TC1072-4.0VCH713 - Microchip Technology

TC1072/TC1073

Features:

• 50 µA Ground Current for Longer Battery Life

• Very Low Dropout Voltage

• Choice of 50 mA (TC1072) and 100 mA (TC1073)

Output

• High Output Voltage Accuracy

• Standard or Custom Output Voltages

• Power-Saving Shutdown Mode

• ERROR Output Can Be Used as a Low Battery

Detector or Processor Reset Generator

• Bypass Input for Ultra Quiet Operation

• Overcurrent and Overtemperature Protection

• Space-Saving 6-Pin SOT-23 Package

• Pin Compatible Upgrades for Bipolar Regulators

• Standard Output Voltage Options:

- 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V,

3.3V, 3.6V, 4.0V, 5.0V

• Other output voltages are available. Please

contact Microchip Technology Inc. for details.

Applications:

• Battery Operated Systems

• Portable Computers

• Medical Instruments

• Instrumentation

• Cellular/GSM/PHS Phones

• Linear Post-Regulators for SMPS

• Pagers

Typical Application Circuit

General Description

The TC1072 and TC1073 are high accuracy (typically

±0.5%) CMOS upgrades for older (bipolar) low dropout

regulators. Designed specifically for battery-operated

systems, the devices’ CMOS construction eliminates

wasted ground current, significantly extending battery

life. Total supply current is typically 50 µA at full load

(20 to 60 times lower than in bipolar regulators).

The devices’ key features include ultra low noise

operation (plus optional Bypass input); very low

dropout voltage (typically 85 mV, TC1072 and 180 mV,

TC1073 at full load) and fast response to step changes

in load. An error output (ERROR) is asserted when the

devices are out-of-regulation (due to a low input

voltage or excessive output current). ERROR can be

used as a low battery warning or as a processor

RESET signal (with the addition of an external RC

network). Supply current is reduced to 0.5 µA (max)

and both VOUT and ERROR are disabled when the

shutdown input is low. The devices incorporate both

overtemperature and overcurrent protection.

The TC1072 and TC1073 are stable with an output

capacitor of only 1 µF and have a maximum output

current of 50 mA, and 100 mA, respectively. For higher

output current versions, please see the TC1185,

TC1186, TC1187 (IOUT = 150 mA) and TC1107,

TC1108 and TC1173 (IOUT = 300 mA) data sheets.

Package Type

TC1072

TC1073

VOUT

GND

1 µF

VIN VIN VOUT

SHDN

Shutdown Control

(from Power Control Logic)

ERRO

ERROR

Bypass

CBYPASS

470 pF

6-Pin SOT-23

VOUT ERROR

SHDNGNDVIN

Bypass

50mA and 100mA CMOS LDOs with Shutdown, ERROR Output and VREF Bypass

TC1072/TC1073

1.0 ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings†

Input Voltage .........................................................6.5V

Output Voltage........................... (-0.3V) to (VIN + 0.3V)

Power Dissipation................Internally Limited (Note 6)

Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V

Operating Temperature Range......-40°C < TJ < 125°C

Storage Temperature..........................-65°C to +150°C

† Note: Stresses above those listed under "Absolute

Maximum Ratings" may cause permanent damage to

the device. These are stress ratings only and functional

operation of the device at these or any other conditions

above those indicated in the operation sections of the

specifications is not implied. Exposure to Absolute

Maximum Rating conditions for extended periods may

affect device reliability.

TC1072/TC1073 ELECTRICAL SPECIFICATIONS

Electrical Characteristics: Unless otherwise noted, VIN =V

OUT + 1V, IL= 0.1 mA, CL=3.3μF, S HDN >V

IH, TA=+25°C.

Boldface type specifications apply for junction temperatures of -40°C to +125°C.

