Issue 2.2 1/61
STPC® CLIENT
PC Compatible Embedded Microprocessor
October 13, 2000
Figure 1. Logic Diagram
POWERFUL X86 PROCESSOR
64-BIT 66MHz BUS INTERFACE
64 -BIT DRAM CONTROLLER
SVG A G R A PHI CS C ONTROLLER
UMA ARCHITECTURE
VIDE O SCAL ER
•VIDEO OUTPUT PORT
VIDEO INPUT PORT
CRT CONTROLLER
1 35 MHz RAMDAC
2 OR 3 LINE FLICKER FILTER
SCAN CONVERTER
PCI MASTER / SLAVE / ARBITER
ISA MASTER/SLAVE
IDE CONTROLLER
DMA CONTROLLER
INTERRUPT CONTROLLER
TIMER / COUNTERS
POWER MANAGEMENT
STPC CLIENT OVERVIEW
The STPC Client integrates a standard 5th
generation x86 core, a DRAM controller, a
graphics subsystem, a video pipeline, and
support logic including PCI, ISA, and IDE
controllers to provide a single Consumer
orientated PC compatible subsystem on a single
device.
The device is based on a tightly coupled Unified
Memory Architecture (UMA), sharing the same
memory array between the CPU main memory
and the graphics and video frame buff ers.
Extra facilities are implemented to handle video
streams. Features include smooth scaling and
colour space conversion of the video input stream
and mixing of the video stream with non-video
data from the fram e buffer. The chip also i ncludes
anti-flicker filters to provide a stable, high-quality
Digital TV output.
The STPC Client is packaged in a 388 Plastic Ball
Grid Array (PBGA ).
PBGA388
x86
Core
Host I/F
DRAM
VIP
PCI
PCI BUS
ISA
EID
PCI
ISA BUS
CRT HW
Monitor
TV Output
SY NC Out pu t
Col-
Col-
our
Vid-
CCIR Input
EIDE
2D
Anti-
IPC
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STPC CLIENT
2/61 Issue 2.2 - October 13, 2000
X86 Processo r core
F ully static 32-bit 5-stage pipeline, x86 proc-
essor with DO S, Windows and UNIX compa t-
ibility.
Can access up to 4GB of e xternal memory.
KB ytes unified instruction and data cache
with write back and write th rough capabil ity.
Parallel processing integral floating point unit,
with automatic power down.
Cl ock core speeds up to of 75 MH z.
F ully static design for dynam ic clock control.
Low power and system m anage men t modes.
O ptimi zed design for 3.3V operation.
DRAM Controller
Integrated system memory and graphic frame
memory.
Support s up to 128 MBytes system memory
in 4 banks and as little as MB ytes.
Supports 4MBytes, 8MBites, 16MBites,
32MBites single-sided and double-sided
DRAM SIMMs.
Four quad-word write buffers for CPU to
DRAM and PCI to DRAM cycles.
Four 4-word read buffers for PCI masters.
Support s Fast Page Mode & EDO DRAMs.
Programm able timing for DRAM parameters
including CAS pulse width, CAS pre-charge
time, and RAS to CAS delay.
60, 70, 80 & 100ns DRAM speeds.
M em ory hole size of 1 MByte to 8 MBy tes
supported for PCI/ISA buses.
Hi dden refresh.
To check if your memory device is supported by
the STPC, please refer to Table 6-69 in the
Programming Manual.
Graphics Controller
64-bit windows accelerator.
Backward compatibility to SV GA standards.
Hardware acceleration for text, bitblts , trans-
pare nt blts and fills.
Up to 64 x 64 bit grap hics hardware cursor.
Up to 4MB long linear frame buffer.
8-, 16-, and 24-bit pixels.
CRT Controller
Integrated 135MHz triple RAMDAC allowing
up to 1024 x 768 x 75Hz display.
8-, 16-, 24-bit per pixels.
Int erla ced or non-inter laced out put.
Vide o Pipe line
Two-tap interpol ative horizontal filter.
Two-tap interpol ative vertical filter.
Co lour space conversion (RGB to YUV and
YUV to RGB).
Programmable window size.
Ch ro ma and colou r keying allow ing video
overlay.
Programm able two tap filter with gamma cor-
rection or three tap flicker filter.
Progres sive to interlaced scan converter.
Video Input port
De cod es video inputs in ITU-R 601/656 com-
patible form at s.
O ptional 2:1 dec imator
St ores captured video in off setting area of
the onboa rd frame buffer.
