±0.5°C Accurate PWM
Temperature Sensor in 5-Lead SC-70
TMP05/TMP06
Rev. B
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FEATURES
Modulated serial digital output, proportional to
temperature
±0.5°C typical accuracy at 25°C
±1.0°C accuracy from 0°C to 70°C
Two grades available
Operation from −40°C to +150°C
Operation from 3 V to 5.5 V
Power consumption 70 μW maximum at 3.3 V
CMOS-/TTL-compatible output on TMP05
Flexible open-drain output on TMP06
Small, low cost, 5-lead SC-70 and SOT-23 packages
APPLICATIONS
Isolated sensors
Environmental control systems
Computer thermal monitoring
Thermal protection
Industrial process control
Power-system monitors
FUNCTIONAL BLOCK DIAGRAM
V
DD
TMP05/TMP06
OUT
CONV/IN
FUNC
GND
1
3
5
4
TEMPERATURE
SENSOR
REFERENCE
CLK AND
TIMING
GENERATION
OUTPUT
CONTROL
AVERAG ING
BLOCK/
COUNTER
2
Σ-Δ
CORE
03340-001
Figure 1.
GENERAL DESCRIPTION
The TMP05/TMP06 are monolithic temperature sensors that
generate a modulated serial digital output (PWM), which varies
in direct proportion to the temperature of the devices. The high
period (TH) of the PWM remains static over all temperatures,
while the low period (TL) varies. The B Grade version offers a
high temperature accuracy of ±1°C from 0°C to 70°C with
excellent transducer linearity. The digital output of the TMP05/
TMP06 is CMOS-/TTL-compatible and is easily interfaced to
the serial inputs of most popular microprocessors. The flexible
open-drain output of the TMP06 is capable of sinking 5 mA.
The TMP05/TMP06 are specified for operation at supply voltages
from 3 V to 5.5 V. Operating at 3.3 V, the supply current is
typically 370 µA. The TMP05/TMP06 are rated for operation
over the –40°C to +150°C temperature range. It is not recom-
mended to operate these devices at temperatures above 125°C
for more than a total of 5% (5,000 hours) of the lifetime of the
devices. They are packaged in low cost, low area SC-70 and
SOT-23 packages.
The TMP05/TMP06 have three modes of operation: continu-
ously converting mode, daisy-chain mode, and one shot mode.
A three-state FUNC input determines the mode in which the
TMP05/TMP06 operate.
The CONV/IN input pin is used to determine the rate at which
the TMP05/TMP06 measure temperature in continuously
converting mode and one shot mode. In daisy-chain mode, the
CONV/IN pin operates as the input to the daisy chain.
PRODUCT HIGHLIGHTS
1. The TMP05/TMP06 have an on-chip temperature sensor
that allows an accurate measurement of the ambient
temperature. The measurable temperature range is
–40°C to +150°C.
2. Supply voltage is 3 V to 5.5 V.
3. Space-saving 5-lead SOT-23 and SC-70 packages.
4. Temperature accuracy is typically ±0.5°C. Each part needs
a decoupling capacitor to achieve this accuracy.
5. Temperature resolution of 0.025°C.
6. The TMP05/TMP06 feature a one shot mode that reduces
the average power consumption to 102 µW at 1 SPS.
TMP05/TMP06
Rev. B | Page 2 of 28
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
TMP05A/TMP06A Specifications ............................................. 3
TMP05B/TMP06B Specifications .............................................. 5
Timing Characteristics ................................................................ 7
Absolute Maximum Ratings............................................................ 8
ESD Caution.................................................................................. 8
Pin Configuration and Function Descriptions............................. 9
Typical Performance Characteristics ........................................... 10
Theory of Operation ...................................................................... 13
Circuit Information.................................................................... 13
Converter Details ....................................................................... 13
Functional Description.............................................................. 13
Operating Modes........................................................................ 13
TMP05 Output ........................................................................... 16
TMP06 Output ........................................................................... 16
Application Hints ........................................................................... 17
Thermal Response Time ........................................................... 17
Self-Heating Effects.................................................................... 17
Supply Decoupling ..................................................................... 17
Layout Considerations............................................................... 18
Temperature Monitoring........................................................... 18
Daisy-Chain Application........................................................... 18
Continuously Converting Application .................................... 24
Outline Dimensions ....................................................................... 26
Ordering Guide .......................................................................... 26
REVISION HISTORY
4/06—Rev. A to Rev. B
Changes to Table 1............................................................................ 3
Changes to Table 2............................................................................ 5
Changes to Table 8.......................................................................... 14
Changes to Table 9.......................................................................... 15
10/05—Rev. 0 to Rev. A
Changes to Specifications Table...................................................... 3
Changes to Absolute Maximum Ratings ....................................... 8
Changes to Figure 4.......................................................................... 8
Changes to Figure 7........................................................................ 10
Changes to Figure 15...................................................................... 11
Deleted Figure 18............................................................................ 12
Changes to One Shot Mode Section ............................................ 14
Changes to Figure 20...................................................................... 14
Changes to Daisy-Chain Mode Section ...................................... 15
Changes to Figure 23...................................................................... 15
Changes to Equation 5 and Equation 7 ....................................... 17
Added Layout Considerations Section ........................................ 18
Updated Outline Dimensions....................................................... 26
Changes to Ordering Guide.......................................................... 26
8/04—Revision 0: Initial Version
TMP05/TMP06
Rev. B | Page 3 of 28
SPECIFICATIONS
TMP05A/TMP06A SPECIFICATIONS
All A grade specifications apply for −40°C to +150°C, VDD decoupling capacitor is a 0.1 µF multilayer ceramic, TA = TMIN to TMAX,
VDD = 3.0 V to 5.5 V, unless otherwise noted.
