DS92LV010ATMXNOPB - NATIONAL SEMICONDUCTOR

DS90LV032A

DS90LV032A 3V LVDS Quad CMOS Differential Line Receiver

Literature Number: SNLS011B

DS90LV032A

October 27, 2010

3V LVDS Quad CMOS Differential Line Receiver

General Description

The DS90LV032A is a quad CMOS differential line receiver

designed for applications requiring ultra low power dissipation

and high data rates. The device is designed to support data

rates in excess of 400 Mbps (200 MHz) utilizing Low Voltage

Differential Signaling (LVDS) technology.

The DS90LV032A accepts low voltage (350 mV typical) dif-

ferential input signals and translates them to 3V CMOS output

levels. The receiver supports a TRI-STATE® function that

may be used to multiplex outputs. The receiver also supports

open, shorted and terminated (100Ω) input Fail-safe. The re-

ceiver output will be HIGH for all fail-safe conditions.

The DS90LV032A and companion LVDS line driver (eg.

DS90LV031A) provide a new alternative to high power PECL/

ECL devices for high speed point-to-point interface applica-

tions.

Features

■>400 Mbps (200 MHz) switching rates

■0.1 ns channel-to-channel skew (typical)

■0.1 ns differential skew (typical)

■3.3 ns maximum propagation delay

■3.3V power supply design

■Power down high impedance on LVDS inputs

■Low Power design (40mW @ 3.3V static)

■Interoperable with existing 5V LVDS networks

■Accepts small swing (350 mV typical) VID

■Supports open, short and terminated input fail-safe

■Compatible with ANSI/TIA/EIA-644

■Industrial temp. operating range (-40°C to +85°C)

■Available in SOIC and TSSOP Packaging

Connection Diagram

Dual-in-Line

10006701

Order Number DS90LV032ATM

or DS90LV032ATMTC

See NS Package Number M16A or MTC16

Functional Diagram

10006702

Truth Table

ENABLES INPUTS OUTPUT

EN EN* RIN+ − RIN− ROUT

L H X Z

All other combinations VID ≥ 0.1V H

of ENABLE inputs VID ≤ −0.1V L

Full Fail-safe

OPEN/SHORT H

or Terminated

TRI-STATE® is a registered trademark of National Semiconductor Corporation.

DS90LV032A 3V LVDS Quad CMOS Differential Line Receiver

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage (VCC)−0.3V to +4V

Input Voltage (RIN+, RIN−)−0.3V to +3.9V

Enable Input Voltage (EN, EN*) −0.3V to (VCC + 0.3V)

Output Voltage (ROUT) −0.3V to (VCC + 0.3V)

Maximum Package Power Dissipation @ +25°C

M Package 1025 mW

MTC Package 866 mW

Derate M Package 8.2 mW/°C above +25°C

Derate MTC Package 6.9 mW/°C above +25°C

Storage Temperature Range −65°C to +150°C

Lead Temperature Range

(Soldering 4 sec.) +260°C

Maximum Junction Temperature +150°C

ESD Rating (Note 10)

(HBM 1.5 kΩ, 100 pF) ≥ 4.5 kV

(EIAJ 0 Ω, 200 pF) ≥ 250 V

Recommended Operating

Conditions

Min Typ Max Units

Supply Voltage (VCC) +3.0 +3.3 +3.6 V

Receiver Input Voltage GND +3.0 V

Operating Free Air

Temperature (TA) −40 25 +85 °C

Electrical Characteristics

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Note 2)

Symbol Parameter Conditions Pin Min Typ Max Units

VTH Differential Input High Threshold VCM = +1.2V

(Note 13)

