Publication# 16493 Rev. DAmendment/0
Issue Date: February 1996
2-36
PALCE16V8 Family
EE CMOS 20-Pin Universal Programmable Array Logic
FINAL COM’L: H-5/7/10/15/25, Q-10/15/25
IND: H-10/15/25, Q-20/25
DISTINCTIVE CHARACTERISTICS
■Pin and function compatible with all 20-pin
GAL devices
■Electrically erasable CMOS technology
provides reconfigurable logic and full
testability
■High-speed CMOS technology
— 5-ns propagation delay for “-5” version
— 7.5-ns propagation delay for “-7” version
■Direct plug-in replacement for the PAL16R8
series and most of the PAL10H8 series
■Outputs programmable as registered or
combinatorial in any combination
■Peripheral Component Interconnect (PCI)
compliant
■Programmable output polarity
■Programmable enable/disable control
■Preloadable output registers for testability
■Automatic register reset on power up
■Cost-effective 20-pin plastic DIP, PLCC, and
SOIC packages
■Extensive third-party software and programmer
support through FusionPLD partners
■Fully tested for 100% programming and
functional yields and high reliability
■5 ns version utilizes a split leadframe for
improved performance
GENERAL DESCRIPTION
The PALCE16V8 is an advanced PAL device built with
low-power, high-speed, electrically-erasable CMOS
technology. It is functionally compatible with all 20-pin
GAL devices. The macrocells provide a universal device
architecture. The PALCE16V8 will directly replace the
PAL16R8 and PAL10H8 series devices, with the excep-
tion of the PAL16C1.
The PALCE16V8 utilizes the familiar sum-of-products
(AND/OR) architecture that allows users to implement
complex logic functions easily and efficiently. Multiple
levels of combinatorial logic can always be reduced to
sum-of-products form, taking advantage of the very
wide input gates available in PAL devices. The equa-
tions are programmed into the device through floating-
gate cells in the AND logic array that can be erased
electrically.
The fixed OR array allows up to eight data product terms
per output for logic functions. The sum of these products
feeds the output macrocell. Each macrocell can be pro-
grammed as registered or combinatorial with an active-
high or active-low output. The output configuration is
determined by two global bits and one local bit
controlling four multiplexers in each macrocell.
AMD’s FusionPLD program allows PALCE16V8 de-
signs to be implemented using a wide variety of popular
industry-standard design tools. By working closely with
the FusionPLD partners, AMD certifies that the tools
provide accurate, quality support. By ensuring that third-
party tools are available, costs are lowered because a
designer does not have to buy a complete set of new
tools for each device. The FusionPLD program also
greatly reduces design time since a designer can use a
tool that is already installed and familiar.
AMD
2-37PALCE16V8 Family
BLOCK DIAGRAM
Programmable AND Array
32 x 64
MACRO
MC0
MACRO
MC1
MACRO
MC2
MACRO
MC3
MACRO
MC4
MACRO
MC5
MACRO
MC6
MACRO
MC7
OE/I9I/O0I/O1I/O2I/O3I/O4I/O5I/O6I/O7
8
I1 – I8CLK/I0
16493D-1
CONNECTION DIAGRAMS
Top View
16493D-2
PLCC/LCC
DIP/SOIC
PIN DESIGNATIONS
CLK = Clock
GND = Ground
I = Input
I/O = Input/Output
OE = Output Enable
VCC = Supply Voltage
Note: Pin 1 is marked for orientation.
3
5
7
2
1
4
8
6
16
14
12
15
13
11
CLK/I0VCC
9
10
17
18
19
20 I/O7
I/O6
I/O5
I/O4
I/O3
I/O2
I/O1
I/O0
OE/I9
I1
I2
I3
I4
I5
I6
I7
I8
GND
1 20 19
18
17
16
15
14
2
3
4
5
6
7
8
9 10 11 12 13
I3
I4
I5
I6
I7
I/O6
I/O5
I/O4
I/O3
I/O2
OE/I9
I/O0
I/O1
GND
I8
CLK/I0
VCC
I/O7
I1
I2
16493D-3
AMD
2-38 PALCE16V8H-5/7/10/15/25, Q-10/15/25 (Com’l)
H-10/15/25, Q-20/25 (Ind)
ORDERING INFORMATION
Commercial and Industrial Products
PACKAGE TYPE
P = 20-Pin Plastic DIP (PD 020)
J = 20-Pin Plastic Leaded Chip
Carrier (PL 020)
S = 20-Pin Plastic Gull-Wing
Small Outline Package (SO 020)
OPERATING CONDITIONS
C = Commercial (0°C to +75°C)
I = Industrial (–40°C to +85°C)
Valid Combinations
AMD programmable logic products for commercial and industrial applications are available with several ordering options. The
order number (Valid Combination) is formed by a combination of:
Valid Combinations
Valid Combinations lists configurations planned
to be supported in volume for this device. Consult
the local AMD sales office to confirm availability of
specific valid combinations and to check on newly
released combinations.
PAL CE 16 V 8 H -5 P C
SPEED
-5 = 5 ns tPD
-7 = 7.5 ns tPD
-10 = 10 ns tPD
-15 = 15 ns tPD
-20 = 20 ns tPD
-25 = 25 ns tPD
FAMILY TYPE
PAL = Programmable Array Logic
POWER
H = Half Power (90 – 125 mA ICC)
Q = Quarter Power (55 mA ICC)
TECHNOLOGY
CE = CMOS Electrically Erasable
NUMBER OF
ARRAY INPUTS
OUTPUT TYPE
V = Versatile
NUMBER OF OUTPUTS
/5
PROGRAMMING DESIGNATOR
Blank = Initial Algorithm
/4 = First Revision
/5 = Second Revision
(Same Algorithm as /4)
OPTIONAL PROCESSING
Blank = Standard Processing
PALCE16V8H-5
PALCE16V8H-7
PALCE16V8H-10
PALCE16V8Q-10
PALCE16V8H-15
PALCE16V8Q-15
PALCE16V8Q-20
PALCE16V8H-25
PALCE16V8Q-25
PC, JC, SC, PI, JI
PC, JC, PI, JI
/5
/4
PC, JC, SC
JC /5
PC, JC
Blank,
/4
PC, JC, SC, PI, JI
PC, JC
PC, JC, SC, PI, JI
PI, JI
AMD
2-39PALCE16V8 Family
FUNCTIONAL DESCRIPTION
The PALCE16V8 is a universal PAL device. It has eight
independently configurable macrocells (MC0–MC7).