Symbol Parameter Min Typ Max Units Test Conditions

VIN Input Operating Voltage 2.7 —6.0 VNote 9

IOUTMAX Maximum Output Current 50

100

—

TC1072

TC1073

VOUT Output Voltage VR –

2.5%

VR ±0.5% VR + 2.5% VNote 1

TCVOUT VOUT Temperature Coefficient —

—

ppm/°C Note 2

ΔVOUT/ΔVIN Line Regulation — 0.05 0.35 %(V

R + 1V) ≤ VIN ≤ 6V

ΔVOUT/VOUT Load Regulation — 0.5 2.0 %I

L = 0.1 mA to IOUTMAX

(Note 3)

VIN-VOUT Dropout Voltage —

—

180

—

120

250

mV IL=0.1mA

IL=20mA

IL=50mA

IL= 100 mA (Note 4),

TC1073

IIN Supply Current — 50 80 µA SHDN =V

IH, IL=0 (Note 8)

IINSD Shutdown Supply Current — 0.05 0.5 µA SHDN =0V

PSRR Power Supply Rejection Ratio — 64 — dB FRE ≤1kHz

IOUTSC Output Short Circuit Current — 300 450 mA VOUT =0V

ΔVOUT/ΔPDThermal Regulation — 0.04 — V/W Notes 5, 6

TSD Thermal Shutdown Die Temperature — 160 — °C

ΔTSD Thermal Shutdown Hysteresis — 10 — °C

eN Output Noise — 260 — nV/√Hz IL=I

OUTMAX

470 pF from Bypass to GND

Note 1: VR is the regulator output voltage setting. For example: VR= 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.

3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range

from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal

regulation specification.

4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.

5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or

line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN =6V for T=10 ms.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate

thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.

7: Hysteresis voltage is referenced by VR.

8: Apply for Junction Temperatures of -40°C to +85°C.

9: The minimum VIN has to justify the conditions = VIN ≥VR+V

DROPOUT and VIN ≥2.7V for IL= 0.1 mA to IOUTMAX.

TC VOUT = (VOUTMAX – VOUTMIN) x 106

VOUT x ΔT

TC1072/TC1073

SHDN Input

VIH SHDN Input High Threshold 45 — — %VIN VIN = 2.5V to 6.5V

VIL SHDN Input Low Threshold — — 15 %VIN VIN = 2.5V to 6.5V

ERROR Open Drain Output

VINMIN Minimum VIN Operating Voltage 1.0 — — V

VOL Output Logic Low Voltage — — 400 mV 1 mA Flows to ERROR

VTH ERROR Threshold Voltage — 0.95 x VR— V See Figure 4-2

VHYS ERROR Positive Hysteresis — 50 — mV Note 7

tDELAY VOUT to ERROR Delay — 2.5 — ms Vout falling from VR to

VR-10%

TC1072/TC1073 ELECTRICAL SPECIFICATIONS (CONTINUED)

Electrical Characteristics: Unless otherwise noted, VIN =V

OUT + 1V, IL= 0.1 mA, CL=3.3μF, S HDN >V

IH, TA= +25°C.

Boldface type specifications apply for junction temperatures of -40°C to +125°C.

Symbol Parameter Min Typ Max Units Test Conditions

Note 1: VR is the regulator output voltage setting. For example: VR= 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.

3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range

from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal

regulation specification.

4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.

5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or

line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN =6V for T=10 ms.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate

thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.

7: Hysteresis voltage is referenced by VR.

8: Apply for Junction Temperatures of -40°C to +85°C.

9: The minimum VIN has to justify the conditions = VIN ≥VR+V

DROPOUT and VIN ≥2.7V for IL= 0.1 mA to IOUTMAX.

TC VOUT = (VOUTMAX – VOUTMIN) x 106

VOUT x ΔT

TC1072/TC1073

2.0 TYPICAL CHARACTERISTICS CURVES

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

0.000

0.002

0.004

0.006

0.008

0.010

0.012

0.014

0.016

0.018

0.020

-40 -20 0 20 50 70 125

DROPOUT VOLTAGE (V)

ILOAD = 10mA

CIN = 1μF

COUT = 1μF

TEMPERATURE (°C)

Dropout Voltage vs. Temperature (VOUT = 3.3V)

0.000

0.020

0.040

0.060

0.080

0.100

0.120

0.140

0.160

0.180

0.200

-40 -20 0 20 50 70 125

DROPOUT VOLTAGE (V)

ILOAD = 100mA

CIN = 1μF

COUT = 1μF

TEMPERATURE (°C)

