2016 CATALOG Thermal Management Solutions 2016.9 industrial.panasonic.com/ Thermal Management Solutions CONTENTS Product Item Multilayer NTC Thermistors NTC Thermistors for automotive devices (chip type) "PGS" Graphite Sheets SSM(Semi-Sealing Material) "NASBIS" Insulating Sheet Part Number Page The NTC Thermistors 2 ERT JZ ERT J0 ERT J1 3 Handling Precautions 11 ERT J0 M ERT J1 M 16 Handling Precautions 21 EYG S EYG A EYG E 26 Minimum order 32 Handling Precautions 34 EYG Y EYG N 35 Handling Precautions 38 EYG T 39 Handling Precautions 42 "Graphite-PAD" high thermal conductivity in z-direction All products in this catalog comply with the RoHS Directive. The RoHS Directive is "the Directive (2011/65/EU) on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment " and its revisions. 01 Aug. 2016 -1- NTC Thermistors The NTC Thermistors NTC Thermistors is a negative temperature coefficient resistor that significantly reduces its resistance value as the heat/ ambient temperature rises. Thermistors is sintered in high-temperature (1200 C to 1500 C), and manufactured in various shapes. It's comprised of 2 to 4 kinds of metal oxides: iron, nickel, cobalt, manganese and copper. Features Recommended Applications Temperature Coefficient of Resistance is negative, and it's extremely large (-2.8 to -5.1 [%/C]). Various shapes, especially co mpact size components are available. Selection of resistance vale is comparatively free, it's available from several tens to several hundred k. For temperature measurement or temperature detection : Thermometer, temperature controller For temperature compensation : Transistor, transistor circuit, quarts oscillation circuit, and measuring instruments Physical Characteristics of NTC Thermistors Thermistor is a resistor sensitive to temperature that is utilizing the characteristic of metal oxide semiconductor having large temperature coefficient. And its temperature dependency of resistance value is indicated by the following equation : R=R0 exp [ ( B 1 T 1 T0 )] Fig. 1 1000 100 .....................................(1) 10 RT/R25 T0 : Standard Temperature 298.15 K(25 C) R0 : Resistance at T0 [K] B : Thermistor Constant [K] Temperature coefficient (a) in general meaning is indicated as follows : 1 2000 3000 400 0 500 0 60 00 0.1 B .................................................................... (2) 2 T 0.01 Since the change by temperature is considerably large, a is not appropriate as a constant. Therefore, B value (constant) is generally used as a coefficient of thermistors. 0.001 a= B=1000 -40 -20 0 20 40 60 T (C) 80 100 120 140 Major Characteristics of NTC Thermistors The relation between resistance and temperature of a thermistor is linear as shown in Fig. 2. The resistance value is shown in vertical direction in a logarithmic scale and reciprocal of absolute temperature (adding 273.15 to centigrade) is shown in horizontal direction. The B value (constant) determines the gradient of these straight lines. The B value (constant) is calculated by using following equation. knR1 - knR2 1 1 T1 T2 700 =4 0 B 25/5 100000 10000 ....................................................... (3) R1: Resistance at T1 K R2: Resistance at T2 K When you calculate this equation, you'll find that B value is not exactly constant. The resistance is expressed by the following equation : R = AT-C exp D/T ............................................................. (4) In (4), C is a small positive or negative constant and quite negligible except for use in precision temperature-measuring device, therefore, the B value can be considered as constant number. In Fig. 1, the relation between the resistance ratio RT/R25 (R25 : Resistance at 25 C, RT : Resistance at T C) and B Value is shown with T C, in the horizontal direction. 500 44005 = 00= /55 BB2255/ 0 104 4 25 EV EP473 0 0= J 0 5 T RTJ 5/ 2 R B E E 5 03 343 R1 5= E 0 25/8 J B T 0 A 5 0 ER 3 =4 G10 /50 5 E 2 0 B J ERT 02 T1 E TJ0 ER 00 =28 B 25/50 1 A10 J0E ERT 1000000 R () B= Fig. 2 10000000 1000 100 10 1 2.4 125 2.9 85 3.4 1 (x10 -3K-1) T 50 25 T (C) 3.9 0 -20 4.4 -40 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 May. 2015 -2- Multilayer NTC Thermistors Multilayer NTC Thermistors Series: ERTJ Features Surface Mount Device (0201, 0402, 0603) Highly reliable multilayer / monolithic structure Wide temperature operating range (-40 to 125 Environmentally-friendly lead-free RoHS compliant C) Recommended Applications Mobile Phone * Temperature compensation for crystal oscillator * Temperature compensation for semiconductor devices Personal Computer and Peripheral Device * Temperature detection for CPU and memory device * Temperature compensation for ink-viscosity (Inkjet Printer) Battery Pack (secondary battery) * Temperature detection of battery cells Liquid Crystal Display * Temperature compensation of display contrast * Temperature compensation of display backlighting (CCFL) Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E R T J 0 E G 1 0 3 J A Common Code Product Code Type Code ERT NTC J Chip Type (SMD) Thermistors Multilayer Type Size Code Z "0201" 0 "0402" 1 "0603" Packaging Style Code E V "0201", "0402" Pressed Carrier Taping Punched Carrier Taping (Pitch : 2 mm) "0603" Punched Carrier Taping (Pitch : 4 mm) B Value Class Code 2701 to 2800 A 3301 to 3400 G 3801 to 3900 M 4001 to 4100 P 4201 to 4300 R 4301 to 4400 S 4401 to 4500 T 4601 to 4700 V Nominal Resistance R25 () The first two digits are significant figures of resistance and the third one denotes the number of zeros following them. (Example) Resistance Tolerance Code G 1% Narrow Tolerance 2% Type H J 3% Standard 5% Type F Special Specification Construction 3 4 5 1 No. Name A Semiconductive Ceramics B Internal electrode C 2 D E Terminal electrode Substrate electrode Intermediate electrode External electrode Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 May. 2015 -3- Multilayer NTC Thermistors Ratings Size code (EIA) Operating Temperature Range Rated Maximum Power Dissipation1 2 Dissipation Factor Z(0201) 0(0402) -40 to 125 C 66 mW Approximately 2 mW/C 33 mW Approximately 1 mW/C 1(0603) 100 mW Approximately 3 mW/C 1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature. * The maximum value of power, and rated power is same under the condition of ambient temperature 25 C or less. If the temperature exceeds 25 C, rated power depends on the decreased power dissipation curve. * Please see "Operating Power" for details. 2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 C through self heat generation under stable temperatures. * Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT). Part Number List of Narrow Tolerance Type (Resistance Tolerance : 2 %, 1 %) 0201(EIA) Part Number ERTJZEG103A ERTJZEP473 ERTJZER683 ERTJZER104 ERTJZET104 ERTJZEV104 : Resistance Tolerance Code Nominal Resistance at 25 C 10 k 47 k 68 k 100 k 100 k 100 k Resistance Tolerance Nominal Resistance at 25 C 10 k 33 k 47 k 68 k 100 k 100 k Resistance Tolerance Nominal Resistance at 25 C 10 k 100 k Resistance Tolerance 1 %(F) or 2 %(G) 1 %(F) or 2 %(G) B Value at 25/50(K) (3380 K) 4050 K1 % 4250 K1 % 4250 K1 % 4500 K1 % 4700 K1 % B Value at 25/85(K) 3435 K1% (4100 K) (4300 K) (4300 K) (4550 K) (4750 K) B Value at 25/50(K) (3380 K) 4050 K1 % 4050 K1 % 4050 K1 % 4330 K1 % 4700 K1 % B Value at 25/85(K) 3435 K1 % (4100 K) (4100 K) (4100 K) (4390 K) (4750 K) B Value at 25/50(K) (3380 K) (4330 K) B Value at 25/85(K) 3435 K1 % 4390 K1 % 0402(EIA) Part Number ERTJ0EG103A ERTJ0EP333 ERTJ0EP473 ERTJ0EP683 ERTJ0ES104 ERTJ0EV104 1 %(F) or 2 %(G) : Resistance Tolerance Code 0603(EIA) Part Number ERTJ1VG103A ERTJ1VS104A : Resistance Tolerance Code Part Number List of Standard Type (Resistance Tolerance : 5 %, 3 %) 0201(EIA) Part Number ERTJZET202 ERTJZET302 ERTJZET472 ERTJZEG103A ERTJZEP473 ERTJZER683 ERTJZER104 ERTJZET104 ERTJZEV104 Nominal Resistance at 25 C 2.0 k 3.0 k 4.7 k 10 k 47 k 68 k 100 k 100 k 100 k Resistance Tolerance 3 %(H) or 5 %(J) B Value at 25/50(K) 4500 K2 % 4500 K2 % 4500 K2 % (3380 K) 4050 K2 % 4250 K2 % 4250 K2 % 4500 K2 % 4700 K2 % B Value at 25/85(K) (4450 K) (4450 K) (4450 K) 3435 K1 % (4100 K) (4300 K) (4300 K) (4550 K) (4750 K) : Resistance Tolerance Code Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 May. 2015 -4- Multilayer NTC Thermistors 0402(EIA) Part Number ERTJ0EA220 Nominal Resistance at 25 C 22 Resistance Tolerance B Value at 25/50(K) 2750 K3 % B Value at 25/85(K) (2700 K) ERTJ0EA330 33 2750 K3 % (2700 K) ERTJ0EA400 40 2750 K3 % (2700 K) ERTJ0EA470 47 2750 K3 % (2700 K) ERTJ0EA680 68 2800 K3 % (2750 K) ERTJ0EA101 100 2800 K3 % (2750 K) ERTJ0EA151 150 2800 K3 % (2750 K) ERTJ0ET102 1.0 k 4500 K2 % (4450 K) ERTJ0ET152 1.5 k 4500 K2 % (4450 K) ERTJ0ET202 2.0 k 4500 K2 % (4450 K) ERTJ0ET222 2.2 k 4500 K2 % (4450 K) ERTJ0ET302 3.0 k 4500 K2 % (4450 K) ERTJ0ER332 3.3 k 4250 K2 % (4300 K) ERTJ0ET332 3.3 k 4500 K2 % (4450 K) ERTJ0ET472 4.7 k 4500 K2 % (4450 K) ERTJ0ER472 4.7 k 4250 K2 % (4300 K) ERTJ0ER682 6.8 k 4250 K2 % (4300 K) ERTJ0EG103A 10 k (3380 K) 3435 K1 % ERTJ0EM103 10 k 3900 K2 % (3970 K) ERTJ0ER103 10 k 4250 K2 % (4300 K) ERTJ0ER153 15 k 4250 K2 % (4300 K) 3 %(H) or 5 %(J) ERTJ0ER223 22 k 4250 K2 % (4300 K) ERTJ0EP333 33 k 4050 K2 % (4100 K) ERTJ0ER333 33 k 4250 K2 % (4300 K) ERTJ0ET333 33 k 4500 K2 % (4580 K) ERTJ0EP473 47 k 4050 K2 % (4100 K) ERTJ0EV473 47 k 4700 K2 % (4750 K) ERTJ0EP683 68 k 4050 K2 % (4100 K) ERTJ0ER683 68 k 4250 K2 % (4300 K) ERTJ0EV683 68 k 4700 K2 % (4750 K) ERTJ0ER104 100 k 4250 K2 % (4300 K) ERTJ0ES104 100 k 4330 K2 % (4390 K) ERTJ0ET104 100 k 4500 K2 % (4580 K) ERTJ0EV104 100 k 4700 K2 % (4750 K) ERTJ0ET154 150 k 4500 K2 % (4580 K) ERTJ0EV154 150 k 4700 K2 % (4750 K) ERTJ0EV224 220 k 4700 K2 % (4750 K) ERTJ0EV334 330 k 4700 K2 % (4750 K) ERTJ0EV474 470 k 4700 K2 % (4750 K) : Resistance Tolerance Code Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 May. 2015 -5- Multilayer NTC Thermistors 0603(EIA) Part Number ERTJ1VA220 Nominal Resistance at 25 C 22 Resistance Tolerance B Value at 25/50(K) 2750 K3 % B Value at 25/85(K) (2700 K) ERTJ1VA330 33 2750 K3 % (2700 K) ERTJ1VA400 40 2800 K3 % (2750 K) ERTJ1VA470 47 2800 K3 % (2750 K) ERTJ1VA680 68 2800 K3 % (2750 K) ERTJ1VA101 100 2800 K3 % (2750 K) ERTJ1VT102 1.0 k 4500 K2 % (4450 K) ERTJ1VT152 1.5 k 4500 K2 % (4450 K) ERTJ1VT202 2.0 k 4500 K2 % (4450 K) ERTJ1VT222 2.2 k 4500 K2 % (4450 K) ERTJ1VT302 3.0 k 4500 K2 % (4450 K) ERTJ1VT332 3.3 k 4500 K2 % (4450 K) ERTJ1VR332 3.3 k 4250 K2 % (4300 K) ERTJ1VR472 4.7 k 4250 K2 % (4300 K) ERTJ1VT472 4.7 k ERTJ1VR682 6.8 k ERTJ1VG103A 3 %(H) or 5 %(J) 4500 K2 % (4450 K) 4250 K2 % (4300 K) 10 k (3380 K) 3435 K1% ERTJ1VR103 10 k 4250 K2 % (4300 K) ERTJ1VR153 15 k 4250 K2 % (4300 K) ERTJ1VR223 22 k 4250 K2 % (4300 K) ERTJ1VR333 33 k 4250 K2 % (4300 K) ERTJ1VP473 47 k 4100 K2 % (4150 K) ERTJ1VR473 47 k 4250 K2 % (4300 K) ERTJ1VV473 47 k 4700 K2 % (4750 K) ERTJ1VR683 68 k 4250 K2 % (4300 K) ERTJ1VV683 68 k 4700 K2 % (4750 K) ERTJ1VS104A 100 k (4330 K) 4390 K1% ERTJ1VV104 100 k 4700 K2 % (4750 K) ERTJ1VV154 150 k 4700 K2 % (4750 K) ERTJ1VT224 220 k 4500 K2 % (4580 K) : Resistance Tolerance Code Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 May. 2015 -6- Multilayer NTC Thermistors Temperature and Resistance value (the resistance value at 25 C is set to 1)/ Reference values ERTJA~ B25/50 2750 K 2800 K B25/85 (2700 K) (2750 K) ERTJG~ ERTJM~ ERTJP~ ERTJR~ ERTJ0ES~ ERTJ1VS~ ERTJT~ ERTJ0ET104 ERTJV~ (3375 K) 3435 K 3900 K 4050 K 4250 K 4330 K (3970 K) (4100 K) (4300 K) (4390 K) (4330 K) 4390 K 4500 K 4500 K 4700 K (4450 K) (4580 K) (4750 K) 1 T(C) 2 -40 13.05 13.28 20.52 32.11 33.10 43.10 45.67 45.53 63.30 47.07 59.76 -35 10.21 10.40 15.48 23.29 24.03 30.45 32.08 31.99 42.92 33.31 41.10 11.79 17.08 17.63 21.76 22.80 22.74 29.50 23.80 28.61 12.65 13.06 15.73 16.39 16.35 20.53 17.16 20.14 11.48 11.91 11.89 14.46 12.49 14.33 -30 8.061 8.214 -25 6.427 6.547 9.069 -20 5.168 5.261 7.037 9.465 9.761 -15 4.191 4.261 5.507 7.147 7.362 8.466 8.743 8.727 -10 3.424 3.476 4.344 5.444 5.599 6.300 6.479 6.469 7.407 6.772 7.482 -5 2.819 2.856 3.453 4.181 4.291 4.730 4.845 4.839 5.388 5.046 5.481 0 2.336 2.362 2.764 3.237 3.312 3.582 3.654 3.650 3.966 3.789 4.050 5 1.948 1.966 2.227 2.524 2.574 2.734 2.778 2.776 2.953 2.864 3.015 10 1.635 1.646 1.806 1.981 2.013 2.102 2.128 2.126 2.221 2.179 2.262 15 1.380 1.386 1.474 1.567 1.584 1.629 1.642 1.641 1.687 1.669 1.710 20 1.171 1.174 1.211 1.247 1.255 1.272 1.277 1.276 1.293 1.287 1.303 25 1 1 1 1 1 1 1 1 1 1 1 30 0.8585 0.8565 0.8309 0.8072 0.8016 0.7921 0.7888 0.7890 0.7799 0.7823 0.7734 35 0.7407 0.7372 0.6941 0.6556 0.6461 0.6315 0.6263 0.6266 0.6131 0.6158 0.6023 40 0.6422 0.6376 0.5828 0.5356 0.5235 0.5067 0.5004 0.5007 0.4856 0.4876 0.4721 45 0.5595 0.5541 0.4916 0.4401 0.4266 0.4090 0.4022 0.4025 0.3874 0.3884 0.3723 50 0.4899 0.4836 0.4165 0.3635 0.3496 0.3319 0.3251 0.3254 0.3111 0.3111 