Each macrocell can be configured as registered output,
combinatorial output, combinatorial I/O or dedicated in-
put. The programming matrix implements a program-
mable AND logic array, which drives a fixed OR logic
array. Buffers for device inputs have complementary
outputs to provide user-programmable input signal po-
larity. Pins 1 and 11 serve either as array inputs or as
clock (CLK) and output enable (OE), respectively, for all
flip-flops.
Unused input pins should be tied directly to VCC or GND.
Product terms with all bits unprogrammed (discon-
nected) assume the logical HIGH state and product
terms with both true and complement of any input signal
connected assume a logical LOW state.
The programmable functions on the PALCE16V8 are
automatically configured from the user’s design
specification. The design specification is processed by
development software to verify the design and create a
programming file (JEDEC). This file, once downloaded
to a programmer, configures the device according to the
user’s desired function.
The user is given two design options with the
PALCE16V8. First, it can be programmed as a standard
PAL device from the PAL16R8 and PAL10H8 series.
The PAL programmer manufacturer will supply device
codes for the standard PAL device architectures to be
used with the PALCE16V8. The programmer will pro-
gram the PALCE16V8 in the corresponding architec-
ture. This allows the user to use existing standard PAL
device JEDEC files without making any changes to
them. Alternatively, the device can be programmed as
a PALCE16V8. Here the user must use the PALCE16V8
device code. This option allows full utilization of the
macrocell.
16493D-4
*In macrocells MC0 and MC7, SG1 is replaced by
SG0
on the feedback multiplexer.
1 1
0 X
1 0
SG1
SG1
SL0X
DQ
Q
1 0
1 1
0 X
1 1
1 0
0 0
0 1
VCC
CLK
SL0X
OE
To
Adjacent
Macrocell
From
Adjacent
Pin
1 1
0 X
1 0
*
SL1X
I/OX
PALCE16V8 Macrocell
AMD
2-40 PALCE16V8 Family
Configuration Options
Each macrocell can be configured as one of the follow-
ing: registered output, combinatorial output, combinato-
rial I/O, or dedicated input. In the registered output
configuration, the output buffer is enabled by the OE pin.
In the combinatorial configuration, the buffer is either
controlled by a product term or always enabled. In the
dedicated input configuration, it is always disabled. With
the exception of MC0 and MC7, a macrocell configured
as a dedicated input derives the input signal from an ad-
jacent I/O. MC0 derives its input from pin 11 (OE) and
MC7 from pin 1 (CLK).
The macrocell configurations are controlled by the con-
figuration control word. It contains 2 global bits (SG0
and SG1) and 16 local bits (SL00 through SL07 and SL10
through SL17). SG0 determines whether registers will
be allowed. SG1 determines whether the PALCE16V8
will emulate a PAL16R8 family or a PAL10H8 family de-
vice. Within each macrocell, SL0x, in conjunction with
SG1, selects the configuration of the macrocell, and
SL1x sets the output as either active low or active high
for the individual macrocell.
The configuration bits work by acting as control inputs
for the multiplexers in the macrocell. There are four mul-
tiplexers: a product term input, an enable select, an out-
put select, and a feedback select multiplexer. SG1 and
SL0x are the control signals for all four multiplexers. In
MC0 and MC7, SG0 replaces SG1 on the feedback mul-
tiplexer. This accommodates CLK being the adjacent
pin for MC7 and OE the adjacent pin for MC0.
Registered Output Configuration
The control bit settings are SG0 = 0, SG1 = 1 and SL0x =
0. There is only one registered configuration. All eight
product terms are available as inputs to the OR gate.
Data polarity is determined by SL1x. The flip-flop is
loaded on the LOW-to-HIGH transition of CLK. The
feedback path is from Q on the register. The output
buffer is enabled by OE.
Combinatorial Configurations
The PALCE16V8 has three combinatorial output con-
figurations: dedicated output in a non-registered device,
I/O in a non-registered device and I/O in a registered
device.
Dedicated Output in a Non-Registered
Device
The control bit settings are SG0 = 1, SG1 = 0 and SL0x =
0. All eight product terms are available to the OR gate.
Although the macrocell is a dedicated output, the feed-
back is used, with the exception of pins 15 and 16. Pins
15 and 16 do not use feedback in this mode. Because
CLK and OE are not used in a non-registered device,
pins 1 and 11 are available as input signals. Pin 1 will
use the feedback path of MC7 and pin 11 will use the
feedback path of MC0.
Combinatorial I/O in a Non-Registered
Device
The control bit settings are SG0 = 1, SG1 = 1, and SL0x =
1. Only seven product terms are available to the OR
gate. The eighth product term is used to enable the out-
put buffer. The signal at the I/O pin is fed back to the
AND array via the feedback multiplexer. This allows the
pin to be used as an input.
Because CLK and OE are not used in a non-registered
device, pins 1 and 11 are available as inputs. Pin 1 will
use the feedback path of MC7 and pin 11 will use the
feedback path of MC0.
Combinatorial I/O in a Registered Device
The control bit settings are SG0 = 0, SG1 = 1 and SL0x =
1. Only seven product terms are available to the OR
gate. The eighth product term is used as the output
enable. The feedback signal is the corresponding I/O
signal.
Dedicated Input Configuration
The control bit settings are SG0 = 1, SG1 = 0 and SL0x =
1. The output buffer is disabled. Except for MC0 and MC7
the feedback signal is an adjacent I/O. For MC0 and MC7
the feedback signals are pins 1 and 11. These configu-
rations are summarized in Table 1 and illustrated in
Figure 2.
