DataSheeT - enpirion(R) power solutions EP53A7xQI 1A PowerSoC Step-Down DC-DC Switching Converter with Integrated Inductor DESCRIPTION FEATURES The EP53A7xQI (x = L or H) is a 1000mA PowerSOC. The EP53A7xQI integrates MOSFET switches, control, compensation, and the magnetics in an advanced 3mm x 3mm QFN Package. * Integrated Inductor Technology * 3mm x 3mm x 1.1mm QFN Package * Total Solution Footprint < 21mm2 * Low VOUT Ripple for IO Compatibility * High Efficiency, up to 94% * 1000mA continuous output current * 55A quiescent current * Less than 1A standby current * 5 MHz switching frequency * 3 pin VID for glitch free voltage scaling * VOUT Range 0.6V to VIN - 0.5V * Short Circuit and Over Current Protection * UVLO and Thermal Protection * IC Level Reliability in a PowerSoC Solution Integrated magnetics enables a tiny solution footprint, low output ripple, low part-count, and high reliability, while maintaining high efficiency. The complete solution can be implemented in as little as 21mm2. A proprietary light load mode (LLM) provides high efficiency in light load conditions. The EP53A7xQI uses a 3-pin VID to easily select the output voltage setting. Output voltage settings are available in 2 optimized ranges providing coverage for typical VOUT settings. The VID pins can be changed on the fly for fast dynamic voltage scaling. EP53A7LQI further has the option to use an external voltage divider. The EP53A7xQI offers the optimal combination of very small solution footprint and advanced performance features. All Enpirion products are RoHS compliant and leadfree manufacturing environment compatible. APPLICATIONS * Portable Wireless and RF applications * Solid State Storage Applications * Space constrained applications requiring high efficiency and very small solution size 3.5mm 4.7uF 100 ohm 100 Ohm VIN 6mm EP53A7xQI 4.7F PVIN VOUT AVIN VSENSE ENABLE LLM VS0 VFB VOUT 10F VS1 VS2 PGND AGND 10uF Figure 2. Simplified Applications Circuit Figure 1: Total Solution Footprint Page 1 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI ORDERING INFORMATION Part Number Package Markings TJ Rating Package Description EP53A7LQI ADXX -40C to +125C 16-pin (3mm x 3mm x 1.1mm) QFN EP53A7HQI AGXX -40C to +125C 16-pin (3mm x 3mm x 1.1mm) QFN EP53A7LQI-E EP53A7LQI Evaluation Board EP53A7HQI-E EP53A7HQI Evaluation Board Packing and Marking Information: https://www.intel.com/support/quality-and-reliability/packing.html PIN FUNCTIONS Figure 3. EP53A7LQI Pin Out Diagram (Top View) Figure 4. EP53A7HQI Pin Out Diagram (Top View) NOTE A: NC pins are not to be electrically connected to each other or to any external signal, ground or voltage. However, they must be soldered to the PCB. Failure to follow this guideline may result in part malfunction or damage. NOTE B: White `dot' on top left is pin 1 indicator on top of the device package. Page 2 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI PIN DESCRIPTIONS PIN NAME TYPE FUNCTION 1, 15, 16 NC(SW) - NO CONNECT - These pins are internally connected to the common switching node of the internal MOSFETs. NC (SW) pins are not to be electrically connected to any external signal, ground, or voltage. However, they must be soldered to the PCB. Failure to follow this guideline may result in part malfunction or damage to the device. 2 PGND Ground Power ground. Connect this pin to the ground electrode of the Input and output filter capacitors. 3 LLM Analog LLM ( Light load mode - "LLM") pin. Logic-High enables automatic LLM/PWM and logic-low places the device in fixed PWM operation. 4 VFB/ NC Analog 5 VSENSE Analog Sense pin for preset output voltages. Refer to application section for proper configuration. 