0.2954 55 0.4309 0.4238 0.3543 0.3018 0.2881 0.2709 0.2642 0.2645 0.2513 0.2504 0.2356 60 0.3806 0.3730 0.3027 0.2518 0.2386 0.2222 0.2158 0.2161 0.2042 0.2026 0.1889 65 0.3376 0.3295 0.2595 0.2111 0.1985 0.1832 0.1772 0.1774 0.1670 0.1648 0.1523 70 0.3008 0.2922 0.2233 0.1777 0.1659 0.1518 0.1463 0.1465 0.1377 0.1348 0.1236 75 0.2691 0.2600 0.1929 0.1504 0.1393 0.1264 0.1213 0.1215 0.1144 0.1108 0.1009 80 0.2417 0.2322 0.1672 0.1278 0.1174 0.1057 0.1011 0.1013 0.09560 0.09162 0.08284 85 0.2180 0.2081 0.1451 0.1090 0.09937 0.08873 0.08469 0.08486 0.08033 0.07609 0.06834 90 0.1974 0.1871 0.1261 0.09310 0.08442 0.07468 0.07122 0.07138 0.06782 0.06345 0.05662 10.30 9.159 10.31 95 0.1793 0.1688 0.1097 0.07980 0.07200 0.06307 0.06014 0.06028 0.05753 0.05314 0.04712 100 0.1636 0.1528 0.09563 0.06871 0.06166 0.05353 0.05099 0.05112 0.04903 0.04472 0.03939 105 0.1498 0.1387 0.08357 0.05947 0.05306 0.04568 0.04340 0.04351 0.04198 0.03784 0.03308 110 0.1377 0.1263 0.07317 0.05170 0.04587 0.03918 0.03708 0.03718 0.03609 0.03218 0.02791 115 0.1270 0.1153 0.06421 0.04512 0.03979 0.03374 0.03179 0.03188 0.03117 0.02748 0.02364 120 0.1175 0.1056 0.05650 0.03951 0.03460 0.02916 0.02734 0.02742 0.02702 0.02352 0.02009 125 0.1091 0.09695 0.04986 0.03470 0.03013 0.02527 0.02359 0.02367 0.02351 0.02017 0.01712 1 Applied to the product except for ERTJ0ET104 in B25/50=4500 K. 2 Applied only to ERTJ0ET104. B25/50= kn (R25/R50) 1/298.15-1/323.15 B25/85= kn (R25/R85) 1/298.15-1/358.15 R25=Resistance at 25.00.1 C R50=Resistance at 50.00.1 C R85=Resistance at 85.00.1 C Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 May. 2015 -7- Multilayer NTC Thermistors Specification and Test Method Item Specification Rated Zero-power Within the specified tolerance. Resistance (R25) Test Method The value is measured at a power that the influence of self-heat generation can be negligible (0.1mW or less), at the rated ambient temperature of 25.00.1C. B Value The Zero-power resistances; R1 and R2, shall be measured respectively at T1 (deg.C) and T2 (deg.C). The B value is calculated by the following equation. Shown in each Individual Specification. Individual Specification shall specify B25/50 or B25/85. BT1/T2= T1 25.0 0.1 C 25.0 0.1 C B25/50 B25/85 Adhesion kn (R1)-kn (R2) 1/(T1+273.15)-1/(T2+273.15) T2 50.0 0.1 C 85.0 0.1 C The terminal electrode shall be free from peeling Applied force : or signs of peeling. Size 0201 :2N Size 0402, 0603 : 5 N Duration : 10 s Size : 0201, 0402 1.0 0.3/Size:0201 0.5/Size:0402 0.5R Test Sample Board 1.0 Size : 0603 Test Sample Bending distance : 1 mm Bending speed : 1 mm/s 20 Bending distance Bending Strength There shall be no cracks and other mechanical damage. R25 change : within 5 % Unit : mm R340 452 452 Unit : mm Resistance to Soldering Heat Solderability There shall be no cracks and other mechanical damage. Nallow Tol. type Standard type R25 change : within 2 % within 3 % B Value change : within 1 % within 2 % Soldering bath method Solder temperature : 270 5 C Dipping period : 4.0 1 s Preheat condition : More than 95 % of the soldered area of both terminal electrodes shall be covered with fresh solder. Soldering bath method Solder temperature : 230 5 C Dipping period : 4 1 s Solder : Sn-3.0Ag-0.5Cu Step 1 2 Temp (C) 80 to 100 150 to 200 Period (s) 120 to 180 120 to 180 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 May. 2015 -8- Multilayer NTC Thermistors Specification and Test Method Item Temperature Cycling Specification Test Method Nallow Tol. type Standard type Conditions of one cycle : within 2 % within 3 % Step 1 : -40 C, 303 min R25 change B Value change : within 1 % within 2 % Step 2 : Room temp., 3 min max. Step 3 : 125 C, 303 min. Step 4 : Room temp., 3 min max. Number of cycles: 100 cycles Humidity R25 change : B Value change : Biased Humidity Low Temperature Exposure Nallow Tol. type Standard type Temperature : 85 2 C within 2 % within 3 % Relative humidity : 85 5 % within 1 % within 2 % Test period : 1000 +48/0 h R25 change : B Value change : Nallow Tol. type Standard type Temperature : 85 2 C within 2 % within 3 % Relative humidity : 85 5 % within 1 % within 2 % Applied power : 10 mW(D.C.) Test period : 500 +48/0 h R25 change : B Value change : Nallow Tol. type Standard type Specimens are soldered on the testing board within 2 % within 3 % shown in Fig.2. within 1 % within 2 % Temperature : -40 3 C Test period : 1000 +48/0 h High Temperature Nallow Tol. type Standard type Specimens are soldered on the testing board Exposure R25 change : within 2 % within 3 % shown in Fig.2. B Value change : within 1 % within 2 % Temperature : 125 3 C Test period : 1000 +48/0 h Typical Application Temperature Detection Writing current control of HDD Vcc GMR Head R R L Rth NTC AD converter CPU Temperature Interface Temperature Compensation (Pseudo-linearization) Contrast level control of LCD Compensation (RF circuit) Temperature compensation of TCXO Vcc PMIC ADC R Rth NTC R LCD NTC R Rth Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 May. 2015 -9- Multilayer NTC Thermistors Dimensions in mm (not to scale) L (Unit : mm) W Size Code (EIA) L W T L1, L2 Z(0201) 0.600.03 0.300.03 0.300.03 0.150.05 0(0402) 1.00.1 0.500.05 0.500.05 0.250.15 1(0603) 1.600.15 0.80.1 0.80.1 0.30.2 T L2 L1 Packaging Methods Size Code Thickness (mm) Z(0201) 0(0402) 1(0603) Pitch Reel Packing Quantities 0.3 0.5 0.8 Kind of Taping Pressed Carrier Taping 2 2 4 Punched Carrier Taping W1 E 15,000 10,000 4,000 C D 2 mm (Pressed Carrier Taping) : Size 0201 Feeding hole fD0 W2 Chip pocket A E t Dim. B (mm) K0 Chip component A B W P 1 P2 F E P2 P0 fD 0 t 0.03 0.03 0.2 0.05 0.10 0.05 0.05 0.1 Pitch Feeding hole fD0 C D E 13.00.5 21.00.8 2.00.5 W1 9.0 W2 +1.0 0 11.41.0 Part and Taped End Leader part 0 max. 0.03 Top cover tape 2 mm (Punched Carrier Taping) : Size 0402 100 min. Vacant position 400 min. Chip pocket E t1 60.0 +1.0 0 Leader K0 Dim. 0.36 0.66 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.55 0.36 (mm) 180 0 -3 Tape running direction P0 P1 fB fA Symbol F W A Symbol for Taping Pitch Quantity (mm) (pcs./reel) B Standard Taped end B F W A t2 Chip component A Symbol B W P1 P2 F E P0 P1 P2 P0 fD 0 t1 Dim. 0.62 1.12 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.7 0.05 0.05 0.2 0.05 0.10 0.05 0.05 0.1 Pitch 0 t2 1.0 max. max. Minimum Quantity / Packing Unit Part Number Minimum Quantity Packing Quantity Carton / Packing Unit in Carton LxWxH (mm) (Size) 4 mm (Punched Carrier Taping) : Size 0603 Feeding hole fD0 ERTJZ (0201) 15,000 300,000 250x200x200 ERTJ0 (0402) 10,000 200,000 250x200x200 4,000 80,000 250x200x200 Tape running direction ERTJ1 (0603) Chip pocket E t1 B A t2 Symbol A Dim. 1.0 (mm) P1 Chip component 0.1 B W F E P2 P1 P0 P2 P0 fD 0 t1 1.8 8.0 3.50 1.75 4.0 2.00 4.0 1.5+0.1 1.1 0.1 (Unit : mm) F W (mm) 160 min. Vacant position Tape running direction 0.2 0.05 0.10 0.1 0.05 0.1 0 Part No., quantity and country of origin are designated on outer packages in English. t2 1.4 max. max. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 May. 2015 - 10 - Multilayer NTC Thermistors Multilayer NTC Thermistors Series: ERTJ Handling Precautions Safety Precautions Multilayer NTC Thermistors (hereafter referred to as "Thermistors") should be used for general purpose applications found in consumer electronics (audio/visual, home, office, information & communication) equipment. When subjected to severe electrical, environmental, and/or mechanical stress beyond the specifications, as noted in the Ratings and Specified Conditions section, the Thermistors' performance may be degraded, or become failure mode, such as short circuit mode and open-circuit mode. If you use under the condition of short-circuit, heat generation of thermistors will occur by running large current due to application of voltage. There are possibilities of smoke emission, substrate burn-out, and, in the worst case, fire. For products which require higher safety levels, please carefully consider how a single malfunction can affect your product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe, such as setting up protecting circuits, etc. For the following applications and conditions, please contact us for product of special specification not found in this document. * When your application may have difficulty complying with the safety or handling precautions specified below. * High-quality and high-reliability required devices that have possibility of causing hazardous conditions, such as death or injury (regardless of directly or indirectly), due to failure or malfunction of the product. 1 Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.) 2 Submarine Equipment (submarine repeating equipment, etc.) 3 Transportation Equipment (motor vehicles, airplanes, trains, ship, traffic signal controllers, etc.) 4 Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system, etc.) 5 Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.) 6 Information Processing Equipment (large scale computer systems, etc.) 7 Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.) 8 Rotary Motion Equipment 9 Security Systems J And any similar types of equipment Operating Conditions and Circuit Design [Maximum power dissipation] 1. Circuit Design * The Maximum power that can be continuously applied under static air at a certain ambient temperature. The Maximum power dissipation under an ambient temperature of 25 C or less is the same with the rated maximum power dissipation, and Maximum power dissipation beyond 25 C depends on the Decreased power dissipation curve below. 1.1 Operating Temperature and Storage Temperature When operating a components-mounted circuit, please be sure to observe the "Operating Temperature Range", written in delivery specifications. Please remember not to use the product under the condition that exceeds the specified maximum temperature. Storage temperature of PCB after mounting Thermistors, which is not operated, should be within the specified "Storage Temperature Range" in the delivery specifications. Maximum power dissipation / Rated maximum power dissipation (%) Decreased power dissipation curve 1.2 Operating Power The electricity applied to between terminals of Thermistors should be under the specified maximum power dissipation. There are possibilities of breakage and burn-out due to excessive self-heating of Thermistors, if the power exceeds maximum power dissipation when operating. Please consider installing protection circuit for your circuit to improve the safety, in case of abnormal voltage application and so on. Thermistors' performance of temperature detection would be deteriorated if self-heating occurs, even when you use it under the maximum power dissipation. Please consider the maximum power dissipation and dissipation factor. 100 50 25 75 125 Ambient temperature (C) [Dissipation factor] * The constant amount power required to raise the temperature of the Thermistor 1 C through self heat generation under stable temperatures. Dissipation factor (mW/C) = Power consumption of Thermistor / Temperature rise of element Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 May. 2015 - 11 - Multilayer NTC Thermistors 1.3 Environmental Restrictions (2) The land size shall be designed to have equal space, on both right and left sides. If the amount of solder on both sides is not equal, the component may be cracked by stress, since the side with a larger amount of solder solidifies later during cooling. The Thermistors shall not be operated and/or stored under the following conditions. (1) Environmental conditions (a) Under direct exposure to water or salt water (b) Under conditions where water can condense and/or dew can form (c) Under conditions containing corrosive gases such as hydrogen sulfide, sulfurous acid, chlorine and ammonia (2) Mechanical conditions The place where vibration or impact that exceeds specified conditions written in delivery specification is loaded. Recommended Amount of Solder (a) Excessive amount (1) Solder resist shall be utilized to equalize the amounts of solder on both sides. (2) Solder resist shall be used to divide the pattern for the following cases; * Components are arranged closely. * The Thermistor is mounted near a component with lead wires. * The Thermistor is placed near a chassis. Refer to the table below. The resistance of the Thermistors varies depending on ambient temperatures and self-heating. To measure the resistance value when examining circuit configuration and conducting receiving inspection and so on, the following points should be taken into consideration: 1 Measurement temp : 250.1 C Measurement in liquid (silicon oil, etc.) is recommended for a stable measurement temperature. 