OPA373, OPA2373 OPA374 OPA2374, OPA4374 SBOS279E - SEPTEMBER 2003 - REVISED MAY 2008 6.5MHz, 585A, Rail-to-Rail I/O CMOS Operational Amplifier FEATURES D D D D D D D D DESCRIPTION LOW OFFSET: 5mV (max) LOW IB: 10pA (max) HIGH BANDWIDTH: 6.5MHz RAIL-TO-RAIL INPUT AND OUTPUT SINGLE SUPPLY: +2.3V to +5.5V SHUTDOWN: OPAx373 SPECIFIED UP TO +125C MicroSIZE PACKAGES: SOT23-5, SOT23-6, SOT23-8 and DFN-10 The OPA373 and OPA374 families of operational amplifiers are low power and low cost with excellent bandwidth (6.5MHz) and slew rate (5V/s). The input range extends 200mV beyond the rails and the output range is within 25mV of the rails. The speed/power ratio and small size make them ideal for portable and battery-powered applications. The OPA373 family includes a shutdown mode. Under logic control, the amplifiers can be switched from normal operation to a standby current that is less than 1A. APPLICATIONS D D D D PORTABLE EQUIPMENT BATTERY-POWERED DEVICES ACTIVE FILTERS DRIVING A/D CONVERTERS OPA374 OPA373 1 V- 2 +IN A75 Out 3 The OPA373 and OPA374 families of operational amplifiers are specified for single or dual power supplies of +2.7V to +5.5V, with operation from +2.3V to +5.5V. All models are specified for -40C to +125C. 6 V+ 5 Enable 4 Out 1 V- 2 -IN +IN OPA2373 5 V+ OUT A 1 -IN A 2 4 3 -IN +IN A 10 V+ 9 OUT B 8 -IN B A 3 B SOT23-6(1) V- 4 7 +IN B Enable A 5 6 Enable B SOT23-5 OPA373 OPA2373 MSOP-10 NC(2) 1 8 Enable -IN 2 7 V+ V+ OUT A Exposed thermal die pad on underside (Must be connected to V-) -IN A OPA4374 +IN A +IN 3 6 OUT OUT A 1 V- 4 5 NC(2) -IN A 2 +IN A SO-8 OPA374 NC(2) -IN +IN V- 1 8 2 7 3 4 NC(2) 14 OUT D 13 -IN D 3 12 +IN D V+ 4 11 V- +IN B 5 10 +IN C 9 -IN C 8 OUT C -IN B 6 OUT B 7 A B D C V+ 6 OUT 5 NC(2) SO-14, TSSOP-14 V- OUT B -IN B +IN B Enable B Enable A DFN-10 OPA2374 OUT A 1 -IN A 2 +IN A 3 V- 4 A B 8 V+ 7 OUT B 6 -IN B 5 +IN B SO-8, SOT23-8 SO-8 (1) Pin 1 of the SOT23-6 is determined by orienting the package marking as shown. (2) NC indicates no internal connection. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright 2003-2008, Texas Instruments Incorporated ! ! www.ti.com "#"$ %"#" "#& %"#&$ &"#& www.ti.com SBOS279E - SEPTEMBER 2003 - REVISED MAY 2008 PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY Shutdown OPA373 OPA373 OPA2373 OPA2373 SOT23-6 SO-8 MSOP-10 DFN-10 DBV D DGS DRC -40C to +125C -40C to +125C -40C to +125C -40C to +125C A75 OPA373A AYO OCEQ OPA373AIDBVT OPA373AIDBVR OPA373AID OPA373AIDR OPA2373AIDGST OPA2373AIDGSR OPA2373AIDRCT OPA2373AIDRCR Tape and Reel, 250 Tape and Reel, 3000 Rails, 100 Tape and Reel, 2500 Tape and Reel, 250 Tape and Reel, 2500 Tape and Reel, 250 Tape and Reel, 3000 Non-Shutdown OPA374 SOT23-5 DBV -40C to +125C A76 OPA374AIDBVT Tape and Reel, 250 OPA374AIDBVR Tape and Reel, 3000 OPA374 SO-8 D -40C to +125C OPA274A OPA374AID Rails, 100 OPA374AIDR Tape and Reel, 2500 OPA2374 SOT23-8 DCN -40C to +125C ATP OPA2374AIDCNT Tape and Reel, 250 OPA2374AIDCNR Tape and Reel, 3000 OPA2374 SO-8 D -40C to +125C OPA2374A OPA2374AID Rails, 100 OPA2374AIDR Tape and Reel, 2500 OPA4374 SO-14 D -40C to +125C OPA4374A OPA4374AID Rails, 58 OPA4374AIDR Tape and Reel, 2500 OPA4374 TSSOP-14 PW -40C to +125C OPA4374A OPA4374AIPWT Tape and Reel, 250 OPA4374AIPWR Tape and Reel, 2500 (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this datasheet. ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V Signal Input Terminals, Voltage(2) . . . . . . . . . -0.5V to (V+) + 0.5V Current(2) . . . . . . . . . . . . . . . . . . . 10mA Output Short-Circuit(3) . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Operating Temperature . . . . . . . . . . . . . . . . . . . . . -55C to +150C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . -65C to +150C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150C Lead Temperature (soldering, 10s) . . . . . . . . . . . . . . . . . . . . +300C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Short-circuit to ground, one amplifier per package. 