MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
REV 1
© Motorola, Inc. 2004
Order number: MMA3202 D
Rev 1, 1/2004
Surface Mount
Micromachined Ac celerometer
The MMA3200 series of dual axis (X and Y) silicon capacitive, micro-
machined accelerometers features signal conditioning, a 4-pole low
pass filter , temperature compensation and separate outputs for the two
axes. Zero-g offset full scale span and filter cut-off are factory set and
require no external devices. A full system self-test capability verifies
system functionality."
Features
Sensitivity in two separate axes: 100g X-axis and 50g Y-axis
Integral Signal Conditioning
Linear Output
Ratiometric Performance
4th Order Bessel Filter Preserves Pulse Shape Integrity
Calibrated Self-test
Low Voltage Detect, Clock Monitor, and EPROM Parity Check Status
Transducer Hermetically Sealed at Wafer Level for Superior Reliability
Robust Design, High Shocks Survivability
Typical Applications
Vibration Monitoring and Recording
Impact Monitoring
Appliance Control
Mechanical Bearing Monitoring
Computer Hard Drive Protection
Computer Mouse and Joysticks
Virtual Reality Input Devices
Sport Diagnostic Devices and Systems
ORDERING INFORMATION
Device Temper at ur e Ran ge Case No. Packa ge
MMA3202D – 40 to +125°C Case 475A-01 SOIC-20
MMA3202D: X-Y AXIS SENSITIVITY
MICROMACHINED
ACCELEROMETER
±100/50g
20 LEAD SOIC
CASE 475A-01
MMA3202D
14
15
16
17
18
19
20
8
7
6
5
4
3
2
1
13
N/C
N/C
N/C
ST
XOUT
STATUS
VDD
GND
N/C
N/C
N/C
N/C
N/C
N/C
N/C
12
10
911
VSS
AVDD
N/C
YOUT
N/C
PIN ASSIGNMENT
Figure 1. Simplified Accelerometer Functional Block Diagram
G-CELL
SENSOR INTEGRATOR GAIN FILTER TEMP
COMP
SELF-TEST CONTROL LOGIC &
EPROM TRIM
CIRCUITS CLOCK GEN.
OSCILLATOR
VDD
XOUT
VSS
ST
STATUS
AVDD
YOUT
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2 Surface Mount Micromachined Accelerometer MOTOROLA
MMA3202D
Maximum Ratings (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.)
NOTES:
1. Dropped onto concrete surface from any axis.
ELECTRO STATIC DISCHARGE (ESD)
WARNING: This device is sensitive to electrostatic
discharge.
Although the Motorola accelerometers contain internal
2kV ESD protection circuitry, extra precaution must be
taken by the user to protect the chip from ESD. A charge
of over 2000 volts can accumulate on the human body or
associated test equipment. A charge of this magnitude
can alter the performance or cause failure of the chip.
When handling the accelerometer, proper ESD precau-
tions should be followed to avoid exposing the device to
discharges which may be detrimental to its performance.
Rating Symbol Value Unit
Powe red A c celeration (all axes) Gpd 1500 g
Unpowered Acceleration (all axes) Gupd 2000 g
Supply Voltage VDD –0.3 to +7.0 V
Drop Test (1) Ddrop 1.2 m
Storage Temperature Range Tstg –40 to +125 °C
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MOTOROLA Surface Mount Micromachined Accelerometer 3
MMA3202D
Operating Characteristics
(Unless otherwise noted: –40°C TA +105°C, 4.75 VDD 5.25, Acceleration = 0g, Loaded output(1))
NOTES:
1. For a loaded output the measurements are observed after an RC filter consisting of a 1 k resistor and a 0.01 µF ca pacitor to grou n d.
2. These limits define the range of operation for which t he part will meet specification.
3. Within th e su pply r ang e o f 4. 75 a nd 5.25 volt s, the dev ice ope rates as a ful ly calib rat ed linear a c celero meter. Beyond t hese suppl y limits the dev ice may
operate as a linear device but is not guaranteed to be in calibration.
4. The device can measure both + and – ac celeration. With no input acceleration the output is at midsupply. For positive acceleration the out put will
increas e above VDD/2 and for nega tiv e acceleration the output will decrease below VDD/2.
5. The device is calibrated at 20g.
6. At clock frequency 70 kHz.
7. The digital input pin has an internal pull- down current sourc e to prevent inad vertent self te st initiation due to external board level leakage s.