2 Power : 0.10 mW max. 4 terminal measurement with a constant-current power supply is recommended. Prohibited Applications and Recommended Applications Item 2. Design of Printed Circuit Board 2.1 Selection of Printed Circuit Boards Mixed mounting with a component with lead wires There is a possibility of performance deterioration by heat shock (temperature cycles), which causes cracks, from alumina substrate. Please confirm that the substrate you use does not deteriorate the Thermistors' quality. Arrangement near chassis 2.2 Design of Land Pattern Retro-fitting of component with lead wires Recommended Land Dimensions Lateral arrangement SMD c Solder resist Z(0201) 0(0402) 1(0603) a b Chassis Solder (Ground solder) Solder resist Solder resist A lead wire of Soldering Retro-fitted component iron Portion to be excessively soldered Land Solder resist Solder resist To prevent the crack of Thermistors, try to place it on the position that could not easily be affected by the bending stress of substrate while mounting procedures or procedures afterwards. Placement of the Thermistors near heating elements also requires the great care to be taken in order to avoid stresses from rapid heating and cooling. Unit (mm) Size Code (EIA) The lead wire of a component with lead wires Improved applications by pattern division 2.4 Component Layout a Component dimensions L W T 0.6 0.3 0.3 1.0 0.5 0.5 1.6 0.8 0.8 Prohibited applications Electrode pattern (1) Recommended land dimensions are shown below. Use the proper amount of solder in order to prevent cracking. Using too much solder places excessive stress on the Thermistors. b (c) Insufficient amount 2.3 Utilization of Solder Resist 1.4 Measurement of Resistance Land (b) Proper amount c 0.2 to 0.3 0.25 to 0.30 0.2 to 0.3 0.4 to 0.5 0.4 to 0.5 0.4 to 0.5 0.8 to 1.0 0.6 to 0.8 0.6 to 0.8 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 May. 2015 - 12 - Multilayer NTC Thermistors 2. Chip Mounting Consideration (1) To minimize mechanical stress caused by the warp or bending of a PC board, please follow the recommended Thermistors' layout below. Prohibited layout (1) When mounting the Thermistors/components on a PC board, the Thermistor bodies shall be free from excessive impact loads such as mechanical impact or stress due to the positioning, pushing force and displacement of vacuum nozzles during mounting. (2) Maintenance and inspection of the Chip Mounter must be performed regularly. (3) If the bottom dead center of the vacuum nozzle is too low, the Thermistor will crack from excessive force during mounting. The following precautions and recommendations are for your reference in use. (a) Set and adjust the bottom dead center of the vacuum nozzles to the upper surface of the PC board after correcting the warp of the PC board. (b) Set the pushing force of the vacuum nozzle during mounting to 1 to 3 N in static load. (c) For double surface mounting, apply a supporting pin on the rear surface of the PC board to suppress the bending of the PC board in order to minimize the impact of the vacuum nozzles. Typical examples are shown in the table below. Recommended layout Layout the Thermistors sideways against the stressing direction (2) The following layout is for your reference since mechanical stress near the dividing/breaking position of a PC board varies depending on the mounting position of the Thermistors. E D Perforation C A B Slit Magnitude of stress A>B=C>D>E (3) The magnitude of mechanical stress applied to the Thermistors when dividing the circuit board in descending order is as follows: push back < slit < V-groove < perforation. Also take into account the layout of the Thermistors and the dividing/breaking method. (4) When the Thermistors are placed near heating elements such as heater, etc., cracks from thermal stresses may occur under following situation: * Soldering the Thermistors directly to heating elements. * Sharing the land with heating elements. If planning to conduct above-mentioned mounting and/or placement, please contact us in advance. Item Single surface mouting Prohibited mounting Crack Recommended mounting The supporting pin does not necessarily have to be positioned beneath the Thermistor. Supporting pin Double surface mounting Separation of Solder Crack Supporting pin (d) Adjust the vacuum nozzles so that their bottom dead center during mounting is not too low. (4) The closing dimensions of the positioning chucks shall be controlled. Maintenance and replacement of positioning chucks shall be performed regularly to prevent chipping or cracking of the Thermistors caused by mechanical impact during positioning due to worn positioning chucks. (5) Maximum stroke of the nozzle shall be adjusted so that the maximum bending of PC board does not exceed 0.5 mm at 90 mm span. The PC board shall be supported by an adequate number of supporting pins. 2.5 Mounting Density and Spaces Intervals between components should not be too narrow to prevent the influence from solder bridges and solder balls. The space between components should be carefully determined. Precautions for Assembly 1. Storage (1) The Thermistors shall be stored between 5 to 40 C and 20 to 70 % RH, not under severe conditions of high temperature and humidity. (2) If stored in a place where humidity, dust, or corrosive gasses (hydrogen sulfide, sulfurous acid, hydrogen chloride and ammonia, etc.) are contained, the solderability of terminal electrodes will be deteriorated. In addition, storage in a places where the heat or direct sunlight exposure occur will cause mounting problems due to deformation of tapes and reels and components and taping/reels sticking together. (3) Do not store components longer than 6 months. Check the solderability of products that have been stored for more than 6 months before use 3. Selection of Soldering Flux Soldering flux may seriously affect the performance of the Thermistors. The following shall be confirmed before use. (1) The soldering flux should have a halogen based content of 0.1 wt% (converted to chlorine) or below. Do not use soldering flux with strong acid. (2) When applying water-soluble soldering flux, wash the Thermistors sufficiently because the soldering flux residue on the surface of PC boards may deteriorate the insulation resistance on the Thermistors' surface. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 May. 2015 - 13 - Multilayer NTC Thermistors 4. Soldering (b) Preheating: Conduct sufficient pre-heating, and make sure that the temperature difference between solder and Thermistors' surface is 150 C or less. (c) Temperature of Iron tip: 300 C max. (The required amount of solder shall be melted in advance on the soldering tip.) (d) Gradual cooling: After soldering, the Thermistors shall be cooled gradually at room temperature. 4.1 Reflow Soldering The reflow soldering temperature conditions are composed of temperature curves of Preheating, Temp. rise, Heating, Peak and Gradual cooling. Large temperature difference inside the Thermistors caused by rapid heat application to the Thermistors may lead to excessive thermal stresses, contributing to the thermal cracks. The Preheating temperature requires controlling with great care so that tombstone phenomenon may be prevented. Temperature 140 to 180 C Preheating temp 2Temp. rise to Peak temp. 220 C min. 3Heating 260 C max. 4Peak Peak temp. 5Gradual cooling to 140 C Recommended profile of Hand soldering (EX) Period or Speed 60 to 120 sec Item 1Preheating 2 to 5 C /sec T Gradual cooling 60 sec max. 10 sec max. Preheating 1 to 4 C /sec 60 to 120 sec Recommended profile of Reflow soldering (EX) T Temperature (C) T : Allowable temperature difference T < 150 C 4 Peak 260 220 2 Temp. rise (2) Condition 2 (without preheating) Hand soldering can be performed without preheating, by following the conditions below: (a) Soldering iron tip shall never directly touch the ceramic and terminal electrodes of the Thermistors. (b) The lands are sufficiently preheated with a soldering iron tip before sliding the soldering iron tip to the terminal electrodes of the Thermistors for soldering. 5 Gradual cooling 180 140 1 Preheating 3 Heating Time 60 to 120 sec 3 sec max. 60 sec max. T : Allowable temperature difference T < 150 C Conditions of Hand soldering without preheating The rapid cooling (forced cooling) during Gradual cooling part should be avoided, because this may cause defects such as the thermal cracks, etc. When the Thermistors are immersed into a cleaning solvent, make sure that the surface temperatures of the devices do not exceed 100 C. Per for ming reflow soldering twice under the conditions shown in the figure above [Recommended profile of Reflow soldering (EX)] will not cause any problems. However, pay attention to the possible warp and bending of the PC board. Item Temperature of Iron tip Wattage Shape of Iron tip Soldering time with a soldering iron Condition 270 C max. 20 W max. f3 mm max. 3 sec max. 5. Post Soldering Cleaning 5.1 Cleaning solvent Soldering flux residue may remain on the PC board if cleaned with an inappropriate solvent. This may deteriorate the electrical characteristics and reliability of the Thermistors. 4.2 Hand Soldering Hand soldering typically causes significant temperature change, which may induce excessive thermal stresses inside the Thermitors, resulting in the thermal cracks, etc. In order to prevent any defects, the following should be observed. * The temperature of the soldering tips should be controlled with special care. * The direct contact of soldering tips with the Thermistors and/or terminal electrodes should be avoided. * Dismounted Thermistors shall not be reused. (1) Condition 1 (with preheating) (a) Soldering: Use thread solder (f1 mm or below) which contains flux with low chlorine, developed for precision electronic equipment. 5.2 Cleaning conditions Inappropriate cleaning conditions such as insufficient cleaning or excessive cleaning may impair the electrical characteristics and reliability of the Thermistors. (1) Insufficient cleaning can lead to: (a) The halogen substance found in the residue of the soldering flux may cause the metal of terminal electrodes to corrode. (b) The halogen substance found in the residue of the soldering flux on the surface of the Thermistors may change resistance values. (c) Water-soluble soldering flux may have more remarkable tendencies of (a) and (b) above compared to those of rosin soldering flux. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 May. 2015 - 14 - Multilayer NTC Thermistors (2) Dividing/Breaking of the PC boards shall be done carefully at moderate speed by using a jig or apparatus to protect the Thermistors on the boards from mechanical damage. (3) Examples of PCB dividing/breaking jigs: The outline of PC board breaking jig is shown below. When PC boards are broken or divided, loading points should be close to the jig to minimize the extent of the bending Also, planes with no parts mounted on should be used as plane of loading, in order to prevent tensile stress induced by the bending, which may cause cracks of the Thermistors or other parts mounted on the PC boards. (2) Excessive cleaning can lead to: (a) When using ultrasonic cleaner, make sure that the output is not too large, so that the substrate will not resonate. The resonation causes the cracks in Varistors and/or solders, and deteriorates the strength of the terminal electrodes. Please follow these conditions for Ultrasonic cleaning: Ultrasonic wave output : 20 W/L max. Ultrasonic wave frequency : 40 kHz max. Ultrasonic wave cleaning time : 5 min. max. 5.3 Contamination of Cleaning solvent Cleaning with contaminated cleaning solvent may cause the same results as insufficient cleaning due to the high density of liberated halogen. Outline of Jig 6. Inspection Process The pressure from measuring terminal pins might bend the PCB when implementing circuit inspection after mounting Thermistors on PCB, and as a result, cracking may occur. (1) Mounted PC boards shall be supported by an adequate number of supporting pins on the back with bend settings of 90 mm span 0.5 mm max. (2) Confirm that the measuring pins have the right tip shape, are equal in height, have the right pressure, and are set in the correct positions. The following figures are for your reference to avoid bending the PC board. Item Prohibited setting PC board PC board splitting jig Prohibited dividing Recommended dividing Loading direction Loading point PC board Recommended setting PC board Chip component Loading direction V-groove Chip component Loading point V-groove Check pin Check pin 9. Mechanical Impact Bending of PC board Separated, Crack V-groove (1) The Thermistors shall be free from any excessive mechanical impact. The Thermistor body is made of ceramics and may be damaged or cracked if dropped. N eve r use a T h ermisto r w hich has be en dropped; their quality may be impaired and failure rate increased. (2) When handling PC boards with Thermistors mounted on them, do not allow the Thermistors to collide with another PC board. When mounted PC boards are handled or stored in a stacked state, the corner of a PC board might strike Thermistors, and the impact of the strike may cause damage or cracking and can deteriorate the withstand voltage and insulation resistance of the Thermistor. Supporting pin 7. Protective Coating When the surface of a PC board on which the Thermistors have been mounted is coated with resin to protect against moisture and dust, it shall be confirmed that the protective coating does not affect the performance of Varistors. (1) Choose the material that does not emit the decomposition and/or reaction gas. The Gas may affect the composing members of the Varistors. (2) Shrinkage and expansion of resin coating when curing may apply stress to the Varistors and may lead to occurrence of cracks. 