General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of
TT electronics plc
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Wire and Film Technologies Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Metal Glaze™ thick film
element fired at 1000°C to
solid ceramic substrate
High temperature
dielectric coating
60/40 Solder over
nickel barrier
High Purity ceramic
core for optimal
thermal
distribution
Metal Glaze™ Cylindrical
Official Size
Power Resistor
CHP1X Series
• 0.1 ohm to 10K ohm
• Outstanding surge capacity
• 1W in a 1/2W package (2010 footprint)
• 150°C maximum operating temperature
Electrical Data
Size
Code¹
Industry
Footprint
IRC
Type
Maximum
Power Rat-
ing
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
Tolerance
(±%)³
TCR
(±%)³ Product Category
D 2010 CHP 1X 1W @ 70°C 300 600 0.1 to 0.99 1, 2, 5 100 Low Range
1.0 to 10K 1, 2, 5 50, 100 Standard
² Not to exceed P x R ³ Consult factory for tighter TCR, tolerance, or resistance values
Environmental Data
Characteristics Maximum Change Test Method
Temperature Coefficient As specified MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
Short Time Overload ±0.5% + 0.01 ohm
±1% for R>100K ohm
MIL-R-55342E Par 4.7.5
2.5 x P x R for 5 seconds
High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Resistance to Bonding Exposure ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.7 (Reflow soldered to board at
260°C for 10 seconds)
Solderability 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Moisture Resistance ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
Life Test ±0.3% + 0.01 ohm MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
Terminal Adhesion Strength ±1% + 0.01 ohm
no mechanical damage
1200 gram push from underside of mounted chip for
60 seconds
Resistance to Board Bending ±1% + 0.01 ohm
no mechanical damage
Chip mounted in center of 90mm long board, deflected
5mm so as to exert pull on chip contacts for 10 seconds
√
√
CHP1X Series Issue September 2008 Sheet 1 of 2
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Wire and Film Technologies Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Power Derating Curve
Metal Glaze™ Cylindrical
Official Size
Power Resistor
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
% of Rated Power
120
100
80
60
40
20
0
Ambient Temperature (°C)
Applied Power
(Watts)
Temperature Rise
(C)
120
100
80
60
40
20
0
0.00 0.25 0.50 0.75 1.00 1.25
Resistor Hot Spot
Solder Joint
Temperature Rise Chart
1.0E - 04 1.0E - 03 1.0E - 02 1.0E - 01 1.0E + 00
Peak Power (watts)
Surge or Pulse Duration (seconds)
100,000
10,000
1,000
100
10
1
Non/Low Repetitive Surge Curve
Repetitive Surge Curve
1.0E - 04 1.0E - 03 1.0E - 02 1.0E - 01 1.0E + 00
Surge or Pulse Duration (Seconds)
Peak Power (watts)
1,000.00
100.00
10.00
1.00
CHP1X Series Issue September 2008 Sheet 2 of 2
Sample Part No.
IRC Type
(CHP 1X)
Temperature Coefficient
(50 ppm, 100 ppm)
Resistance Value
(100 ohms and greater - First 3 significant digits plus 4th digit multiplier)
Example: 100 ohms = 1000, 1000 ohms = 1001, 150,000 ohms = 1503
(Less than 100 ohms - "R" is used to designate decimal)
Example: 51 ohms = 51R0, 1 ohm = 1R00, 0.25 ohms = R250
Tolerance
(C = 0.25%; D = 0.5%; F = 1.0%; G = 2.0%; J = 5.0%)
Packaging Code*
(BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel)
Ordering Data
CHP 1X - 100 - 2203 - F - 13
