BAT60AE6327 - INFINEON TECHNOLOGIES AG

RCV e3

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Revision: 31-Jan-17 1Document Number: 20054

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High Voltage (up to 0.5 kV) Thick Film Chip Resistors

FEATURES

• High operating voltage (up to 500 V)

• Pure tin solder contacts on Ni barrier layer

provides compatibility with lead (Pb)-free and

lead containing soldering processes

• Metal glaze on high quality ceramic

• Material categorization: for definitions of

compliance please see www.vishay.com/doc?99912

Notes

• These resistors do not feature a lifetime limitation when operated within the limits of rated dissipation, permissible operating voltage and

permissible film temperature. However, the resistance typically increases due to the resistor’s film temperature over operating time, generally

known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional lifetime

•No marking

• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material

Note

(1) The power dissipation on the resistors generates a temperature rise against the local ambient, depending on the heat flow support of the

printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded

STANDARD ELECTRICAL SPECIFICATIONS

MODEL

CASE

SIZE

INCH

CASE

SIZE

METRIC

POWER

RATING

P70

LIMITINGELEMENT

VOLTAGE UMAX.

ACRMS/DC

TEMPERATURE

COEFFICIENT

± ppm/K

TOLERANCE

± %

RESISTANCE

RANGE



SERIES

RCV0805 e3 0805 RR 2012M 0.125 400 100 1 100K to 10M E24; E96

200 5 E24

RCV1206 e3 1206 RR 3216M 0.25 500 100 1 100K to 10M E24; E96

200 5 E24

TECHNICAL SPECIFICATIONS

PARAMETER UNIT RCV0805 RCV1206

Rated dissipation P70 (1) W 0.125 0.25

Limiting element voltage Umax. ACRMS/DC V 400 500

Insulation voltage Uins. (1 min) V > 500

Voltage coefficient of resistance chart ppm/V 25

Insulation resistance > 109

Operating temperature range °C -55 to +155

Weight mg 5.5 10

PART NUMBER AND PRODUCT DESCRIPTION

Part Number: RCV1206100KFKEA

MODEL RESISTANCE TOLERANCE TCR PACKAGING

RCV0805

RCV1206

K = thousand

M = million

F = ± 1 %

J = ± 5 %

K = ± 100 ppm/K

N = ± 200 ppm/K

EA, EB, EC

Product Description: RCV1206 100 100K 1 % ET1 e3

RCV1206 100 100K 1 % ET1 e3

MODEL TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE

RCV0805

RCV1206

± 100 ppm/K

± 200 ppm/K

100K = 100 k

10M = 10 M

± 1 %

± 5 % ET1, ET5, ET6 e3 = pure tin

termination finish

R C V 1 2 0 6 1 0 0 K F K E A

RCV e3

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Revision: 31-Jan-17 2Document Number: 20054

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FUNCTIONAL PERFORMANCE

PACKAGING

MODEL CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER

RCV0805

EA = ET1 5000

Paper tape acc. to

IEC 60068-3

Type I

8 mm 4 mm

180 mm/7"

EB = ET5 10 000 285 mm/11.25"

EC = ET6 20 000 330 mm/13"

RCV1206

EA = ET1 5000 180 mm/7"

EB = ET5 10 000 285 mm/11.25"

EC = ET6 20 000 330 mm/13"

DIMENSIONS

SIZE DIMENSIONS in millimeters

SOLDER PAD DIMENSIONS in millimeters

REFLOW SOLDERING WAVE SOLDERING

INCH METRIC L W H T1 T2 a b l a b l

0805 2012 2.0 + 0.20

- 0.10 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20

- 0.10 0.3 ± 0.2 0.7 1.3 1.2 0.9 1.3 1.3

1206 3216 3.2 + 0.10

- 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 1.7 2.0 1.1 1.7 2.3

Derating

Ambient Temperature in

amb

Fraction of Rated Dissipation P

- 50 0 50 100 150

100

70 °C

RCV e3

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Revision: 31-Jan-17 3Document Number: 20054

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1

CLAUSE

IEC 60068-2

TEST METHOD TEST

PROCEDURE REQUIREMENTS

PERMISSIBLE CHANGE (R)