RIN+,

RIN−

+20 +100 mV

VTL Differential Input Low Threshold −100 −20 mV

VCMR Common-Mode Voltage Range VID = 200 mV peak to peak (Note 5) 0.1 2.3 V

IIN Input Current VIN = +2.8V VCC = 3.6V or 0V −10 ±1 +10 μA

VIN = 0V −10 ±1 +10 μA

VIN = +3.6V VCC = 0V -20 +20 μA

VOH Output High Voltage IOH = −0.4 mA, VID = +200 mV ROUT 2.7 3.0 V

IOH = −0.4 mA, Input terminated 2.7 3.0 V

IOH = −0.4 mA, Input shorted 2.7 3.0 V

VOL Output Low Voltage IOL = 2 mA, VID = −200 mV 0.1 0.25 V

IOS Output Short Circuit Current Enabled, VOUT = 0V (Note 11) −15 −48 −120 mA

IOZ Output TRI-STATE Current Disabled, VOUT = 0V or VCC −10 ±1 +10 μA

VIH Input High Voltage EN,

EN*

2.0 VCC V

VIL Input Low Voltage GND 0.8 V

IIInput Current VIN = 0V or VCC, Other Input = VCC or GND −10 ±1 +10 μA

VCL Input Clamp Voltage ICL = −18 mA −1.5 −0.8 V

ICC No Load Supply Current EN, EN* = VCC or GND, Inputs Open VCC 10 15 mA

Receivers Enabled EN, EN* = 2.4V or 0.5V, Inputs Open 10 15 mA

ICCZ No Load Supply Current

Receivers Disabled

EN = GND, EN* = VCC, Inputs Open 3 5 mA

www.national.com 2

DS90LV032A

Switching Characteristics

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Note 3, Note 4, Note 7, Note 8)

Symbol Parameter Conditions Min Typ Max Units

tPHLD Differential Propagation Delay High to Low CL = 10 pF 1.8 3.3 ns

tPLHD Differential Propagation Delay Low to High VID = 200 mV 1.8 3.3 ns

tSKD1 Differential Pulse Skew |tPHLD − tPLHD| (Note 6)(Figure 1 and Figure 2)0 0.1 0.35 ns

tSKD2 Differential Channel-to-Channel Skew-same device (Note 7) 0 0.1 0.5 ns

tSKD3 Differential Part to Part Skew (Note 8) 1.0 ns

tSKD4 Differential Part to Part Skew (Note 9) 1.5 ns

tTLH Rise Time 0.35 1.2 ns

tTHL Fall Time 0.35 1.2 ns

tPHZ Disable Time High to Z RL = 2 kΩ 8 12 ns

tPLZ Disable Time Low to Z CL = 10 pF 6 12 ns

tPZH Enable Time Z to High (Figure 3 and Figure 4) 11 17 ns

tPZL Enable Time Z to Low 11 17 ns

fMAX Maximum Operating Frequency (Note 14) All Channels Switching 200 250 MHz

Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices

should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.

Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise

specified.

Note 3: All typicals are given for: VCC = +3.3V, TA = +25°C.

Note 4: Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr and tf (0% to 100%) ≤ 3 ns for RIN.

Note 5: The VCMR range is reduced for larger VID. Example: if VID = 400mV, the VCMR is 0.2V to 2.2V. The fail-safe condition with inputs shorted is valid over

a common-mode range of 0V to 2.3V. A VID up to VCC − 0V may be applied to the RIN+/ RIN− inputs with the Common-Mode voltage set to VCC/2. Propagation

delay and Differential Pulse skew decrease when VID is increased from 200mV to 400mV. Skew specifications apply for 200mV ≤ VID ≤ 800mV over the common-

mode range .

Note 6: tSKD1 is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel

Note 7: tSKD2, Channel-to-Channel Skew, is defined as the difference between the propagation delay of one channel and that of the others on the same chip with

any event on the inputs.

Note 8: tSKD3, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices at the same

VCC, and within 5°C of each other within the operating temperature range.

Note 9: tSKD4, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over recommended

operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min| differential propagation delay.

Note 10: ESD Rating:

HBM (1.5 kΩ, 100 pF) ≥ 4.5kV

EIAJ (0Ω, 200 pF) ≥ 250V

Note 11: Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not

exceed maximum junction temperature specification.

Note 12: CL includes probe and jig capacitance.