2 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. "#"$ %"#" "#& %"#&$ &"#& www.ti.com SBOS279E - SEPTEMBER 2003 - REVISED MAY 2008 ELECTRICAL CHARACTERISTICS: VS = +2.7V to +5.5V Boldface limits apply over the specified temperature range, TA = -40C to +125C. At TA = +25C, RL = 10k connected to VS/2, and VOUT = VS/2, unless otherwise noted. OPA373, OPA2373, OPA374, OPA2374, OPA4374 PARAMETER OFFSET VOLTAGE Input Offset Voltage over Temperature Drift vs Power Supply over Temperature Channel Separation, DC f = 1kHz INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio over Temperature CONDITIONS VOS dVOS/dT PSRR VS = 5V OPEN-LOOP GAIN Open-Loop Voltage Gain over Temperature VCM CMRR (V-) - 0.2V < VCM < (V+) - 2V (V-) - 0.2V < VCM < (V+) - 2V VS = 5.5V, (V-) - 0.2V < VCM < (V+) + 0.2V VS = 5.5V, (V-) - 0.2V < VCM < (V+) + 0.2V (V-) - 0.2 80 70 66 60 ENABLE/SHUTDOWN tOFF tON VL (shutdown) VH (amplifier is active) Input Bias Current of Enable Pin IQSD (per amplifier) 1 5 6.5 mV mV V/C V/V V/V V/V dB 100 150 (V+) + 0.2 V dB dB dB dB 10 10 pA pA 90 1013 3 1013 6 pF pF 10 15 4 VPP nV/Hz fA/Hz 110 dB dB dB dB VCM < (V+) - 2V en in AOL OUTPUT Voltage Output Swing from Rail over Temperature FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate Settling Time, 0.1% 0.01% Overload Recovery Time Total Harmonic Distortion + Noise UNIT 0.5 0.5 IB IOS over Temperature over Temperature Short-Circuit Current Capacitive Load Drive Open-Loop Output Impedance MAX 3 25 VS = 2.7V to 5.5V, VCM < (V+) - 2V VS = 2.7V to 5.5V, VCM < (V+) - 2V INPUT IMPEDANCE Differential Common-Mode NOISE Input Voltage Noise, f = 0.1Hz to 10Hz Input Voltage Noise Density, f = 10kHz Input Current Noise Density, f = 10kHz TYP 0.4 128 over Temperature INPUT BIAS CURRENT Input Bias Current Input Offset Current MIN VS = 5V, RL = 100k, 0.025V < VO < 4.975V VS = 5V, RL = 100k, 0.025V < VO < 4.975V VS = 5V, RL = 5k, 0.125V < VO < 4.875V VS = 5V, RL = 5k, 0.125V < VO < 4.875V RL = 100k RL = 100k RL = 5k RL = 5k ISC CLOAD f = 1MHz, IO = 0 94 80 94 80 106 18 25 25 100 125 125 See Typical Characteristics See Typical Characteristics 220 mV mV mV mV 6.5 5 1 1.5 0.3 0.0013 MHz V/s s s s % 3 12 s s V V A A CL = 100pF GBW SR tS THD+N G = +1 VS = 5V, 2V Step, G = +1 VS = 5V, 2V Step, G = +1 VIN * Gain > VS VS = 5V, VO = 3VPP, G = +1, f = 1kHz V- (V-) + 0.8 V+ (V-) + 2 0.2 < 0.5 1 3 "#"$ %"#" "#& %"#&$ &"#& www.ti.com SBOS279E - SEPTEMBER 2003 - REVISED MAY 2008 ELECTRICAL CHARACTERISTICS: VS = +2.7V to +5.5V (continued) Boldface limits apply over the specified temperature range, TA = -40C to +125C. At TA = +25C, RL = 10k connected to VS/2, and VOUT = VS/2, unless otherwise noted. OPA373, OPA2373, OPA374, OPA2374, OPA4374 PARAMETER POWER SUPPLY Specified Voltage Range Operating Voltage Range Quiescent Current (per amplifier) over Temperature TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance SOT23-5, SOT23-6, SOT23-8 MSOP-10, SO-8 SO-14, TSSOP-14 DFN-10 4 CONDITIONS VS IQ MIN TYP 2.7 2.3 to 5.5 585 IO = 0 -40 -55 -65 UNIT 5.5 V V A A 750 800 +125 +150 +150 qJA JEDEC High-K Board MAX 200 150 100 56 C C C C/W C/W C/W C/W C/W "#"$ %"#" "#& %"#&$ &"#& www.ti.com SBOS279E - SEPTEMBER 2003 - REVISED MAY 2008 TYPICAL CHARACTERISTICS At TA = +25C, RL = 10k connected to VS/2, and VOUT = VS/2, unless otherwise noted. POWER-SUPPLY AND COMMON-MODE REJECTION RATIO vs FREQUENCY 120 100 0 100 Gain 80 -30 60 -60 40 -90 Phase 20 -120 0 -150 -20 10 100 1k 10k 100k 1M PSRR and CMRR (dB) 30 Phase Margin (_) Open-Loop Gain (dB) OPEN-LOOP GAIN AND PHASE vs FREQUENCY 120 CMRR 80 PSRR 60 40 20 0 -180 10M 100 1k 10k 10M 0.100 Total Harmonic Distortion+Noise (%) 1000 Voltage Noise (nV/Hz) 1M TOTAL HARMONIC DISTORTION+NOISE vs FREQUENCY INPUT VOLTAGE NOISE SPECTRAL DENSITY vs FREQUENCY 100 RL = 5k G = 10V/V 0.010 G = 1V/V 0.001 10 10 100 1k 10k 10 100k 100 1k 10k 100k Frequency (Hz) Frequency (Hz) OPEN-LOOP GAIN AND POWER-SUPPLY REJECTION RATIO vs TEMPERATURE COMMON-MODE REJECTION RATIO vs TEMPERATURE 120 130 VS = 5.5V RL = 100k 110 120 VCM = -0.2V to 3.5V 100 CMRR (dB) AOL, PSRR (dB) 100k Frequency (Hz) Frequency (Hz) 110 RL = 5k 100 PSRR 90 80 VCM = -0.2V to 5.7V 70 60 90 50 80 40 -50 -25 0 25 50 75 Temperature (_ C) 100 125 150 -50 -25 0 25 50 75 100 125 150 Temperature (_C) 5 "#"$ %"#" "#& %"#&$ &"#& www.ti.com SBOS279E - SEPTEMBER 2003 - REVISED MAY 2008 TYPICAL CHARACTERISTICS (continued) At TA = +25C, RL = 10k connected to VS/2, and VOUT = VS/2, unless otherwise noted. QUIESCENT CURRENT vs SUPPLY VOLTAGE QUIESCENT CURRENT vs TEMPERATURE 800 800 VOUT = 1/2[(V+) - (V-)] Quiescent Current (A) Quiescent Current (A) 700 600 500 400 300 700 600 500 400 -50 -25 300 0 25 50 75 100 125 150 2.0 3.0 4.5 5.0 5.5 CONTINUOUS SHORT-CIRCUIT CURRENT vs POWER-SUPPLY VOLTAGE 12 +ISC Short-Circuit Current (mA) +ISC 12 10 8 -ISC 6 4 2 10 8 -ISC 6 4 2 0 0 -50 -25 0 25 50 75 100 2.0 125 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Power-Supply Voltage (V) Temperature (_ C) INPUT BIAS CURRENT vs TEMPERATURE OUTPUT VOLTAGE SWING vs OUTPUT CURRENT 3 10k 2 1k Output Voltage (V) Input Bias Current (pA) 4.0 SHORT-CIRCUIT CURRENT vs TEMPERATURE 14 100 10 1 1 0 -1 -55_ C 25_C 150_C -2 -3 0.1 -50 -25 0 25 50 Temperature (_ C) 6 3.5 Supply Voltage (V) 16 Short-Circuit Current (mA) 2.5 Temperature (_C) 75 100 125 0 2 4 6 8 10 12 Output Current (mA) 14 16 18 20 "#"$ %"#" "#& %"#&$ &"#& www.ti.com SBOS279E - SEPTEMBER 2003 - REVISED MAY 2008 TYPICAL CHARACTERISTICS (continued) At TA = +25C, RL = 10k connected to VS/2, and VOUT = VS/2, unless otherwise noted. MAXIMUM OUTPUT VOLTAGE vs FREQUENCY OFFSET VOLTAGE PRODUCTION DISTRIBUTION 6 VS = 5.5V VS = 5V 4 3 Population Output Voltage (VPP ) 5 VS = 2.5V 2 1 0 10k 100k 1M -5 10M -4 -3 Frequency (Hz) -2 -1 0 1 2 3 4 5 5.5 Offset Voltage (mV) OFFSET VOLTAGE DRIFT MAGNITUDE PRODUCTION DISTRIBUTION SMALL-SIGNAL STEP RESPONSE CL = 100pF Population 50mV/div Typical production distribution of packaged units. 1 2 3 4 5 6 7 8 200ns/div 9 10 11 12 13 14 15 16 Offset Voltage Drift (V/_C) LARGE -SIGNAL STEP RESPONSE SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE 50 Refer to the Capacitive Load and Stability section for tips on improving performance. CL = 100pF 40 1V/div Small-Signal Overshoot (%) 60 G = +1V/V 30 20 G = 10V/V RFB = 10k 10 0 10 100 1k 10k 400ns/div Load Capacitance (pF) 7 "#"$ %"#" "#& %"#&$ &"#& www.ti.com SBOS279E - SEPTEMBER 2003 - REVISED MAY 2008 TYPICAL CHARACTERISTICS (continued) At TA = +25C, RL = 10k connected to VS/2, and VOUT = VS/2, unless otherwise noted. CHANNEL SEPARATION vs FREQUENCY SETTLING TIME vs CLOSED-LOOP GAIN 140 Channel Separation (dB) Settling Time (s) 100 10 0.01% 0.1% 1 G = +1V/V, All Channels RL = 5k 120 100 80 60 40 20 0.1 0 1 10 Closed-Loop Gain (V/V) 8 100 10 100 1K 10K 100K Frequency (Hz) 1M 10M 100M "#"$ %"#" "#& %"#&$ &"#& www.ti.com SBOS279E - SEPTEMBER 2003 - REVISED MAY 2008 APPLICATIONS The input common-mode voltage range includes both rails, allowing the OPA373 and OPA374 series op amps to be used in virtually any single-supply application up to a supply voltage of +5.5V. 1.5 Offset Voltage (mV) The OPA373 and OPA374 series op amps are unity-gain stable and suitable for a wide range of general-purpose applications. Rail-to-rail input and output make them ideal for driving sampling Analog-to-Digital Converters (ADCs). Excellent ac performance makes them well-suited for audio applications. The class AB output stage is capable of driving 100k loads connected to any point between V+ and ground. 