Table 1. Macrocell Configuration
SG0 SG1 SL0XCell Configuration Devices Emulated
Device Uses Registers
0 1 0 Registered Output PAL16R8, 16R6,
16R4
0 1 1 Combinatorial I/O PAL16R6, 16R4
Device Uses No Registers
1 0 0 Combinatorial PAL10H8, 12H6,
Output 14H4, 16H2, 10L8,
12L6, 14L4, 16L2
1 0 1 Input PAL12H6, 14H4,
16H2, 12L6, 14L4,
16L2
1 1 1 Combinatorial I/O PAL16L8
Programmable Output Polarity
The polarity of each macrocell can be active-high or ac-
tive-low, either to match output signal needs or to
reduce product terms. Programmable polarity allows
Boolean expressions to be written in their most compact
form (true or inverted), and the output can still be of the
desired polarity. It can also save “DeMorganizing”
efforts.
Selection is through a programmable bit SL1x which
controls an exclusive-OR gate at the output of the AND/
OR logic. The output is active high if SL1x is 1 and active
low if SL1x is 0.
AMD
2-41PALCE16V8 Family
16493D-5
D
Q
Q
OE
CLK
Registered Active Low
D
Q
Q
OE
CLK
Registered Active High
Combinatorial I/O Active Low Combinatorial I/O Active High
Combinatorial Output Active Low
VCC
Combinatorial Output Active High
VCC
Adjacent I/O pin
Dedicated Input
Notes:
1. Feedback is not available on pins 15
and 16 in the combinatorial output mode.
2. This configuration is not available on pins 15 and 16.
Note 1 Note 1
Note 2
Figure 2. Macrocell Configurations
AMD
2-42 PALCE16V8 Family
Power-Up Reset
All flip-flops power up to a logic LOW for predictable sys-
tem initialization. Outputs of the PALCE16V8 will de-
pend on whether they are selected as registered or
combinatorial. If registered is selected, the output will be
HIGH. If combinatorial is selected, the output will be a
function of the logic.
Register Preload
The register on the PALCE16V8 can be preloaded from
the output pins to facilitate functional testing of complex
state machine designs. This feature allows direct load-
ing of arbitrary states, making it unnecessary to cycle
through long test vector sequences to reach a desired
state. In addition, transitions from illegal states can be
verified by loading illegal states and observing proper
recovery.
Security Bit
A security bit is provided on the PALCE16V8 as a deter-
rent to unauthorized copying of the array configuration
patterns. Once programmed, this bit defeats readback
and verification of the programmed pattern by a device
programmer, securing proprietary designs from com-
petitors. The bit can only be erased in conjunction with
the array during an erase cycle.
Electronic Signature Word
An electronic signature word is provided in the
PALCE16V8 device. It consists of 64 bits of programm-
able memory that can contain user-defined data. The
signature data is always available to the user independ-
ent of the security bit.
Programming and Erasing
The PALCE16V8 can be programmed on standard logic
programmers. It also may be erased to reset a previ-
ously configured device back to its virgin state. Erasure
is automatically performed by the programming hard-
ware. No special erase operation is required.
Quality and Testability
The PALCE16V8 offers a very high level of built-in qual-
ity. The erasability of the device provides a direct means
of verifying performance of all AC and DC parameters.
In addition, this verifies complete programmability and
functionality of the device to provide the highest pro-
gramming yields and post-programming functional
yields in the industry.
Technology
The high-speed PALCE16V8 is fabricated with AMD’s
advanced electrically erasable (EE) CMOS process.
The array connections are formed with proven EE cells.
Inputs and outputs are designed to be compatible with
TTL devices. This technology provides strong input
clamp diodes, output slew-rate control, and a grounded
substrate for clean switching.
PCI Compliance
The PALCE22V10H-7/10 is fully compliant with the
PCI
Local Bus Specification
published by the PCI Special In-
terest Group. The PALCE22V10H-7/10’s predictable
timing ensures compliance with the PCI AC specifica-
tions independent of the design.
AMD
2-43PALCE16V8 Family
LOGIC DIAGRAM
16493D-6
034781112151619202324272831
0
7
8
15
16
23
24
31
03478111215161920 2427283123
I2
I1
CLK/I01
2
3
I4
I34
5
CLK OE
1 1
0 X
1 0
SG1
SL07
1 1
0 X
1 0
SG1
SL05
1 1
0 X
1 0
SG1
SL04
SG1
1 1
0 X
1 0
DQ
Q
1 0
1 1
1 1
1 0
0 0
0 1
VCC
SL05
0 X
SG1
1 1
0 X
1 0
DQ
Q
1 0
1 1
1 1
1 0
0 0
0 1
VCC
SL04
0 X
1 1
0 X
1 0
SG1
SL06
SG1
1 1
0 X
1 0
DQ
Q
1 0
1 1
1 1
1 0
0 0
0 1
VCC
SL06
0 X
SG0
1 1
0 X
1 0
DQ
Q
1 0
1 1
0 X
1 1
1 0
0 0
0 1
VCC
17
I/O4
16
18
I/O5
I/O6
I/O7
19
SL17
SL16
SL15
SL14
20 VCC
SL07
AMD
2-44 PALCE16V8 Family
LOGIC DIAGRAM (continued)
16493D-6
(concluded)
034781112151619202324272831
32
39
40
47
48
55
0 3 4 7 8 1112 1516 1920 2324 2728 31
I
8
I
7
I
6
I
5
56
63
6
7
8
9
CLK OE
1 1
0 X
1 0
SG1
SL03
1 1
0 X
1 0
SG1
SL01
1 1
0 X
1 0
SG1
SL00
1 1
0 X
1 0
SG1
SL02
OE/I
1 1
0 X
1 0
DQ
Q
1 0
1 1
0 X
1 1
1 0
0 0
0 1
SG0
VCC
SG1
1 1
0 X
1 0
DQ
Q
1 0
1 1
1 1
1 0
0 0
0 1
VCC
SL01
0 X
1 1
0 X
1 0
DQ
Q
1 0
1 1
1 1
1 0
0 0
0 1
VCC
0 X
SG1
1 1
0 X
1 0
DQ
Q
1 0
1 1
1 1
1 0
0 0
0 1
VCC
SL02
0 X
SG1 SL03
I/O3
15
I/O2
14
I/O1
13
I/O0
12
11
SL13
SL12
SL11
SL10
9
SL00
GND 10
AMD
2-45PALCE16V8H-5 (Com’l)
ABSOLUTE MAXIMUM RATINGS
Storage Temperature –65°C to +150°C. . . . . . . . . . .