6 AGND Power Analog ground. This is the quiet ground for the internal control circuitry, and the ground return for external feedback voltage divider 7, 8 VOUT Power Regulated Output Voltage. Refer to application section for proper layout and decoupling. EP53A7LQI: Feedback pin for external divider option. EP53A7HQI: No Connect Output voltage select. VS2 = pin 9, VS1 = pin 10, VS0 = pin 11. 9, 10, 11 VS2, VS1, VS0 Analog EP53A7LQI: Selects one of seven preset output voltages or an external resistor divider. EP53A7HQI: Selects one of eight preset output voltages. (Refer to section on output voltage select for more details.) 12 ENABLE Analog Output Enable. Enable = logic high; Disable = logic low 13 AVIN Power Input power supply for the controller circuitry. Connect to PVIN through a 100 Ohm resistor. 14 PVIN Power Input Voltage for the MOSFET switches. Page 3 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI ABSOLUTE MAXIMUM RATINGS CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond the recommended operating conditions is not implied. Stress beyond the absolute maximum ratings may impair device life. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Absolute Maximum Pin Ratings PARAMETER SYMBOL MIN MAX UNITS Input Supply Voltage -0.3 6.0 V ENABLE, VSENSE, VSO - VS2 -0.3 VIN+0.3 V VFB (EP53A7LQI) -0.3 2.7 V MIN MAX UNITS +150 C +150 C +260 C MAX UNITS Absolute Maximum Thermal Ratings PARAMETER CONDITION Maximum Operating Junction Temperature Storage Temperature Range Reflow Peak Body Temperature -65 (10 Sec) MSL3 JEDEC J-STD-020A Absolute Maximum ESD Ratings PARAMETER CONDITION MIN HBM (Human Body Model) 2000 V RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN MAX UNITS Input Voltage Range VIN 2.7 5.5 V Operating Ambient Temperature Range TA -40 +85 C Operating Junction Temperature TJ -40 +125 C THERMAL CHARACTERISTICS PARAMETER Thermal Resistance: Junction to Ambient -0 LFM (1) Thermal Overload Trip Point Thermal Overload Trip Point Hysteresis SYMBOL TYPICAL UNITS JA 80 C/W TJ-TP +155 C 25 C (1) Based on 2oz. external copper layers and proper thermal design in line with EIJ/JEDEC JESD51-7 standard for high thermal conductivity boards. Page 4 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI ELECTRICAL CHARACTERISTICS NOTE: TA = -40C to +85C unless otherwise noted. Typical values are at TA = 25C, VIN = 3.6V. CIN = -4.7F MLCC, COUT = 10F MLCC PARAMETER Operating Input Voltage SYMBOL TEST CONDITIONS MIN TYP 2.4 VIN MAX UNITS 5.5 V Under Voltage LockOut - VIN Rising VUVLO_R 2.0 V Under Voltage LockOut - VIN Falling VUVLO_F 1.9 V/ms Drop Out Resistance RDO Input to Output Resistance Output Voltage Range VOUT EP53A7LQI (VDO = ILOAD X RDO) EP53A7HQI Dynamic Voltage Slew Rate VSLEW EP53A7HQI EP53A7LQI VID Preset VOUT Initial Accuracy 350 0.6 1.8 500 m VIN-VDO 3.3 V 8 4 V/ms TA = 25C, VIN = 3.6V; VOUT ILOAD = 100mA ; -2 +2 % 0.612 V 0.8V VOUT 3.3V VFB Pin Voltage (Load and Temperature) TA = 25C, VIN = 3.6V; VVFB ILOAD = 100mA ; 0.588 0.6 0.8V VOUT 3.3V Line Regulation VOUT_LINE 2.4V VIN 5.5V 0.03 %/V Load Regulation VOUT_LOAD 0A ILOAD 1A 0.6 %/A Temperature Variation VOUT_TEMPL -40C TA +85C 30 ppm/ C Output Current Range IOUT Shut-down Current ISD Enable = Low EP53A7HQI Operating Quiescent Current IQ EP53A7LQI Operating Quiescent Current IQ OCP Threshold ILIM 1000 mA 0.75 A ILOAD=0; Preset Output Voltages, LLM=High 55 A ILOAD=0; Preset Output Voltages, LLM=High 65 A 1.4 A 2.4V VIN 5.5V 0.6V VOUT 3.3V 1.25 Page 5 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI PARAMETER Feedback Pin Input Current (1) SYMBOL TEST CONDITIONS MIN TYP MAX <100 IFB UNITS nA VS0-VS2, Pin Logic Low VVSLO 0.0 0.3 V VS0-VS2, Pin Logic High VVSHI 1.4 VIN V VS0-VS2, Pin Input Current (1) IVSX Enable Pin Logic Low VENLO Enable Pin Logic High VENHI Enable Pin Current (1) IENABLE <100 0.3 1.4 LLM Pin Logic Low VLLMLO LLM Pin Logic High VLLMHI V V <100 Minimum difference between VIN and VOUT to ensure proper LLM operation LLM Engage Headroom nA nA 700 mV 0.3 1.4 V V LLM Pin