Dropout Voltage vs. Temperature (VOUT = 3.3V)

GND CURRENT (

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5

ILOAD = 10mA

CIN = 1μF

COUT = 1μF

Ground Current vs. VIN (VOUT = 3.3V)

VIN (V)

0.000

0.010

0.020

0.030

0.040

0.050

0.060

0.070

0.080

0.090

0.100

-40 -20 0 20 50 70 125

DROPOUT VOLTAGE (V)

ILOAD = 50mA

CIN = 1μF

COUT = 1μF

TEMPERATURE (°C)

Dropout Voltage vs. Temperature (VOUT = 3.3V)

0.000

0.050

0.100

0.150

0.200

0.250

0.300

-40 -20 0 20 50 70 125

DROPOUT VOLTAGE (V)

ILOAD = 150mA

CIN = 1μF

COUT = 1μF

TEMPERATURE (°C)

Dropout Voltage vs. Temperature (VOUT = 3.3V)

GND CURRENT (

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5

ILOAD = 100mA

CIN = 1μF

COUT = 1μF

Ground Current vs. VIN (VOUT = 3.3V)

VIN (V)

TC1072/TC1073

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

GND CURRENT (μA)

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5

ILOAD = 150mA

CIN = 1μF

COUT = 1μF

VIN (V)

Ground Current vs. VIN (VOUT = 3.3V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

LOAD

= 100mA

= 1μF

OUT

= 1μF

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7

(V)

OUT

(V)

OUT

vs.

OUT

= 3.3V)

3.274

3.276

3.278

3.280

3.282

3.284

3.286

3.288

3.290

-40 -20 -10 0 20 40 85 125

ILOAD = 150mA

CIN = 1μF

COUT = 1μF

VIN = 4.3V

TEMPERATURE (°C)

VOUT (V)

Output Voltage vs. Temperature (VOUT = 3.3V)

0.5

1.5

2.5

3.5

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7

LOAD

= 0

= 1μF

OUT

= 1μF

(V)

OUT

(V)

OUT

vs.

OUT

= 3.3V)

3.275

3.280

3.285

3.290

3.295

3.300

3.305

3.310

3.315

3.320

-40 -20 -10 0 20 40 85 125

ILOAD = 10mA

CIN = 1μF

COUT = 1μF

VIN = 4.3V

TEMPERATURE (°C)

VOUT (V)

Output Voltage vs. Temperature (VOUT = 3.3V)

TC1072/TC1073

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

4.985

4.990

4.995

5.000

5.005

5.010

5.015

5.020

5.025

-40 -20 -10 0 20 40 85 125

ILOAD = 10mA

VIN = 6V

CIN = 1μF

COUT = 1μF

TEMPERATURE (°C)

Output Voltage vs. Temperature (VOUT = 5V)

VOUT (V)

-40 -20 -10 0 20 40 85 125

GND CURRENT (

ILOAD = 10mA

VIN = 6V

CIN = 1μF

COUT = 1μF

TEMPERATURE (°C)

Temperature

vs. Quiescent Current

(VOUT = 5V)

4.974

4.976

4.978

4.980

4.982

4.984

4.986

4.988

4.990

4.992

4.994

-40 -20 -10 0 20 40 85 125

ILOAD = 150mA

VIN = 6V

CIN = 1μF

COUT = 1μF

TEMPERATURE (°C)

Output Voltage vs. Temperature (VOUT = 5V)

VOUT (V)

Temperature vs. Quiescent Current (VOUT = 5V)

-40 -20 -10 0 20 40 85 125

GND CURRENT (μA)

ILOAD = 150mA

VIN = 6V

CIN = 1μF

COUT = 1μF

TEMPERATURE (°C)

10.0

1.0

0.1

0.0

0.01K 0.1K 1K 10K 100K 1000K

FREQUENCY (Hz)

Output Noise vs. Frequency

NOISE (μV/√Hz)

RLOAD = 50Ω

COUT = 1μF

CIN = 1μF

CBYP = 0

1000

100

0.1

0.01

010 20 30 40 50 60 70 80 90 100

LOAD CURRENT (mA)