Note 13: VCC is always higher than RIN+ and RIN− voltage. RIN− and RIN+ are allowed to have a voltage range −0.2V to VCC − VID/2. However, to be compliant

with AC specifications, the common voltage range is 0.1V to 2.3V

Note 14: fMAX generator input conditions: tr = tf < 1ns (0% to 100%), 50% duty cycle, differential (1.05V to 1.35V peak to peak). Output Criteria: 60%/40% duty

cycle, VOL (max 0.4V), VOH (min 2.7V), Load = 10 pF (stray plus probes)

3 www.national.com

DS90LV032A

Parameter Measurement Information

10006703

FIGURE 1. Receiver Propagation Delay and Transition Time Test Circuit

10006704

FIGURE 2. Receiver Propagation Delay and Transition Time Waveforms

10006705

CL includes load and test jig capacitance.

S1 = VCC for tPZL, and tPLZ measurements.

S1 = GND for tPZH and tPHZ measurements.

FIGURE 3. Receiver TRI-STATE Delay Test Circuit

www.national.com 4

DS90LV032A

10006706

FIGURE 4. Receiver TRI-STATE Delay Waveforms

Typical Application

Balanced System

10006707

FIGURE 5. Point-to-Point Application

5 www.national.com

DS90LV032A

Applications Information

General application guidelines and hints for LVDS drivers and

receivers may be found in the following application notes:

www.national.com/lvds.

LVDS drivers and receivers are intended to be primarily used

in an uncomplicated point-to-point configuration as is shown

in Figure 5. This configuration provides a clean signaling en-

vironment for the fast edge rates of the drivers . The receiver

is connected to the driver through a balanced media which

may be a standard twisted pair cable, a parallel pair cable, or

simply PCB traces. Typically the characteristic impedance of

the media is in the range of 100Ω. A termination resistor of

100Ω should be selected to match the media, and is located

as close to the receiver input pins as possible. The termination

resistor converts the driver output (current mode) into a volt-

age that is detected by the receiver. Other configurations are

possible such as a multi-receiver configuration, but the effects

of a mid-stream connector(s), cable stub(s), and other

impedance discontinuities as well as ground shifting, noise

margin limits, and total termination loading must be taken into

account.

The DS90LV032A differential line receiver is capable of de-

tecting signals as low as 100 mV, over a ±1V common-mode

range centered around +1.2V. This is related to the driver off-

set voltage which is typically +1.2V. The driven signal is

centered around this voltage and may shift ±1V around this

center point. The ±1V shifting may be the result of a ground

potential difference between the driver's ground reference

and the receiver's ground reference, the common-mode ef-

fects of coupled noise, or a combination of the two. Both

receiver input pins have a recommended operating input volt-

age range of 0V to +2.4V (measured from each pin to ground),

exceeding these limits may turn on the ESD protection cir-

cuitry which will clamp the bus voltages.

Power Decoupling Recommendations:

Bypass capacitors must be used on power pins. High fre-

quency ceramic (surface mount is recommended) 0.1µF in

parallel with 0.01µF, in parallel with 0.001µF at the power

supply pin as well as scattered capacitors over the printed

circuit board. Multiple vias should be used to connect the de-

coupling capacitors to the power planes A 10µF (35V) or

greater solid tantalum capacitor should be connected at the

power entry point on the printed circuit board.

PC Board considerations:

Use at least 4 PCB layers (top to bottom); LVDS signals,

ground, power, TTL signals.

Isolate TTL signals from LVDS signals, otherwise the TTL

may couple onto the LVDS lines. It is best to put TTL and

LVDS signals on different layers which are isolated by a pow-

er/ground plane(s).

Keep drivers and receivers as close to the (LVDS port side)

connectors as possible.

Differential Traces:

Use controlled impedance traces which match the differential

impedance of your transmission medium (ie. cable) and ter-

mination resistor. Run the differential pair trace lines as close

together as possible as soon as they leave the IC (stubs

should be < 10mm long). This will help eliminate reflections

and ensure noise is coupled as common-mode. Lab experi-

ments show that differential signals which are 1mm apart

radiate far less noise than traces 3mm apart since magnetic

field cancellation is much better with the closer traces. Plus,

noise induced on the differential lines is much more likely to

appear as common-mode which is rejected by the receiver.

Match electrical lengths between traces to reduce skew.