2.0 1.0 0.5 0 -0.5 -1.0 -1.5 -2.0 - 0.5 0 V- V+ 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Common-Mode Voltage (V) Rail-to-rail input and output swing significantly increases dynamic range, especially in low-supply applications. Figure 1. Behavior of Typical Transition Region at Room Temperature Power-supply pins should be bypassed with 0.01F ceramic capacitors. RAIL-TO-RAIL INPUT OPERATING VOLTAGE The OPA373 and OPA374 op amps are specified and tested over a power-supply range of +2.7V to +5.5V (1.35V to 2.75V). However, the supply voltage may range from +2.3V to +5.5V (1.15V to 2.75V). Supply voltages higher than 7.0V (absolute maximum) can permanently damage the amplifier. Parameters that vary over supply voltage or temperature are shown in the Typical Characteristics section of this data sheet. The input common-mode range extends from (V-) - 0.2V to (V+) + 0.2V. For normal operation, inputs should be limited to this range. The absolute maximum input voltage is 500mV beyond the supplies. Inputs greater than the input common-mode range but less than the maximum input voltage, while not valid, will not cause any damage to the op amp. Unlike some other op amps, if input current is limited, the inputs may go beyond the supplies without phase inversion, as shown in Figure 2. G = +1V/V, VS = 5V VIN The input common-mode voltage range of the OPA373 and OPA374 series extends 200mV beyond the supply rails. This is achieved with a complementary input stage--an N-channel input differential pair in parallel with a P-channel differential pair. The N-channel pair is active for input voltages close to the positive rail, typically (V+) - 1.65V to 200mV above the positive supply, while the P-channel pair is on for inputs from 200mV below the negative supply to approximately (V+) - 1.65V. There is a 500mV transition region, typically (V+) - 1.9V to (V+) - 1.4V, in which both pairs are on. This 500mV transition region, shown in Figure 1, can vary 300mV with process variation. Thus, the transition region (both stages on) can range from (V+) - 2.2V to (V+) - 1.7V on the low end, up to (V+) - 1.6V to (V+) - 1.1V on the high end. Within the 500mV transition region PSRR, CMRR, offset voltage, offset drift, and THD may be degraded compared to operation outside this region. 5V VOUT 1V/div COMMON-MODE VOLTAGE RANGE 0V 1s/div Figure 2. OPA373: No Phase Inversion with Inputs Greater Than the Power-Supply Voltage Normally, input bias current is approximately 500fA; however, input voltages exceeding the power supplies by more than 500mV can cause excessive current to flow in or out of the input pins. Momentary voltages greater than 500mV beyond the power supply can be tolerated if the current on the input pins is limited to 10mA. This is easily accomplished with an input resistor; see Figure 3. (Many input signals are inherently current-limited to less than 10mA, therefore, a limiting resistor is not required.) 9 "#"$ %"#" "#& %"#&$ &"#& www.ti.com SBOS279E - SEPTEMBER 2003 - REVISED MAY 2008 V+ IOVERLOAD 10mA max R OPA373 VOUT capacitor, CFB, can be inserted in the feedback, as shown in Figure 5. This significantly reduces overshoot by compensating the effect of capacitance, CIN, which includes the amplifier input capacitance and printed circuit board (PCP) parasitic capacitance. VIN V+ RS 10to 20 Figure 3. Input Current Protection for Voltages Exceeding the Supply Voltage VOUT OPA373 VIN RL CL RAIL-TO-RAIL OUTPUT A class AB output stage with common-source transistors is used to achieve rail-to-rail output. For light resistive loads ( > 100k), the output voltage can typically swing to within 18mV from the supply rails. With moderate resistive loads (5k to 50k), the output can typically swing to within 100mV from the supply