Stability Region vs. Load Current

COUT ESR (Ω)

COUT = 1μF

to 10μF

Stable Region

table Re

-30

-35

-40

-45

-50

-60

-55

-65

-70

-75

-80

0.01K 0.1K 1K 10K 100K 1000

FREQUENCY (Hz)

Power Supply Rejection Ratio

PSRR (dB)

IOUT = 10mA

VINDC = 4V

VINAC = 100mVp-p

VOUT = 3V

CIN = 0

COUT = 1μF

TC1072/TC1073

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

VOUT

Measure Rise Time of 3.3V LDO with Bypass Capacitor

Conditions: CIN = 1μF, COUT = 1μF, CBYP = 470pF, ILOAD = 100mA

VIN = 4.3V, Temp = 25°C, Rise Time = 448μS

VSHDN

Measure Fall Time of 3.3V LDO with Bypass Capacitor

Conditions: CIN = 1μF, COUT = 1μF, CBYP = 470pF, ILOAD = 50mA

VIN = 4.3V, Temp = 25°C, Fall Time = 100μS

VOUT

VSHDN

Measure Rise Time of 3.3V LDO without Bypass Capacitor

Conditions: CIN = 1μF, COUT = 1μF, CBYP = 0pF, ILOAD = 100mA

VIN = 4.3V, Temp = 25°C, Rise Time = 184μS

VOUT

VSHDN

Measure Fall Time of 3.3V LDO without Bypass Capacitor

Conditions: CIN = 1μF, COUT = 1μF, CBYP = 0pF, ILOAD = 100mA

VIN = 4.3V, Temp = 25°C, Fall Time = 52μS

VOUT

VSHDN

TC1072/TC1073

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

Measure Rise Time of 5.0V LDO with Bypass Capacitor

Conditions: CIN = 1μF, COUT = 1μF, CBYP = 470pF, ILOAD = 100mA

VIN = 6V, Temp = 25°C, Rise Time = 390μS

VOUT

VSHDN

Measure Fall Time of 5.0V LDO with Bypass Capacitor

Conditions: CIN = 1μF, COUT = 1μF, CBYP = 470pF, ILOAD = 50mA

VIN = 6V, Temp = 25°C, Fall Time = 167μS

VOUT

VSHDN

Measure Rise Time of 5.0V LDO without Bypass Capacitor

Conditions: CIN = 1μF, COUT = 1μF, CBYP = 0pF, ILOAD = 100mA

VIN = 6V, Temp = 25°C, Rise Time = 192μS

VOUT

VSHDN

Measure Fall Time of 5.0V LDO without Bypass Capacitor

Conditions: CIN = 1μF, COUT = 1μF, CBYP = 0pF, ILOAD = 100mA

VIN = 6V, Temp = 25°C, Fall Time = 88μS

VOUT

VSHDN

TC1072/TC1073

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

ILOAD

VOUT

Load Regulation of 3.3V LDO

Conditions: CIN = 1μF, COUT = 2.2μF, CBYP = 470pF,

VIN = VOUT + 0.25V, Temp = 25°C

ILOAD = 50mA switched in at 10kHz, VOUT is AC coupled

Load Regulation of 3.3V LDO

Conditions: CIN = 1μF, COUT = 2.2μF, CBYP = 470pF,

VIN = VOUT + 0.25V, Temp = 25°C

ILOAD = 150mA switched in at 10kHz, VOUT is AC coupled

ILOAD

VOUT

Load Regulation of 3.3V LDO

Conditions: CIN = 1μF, COUT = 2.2μF, CBYP = 470pF,

VIN = VOUT + 0.25V, Temp = 25°C

ILOAD = 100mA switched in at 10kHz, VOUT is AC coupled

ILOAD

VOUT

VIN

VOUT

Line Regulation of 3.3V LDO

Conditions: VIN = 4V, + 1V Squarewave @ 2.5kHz

CIN = 0μF, COUT = 1μF, C BYP = 470pF,

ILOAD = 100mA, VIN & VOUT are AC coupled

TC1072/TC1073

Note: Unless otherwise specified, all parts are measured at temperature = +25°C.