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
TEMPERATURE SENSOR AND ADC
Nominal Conversion Rate (One Shot Mode) See Table 7
Accuracy @ VDD = 3.0 V to 5.5 V ±2 °C TA = 0°C to 70°C, VDD = 3.0 V to 5.5 V
±3 °C TA = –40°C to +100°C, VDD = 3.0 V to 5.5 V
±4 °C TA = –40°C to +125°C, VDD = 3.0 V to 5.5 V
±51°C TA = –40°C to +150°C, VDD = 3.0 V to 5.5 V
Temperature Resolution 0.025 °C/5 μs Step size for every 5 μs on TL
TH Pulse Width 40 ms TA = 25°C, nominal conversion rate
TL Pulse Width 76 ms TA = 25°C, nominal conversion rate
Quarter Period Conversion Rate
(All Operating Modes) See Table 7
Accuracy
@ VDD = 3.3 V (3.0 V to 3.6 V) ±1.5 °C TA = –40°C to +150°C
@ VDD = 5 V (4.5 V to 5.5 V) ±1.5 °C TA = –40°C to +150°C
Temperature Resolution 0.1 °C/5 μs Step size for every 5 μs on TL
TH Pulse Width 10 ms TA = 25°C, QI conversion rate
TL Pulse Width 19 ms TA = 25°C, QP conversion rate
Double High/Quarter Low Conversion Rate
(All Operating Modes) See Table 7
Accuracy
@ VDD = 3.3 V (3.0 V to 3.6 V) ±1.5 °C TA = –40°C to +150°C
@ VDD = 5 V (4.5 V to 5.5 V) ±1.5 °C TA = –40°C to +150°C
Temperature Resolution 0.1 °C/5 μs Step size for every 5 μs on TL
TH Pulse Width 80 ms TA = 25°C, DH/QL conversion rate
TL Pulse Width 19 ms TA = 25°C, DH/QL conversion rate
Long-Term Drift 0.081 °C Drift over 10 years, if part is operated at 55°C
Temperature Hysteresis 0.0023 °C Temperature cycle = 25°C to 100°C to 25°C
SUPPLIES
Supply Voltage 3 5.5 V
Supply Current
Normal Mode2
@ 3.3 V 370 600 μA Nominal conversion rate
@ 5.0 V 425 650 μA Nominal conversion rate
Quiescent2
@ 3.3 V 3 12 μA Device not converting, output is high
@ 5.0 V 5.5 20 μA Device not converting, output is high
One Shot Mode @ 1 SPS 30.9 μA Average current @ VDD = 3.3 V,
nominal conversion rate @ 25°C
37.38 μA
Average current @ VDD = 5.0 V,
nominal conversion rate @ 25°C
Power Dissipation 803.33 μW VDD = 3.3 V, continuously converting at
nominal conversion rates @ 25°C
1 SPS 101.9 μW Average power dissipated for VDD = 3.3 V,
one shot mode @ 25°C
186.9 μW
Average power dissipated for VDD = 5.0 V,
one shot mode @ 25°C
TMP05/TMP06
Rev. B | Page 4 of 28
Parameter Min Typ Max Unit Test Conditions/Comments
TMP05 OUTPUT (PUSH-PULL)3
Output High Voltage (VOH) VDD − 0.3 V IOH = 800 μA
Output Low Voltage (VOL) 0.4 V IOL = 800 μA
Output High Current (IOUT)42 mA Typ VOH = 3.17 V with VDD = 3.3 V
Pin Capacitance 10 pF
Rise Time (tLH)5 50 ns
Fall Time (tHL)5 50 ns
RON Resistance (Low Output) 55 Ω Supply and temperature dependent
TMP06 OUTPUT (OPEN DRAIN)3
Output Low Voltage (VOL) 0.4 V IOL = 1.6 mA
Output Low Voltage (VOL) 1.2 V IOL = 5.0 mA
Pin Capacitance 10 pF
High Output Leakage Current (IOH) 0.1 5 μA PWMOUT = 5.5 V
Device Turn-On Time 20 ms
Fall Time (tHL)6 30 ns
RON Resistance (Low Output) 55 Ω Supply and temperature dependent
DIGITAL INPUTS3
Input Current ±1 μA VIN = 0 V to VDD
Input Low Voltage (VIL) 0.3 × VDD V
Input High Voltage (VIH) 0.7 × VDD V
Pin Capacitance 3 10 pF
1 It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond
this limit affects device reliability.
2 Normal mode current relates to current during TL. TMP05/TMP06 are not converting during TH, so quiescent current relates to current during TH.
3 Guaranteed by design and characterization, not production tested.
4 It is advisable to restrict the current being pulled from the TMP05 output because any excess currents going through the die cause self-heating. As a consequence,
false temperature readings can occur.
5 Test load circuit is 100 pF to GND.
6 Test load circuit is 100 pF to GND, 10 kΩ to 5.5 V.
TMP05/TMP06
Rev. B | Page 5 of 28
TMP05B/TMP06B SPECIFICATIONS
All B grade specifications apply for –40°C to +150°C; VDD decoupling capacitor is a 0.1 µF multilayer ceramic; TA = TMIN to TMAX,
VDD = 3 V to 5.5 V, unless otherwise noted.
Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
TEMPERATURE SENSOR AND ADC
Nominal Conversion Rate (One Shot Mode) See Table 7
Accuracy1
@ VDD = 3.3 V (±5%) ±0.2 ±1 °C TA = 0°C to 70°C, VDD = 3.135 V to 3.465 V
@ VDD = 5 V (±10%) ±0.4 −1/+1.5 °C TA = 0°C to 70°C, VDD = 4.5 V to 5.5 V
@ VDD = 3.3 V (±10%) and 5 V (±10%) ±1.5 °C TA = –40°C to +70°C, VDD = 3.0 V to 3.6 V,
VDD = 4.5 V to 5.5 V
±2 °C
TA = –40°C to +100°C, VDD = 3.0 V to 3.6 V,
VDD = 4.5 V to 5.5 V
±2.5 °C
TA = –40°C to +125°C, VDD = 3.0 V to 3.6 V,
VDD = 4.5 V to 5.5 V
±4.52°C TA = –40°C to +150°C, VDD = 3.0 V to 3.6 V,
VDD = 4.5 V to 5.5 V
Temperature Resolution 0.025 °C/5 μs Step size for every 5 μs on TL
TH Pulse Width 40 ms TA = 25°C, nominal conversion rate
TL Pulse Width 76 ms TA = 25°C, nominal conversion rate
Quarter Period Conversion Rate
(All Operating Modes)
See
Table 7
Accuracy1
@ VDD = 3.3 V (3.0 V to 3.6 V) ±1.5 °C TA = –40°C to +150°C
@ VDD = 5.0 V (4.5 V to 5.5 V) ±1.5 °C TA = –40°C to +150°C
Temperature Resolution 0.1 °C/5 μs Step size for every 5 μs on TL
TH Pulse Width 10 ms TA = 25°C, QP conversion rate
TL Pulse Width 19 ms TA = 25°C, QP conversion rate
Double High/Quarter Low Conversion Rate
(All Operating Modes)