Vide o pass through to the onboard PAL /
NTSC encoder for full screen video images.
HSY NC and B/T gen eration or lock onto
external video timing so urce.
PCI Controlle r
Int egrated PCI arbitration interface able to
directly manage up to 3 PCI masters at a
time.
Translation of PCI cycles to ISA bus.
Tr a ns lation of ISA maste r initia te d cycle to
PCI.
Support for burst read/write from PCI master.
The PCI clock runs at a third or half CPU
clock speed.
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STPC CLIE NT
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IS A master/slav e
T he ISA clock generated from either
14 .3 18MHz o s c illa t or cl o ck or P C I clo ck
Support s programmable ex tra wait state for
ISA cycles
Supports I/O recovery time for back to back I/
O cycles .
Fast Gate A2 0 and Fast reset.
Support s the single ROM that C, D, or E.
blocks shares with F block BIOS ROM.
Support s flash ROM.
Buffered DMA & I SA master cycl es to reduce
bandwidth utilization of the PCI and Host bus.
IDE Inte rface
Supports PIO
Supports up to Mode 5 Timings
Supports up to 4 IDE devices
Individual drive timing for all four IDE devices
Co ncu rrent channel operation (PIO modes) -
4 x 32-Bit Buffer FIFO per channel
Support for PIO mode 3 & 4
Support for 11.1/16.6 MB/s, I/O Channel
Ready PIO data transfers.
Support s both lega cy & native IDE modes
Supports hard drives larger than 528MB
Support for CD-ROM and tape peripherals
Backward compatibility with IDE (ATA-1).
Integrated peripheral contr oller
2X8237/AT compatible 7-channel DMA con-
troller.
2X8259/AT compatible interrupt Controller.
16 interrupt inputs - ISA and PCI.
T hree 8254 com patible Timer/Counters.
Power Management
Four power saving modes: On, Doze, Stand-
by, Suspend.
Programmable system activity detector
Supports SMM.
Supports ST OPCLK.
Support s IO trap & resta rt .
Independent peripheral time-out timer to
moni tor hard disk, serial & parallel port s.
Supports RTC, interrupts and DMAs wake-up
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UPDATE HISTORY FOR OVERVIEW
Issue 2.2 - October 13, 2000 5/61
UP DATE H ISTORY FOR OVERV IEW
The follow ing changes have been made to the Board Layout Chapter on 02/02/2000 .
The follow ing changes have been made to the Board Layout Chapter from Revision 1.0 to Release 1.2.
Section Change Text
Added To check if your memory device is supported by the STPC, please refer to
Table 6-69 Host Address to MA Bus Mappin
g
in the Programm ing M anual.
Section Change Text
N/A Replaced “f ully P C compatibleWith “with DOS, Windows and UNIX compatibility”
N/A Replaced “133 MHz” With 75 MHz”
N/A Removed “Dr ivers for Windows and other operating systems.”
N/A Removed Requires external frequency synthesizer and reference sources.”
N/A Replaced Chroma and co lour keying for integrated video overlay.” With “Chroma and colour
keying allowing video overlay.
N/A Replaced “Accepts video inputs in CCIR 601/656 or ITU-R 601/656, and decodes the
stream.” WithDecodes video inputs in ITU-R 601/656 comp atible form at s.
N/A Replaced
“Fully compliant with PCI 2.1 specification.
Integrated PCI arbitration interface. Up to 3 masters can connect directly.
External PA L allows for greater than 3 masters.”
With
“Integrated PCI arbitration interface able to directly manage up to 3 PCI
mast ers at a time.”
N/A Replaced “0.33X and 0.5X CPU clock PCI clock.” With “The PCI clock runs at a third or
half CPU clock speed.”
N/A Removed “Suppo rt s flash ROM.”
N/A Replaced “Suppo rt s ISA hidden refresh. ” With “Supports flash RO M .”
N/A Replaced Buffered DMA & ISA master cycles to reduce bandwi dth utilization of the PCI
and Host bus. NSP compliant.” With “Buffered DMA & ISA master cycles to
reduce bandwidth utilization of the PCI and Host bus. “
N/A Replaced Supp orts PIO and Bus Mas ter IDE” With “Sup ports PIO”
N/A Removed “Transfer Rates to 22 MByt es/sec”
N/A Added “Individual dri ve timing for all four IDE devices
N/A Replaced
“Concurrent channel operation (PIO & DMA modes) - 4 x 32-Bit Buffer FIFO
per channe l”
With
“Concurrent channel operation (PIO modes) - 4 x 32-Bit Buffer FIFO per
channel”
N/A Removed
“Support for DMA mode 1 & 2.