rails and maintain high open-loop gain. See the Typical Characteristic curve, Output Voltage Swing vs Output Current, for more information. Figure 4. Series Resistor in Unity-Gain Configuration Improves Capacitive Load Drive CFB RF CAPACITIVE LOAD AND STABILITY One method of improving capacitive load drive in the unity-gain configuration is to insert a small (10 to 20) resistor, RS, in series with the output, as shown in Figure 4. This significantly reduces ringing while maintaining dc performance for purely capacitive loads. When there is a resistive load in parallel with the capacitive load, RS must be placed within the feedback loop as shown to allow the feedback loop to compensate for the voltage divider created by RS and RL. RI VIN VOUT OPA373 CIN CL Figure 5. Improving Capacitive Load Drive For example, when driving a 100pF load in unity-gain inverter configuration, adding a 6pF capacitor in parallel with the 10k feedback resistor decreases overshoot from 57% to 12%, as shown in Figure 6. 60 G = -1V/V RFB = 10k 50 Overshoot (%) OPA373 series op amps can drive a wide range of capacitive loads. However, under certain conditions, all op amps may become unstable. Op amp configuration, gain, and load value are just a few of the factors to consider when determining stability. An op amp in unity-gain configuration is the most susceptible to the effects of capacitive load. The capacitive load reacts with the op amp output resistance, along with any additional load resistance, to create a pole in the small-signal response that degrades the phase margin. The OPA373 series op amps perform well in unity-gain configuration, with a pure capacitive load up to approximately 250pF. Increased gains allow the amplifier to drive more capacitance. See the Typical Characteristics curve, Small-Signal Overshoot vs Capacitive Load, for further details. V+ 40 30 20 10 In unity-gain inverter configuration, phase margin can be reduced by the reaction between the capacitance at the op amp input and the gain setting resistors, thus degrading capacitive load drive. Best performance is achieved by using small valued resistors. However, when large valued resistors cannot be avoided, a small (4pF to 6pF) 10 CFB = 6pF 0 10 100 1k 10k Load Capacitance (pF) Figure 6. Improving Capacitive Load Drive "#"$ %"#" "#& %"#&$ &"#& www.ti.com SBOS279E - SEPTEMBER 2003 - REVISED MAY 2008 DRIVING ADCs Figure 8 shows the OPA373 driving the ADS7816 in a speech band-pass filtered data acquisition system. This small, low-cost solution provides the necessary amplification and signal conditioning to interface directly with an electret microphone. This circuit will operate with VS = 2.7V to 5V. The OPA373 and OPA374 series op amps are optimized for driving medium-speed sampling ADCs. The OPA373 and OPA374 op amps buffer the ADC input capacitance and resulting charge injection, while providing signal gain. The OPA373 is shown driving the ADS7816 in a basic noninverting configuration, as shown in Figure 7. The ADS7816 is a 12-bit, MicroPower sampling converter in the MSOP-8 package. When used with the low-power, miniature packages of the OPA373, the combination is ideal for space-limited, low-power applications. In this configuration, an RC network at the ADC input can be used to provide anti-aliasing filtering. The OPA373 is shown in the inverting configuration described in Figure 9. In this configuration, filtering may be accomplished with the capacitor across the feedback resistor. ENABLE/SHUTDOWN OPA373 and OPA374 series op amps typically require 585A quiescent current. The enable/shutdown feature of the OPA373 allows the op amp to be shut off in order to reduce this current to less than 1A. +5V 0.1F 0.1F 1 VREF 8 V+ 500 7 DCLOCK +In OPA373 2 VIN ADS7816 12-Bit ADC -In 3300pF 6 DOUT CS/SHDN 3 Serial Interface 