See
Table 7
Accuracy1
@ VDD = 3.3 V (3.0 V to 3.6 V) ±1.5 °C TA = –40°C to +150°C
@ VDD = 5 V (4.5 V to 5.5 V) ±1.5 °C TA = –40°C to +150°C
Temperature Resolution 0.1 °C/5 μs Step size for every 5 μs on TL
TH Pulse Width 80 ms TA = 25°C, DH/QL conversion rate
TL Pulse Width 19 ms TA = 25°C, DH/QL conversion rate
Long-Term Drift 0.081 °C Drift over 10 years, if part is operated at 55°C
Temperature Hysteresis 0.0023 °C Temperature cycle = 25°C to 100°C to 25°C
SUPPLIES
Supply Voltage 3 5.5 V
Supply Current
Normal Mode3
@ 3.3 V 370 600 μA Nominal conversion rate
@ 5.0 V 425 650 μA Nominal conversion rate
Quiescent3
@ 3.3 V 3 12 μA Device not converting, output is high
@ 5.0 V 5.5 20 μA Device not converting, output is high
One Shot Mode @ 1 SPS 30.9 μA Average current @ VDD = 3.3 V,
nominal conversion rate @ 25°C
37.38 μA
Average current @ VDD = 5.0 V,
nominal conversion rate @ 25°C
TMP05/TMP06
Rev. B | Page 6 of 28
Parameter Min Typ Max Unit Test Conditions/Comments
Power Dissipation 803.33 μW VDD = 3.3 V, continuously converting at
nominal conversion rates @ 25°C
1 SPS 101.9 μW Average power dissipated for VDD = 3.3 V,
one shot mode @ 25°C
186.9 μW
Average power dissipated for VDD = 5.0 V,
one shot mode @ 25°C
TMP05 OUTPUT (PUSH-PULL)4
Output High Voltage (VOH) VDD − 0.3 V IOH = 800 μA
Output Low Voltage (VOL) 0.4 V IOL = 800 μA
Output High Current (IOUT)52 mA Typical VOH = 3.17 V with VDD = 3.3 V
Pin Capacitance 10 pF
Rise Time (tLH)6 50 ns
Fall Time (tHL)6 50 ns
RON Resistance (Low Output) 55 Ω Supply and temperature dependent
TMP06 OUTPUT (OPEN DRAIN)4
Output Low Voltage (VOL) 0.4 V IOL = 1.6 mA
Output Low Voltage (VOL) 1.2 V IOL = 5.0 mA
Pin Capacitance 10 pF
High Output Leakage Current (IOH) 0.1 5 μA PWMOUT = 5.5 V
Device Turn-On Time 20 ms
Fall Time (tHL)7 30 ns
RON Resistance (Low Output) 55 Ω Supply and temperature dependent
DIGITAL INPUTS4
Input Current ±1 μA VIN = 0 V to VDD
Input Low Voltage (VIL) 0.3 × VDD V
Input High Voltage (VIH) 0.7 × VDD V
Pin Capacitance 3 10 pF
1 The accuracy specifications for 3.0 V to 3.6 V and 4.5 V to 5.5 V supply ranges are specified to 3-Σ performance.
2 It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond
this limit affects device reliability.
3 Normal mode current relates to current during TL. TMP05/TMP06 are not converting during TH, so quiescent current relates to current during TH.
4 Guaranteed by design and characterization, not production tested.
5 It is advisable to restrict the current being pulled from the TMP05 output because any excess currents going through the die cause self-heating. As a consequence,
false temperature readings can occur.
6 Test load circuit is 100 pF to GND.
7 Test load circuit is 100 pF to GND, 10 kΩ to 5.5 V.
TMP05/TMP06
Rev. B | Page 7 of 28
TIMING CHARACTERISTICS
TA = TMIN to TMAX, VDD = 3.0 V to 5.5 V, unless otherwise noted. Guaranteed by design and characterization, not production tested.
Table 3.
Parameter Limit Unit Comments
TH 40 ms typ PWM high time @ 25°C under nominal conversion rate
TL 76 ms typ PWM low time @ 25°C under nominal conversion rate
t3150 ns typ TMP05 output rise time
t41 50 ns typ TMP05 output fall time
t4230 ns typ TMP06 output fall time
t5 25 μs max Daisy-chain start pulse width
1 Test load circuit is 100 pF to GND.
2 Test load circuit is 100 pF to GND, 10 kΩ to 5.5 V.
T
H
T
L
t
4
90% 10%
t
3
90%10%
03340-002
Figure 2. PWM Output Nominal Timing Diagram (25°C)
t
5
ST
A
RT PULSE
03340-003
Figure 3. Daisy-Chain Start Timing
TMP05/TMP06
Rev. B | Page 8 of 28
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
VDD to GND –0.3 V to +7 V
Digital Input Voltage to GND –0.3 V to VDD + 0.3 V
Maximum Output Current (OUT) ±10 mA
Operating Temperature Range1–40°C to +150°C
Storage Temperature Range –65°C to +160°C
Maximum Junction Temperature, TJ max 150°C
5-Lead SOT-23 (RJ-5)
Power Dissipation2WMAX = (TJ max – TA3)/θJA
Thermal Impedance4
θJA, Junction-to-Ambient (Still Air) 240°C/W
5-Lead SC-70 (KS-5)
Power Dissipation2 W
MAX = (TJ max – TA3)/θJA
Thermal Impedance4
θJA, Junction-to-Ambient 534.7°C/W
θJC, Junction-to-Case 172.3°C/W
IR Reflow Soldering
Peak Temperature 220°C (0°C/5°C)
Time at Peak Temperature 10 sec to 20 sec
Ramp-Up Rate 2°C/s to 3°C/s
Ramp-Down Rate −6°C/s
Time 25°C to Peak Temperature 6 minutes max
IR Reflow Soldering (Pb-Free Package)
Peak Temperature 260°C (0°C)
Time at Peak Temperature 20 sec to 40 sec
Ramp-Up Rate 3°C/sec max
Ramp-Down Rate –6°C/sec max
Time 25°C to Peak Temperature 8 minutes max
1 It is not recommended to operate the device at temperatures above 125°C
for more than a total of 5% (5,000 hours) of the lifetime of the device. Any
exposure beyond this limit affects device reliability.
2 SOT-23 values relate to the package being used on a 2-layer PCB and SC-70
values relate to the package being used on a 4-layer PCB. See Figure 4 for a
plot of maximum power dissipation vs. ambient temperature (TA).
3 TA = ambient temperature.
4 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled PCB
mounted components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
0.9
0
03340-0-040
TEMPERATURE (°C)
MAXIMUM POWER DISSIPATION (W)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
–10
–20
–30
–40
SC-70
SOT-23
Figure 4. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
TMP05/TMP06
Rev. B | Page 9 of 28
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
OUT
1
FUNC
3
CONV/IN
2
V
DD
5
GND
4
TMP05/
TMP06
TOP VIEW
(Not to Scale)
03340-005
Figure 5. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 OUT Digital Output. Pulse-width modulated (PWM) output gives a square wave whose ratio of high-to-low period is
proportional to temperature.
2 CONV/IN Digital Input. In continuously converting and one shot operating modes, a high, low, or float input determines the
temperature measurement rate. In daisy-chain operating mode, this pin is the input pin for the PWM signal from
the previous part on the daisy chain.
3 FUNC Digital Input. A high, low, or float input on this pin gives three different modes of operation. For details, see the
Operating Modes section.
4 GND Analog and Digital Ground.
5 VDD Positive Supply Voltage, 3.0 V to 5.5 V. Using a decoupling capacitor of 0.1 μF as close as possible to this pin is
strongly recommended.