Line Regulation of 5.0V LDO

Conditions: VIN = 6V, + 1V Squarewave @ 2.5kHz

VIN

VOUT

CIN = 0μF, COUT = 1μF, C BYP = 470pF,

ILOAD = 100mA, VIN & VOUT are AC coupled

VOUT

Thermal Shutdown Response of 5.0V LDO

Conditions: VIN = 6V, CIN = 0μF, COUT = 1μF

ILOAD was increased until temperature of die reached about 160°C, at

which time integrated thermal protection circuitry shuts the regulator

off when die temperature exceeds approximately 160°C. The regulator

remains off until die temperature drops to approximately 150°C.

TC1072/TC1073

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

3.1 Input Voltage Supply (VIN)

Connect unregulated input supply to the VIN pin. If

there is a large distance between the input supply and

the LDO regulator, some input capacitance is

necessary for proper operation. A 1 µF capacitor

connected from VIN to ground is recommended for

most applications.

3.2 Ground (GND)

Connect the unregulated input supply ground return to

GND. Also connect the negative side of the 1 µF typical

input decoupling capacitor close to GND and the

negative side of the output capacitor COUT to GND.

3.3 Shutdown Control Input (SHDN)

The regulator is fully enabled when a logic-high is

applied to SHDN. The regulator enters shutdown when

a logic-low is applied to SHDN. During shutdown,

output voltage falls to zero, ERROR is open-circuited

and supply current is reduced to 0.5 µA (maximum).

3.4 Out-Of-Regulation Flag (ERROR)

ERROR goes low when VOUT is out-of-tolerance by

approximately – 5%.

3.5 Reference Bypass Input (Bypass)

Connecting a 470 pF to this input further reduces

output noise.

3.6 Regulated Voltage Output (VOUT)

Connect the output load to VOUT of the LDO. Also

connect the positive side of the LDO output capacitor

as close as possible to the VOUT pin.

Pin No.

(6-Pin SOT-23) Symbol Description

IN Unregulated supply input.

2 GND Ground terminal.

3 SHDN Shutdown control input.

4ERROR

Out-of-Regulation Flag. (Open drain output).

5 Bypass Reference bypass input.

OUT Regulated voltage output.

TC1072/TC1073

4.0 DETAILED DESCRIPTION

The TC1072 and TC1073 are precision fixed output

voltage regulators. (If an adjustable version is desired,

please see the TC1070/TC1071/TC1187 data sheet.)

Unlike bipolar regulators, the TC1072 and TC1073’s

supply current does not increase with load current. In

addition, VOUT remains stable and within regulation

over the entire 0 mA to IOUTMAX load current range, (an

important consideration in RTC and CMOS RAM

battery back-up applications).

Figure 4-1 shows a typical application circuit. The

regulator is enabled any time the shutdown input

(SHDN) is at or above VIH, and shutdown (disabled)

when SHDN is at or below V

IL. SHDN may be

controlled by a CMOS logic gate, or I/O port of a

microcontroller. If the SHDN input is not required, it

should be connected directly to the input supply. While

in shutdown, supply current decreases to 0.05 µA

(typical), VOUT falls to zero volts, and ERROR is open-

circuited.

FIGURE 4-1: Typical Application Circuit.

4.1 ERROR Open-Drain Output

ERROR is driven low whenever VOUT falls out of

regulation by more than –5% (typical). This condition

may be caused by low input voltage, output current

limiting, or thermal limiting. The ERROR output voltage

value (e.g. ERROR =V

OL at 4.75V (typical) for a 5.0V

regulator and 2.85V (typical) for a 3.0V regulator).

ERROR output operation is shown in Figure 4-2.

Note that ERROR is active tDELAY (typically, 2.5 µs)

after VOUT falls to VTH, and inactive when VOUT rises

above VTH by VHYS.

As shown in Figure 4-1, ERROR can be used as a

battery low flag, or as a processor RESET signal (with

the addition of timing capacitor C2). R1 x C2 should be

chosen to maintain ERROR below VIH of the processor

RESET input for at least 200 ms to allow time for the

system to stabilize. Pull-up resistor R1 can be tied to

VOUT, VIN or any other voltage less than (VIN + 0.3V).