5 GND 4 VIN = 0V to 5V for 0V to 5V output. fSAMPLE = 100kHz NOTE: ADC Input = 0 to VREF RC network filters high frequency noise. Figure 7. The OPA373 in Noninverting Configuration Driving the ADS7816 V+ = +2.7V to +5V Passband 300Hz to 3kHz R9 510k R1 1.5k R2 1M R4 20k C3 33pF C1 1000pF Electret Microphone (1) R3 1M 1/2 OPA2373 R7 51k R8 150k VREF 1 8 V+ 7 C2 1000pF R6 100k 1/2 OPA2373 +IN ADS7816 6 12-Bit ADC 5 2 -IN DCLOCK D OUT CS/SHDN Serial Interface 3 4 GND NOTE: (1) Electret microphone powered by R 1. R5 20k G = 100 Figure 8. The OPA2373 as a Speech Bypass Filtered Data Acquisition System 11 "#"$ %"#" "#& %"#&$ &"#& www.ti.com SBOS279E - SEPTEMBER 2003 - REVISED MAY 2008 +5V 330pF 0.1F 5k 0.1F 5k VIN 1 VREF 8 V+ 500k OPA373 VS 2 DCLOCK 7 +IN 6 ADS7816 DOUT 12- Bit ADC 2 5 -IN CS/SHDN 3300pF 3 GND 4 Serial Interface NOTE: ADC Input = 0 to VREF Figure 9. The OPA373 in Inverting Configuration Driving the ADS7816 C3 330pF R1 11.7k 1/2 R2 2.72k R3 21.4k OPA373 1/2 OPA373 C1 680pF C2 330pF NOTE: FilterPro is a low-pass filter design program available for download at no cost from TI's web site (www.ti.com). The program can be used to determine component values for other cutoff frequencies or filter types. Figure 10. Three-Pole Sallen-Key Butterworth Low-Pass Filter 12 "#"$ %"#" "#& %"#&$ &"#& www.ti.com SBOS279E - SEPTEMBER 2003 - REVISED MAY 2008 DFN PACKAGE LAYOUT GUIDELINES The OPA2373 is available in a DFN-10 package (also known as SON), which is a QFN package with lead contacts on only two sides of the bottom of the package. This leadless, near-chip-scale package maximizes board space and enhances thermal and electrical characteristics through an exposed pad. DFN packages are physically small, have a smaller routing area, improved thermal performance, and improved electrical parasitics, with a pinout scheme that is consistent with other commonly-used packages, such as SO and MSOP. Additionally, the absence of external leads eliminates bent-lead issues. The leadframe die pad should be soldered to a thermal pad on the PCB. A mechanical data sheet showing an example layout is attached at the end of this data sheet. Refinements to this layout may be required based on assembly process requirements. The DFN package can be easily mounted using standard PCP assembly techniques. See Application Note, QFN/SON PCB Attachment (SLUA271) and Application Report, Quad Flatpack No-Lead Logic Packages (SCBA017), both available for download at www.ti.com. Mechanical drawings located at the end of this data sheet list the physical dimensions for the package and pad. The five holes in the landing pattern are optional, and are intended for use with thermal vias that connect the leadframe die pad to the heatsink area on the PCB. Soldering the exposed pad significantly improves board-level reliability during temperature cycling, key push, package shear, and similar board-level tests. Even with applications that have low-power dissipation, the exposed pad must be soldered to the PCB to provide structural integrity and long-term reliability. The exposed leadframe die pad on the bottom of the package should be connected to V-. 13 PACKAGE OPTION ADDENDUM www.ti.com 21-Jul-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) OPA2373AIDGSR ACTIVE MSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2373AIDGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2373AIDGST ACTIVE MSOP DGS 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2373AIDGSTG4 ACTIVE MSOP DGS 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2373AIDRCR ACTIVE SON DRC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2373AIDRCRG4 ACTIVE SON DRC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2373AIDRCT ACTIVE SON DRC 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2373AIDRCTG4 ACTIVE SON DRC 