TMP05/TMP06
Rev. B | Page 10 of 28
TYPICAL PERFORMANCE CHARACTERISTICS
10
9
8
7
6
5
4
3
2
1
0
–50 –30 –10 10 30 50 70 90 110 130 150
TEMPERATURE (°C)
OUTPUT FREQUENCY (Hz)
VDD = 3.3V AND 5V
OUT PIN LOADED WITH 10kΩ
03340-020
Figure 6. PWM Output Frequency vs. Temperature
8.57
8.50
3.0
SUPPLY VOLTAGE (V)
OUTPUT FREQUENCY (Hz)
8.56
8.55
8.54
8.53
8.52
8.51
3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4
OUT PIN LOADED WITH 10kΩ
AMBIENT TEMPERATURE = 25°C
03340-041
Figure 7. PWM Output Frequency vs. Supply Voltage
140
120
100
80
60
40
20
0
–50 –30 –10 10 30 50 70 90 110 130 150
TEMPERATURE (°C)
TIME (ms)
VDD = 3.3V AND 5V
OUT PIN LOADED WITH 10kΩ
TL TIME
TH TIME
03340-022
Figure 8. TH and TL Times vs. Temperature
0
0
100ns/DIV
1V/DIV
V
DD
= 3.3V AND 5V
C
LOAD
= 100pF
TIME (ns)
VOLTAGE (V)
03340-023
Figure 9. TMP05 Output Rise Time at 25°C
0
0
100ns/DIV
1V/DIV
V
DD
= 3.3V AND 5V
C
LOAD
= 100pF
TIME (ns)
VOLTAGE (V)
03340-024
Figure 10. TMP05 Output Fall Time at 25°C
0
0
100ns/DIV
1V/DIV
V
DD
= 3.3V AND 5V
R
PULLUP
= 1kΩ
R
LOAD
= 10kΩ
C
LOAD
= 100pF
TIME (ns)
VOLTAGE (V)
03340-025
Figure 11. TMP06 Output Fall Time at 25°C
TMP05/TMP06
Rev. B | Page 11 of 28
2000
1800
1600
1400
1200
1000
800
600
400
200
0
0 10000900080007000600050004000300020001000
CAPACTIVE LOAD (pF)
TIME (ns)
V
DD
= 3.3V AND 5V
RISE TIME
FALL TIME
03340-026
Figure 12. TMP05 Output Rise and Fall Times vs. Capacitive Load
250
200
150
100
50
0
–50 –25 0 25 50 75 100 125 150
TEMPERATURE (°C)
OUTPUT LOW VOLTAGE (mV)
VDD = 3.3V AND 5V ILOAD = 5mA
ILOAD = 1mA
ILOAD = 0.5mA
03340-027
Figure 13. TMP06 Output Low Voltage vs. Temperature
35
30
25
20
15
–50 –25 0 25 50 75 100 125 150
TEMPERATURE (°C)
SINK CURRENT (mA)
VDD = 3.3V AND 5V
03340-028
Figure 14. TMP06 Open Drain Sink Current vs. Temperature
1.25
–1.25
–40
TEMPERATURE (°C)
TEMPERATURE ERROR (°C)
1.00
0.75
0.50
0.25
0
–0.25
–0.50
–0.75
–1.00
–20 020 40 60 80 100 120 140
3.3V
5V
CONTINUOUS MODE OPERATION
NOMINAL CONVERSION RATE
03340-042
Figure 15. Output Accuracy vs. Temperature
350
300
250
200
150
100
50
0
–50 –25 0 25 50 75 100 125 150
TEMPERATURE (°C)
SUPPLY CURRENT (µA)
VDD = 3.3V AND 5V
CONTINUOUS MODE OPERATION
NOMINAL CONVERSION RATE
NO LOAD ON OUT PIN
03340-030
Figure 16. Supply Current vs. Temperature
255
250
245
240
235
230
225
220
215
2.7 5.75.45.14.84.54.23.93.63.33.0
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (µA)
AMBIENT TEMPERATURE = 25°C
CONTINUOUS MODE OPERATION
NOMINAL CONVERSION RATE
NO LOAD ON OUT PIN
03340-031
Figure 17. Supply Current vs. Supply Voltage
TMP05/TMP06
Rev. B | Page 12 of 28
140
120
100
80
60
40
20
0
0 10203040506070
TIME (Seconds)
TEMPERATURE (°C)
TEMPERATURE OF
ENVIRONMENT (30°C)
CHANGED HERE
FINAL TEMPERATURE = 120°C
03340-033
Figure 18. Response to Thermal Shock
1.25
1.00
0.75
0.50
0.25
0
0 5 10 15 20 25 30
LOAD CURRENT (mA)
TEMPERATURE ERROR (°C)
V
DD
= 3.3V AND 5V
AMBIENT TEMPERATURE = 25°C
03340-034
Figure 19. TMP05 Temperature Error vs. Load Current
TMP05/TMP06
Rev. B | Page 13 of 28
THEORY OF OPERATION
CIRCUIT INFORMATION
The TMP05/TMP06 are monolithic temperature sensors that
generate a modulated serial digital output that varies in direct
proportion with the temperature of each device. An on-board
sensor generates a voltage precisely proportional to absolute
temperature, which is compared to an internal voltage reference
and is input to a precision digital modulator. The ratiometric
encoding format of the serial digital output is independent of
the clock drift errors common to most serial modulation
techniques such as voltage-to-frequency converters. Overall
accuracy for the A grade is ±2°C from 0°C to +70°C with
excellent transducer linearity. B grade accuracy is ±1°C from
0°C to 70°C. The digital output of the TMP05 is CMOS-/TTL-
compatible and is easily interfaced to the serial inputs of most
popular microprocessors. The open-drain output of the TMP06
is capable of sinking 5 mA.
The on-board temperature sensor has excellent accuracy and
linearity over the entire rated temperature range without
correction or calibration by the user.
The sensor output is digitized by a first-order Σ-∆ modulator,
also known as the charge balance type analog-to-digital
converter. This type of converter utilizes time-domain over-
sampling and a high accuracy comparator to deliver 12 bits of
effective accuracy in an extremely compact circuit.
CONVERTER DETAILS
The Σ-∆ modulator consists of an input sampler, a summing
network, an integrator, a comparator, and a 1-bit DAC. Similar
to the voltage-to-frequency converter, this architecture creates,
in effect, a negative feedback loop whose intent is to minimize
the integrator output by changing the duty cycle of the
comparator output in response to input voltage changes. The
comparator samples the output of the integrator at a much
higher rate than the input sampling frequency, which is called
oversampling. Oversampling spreads the quantization noise
over a much wider band than that of the input signal, improving
overall noise performance and increasing accuracy.
Σ-ΔMODULATOR
INTEGRATOR
COMPARATOR
1-BIT
DAC
DIGITAL
FILTER
CLOCK
GENERATOR
VOLTAGE REF
AND VPTAT
TMP05/TMP06
OUT
(SINGLE-BIT)
+
–
+
–
0
3340-006
Figure 20. First-Order Σ-∆ Modulator
The modulated output of the comparator is encoded using a
circuit technique that results in a serial digital signal with a
mark-space ratio format. This format is easily decoded by any
microprocessor into either °C or °F values, and is readily
transmitted or modulated over a single wire. More importantly,
this encoding method neatly avoids major error sources
common to other modulation techniques because it is clock-
independent.
FUNCTIONAL DESCRIPTION
The output of the TMP05/TMP06 is a square wave with a
typical period of 116 ms at 25°C (CONV/IN pin is left floating).
The high period, TH, is constant, while the low period, TL, varies
with measured temperature. The output format for the nominal
conversion rate is readily decoded by the user as follows:
Temperature (°C) = 421 − (751 × (TH/TL)) (1)
T
H
T
L
03340-007
Figure 21. TMP05/TMP06 Output Format
The time periods TH (high period) and TL (low period) are
values easily read by a microprocessor timer/counter port, with
the above calculations performed in software. Because both
periods are obtained consecutively using the same clock,
performing the division indicated in Equation 1 results in a
ratiometric value independent of the exact frequency or drift of
the TMP05/TMP06 originating clock or the user’s counting clock.
OPERATING MODES
The user can program the TMP05/TMP06 to operate in three
different modes by configuring the FUNC pin on power-up as
either low, floating, or high.
Table 6. Operating Modes
FUNC Pin Operating Mode
Low One shot
Floating Continuously converting
High Daisy-chain
Continuously Converting Mode
In continuously converting mode, the TMP05/TMP06 continu-
ously output a square wave representing temperature. The
frequency at which this square wave is output is determined by
the state of the CONV/IN pin on power-up. Any change to the
state of the CONV/IN pin after power-up is not reflected in the
parts until the TMP05/TMP06 are powered down and back up.
TMP05/TMP06
Rev. B | Page 14 of 28
One Shot Mode
In one shot mode, the TMP05/TMP06 output one square wave
representing temperature when requested by the microcon-
troller. The microcontroller pulls the OUT pin low and then
releases it to indicate to the TMP05/TMP06 that an output is
required. The time between the OUT pin going low to the time
it is released should be greater than 20 ns. Internal hysteresis in
the OUT pin prevents the TMP05/TMP06 from recognizing
that the pulse is going low (if it is less than 20 ns). The
temperature measurement is output when the OUT line is
released by the microcontroller (see Figure 22).