8. Time for the ou tput to reach 90% of i ts final value after a self-test is initiated.
9. Time for amplifiers to recover after an acceleratio n signal causing them to satura te.
10. Preserves pha se margin (60°) to guarantee ou tpu t amplifier stabilit y.
11. A measure of the device's ability to reject an acceleration applied 90° from the true axis of sensitivity.
12. The Status pin output is not valid following power-up until at least one rising edge has been applied to the self-te st pin. The Status pin is high whenever
the self-test input is high, as a means to check the connecti vity of the self-test and Status pins in the application.
13. The S tatus pin output latches high if a Low Voltage Detection or Cl ock Frequency failure occurs, or the EPROM parity changes to odd. The Status pin
can be reset low if the self-te st pin is pulsed with a high input for at least 100 µs, unless a fault condition continues to exist.
Characteristic Symbol Min Typ Max Unit
Operating Range (2)
Supply V oltag e (3)
Supply C urrent
Operating Temperature Range
Acceleration Range X-axis
Acceleration Range Y-axis
VDD
IDD
TA
gFS
gFS
4.75
6
40
5.00
8
112.5
56.3
5.25
10
+125
V
mA
°C
g
g
Output Signal
Zero g (TA = 25°C, VDD = 5.0 V)(4)
Zero g
Sensitivity X-axis (TA = 25°C, VDD = 5.0 V)(5)
Sensitivity Y-axis (TA = 25°C, VDD = 5.0 V)(5)
Sensitivity X-axis
Sensitivity Y-axis
Bandwidth Response
Nonlinearity
VOFF
VOFF,v
S
S
SV
SV
f–3dB
NLOUT
2.35
0.46VDD
19
38
3.72
7.44
360
1.0
2.5
0.50 VDD
20
40
4
8
400
2.65
0.54 VDD
21
42
4.28
8.56
440
+1.0
V
V
mV/g
mV/g
mV/g/V
mV/g/V
Hz
% FSO
Noise
RMS (.01 Hz – 1 kHz)
Power S pect ral D ensit y
Clock Noise (without RC load on output)(6)
nRMS
nPSD
nCLK
110
2.0
2.8
mVrms
µV/(Hz1/2)
mVpk
Self-Test
Output Response
Input Low
Input High
Input Loading(7)
Response Time(8)
gST
VIL
VIH
IIN
tST
9.6
VSS
0.7 x VDD
30
12
100
2.0
14.4
0.3 x VDD
VDD
300
g
V
V
µA
ms
Status(12)(13)
Output Low (Iload = 100 µA)
Output High (Iload = 100 µA) VOL
VOH
VDD –0.8
0.4
V
V
Mini mum Supply Vo ltage (LVD Trip) VLVD 2.7 3.25 4.0 V
Clock Monitor Fail Detection Frequency fmin 50 260 kHz
Output Stage Performance
Electrica l Satu rat ion Recovery Time(9)
Full Scale Output Range (IOUT = 200 µA)
Capacitive Load Drive(10)
Output Impedence
tDELAY
VFSO
CL
ZO
0.25
0.2
300
VDD 0.25
100
ms
V
pF
Mechanical Characteristics
Transverse Sensitivity(11)
Package Resonance VXZ,YZ
fPKG
10 5.0
% FSO
kHz
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4 Surface Mount Micromachined Accelerometer MOTOROLA
MMA3202D
PRINCIPLE OF OPERATION
The Motorola accelerometer is a surface-microma-
chined integrated-circuit accelerometer.
The device consists of a surface micromachined ca-
pacitive sensing cell (g-cell) and a CMOS signal condi-
tioning ASIC contained in a single integrated circuit
package. The sensing element is sealed hermetically at
the wafer level using a bulk micromachined “cap'' wafer.
The g-cell is a mechanical structure formed from semi-
condu cto r mater ial s (poly s il icon ) usi ng se mic on duc tor
processes (masking and etching). It can be modeled as
a set of beams att ached to a movable central mass that
move between fixed beams. The movable beams can be
deflected from their rest position by subjecting the sys-
tem to an acceleration (Figure 2).
As the beams attached to the central mass move, the
distance from them to the fixed beams on one side will in-
crease by the same amount that the distance to the fixed
beams on the other side decreases. The change in dis-
tance is a measure of acceleration.