Stability for product types: 100 k to 10 M

RCV e3

4.5 - Resistance - ± 1 % ± 5 %

4.13 - Short time

overload

U = 2.5 x

 2 x Umax.;

± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )

Style Duration

RR2012M 1 s

RR3216M 2 s

4.17.2 58 (Td) Solderability

Solder bath method;

Sn60Pb40

non-activated flux;

(235 ± 5) °C

(2 ± 0.2) s

Good tinning

( 95 % covered);

no visible damage

Solder bath method;

Sn96.5Ag3Cu0.5

non-activated flux;

(245 ± 5) °C

(3 ± 0.3) s

Good tinning

( 95 % covered);

no visible damage

4.8.4.2 - Temperature

coefficient

(20 / -55 / 20) °C and

(20 / 155 / 20) °C ± 100 ppm/K ± 200 ppm/K

4.32 21 (Uu3) Shear (adhesion) 17.7 N No visible damage

4.33 21 (Uu1) Substrate bending Depth 2 mm;

3 times

No visible damage, no open circuit in bent position

± (0.25 % R + 0.05 )

4.19 14 (Na) Rapid change of

temperature

30 min. at -55 °C;

30 min. at 125 °C

5 cycles ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )

1000 cycles ± (1 % R + 0.05 )± (1 % R + 0.05 )

4.23 - Climatic sequence: -

± (1 % R + 0.05 )± (2 % R + 0.1 )

4.23.2 2 (Ba) Dry heat 125 °C; 16 h

4.23.3 30 (Db) Damp heat, cyclic 55 °C;  90 % RH

24 h; 1 cycle

4.23.4 1 (Aa) Cold -55 °C; 2 h

4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h

4.23.6 30 (Db) Damp heat, cyclic 55 °C; . 90 % RH

24 h; 5 cycle

4.23.7 - DC load U =

4.25.1 - Endurance

at 70 °C

U =  Umax.;

1.5 h on; 0.5 h off;

70 °C; 1000 h ± (1 % R + 0.05 )± (2 % R + 0.1 )

70 °C; 8000 h ± (2 % R + 0.1 )± (4 % R + 0.1 )

4.18.2 58 (Td) Resistance to

soldering heat

Solder bath method

(260 ± 5) °C;

(10 ± 1) s

± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )

4.24 78 (Cab) Damp heat,

steady state

(40 ± 2) °C;

(93 ± 3) % RH;

56 days

± (1 % R + 0.05 )± (2 % R + 0.05 )

P70 x R

RCV e3

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Revision: 31-Jan-17 4Document Number: 20054

For technical questions, contact: thickfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

All tests are carried out in accordance with the following specifications:

• EN 60115-1, generic specification

• EN 140400, sectional specification

• EN 140401-802, detail specification

• IEC 60068-2-x, environmental test procedures

4.25.3 - Endurance at upper

category temperature 155 °C; 1000 h ± (1 % R + 0.05 )± (2 % R + 0.05 )

4.40 -

Electrostatic

discharge

(human body model)

IEC 61340-3-1;

3 pos. + 3 neg. discharges;

ESD voltage acc. to style

± (1 % R + 0.05 )

4.29 45 (XA) Component solvent

resistance

Isopropyl alcohol;

50 °C; method 2 No visible damage

4.30 45 (XA) Solvent resistance

of marking

Isopropyl alcohol;

50 °C; method 1, toothbrush Marking legible, no visible damage

4.22 6 (Fc) Vibration, endurance

by sweeping

f = 10 Hz to 2000 Hz;

x, y, z  1.5 mm;

A  200 m/s2;

10 sweeps per axis

± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )

4.37 - Periodic electric

overload

U =

 2 x Umax.;

0.1 s on; 2.5 s off;

1000 cycles

± (1 % R + 0.05 )

4.27 -

Single pulse high

voltage overload,

10 μs/700 μs

Û = 10 x

 2 x Umax.;

10 pulses

± (1 % R + 0.05 )

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1

CLAUSE

IEC 60068-2

TEST METHOD TEST

PROCEDURE REQUIREMENTS

PERMISSIBLE CHANGE (R)

Stability for product types: 100 k to 10 M

RCV e3

15 x P70 x R

P70 x R

Legal Disclaimer Notice

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Revision: 08-Feb-17 1Document Number: 91000

Disclaimer



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