Flash SRAM MCP System LSI ASICs APs Display Drivers Imaging ICs Foundry Storage Solid State Drives Hard Drives Optical Disc Drives LCD Panels Displays Monitors Smartphones Tablets TVs Samsung Semiconductor, Inc. 3655 North First Street San Jose, CA 95134-1713 samsung.com/us/oem-solutions Disclaimer: The information in this publication has been carefully checked and is believed to be accurate at the time of publication. Samsung assumes no responsibility, however, for possible errors or omissions, or for any consequences resulting from the use of the information contained herein. Samsung reserves the right to make changes in its products or product specifications with the intent to improve function or design at any time and without notice and is not required to update this documentation to reflect such changes. This publication does not convey to a purchaser of semiconductor devices described herein any license under the patent rights of Samsung or others. Samsung makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Samsung assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability, including without limitation any consequential or incidental damages. Copyright 2012. Samsung and Samsung Semiconductor, Inc. are registered trademarks of Samsung Electronics, Co., Ltd. All other names and brands may be claimed as the property of others. The appearance of all products, dates, figures, diagrams and tables are subject to change at any time, without notice. BR-12-ALL-001 | Printed 02/12