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2374AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2374AIDCNR ACTIVE SOT-23 DCN 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2374AIDCNRG4 ACTIVE SOT-23 DCN 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2374AIDCNT ACTIVE SOT-23 DCN 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2374AIDCNTG4 ACTIVE SOT-23 DCN 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2374AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2374AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2374AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA373AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 1 Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 21-Jul-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) OPA373AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA373AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA373AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA373AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA373AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA373AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA373AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA374AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA374AIDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA374AIDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA374AIDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA374AIDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA374AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA374AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA374AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA4374AID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA4374AIDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA4374AIDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 2 Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 21-Jul-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) OPA4374AIDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA4374AIPWR ACTIVE TSSOP PW 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA4374AIPWRG4 ACTIVE TSSOP PW 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA4374AIPWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA4374AIPWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing OPA2373AIDGSR MSOP DGS 10 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2373AIDGST MSOP DGS 10 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2373AIDRCR SON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 OPA2373AIDRCT SON DRC 10 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 OPA2374AIDCNR SOT-23 DCN 8 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 OPA2374AIDCNT SOT-23 DCN 8 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 OPA2374AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA373AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA374AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA4374AIDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 OPA4374AIPWR TSSOP PW 14 2500 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 OPA4374AIPWT TSSOP PW 14 250 180.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2373AIDGSR MSOP DGS 10 2500 367.0 367.0 35.0 OPA2373AIDGST MSOP DGS 10 250 210.0 185.0 35.0 OPA2373AIDRCR SON DRC 10 3000 367.0 367.0 35.0 OPA2373AIDRCT SON DRC 10 250 210.0 185.0 35.0 OPA2374AIDCNR SOT-23 DCN 8 3000 210.0 185.0 35.0 OPA2374AIDCNT SOT-23 DCN 8 250 210.0 185.0 35.0 OPA2374AIDR SOIC D 8 2500 367.0 367.0 35.0 OPA373AIDR SOIC D 8 2500 367.0 367.0 35.0 OPA374AIDR SOIC D 8 2500 367.0 367.0 35.0 OPA4374AIDR SOIC D 14 2500 367.0 367.0 38.0 OPA4374AIPWR TSSOP PW 14 2500 367.0 367.0 35.0 OPA4374AIPWT TSSOP PW 14 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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