1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOT23 small Surface
Mounted Device (SMD) plastic package.
1.2 Features
■Forward current: 0.5 A
■Very low forward voltage
■Small SMD plastic package
1.3 Applications
■Low voltage rectification
■High efficiency DC-to-DC conversion
■Switch mode power supply
■Inverse polarity protection
■Low power consumption applications
PMEGxx05ET series
0.5 A very low VF MEGA Schottky barrier rectifiers in
SOT23 package
Rev. 01 — 15 July 2005 Product data sheet
Table 1: Product overview
Type number Package Configuration
Philips JEITA
PMEG2005ET SOT23 - single diode
PMEG3005ET SOT23 - single diode
PMEG4005ET SOT23 - single diode
9397 750 15183 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 15 July 2005 2 of 12
Philips Semiconductors PMEGxx05ET series
0.5 A very low VF MEGA Schottky barrier rectifiers in SOT23 package
1.4 Quick reference data
[1] Pulse test: tp≤300 µs; δ≤0.02.
2. Pinning information
3. Ordering information
Table 2: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IFforward current - - 0.5 A
VRreverse voltage
PMEG2005ET - - 20 V
PMEG3005ET - - 30 V
PMEG4005ET - - 40 V
VFforward voltage IF= 500 mA [1]
PMEG2005ET - 355 390 mV
PMEG3005ET - 380 430 mV
PMEG4005ET - 420 470 mV
Table 3: Pinning
Pin Description Simplified outline Symbol
1 anode
2 not connected
3 cathode
12
3
mlc357
2
n.c.
1
3
Table 4: Ordering information
Type number Package
Name Description Version
PMEG2005ET - plastic surface mounted package; 3 leads SOT23
PMEG3005ET - plastic surface mounted package; 3 leads SOT23
PMEG4005ET - plastic surface mounted package; 3 leads SOT23
9397 750 15183 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 15 July 2005 3 of 12
Philips Semiconductors PMEGxx05ET series
0.5 A very low VF MEGA Schottky barrier rectifiers in SOT23 package
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
[1] For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating will be available on request.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
Table 5: Marking codes
Type number Marking code[1]
PMEG2005ET P3*
PMEG3005ET P4*
PMEG4005ET P5*
Table 6: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRreverse voltage
PMEG2005ET - 20 V
PMEG3005ET - 30 V
PMEG4005ET - 40 V
IFforward current - 0.5 A
IFRM repetitive peak forward current tp≤1 ms; δ≤0.5 - 3.9 A
IFSM non-repetitive peak forward
current tp= 8 ms square
wave [1] -10A
Ptot total power dissipation Tamb ≤25 °C[1] - 280 mW
[2] - 420 mW
Tjjunction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
Table 7: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1] [2] - - 440 K/W
[1] [3] - - 300 K/W
9397 750 15183 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 15 July 2005 4 of 12
Philips Semiconductors PMEGxx05ET series
0.5 A very low VF MEGA Schottky barrier rectifiers in SOT23 package
7. Characteristics
[1] Pulse test: tp≤300 µs; δ≤0.02.
Table 8: Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage [1]
PMEG2005ET IF= 0.1 mA - 90 130 mV
IF= 1 mA - 150 190 mV
IF= 10 mA - 210 240 mV
IF= 100 mA - 280 330 mV
IF= 500 mA - 355 390 mV
PMEG3005ET IF= 0.1 mA - 90 130 mV
IF= 1 mA - 150 200 mV
IF= 10 mA - 215 250 mV
IF= 100 mA - 285 340 mV
IF= 500 mA - 380 430 mV
PMEG4005ET IF= 0.1 mA - 95 130 mV
IF= 1 mA - 155 210 mV
IF= 10 mA - 220 270 mV
IF= 100 mA - 295 350 mV
IF= 500 mA - 420 470 mV
IRreverse current
PMEG2005ET VR=10V - 15 40 µA
VR= 20 V - 40 200 µA
PMEG3005ET VR=10V - 12 30 µA
VR= 30 V - 40 150 µA
PMEG4005ET VR=10V - 7 20 µA
VR= 40 V - 30 100 µA
Cddiode capacitance VR= 1 V; f = 1 MHz
PMEG2005ET - 66 80 pF
PMEG3005ET - 55 70 pF
PMEG4005ET - 43 50 pF
9397 750 15183 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 15 July 2005 5 of 12
Philips Semiconductors PMEGxx05ET series
0.5 A very low VF MEGA Schottky barrier rectifiers in SOT23 package
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb =85°C
(4) Tamb =25°C
(5) Tamb =−40 °C
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb =85°C
(4) Tamb =25°C
(5) Tamb =−40 °C
Fig 1. PMEG2005ET: Forward current as a function of
forward voltage; typical values Fig 2. PMEG2005ET: Reverse current as a function of
reverse voltage; typical values
Tamb =25°C; f = 1 MHz
Fig 3. PMEG2005ET: Diode capacitance as a function of reverse voltage; typical values
006aaa517
10
102
103
104
IF
(mA)
1
VF (V)
0 0.60.40.2
(3)(2)(1) (4) (5)
006aaa518
IR
(µA)
1
10−2
10−1
104
103
102
10
105
10−3
VR (V)