µCONTROLLER RELEASES
OUT LINE HERE
µCONTROLLE
R
PULLS DOWN
OUT LINE HERE
TEMP MEASUREMENT
T
L
T
H
>20ns
TIME
T
0
03340-019
Figure 22. TMP05/TMP06 One Shot OUT Pin Signal
In the TMP05 one shot mode only, an internal resistor is
switched in series with the pull-up MOSFET. The TMP05 OUT
pin has a push-pull output configuration (see Figure 23).
Therefore, it needs a series resistor to limit the current drawn
on this pin when the user pulls it low to start a temperature
conversion. This series resistance prevents any short circuit
from VDD to GND, and, as a result, protects the TMP05 from
short-circuit damage.
TMP05
V+
OUT
5kΩ
03340-016
Figure 23. TMP05 One Shot Mode OUT Pin Configuration
The advantages of the one shot mode include lower average
power consumption, and the microcontroller knowing that the
first low-to-high transition occurs after the microcontroller
releases the OUT pin.
Conversion Rate
In continuously converting and one shot modes, the state of the
CONV/IN pin on power-up determines the rate at which the
TMP05/TMP06 measure temperature. The available conversion
rates are shown in Table 7.
Table 7. Conversion Rates
CONV/IN Pin Conversion Rate TH/TL (25°C)
Low Quarter period
(TH/4, TL/4)
10/19 (ms)
Floating Nominal 40/76 (ms)
High Double high (TH x 2)
Quarter low (TL/4)
80/19 (ms)
The TMP05 (push-pull output) advantage when using the high
state conversion rate (double high/quarter low) is lower power
consumption. However, the trade-off is loss of resolution on the
low time. Depending on the state of the CONV/IN pin, two
different temperature equations must be used.
The temperature equation for the low and floating states’
conversion rates is
Temperature (°C) = 421 − (751 × (TH/TL)) (2)
Table 8. Conversion Times Using Equation 2
Temperature (°C) TL (ms) Cycle Time (ms)
–40 65.2 105
–30 66.6 107
–20 68.1 108
–10 69.7 110
0 71.4 111
10 73.1 113
20 74.9 115
25 75.9 116
30 76.8 117
40 78.8 119
50 81 121
60 83.2 123
70 85.6 126
80 88.1 128
90 90.8 131
100 93.6 134
110 96.6 137
120 99.8 140
130 103.2 143
140 106.9 147
150 110.8 151
TMP05/TMP06
Rev. B | Page 15 of 28
The temperature equation for the high state conversion rate is
Temperature (°C) = 421 − (93.875 × (TH/TL)) (3)
Table 9. Conversion Times Using Equation 3
Temperature (°C) TL (ms) Cycle Time (ms)
–40 16.3 96.2
–30 16.7 96.6
–20 17 97.03
–10 17.4 97.42
0 17.8 97.84
10 18.3 98.27
20 18.7 98.73
25 19 98.96
30 19.2 99.21
40 19.7 99.71
50 20.2 100.24
60 20.8 100.8
70 21.4 101.4
80 22 102.02
90 22.7 102.69
100 23.4 103.4
110 24.1 104.15
120 25 104.95
130 25.8 105.81
140 26.7 106.73
150 27.7 107.71
Daisy-Chain Mode
Setting the FUNC pin to a high state allows multiple TMP05/
TMP06s to be connected together and, therefore, allows one input
line of the microcontroller to be the sole receiver of all temperature
measurements. In this mode, the CONV/IN pin operates as the
input of the daisy chain. In addition, conversions take place at
the nominal conversion rate of TH/TL = 40 ms/76 ms at 25°C.
Therefore, the temperature equation for the daisy-chain mode
of operation is
Temperature (°C) = 421 − (751 × (THTL)) (4)
OUT
MICRO
IN
TMP05/
TMP06
CONV/IN
OUT
#1
TMP05/
TMP06
CONV/IN
OUT
#2
TMP05/
TMP06
CONV/IN
OUT
#3
TMP05/
TMP06
CONV/IN
OUT
#N
03340-009
Figure 24. Daisy-Chain Structure
A second microcontroller line is needed to generate the conver-
sion start pulse on the CONV/IN pin. The pulse width of the
start pulse should be less than 25 µs but greater than 20 ns. The
start pulse on the CONV/IN pin lets the first TMP05/TMP06
part know that it should now start a conversion and output its
own temperature. Once the part has output its own temperature,
it outputs a start pulse for the next part on the daisy-chain link.
The pulse width of the start pulse from each TMP05/TMP06 part
is typically 17 µs.
Figure 25 shows the start pulse on the CONV/IN pin of the first
device on the daisy chain. Figure 26 shows the PWM output by
this first part.
Before the start pulse reaches a TMP05/TMP06 part in the
daisy chain, the device acts as a buffer for the previous tempera-
ture measurement signals. Each part monitors the PWM signal
for the start pulse from the previous part. Once the part detects
the start pulse, it initiates a conversion and inserts the result at
the end of the daisy-chain PWM signal. It then inserts a start
pulse for the next part in the link. The final signal input to the
microcontroller should look like Figure 27. The input signal on
Pin 2 (IN) of the first daisy-chain device must remain low until
the last device has output its start pulse.
If the input on Pin 2 (IN) goes high and remains high, the
TMP05/TMP06 part powers down between 0.3 sec and 1.2 sec
later. The part, therefore, requires another start pulse to generate
another temperature measurement. Note that to reduce power
dissipation through the part, it is recommended to keep Pin 2
(IN) at a high state when the part is not converting. If the IN pin
is at 0 V, the OUT pin is at 0 V (because it is acting as a buffer
when not converting), and is drawing current through either the
pull-up MOSFET (TMP05) or the pull-up resistor (TMP06).
MUST GO HIGH ONLY
AFTER START PULSE HAS
BEEN OUTPUT BY LAST
TMP05/TMP06 ON DAISY CHAIN.
START
PULSE
CONVERSION
STARTS ON
THIS EDGE
>20ns
AND
<25µs
TIME
T
0
>20ns
0
3340-017
Figure 25. Start Pulse at CONV/IN Pin of First
TMP05/TMP06 Device on Daisy Chain
START
PULSE
17µs
#1 TEMP MEASUREMENT
T
0
TIME
03340-010
Figure 26. Daisy-Chain Temperature Measurement
and Start Pulse Output from First TMP05/TMP06
TMP05/TMP06
Rev. B | Page 16 of 28
START
PULSE
#1 TEMP MEASUREMENT #2 TEMP MEASUREMENT #N TEMP MEASUREMENT
T
0
TIME
03340-008
Figure 27. Daisy-Chain Signal at Input to the Microcontroller
TMP05 OUTPUT
The TMP05 has a push-pull CMOS output (Figure 28) and
provides rail-to-rail output drive for logic interfaces. The rise
and fall times of the TMP05 output are closely matched so that
errors caused by capacitive loading are minimized. If load
capacitance is large (for example, when driving a long cable),
an external buffer could improve accuracy.
An internal resistor is connected in series with the pull-up
MOSFET when the TMP05 is operating in one shot mode.