Ambient Temperature
with Power Applied –55°C to +125°C. . . . . . . . . . . . .
Supply Voltage with
Respect to Ground –0.5 V to +7.0 V. . . . . . . . . . . . .
DC Input Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . .
DC Output or I/O
Pin Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . .
Static Discharge Voltage 2001 V. . . . . . . . . . . . . . . . .
Latchup Current
(TA = 0°C to 75°C) 100 mA. . . . . . . . . . . . . . . . . . . . .
Stresses above those listed under Absolute Maximum Rat-
ings may cause permanent device failure. Functionality at or
above these limits is not implied. Exposure to Absolute Maxi-
mum Ratings for extended periods may affect device reliabil-
ity. Programming conditions may differ.
OPERATING RANGES
Commercial (C) Devices
Temperature (TA) Operating
in Free Air 0°C to +75°C. . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage (VCC) with
Respect to Ground +4.75 V to +5.25 V. . . . . . . . . . . .
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
DC CHARACTERISTICS over COMMERCIAL operating ranges unless otherwise
specified
Parameter
Symbol Parameter Description Test Conditions Min Max Unit
VOH Output HIGH Voltage IOH = –3.2 mA VIN = VIH or VIL 2.4 V
VCC = Min
VOL Output LOW Voltage IOL = 24 mA VIN = VIH or VIL 0.5 V
VCC = Min
VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V
Voltage for all Inputs (Note 1)
VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V
Voltage for all Inputs (Note 1)
IIH Input HIGH Leakage Current VIN = 5.25 V, VCC = Max (Note 2) 10 µA
IIL Input LOW Leakage Current VIN = 0 V, VCC = Max (Note 2) –100 µA
IOZH Off-State Output Leakage VOUT = 5.25 V, VCC = Max 10 µA
Current HIGH VIN = VIH or VIL (Note 2)
IOZL Off-State Output Leakage VOUT = 0 V, VCC = Max –100 µA
Current LOW VIN = VIH or VIL (Note 2)
ISC Output Short-Circuit Current VOUT = 0.5 V, VCC = Max (Note 3) –30 –150 mA
ICC Supply Current Outputs Open (IOUT = 0 mA), VIN = 0 V 125 mA
(Static) VCC = Max
Notes:
1. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
2. I/O pin leakage is the worst case of IIL and IOZL (or IIH and IOZH).
3. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second.
VOUT = 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
AMD
2-46 PALCE16V8H-5 (Com’l)
CAPACITANCE (Note 1)
Parameter
Symbol Parameter Descriptions Test Conditions Typ Unit
CIN Input Capacitance VIN = 2.0 V VCC = 5.0 V, TA = 25°C, 5 pF
COUT Output Capacitance VOUT = 2.0 V f = 1 MHz 8 pF
Note:
1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified
where capacitance may be affected.
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2)
Parameter Min
Symbol Parameter Description (Note 5) Max Unit
tPD Input or Feedback to Combinatorial Output 1 5 ns
tSSetup Time from Input or Feedback to Clock 3 ns
tHHold Time 0ns
t
CO Clock to Output 1 4 ns
tSKEWR Skew Between Registered Outputs (Note 4) 1 ns
tWL LOW 3 ns
tWH HIGH 3 ns
External Feedback 1/(tS+tCO) 142.8 MHz
fMAX Internal Feedback (fCNT), 1/(tS+tCF) (Note 6) 166 MHz
No Feedback 1/(tWH+tWL) 166 MHz
tPZX OE to Output Enable 1 6 ns
tPXZ OE to Output Disable 1 5 ns
tEA Input to Output Enable Using Product Term Control 2 6 ns
tER Input to Output Disable Using Product Term Control 2 5 ns
Clock Width
Maximum
Frequency
(Note 3)
Notes:
2. See Switching Test Circuit for test conditions.
3. These parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified
where frequency may be affected.
4. Skew testing takes into account pattern and switching direction differences between outputs that have equal loading.
5. Output delay minimums for t
PD
, t
CO
, t
PZX
, t
PXZ
, t
EA
, and t
ER
are defined under best case conditions. Future process improve-
ments may alter these values therefore, minimum values are recommended for simulation purposes only.
6. t
CF
is a calculated value and is not guaranteed. t
CF
can be found using the following equation:
t
CF
= 1/f
MAX
(internal feedback) – t
S
.
AMD
2-47PALCE16V8H-7 (Com’l)
ABSOLUTE MAXIMUM RATINGS
Storage Temperature –65°C to +150°C. . . . . . . . . .
Ambient Temperature with
Power Applied –55°C to +125°C. . . . . . . . . . . . . . . .
Supply Voltage with Respect
to Ground –0.5 V to + 7.0 V. . . . . . . . . . . . . . . . . . . .
DC Input Voltage –0.5 V to VCC + 1.0 V. . . . . . . . . . .
DC Output or I/O
Pin Voltage –0.5 V to VCC + 1.0 V. . . . . . . . . . . . . . .
Static Discharge Voltage 2001 V. . . . . . . . . . . . . . . . .
Latchup Current
(TA = 0°C to +75°C) 100 mA. . . . . . . . . . . . . . . . . . . .
Stresses above those listed under Absolute Maximum Rat-
ings may cause permanent device failure. Functionality at or
above these limits is not implied. Exposure to Absolute Maxi-
mum Ratings for extended periods may affect device reliabil-
ity. Programming conditions may differ.
OPERATING RANGES
Commercial (C) Devices
Temperature (TA)
Operating in Free Air 0°C to +75°C. . . . . . . . . . . . . .
Supply Voltage (VCC)
with Respect to Ground +4.75 V to +5.25 V. . . . . . . .
Operating Ranges define those limits between which the func-
tionality of the device is guaranteed.
