EHF1100TTS-24.000M REGULATORY COMPLIANCE (Data Sheet downloaded on Dec 15, 2018) 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 14 Pin DIP Metal Thru-Hole 24.000MHz 100ppm 0C to +70C ELECTRICAL SPECIFICATIONS Nominal Frequency 24.000MHz Frequency Tolerance/Stability 100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operation Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25C, Shock, and Vibration.) Aging at 25C 5ppm/year Maximum Operating Temperature Range 0C to +70C Supply Voltage 5.0Vdc 10% Input Current 50mA Maximum (No Load) Output Voltage Logic High (Voh) 2.4Vdc Minimum with TTL Load, Vdd-0.4Vdc Minimum with HCMOS Load (IOH = -16mA) Output Voltage Logic Low (Vol) 0.4Vdc Maximum with TTL Load, 0.5Vdc Maximum with HCMOS Load (IOL = +16mA) Rise/Fall Time 6nSec Maximum (Measured at 0.8Vdc to 2.0Vdc with TTL Load, Measured at 20% to 80% of waveform with HCMOS Load) Duty Cycle 50 5(%) (Measured at 50% of waveform with TTL Load or with HCMOS Load) Load Drive Capability 10TTL Load or 50pF HCMOS Load Maximum Output Logic Type CMOS Pin 1 Connection Tri-State (Disabled Output: High Impedance) Tri-State Input Voltage (Vih and Vil) +2.2Vdc Minimum to enable output, +0.8Vdc Maximum to disable output (High Impedance), No Connect to enable output. Absolute Clock Jitter 250pSec Maximum, 100pSec Typical One Sigma Clock Period Jitter 50pSec Maximum, 30pSec Typical Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014, Condition A Gross Leak Test MIL-STD-883, Method 1014, Condition C Lead Integrity MIL-STD-883, Method 2004 Mechanical Shock MIL-STD-202, Method 213, Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/26/2012 | Page 1 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EHF1100TTS-24.000M MECHANICAL DIMENSIONS (all dimensions in millimeters) 15.240 0.203 7.620 0.203 0.9 MAX 1 7 14 8 DIA 0.457 0.100 (X4) PIN CONNECTION 1 Tri-State (High Impedance) 7 Ground/Case Ground 8 Output 14 Supply Voltage LINE MARKING 5.08 MIN 5.08 MAX 13.2 MAX MARKING ORIENTATION 1 ECLIPTEK 2 24.000M 3 XXXXX XXXXX=Ecliptek Manufacturing Identifier 20.8 MAX www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/26/2012 | Page 2 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EHF1100TTS-24.000M CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% or 2.0VDC OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% or 1.4VDC 20% or 0.8VDC VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/26/2012 | Page 3 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EHF1100TTS-24.000M Test Circuit for CMOS Output Frequency Counter Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Tri-State Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/26/2012 | Page 4 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EHF1100TTS-24.000M Test Circuit for TTL Output Output Load Drive Capability 10TTL 5TTL RL Value (Ohms) CL Value (pF) 390 780 15 15 Oscilloscope Frequency Counter Table 1: RL Resistance Value and CL Capacitance Value Vs. Output Load Drive Capability + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) RL (Note 4) Output + Voltage Meter _ + 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Power Supply _ Tri-State Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'. Note 5: All diodes are MMBD7000, MMBD914, or equivalent. www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/26/2012 | Page 5 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EHF1100TTS-24.000M Recommended Solder Reflow Methods High Temperature Solder Bath (Wave Solder) TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3C/Second Maximum 150C 175C 200C 60 - 180 Seconds 3C/Second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 Seconds 6C/Second Maximum 8 Minutes Maximum Level 1 Temperatures shown are applied to back of PCB board and device leads only. Do not use this method for product with the Gull Wing option. www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/26/2012 | Page 6 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EHF1100TTS-24.000M Recommended Solder Reflow Methods Low Temperature Infrared/Convection 185C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/Second Maximum N/A 150C N/A 60 - 120 Seconds 5C/Second Maximum 150C 200 Seconds Maximum 185C Maximum 185C Maximum 2 Times 10 Seconds Maximum 2 Times 5C/Second Maximum N/A Level 1 Temperatures shown are applied to body of device. Use this method only for product with the Gull Wing option. www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/26/2012 | Page 7 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EHF1100TTS-24.000M Recommended Solder Reflow Methods Low Temperature Solder Bath (Wave Solder) TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/Second Maximum N/A 150C N/A 30 - 60 Seconds 5C/Second Maximum 150C 200 Seconds Maximum 245C Maximum 245C Maximum 1 Time / 235C Maximum 2 Times 5 Seconds Maximum 1 Time / 15 Seconds Maximum 2 Times 5C/Second Maximum N/A Level 1 Temperatures shown are applied to back of PCB board and device leads only. Do not use this method for product with the Gull Wing option. Low Temperature Manual Soldering 185C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only. This method can be utilized with both Gull Wing and Non-Gull Wing devices.) High Temperature Manual Soldering 260C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only. This method can be utilized with both Gull Wing and Non-Gull Wing devices.) www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 06/26/2012 | Page 8 of 8 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Ecliptek: EHF1100TTS-24.000M