TMP05
V+
OUT
03340-011
Figure 28. TMP05 Digital Output Structure
TMP06 OUTPUT
The TMP06 has an open-drain output. Because the output
source current is set by the pull-up resistor, output capacitance
should be minimized in TMP06 applications. Otherwise,
unequal rise and fall times skew the pulse width and introduce
measurement errors.
OUT
TMP06
03340-012
Figure 29. TMP06 Digital Output Structure
TMP05/TMP06
Rev. B | Page 17 of 28
APPLICATION HINTS
THERMAL RESPONSE TIME
The time required for a temperature sensor to settle to a
specified accuracy is a function of the sensor’s thermal mass
and the thermal conductivity between the sensor and the object
being sensed. Thermal mass is often considered equivalent to
capacitance. Thermal conductivity is commonly specified using
the symbol Q and can be thought of as thermal resistance. It is
usually specified in units of degrees per watt of power transferred
across the thermal joint. Thus, the time required for the TMP05/
TMP06 to settle to the desired accuracy is dependent on the
package selected, the thermal contact established in that
particular application, and the equivalent power of the heat
source. In most applications, the settling time is probably best
determined empirically.
SELF-HEATING EFFECTS
The temperature measurement accuracy of the TMP05/TMP06
can be degraded in some applications due to self-heating. Errors
are introduced from the quiescent dissipation and power dissipated
when converting, that is, during TL. The magnitude of these
temperature errors depends on the thermal conductivity of the
TMP05/TMP06 package, the mounting technique, and the
effects of airflow. Static dissipation in the TMP05/TMP06 is
typically 10 µW operating at 3.3 V with no load. In the 5-lead
SC-70 package mounted in free air, this accounts for a
temperature increase due to self-heating of
T = PDISS × θJA = 10 µW × 534.7°C/W = 0.0053°C (5)
In addition, power is dissipated by the digital output, which is
capable of sinking 800 µA continuously (TMP05). Under an
800 µA load, the output can dissipate
PDISS = (0.4 V)(0.8 mA)((TL)/TH + TL)) (6)
For example, with TL = 80 ms and TH = 40 ms, the power
dissipation due to the digital output is approximately 0.21 mW.
In a free-standing SC-70 package, this accounts for a tempera-
ture increase due to self-heating of
T = PDISS × θJA = 0.21 mW × 534.7°C/W = 0.112°C (7)
This temperature increase directly adds to that from the
quiescent dissipation and affects the accuracy of the TMP05/
TMP06 relative to the true ambient temperature.
It is recommended that current dissipated through the device be
kept to a minimum because it has a proportional effect on the
temperature error.
SUPPLY DECOUPLING
The TMP05/TMP06 should be decoupled with a 0.1 µF ceramic
capacitor between VDD and GND. This is particularly important
if the TMP05/TMP06 are mounted remotely from the power
supply. Precision analog products such as the TMP05/TMP06
require a well filtered power source. Because the parts operate
from a single supply, simply tapping into the digital logic power
supply could appear to be a convenient option. Unfortunately,
the logic supply is often a switch-mode design, which generates
noise in the 20 kHz to 1 MHz range. In addition, fast logic gates
can generate glitches hundreds of mV in amplitude due to
wiring resistance and inductance.
If possible, the TMP05/TMP06 should be powered directly
from the system power supply. This arrangement, shown in
Figure 30, isolates the analog section from the logic switching
transients. Even if a separate power supply trace is not available,
generous supply bypassing reduces supply-line-induced errors.
Local supply bypassing consisting of a 0.1 µF ceramic capacitor
is critical for the temperature accuracy specifications to be
achieved. This decoupling capacitor must be placed as close as
possible to the TMP05/TMP06 VDD pin. A recommended
decoupling capacitor is Phicomp’s 100 nF, 50 V X74.
It is important to keep the capacitor package size as small as
possible because ESL (equivalent series inductance) increases
with increasing package size. Reducing the capacitive value
below 100 nF increases the ESR (equivalent series resistance).
Using a capacitor with an ESL of 1 nH and an ESR of 80 mΩ is
recommended.
0.1µF
TMP05/
TMP06
TTL/CMOS
LOGIC
CIRCUITS
POWER
SUPPLY
03340-013
Figure 30. Use Separate Traces to Reduce Power Supply Noise
TMP05/TMP06
Rev. B | Page 18 of 28
LAYOUT CONSIDERATIONS
Digital boards can be electrically noisy environments and
glitches are common on many of the signals in the system.
The likelihood of glitches causing problems to the TMP05/
TMP06 OUT pin is very minute. The typical impedance of the
TMP05/TMP06 OUT pin when driving low is 55 Ω. When
driving high, the TMP05 OUT pin is similar. This low imped-
ance makes it very difficult for a glitch to break the VIL and VIH
thresholds. There is a slight risk that a sizeable glitch could
cause problems. A glitch can only cause problems when the
OUT pin is low during a temperature measurement. If a glitch
occurs that is large enough to fool the master into believing that
the temperature measurement is over, the temperature read
would not be the actual temperature. In most cases, the master
spots a temperature value that is erroneous and can request
another temperature measurement for confirmation. One area
that can cause problems is if this very large glitch occurs near
the end of the low period of the mark-space waveform, and the
temperature read back is so close to the expectant temperature
that the master does not question it.
One layout method that helps in reducing the possibility of a
glitch is to run ground tracks on either side of the OUT line.
Use a wide OUT track to minimize inductance and reduce noise
pickup. A 10 mil track minimum width and spacing is
recommended. Figure 31 shows how glitch protection traces
could be laid out.
GND
OUT
GND
10 MIL
10 MIL
10 MIL
10 MIL
10 MIL
03340-043
Figure 31. Use Separate Traces to Reduce Power Supply Noise
Another method that helps reduce the possibility of a glitch is to
use a 50 ns glitch filter on the OUT line. The glitch filter
eliminates any possibility of a glitch getting through to the
master or being passed along a daisy chain.
TEMPERATURE MONITORING
The TMP05/TMP06 are ideal for monitoring the thermal
environment within electronic equipment. For example, the
surface-mounted package accurately reflects the exact thermal
conditions that affect nearby integrated circuits.
The TMP05/TMP06 measure and convert the temperature at
the surface of their own semiconductor chip. When the
TMP05/TMP06 are used to measure the temperature of a
nearby heat source, the thermal impedance between the heat
source and the TMP05/TMP06 must be considered. Often, a
thermocouple or other temperature sensor is used to measure
the temperature of the source, while the TMP05/TMP06
temperature is monitored by measuring TH and TL. Once the
thermal impedance is determined, the temperature of the heat
source can be inferred from the TMP05/TMP06 output.
One example of using the TMP05/TMP06’s unique properties is
in monitoring a high power dissipation microprocessor. Each
TMP05/TMP06 part, in a surface-mounted package, is
mounted directly beneath the microprocessor’s pin grid array
(PGA) package. In a typical application, the TMP05/TMP06
output is connected to an ASIC, where the pulse width is
measured. The TMP05/TMP06 pulse output provides a
significant advantage in this application because it produces a
linear temperature output while needing only one I/O pin and
without requiring an ADC.
DAISY-CHAIN APPLICATION
This section provides an example of how to connect two
TMP05s in daisy-chain mode to a standard 8052 microcon-
troller core. The ADuC812 is the microcontroller used and the
core processing engine is the 8052. Figure 31 shows how to
interface to the 8052 core device. The TMP05 Program Code
Example 1 section shows how to communicate from the
ADuC812 to two daisy-chained TMP05s. This code can also be
used with the ADuC831 or any microprocessor running on an
8052 core.