02015510
(3)
(2)
(1)
(4)
(5)
VR (V)
020168124
006aaa249
40
80
120
Cd
(pF)
0
9397 750 15183 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 15 July 2005 6 of 12
Philips Semiconductors PMEGxx05ET series
0.5 A very low VF MEGA Schottky barrier rectifiers in SOT23 package
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb =85°C
(4) Tamb =25°C
(5) Tamb =−40 °C
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb =85°C
(4) Tamb =25°C
(5) Tamb =−40 °C
Fig 4. PMEG3005ET: Forward current as a function of
forward voltage; typical values Fig 5. PMEG3005ET: Reverse current as a function of
reverse voltage; typical values
Tamb =25°C; f = 1 MHz
Fig 6. PMEG3005ET: Diode capacitance as a function of reverse voltage; typical values
006aaa519
10
102
103
104
IF
(mA)
1
VF (V)
0 0.80.60.2 0.4
(3)(2)(1) (4) (5)
006aaa520
IR
(µA)
1
10−2
10−1
104
103
102
10
105
10−3
VR (V)
03025510 2015
(3)
(2)
(1)
(4)
(5)
VR (V)
0302010
006aaa252
40
80
120
Cd
(pF)
0
9397 750 15183 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 15 July 2005 7 of 12
Philips Semiconductors PMEGxx05ET series
0.5 A very low VF MEGA Schottky barrier rectifiers in SOT23 package
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb =85°C
(4) Tamb =25°C
(5) Tamb =−40 °C
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb =85°C
(4) Tamb =25°C
(5) Tamb =−40 °C
Fig 7. PMEG4005ET: Forward current as a function of
forward voltage; typical values Fig 8. PMEG4005ET: Reverse current as a function of
reverse voltage; typical values
Tamb =25°C; f = 1 MHz
Fig 9. PMEG4005ET: Diode capacitance as a function of reverse voltage; typical values
006aaa521
10
102
103
104
IF
(mA)
1
VF (V)
0 1.00.80.4 0.60.2
(3)(1) (4) (5)(2)
006aaa522
IR
(µA)
1
10−2
10−1
104
103
102
10
105
10−3
VR (V)
0403010 20
(3)
(2)
(1)
(4)
(5)
VR (V)
0403010 20
006aaa255
40
60
20
80
100
Cd
(pF)
0
9397 750 15183 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 15 July 2005 8 of 12
Philips Semiconductors PMEGxx05ET series
0.5 A very low VF MEGA Schottky barrier rectifiers in SOT23 package
8. Package outline
9. Packing information
[1] For further information and the availability of packing methods, see Section 16.
Fig 10. Package outline SOT23 (TO-236AB)
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1 1.4
1.2
0.48
0.38 0.15
0.09
12
3
Table 9: Packing methods
The -xxx numbers are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
PMEG2005ET SOT23 4 mm pitch, 8 mm tape and reel -215 -235
PMEG3005ET
PMEG4005ET
9397 750 15183 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 15 July 2005 9 of 12
Philips Semiconductors PMEGxx05ET series
0.5 A very low VF MEGA Schottky barrier rectifiers in SOT23 package
10. Soldering
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 11. Reflow soldering footprint SOT23 (TO-236AB)
MSA439
1.00
0.60
(3x)
1.30
12
3
2.50
3.00 0.85 2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85
solder lands
solder resist
occupied area
solder paste
9397 750 15183 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 15 July 2005 10 of 12
Philips Semiconductors PMEGxx05ET series
0.5 A very low VF MEGA Schottky barrier rectifiers in SOT23 package
11. Revision history
Table 10: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
PMEGXX05ET_SER_1 20050715 Product data sheet - 9397 750 15183 -
Philips Semiconductors PMEGxx05ET series
0.5 A very low VF MEGA Schottky barrier rectifiers in SOT23 package
9397 750 15183 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 15 July 2005 11 of 12
12. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
13. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
14. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
15. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
16. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights. Date of release: 15 July 2005
Document number: 9397 750 15183
Published in The Netherlands
Philips Semiconductors PMEGxx05ET series
0.5 A very low VF MEGA Schottky barrier rectifiers in SOT23 package
17. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
9 Packing information. . . . . . . . . . . . . . . . . . . . . . 8
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
12 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 11
13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
14 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
16 Contact information . . . . . . . . . . . . . . . . . . . . 11