The g-cell plates form two back-to- back capacitors
(Figure 2). As the central mass moves with acceleration,
the distance between the beams change and each ca-
pacitor's value will change, (C = NAε/D). Where A is the
area of the facing side of the beam, ε is the dielectric con-
stant, D is the distance between the beams, and N is the
number of beams. The X-Y device contains two struc-
tures at right angles to each other.
The CMOS ASIC uses switched capacitor techniques
to measure the g-cell capacitors and extract the acceler-
ation data from the difference between the two capaci -
tors. The ASIC also signal conditions and filters
(switched capacitor) the signal, providing a high level out-
put voltage that is ratiometric and proportional to acceler-
ation.
Figure 1. Simplified Transducer Physical Model
SPECIAL FEATURES
Filtering
The Motorola accelerometers contain an onboard 4-
pole switched capacitor filter . A Bessel implementation is
used because it provides a maximally flat delay response
(linear phase) thus preserving pulse shape integrity. Be-
cause the filter is realized using switched capacitor tech-
niques, there is no requirement for external passive
components (resistors and capacitors) to set the cut-off
frequency.
Self-Test
The sensor provides a self-test feature that allows the
verification of the mechanical and electrical integrity of
the accelerometer at any time before or after installation.
This feature is critical in applications such as automotive
airbag systems where system integrity must be ensured
over the life of the vehicle. A fourth “plate'' is used in the
g-cell as a self-test plate. When the user applies a logic
high input to the self-test pin, a calibrated potential is ap-
plied across the self-test plate and the moveable plate.
The resulting electrostatic force (Fe = 1/2AV2/d2) causes
the center plate to deflect. The resultant deflection is
measured by the accelerometer's control ASIC and a
proportional output voltage results. This procedure as-
sures that both the mechanical (g-cell) and electronic
sections of the accelerometer are functioning.
Ratiometricity
Ratiometricity simply means that the output offset volt-
age and sensitivity will scale linearly with applied supply
voltage. That is, as you increase supply voltage the sen-
sitivity and offset increase linearly; as supply voltage de-
creases, offset and sensitivity decrease linearly. This is
a key feature when interfacing to a microcontroller or an
A/D converter because it provides system level cancella-
tion of supply induced errors in the analog to digital con-
version process.
Status
Motorola accelerometers include fault detection cir-
cuitry and a fault latch. The Status pin is an output from
the fault latch, OR'd with self-test, and is set high when-
ever one (or more) of the following events occur:
Supply voltage falls below the Low Voltage Detect
(LVD) voltage threshold
Acceleration
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MOTOROLA Surface Mount Micromachined Accelerometer 5
MMA3202D
Clock oscillator falls below the clock monitor minimum
frequency
Parity of the EPROM bits becomes odd in number.
The fault latch can be reset by a falling edge on the
self-test input pin, unless one (or more) of the fault con-
ditions continues to exist.
BASIC CONNECTIONS
Figure 3. SOIC Accelerometer with Recommended
Connec tion Diagr am
Figure 4. Recommended PCB Layout for Interfacing
Accelerometer to Microcontroller
NOTES:
• Use a 0.1
µ
F capacitor on VDD to decouple the power source.
• Physical coupling distance of the accelerometer to the
microcontroller should be minimal.
• Place a ground plane beneath the accelerometer to reduce
noise , the gro un d pla ne shou ld be atta ch ed to all of the o pen
ended terminals shown in Figure 4.
• Use an RC filter of 1 k
and 0.01
µ
F on th e outpu t of the
acce lerometer to minimize clock noise (from the switched
capacitor filter circuit).
• PC B layou t of pow er and gr ound sh ould not couple p ower su pply
noise.
• Accel erometer and microcontroll er should not be a high
current path.
• A/D sampli ng rate and any extern al power supp ly switch ing
frequency should be selected such that they do not interfere
with the internal accelerometer sampling frequency. This will
prevent aliasing errors.
Pin No. Pin Name Description
1 thru 3 Redundant VSS. Leave
unconnected.
4 No internal connection. Leave
unconnected.
5 ST Logic input pin used to initiate self-
test.
6X
OUT Output voltage of the accelerometer.
X Direction.
7 STATUS Logic output pin to indicate fault.
8V
SS The power supply ground.
9V
DD The power supply input.