Skew between the signals of a pair means a phase difference

between signals which destroys the magnetic field cancella-

tion benefits of differential signals and EMI will result. (Note

the velocity of propagation, v = c/Er where c (the speed of

light) = 0.2997mm/ps or 0.0118 in/ps). Do not rely solely on

the autoroute function for differential traces. Carefully review

dimensions to match differential impedance and provide iso-

lation for the differential lines. Minimize the number of vias

and other discontinuities on the line.

Avoid 90° turns (these cause impedance discontinuities). Use

arcs or 45° bevels.

Within a pair of traces, the distance between the two traces

should be minimized to maintain common-mode rejection of

the receivers. On the printed circuit board, this distance

should remain constant to avoid discontinuities in differential

impedance. Minor violations at connection points are allow-

able.

Termination:

Use a resistor which best matches the differential impedance

of your transmission line. The resistor should be between

90Ω and 130Ω. Remember that the current mode outputs

need the termination resistor to generate the differential volt-

age. LVDS will not work without resistor termination. Typical-

ly, connect a single resistor across the pair at the receiver end.

Surface mount 1% to 2% resistors are best. PCB stubs, com-

ponent lead, and the distance from the termination to the

receiver inputs should be minimized. The distance between

the termination resistor and the receiver should be <10mm

(12mm MAX)

Probing LVDS Transmission Lines:

Always use high impedance (> 100kΩ), low capacitance

(< 2 pF) scope probes with a wide bandwidth (1 GHz) scope.

Improper probing will give deceiving results.

Cables and Connectors, General Comments:

When choosing cable and connectors for LVDS it is important

to remember:

Use controlled impedance media. The cables and connectors

you use should have a matched differential impedance of

about 100Ω. They should not introduce major impedance dis-

continuities.

Balanced cables (e.g. twisted pair) are usually better than

unbalanced cables (ribbon cable, simple coax.) for noise re-

duction and signal quality. Balanced cables tend to generate

less EMI due to field canceling effects and also tend to pick

up electromagnetic radiation as common-mode (not differen-

tial mode) noise which is rejected by the receiver. For cable

distances < 0.5M, most cables can be made to work effec-

tively. For distances 0.5M ≤ d ≤ 10M, CAT 3 (category 3)

twisted pair cable works well, is readily available and relatively

inexpensive.

Fail-Safe Feature:

The LVDS receiver is a high gain, high speed device that am-

plifies a small differential signal (20mV) to CMOS logic levels.

Due to the high gain and tight threshold of the receiver, care

should be taken to prevent noise from appearing as a valid

signal.

The receiver's internal fail-safe circuitry is designed to source/

sink a small amount of current, providing fail-safe protection

(a stable known state of HIGH output voltage) for floating,

terminated or shorted receiver inputs.

1. Open Input Pins. The DS90LV032A is a quad receiver

device, and if an application requires only 1, 2 or 3

receivers, the unused channel(s) inputs should be left

www.national.com 6

DS90LV032A

OPEN. Do not tie unused receiver inputs to ground or any

other voltages. The input is biased by internal high value

pull up and pull down resistors to set the output to a HIGH

state. This internal circuitry will guarantee a HIGH, stable

output state for open inputs.

2. Terminated Input. If the driver is disconnected (cable

unplugged), or if the driver is in a TRI-STATE or power-

off condition, the receiver output will again be in a HIGH

state, even with the end of cable 100Ω termination

resistor across the input pins. The unplugged cable can

become a floating antenna which can pick up noise. If the

cable picks up more than 10mV of differential noise, the

receiver may see the noise as a valid signal and switch.

To insure that any noise is seen as common-mode and

not differential, a balanced interconnect should be used.

Twisted pair cable will offer better balance than flat ribbon

cable.

3. Shorted Inputs. If a fault condition occurs that shorts

the receiver inputs together, thus resulting in a 0V

differential input voltage, the receiver output will remain

in a HIGH state. Shorted input fail-safe is not supported

across the common-mode range of the device (GND to

2.4V). It is only supported with inputs shorted and no

external common-mode voltage applied.

External lower value pull up and pull down resistors (for a

stronger bias) may be used to boost fail-safe in the presence

of higher noise levels. The pull up and pull down resistors

should be in the 5kΩ to 15kΩ range to minimize loading and

waveform distortion to the driver. The common-mode bias

point should be set to approximately 1.2V (less than 1.75V)

to be compatible with the internal circuitry.