T
IMER T0
S
TARTS TEMPSEGMENT = 1 TEMPSEGMENT = 2 TEMPSEGMENT = 3
TEMP_HIGH2TEMP_HIGH1
TEMP_LOW0 TEMP_LOW1
TEMP_HIGH0
INTO INTO INTO
03340-035
Figure 32. Reference Diagram for Software Variables
in the TMP05 Program Code Example 1
Figure 32 is a diagram of the input waveform into the ADuC812
from the TMP05 daisy chain. It illustrates how the code’s variables
are assigned and it should be referenced when reading the
TMP05 Program Code Example 1. Application notes showing
the TMP05 working with other types of microcontrollers are
available from Analog Devices at www.analog.com.
Figure 33 shows how the three devices are hardwired together.
Figure 34 to Figure 36 are flow charts for this program.
TMP05/TMP06
Rev. B | Page 19 of 28
VDD
START
PULSE
TH (U2)
TL (U2)
TL (U1)
TH (U1)
T0TIME
TH (U1)
TL (U1)
GND FUNC
CONV/IN
OUT
TMP05 (U1)
GND FUNC
CONV/IN
OUT
TMP05 (U2)
ADuC812
P3.7
P3.2/INTO
TIME
START
PULSE
START
PULSE
T
0
VDD
0.1µF
VDD
VDD
0.1µF
VDD
VDD
03340-014
Figure 33. Typical Daisy-Chain Application Circuit
TMP05/TMP06
Rev. B | Page 20 of 28
DECLARE VARIABLES
INITIALIZE TIMERS
ENABLE TIMER
INTERRUPTS
SEND START
PULSE
START TIMER 0
SET-UP EDGE
TRIGGERED
(H-L) INTO
ENABLE INTO
INTERRUPT
ENABLE GLOBAL
INTERRUPTS
WAIT FOR
INTERRUPT
PROCESS
INTERRUPTS
WAIT FOR END
OF MEASUREMENT
CALCULATE
TEMPERATURE
AND SEND
FROM UART
03340-036
Figure 34. ADuC812 Main Routine Flowchart
SET-UP UART
CONVERT VARIABLES
TO FLOATS
CALCULATE
TEMPERATURE
FROM U1
TEMP U1 =
421 – (751 × (TEMP_HIGH0/
(TEMP_LOW0 – (TEMP_HIGH1)))
CALCULATE
TEMPERATURE
FROM U2
TEMP U2 =
421 – (751 × (TEMP_HIGH1/
(TEMP_LOW1 – (TEMP_HIGH2)))
SEND TEMPERATURE
RESULTS
OUT OF UART
03340-038
Figure 35. ADuC812 Temperature Calculation Routine Flowchart
TMP05/TMP06
Rev. B | Page 21 of 28
YE S
NO
NO
YE S
NO
NO
YES
ENTER INTERRUPT
ROUTINE
CHECK IF TIMER 1
IS RUNNING
COPY TIMER 1 VALUES
INTO A REGISTER
RESET TIMER 1
START TIMER 1
IS TEMPSEGMENT
= 1
CALCULATE
TEMP_HIGH0
RESET TIMER 0
TO ZERO
IS TEMPSEGMENT
= 2
IS TEMPSEGMENT
= 3
CALCULATE
TEMP_LOW1
CALCULATE
TEMP_HIGH2
USING TIMER 0
VALUES
INCREMENT
TEMPSEGMENT
EXIT INTERRUPT
ROUTINE
CALCULATE
TEMP_LOW0
USING TIMER 1
VALUES
CALCULATE
TEMP_HIGH1
USING TIMER 0
VALUES
RESET TIMER 0
TO ZERO
YES
03340-037
Figure 36. ADuC812 Interrupt Routine Flowchart
TMP05 Program Code Example 1
//=============================================================================================
// Description : This program reads the temperature from 2 daisy-chained TMP05 parts.
//
// This code runs on any standard 8052 part running at 11.0592MHz.
// If an alternative core frequency is used, the only change required is an
// adjustment of the baud rate timings.
//
// P3.2 = Daisy-chain output connected to INT0.
// P3.7 = Conversion control.
// Timer0 is used in gate mode to measure the high time.
// Timer1 is triggered on a high-to-low transition of INT0 and is used to measure
// the low time.
//=============================================================================================
TMP05/TMP06
Rev. B | Page 22 of 28
#include <stdio.h>
#include <ADuC812.h> //ADuC812 SFR definitions
void delay(int);
sbit Daisy_Start_Pulse = 0xB7; //Daisy_Start_Pulse = P3.7
sbit P3_4 = 0xB4;
long temp_high0,temp_low0,temp_high1,temp_low1,temp_high2,th,tl; //Global variables to allow
//access during ISR.
//See
Figure 32.
int timer0_count=0,timer1_count=0,tempsegment=0;
void int0 () interrupt 0 //INT0 Interrupt Service Routine
{
if (TR1 == 1)
{
th = TH1;
tl = TL1;
th = TH1; //To avoid misreading timer
TL1 = 0;
TH1 = 0;
}
TR1=1; //Start timer1 running, if not running
Already
if (tempsegment == 1)
{
temp_high0 = (TH0*0x100+TL0)+(timer0_count*65536); //Convert to integer
TH0=0x00; //Reset count
TL0=0x00;
timer0_count=0;
}
if (tempsegment == 2)
{
temp_low0 = (th*0x100+tl)+(timer1_count*65536); //Convert to integer
temp_high1 = (TH0*0x100+TL0)+(timer0_count*65536); //Convert to integer
TH0=0x00; //Reset count
TL0=0x00;
timer0_count=0;
timer1_count=0;
}
if (tempsegment == 3)
{
temp_low1 = (th*0x100+tl)+(timer1_count*65536); //Convert to integer
temp_high2 = (TH0*0x100+TL0)+(timer0_count*65536);
TH0=0x00; //Reset count
TL0=0x00;
timer0_count=0;
timer1_count=0;
}
tempsegment++;
}
void timer0 () interrupt 1
{
timer0_count++; //Keep a record of timer0 overflows
}
void timer1 () interrupt 3
{
timer1_count++; //Keep a record of timer1 overflows
TMP05/TMP06
Rev. B | Page 23 of 28
}
void main(void)
{
double temp1=0,temp2=0;
double T1,T2,T3,T4,T5;
// Initialization
TMOD = 0x19; // Timer1 in 16-bit counter mode
// Timer0 in 16-bit counter mode
// with gate on INT0. Timer0 only counts when INTO pin // is high.
ET0 = 1; // Enable timer0 interrupts
ET1 = 1; // Enable timer1 interrupts
tempsegment = 1; // Initialize segment
Daisy_Start_Pulse = 0; // Pull P3.7 low
// Start Pulse
Daisy_Start_Pulse = 1;
Daisy_Start_Pulse = 0; //Toggle P3.7 to give start pulse
// Set T0 to count the high period
TR0 = 1; // Start timer0 running
IT0 = 1; // Interrupt0 edge triggered
EX0 = 1; // Enable interrupt
EA = 1; // Enable global interrupts
for(;;)
{
if (tempsegment == 4)
break;
}
//CONFIGURE UART
SCON = 0x52 ; // 8-bit, no parity, 1 stop bit
TMOD = 0x20 ; // Configure timer1..
TH1 = 0xFD ; // ..for 9600baud..