Current ILLM <100 nA Operating Frequency FOSC 5 MHz Soft Start Slew Rate VSS 8 4 V/ms Soft Start Rise Time (2) TSS EP53A7HQI (VID only) EP53A7LQI (VID only) EP53A7LQI (VFB mode) 170 225 280 s (1) Parameter guaranteed by design and characterization. (2) Measured from when VIN VUVLO_R & ENABLE pin crosses its logic High threshold. Page 6 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI 95 90 85 80 75 70 65 60 55 50 45 LLM Efficiency (%) Efficiency (%) TYPICAL PERFORMANCE CURVES VOUT=1.2V PWM 10 100 Load Current (mA) Efficiency (%) Efficiency (%) PWM 10 100 Load Current (mA) 1000 Efficiency vs. Load Current: VOUT = 2.5V, VIN (from top to bottom) = 3.3, 3.7, 4.3, 5.0V VOUT=1.8V PWM 100 Load Current (mA) 1000 Efficiency vs. Load Current: VOUT = 1.8V, VIN (from top to bottom) = 2.5, 3.3, 3.7, 4.3, 5.0V LLM VOUT=2.5V LLM 10 1000 Efficiency vs. Load Current: VOUT = 1.2V, VIN (from top to bottom) = 2.5, 3.3, 3.7, 4.3, 5.0V 95 90 85 80 75 70 65 60 55 50 45 95 90 85 80 75 70 65 60 55 50 45 95 90 85 80 75 70 65 60 55 50 45 LLM PWM 10 VOUT=3.3V 100 Load Current (mA) 1000 Efficiency vs. Load Current: VOUT = 3.3V, VIN (from top to bottom) = 3.7, 4.3, 5.0V Page 7 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI TYPICAL PERFORMANCE CHARACTERISTICS Start Up Waveform: VIN = 5.0V, VOUT = 3.3V; Start Up Waveform: VIN = 5.0V, VOUT = 3.3V; ILOAD = 10mA; VID Mode ILOAD = 1000mA; VID Mode Shut-down Waveform: VIN = 5.0V, VOUT = 3.3V; Shut-down Waveform: VIN = 5.0V, VOUT = 3.3V; ILOAD = 10mA, PWM ILOAD = 1000mA, PWM Page 8 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED) 5mV/Div 50mV/Div Output Ripple: VIN = 5.0V, VOUT = 1.2V, Load = 10mA LLM enabled Output Ripple: VIN = 5.0V, VOUT = 1.2V, Load = 1A 5mV/Div 50mV/Div Output Ripple: VIN = 5.0V, VOUT = 3.3V, Load = 10mA LLM enabled Output Ripple: VIN = 5.0V, VOUT = 3.3V, Load = 1A Page 9 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED) 5mV/Div 50mV/Div Output Ripple: VIN = 3.3V, VOUT = 1.8V, Load = 10mA Output Ripple: VIN = 3.3V, VOUT = 1.8V LLM enabled Load = 1A 5mV/Div 50mV/Div Output Ripple: VIN = 3.3V, VOUT = 1.2V, Load = 10mA Output Ripple: VIN = 3.3V, VOUT = 1.2V, LLM enabled Load = 1A Page 10 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED) Load Transient: VIN = 5.0V, VOUT = 3.3V Load Transient: VIN = 5.0V, VOUT = 3.3V Load stepped from 0mA to 1000mA Load stepped from 10mA to 1000mA, LLM enabled Load Transient: VIN = 5.0V, VOUT = 1.2V Load Transient: VIN = 5.0V, VOUT = 1.2V Load stepped from 0mA to 1000mA Load stepped from 10mA to 1000mA, LLM enabled Page 11 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED) Load Transient: VIN = 3.7V, VOUT = 1.2V Load Transient: VIN = 3.7V, VOUT = 1.2V Load stepped from 0mA to 1000mA Load stepped from 10mA to 1000mA, LLM enabled Load Transient: VIN = 3.3V, VOUT = 1.8V Load Transient: VIN = 3.3V, VOUT = 1.8V Load stepped from 0mA to 1000mA Load stepped from 10mA to 1000mA, LLM enabled Page 12 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI FUNCTIONAL BLOCK DIAGRAM LLM PVIN UVLO Mode Logic Thermal Limit Current Limit ENABLE NC(SW) Soft Start P-Drive (-) Logic VOUT PWM Comp (+) N-Drive PGND VSENSE Sawtooth Generator Compensation Network Switch (-) VFB Error Amp (+) DAC VREF Voltage Select Package Boundry AVIN AGND VS0 VS1 VS2 Figure 5: Functional Block Diagram Page 13 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI FUNCTIONAL DESCRIPTION Synchronous DC-DC Step-Down PowerSoC The EP53A7xQI requires only 2 small MLCC capacitors and an 0201 resistor for a complete DC-DC converter solution. The device integrates MOSFET switches, PWM controller, Gate-drive, compensation, and inductor into a tiny 3mm x 3mm x 1.1mm QFN package. Advanced package design, along with the high level of integration, provides very low output ripple and noise. The EP53A7xQI uses voltage mode control for high noise