DC CHARACTERISTICS over COMMERCIAL operating ranges unless otherwise
specified
Parameter
Symbol Parameter Description Test Conditions Min Max Unit
VOH Output HIGH Voltage IOH = –3.2 mA VIN = VIH or VIL 2.4 V
VCC = Min
VOL Output LOW Voltage IOL = 24 mA VIN = VIH or VIL 0.5 V
VCC = Min
VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V
Voltage for all Inputs (Note 1)
VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V
Voltage for all Inputs (Note 1)
IIH Input HIGH Leakage Current VIN = 5.5 V, VCC = Max (Note 2) 10 µA
IIL Input LOW Leakage Current VIN = 0 V, VCC = Max (Note 2) –100 µA
IOZH Off-State Output Leakage VOUT = 5.5 V, VCC = Max, 10 µA
Current HIGH VIN = VIL or VIH (Note 2)
IOZL Off-State Output Leakage VOUT = 0 V, VCC = Max –100 µA
Current LOW VIN = VIL or VIH (Note 2)
ISC Output Short-Circuit Current VOUT = 0.5 V, VCC = Max (Note 3) –30 –150 mA
ICC Supply Current Outputs Open, (IOUT = 0 mA), 115 mA
(Dynamic) VCC = Max, f = 25 MHz
Notes:
1. These are absolute values with respect to the device ground and all overshoots due to system and tester noise are included.
2. I/O pin leakage is the worst case of IIL and IOZL (or IIH and IOZH).
3. Not more than one output should be tested at a time. Duration of the short-circuit test should not exceed one second.
VOUT = 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
AMD
2-48 PALCE16V8H-7 (Com’l)
CAPACITANCE (Note 1)
Parameter
Symbol Parameter Descriptions Test Conditions Typ Unit
CIN Input Capacitance VIN = 2.0 V VCC = 5.0 V, TA = 25°C, 5 pF
COUT Output Capacitance VOUT = 2.0 V f = 1 MHz 8 pF
Note:
1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified
where capacitance may be affected.
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2)
Parameter Min
Symbol Parameter Description (Note 5) Max Unit
tPD Input or Feedback to Combinatorial Output 8 Outputs Switching 3 7.5 ns
1 Output Switching 3 7 ns
tSSetup Time from Input or Feedback 5 ns
tHHold Time 0ns
t
CO Clock to Output 1 5 ns
tSKEWR Skew Between Registered Outputs (Note 4) 1 ns
tWL LOW 4 ns
tWH HIGH 4 ns
External Feedback 1/(tS + tCO) 100 MHz
fMAX Internal Feedback (fCNT) 1/(tS + tCF) (Note 6) 125 MHz
No Feedback 1/(tWH + tWL) 125 MHz
tPZX OE to Output Enable 1 6 ns
tPXA OE to Output Disable 1 6 ns
tEA Input to Output Enable Using Product Term Control 3 9 ns
tER Input to Output Disable Using Product Term Control 3 9 ns
Clock Width
Maximum
Frequency
(Note 3)
Notes:
2. See Switching Test Circuit for test conditions.
3. These parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified
where frequency may be affected.
4. Skew testing takes into account pattern and switching direction differences between outputs that have equal loading.
5. Output delay minimums for t
PD
, t
CO
, t
PZX
, t
PXZ
, t
EA
, and t
ER
are defined under best case conditions. Future process improvements
may alter these values therefore, minimum values are recommended for simulation purposes only.
6. t
CF
is a calculated value and is not guaranteed. t
CF
can be found using the following equation:
t
CF
= 1/f
MAX
(internal feedback) – t
S
.
AMD
2-49PALCE16V8H-10 (Com’l, Ind)
ABSOLUTE MAXIMUM RATINGS
Storage Temperature –65°C to +150°C. . . . . . . . . . .
Ambient Temperature
with Power Applied –55°C to +125°C. . . . . . . . . . . . .
Supply Voltage with
Respect to Ground –0.5 V to + 7.0 V. . . . . . . . . . . .
DC Input Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . .
DC Output or I/O
Pin Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . .
Static Discharge Voltage 2001 V. . . . . . . . . . . . . . . . .
Latchup Current
(TA = –40°C to +85°C) 100 mA. . . . . . . . . . . . . . . . . .
Stresses above those listed under Absolute Maximum Rat-
ings may cause permanent device failure. Functionality at or
above these limits is not implied. Exposure to Absolute Maxi-
mum Ratings for extended periods may affect device reliabil-
ity. Programming conditions may differ.
OPERATING RANGES
Commercial (C) Devices
Temperature (TA) Operating
in Free Air 0°C to +75°C. . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage (VCC) with
Respect to Ground +4.75 V to +5.25 V. . . . . . . . . . . .
Industrial (I) Devices
Temperature (TA) Operating
in Free Air –40°C to +85°C. . . . . . . . . . . . . . . . . . . . .
Supply Voltage (VCC) with
Respect to Ground +4.5 V to +5.5 V. . . . . . . . . . . . . .
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
DC CHARACTERISTICS over COMMERCIAL and INDUSTRIAL operating ranges
Parameter
Symbol Parameter Description Test Conditions Min Max Unit
VOH Output HIGH Voltage IOH = –3.2 mA VIN = VIH or VIL 2.4 V
VCC = Min
VOL Output LOW Voltage IOL = 24 mA VIN = VIH or VIL 0.5 V
VCC = Min
VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V
Voltage for all Inputs (Note 1)
VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V
Voltage for all Inputs (Note 1)
IIH Input HIGH Leakage Current VIN = 5.25 V, VCC = Max (Note 2) 10 µA
IIL Input LOW Leakage Current VIN = 0 V, VCC = Max (Note 2) –100 µA
IOZH Off-State Output Leakage VOUT = 5.25 V, VCC = Max 10 µA
Current HIGH VIN = VIH or VIL (Note 2)
IOZL Off-State Output Leakage VOUT = 0 V, VCC = Max –100 µA
Current LOW VIN = VIH or VIL (Note 2)
ISC Output Short-Circuit Current VOUT = 0.5 V VCC = Max (Note 3) –30 –150 mA
ICC Commercial Supply Current Outputs Open (IOUT = 0 mA) 115 mA
(Dynamic) VCC = Max, f = 15 MHz
Industrial Supply Current 130 mA
Notes:
1. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
2. I/O pin leakage is the worst case of IIL and IOZL (or IIH and IOZH).
3. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second.
