SN54ABT373, SN74ABT373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS155D – JANUARY 1991 – REVISED MAY 1997
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
State-of-the-Art
EPIC-
ΙΙ
B
BiCMOS Design
Significantly Reduces Power Dissipation
D
Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
D
Typical VOLP (Output Ground Bounce) < 1 V
at VCC = 5 V, TA = 25°C
D
High-Drive Outputs (–32-mA IOH, 64-mA IOL)
D
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Ceramic Flat (W) Package, and Plastic (N)
and Ceramic (J) DIPs
description
The eight latches of the ’ABT373 are transparent
D-type latches. While the latch-enable (LE) input
is high, the Q outputs follow the data (D) inputs.
When LE is taken low, the Q outputs are latched
at the logic levels set up at the D inputs.
A buffered output-enable (OE) input can be used
to place the eight outputs in either a normal logic
state (high or low logic levels) or a
high-impedance state. In the high-impedance
state, the outputs neither load nor drive the bus
lines significantly . The high-impedance state and
increased drive provide the capability to drive bus
lines without need for interface or pullup
components.
OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
T o ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT373 is characterized for operation over the full military temperature range of –55°C to 125°C. The
SN74ABT373 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each latch)
INPUTS OUTPUT
OE LE DQ
L H H H
LHL L
LLX Q
0
H X X Z
Copyright 1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC-ΙΙB is a trademark of Texas Instruments Incorporated.
SN54ABT373 ...J OR W PACKAGE
SN74ABT373 . . . DB, DW, N, OR PW PACKAGE
(TOP VIEW)
SN54ABT373 . . . FK PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
LE
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
2D
2Q
3Q
3D
4D
1D
1Q
OE
5Q
5D 8Q
4Q
GND
LE VCC
8D
7D
7Q
6Q
6D
SN54ABT373, SN74ABT373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS155D – JANUARY 1991 – REVISED MAY 1997
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic symbol†
1D
3
1D 4
2D 7
3D
EN
1
1Q
2
2Q
5
3Q
6
8
4D 13
5D 14
6D
4Q
9
5Q
12
6Q
15
OE
17
7D 18
8D
C1
11
LE
7Q
16
8Q
19
†This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
OE
To Seven Other Channels
1
11
32
LE
1D
C1
1D 1Q
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high or power-off state, VO –0.5 V to 5.5 V. . . . . . . . . . . . . . . . . . .
Current into any output in the low state, IO: SN54ABT373 96 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74ABT373 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) –18 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DB package 115°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 128°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
‡Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages,
which use a trace length of zero.
SN54ABT373, SN74ABT373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS155D – JANUARY 1991 – REVISED MAY 1997
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
SN54ABT373 SN74ABT373
UNIT
MIN MAX MIN MAX
UNIT
VCC Supply voltage 4.5 5.5 4.5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VIInput voltage 0 VCC 0 VCC V
IOH High-level output current –24 –32 mA
IOL Low-level output current 48 64 mA
∆t/∆vInput transition rise or fall rate Outputs enabled 5 5 ns/V
TAOperating free-air temperature –55 125 –40 85 °C
NOTE 3: Unused inputs must be held high or low to prevent them from floating.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
TA = 25°C SN54ABT373 SN74ABT373
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYP†MAX MIN MAX MIN MAX
UNIT
VIK VCC = 4.5 V, II = –18 mA –1.2 –1.2 –1.2 V
VCC = 4.5 V, IOH = –3 mA 2.5 2.5 2.5
VOH
VCC = 5 V, IOH = –3 mA 3 3 3
V
V
OH
VCC =45V
IOH = –24 mA 2 2
V
V
CC =
4
.
5
V
IOH = –32 mA 2* 2
VOL
VCC =45V
IOL = 48 mA 0.55 0.55
V
V
OL
V
CC =
4
.
5
V
IOL = 64 mA 0.55* 0.55
V
Vhys 100 mV
IIVCC = 5.5 V, VI = VCC or GND ±1±1±1µA
IOZH VCC = 5.5 V, VO = 2.7 V 10‡10‡10‡µA
IOZL VCC = 5.5 V, VO = 0.5 V –10‡–10‡–10‡µA
Ioff VCC = 0, VI or VO ≤ 4.5 V ±100 ±100 µA
ICEX VCC = 5.5 V, VO = 5.5 V Outputs high 50 50 50 µA
IO§VCC = 5.5 V, VO = 2.5 V –50 –100 –180 –50 –180 –50 –180 mA
V55VI0
Outputs high 1 250 250 250 µA
ICC VCC = 5.5 V, IO = 0,
VI=V
CC or GND
Outputs low 24 30 30 30 mA
VI
=
VCC
or
GND
Outputs disabled 0.5 250 250 250 µA
∆ICC¶VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND 1.5 1.5 1.5 mA
CiVI = 2.5 V or 0.5 V 3 pF
CoVO = 2.5 V or 0.5 V 6 pF
* On products compliant to MIL-PRF-38535, this parameter does not apply.
†All typical values are at VCC = 5 V.
‡This data sheet limit may vary among suppliers.
§Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
¶This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
SN54ABT373, SN74ABT373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS155D – JANUARY 1991 – REVISED MAY 1997
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
SN54ABT373
VCC = 5 V,
TA = 25°CMIN MAX UNIT
MIN MAX
twPulse duration, LE high 3.3 3.3 ns
tsu
Setu
p
time data before LE↓
High 2.2 2.5
ns
t
su
Setup
time
,
data
before
LE↓
Low 2.2 2.5
ns
thHold time, data after LE↓High or low 2.2 2.5 ns
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
SN74ABT373
VCC = 5 V,
TA = 25°CMIN MAX UNIT
MIN MAX
twPulse duration, LE high 3.3 3.3 ns
t
Setup time data before LE↓
High 1.9 1.9
ns
t
su
S
e
t
up
ti
me,
d
a
t
a
b
e
f
ore
LE↓
Low 1.5 1.5
ns
thHold time, data after LE↓High or low 1 1 ns
SN54ABT373, SN74ABT373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS155D – JANUARY 1991 – REVISED MAY 1997
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54ABT373
PARAMETER FROM
(INPUT) TO
(OUTPUT) VCC = 5 V,
TA = 25°CMIN MAX UNIT
MIN TYP MAX
tPLH
D
Q
1.9 3.9 5.4 1.3 6.8
ns
tPHL
D
Q
2.2 4.2 5.7 2 7
ns
tPLH
LE
Q
2.2 4.6 6.1 1.8 7.7
ns
tPHL
LE
Q
3.2 5.2 6.7 2.5 7.7
ns
tPZH
OE
Q
1.2 3.2 5.5 1 6.2
ns
tPZL
OE
Q
2 4.7 6.2 1.5 7.2
ns
tPHZ
OE
Q
2.5 4.9 6.4 2.4 8
ns
tPLZ
OE
Q
2 4.5 6 2 7
ns
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN74ABT373
PARAMETER FROM
(INPUT) TO
(OUTPUT) VCC = 5 V,
TA = 25°CMIN MAX UNIT
MIN TYP MAX
tPLH
D
Q
1.9 3.9 5.4 1.9 5.9
ns
tPHL
D
Q
2.2 4.2 5.7 2.2 6.2
ns
tPLH
LE
Q
2.2 4.6 6.1 2.2 6.6
ns
tPHL
LE
Q
3.2 5.2 6.7 3.2 7.2
ns
tPZH
OE
Q
1.2 3.2 4.7 1.2 5.2
ns
tPZL
OE
Q
2.7 4.7 6.2 2.7 6.7
ns
tPHZ
OE
Q
2.5 4.9 6.4 2.5 6.9
ns
tPLZ
OE
Q
2 4.5 6 2 6.5
ns
SN54ABT373, SN74ABT373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS155D – JANUARY 1991 – REVISED MAY 1997
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
1.5 V
th
tsu
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
7 V
Open
GND
500 Ω
500 Ω
Data Input
Timing Input 1.5 V 3 V
0 V
1.5 V 1.5 V
3 V
0 V
3 V
0 V
1.5 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
1.5 V 1.5 V 3 V
0 V
1.5 V1.5 V
Input
1.5 V
Output
Control
Output
W aveform 1
S1 at 7 V
(see Note B)
Output
W aveform 2
S1 at Open
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
1.5 V1.5 V
3.5 V
0 V
1.5 V VOL + 0.3 V
1.5 V VOH – 0.3 V
≈ 0 V
3 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7 V
Open
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 n s , t f≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
1.5 V
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9321801Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9321801Q2A
SNJ54ABT
373FK
5962-9321801QRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9321801QR
A
SNJ54ABT373J
5962-9321801QSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9321801QS
A
SNJ54ABT373W
SN74ABT373DBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AB373
SN74ABT373DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AB373
SN74ABT373DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ABT373
SN74ABT373DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ABT373
SN74ABT373N ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74ABT373N
SN74ABT373NSR ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ABT373
SN74ABT373PW ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AB373
SN74ABT373PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AB373
SN74ABT373PWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AB373
SNJ54ABT373FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9321801Q2A
SNJ54ABT
373FK
SNJ54ABT373J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9321801QR
A
SNJ54ABT373J
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SNJ54ABT373W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9321801QS
A
SNJ54ABT373W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54ABT373, SN74ABT373 :
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74ABT373DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74ABT373DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1
SN74ABT373NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1
SN74ABT373PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 6-May-2017
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ABT373DBR SSOP DB 20 2000 367.0 367.0 38.0
SN74ABT373DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74ABT373NSR SO NS 20 2000 367.0 367.0 45.0
SN74ABT373PWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 6-May-2017
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
TYP
10.63
9.97
2.65 MAX
18X 1.27
20X 0.51
0.31
2X
11.43
TYP
0.33
0.10
0 - 8
0.3
0.1
0.25
GAGE PLANE
1.27
0.40
A
NOTE 3
13.0
12.6
B7.6
7.4
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
120
0.25 C A B
11
10
PIN 1 ID
AREA
NOTE 4
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
(9.3)
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
20X (2)
20X (0.6)
18X (1.27)
(R )
TYP
0.05
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:6X
1
10 11
20
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
(9.3)
18X (1.27)
20X (0.6)
20X (2)
4220724/A 05/2016
SOIC - 2.65 mm max heightDW0020A
SOIC
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
10 11
20
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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