8. Dividing/Breaking of PC Boards Mounted PCB (1) Please be careful not to stress the substrate with bending/twisting when dividing, after mounting components including Varistors. Abnormal and excessive mechanical stress such as bending or torsion shown below can cause cracking in the Thermistors. Bending Crack Crack Floor Other Torsion The various precautions described above are typical. For special mounting conditions, please contact us. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 May. 2015 - 15 - NTC Thermistors for automotive devices (chip type) Multilayer NTC Thermistors ERTJ Series: Features Surface Mount Device (0402, 0603) Highly reliable multilayer / monolithic structure Wide temperature operating range (-40 to 150 Environmentally-friendly lead-free RoHS compliant C) Recommended Applications For For For For For For car audio system ECUs electric pumps and compressors LED lights batteries temperature detection of various circuits Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E R T J 0 E G 1 0 3 F M Common Code Product Code Type Code ERT NTC J Chip Type (SMD) Thermistors Multilayer Type Size Code 0 "0402" 1 "0603" Packaging Style Code E V "0402" Pressed Carrier Taping Punched Carrier Taping (Pitch : 2 mm) "0603" Punched Carrier Taping (Pitch : 4 mm) B Value Class Code 2701 to 2800 A 3301 to 3400 G 3801 to 3900 M 4001 to 4100 P 4201 to 4300 R 4301 to 4400 S 4401 to 4500 T 4601 to 4700 V Nominal Resistance R25 () The first two digits are significant figures of resistance and the third one denotes the number of zeros following them. (Example) Resistance Tolerance Code G 1% Narrow Tolerance 2% Type H J 3% Standard 5% Type F M Automotive component Construction 3 4 5 1 No. Name A Semiconductive Ceramics B Internal electrode C 2 D E Terminal electrode Substrate electrode Intermediate electrode External electrode Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 - 16 - Jun. 2015 NTC Thermistors for automotive devices (chip type) Ratings Size code (EIA) Operating Temperature Range Rated Maximum Power Dissipation1 Dissipation Factor2 0(0402) 1(0603) -40 to 150 C 66 mW Approximately 2 mW/C 100 mW Approximately 3 mW/C 1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature. * The maximum value of power, and rated power is same under the condition of ambient temperature 25 C or less. If the temperature exceeds 25 C, rated power depends on the decreased power dissipation curve. * Please see "Operating Power" for details. 2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 C through self heat generation under stable temperatures. * Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT). Part Number List 0402(EIA) Part Number ERTJ0EG103M ERTJ0EP473M ERTJ0ER104M ERTJ0EV104M 0603(EIA) Nominal Resistance at 25 C 10 k 47 k 100 k 100 k B Value B Value at 25/50(K) at 25/85(K) 3380 K1 % 3435 K1 % 4050 K1 % (4100 K) 4250 K1 % (4300 K) 4700 K1 % (4750 K) Nominal Resistance at 25 C ERTJ1VG103M 10 k ERTJ1VP473M 47 k ERTJ1VV104M 100 k Part Number B Value B Value at 25/50(K) at 25/85(K) 3380 K1 % 3435 K1 % 4100 K1 % (4150 K) 4700 K1 % (4750 K) : Resistance Tolerance Code (F : 1%, G : 2%, H : 3%, J : 5%) : Resistance Tolerance Code (F : 1%, G : 2%, H : 3%, J : 5%) Temperature B25/50 B25/85 T(C) -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 125 B25/50= and Resistance value (the resistance value at 25 C is set to 1)/ Reference values ERTJG~ (3380 K) 3435 K ERTJP~ 4050 K (4100 K) ERTJP~ 4100 K (4150 K) ERTJR~ 4250 K (4300 K) ERTJV~ 4700 K (4750 K) 20.52 15.48 11.79 9.069 7.037 5.507 4.344 3.453 2.764 2.227 1.806 1.474 1.211 1 0.8309 0.6941 0.5828 0.4916 0.4165 0.3543 0.3027 0.2595 0.2233 0.1929 0.1672 0.1451 0.1261 0.1097 0.09563 0.08357 0.07317 0.06421 0.05650 0.04986 33.10 24.03 17.63 13.06 9.761 7.362 5.599 4.291 3.312 2.574 2.013 1.584 1.255 1 0.8016 0.6461 0.5235 0.4266 0.3496 0.2881 0.2386 0.1985 0.1659 0.1393 0.1174 0.09937 0.08442 0.07200 0.06166 0.05306 0.04587 0.03979 0.03460 0.03013 34.56 24.99 18.26 13.48 10.04 7.546 5.720 4.369 3.362 2.604 2.030 1.593 1.258 1 0.7994 0.6426 0.5194 0.4222 0.3451 0.2837 0.2344 0.1946 0.1623 0.1359 0.1143 0.09658 0.08189 0.06969 0.05957 0.05117 0.04415 0.03823 0.03319 0.02886 42.40 29.96 21.42 15.50 11.33 8.370 6.244 4.699 3.565 2.725 2.098 1.627 1.271 1 0.7923 0.6318 0.5069 0.4090 0.3320 0.2709 0.2222 0.1831 0.1516 0.1261 0.1054 0.08843 0.07457 0.06316 0.05371 0.04585 0.03929 0.03378 0.02913 0.02519 59.76 41.10 28.61 20.14 14.33 10.31 7.482 5.481 4.050 3.015 2.262 1.710 1.303 1 0.7734 0.6023 0.4721 0.3723 0.2954 0.2356 0.1889 0.1523 0.1236 0.1009 0.08284 0.06834 0.05662 0.04712 0.03939 0.03308 0.02791 0.02364 0.02009 0.01712 kn (R25/R50) 1/298.15-1/323.15 B25/85= kn (R25/R85) 1/298.15-1/358.15 R25=Resistance at 25.00.1 C R50=Resistance at 50.00.1 C R85=Resistance at 85.00.1 C Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 - 17 - Jun. 2015 NTC Thermistors for automotive devices (chip type) Specification and Test Method Item Specification Rated Zero-power Within the specified tolerance. Resistance (R25) Test Method The value is measured at a power that the influence of self-heat generation can be negligible (0.1mW or less), at the rated ambient temperature of 25.00.1C. B Value The Zero-power resistances; R1 and R2, shall be measured respectively at T1 (deg.C) and T2 (deg.C). The B value is calculated by the following equation. Shown in each Individual Specification. Individual Specification shall specify B25/50 or B25/85. BT1/T2= T1 25.0 0.1 C 25.0 0.1 C B25/50 B25/85 Adhesion kn (R1)-kn (R2) 1/(T1+273.15)-1/(T2+273.15) T2 50.0 0.1 C 85.0 0.1 C The terminal electrode shall be free from peeling Applied force : or signs of peeling. Size 0402, 0603 : 5 N Duration : 10 s Size : 0402 1.0 0.5 0.5R Test Sample Board 1.0 Size : 0603 Test Sample Bending distance : 2 mm Bending speed : 1 mm/s 20 R340 452 Bending distance Bending Strength There shall be no cracks and other mechanical damage. R25 change : within 5 % Unit : mm 452 Unit : mm Resistance to Vibration There shall be no cracks and other mechanical damage. R25 change : B Value change : Resistance to Impact within 2 % within 1 % There shall be no cracks and other mechanical damage. R25 change : B Value change : within 2 % within 1 % Solder samples on a testing substrate, then apply vibration to them. Acceleration :5G Vibrational frequency : 10 to 2000 Hz Sweep time : 20 minutes 12 cycles in three directions, which are perpendicular to each other Solder samples on a testing substrate, then apply impacts to them. Pulse waveform : Semisinusoidal wave, 11 ms Impact acceleration : 50 G Impact direction : X-X', Y-Y', Z-Z' In 6 directions, three times each Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 - 18 - Jun. 2015 NTC Thermistors for automotive devices (chip type) Specification and Test Method Item Resistance to Soldering Heat Specification There shall be no cracks and other mechanical damage. R25 change : B Value change : within 2 % within 1 % Test Method Soldering bath method Solder temperature : 260 5 C, 270 5 C Dipping period : 3.0 0.5 s, 10.0 0.5 s Preheat condition : Step 1 2 Temp (C) 80 to 100 150 to 200 Period (s) 120 to 180 120 to 180 Solderability More than 95 % of the soldered area of both terminal electrodes shall be covered with fresh solder. Soldering bath method Solder temperature : 230 5 C Dipping period : 4 1 s Solder : Sn-3.0Ag-0.5Cu Temperature Cycling R25 change : B Value change : within 2 % within 1 % Conditions of one cycle Step 1 : -553 C, 303 min. Step 2 : Room temp., 3 min. max. Step 3 : 1255 C, 303 min. Step 4 : Room temp., 3 min. max. Number of cycles: 2000 cycles Humidity R25 change : B Value change : within 2 % within 1 % Temperature : 85 2 C Relative humidity : 85 5 % Test period : 2000 +48/0 h Biased Humidity R25 change : B Value change : within 2 % within 1 % Temperature : 85 2 C Relative humidity : 85 5 % Applied power : 10 mW(D.C.) Test period : 2000 +48/0 h Low Temperature Exposure R25 change : B Value change : within 2 % within 1 % Temperature Test period : -40 3 C : 2000 +48/0 h High Temperature R25 change : Exposure 1 B Value change : within 2 % within 1 % Temperature Test period : 125 3 C : 2000 +48/0 h High Temperature R25 change : Exposure 2 B Value change : within 3 % within 2 % Temperature Test period : 150 3 C : 1000 +48/0 h Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 - 19 - Jun. 2015 NTC Thermistors for automotive devices (chip type) Dimensions in mm (not to scale) L W (Unit : mm) Size Code (EIA) L W T L1, L2 0 (0402) 1.00.1 0.500.05 0.500.05 0.250.15 1 (0603) 1.600.15 0.80.1 0.80.1 0.30.2 T L2 L1 Packaging Methods Size Code Reel Packing Quantities Thickness (mm) 0 (0402) 0.5 1 (0603) 0.8 for Taping Pitch Quantity (mm) (pcs./reel) Kind of Taping Punched Carrier Taping 2 10,000 4 4,000 W1 E C B Standard D Pitch W2 2 mm (Punched Carrier Taping) : Size 0402 A Feeding hole fD0 t1 Chip pocket E Symbol (mm) fB fA 180 0 -3 60.0 +1.0 0 C D E 13.00.5 21.00.8 2.00.5 W1 9.0 +1.0 0 W2 11.41.0 B F W A Dim. t2 Chip component A Symbol B W P1 P2 F E P0 P1 P2 P0 fD 0 t1 Dim. 0.62 1.12 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.7 (mm) 0.05 0.05 0.2 0.05 0.10 0.05 0.05 0.1 Pitch Leader Tape running direction 0 Part and Taped End Leader part t2 Top cover tape 1.0 max. max. 100 min. Vacant position 400 min. 4 mm (Punched Carrier Taping) : Size 0603 Feeding hole fD0 Chip pocket Taped end E t1 B F W A t2 Symbol 160 min. Vacant position (Unit : mm) ERTJ0 (0402) Minimum Quantity/ Packing Unit 10,000 Packing Quantity in Carton 200,000 Carton LxWxH (mm) 250x200x200 ERTJ1 (0603) 4,000 80,000 250x200x200 A Dim. 1.0 (mm) P1 Chip component 0.1 B 1.8 0.1 W F E P2 Tape running direction P0 P1 P2 P0 fD 0 t1 t2 8.0 3.50 1.75 4.0 2.00 4.0 1.5+0.1 1.1 1.4 0.2 0.05 0.10 0.1 0.05 0.1 0 max. max. Minimum Quantity / Packing Unit Part Number (Size) Part No., quantity and country of origin are designated on outer packages in English. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 - 20 - Jun. 2015 NTC Thermistors for automotive devices (chip type) Multilayer NTC Thermistors Series: ERTJ Handling Precautions Safety Precautions The NTC Thermistors for automotive devices (chip type), hereafter referred to as Thermisotrs, is designed for use in automotive devices. When subjected to severe electrical, environmental, and/or mechanical stress beyond the specifications, as noted in the Ratings and Specified Conditions section, the Thermistors' performance may be degraded, or become failure mode, such as short circuit mode and open-circuit mode. If you use under the condition of short-circuit, heat generation of thermistors will occur by running large current due to application of voltage. There are possibilities of smoke emission, substrate burn-out, and, in the worst case, fire. For products which require higher safety levels, please carefully consider how a single malfunction can affect your product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe, such as setting up protecting circuits, etc. For the following applications and conditions, please contact us for product of special specification not found in this document. * When your application may have difficulty complying with the safety or handling precautions specified below. * High-quality and high-reliability required devices that have possibility of causing hazardous conditions, such as death or injury (regardless of directly or indirectly), due to failure or malfunction of the product. 1 Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.) 2 Submarine Equipment (submarine repeating equipment, etc.) 3 Transportation Equipment (airplanes, trains, ship, traffic signal controllers, etc.) 4 Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system, etc.) 5 Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.) 6 Information Processing Equipment (large scale computer systems, etc.) 7 Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.) 