immunity and load matching to advanced 90nm loads. A 3-pin VID allows the user to choose from one of 8 output voltage settings. The EP53A7xQI comes with two VID output voltage ranges. The EP53A7HQI provides VOUT settings from 1.8V to 3.3V, the EP53A7LQI provides VID settings from 0.8V to 1.5V, and also has an external resistor divider option to program output setting over the 0.6V to VIN-0.5V range. The EP53A7xQI provides the industry's highest power density of any 1A DCDC converter solution. The key enabler of this revolutionary integration is Altera Enpirion's proprietary power MOSFET technology. The advanced MOSFET switches are implemented in deep-submicron CMOS to supply very low switching loss at high switching frequencies and to allow a high level of integration. The semiconductor process allows seamless integration of all switching, control, and compensation circuitry. The proprietary magnetics design provides high-density/high-value magnetics in a very small footprint. Altera Enpirion magnetics are carefully matched to the control and compensation circuitry yielding an optimal solution with assured performance over the entire operating range. Protection features include under-voltage lock-out (UVLO), over-current protection (OCP), short circuit protection, and thermal overload protection. Integrated Inductor The EP53A7xQI utilizes a proprietary low loss integrated inductor. The integration of the inductor greatly simplifies the power supply design process. The integrated inductor provides the optimal solution to the complexity, output ripple, and noise that plague low power DC-DC converter design. Voltage Mode Control The EP53A7xQI utilizes an integrated type III compensation network. Voltage mode control is inherently impedance matched to the sub 90nm process technology that is used in today's advanced ICs. Voltage mode control also provides a high degree of noise immunity at light load currents so that low ripple and high accuracy are maintained over the entire load range. The very high switching frequency allows for a very wide control loop bandwidth and hence excellent transient performance. Light Load Mode (LLM) Operation The EP53A7xQI uses a proprietary light load mode to provide high efficiency in the low load operating condition. When the LLM pin is high, the device is in automatic LLM/PWM mode. When the LLM pin is low, the device is in PWM mode. In automatic LLM/PWM mode, when a light load condition is detected, the device will (1) step VOUT up by approximately 1.5% above the nominal operating output voltage setting, VNOM, and then (2) shut down unnecessary circuitry, and (3) monitor VOUT. When VOUT falls below VNOM, the device will repeat (1), (2), and (3). The voltage step up, or pre-positioning, improves transient droop when a load transient causes a transition from LLM mode to PWM mode. If a load transient occurs, causing VOUT to fall below the threshold VMIN, the device will exit LLM operation and begin normal PWM operation. Figure 6 demonstrates VOUT behavior during transition into and out of LLM operation. Page 14 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI LLM Ripple VMAX PWM Ripple VNOM VMIN VOUT Load Step IOUT Figure 6: VOUT Behavior in LLM Operation Device exits LLM, tests load current Figure 1: VOUT Droop during Periodic LLM Exit Many multi-mode DC-DC converters suffer from a condition that occurs when the load current increases only slowly so that there is no load transient driving VOUT below the VMIN threshold (shown in Figure 6). In this condition, the device would never exit LLM operation. This could adversely affect efficiency and cause unwanted ripple. To prevent this from occurring, the EP53A7xQI periodically exits LLM mode into PWM mode and measures the load current. If the load current is above the LLM threshold current, the device will remain