VOUT = 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
AMD
2-50 PALCE16V8H-10 (Com’l, Ind)
CAPACITANCE (Note 1)
Parameter
Symbol Parameter Descriptions Test Conditions Typ Unit
CIN Input Capacitance VIN = 2.0 V VCC = 5.0 V, TA = 25°C, 5 pF
COUT Output Capacitance VOUT = 2.0 V f = 1 MHz 8 pF
Note:
1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified
where capacitance may be affected.
SWITCHING CHARACTERISTICS over COMMERCIAL and INDUSTRIAL operating ranges
(Note 2)
Parameter Min
Symbol Parameter Description (Note 4) Max Unit
tPD Input or Feedback to Combinatorial Output 3 10 ns
tSSetup Time from Input or Feedback to Clock 7.5 ns
tHHold Time 0ns
t
CO Clock to Output 3 7.5 ns
tWL LOW 6 ns
tWH HIGH 6 ns
External Feedback 1/(tS + tCO) 66.7 MHz
fMAX Internal Feedback (fCNT) 1/(tS + tCF) (Note 5) 71.4 MHz
No Feedback 1/(tWH + tWL) 83.3 MHz
tPZX OE to Output Enable 2 10 ns
tPXZ OE to Output Disable 2 10 ns
tEA Input to Output Enable Using Product Term Control 3 10 ns
tER Input to Output Disable Using Product Term Control 3 10 ns
Clock Width
Maximum
Frequency
(Note 3)
Notes:
2. See Switching Test Circuit for test conditions.
3. These parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified
where frequency may be affected.
4. Output delay minimums for t
PD
, t
CO
, t
PZX
, t
PXZ
, t
EA
, and t
ER
are defined under best case conditions. Future process improve-
ments may alter these values therefore, minimum values are recommended for simulation purposes only.
5. t
CF
is a calculated value and is not guaranteed. t
CF
can be found using the following equation:
t
CF
= 1/f
MAX
(internal feedback) – t
S
.
AMD
2-51PALCE16V8Q-10 (Com’l)
ABSOLUTE MAXIMUM RATINGS
Storage Temperature –65°C to +150°C. . . . . . . . . . .
Ambient Temperature
with Power Applied –55°C to +125°C. . . . . . . . . . . . .
Supply Voltage with
Respect to Ground –0.5 V to +7.0 V. . . . . . . . . . . . .
DC Input Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . .
DC Output or I/O
Pin Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . .
Static Discharge Voltage 2001 V. . . . . . . . . . . . . . . . .
Latchup Current
(TA = 0°C to 75°C) 100 mA. . . . . . . . . . . . . . . . . . . . .
Stresses above those listed under Absolute Maximum Rat-
ings may cause permanent device failure. Functionality at or
above these limits is not implied. Exposure to Absolute Maxi-
mum Ratings for extended periods may affect device reliabil-
ity. Programming conditions may differ.
OPERATING RANGES
Commercial (C) Devices
Temperature (TA) Operating
in Free Air 0°C to +75°C. . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage (VCC) with
Respect to Ground +4.75 V to +5.25 V. . . . . . . . . . . .
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
DC CHARACTERISTICS over COMMERCIAL operating ranges unless otherwise
specified
Parameter
Symbol Parameter Description Test Conditions Min Max Unit
VOH Output HIGH Voltage IOH = –3.2 mA VIN = VIH or VIL 2.4 V
VCC = Min
VOL Output LOW Voltage IOL = 24 mA VIN = VIH or VIL 0.5 V
VCC = Min
VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V
Voltage for all Inputs (Note 1)
VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V
Voltage for all Inputs (Note 1)
IIH Input HIGH Leakage Current VIN = 5.25 V, VCC = Max (Note 2) 10 µA
IIL Input LOW Leakage Current VIN = 0 V, VCC = Max (Note 2) –100 µA
IOZH Off-State Output Leakage VOUT = 5.25 V, VCC = Max 10 µA
Current HIGH VIN = VIH or VIL (Note 2)
IOZL Off-State Output Leakage VOUT = 0 V, VCC = Max –100 µA
Current LOW VIN = VIH or VIL (Note 2)
ISC Output Short-Circuit Current VOUT = 0.5 V, VCC = Max (Note 3) –30 –150 mA
ICC Supply Current (Dynamic) Outputs Open (IOUT = 0 mA) 55 mA
VCC = Max, f = 15 MHz
Notes:
1. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
2. I/O pin leakage is the worst case of IIL and IOZL (or IIH and IOZH).
3. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second.
VOUT = 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
AMD
2-52 PALCE16V8Q-10 (Com’l)
CAPACITANCE (Note 1)
Parameter
Symbol Parameter Descriptions Test Conditions Typ Unit
CIN Input Capacitance VIN = 2.0 V VCC = 5.0 V, TA = 25°C, 5 pF
COUT Output Capacitance VOUT = 2.0 V f = 1 MHz 8 pF
Note:
1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified
where capacitance may be affected.
SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2)
Parameter Min
Symbol Parameter Description (Note 4) Max Unit
tPD Input or Feedback to Combinatorial Output 3 10 ns
tSSetup Time from Input or Feedback to Clock 7.5 ns
tHHold Time 0ns
t
CO Clock to Output 3 7.5 ns
tWL LOW 6 ns
tWH HIGH 6 ns
External Feedback 1/(tS + tCO) 66.7 MHz
fMAX Internal Feedback (fCNT) 1/(tS + tCF) (Note 5) 71.4 MHz
No Feedback 1/(tWH + tWL) 83.3 MHz
tPZX OE to Output Enable 2 10 ns
tPXZ OE to Output Disable 2 10 ns
tEA Input to Output Enable Using Product Term Control 3 10 ns
tER Input to Output Disable Using Product Term Control 3 10 ns
Clock Width
Maximum
Frequency
(Note 3)
Notes:
2. See Switching Test Circuit for test conditions.
3. These parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified
where frequency may be affected.
4. Output delay minimums for t
PD
, t
CO
, t
PZX
, t
PXZ
, t
EA
, and t
ER
are defined under best case conditions. Future process improve-
ments may alter these values therefore, minimum values are recommended for simulation purposes only.
5. t
CF
is a calculated value and is not guaranteed. t
CF
can be found using the following equation:
t
CF
= 1/f
MAX
(internal feedback) – t
S
.