8 Rotary Motion Equipment 9 Security Systems J And any similar types of equipment Operating Conditions and Circuit Design [Maximum power dissipation] 1. Circuit Design * The Maximum power that can be continuously applied under static air at a certain ambient temperature. The Maximum power dissipation under an ambient temperature of 25 C or less is the same with the rated maximum power dissipation, and Maximum power dissipation beyond 25 C depends on the Decreased power dissipation curve below. 1.1 Operating Temperature and Storage Temperature When operating a components-mounted circuit, please be sure to observe the "Operating Temperature Range", written in delivery specifications. Please remember not to use the product under the condition that exceeds the specified maximum temperature. Storage temperature of PCB after mounting Thermistors, which is not operated, should be within the specified "Storage Temperature Range" in the delivery specifications. Maximum power dissipation/ Rated maximum power dissipation (%) Decreased power dissipation curve 120 100 1.2 Operating Power The electricity applied to between terminals of Thermistors should be under the specified maximum power dissipation. There are possibilities of breakage and burn-out due to excessive self-heating of Thermistors, if the power exceeds maximum power dissipation when operating. Please consider installing protection circuit for your circuit to improve the safety, in case of abnormal voltage application and so on. Thermistors' performance of temperature detection would be deteriorated if self-heating occurs, even when you use it under the maximum power dissipation. Please consider the maximum power dissipation and dissipation factor. 80 60 40 20 0 -25 0 25 50 75 100 125 150 175 Ambient temperature (C) [Dissipation factor] * The constant amount power required to raise the temperature of the Thermistor 1 C through self heat generation under stable temperatures. Dissipation factor (mW/C) = Power consumption of Thermistor / Temperature rise of element Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 - 21 - Jun. 2015 NTC Thermistors for automotive devices (chip type) 1.3 Environmental Restrictions (2) The land size shall be designed to have equal space, on both right and left sides. If the amount of solder on both sides is not equal, the component may be cracked by stress, since the side with a larger amount of solder solidifies later during cooling. The Thermistors shall not be operated and/or stored under the following conditions. (1) Environmental conditions (a) Under direct exposure to water or salt water (b) Under conditions where water can condense and/or dew can form (c) Under conditions containing corrosive gases such as hydrogen sulfide, sulfurous acid, chlorine and ammonia (2) Mechanical conditions The place where vibration or impact that exceeds specified conditions written in delivery specification is loaded. Recommended Amount of Solder (a) Excessive amount (1) Solder resist shall be utilized to equalize the amounts of solder on both sides. (2) Solder resist shall be used to divide the pattern for the following cases; * Components are arranged closely. * The Thermistor is mounted near a component with lead wires. * The Thermistor is placed near a chassis. Refer to the table below. The resistance of the Thermistors varies depending on ambient temperatures and self-heating. To measure the resistance value when examining circuit configuration and conducting receiving inspection and so on, the following points should be taken into consideration: 1 Measurement temp : 250.1 C Measurement in liquid (silicon oil, etc.) is recommended for a stable measurement temperature. 2 Power : 0.10 mW max. 4 terminal measurement with a constant-current power supply is recommended. Prohibited Applications and Recommended Applications Item 2. Design of Printed Circuit Board 2.1 Selection of Printed Circuit Boards Mixed mounting with a component with lead wires There is a possibility of performance deterioration by heat shock (temperature cycles), which causes cracks, from alumina substrate. Please confirm that the substrate you use does not deteriorate the Thermistors' quality. Arrangement near chassis 2.2 Design of Land Pattern Retro-fitting of component with lead wires Recommended Land Dimensions Lateral arrangement SMD c Solder resist Chassis Solder (Ground solder) Solder resist Solder resist A lead wire of Soldering Retro-fitted component iron Portion to be excessively soldered Land Solder resist Solder resist To prevent the crack of Thermistors, try to place it on the position that could not easily be affected by the bending stress of substrate while mounting procedures or procedures afterwards. Placement of the Thermistors near heating elements also requires the great care to be taken in order to avoid stresses from rapid heating and cooling. Unit (mm) Size Code (EIA) The lead wire of a component with lead wires Improved applications by pattern division 2.4 Component Layout a Component dimensions L W T Prohibited applications Electrode pattern (1) Recommended land dimensions are shown below. Use the proper amount of solder in order to prevent cracking. Using too much solder places excessive stress on the Thermistors. b (c) Insufficient amount 2.3 Utilization of Solder Resist 1.4 Measurement of Resistance Land (b) Proper amount a b c 0(0402) 1.0 0.5 0.5 0.4 to 0.5 0.4 to 0.5 0.4 to 0.5 1(0603) 1.6 0.8 0.8 0.8 to 1.0 0.6 to 0.8 0.6 to 0.8 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 - 22 - Jun. 2015 NTC Thermistors for automotive devices (chip type) 2. Chip Mounting Consideration (1) To minimize mechanical stress caused by the warp or bending of a PC board, please follow the recommended Thermistors' layout below. Prohibited layout (1) When mounting the Thermistors/components on a PC board, the Thermistor bodies shall be free from excessive impact loads such as mechanical impact or stress due to the positioning, pushing force and displacement of vacuum nozzles during mounting. (2) Maintenance and inspection of the Chip Mounter must be performed regularly. (3) If the bottom dead center of the vacuum nozzle is too low, the Thermistor will crack from excessive force during mounting. The following precautions and recommendations are for your reference in use. (a) Set and adjust the bottom dead center of the vacuum nozzles to the upper surface of the PC board after correcting the warp of the PC board. (b) Set the pushing force of the vacuum nozzle during mounting to 1 to 3 N in static load. (c) For double surface mounting, apply a supporting pin on the rear surface of the PC board to suppress the bending of the PC board in order to minimize the impact of the vacuum nozzles. Typical examples are shown in the table below. Recommended layout Layout the Thermistors sideways against the stressing direction (2) The following layout is for your reference since mechanical stress near the dividing/breaking position of a PC board varies depending on the mounting position of the Thermistors. E D Perforation C A B Slit Magnitude of stress A>B=C>D>E (3) The magnitude of mechanical stress applied to the Thermistors when dividing the circuit board in descending order is as follows: push back < slit < V-groove < perforation. Also take into account the layout of the Thermistors and the dividing/breaking method. (4) When the Thermistors are placed near heating elements such as heater, etc., cracks from thermal stresses may occur under following situation: * Soldering the Thermistors directly to heating elements. * Sharing the land with heating elements. If planning to conduct above-mentioned mounting and/or placement, please contact us in advance. Item Single surface mouting Prohibited mounting Crack Recommended mounting The supporting pin does not necessarily have to be positioned beneath the Thermistor. Supporting pin Double surface mounting Separation of Solder Crack Supporting pin (d) Adjust the vacuum nozzles so that their bottom dead center during mounting is not too low. (4) The closing dimensions of the positioning chucks shall be controlled. Maintenance and replacement of positioning chucks shall be performed regularly to prevent chipping or cracking of the Thermistors caused by mechanical impact during positioning due to worn positioning chucks. (5) Maximum stroke of the nozzle shall be adjusted so that the maximum bending of PC board does not exceed 0.5 mm at 90 mm span. The PC board shall be supported by an adequate number of supporting pins. 2.5 Mounting Density and Spaces Intervals between components should not be too narrow to prevent the influence from solder bridges and solder balls. The space between components should be carefully determined. Precautions for Assembly 1. Storage (1) The Thermistors shall be stored between 5 to 40 C and 20 to 70 % RH, not under severe conditions of high temperature and humidity. (2) If stored in a place where humidity, dust, or corrosive gasses (hydrogen sulfide, sulfurous acid, hydrogen chloride and ammonia, etc.) are contained, the solderability of terminal electrodes will be deteriorated. In addition, storage in a places where the heat or direct sunlight exposure occur will cause mounting problems due to deformation of tapes and reels and components and taping/reels sticking together. (3) Do not store components longer than 6 months. Check the solderability of products that have been stored for more than 6 months before use 3. Selection of Soldering Flux Soldering flux may seriously affect the performance of the Thermistors. The following shall be confirmed before use. (1) The soldering flux should have a halogen based content of 0.1 wt% (converted to chlorine) or below. Do not use soldering flux with strong acid. (2) When applying water-soluble soldering flux, wash the Thermistors sufficiently because the soldering flux residue on the surface of PC boards may deteriorate the insulation resistance on the Thermistors' surface. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 - 23 - Jun. 2015 NTC Thermistors for automotive devices (chip type) 4. Soldering (b) Preheating: Conduct sufficient pre-heating, and make sure that the temperature difference between solder and Thermistors' surface is 150 C or less. (c) Temperature of Iron tip: 300 C max. (The required amount of solder shall be melted in advance on the soldering tip.) (d) Gradual cooling: After soldering, the Thermistors shall be cooled gradually at room temperature. 4.1 Reflow Soldering The reflow soldering temperature conditions are composed of temperature curves of Preheating, Temp. rise, Heating, Peak and Gradual cooling. Large temperature difference inside the Thermistors caused by rapid heat application to the Thermistors may lead to excessive thermal stresses, contributing to the thermal cracks. The Preheating temperature requires controlling with great care so that tombstone phenomenon may be prevented. Temperature 140 to 180 C Preheating temp 2Temp. rise to Peak temp. 220 C min. 3Heating 260 C max. 4Peak Peak temp. 5Gradual cooling to 140 C Recommended profile of Hand soldering (EX) Period or Speed 60 to 120 sec Item 1Preheating 2 to 5 C /sec T Gradual cooling 60 sec max. 10 sec max. Preheating 1 to 4 C /sec 60 to 120 sec Recommended profile of Reflow soldering (EX) T Temperature (C) T : Allowable temperature difference T < 150 C 4 Peak 260 220 2 Temp. rise (2) Condition 2 (without preheating) Hand soldering can be performed without preheating, by following the conditions below: (a) Soldering iron tip shall never directly touch the ceramic and terminal electrodes of the Thermistors. (b) The lands are sufficiently preheated with a soldering iron tip before sliding the soldering iron tip to the terminal electrodes of the Thermistors for soldering. 5 Gradual cooling 180 140 1 Preheating 3 Heating Time 60 to 120 sec 3 sec max. 60 sec max. T : Allowable temperature difference T < 150 C Conditions of Hand soldering without preheating The rapid cooling (forced cooling) during Gradual cooling part should be avoided, because this may cause defects such as the thermal cracks, etc. When the Thermistors are immersed into a cleaning solvent, make sure that the surface temperatures of the devices do not exceed 100 C. Per for ming reflow soldering twice under the conditions shown in the figure above [Recommended profile of Reflow soldering (EX)] will not cause any problems. However, pay attention to the possible warp and bending of the PC board. Item Temperature of Iron tip Wattage Shape of Iron tip Soldering time with a soldering iron Condition 270 C max. 20 W max. f3 mm max. 3 sec max. 5. Post Soldering Cleaning 5.1 Cleaning solvent Soldering flux residue may remain on the PC board if cleaned with an inappropriate solvent. This may deteriorate the electrical characteristics and reliability of the Thermistors. 