in PWM mode. If the load current is below the LLM threshold, the device will re-enter LLM operation. There will be a small droop in VOUT at the point where the device exits and re-enters LLM, as shown in Figure 7. The load current at which the device will enter LLM mode is a function of input and output voltage. Figure 8 shows the typical value at which the device will enter LLM operation. The actual load current at which the device will enter LLM operation can vary by +/-30%. Table 1 shows the minimum load current below which the device is guaranteed to be in LLM operating mode. To ensure normal LLM operation, LLM mode should be enabled/disabled with specific sequencing. For applications with explicit LLM pin control, enable LLM after VIN ramp up complete; disable LLM before VIN ramp down. For applications with ENABLE control, tie LLM to ENABLE; enable device after VIN ramp up complete and disable device before VIN rampdown begins. For devices with ENABLE and LLM tied to VIN, contact Intel Applications engineering for specific recommendations. Page 15 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI LLM Threshold Current vs. VOUT LLM Threshold (mA) 250 200 150 VIN=5V (top curve) 100 VIN=4.2V VIN=3.7V 50 VIN=3.3V (bottom curve) 0 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 VOUT (V) Figure 2: Typical load current for LLM engage and disengage versus VOUT for selected input voltages Increased output filter capacitance and/or increased bulk capacitance at the load will decrease the magnitude of the LLM ripple. Refer to the section on output filter capacitance for maximum values of output filter capacitance and the Soft-Start section for maximum bulk capacitance at the load. NOTE: For proper LLM operation the EP53A7xQI requires a minimum difference between VIN and VOUT of 700mV. If this condition is not met, the device cannot be assured proper LLM operation. NOTE: Automatic LLM/PWM is not available when using the external resistor divider option for VOUT programming. Soft Start Internal soft start circuits limit in-rush current when the device starts up from a power down condition or when the "ENABLE" pin is asserted "high". Digital control circuitry limits the VOUT ramp rate to levels that are safe for the Power MOSFETS and the integrated inductor. The EP53A7HQI has a soft-start slew rate that is twice that of the EP53A7LQI. When the EP53A7LUI is configured in external resistor divider mode, the device has a fixed VOUT ramp time. Therefore, the ramp rate will vary with the output voltage setting. Output voltage ramp time is given in the Electrical Characteristics Table. Excess bulk capacitance on the output of the device can cause an over-current condition at startup. The maximum total capacitance on the output, including the output filter capacitor and bulk and decoupling capacitance, at the load, is given as: EP53A7LQI: COUT_TOTAL_MAX = COUT_Filter + COUT_BULK = 200F EP53A7HQI: COUT_TOTAL_MAX = COUT_Filter + COUT_BULK = 100F EP53A7LUI in external divider mode: COUT_TOTAL_MAX = 2.25x10-4/VOUT Farads The nominal value for COUT is 10F. See the applications section for more details. Page 16 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI Over Current/Short Circuit Protection The current limit function is achieved by sensing the current flowing through a sense P-MOSFET which is compared to a reference current. When this level is exceeded the P-FET is turned off and the N-FET is turned on, pulling VOUT low. This condition is maintained for approximately 0.5mS and then a normal soft start is initiated. If the over current condition still persists, this cycle will repeat. Under Voltage Lockout During initial power up, an under voltage lockout circuit will hold-off the switching circuitry until the input voltage reaches a sufficient level to insure proper operation. If the voltage