AMD
2-53PALCE16V8H-15/25, Q-15/25 (Com’l, Ind), Q-20 (Ind)
ABSOLUTE MAXIMUM RATINGS
Storage Temperature –65°C to +150°C. . . . . . . . . . .
Ambient Temperature
with Power Applied –55°C to +125°C. . . . . . . . . . . . .
Supply Voltage with
Respect to Ground –0.5 V to + 7.0 V. . . . . . . . . . . .
DC Input Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . .
DC Output or I/O
Pin Voltage –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . .
Static Discharge Voltage 2001 V. . . . . . . . . . . . . . . . .
Latchup Current
(TA = –40°C to +85°C) 100 mA. . . . . . . . . . . . . . . . . .
Stresses above those listed under Absolute Maximum Rat-
ings may cause permanent device failure. Functionality at or
above these limits is not implied. Exposure to Absolute Maxi-
mum Ratings for extended periods may affect device reliabil-
ity. Programming conditions may differ.
OPERATING RANGES
Commercial (C) Devices
Temperature (TA) Operating
in Free Air 0°C to +75°C. . . . . . . . . . . . . . . . . . . . . . .
Supply Voltage (VCC) with
Respect to Ground +4.75 V to +5.25 V. . . . . . . . . . . .
Industrial (I) Devices
Temperature (TA) Operating
in Free Air –40°C to +85°C. . . . . . . . . . . . . . . . . . . . .
Supply Voltage (VCC) with
Respect to Ground +4.5 V to +5.5 V. . . . . . . . . . . . . .
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
DC CHARACTERISTICS over COMMERCIAL and INDUSTRIAL operating ranges
Parameter
Symbol Parameter Description Test Conditions Min Max Unit
VOH Output HIGH Voltage IOH = –3.2 mA VIN = VIH or VIL 2.4 V
VCC = Min
VOL Output LOW Voltage IOL = 24 mA VIN = VIH or VIL 0.5 V
VCC = Min
VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V
Voltage for all Inputs (Note 1)
VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V
Voltage for all Inputs (Note 1)
IIH Input HIGH Leakage Current VIN = 5.25 V, VCC = Max (Note 2) 10 µA
IIL Input LOW Leakage Current VIN = 0 V, VCC = Max (Note 2) –100 µA
IOZH Off-State Output Leakage VOUT = 5.25 V, VCC = Max 10 µA
Current HIGH VIN = VIH or VIL (Note 2)
IOZL Off-State Output Leakage VOUT = 0 V, VCC = Max –100 µA
Current LOW VIN = VIH or VIL (Note 2)
ISC Output Short-Circuit Current VOUT = 0.5 V, VCC = Max (Note 3) –30 –150 mA
ICC Commercial Supply Current Outputs Open (IOUT = 0 mA) H 90
(Dynamic) VCC = Max, f = 15 MHz Q 55
ICC Industrial Supply Current Outputs Open (IOUT = 0 mA) H 130
(Dynamic) VCC = Max, f = 15 MHz Q 65
Notes:
1. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
2. I/O pin leakage is the worst case of IIL and IOZL (or IIH and IOZH).
3. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second.
VOUT = 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
mA
mA
AMD
2-54 PALCE16V8H-15/25, Q-15/25 (Com’l, Ind), Q-20 (Ind)
CAPACITANCE (Note 1)
Parameter
Symbol Parameter Descriptions Test Conditions Typ Unit
CIN Input Capacitance VIN = 2.0 V VCC = 5.0 V, TA = 25°C, 5 pF
COUT Output Capacitance VOUT = 2.0 V f = 1 MHz 8 pF
Note:
1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified
where capacitance may be affected.
SWITCHING CHARACTERISTICS over COMMERCIAL and INDUSTRIAL operating ranges
(Note 2)
Parameter
Symbol Parameter Description Min Max Min Max Min Max Unit
tPD Input or Feedback to Combinatorial Output 15 20 25 ns
tSSetup Time from Input or Feedback to Clock 12 13 15 ns
tHHold Time 0 0 0 ns
tCO Clock to Output 10 11 12 ns
tWL LOW 8 10 12 ns
tWH HIGH 8 10 12 ns
External Feedback 1/(tS + tCO) 45.5 41.6 37 MHz
fMAX Internal Feedback 1/(tS + tCO) 50 45.4 40 MHz
(fCNT) (Note 4)
No Feedback 1/(tWH + tWL) 62.5 50.0 41.6 MHz
tPZX OE to Output Enable 15 18 20 ns
tPXZ OE to Output Disable 15 18 20 ns
tEA Input to Output Enable Using Product Term Control 15 18 20 ns
tER Input to Output Disable Using Product Term Control 15 18 20 ns
Clock Width
Maximum
Frequency
(Note 3)
Notes:
2. See Switching Test Circuit for test conditions.
3. These parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified
where frequency may be affected.
4. t
CF
is a calculated value and is not guaranteed. t
CF
can be found using the following equation:
t
CF
= 1/f
MAX
(internal feedback) – t
S
.
-15 -20 -25
AMD
2-55PALCE16V8 Family
SWITCHING WAVEFORMS
Notes:
1. VT = 1.5 V
2. Input pulse amplitude 0 V to 3.0 V.
3. Input rise and fall times 2 ns – 5 ns typical.
tPD
Input or
Feedback
Combinatorial
Output
VT
VT
16493D-7
Combinatorial Output
VT
VT
Input
Output
Input to Output Disable/Enable
16493D-8
tER tEA
VT
Input or
Feedback
Registered
Output
Registered Output
16493D-9
tS
tCO
VT
tH
VT
Clock
tWH
Clock
Clock Width
VT
tWL
16493D-10
VT
VT
OE
Output
OE to Output Disable/Enable
16493D-11
tPZX
tPXZ
VOH - 0.5V
VOL + 0.5V
VOH - 0.5V
VOL + 0.5V
AMD
2-56 PALCE16V8 Family
KEY TO SWITCHING WAVEFORMS
KS000010-PAL
Must be
Steady
May
Change
from H to L
May
Change
from L to H
Does Not
Apply
Don’t Care,
Any Change
Permitted
Will be
Steady
Will be
Changing
from H to L
Will be
Changing
from L to H
Changing,
State
Unknown
Center
Line is High-
Impedance
“Off” State
WAVEFORM INPUTS OUTPUTS
SWITCHING TEST CIRCUIT
16493D-12
CL
Output
R1
R2
S1
Test Point
5 V
Measured
Specification S1CLR1R2Output Value
tPD, tCO Closed 1.5 V
tEA Z → H: Open 50 pF 200 Ω390 Ω1.5 V
Z → L: Closed
tER H →Z: Open 5 pF H-5: H →Z: VOH – 0.5 V
L →Z: Closed 200 ΩL →Z: VOL + 0.5 V
Commercial
AMD
2-57PALCE16V8 Family
TYPICAL ICC CHARACTERISTICS
VCC = 5 V, TA = 25°C
150
125
100
75
50
25
0
01020304050
Frequency (MHz)
ICC (mA)
16493D-13
The selected “typical” pattern utilized 50% of the device resources. Half of the macrocells were programmed as registered, and
the other half were programmed as combinatorial. Half of the available product terms were used for each macrocell. On any
vector, half of the outputs were switching.
By utilizing 50% of the device, a midpoint is defined for I
CC
. From this midpoint, a designer may scale the I
CC
graphs up or down to
estimate the I
CC
requirements for a particular design.
16V8H-5
16V8H-7
16V8H-10
16V8H-15/25
16V8Q-10/15/25
ICC vs. Frequency
AMD
2-58 PALCE16V8 Family
ENDURANCE CHARACTERISTICS
The PALCE16V8 is manufactured using AMD’s ad-
vanced Electrically Erasable process. This technology
uses an EE cell to replace the fuse link used in bipolar
parts. As a result, the device can be erased and
reprogrammed—a feature which allows 100% testing at
the factory.
Symbol Parameter Test Conditions Min Unit
tDR Min Pattern Data Retention Time Max Storage Temperature 10 Years
Max Operating Temperature 20 Years
N Min Reprogramming Cycles Normal Programming Conditions 100 Cycles
AMD
2-59PALCE16V8 Family
ROBUSTNESS FEATURES
PALCE16V8X-X/5 devices have some unique features
that make them extremely robust, especially when oper-
ating in high-speed design environments. Pull-up resis-
tors on inputs and I/O pins cause unconnected pins to
default to a known state. Input clamping circuitry limits
negative overshoot, eliminating the possibility of false
clocking caused by subsequent ringing. A special noise
filter makes the programming circuitry completely insen-
sitive to any positive overshoot that has a pulse width of
less than about 100 ns for the /5 versions. Selected /4
devices are also being retrofitted with these robustness
features. See chart below for device listings.
INPUT/OUTPUT EQUIVALENT SCHEMATICS FOR /5 VERSIONS AND SELECTED /4
VERSIONS*
16493D-14
Typical Input
Typical Output
Preload
Circuitry
ESD
Protection
and
Clamping
Feedback
Input
VCC
VCC
> 50 kΩ
VCC
Programming
Voltage
Detection
Positive
Overshoot
Filter Programming
Circuitry
Provides ESD
Protection and
Clamping
Programming
Pins only
> 50 kΩ
VCC
Device Filter Only Filter and Pullups
PALCE16V8H-10 E, F, K L
PALCE16V8H-15 D, E, F, G, I, J, K L, M
PALCE16V8Q-15 D, G, J M
PALCE16V8H-25 D, G, J M
PALCE16V8Q-25 D, G, J M
Rev Letter
Topside Marking:
AMD CMOS PLD’s are marked on the top of the package in the
following manner:
PALCEXXXX
Date Code (3 numbers) Lot ID (4 characters)– –(Rev. Letter)
The Lot ID and Rev Letter are separated by two spaces.
*
AMD
2-60 PALCE16V8 Family
POWER-UP RESET
The PALCE16V8 has been designed with the capability
to reset during system power-up. Following power-up,
all flip-flops will be reset to LOW. The output state will be
HIGH independent of the logic polarity. This feature pro-
vides extra flexibility to the designer and is especially
valuable in simplifying state machine initialization. A
timing diagram and parameter table are shown below.
Due to the synchronous operation of the power-up reset
and the wide range of ways VCC can rise to its steady
state, two conditions are required to insure a valid
power-up reset. These conditions are:
The VCC rise must be monotonic.
Following reset, the clock input must not be driven
from LOW to HIGH until all applicable input and
feedback setup times are met.
Parameter
Symbol Parameter Descriptions Min Max Unit
tPR Power-Up Reset Time 1000 ns
tSInput or Feedback Setup Time
tWL Clock Width LOW See Switching Characteristics
16493D-15
tPR
tWL
tS
4 V VCC
Power
Registered
Output
Clock
Power-Up Reset Waveform
AMD
2-61PALCE16V8 Family
TYPICAL THERMAL CHARACTERISTICS
/4 Devices (PALCE16V8H-10/4)
Measured at 25°C ambient. These parameters are not tested.
Parameter
Symbol Parameter Description PDIP PLCC Unit
θjc Thermal Impedance, Junction to Case 25 22 °C/W
θja Thermal Impedance, Junction to Ambient 71 64 °C/W
θjma Thermal Impedance, Junction to Ambient with Air Flow 200 Ifpm air 61 55 °C/W
400 Ifpm air 55 51 °C/W
600 Ifpm air 51 47 °C/W
800 Ifpm air 47 45 °C/W
Typ
/5 Devices (PALCE16V8H-7/5)
Measured at 25°C ambient. These parameters are not tested.
Parameter
Symbol Parameter Description PDIP PLCC Unit
θjc Thermal Impedance, Junction to Case 29 23 °C/W
θja Thermal Impedance, Junction to Ambient 70 61 °C/W
θjma Thermal Impedance, Junction to Ambient with Air Flow 200 Ifpm air 64 53 °C/W
400 Ifpm air 58 47 °C/W
600 Ifpm air 53 44 °C/W
800 Ifpm air X X °C/W
Typ
Plastic
θjc
Considerations
The data listed for plastic
θjc
are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the
θjc
measurement relative to a specific location on the
package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the
package. Furthermore,
θjc
tests on packages are performed in a constant-temperature bath, keeping the package surface at a
constant temperature. Therefore, the measurements can only be used in a similar environment.
