BSP 92
Data Sheet 2 05.99
Maximum Ratings
Parameter Symbol Values Unit
Chip or operating temperature
T
j -55 ... + 150 ˚C
Storage temperature
T
stg -55 ... + 150
Thermal resistance, chip to ambient air 1)
R
thJA
≤
72 K/W
Thermal resistance, junction-soldering point 1)
R
thJS
≤
12
DIN humidity category, DIN 40 040 E
IEC climatic category, DIN IEC 68-1 55 / 150 / 56
1) Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection
Electrical Characteristics, at
T
j = 25˚C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain- source breakdown voltage
V
GS = 0 V,
I
D = -0.25 mA,
T
j = 25 ˚C
V
(BR)DSS -240 - -
V
Gate threshold voltage
V
GS=
V
DS,
I
D = -1 mA
V
GS(th) -0.8 -1.5 -2
Zero gate voltage drain current
V
DS = -240 V,
V
GS = 0 V,
T
j = 25 ˚C
V
DS = -240 V,
V
GS = 0 V,
T
j = 125 ˚C
V
DS = -60 V,
V
GS = 0 V,
T
j = 25 ˚C
I
DSS
-
-
-
-
-10
-0.1
-0.2
-100
-1
µA
Gate-source leakage current
V
GS = -20 V,
V
DS = 0 V
I
GSS - -10 -100
nA
Drain-Source on-state resistance
V
GS = -10 V,
I
D = -0.2 A
R
DS(on) - 12 20
Ω