drops below the UVLO threshold, the lockout circuitry will again disable the switching. Hysteresis is included to prevent chattering between states. Enable The ENABLE pin provides a means to shut down the converter or enable normal operation. A logic low will disable the converter and cause it to shut down. A logic high will enable the converter into normal operation. NOTE: The ENABLE pin must not be left floating. Thermal Shutdown When excessive power is dissipated in the chip, the junction temperature rises. Once the junction temperature exceeds the thermal shutdown temperature, the thermal shutdown circuit turns off the converter output voltage thus allowing the device to cool. When the junction temperature decreases by 25C, the device will go through the normal startup process. Page 17 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI APPLICATION INFORMATION Output Voltage Programming The EP53A7xQI utilizes a 3-pin VID to program the output voltage value. The VID is available in two sets of output VID programming ranges. The VID pins should be connected either to an external control signal, AVIN or to AGND to avoid noise coupling into the device. The VID pins must not be left floating. The "Low" range is optimized for low voltage applications. It comes with preset VID settings ranging from 0.80V and 1.5V. This VID set also has an external divider option. To specify this VID range, order part number EP53A7LQI. The "High" VID set provides output voltage settings ranging from 1.8V to 3.3V. This version does not have an external divider option. To specify this VID range, order part number EP53A7HQI. 100 ohm VIN 4.7F PVIN VOUT AVIN VSENSE ENABLE LLM VOUT 10F VS0 VS1 VS2 PGND AGND Figure 3: Application Circuit, EP53A7HQI. Note that all control signals should be connected to an external control signal, AVIN or AGND. 100 ohm VIN 4.7F PVIN VOUT AVIN VSENSE ENABLE LLM VS0 VFB VOUT 10F VS1 VS2 PGND AGND Figure 4: Application Circuit, EP53A7LQI showing the VFB function. Internally, the output of the VID multiplexer sets the value for the voltage reference DAC, which in turn is connected to the non-inverting input of the error amplifier. This allows the use of a single feedback divider with constant loop gain and optimum compensation, independent of the output voltage selected. NOTE: The VID pins must not be left floating. Page 18 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI EP53A7L Low VID Range Programming The EP53A7LQI is designed to provide a high degree of flexibility in powering applications that require low VOUT settings and dynamic voltage scaling (DVS). The device employs a 3-pin VID architecture that allows the user to choose one of seven (7) preset output voltage settings, or the user can select an external voltage divider option. The VID pin settings can be changed on the fly to implement glitch-free voltage scaling. Table 1: EP53A7LQI VID Voltage Select Settings VS2 VS1 VS0 VOUT 0 0 0 1.50 0 0 1 1.45 0 1 0 1.20 0 1 1 1.15 1 0 0 1.10 1 0 1 1.05 1 1 0 0.80 1 1 1 EXT Table 1 shows the VS2-VS0 pin logic states for the EP53A7LQI and the associated output voltage levels. A logic "1" indicates a connection to AVIN or to a "high" logic voltage level. A logic "0" indicates a connection to AGND or to a "low" logic voltage level. These pins can be either hardwired to AVIN or AGND or alternatively can be driven by standard logic levels. Logic levels are defined in the electrical characteristics table. Any level between the logic high and logic low is indeterminate. EP53A7LQI External Voltage Divider The external divider option is chosen by connecting VID pins VS2-VS0 to AVIN or a logic "1" or "high". The EP53A7LQI uses a separate feedback pin, VFB, when using the external divider. VSENSE must be connected to VOUT as indicated in Figure 11. The output voltage is selected by the following