Sep - 09
D5XB40 ........ D5XB100
5.0 Amp. Glass Passivated Bridge Rectifier
Maximum Ratings, according to IEC publication No. 134
VRRM Peak recurrent reverse voltage (V)
Maximum RMS Voltage (V)
IFSM
10ms. peak forward surge current (Jedec Method)
180 A
VRMS
TjOperating temperature range -40 to +150 °C
Junction-case. With Heatsink.
IF(AV) Max. Average forward current with heatsink
without heatsink
3.4 °C/W
Rth (j-c)
Tstg Storage temperature range -40 to +150 °C
Electrical Characteristics at Tamb = 25 °C
1.00 V
VF
Max. forward voltage drop per diode at IF = 3.0 A
IR
Max. instantaneous reverse current at VRRM
5 µA
400
280
600
420
800
560
D5XB
40 D5XB
60 D5XB
80
I2tI2t value for fusing (t = 10 ms)
120 A
2sec
Rth (j-a)
30 °C/W
1000
700
D5XB
100
Voltage
400 to 1000 V
Current
5.0 A
R
Junction-Ambient. Without Heatsink.
MAXIMUM THERMAL RESISTANCE
• Mounting Instructions
• High temperature soldering guaranteed: 260 ºC – 10 sc.
• Recommended mounting torque: 8 Kg.cm.
Plastic
Case
• Glass Passivated Junction Chips.
• Lead and polarity identifications.
• Case: Molded Plastic.
• Ideal for printed circuit board (P.C.B.).
• High surge current capability.
• The plastic material carries U/L recognition 94 V-O.
V
DIS
Dielectric strength (terminals to case, AC 1 min.)
2500 V
5.0 A at Tc: 100 °C
2.8 A at 25 °C
.386(9.8)
1.193(30.3)
1.169(29.7)
.402(10.2)
.106(2.7)
.091(2.3)
.094(2.4)
.079(2.0)
.043(1.1)
.035(0.9)
.709(18.0)
.669(17.0)
.165(4.2)
.150(3.8)
.303
(7.7) .303
(7.7)
.287
(7.3) .287
(7.3)
.189(4.8)
.799(20.3)
.776(19.7)
.031(0.7)
.024(0.6)
.114(2.9)
.098(2.5)
.134(3.4)
.122(3.1)
.150(3.8)
.134(3.4)
.189(4.8)
.173(4.4)
.441(11.2)
.425(10.8)
C.118(3.0)
x45°