FIGURE 4-2: Error Output Operation.

4.2 Output Capacitor

A 1 µF (minimum) capacitor from VOUT to ground is

recommended. The output capacitor should have an

effective series resistance greater than 0.1Ω and less

than 5.0Ω, and a resonant frequency above 1 MHz. A

1 µF capacitor should be connected from VIN to GND if

there is more than 10 inches of wire between the

regulator and the AC filter capacitor, or if a battery is

used as the power source. Aluminum electrolytic or

tantalum capacitor types can be used. (Since many

aluminum electrolytic capacitors freeze at

approximately -30°C, solid tantalums are

recommended for applications operating below -25°C.)

When operating from sources other than batteries,

supply-noise rejection and transient response can be

improved by increasing the value of the input and

output capacitors and employing passive filtering

techniques.

4.3 Bypass Input

A 470 pF capacitor connected from the Bypass input to

ground reduces noise present on the internal

reference, which in turn significantly reduces output

noise. If output noise is not a concern, this input may be

left unconnected. Larger capacitor values may be

used, but results in a longer time period to rated output

voltage when power is initially applied.

TC1072

TC1073

VOUT

SHDN

GND

ERROR

1 μF

VIN VOUT

Shutdown Control

(to CMOS Logic or Tie

to VIN if unused)

1 μF

Battery

0.2 μF

C2 Required Only

if ERROR is used as a

Processor RESET Signal

(See Text)

V+

BATTLOW

or RESET

Bypass

C3, 470 pF

VTH

VOUT

ERROR

VIH

VOL

HYSTERESIS (VH)

tDELAY

TC1072/TC1073

5.0 THERMAL CONSIDERATIONS

5.1 Thermal Shutdown

Integrated thermal protection circuitry shuts the

regulator off when die temperature exceeds 160°C.

The regulator remains off until the die temperature

drops to approximately 150°C.

5.2 Power Dissipation

The amount of power the regulator dissipates is

primarily a function of input and output voltage, and

output current. The following equation is used to

calculate worst-case actual power dissipation:

EQUATION 5-1:

The maximum allowable power dissipation

(Equation 5-2) is a function of the maximum ambient

temperature (TAMAX), the maximum allowable die tem-

perature (TJMAX) and the thermal resistance from junc-

tion-to-air (θJA). The 6-Pin SOT-23 package has a θJA

of approximately 220°C/Watt.

EQUATION 5-2:

Equation 5-1 can be used in conjunction with

Equation 5-2 to ensure regulator thermal operation is

within limits. For example:

Given:

VINMAX = 3.0V ±5%

VOUTMIN = 2.7V – 2.5%

ILOADMAX = 40 mA

TJMAX = 125°C

TAMAX = 55°C

Find: 1. Actual power dissipation

2. Maximum allowable dissipation

Actual power dissipation:

≈

(VINMAX – VOUTMIN)ILOADMAX

= [(3.0 x 1.05) – (2.7 x 0.975)] x 40 x 10–3

= 20.7 mW

Maximum allowable power dissipation:

In this example, the TC1072 dissipates a maximum of

20.7 mW; below the allowable limit of 318 mW. In a

similar manner, Equation 5-1 and Equation 5-2 can be

used to calculate maximum current and/or input

voltage limits.

5.3 Layout Considerations

The primary path of heat conduction out of the package

is via the package leads. Therefore, layouts having a

ground plane, wide traces at the pads, and wide power

supply bus lines combine to lower θJA and therefore

increase the maximum allowable power dissipation

limit.

Where:

≈

(VINMAX – VOUTMIN)ILOADMAX

VINMAX

VOUTMIN

ILOADMAX

= Worst-case actual power dissipation

= Minimum regulator output voltage

= Maximum output (load) current

= Maximum voltage on VIN

PDMAX = (TJMAX – TAMAX)

where all terms are previously defined.