formula: VOUT = 0.6V (1 + Ra Rb ) Ra must be chosen as 237K to maintain loop gain. Then Rb is given as: R = b 142.2 x10 3 VOUT - 0.6 VOUT can be programmed over the range of 0.6V to (VIN - 0.5V). Page 19 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI 100 Ohm PVIN 4.7uF VSense AVIN ENABLE VS0 VS1 VS2 VOUT VOUT EP53A7L VIN 10F Ra VFB LLM Rb PGND AGND Figure 5: EP53A7LQI using external divider NOTE: Dynamic Voltage Scaling is not allowed between internal preset voltages and external divider. NOTE: LLM is not functional when using the external divider option. Tie the LLM pin to AGND when using this option. EP53A7HQI High VID Range Programming The EP53A7HQI VOUT settings are optimized for higher nominal voltages such as those required to power IO, RF, or IC memory. The preset voltages range from 1.8V to 3.3V. There are eight (8) preset output voltage settings. The EP53A7HQI does not have an external divider option. As with the EP53A7LQI, the VID pin settings can be changed while the device is enabled. Table 2 shows the VS0-VS2 pin logic states for the EP53A7HQI and the associated output voltage levels. A logic "1" indicates a connection to AVIN or to a "high" logic voltage level. A logic "0" indicates a connection to AGND or to a "low" logic voltage level. These pins can be either hardwired to AVIN or AGND or alternatively can be driven by standard logic levels. Logic levels are defined in the electrical characteristics table. Any level between the logic high and logic low is indeterminate. These pins must not be left floating. Table 2: EP53A7HQI VID Voltage Select Settings VS2 VS1 VS0 VOUT (V) 0 0 0 3.3 0 0 1 3.0 0 1 0 2.9 0 1 1 2.6 1 0 1 2.5 1 0 1 2.2 1 1 0 2.1 1 1 1 1.8 Page 20 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI Power-Up/Down Sequencing During power-up, ENABLE should not be asserted before PVIN, and PVIN should not be asserted before AVIN. The PVIN should never be powered when AVIN is off. During power down, the AVIN should not be powered down before the PVIN. Tying PVIN and AVIN or all three pins (AVIN, PVIN, ENABLE) together during power up or power down meets these requirements. Pre-Bias Start-up The EP53A7xQI does not support startup into a pre-biased condition. Be sure the output capacitors are not charged or the output of the EP53A7xQI is not pre-biased when the EP53A7xQI is first enabled. Input Filter Capacitor The input filter capacitor requirement is a 4.7F 0402 or 0603 low ESR MLCC capacitor. Output Filter Capacitor The output filter capacitor requirement is a minimum of 10F 0805 MLCC. Ripple performance can be improved by using 2x10F 0603 or 2x10F 0805 MLCC capacitors. The maximum output filter capacitance next to the output pins of the device is 60F low ESR MLCC capacitance. VOUT has to be sensed at the last output filter capacitor next to the EP53A7xQI. Additional bulk capacitance for decoupling and bypass can be placed at the load as long as there is sufficient separation between the VOUT Sense point and the bulk capacitance. The separation provides an inductance that isolates the control loop from the bulk capacitance. NOTE: Excess total capacitance on the output (Output Filter + Bulk) can cause an over-current condition at startup. Refer to the section on Soft-Start for the maximum total capacitance on the output. NOTE: The Input and Output capacitors must use a X5R or X7R or equivalent dielectric formulation. Y5V or equivalent dielectric formulations lose capacitance with frequency, bias, and temperature and are not suitable for switch-mode DC-DC converter filter applications. Page 21 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI LAYOUT RECOMMENDATIONS Figure 12 shows critical components and layer 1 traces of a recommended minimum footprint EP53A7LQI/EP53A7HQI layout with ENABLE tied to VIN. Alternate ENABLE configurations, and other small signal