TR1 = 1; // ..(assuming 11.0592MHz crystal)
//Convert variables to floats for calculation
T1= temp_high0;
T2= temp_low0;
T3= temp_high1;
T4= temp_low1;
T5= temp_high2;
temp1=421-(751*(T1/(T2-T3)));
temp2=421-(751*(T3/(T4-T5)));
printf("Temp1 = %f\nTemp2 = %f\n",temp1,temp2); //Sends temperature result out UART
while (1); // END of program
}
// Delay routine
void delay(int length)
{
while (length >=0)
length--;
}
TMP05/TMP06
Rev. B | Page 24 of 28
3.3V
GNDFUNC
CONV/IN
OUT
TMP05
PIC16F876
V
DD
0.1µF
PA.0
FIRST TEMP
MEASUREMENT
T
0
TIME
SECOND TEMP
MEASUREMENT
03340-039
CONTINUOUSLY CONVERTING APPLICATION
This section provides an example of how to connect one
TMP05 in continuously converting mode to a microchip
PIC16F876 microcontroller. Figure 37 shows how to interface
to the PIC16F876.
The TMP05 Program Code Example 2 shows how to
communicate from the microchip device to the TMP05. This
code can also be used with other PICs by changing the include
file for the part.
Figure 37. Typical Continuously Converting Application Circuit
TMP05 Program Code Example 2
//=============================================================================================
//
// Description : This program reads the temperature from a TMP05 part set up in continuously
// converting mode.
// This code was written for a PIC16F876, but can be easily configured to function with other
// PICs by simply changing the include file for the part.
//
// Fosc = 4MHz
// Compiled under CCS C compiler IDE version 3.4
// PWM output from TMP05 connected to PortA.0 of PIC16F876
//
//============================================================================================
#include <16F876.h> // Insert header file for the particular PIC being used
#device adc=8
#use delay(clock=4000000)
#fuses NOWDT,XT, PUT, NOPROTECT, BROWNOUT, LVP
//_______________________________Wait for high function_____________________________________
void wait_for_high() {
while(input(PIN_A0)) ; /* while high, wait for low */
while(!input(PIN_A0)); /* wait for high */
}
//______________________________Wait for low function_______________________________________
void wait_for_low() {
while(input(PIN_A0)); /* wait for high */
}
//_______________________________Main begins here____________________________________________
void main(){
long int high_time,low_time,temp;
setup_adc_ports(NO_ANALOGS);
setup_adc(ADC_OFF);
setup_spi(FALSE);
setup_timer_1 ( T1_INTERNAL | T1_DIV_BY_2); //Sets up timer to overflow after 131.07ms
TMP05/TMP06
Rev. B | Page 25 of 28
do{
wait_for_high();
set_timer1(0); //Reset timer
wait_for_low();
high_time = get_timer1();
set_timer1(0); //Reset timer
wait_for_high();
low_time = get_timer1();
temp = 421 – ((751 * high_time)/low_time)); //Temperature equation for the high state
//conversion rate.
//Temperature value stored in temp as a long int
}while (TRUE);
}
TMP05/TMP06
Rev. B | Page 26 of 28
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-203-AA
0.30
0.15
0.10 MAX
1.00
0.90
0.70
0.46
0.36
0.26
SEATING
PLANE
0.22
0.08
1.10
0.80
45
123
PIN 1
0.65 BSC
2.20
2.00
1.80
2.40
2.10
1.80
1.35
1.25
1.15
0.10 COPLANARITY
0.40
0.10
Figure 38. 5-Lead Thin Shrink Small Outline Transistor Package [SC-70]
(KS-5)
Dimensions shown in millimeters
PIN 1
1.60 BSC 2.80 BSC
1.90
BSC
0.95 BSC
5
123
4
0.22
0.08
10°
5°
0°
0.50
0.30
0.15 MAX SEATING
PLANE
1.45 MAX
1.30
1.15
0.90
2.90 BSC
0.60
0.45
0.30
COMPLIANT TO JEDEC STANDARDS MO-178-AA
Figure 39. 5-Lead Small Outline Transistor Package [SOT-23]
(RJ-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Minimum
Quantities/Reel
Temperature
Range1
Temperature
Accuracy2
Package
Description
Package
Option Branding
TMP05AKS-500RL7 500 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8A
TMP05AKS-REEL 10,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8A
TMP05AKS-REEL7 3,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8A
TMP05AKSZ-500RL73 500 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8C
TMP05AKSZ-REEL3 10,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8C
TMP05AKSZ-REEL73 3,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T8C
TMP05ART-500RL7 500 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8A
TMP05ART-REEL 10,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8A
TMP05ART-REEL7 3,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8A
TMP05ARTZ-500RL73 500 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8C
TMP05ARTZ-REEL3 10,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8C
TMP05ARTZ-REEL73 3,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T8C
TMP05BKS-500RL7 500 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8B
TMP05BKS-REEL 10,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8B
TMP05BKS-REEL7 3,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8B
TMP05BKSZ-500RL73 500 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8D
TMP05BKSZ-REEL3 10,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8D
TMP05BKSZ-REEL73 3,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T8D
TMP05BRT-500RL7 500 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8B
TMP05BRT-REEL 10,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8B
TMP05BRT-REEL7 3,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8B
TMP05BRTZ-500RL73 500 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8D
TMP05BRTZ-REEL3 10,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8D
TMP05BRTZ-REEL73 3,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T8D
TMP05/TMP06
Rev. B | Page 27 of 28
Model
Minimum
Quantities/Reel
Temperature
Range1
Temperature
Accuracy2
Package
Description
Package
Option Branding
TMP06AKS-500RL7 500 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9A
TMP06AKS-REEL 10,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9A
TMP06AKS-REEL7 3,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9A
TMP06AKSZ-500RL73 500 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9C
TMP06AKSZ-REEL3 10,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9C
TMP06AKSZ-REEL73 3,000 –40°C to +150°C ±2°C 5-Lead SC-70 KS-5 T9C
TMP06ART-500RL7 500 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9A
TMP06ART-REEL 10,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9A
TMP06ART-REEL7 3,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9A
TMP06ARTZ-500RL73 500 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9C
TMP06ARTZ-REEL3 10,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9C
TMP06ARTZ-REEL73 3,000 –40°C to +150°C ±2°C 5-Lead SOT-23 RJ-5 T9C
TMP06BKS-500RL7 500 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9B
TMP06BKS-REEL 10,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9B
TMP06BKS-REEL7 3,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9B
TMP06BKSZ-500RL73 500 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9D
TMP06BKSZ-REEL3 10,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9D
TMP06BKSZ-REEL73 3,000 –40°C to +150°C ±1°C 5-Lead SC-70 KS-5 T9D
TMP06BRT-500RL7 500 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9B
TMP06BRT-REEL 10,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9B
TMP06BRT-REEL7 3,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9B
TMP06BRTZ-500RL73 500 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9D
TMP06BRTZ-REEL3 10,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9D
TMP06BRTZ-REEL73 3,000 –40°C to +150°C ±1°C 5-Lead SOT-23 RJ-5 T9D
1 It is not recommended to operate the device at temperatures above 125°C for more than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond
this limit affects device reliability.
2 A-grade and B-grade temperature accuracy is over the 0°C to 70°C temperature range.
3 Z = Pb-free part.
TMP05/TMP06
Rev. B | Page 28 of 28
NOTES
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03340-0-4/06(B)