PDMAX = (TJMAX – TAMAX)

= (125 – 55)

220

= 318 mW

TC1072/TC1073

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

6.2 Taping Form

(V) TC1072

Code

TC1073

Code

1.8 EY FY

2.5 E1 F1

2.6 ET FT

2.7 E2 F2

2.8 EZ FZ

2.85 E8 F8

3.0 E3 F3

3.3 E4 F4

3.6 E9 F9

4.0 E0 F0

5.0 E6 F6

1& = part number code + threshold voltage

(two-digit code)

3represents year and quarter code

4represents production lot ID code

W, Width of

Carrier Tape

User Direction of Feed

P,Pitch

Standard Reel Component

Orientation Reverse Reel Component

Orientation

PIN 1

Device

Marking

PIN 1

Carrier Tape, Number of Components per Reel and Reel Size

Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size

6-Pin SOT-23 8 mm 4 mm 3000 7 in

TC1072/TC1073

6-Lead Plastic Small Outline Transistor (CH) [SOT-23]

Notes:

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not ex ceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM M AX

Number of Pins N 6

Pitch e 0.95 BSC

Outside Lead Pitch e1 1.90 BSC

Overall Height A 0.90 – 1.45

Molded Package Thickness A2 0.89 – 1.30

Standoff A1 0.00 – 0.15

Overall Width E 2.20 – 3.20

Molded Package Width E1 1.30 – 1.80

Overall Length D 2.70 – 3.10

Foot Length L 0.10 – 0.60

Footprint L1 0.35 – 0.80

Foot Angle φ0° – 30°

Lead Thickness c 0.08 – 0.26

Lead Width b 0.20 – 0.51

PIN 1 ID BY

LASER MARK

123

A2 c

Microchip Technology Drawing C04-028B

TC1072/TC1073

NOTES:

TC1072/TC1073

APPENDIX A: REVISION HISTORY

Revision D (February 2007)

•Page 1: Ground current changed to 50 µA.

• Package type changed from SOT-23A to SOT-23.

• Added voltage options.

•T

DELAY added to Table 1-1.

•Section 3.0 “Pin Descriptions”: Added pin

descriptions.

•Section 4.1 “ERROR Open-Drain Output”:

Defined tDELAY

• Changed Figure 4-2.

• Updated Packaging Information.

Revision C (January 2006)

• Undocumented changes.

Revision B (May 2002)

• Undocumented changes.

Revision A (March 2002)

• Original Release of this Document.

TC1072/TC1073

NOTES:

TC1072/TC1073

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. — XXXXXX

Threshold PackageTemperature

Range

Device

Device TC1072: CMOS LDO with Shutdown, ERROR Output & VREF

Bypass

TC1073: CMOS LDO with Shutdown, ERROR Output & VREF

Bypass

Threshold voltage

(typical)

1.8 = 1.8V

2.5 = 2.5V

2.6 = 2.6V

2.7 = 2.7V

2.8 = 2.8V

2.85 = 2.85V

3.0 = 3.0V

3.3 = 3.3V

3.6 = 3.6V

4.0 = 4.0V

5.0 = 5.0V

Temperature Range V = -40°C to +125°C

Package CH713 = Plastic small outline transistor (CH) SOT-23,

6 lead, (tape and reel).

Examples:

a) TC1072-1.8VCH713: 1.8V

b) TC1072-2.5VCH713 2.5V

c) TC1072-2.6VCH713 2.6V

d) TC1072-2.7VCH713 2.7V

e) TC1072-2.8VCH713 2.8V

f) TC1072-2.85VCH713 2.85V

g) TC1072-3.0VCH713 3.0V

h) TC1072-3.3VCH713 3.3V

i) TC1072-3.6VCH713 3.6V

j) TC1072-4.0VCH713 4.0V

k) TC1072-5.0VCH713 5.0V

a) TC1073-1.8VCH713: 1.8V

b) TC1073-2.5VCH713 2.5V

c) TC1073-2.6VCH713 2.6V

d) TC1073-2.7VCH713 2.7V

e) TC1073-2.8VCH713 2.8V

f) TC1073-2.85VCH713 2.85V

g) TC1073-3.0VCH713 3.0V

h) TC1073-3.3VCH713 3.3V

i) TC1073-3.6VCH713 3.6V

j) TC1073-4.0VCH713 4.0V

k) TC1073-5.0VCH713 5.0V

X.X

Voltage

TC1072/TC1073

NOTES:

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

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Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

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