pins need to be connected and routed according to specific customer application. Please see the Gerber files on the Altera website www.intel.com/enpirion for exact dimensions and other layers. Please refer to Figure 12 while reading the layout recommendations in this section. Figure 12: Top PCB Layer Critical Components and Copper for Minimum Footprint (Top View) Recommendation 1: Input and output filter capacitors should be placed on the same side of the PCB, and as close to the EP53A7QI package as possible. They should be connected to the device with very short and wide traces. Do not use thermal reliefs or spokes when connecting the capacitor pads to the respective nodes. The +V and GND traces between the capacitors and the EP53A7QI should be as close to each other as possible so that the gap between the two nodes is minimized, even under the capacitors. Recommendation 2: Input and output grounds are separated until they connect at the PGND pins. The separation shown on Figure 12 between the input and output GND circuits helps minimize noise coupling between the converter input and output switching loops. Recommendation 3: The system ground plane should be the first layer immediately below the surface layer. This ground plane should be continuous and un-interrupted below the converter and the input/output capacitors. Please see the Gerber files on the Altera website www.intel.com/enpirion. Recommendation 4: Multiple small vias should be used to connect the ground traces under the device to the system ground plane on another layer for heat dissipation. The drill diameter of the vias should be 0.33mm, and the vias must have at least 1 oz. copper plating on the inside wall, making the finished hole size around 0.20-0.26mm. Do not use thermal reliefs or spokes to connect the vias to the ground plane. It is preferred to put these vias under the capacitors along the edge of the GND copper closest to the +V copper. Please see Figure 12. These vias connect the input/output filter capacitors to the GND plane and help reduce parasitic inductances in the input and output current loops. If the vias cannot be placed under CIN and COUT, then put them just outside the capacitors along the GND. Do not use thermal reliefs or spokes to connect these vias to the ground plane. Recommendation 5: AVIN is the power supply for the internal small-signal control circuits. It should be connected to the input voltage at a quiet point. In Figure 12 this connection is made with RAVIN at the input capacitor close to the VIN connection. Page 22 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI RECOMMENDED PCB FOOTPRIN Figure 13: EP53A7xQI PCB Footprint (Top View) Page 23 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI PACKAGE DIMENSIONS Figure 14: EP53A7xQI Package Dimensions Packing and Marking Information: https://www.intel.com/support/quality-and-reliability/packing.html Page 24 01543 February 21, 2019 Rev F Datasheet | Intel(R) Enpirion(R) Power Solutions: EP53A7xQI REVISION HISTORY Rev F Date Change(s) Jan 2019 Changed datasheet into Intel format. WHERE TO GET MORE INFORMATION For more information about Intel(R) and Enpirion(R) PowerSoCs, visit: www.altera.com/enpirion (c) 2017 Intel Corporation. All rights reserved. Intel, the Intel logo, Altera, ARRIA, CYCLONE, ENPIRION, MAX, MEGACORE, NIOS, QUARTUS, and STRATIX words and logos are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Other marks and brands may be claimed as the property of others. Intel reserves the right to make changes to any products and services at any time without notice. Intel assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Intel. Intel customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for products or services. * Other marks and brands may be claimed as the property of others. Page 25 01543 February 21, 2019 Rev F