4.2 Hand Soldering Hand soldering typically causes significant temperature change, which may induce excessive thermal stresses inside the Thermitors, resulting in the thermal cracks, etc. In order to prevent any defects, the following should be observed. * The temperature of the soldering tips should be controlled with special care. * The direct contact of soldering tips with the Thermistors and/or terminal electrodes should be avoided. * Dismounted Thermistors shall not be reused. (1) Condition 1 (with preheating) (a) Soldering: Use thread solder (f1 mm or below) which contains flux with low chlorine, developed for precision electronic equipment. 5.2 Cleaning conditions Inappropriate cleaning conditions such as insufficient cleaning or excessive cleaning may impair the electrical characteristics and reliability of the Thermistors. (1) Insufficient cleaning can lead to: (a) The halogen substance found in the residue of the soldering flux may cause the metal of terminal electrodes to corrode. (b) The halogen substance found in the residue of the soldering flux on the surface of the Thermistors may change resistance values. (c) Water-soluble soldering flux may have more remarkable tendencies of (a) and (b) above compared to those of rosin soldering flux. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 - 24 - Jun. 2015 NTC Thermistors for automotive devices (chip type) (2) Dividing/Breaking of the PC boards shall be done carefully at moderate speed by using a jig or apparatus to protect the Thermistors on the boards from mechanical damage. (3) Examples of PCB dividing/breaking jigs: The outline of PC board breaking jig is shown below. When PC boards are broken or divided, loading points should be close to the jig to minimize the extent of the bending Also, planes with no parts mounted on should be used as plane of loading, in order to prevent tensile stress induced by the bending, which may cause cracks of the Thermistors or other parts mounted on the PC boards. (2) Excessive cleaning can lead to: (a) When using ultrasonic cleaner, make sure that the output is not too large, so that the substrate will not resonate. The resonation causes the cracks in Varistors and/or solders, and deteriorates the strength of the terminal electrodes. Please follow these conditions for Ultrasonic cleaning: Ultrasonic wave output : 20 W/L max. Ultrasonic wave frequency : 40 kHz max. Ultrasonic wave cleaning time : 5 min. max. 5.3 Contamination of Cleaning solvent Cleaning with contaminated cleaning solvent may cause the same results as insufficient cleaning due to the high density of liberated halogen. Outline of Jig 6. Inspection Process The pressure from measuring terminal pins might bend the PCB when implementing circuit inspection after mounting Thermistors on PCB, and as a result, cracking may occur. (1) Mounted PC boards shall be supported by an adequate number of supporting pins on the back with bend settings of 90 mm span 0.5 mm max. (2) Confirm that the measuring pins have the right tip shape, are equal in height, have the right pressure, and are set in the correct positions. The following figures are for your reference to avoid bending the PC board. Item Prohibited setting PC board V-groove PC board splitting jig Prohibited dividing Loading direction Loading point PC board Recommended setting Recommended dividing PC board Chip component Loading direction V-groove Chip component Loading point V-groove Check pin Check pin 9. Mechanical Impact Bending of PC board Separated, Crack (1) The Thermistors shall be free from any excessive mechanical impact. The Thermistor body is made of ceramics and may be damaged or cracked if dropped. N eve r use a T h ermisto r w hich has be en dropped; their quality may be impaired and failure rate increased. (2) When handling PC boards with Thermistors mounted on them, do not allow the Thermistors to collide with another PC board. When mounted PC boards are handled or stored in a stacked state, the corner of a PC board might strike Thermistors, and the impact of the strike may cause damage or cracking and can deteriorate the withstand voltage and insulation resistance of the Thermistor. Supporting pin 7. Protective Coating When the surface of a PC board on which the Thermistors have been mounted is coated with resin to protect against moisture and dust, it shall be confirmed that the protective coating does not affect the performance of Varistors. (1) Choose the material that does not emit the decomposition and/or reaction gas. The Gas may affect the composing members of the Varistors. (2) Shrinkage and expansion of resin coating when curing may apply stress to the Varistors and may lead to occurrence of cracks. 8. Dividing/Breaking of PC Boards Mounted PCB (1) Please be careful not to stress the substrate with bending/twisting when dividing, after mounting components including Varistors. Abnormal and excessive mechanical stress such as bending or torsion shown below can cause cracking in the Thermistors. Bending Crack Crack Floor Other Torsion The various precautions described above are typical. For special mounting conditions, please contact us. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 - 25 - Jun. 2015 "PGS" Graphite Sheets "PGS" Graphite Sheets Type: EYG "PGS (Pyrolytic Graphite Sheet)" is a ther mal interface material which is very thin, synthetically made, has high thermal conductivity, and is made from a higly oriented graphite polymer film. It is ideal for providing thermal management/heatsinking in limited spaces or to provide supplemental heat-sinking in addition to conventional means. This material is flexible and can be cut into customizable shapes. "SSM(Semi-Sealing Material)" is the product which is compounding PGS Graphite sheet and High thermal conductive Elastomer resin. It has a function to absorb heat by resin and release the heat by utilizing high thermal conductivity of PGS Graphite sheet. It also enables taking better attachment to the component which has different height on the electronic board, reducing stress to the electronic board. Features Excellent thermal conductivity : 700 to 1950 W/(m*K) (2 to 5 times as high as copper, 3 to 8 time as high as aluminum) Lightweight: Specific gravity : 0.85 to 2.13 g/cm3 (1/4 to 1/10 of copper, 1/1.3 to 1/3 of aluminum in density) Flexible and easy to be cut or trimmed. (withstands repeated bending) Low thermal resistance Low heat resistance with flexible Graphite sheet (SSM) Low repulsion and easy to keep the product's shape after attaching (SSM) Siloxane Free(SSM) High dielectric voltage : 17 kVac/mm (SSM) RoHS compliant Recommended applications Smart phones, Mobile phones, DSC, DVC, Tablet PCs, PCs and peripherals, LED Semiconductor manufacturing equipment (Sputtering, Dry etching, Steppers) Optical communications equipment Devices Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 08 Aug. 2016 - 26 - "PGS" Graphite Sheets Explanation of Part Numbers PGS only (EYGS) 1 2 3 4 5 6 7 8 9 10 E Y G S 0 9 1 2 1 0 Product Code Style S 0912 1218 1823 PGS only Dimension 90 mm x 115 mm 115 mm x 180 mm 180 mm x 230 mm PGS thickness 100 m 10 70 m 07 50 m 05 40 m 04 25 m 03 PGS thickness of 17 m, 10 m does not support as single item. Taping (EYGA) 1 2 3 4 5 6 7 8 9 10 11 12 E Y G A 0 9 1 2 1 0 D M Product Code Style A 0912 1218 Taping Dimension 90 mm x 115 mm 115 mm x 180 mm Please contact us for other dimensions other than those above. Thermally PGS thickness 10 100 m 07 70 m 05 50 m 04 40 m 03 25 m 02 17 m 01 10 m Suffix A M F PA PM DM DF V RV KV Lamination type Please refer to Composition example. conductive elastomer processing (EYGE) 1 2 3 4 5 6 7 8 9 10 11 12 E Y G E 0 9 1 2 X B 6 D Product Code Style E Elastomer processing 0912 Dimension 90 mm x 115 mm SSM type Please contact us for other dimensions other than those above. PGS thickness A 100 m B 70 m C 50 m G 40 m D 25 m E 17 m F 10 m Elastomer thickness 5 0.5 mm 6 1.0 mm 7 1.5 mm 8 2.0 mm 9 3.0 mm Q D P F M A Tape thickness PET tape 8 m PET tape 10 m PET tape 30 m Acrylic adhesive tape 6 m Acrylic adhesive tape 10 m Acrylic adhesive tape 30 m Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 08 Aug. 2016 - 27 - "PGS" Graphite Sheets Characteristics of PGS Graphite Sheets 100 m 0.100.03 mm 0.85 g/cm3 700 W/(m*K) 10000 S/cm 20.0 MPa 9.3x10-7 1/K 3.2x10-5 1/K Thickness Density Thermal conductivity a-b plane Electrical conductivity Extensional strength a-b plane Expansion coefficient c axis Heat resistance Bending(angle 180,R5) Thickness Density Thermal conductivity a-b plane Electrical conductivity Extensional strength a-b plane Expansion coefficient c axis Heat resistance Bending(angle 180,R5) 25 m 0.0250 .010 mm 1.90 g/cm3 1600 W/(m*K) 20000 S/cm 30.0 MPa 9.3x10-7 1/K 3.2x10-5 1/K 70 m 50 m 0.070.015 mm 0.0500 .015 mm 1.21 g/cm3 1.70 g/cm3 1000 W/(m*K) 1300 W/(m*K) 10000 S/cm 10000 S/cm 20.0 MPa 20.0 MPa -7 9.3x10 1/K 9.3x10-7 1/K -5 3.2x10 1/K 3.2x10-5 1/K 400 C 10000 cycles 17 m 0.0170 .005 mm 2.10 g/cm3 1850 W/(m*K) 20000 S/cm 40.0 MPa 9.3x10-7 1/K 3.2x10-5 1/K 400 C 10000 cycles 40 m 0.0400 .012 mm 1.80 g/cm3 1350 W/(m*K) 10000 S/cm 25.0 MPa 9.3x10-7 1/K 3.2x10-5 1/K 10 m 0.0100 .002 mm 2.13 g/cm3 1950 W/(m*K) 20000 S/cm 40.0 MPa 9.3x10-7 1/K 3.2x10-5 1/K Withstand temperature refers to PGS only. (Lamination material such as PET tape etc. is not included) Values are for reference, not guaranteed. Characteristics of SSM (Elastomer) Thickness 1 mm 2 mm Specific heat 1.4 J/(gC) Density 1.88 g/cm3 Thermal conductivity Thermal resistance Compressibility 1.6 W/(m*K) 100 kPa 7.53 (C*cm2)/W 14.82 (C*cm2)/W 19.48 (C*cm2)/W 200 kPa 6.71 (C*cm2)/W 13.17 (C*cm2)/W 16.01 (C*cm2)/W 300 kPa 5.90 (C*cm2)/W 10.73 (C*cm2)/W 11.38 (C*cm2)/W 100 kPa 4.93 % 4.05 % 4.43 % 200 kPa 9.58 % 8.66 % 14.04 % 300 kPa 18.41 % 22.13 % 40.49 % 14 Resistivity > 10x10 cm Dielectric voltage > 17 kVac/mm Hardness (Type E) 39 SUS Adhesive force 3 mm 39 mN/cm Aluminum 31 mN/cm Glass 38 mN/cm Characteristics refer to Elastomer resin only. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 08 Aug. 2016 - 28 - "PGS" Graphite Sheets Comparison of thermal conductivity (a-b plane) Layered structure of PGS Diamond 1950 W/(m*K) PGS 10 m 1850 W/(m*K) PGS 17 m PGS 25 m 1350 W/(m*K) PGS 40 m 1300 W/(m*K) PGS 50 m 1000 W/(m*K) PGS 70 m PGS 100 m 3.3543.356 x10-8cm C axis 1600 W/(m*K) a-b plane 700 W/(m*K) C : 99.9 % above Thermal conductivity: 2 to 5 times as high as copper, Specific gravity: 1/10 to 1/4 that of copper Pure copper Aluminum Magnesium alloy Stainless steel Heat-conductive sheet 0 200 400 600 800 1000 1200 1400 1600 1800 2000 Coefficient of thermal conductivity (W/(m*k)) Electric field shield performance Effect of shield (dB) a-b plane(KEC method) 140 130 Effect of shield (dB)=-20 log (Vs/V0) 120 110 100 90 Effect of electric field shield 80 70 60 50 40 30 Effect of magnetic field shield 20 10 0 10 100 1000 Frequency (MHz) 10000 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 08 Aug. 2016 - 29 - "PGS" Graphite Sheets Lamination type/Composition example Standard series ( PGS 100, 70, 50, 40, 25, 17, 10 m) Type Front face Rear face PGS Only S type - - A-A type - Insulative adhesion type 30 m Adhesive Type A -M type A -F type - - Insulative thin adhesion type 10 m Insulative thin adhesion type 6 m PGS Graphite sheet PGS Graphite sheet PGS Graphite sheet PGS Graphite sheet Acrylic Adhesive tape 30 m Separating paper Acrylic Adhesive tape 10 m Separating paper Acrylic Adhesive tape 6 m Separating paper Structure Features Withstand temperature Standard size Maximum size Part No. 100 m Thickness Part No. 70 m Thickness Part No. 50 m Thickness Part No. 40 m Thickness Part No. 25 m Thickness Part No. 17 m Thickness Part No. 10 m Thickness Type Front face Rear face * High Thermal Conductivity High Flexibility * Low Thermal Resistance * Available up to 400 C * Conductive Material 400 C 115 x 180 mm 180 x 230 mm (25 m to) EYGS121810 100 m EYGS121807 70 m EYGS121805 50 m EYGS121804 40 m EYGS121803 25 m - - - - * With insulation material on one side * With strong adhesive tape for putting chassis * Withstanding Voltage : 2 kV 100 C 90 x 115 mm 115 x 180 mm EYGA091210A 130 m EYGA091207A 100 m EYGA091205A 80 m EYGA091204A 70 m EYGA091203A 55 m EYGA091202A 47 m EYGA091201A 40 m * With insulation material on one side * Low thermal resistance comparison with A-A type * Withstanding Voltage : 1 kV 100 C 90 x 115 mm 115 x 180 mm EYGA091210M 110 m EYGA091207M 80 m EYGA091205M 60 m EYGA091204M 50 m EYGA091203M 35 m EYGA091202M 27 m EYGA091201M 20 m * With insulation material on one side * Low thermal resistance comparison with A-A type 100 C 90 x 115 mm 115 x 180 mm EYGA091210F 106 m EYGA091207F 76 m EYGA091205F 56 m EYGA091204F 46 m EYGA091203F 31 m EYGA091202F 23 m EYGA091201F 16 m Laminated type (Insulation & Adhesive) A-PA type A-PM type A-DM type A-DF type Polyester tape standard type 30 m Polyester tape standard type 30 m Polyester tape thin type 10 m Polyester tape thin type 10 m Insulative adhesion type 30 m Insulative thin adhesion type 10 m Insulative thin adhesion type 10 m Insulative thin adhesion type 6 m PGS Graphite sheet Polyester(PET) PGS Polyester(PET) PGS Polyester(PET) Graphite sheet tape 30 m Graphite sheet tape 10 m tape 30 m PGS Polyester(PET) Graphite sheet tape 10 m Structure Acrylic Adhesive Acrylic Adhesive tape 30 m tape 10 m Separating paper Separating paper Features Withstand temperature Standard size Maximum size Part No. 100 m Thickness Part No. 70 m Thickness Part No. 50 m Thickness Part No. 40 m Thickness Part No. 25 m Thickness Part No. 17 m Thickness Part No. 10 m Thickness * With insulation material on both side * Withstanding Voltage PET tape : 4 kV Adhesive Tape : 2 kV 100 C 90 x 115 mm 115 x 180 mm EYGA091210PA 160 m EYGA091207PA 130 m EYGA091205PA 110 m EYGA091204PA 100 m EYGA091203PA 85 m EYGA091202PA 77 m EYGA091201PA 70 m * With insulation material on both side * Withstanding Voltage PET tape : 4 kV Adhesive Tape : 1 kV 100 C 90 x 115 mm 115 x 180 mm EYGA091210PM 140 m EYGA091207PM 110 m EYGA091205PM 90 m EYGA091204PM 80 m EYGA091203PM 65 m EYGA091202PM 57 m EYGA091201PM 50 m Acrylic Adhesive tape 10 m Separating paper * With insulation material on both side * Withstanding Voltage PET tape : 1 kV Adhesive Tape : 1 kV 100 C 90 x 115 mm 115 x 180 mm EYGA091210DM 120 m EYGA091207DM 90 m EYGA091205DM 70 m EYGA091204DM 60 m EYGA091203DM 45 m EYGA091202DM 37 m EYGA091201DM 30 m Acrylic Adhesive tape 6 m Separating paper * With insulation material on both side * Withstanding Voltage PET tape : 1 kV 100 C 90 x 115 mm 115 x 180 mm EYGA091210DF 116 m EYGA091207DF 86 m EYGA091205DF 66 m EYGA091204DF 56 m EYGA091203DF 41 m EYGA091202DF 33 m EYGA091201DF 26 m Please contact us for other lamination type product. Withstanding Voltages are for reference, not guaranteed. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 08 Aug. 2016 - 30 - "PGS" Graphite Sheets Lamination type/Composition example High heat resistance series ( PGS 100, 70, 50, 40, 25, 17, 10 m) Type A-V type Front face - Rear face High heat resistance and insulation adhesion type 18 m PGS Graphite sheet High heat resistance type A-RV type High heat resistance and insulation type 13 m High heat resistance and insulation adhesion type 18 m A-KV type High heat resistance and insulation type 30 m High heat resistance and insulation adhesion type 18 m PGS Graphite sheet PGS Heat-resistance PEEK tape 13 m Graphite sheet Heat-resistance Acrylic adhesive tape 18 m Separating paper Polyimide tape 30 m Structure Heat-resistance Acrylic adhesive tape 18 m Features Separating paper * With high heat resistance and insulation tape on one side * Withstanding Voltage Adhesive tape : 2 kV Withstand temperature Standard Size Maximam size Part No. 100 m Thickness Part No. 70 m Thickness Part No. 50 m Thickness Part No. 40 m Thickness Part No. 25 m Thickness Part No. 17 m Thickness Part No. 10 m Thickness * With high heat resistance and insulation tape on both side * Withstanding Voltage PEEK tape : 2 kV Adhesive tape : 2 kV 150 C 90 x 115 mm 115 x 180 mm EYGA091210V 118 m EYGA091207V 88 m EYGA091205V 68 m EYGA091204V 58 m EYGA091203V 43 m EYGA091202V 35 m EYGA091201V 28 m Heat-resistance Acrylic adhesive tape 18 m Separating paper * With high heat resistance and more insulated tape on both side * Withstanding Voltage PI tape : 5 kV Adhesive tape : 2 kV 150 C 90 x 115 mm 115 x 180 mm EYGA091210RV 131 m EYGA091207RV 101 m EYGA091205RV 81 m EYGA091204RV 71 m EYGA091203RV 56 m EYGA091202RV 48 m EYGA091201RV 41 m 150 C (Polyimide : 180 C) 90 x 115 mm 115 x 180 mm EYGA091210KV 148 m EYGA091207KV 118 m EYGA091205KV 98 m EYGA091204KV 88 m EYGA091203KV 73 m EYGA091202KV 65 m EYGA091201KV 58 m Please contact us for other lamination type product. Withstanding Voltages are for reference, not guaranteed. Standard series (SSM) Type E-6 type E-8 type E-9 type Elastomer thickness 1.0 mm 2.0 mm 3.0 mm PGS Graphite Sheet PET tape 10 m PGS Graphite Sheet PET tape 10 m PGS Graphite Sheet PET tape 10 m Structure Acrylic Adhesive tape Elastomer 1.0 mm Features * Soft and low thermal resistance (Elastomer) * Low repulsion * Withstanding Voltage : 1.7 kV Acrylic Adhesive tape Elastomer 2.0 mm Acrylic Adhesive tape Elastomer 3.0 mm * Soft and low thermal resistance (Elastomer) * Low repulsion * Withstanding Voltage : 1.7 kV * Soft and low thermal resistance (Elastomer) * Low repulsion * Withstanding Voltage : 1.7 kV Withstand temperature 100 C 100 C 100 C Standard Size 90 x 115 mm 90 x 115 mm 90 x 115 mm EYGE0912XB6D EYGE0912XB8D EYGE0912XB9D 70 m 25 m Part No. Thickness 1.09 mm 2.09 mm 3.09 mm Part No. EYGE0912XD6D EYGE0912XD8D EYGE0912XD9D Thickness 1.05 mm 2.05 mm 3.05 mm Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 08 Aug. 2016 - 31 - "PGS" Graphite Sheets Minimum order Item Type S type 100 m S type 70 m PGS Graphite Sheet Only S type 50 m S type 40 m S type 25 m A-A type 70 m A-A type 25 m PGS 70, 25, 17 m Adhesive Type [Standard series] A-A type 17 m A-M type 70 m A-M type 25 m A-M type 17 m A-PA type 70 m A-PA type 25 m A-PA type 17 m PGS 70, 25, 17 m Laminated Type (Insulation & Adhesive) [Standard series] A-PM type 70 m A-PM type 25 m A-PM type 17 m A-DM type 70 m A-DM type 25 m A-DM type 17 m Part No. EYGS091210 EYGS121810 EYGS182310 EYGS091207 EYGS121807 EYGS182307 EYGS091205 EYGS121805 EYGS182305 EYGS091204 EYGS121804 EYGS182304 EYGS091203 EYGS121803 EYGS182303 EYGA091207A EYGA121807A EYGA091203A EYGA121803A EYGA091202A EYGA121802A EYGA091207M EYGA121807M EYGA091203M EYGA121803M EYGA091202M EYGA121802M EYGA091207PA EYGA121807PA EYGA091203PA EYGA121803PA EYGA091202PA EYGA121802PA EYGA091207PM EYGA121807PM EYGA091203PM EYGA121803PM EYGA091202PM EYGA121802PM EYGA091207DM EYGA121807DM EYGA091203DM EYGA121803DM EYGA091202DM EYGA121802DM Size 90x115 mm 115x180 mm 180x230 mm 90x115 mm 115x180 mm 180x230 mm 90x115 mm 115x180 mm 180x230 mm 90x115 mm 115x180 mm 180x230 mm 90x115 mm 115x180 mm 180x230 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm Minimum order 20 10 10 20 10 10 20 10 10 20 10 10 20 10 10 20 10 20 10 20 10 20 10 20 10 20 10 20 10 20 10 20 10 20 10 20 10 20 10 20 10 20 10 20 10 Only S type supports 180x230 mm size. (PGS thickness of 17 m, 10m does not support as single item) PGS of 10 m, 40 m, 50 m type is also possible to be made as lamination type. The above-listed part number is sample part number for testing. Please contact us about your request of custom part number which will be arranged separately. Please contact us if quantity is below Minimum Order Quantity. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 08 Aug. 2016 - 32 - "PGS" Graphite Sheets Minimum order Item Type A-V type 70 m A-V type 25 m A-V type 17 m A-RV type 70 m PGS 70, 25, 17 m [High heat resistance type] A-RV type 25 m A-RV type 17 m A-KV type 70 m A-KV type 25 m A-KV type 17 m SSM Elastomer 3.0, 2.0, 1.0 mm PGS 70, 25, 17 m E-9 type Elastomer 3.0 mm, PGS 70 m E-9 type Elastomer 3.0 mm, PGS 25 m E-8 type Elastomer 2.0 mm, PGS 70 m E-8 type Elastomer 2.0 mm, PGS 25 m E-6 type Elastomer 1.0 mm, PGS 70 m E-6 type Elastomer 1.0 mm, PGS 25 m Part No. EYGA091207V EYGA121807V EYGA091203V EYGA121803V EYGA091202V EYGA121802V EYGA091207RV EYGA121807RV EYGA091203RV EYGA121803RV EYGA091202RV EYGA121802RV EYGA091207KV EYGA121807KV EYGA091203KV EYGA121803KV EYGA091202KV EYGA121802KV Size 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm 90x115 mm 115x180 mm Minimum order 20 10 20 10 20 10 20 10 20 10 20 10 20 10 20 10 20 10 EYGE0912XD9D 90x115 mm 5 EYGE0912XB9D 90x115 mm 5 EYGE0912XD8D 90x115 mm 5 EYGE0912XB8D 90x115 mm 5 EYGE0912XD6D 90x115 mm 5 EYGE0912XB6D 90x115 mm 5 Only S type supports 180x230 mm size. (PGS thickness of 17 m, 10m does not support as single item) PGS of 10 m, 40 m, 50 m type is also possible to be made as lamination type. The above-listed part number is sample part number for testing. Please contact us about your request of custom part number which will be arranged separately. Please contact us if quantity is below Minimum Order Quantity. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 08 Aug. 2016 - 33 - "PGS" Graphite Sheets "PGS" (Pyrolytic Graphite Sheet) Heat sink sheet Handling Precautions Safety Precautions * When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. * Do not use the products beyond the specifications described in this catalog. * This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. * Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault PGS (Pyrolytic Graphite Sheet) Heat sink sheet (hereafter referred to as PGS) may result in accidents or trouble when subjected to severe conditions of electrical, environmental and /or mechanical stress beyond the specified "Rating" and specified "Conditions" found in the Specifications. Please follow the recommendations in "Safety Precautions" and "Application Notes". Contact our engineering staff or the factory with any questions. 1. 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 Safety Precautions The PGS shall be used within the specified operating temperature range. The PGS is soft, do not rub or touch it with rough materials to avoid scratching it. Lines or folds in the PGS may affect thermal conductivity. The PGS shall not be used with acid. The PGS shall not be used in contact with a soldering iron at 400 C or more The PGS shall not be exposed to salt water or direct sunlight during use. The PGS shall not be used in corrosive gases (hydrogen sulfide, sulfurous acid, chlorine, ammonia etc.). Our PGS has been developed for general industry applications. Prior to using the PGS for special applications such as medical, work please contact our engineering staff or the factory. Never touch a PGS during use because it may be extremely hot. Since SSM Elastomer resin is soft, please do not store the parts under a load. Please do not use the parts in the condition of jamming by contaminants such as metals in SSM Elastomer side. 2. Application notes 2.1 Use protective materials when handling and/or applying the PGS, do not use items with sharp edges as they might tear or puncture the PGS. 2.2 The PGS does not work properly if overheated. 2.3 Thermal conductivity is dependant on the way it is used. Test the adaptability of PGS to your application before use. 2.4 The PGS has conductivity. If required, the PGS should be provided insulation. 2.5 Long term storage * The PGS shall not be stored under severe conditions of salt water, direct sunlight or corrosive gases (hydrogen sulfide, sulfurous acid, chlorine, ammonia etc.). * The PGS shall not be stored near acid. * Please store SSM packed at room temperature and humidity while not in use. 2.6 Once applying to the adherent which has dents, SSM Elastomer resin keeps its shape so it cannot be re-applied to different portion. <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 03 Aug. 2016 - 34 - "NASBIS" Insulating Sheet "NASBIS" Insulating Sheet EYGY/EYGN Type: "NASBIS" is a heat insulating sheet, which is composed of silica aerogel and fiber sheet, created through impregnation process. Pore size of silica aerogel is 10 to 60nm, which means it has smaller space than the mean free path of the air, 68nm. Air molecules do not collide against each other inside the pores, and thus the component shows excellecnt heat insulation performace. Furthermore, combining NASBIS and PGS Graphite Sheet enables controlling the direction of heat. Composite type provides greater heat insulating performance. Features Low thermal conductivity : 0.020 W/m * K typ. Created thin-film sheet ; Thickness : 100 m to 1000 m Various proposals are available when combined with PGS RoHS compliant Graphite sheet Recommended applications Smartphone, Wearable equipment, Digital Still Camera, Notebook PCs, Tablet PCs Explanation of Part Numbers NASBIS Pouch Type (EYGY) 1 2 3 4 5 6 7 8 9 10 11 12 E Y G Y 0 9 1 2 Q N 6 S Product Code 0912 NASBIS Dimension 90 mm x 115 mm Type Q Normal type Thickness of PGS N PGS free type PET tape NASBIS Adhesive tape or PET tape Thickness of NASBIS 3 1000 m 4 500 m 6 100 m Separator X W V U T S PET or Adhesive PET(10 m)x2 PET(30 m)x2 PET( 5 m)+Adhesive( 6 m) PET( 5 m)+Adhesive(10 m) PET( 5 m)+Adhesive(30 m) PET(10 m)+Adhesive(10 m) Please consult the other configurations separately. NASBIS and PGS Composit Type (EYGN) 1 2 3 4 5 6 7 8 9 10 11 12 E Y G N 0 9 1 2 Q E 6 S Product Code NASBIS 0912 Dimension 90 mm x 115 mm PET tape PET tape Normal type Type Q Normal type G Reversal type NASBIS Adhesive tape 6 m PGS Adhesive tape or PET tape Separator Reversal type Thickness of PGS B 70 m C 50 m G 40 m D 25 m PGS E 17 m Adhesive tape F 10 m 6 m NASBIS Adhesive tape or PET tape Separator Thickness of NASBIS 3 1000 m 4 500 m 6 100 m X W V U T S PET or Adhesive PET(10 m)x2 PET(30 m)x2 PET( 5 m)+Adhesive( 6 m) PET( 5 m)+Adhesive(10 m) PET( 5 m)+Adhesive(30 m) PET(10 m)+Adhesive(10 m) Please consult the other configurations separately. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 May. 2016 - 35 - "NASBIS" Insulating Sheet Characteristics of NASBIS Thickness 100 m 500 m 1000 m Thermal conductivity (W/(m*K)) 0.018 to 0.026 0.018 to 0.026 0.018 to 0.026 Operating temperature limit (C) -20 to 100 -20 to 100 -20 to 100 Size / Laminate pouch (mm) 90 x 115 90 x 115 90 x 115 Heatproof temperature(C) 100 100 100 Appearance of silica aerogel and its nanostructure Pore diameter 10 to 60 nm Diameter of silica about 10 nm Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 May. 2016 - 36 - "NASBIS" Insulating Sheet Composition example NASBIS Pouch Type Type Y - X type Y - W type Y - T type Y - S type PET 10 m PET 30 m PET 5 m PET 10 m NASBIS NASBIS NASBIS NASBIS PET 10 m PET 30 m Adhesive 30 m Adhesive 10 m 100 C 100 C 100 C 100 C Standard Part No. EYGY0912QN6X EYGY0912QN6W EYGY0912QN6T EYGY0912QN6S Thickness 120 m 160 m 135 m 120 m Standard Part No. EYGY0912QN4X EYGY0912QN4W EYGY0912QN4T EYGY0912QN4S Thickness 520 m 560 m 535 m 520 m Standard Part No. EYGY0912QN3X EYGY0912QN3W EYGY0912QN3T EYGY0912QN3S Thickness 1020 m 1060 m 1035 m 1020 m N - X type N - W type N - T type N - S type PET 10 m PET 30 m PET 5 m PET 10 m NASBIS NASBIS NASBIS NASBIS Adhesive 6 m Adhesive 6 m Adhesive 6 m Adhesive 6 m Structure Heatproof temperature 100 m 500 m 1000 m NASBIS and PGS Composit Type Normal type Type Structure Heatproof temperature PGS PGS PGS PGS PET 10 m PET 30 m Adhesive 30 m Adhesive 10 m 100 C 100 C 100 C 100 C 100 m Standard Part No. EYGN0912Q6X EYGN0912Q6W EYGN0912Q6T EYGN0912Q6S 500 m Standard Part No. EYGN0912Q4X EYGN0912Q4W EYGN0912Q4T EYGN0912Q4S 1000 m Standard Part No. EYGN0912Q3X EYGN0912Q3W EYGN0912Q3T EYGN0912Q3S N - X type N - W type N - T type N - S type PET 10 m PET 30 m PET 5 m PET 10 m PGS PGS PGS PGS Adhesive 6 m Adhesive 6 m Adhesive 6 m Adhesive 6 m NASBIS and PGS Composit Type Reversal type Type Structure Heatproof temperature NASBIS NASBIS NASBIS NASBIS PET 10 m PET 30 m Adhesive 30 m Adhesive 10 m 100 C 100 C 100 C 100 C 100 m Standard Part No. EYGN0912G6X EYGN0912G6W EYGN0912G6T EYGN0912G6S 500 m Standard Part No. EYGN0912G4X EYGN0912G4W EYGN0912G4T EYGN0912G4S 1000 m Standard Part No. EYGN0912G3X EYGN0912G3W EYGN0912G3T EYGN0912G3S Minimum order 10 pcs. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 May. 2016 - 37 - "NASBIS" Insulating Sheet "NASBIS" (NAno Silica Baloon InSulator) Insulating Sheet Handling Precautions Safety Precautions * When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. * Do not use the products beyond the specifications described in this catalog. * This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. * Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault Our products may result in accidents or trouble when subjected to severe conditions of electrical, environmental and /or mechanical stress beyond the specified "Rating" and specified "Conditions" found in the Specifications. Please follow the recommendations in "Safety Precautions" and "Application Notes". Contact our engineering staff or the factory with any questions. 1. Safety Precautions 1.1 Our products shall be used within the specified operating temperature range. 1.2 Our products are destroyed easily, so don't scratch or rub with hard materials or touch on laminate surfaces. Please note about the damage due to use the sharp-edged tool (metal tweezers) when you use our products. 1.3 Please do not strongly bent or cut. 1.4 Lines or folds in our products may affect thermal conductivity. 1.5 Our products shall not be used with acid, alkali. Our products shall not be used in contact with a soldering iron at 400 C or more 1.6 Our products shall not be exposed to salt water or direct sunlight during use. Our products shall not be used in corrosive gases (hydrogen sulfide, sulfurous acid, chlorine, ammonia etc.). 1.7 Our products has been developed for general industry applications. Prior to using our products for special applications such as medical, work please contact our engineering staff or the factory. 1.8 Never touch our products during use because it may be extremely hot. 1.9 Please do not store the parts under a load. 1.10 Please do not use the parts at the status of hard foreign materials stuck such as metals. 2. Application notes 2.1 Use protective materials when handling and/or applying our products, do not use items with sharp edges as they might tear or puncture our products 2.2 Our products does not work properly if overheated. 2.3 Thermal conductivity is dependant on the way it is used. Test the adaptability of our products to your application before use. 2.4 Long term storage * Please stored at a temperature of between 80 degrees -20 degrees. * Our products shall not be stored under severe conditions of salt water, direct sunlight or corrosive gases (hydrogen sulfide, sulfurous acid, chlorine, ammonia etc.). * Our products shall not be stored near acid, alkali. <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 May. 2016 - 38 - "Graphite-PAD" high thermal conductivity in z-direction "Graphite-PAD" high thermal conductivity in z-direction Type: EYGT Graphite-PAD is a thermal interface material (TIM) that compatibly obtained excellent thermal conductivity in thickness direction (Z-axis direction) and high flexibility (deformable with a low load). The properties are greater than that of existing TIMs. The product is created by filling PGS Graphite Sheet into silicon resin. Features High thermal conductivity : 13 W/m K compressibility : 50 % (t=2 mm, Pressure 300 kPa) Thermal resistance: fit into uneven parts and provide excellent thermal resistance with a low load High reliability : correspond to -40 to 150 C and maintains long-term reliability Thickness range : 0.5/1.0/1.5/2.0/2.5/3.0 mm RoHS compliant Excellent Recommended applications Cooling of heat generating components, such as electronic devices, semiconductor memory device, etc. General-purpose inverter, medical equipment, and DSC Car-mounted camera, motor control unit, automotive lighting (LED), car navigation, luminous source of laser HUD Base station, IGBT module Explanation of Part Numbers Graphite-PAD (EYGT) 1 2 3 4 5 6 7 8 9 10 11 12 E Y G T 3 5 3 5 A 2 0 A Product Code Graphite-PAD 3535 7070 Dimension 35 mm x 35 mm 70 mm x 70 mm A Type Material code Thickness of PAD 30 3.0 mm 25 2.5 mm 20 2.0 mm 15 1.5 mm 10 1.0 mm 05 0.5 mm Ex. code Please confirm other condition separately. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Aug. 2016 - 39 - "Graphite-PAD" high thermal conductivity in z-direction Typical characteristics Test equipment/method Condition 0.5 1.0 1.5 2.0 3.0 Thermal resistance (C*cm2/W) TIM Tester 100 kPa 0.96 1.34 1.56 1.93 2.36 Compressibility (%) Thermal conductivity of Graphite-PAD with a unit (W/m*K) (including contact resistance) Thermal conductivity of the Graphite-PAD (W/m*K) Hardness TIM Tester 100 kPa (50 C) 5.78 10.29 17.46 17.8 17.9 TIM Tester 100 kPa 5.08 7.02 7.80 8.60 10.10 (ASTM D5470) 50 kPa (ASTM D2240) TYPE E Items Data Thickness (mm) 13 25 Adhesive Adhesive on both faces Volume resistivity (*cm) 40x105 (ASTM D257) Operating temperature range (C) -40 to 150 (D4-D10) Siloxane < 70 ppm Structure Embossed separator Graphite-PAD Separator Silicone resin Filler Thermal resistance and Compressibility Thickness 2.0 mm Thickness 3.0 mm Thickness 0.5 mm Thickness 1.0 mm Thickness 1.5 mm 3.0 70 2.5 60 Compressibility (%) Thermal resistance (Kcm2/W) Thickness 0.5 mm Thickness 1.0 mm Thickness 1.5 mm 2.0 1.5 1.0 0.5 0 0 100 200 300 Pressure (kPa) Thickness 2.0 mm Thickness 3.0 mm 50 40 30 20 10 0 400 0 100 200 300 Pressure (kPa) 400 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Aug. 2016 - 40 - "Graphite-PAD" high thermal conductivity in z-direction Composition example Embossed separator Graphite-PAD Structure Separator Operating temperature range 0.5 mm 1.0 mm 1.5 mm 2.0 mm 2.5 mm 3.0 mm -40 C to 150 C 35 x 35 mm 70 x 70 mm Standard Part No. EYGT3535A05A EYGT7070A05A Thickness 0.5 mm 0.5 mm Standard Part No. EYGT3535A10A EYGT7070A10A Thickness 1.0 mm 1.0 mm Standard Part No. EYGT3535A15A EYGT7070A15A Standard dimension Thickness 1.5 mm 1.5 mm Standard Part No. EYGT3535A20A EYGT7070A20A Thickness 2.0 mm 2.0 mm Standard Part No. EYGT3535A25A EYGT7070A25A Thickness 2.5 mm 2.5 mm Standard Part No. EYGT3535A30A EYGT7070A30A Thickness 3.0 mm 3.0 mm Part numbers listed above are all standard samples for your consideration. Contact us for custom-made samples. We can make samples in various forms and/or dimensions other than standard samples. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Aug. 2016 - 41 - "Graphite-PAD" high thermal conductivity in z-direction "'Graphite-PAD" high thermal conductivity in z-direction Handling Precautions Safety Precautions * When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. * Do not use the products beyond the specifications described in this catalog. * This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. * Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault Graphite-PAD may result in accidents or trouble when subjected to severe conditions of electrical, environmental and /or mechanical stress beyond the specified "Rating" and specified "Conditions" found in the Specifications. Please follow the recommendations in "Safety Precautions" and "Application Notes". Contact our engineering staff or the factory with any questions. 1. Safety Precautions 1.1 1.2 1.3 1.4 The Graphite-PAD shall be used within the specified operating temperature range. The Graphite-PAD is soft, do not rub or touch it with rough materials to avoid scratching it. Lines or folds in the Graphite-PAD may affect thermal conductivity. The Graphite-PAD shall not be used with acid. The Graphite-PAD shall not be used in contact with a soldering iron at 150 C or more. 1.5 The Graphite-PAD shall not be exposed to salt water or direct sunlight during use. The Graphite-PAD shall not be used in corrosive gases (hydrogen sulfide, sulfurous acid, chlorine, ammonia etc.). 1.6 Our Graphite-PAD has been developed for general industry applications. Prior to using the Graphite-PAD for special applications such as medical, work please contact our engineering staff or the factory. 1.7 Never touch a Graphite-PAD during use because it may be extremely hot. 2. Application notes 2.1 Do not use items with sharp edges as they might tear or puncture the Graphite-PAD. 2.2 The Graphite-PAD does not work properly if overheated. 2.3 Thermal conductivity is dependant on the way it is used. Test the adaptability of Graphite-PAD to your application before use. 2.4 The Graphite-PAD has conductivity. Use the product at a position/place where you do not need any insulation. 2.5 Long term storage * The Graphite-PAD shall not be stored under severe conditions of salt water, direct sunlight or corrosive gases (hydrogen sulfide sulfurous acid, chlorine, ammonia etc.). * The Graphite-PAD shall not be stored near acid. <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Aug. 2016 - 42 - CAUTION AND WARNING 1. The electronic components contained in this catalog are designed and produced for use in home electric appliances, office equipment, information equipment, communications equipment, and other general purpose electronic devices. Before use of any of these components for equipment that requires a high degree of safety, such as medical instruments, aerospace equipment, disaster-prevention equipment, security equipment, vehicles (automobile, train, vessel), please be sure to contact our sales representative. 2. When applying one of these components for equipment requiring a high degree of safety, no matter what sort of application it might be, be sure to install a protective circuit or redundancy arrangement to enhance the safety of your equipment. In addition, please carry out the safety test on your own responsibility. 3. When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. 4. Technical information contained in this catalog is intended to convey examples of typical performances and/or applications and is not intended to make any warranty with respect to the intellectual property rights or any other related rights of our company or any third parties nor grant any license under such rights. 5. In order to export products in this catalog, the exporter may be subject to the export license requirement under the Foreign Exchange and Foreign Trade Law of Japan. 6. No ozone-depleting substances (ODSs) under the Montreal Protocol are used in the manufacturing processes of Automotive & Industrial Systems Company, Panasonic Corporation. Please contact Factory Device Solutions Business Division Automotive & Industrial Systems Company Panasonic Corporation 1006 Kadoma, Kadoma City, Osaka 571-8506, JAPAN The information in this catalog is valid as of September. 2016.