10 AVDD The power supply input (Analog).
11 YOUT Output voltage of the accelerometer.
Y Direction.
12 thru 16 Used for factory trim. Leave
unconnected.
17 thru 19 No internal connection. Leave
unconnected.
20 Ground
14
15
16
17
18
19
20
8
7
6
5
4
3
2
1
13
N/C
N/C
N/C
ST
XOUT
STATUS
VDD
GND
N/C
N/C
N/C
N/C
N/C
N/C
N/C
12
10
911
VSS
AVDD
N/C
YOUT
N/C
Pinout Description
10
XOUT
YOUT
MMA3202D
VSS
X OUTPU T
SIGNAL
R1
1 k
C2
0.01
µ
F
5
9
8
LOGIC
INPUT
VDD
C1
0.1 µF
7
6
Y OUTPU T
SIGNAL
C3
0.01
µ
F
R2
1 k
AVDD
11
STATUS
ST
VDD
C
P
CB Layout
P0
A/D IN
VRH
VSS
VDD
ST
YOUT
VSS
VDD
0.01 µF
C
1 k
0.1 µF
POWER SUPPLY
R0.1 µF
P1
STATUS
A/D IN
XOUT R0.01 µF
C
1 k
MICROCONTROLLER
ACCELEROMETER
C
C0.01 µF
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6 Surface Mount Micromachined Accelerometer MOTOROLA
MMA3202D
X
14
15
16
17
18
19
20
8
7
6
5
4
3
2
1
13
N/C
N/C
N/C
ST
XOUT
STATUS
VDD
GND
N/C
N/C
N/C
N/C
N/C
N/C
N/C
12
10
911
VSS
AVDD
N/C
YOUT
N/C
+Y
+X
Direction of Earth’s gravity field.*
* When positioned as shown, the Earth’s gravity will result in a positive 1g output in the X channel.
Front View Side View
Top View
Static Acceleration Sensing Direction
Dynamic Acceleration Sensing Direction
Acceleration of the
package in the +X and
+Y direction (center plates
move in the X and Y
direction) will result in an
increase X and Y outputs.
20-Pin SOIC Package
N/C pins are recommended to be left FLOATING
Y
11 12 13 14 15 16 17 18 19 20
10987654321
Activation of Self test moves
the center plate in the X
direction, resulting in an
increase in the output.
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MOTOROLA Surface Mount Micromachined Accelerometer 7
MMA3202D
PACKAGE DIMENSIONS
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICAT IONS
Surface mount board layout is a critical portion of the
total design. The footprint for the surface mount packag-
es must be the correct size to ensure proper solder con-
nection inter face between the board and the package.
With the correct footprint, the packages will self-align
when subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer
to avoid bridging and shorting between solder pads.
DATE 02/10/98
CASE 475A-01
ISSUE O
-T-
C
K
G
SEATING
PLANE
110
20 11
-B-
-A-
P
10 PL
D
16 PL
M
A
M
0.13 (0.005) B
M
T
M
A
M
0.13 (0.005) B
M
T
INCHESMILLIMETERS
1.27 BSC 0.050 BSC
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
12.67
7.40
3.30
0.35
0.76
0.25
0.10
10.16
0.25
MAX
12.96
7.60
3.55
0.49
1.14
0.32
0.25
10.67
0.75
MIN
0.499
0.292
0.130
0.014
0.030
0.010
0.004
0.400
0.010
MAX
0.510
0.299
0.140
0.019
0.045
0.012
0.009
0.420
0.029
R
X 45˚
J
F
M
NOTES:
1.
2.
3.
4.
5.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER.
DEMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
20 LEAD SOIC
Figure 5. Footprint SOIC-20 (Case 475A-01)
0.380 in.
9.65 mm
0.050 in.
1.27 mm
0.024 in.
0.610 mm
0.080 in.
2.03 mm
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P.O. Box 5405, Denver, Colorado 80217 81-3-3440-3569
1-800-521-6274 or 480-768-2130 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre
2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong
852-26668334
HOME PAGE: http:/ /motorola.com/semiconductors
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regarding the suitability of its products for any particular purpose, nor does Motorola assu me any liability arising out of the ap pli cat io n or use of a ny pro du ct
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provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over tim e. A ll op erat in g
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respective owners.
© Motorola, Inc. 2004
MMA3202D
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