Ver: 1.1
Sep 20, 2004
TEL: 886-3-5788833
http://www.gmt.com.tw
2
G1084
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings (Note 1)
Input Voltage…………………………………………7V
Power Dissipation Internally Limited (Note 2)
Maximum Junction Temperature….………….....…150°C
Storage Temperature Range………-65°C ≤ TJ ≤+150°C
Reflow Temperature (soldering, 10sec).…........260°C
Thermal Resistance Junction to Ambient
TO-252(1)………………...………………………125°C/W
TO-263(1)………………………………………….100°C/W
Thermal Resistance Junction to Case
TO-252…………….………...................10°C/W
TO-263………………..……………………….........6°C/W
ESD Rating (Human Body Model)…….....................2kV
Note (1): See Recommended Minimum Footprint
Operating Conditions (Note 1)
(VIN-VADJ) Voltage………..……………….……2.5V~5.5V
Temperature Range…………….…..…..-40°C≤TA≤ 85°C
Electrical Characteristics
Operating Conditions: VIN ≤ 5.5V, TA =TJ = 25°C unless otherwise specified. [Note3]
PARAMETER CONDITION MIN TYP MAX UNIT
Reference Voltage VIN - VOUT = 2V, IOUT = 10mA 1.225 1.250 1.275 V
Line Regulation (VOUT + 1.5V) < VIN < 5.5V, IOUT = 10mA --- 0.5 1 %
Load Regulation (VIN - VOUT) = 2V, 10mA < IOUT <5A --- 0.04 0.5 %
Dropout Voltage ∆VOUT = 2%, IOUT = 5A --- 1.3 1.5 V
Current Limit (VIN - VOUT) = 2V --- 5.4 --- A
Adjust Pin Current Change VIN - VOUT = 2V, 10mA < IOUT < 5A --- 0.15 --- µA
Minimum Load Current 1.5V < (VIN - VOUT) < 5.25V 10 --- --- mA
Quiescent Current VIN - VOUT = 2V --- 80 150 µA
Ripple Rejection f = 120Hz, COUT = 10µF Tantalum,
(VIN - VOUT) = 3V, IOUT = 1A --- 45 --- dB
Temperature Stability VIN = 4V, IO =10mA --- 0.3 --- %
RMS Output Noise (% of VOUT) TA = 25°C, 10Hz < f < 10kHz, ILOAD = 10mA --- 0.007 --- %
Thermal Shutdown Junction Temperature --- 150 --- °C
Thermal Shutdown Hysteresis --- 30 --- °C
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Con-
ditions are conditions under which the device functions but the specifications might not be guaranteed. For
guaranteed specifications and test conditions see the Electrical Characteristics.
Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal re-
sistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient tem-
perature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC
will go into thermal shutdown.
Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4: The type of output capacitor should be tantalum or aluminum.