The footprint of the DS90LV032A is the same as the industry

standard 26LS32 Quad Differential (RS-422) Receiver.

Pin Descriptions

Pin No. Name Description

2, 6, RIN+ Non-inverting receiver input pin

10, 14

1, 7, RIN− Inverting receiver input pin

9, 15

3, 5, ROUT Receiver output pin

11, 13

4 EN Active high enable pin, OR-ed with EN*

12 EN* Active low enable pin, OR-ed with EN

16 VCC Power supply pin, +3.3V ± 0.3V

8 GND Ground pin

Ordering Information

Operating Package Type/ Order Number

Temperature Number

−40°C to +85°C SOP/M16A DS90LV032ATM

−40°C to +85°C TSSOP/MTC16 DS90LV032ATMTC

10006708

FIGURE 6. ICC vs Frequency, four channels switching

7 www.national.com

DS90LV032A

10006709

FIGURE 7. Typical Common-Mode Range variation with respect to amplitude of differential input

10006710

FIGURE 8. Typical Pulse Skew variation versus common-mode voltage

www.national.com 8

DS90LV032A

10006711

FIGURE 9. Variation in High to Low Propagation Delay versus VCM

10006712

FIGURE 10. Variation in Low to High Propagation Delay versus VCM

9 www.national.com

DS90LV032A

Physical Dimensions inches (millimeters) unless otherwise noted

16-Lead (0.150″ Wide) Molded Small Outline Package, JEDEC

Order Number DS90LV032ATM

NS Package Number M16A

16-Lead (0.100″ Wide) Molded Thin Shrink Small Outline Package, JEDEC

Order Number DS90LV032ATMTC

NS Package Number MTC16

www.national.com 10

DS90LV032A

Notes

11 www.national.com

DS90LV032A

Notes

DS90LV032A 3V LVDS Quad CMOS Differential Line Receiver

For more National Semiconductor product information and proven design tools, visit the following Web sites at:

www.national.com

Products Design Support

Amplifiers www.national.com/amplifiers WEBENCH® Tools www.national.com/webench

Audio www.national.com/audio App Notes www.national.com/appnotes

Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns

Data Converters www.national.com/adc Samples www.national.com/samples

Interface www.national.com/interface Eval Boards www.national.com/evalboards

LVDS www.national.com/lvds Packaging www.national.com/packaging

Power Management www.national.com/power Green Compliance www.national.com/quality/green

Switching Regulators www.national.com/switchers Distributors www.national.com/contacts

LDOs www.national.com/ldo Quality and Reliability www.national.com/quality

LED Lighting www.national.com/led Feedback/Support www.national.com/feedback

Voltage References www.national.com/vref Design Made Easy www.national.com/easy

PowerWise® Solutions www.national.com/powerwise Applications & Markets www.national.com/solutions

Serial Digital Interface (SDI) www.national.com/sdi Mil/Aero www.national.com/milaero

Temperature Sensors www.national.com/tempsensors SolarMagic™ www.national.com/solarmagic

PLL/VCO www.national.com/wireless PowerWise® Design

University

www.national.com/training

THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION

(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY

OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO

SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,

IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS

DOCUMENT.

TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT

NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL

PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR

APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND

APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE

NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.

EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO

LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE

AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR

PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY

RIGHT.

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR

SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL

COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and

whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected

to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform

can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.

National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other

brand or product names may be trademarks or registered trademarks of their respective holders.

For the most current product information visit us at www.national.com

National Semiconductor

Americas Technical

Support Center

Email: support@nsc.com

Tel: 1-800-272-9959

National Semiconductor Europe

Technical Support Center

Email: europe.support@nsc.com

National Semiconductor Asia

Pacific Technical Support Center

Email: ap.support@nsc.com

National Semiconductor Japan

Technical Support Center

Email: jpn.feedback@nsc.com

www.national.com

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

applications using TI components. To minimize the risks associated with customer products and applications, customers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,

or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a

warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual

property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied

by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive

business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional

restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all

express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not

responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably

be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing

such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products

and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be

provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in

such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are

specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military

specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265