“Suppo rt for 11.1/16.6 MB/s, I/O Channel Ready PIO data transfers.”
“Suppo rt s 13.3/16.6 MB/s DM A data transfers”
“Bus Master with scatter/gather capability “
“Multi-word DMA suppor t for fast IDE dr ives
“Individual dri ve timing for all four IDE devices
“Suppo rt s both legacy & native IDE modes”
“Suppo rt s hard dr ives larger than 528M B”
“Support for CD-ROM and tape peripherals”
“Backward compatibility with IDE (ATA-1).”
“Dr ivers for Windows and other OSes”
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UPDAT E HIST ORY FOR OVERVIEW
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N/A Added
“Suppo rt for 11.1/16.6 MB/s, I/O Channel Ready PIO data transfers.”
“Suppo rt s both legacy & native IDE modes”
“Suppo rt s hard dr ives larger than 528M B”
“Support for CD-ROM and tape peripherals”
“Backward compatibility with IDE (ATA-1).”
N/A Removed “Co-processor error support logic.”
N/A Replaced “Supports S M M and APM” Wit h “Support s SMM”
N/A Removed “Slow system cloc k do wn to 8MHz”
“Slow Ho st clock down to 8Hz”
“Slow graphic clock down to 8Hz”
Section Change Text
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GENERAL DESCRIPTION
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1. GENER AL DESCRIP TION
At the heart of the STPC Client is an advanced
processor block, dubbed the ST X86. The ST X86
includes a powerful x86 processor core along with
a 64-bit DRAM controller, advanced 64bit acceler-
ated graphics and video controller, a high speed
PCI local-bus controller and Industry standard PC
chip set functions (Interrupt controller, DMA Con-
troller, Interval timer and ISA bus) and EIDE con-
troller.
The STPC Client has in addition to the 5ST86 a
Video subsystem and high quality digital Televi-
sion output.
The STMicroelectronics x86 processor core is em-
bedded wit h stan dard and appli catio n specif ic pe-
ripheral modules on the same silicon die. The core
has all the functionality of the ST Microele ctronics
standard x86 processor products, including the
low power System Manage ment Mode (SMM).
System Management Mode (SMM) provides an
additional interrupt and address space that can be
used for system power management or software
transparent emulation of peripherals. While run-
ning in isolated SMM address space, the SMM in-
terrupt r outine can execute without interfering with
th e oper ating system or applica ti o n progra ms.
Further power management facilities include a
suspend mode that can be initiated from either
hardware or software. Because of the static nature
of the core, no internal data is lost.
The STPC Client makes use of a tightly coupled
Unified Memory Architecture (UMA), where the
same memory array is used for CPU main memo-
ry and graphics frame-buffer. This significantly re-
duces total system memory with system perform-
ances equa l to th at o f a comparable sol ution with
separate frame buffer and system memory. In ad-
dition, memory bandwidth is improved by attach-
ing the graph ics engine d irectly to t he 64-bi t proc-
essor host interface running at the speed of the
processor bus rather than the traditional PCI bus.
The 64-bit wide memory array provides the sys-
tem w ith 320M B /s peak bandwidth, double that of
an equi vale nt system us ing 32 bits. This all ows for
higher screen resolutions and greater colour
depth. The processor bus runs at the speed of the
processor (DX devices) or half the speed ( DX2 de-
vices).
The ‘standard’ PC chipset functions (DMA, inter-
rupt controller, timers, power management logic)
are integrated with the x86 processor core.
The PCI bus is the ma in data comm unication link
to the STPC Client chip. The STPC Client trans-
lates appropriate host bus I/O and Memory cycles
onto the PCI bus. It also supports the ge neration
of Configuration c ycles on the PCI bus. T he STPC
Client, as a PCI bus agent (host bridge class), full y
complies with PCI specification 2.1. The chip-set
also implements the PCI mandatory header regis-
ters in Type 0 PCI configuration space for easy
porting of PCI aware system BIOS. The device
contains a PC I arbitration func tion for t hree ex ter-
nal PCI devices.
The STPC Client integrates an ISA bus controller.
Peripheral modules such as parallel and serial
communications ports, keyboard controllers and
additional ISA devices can be accessed by the
STPC Client chip set through this bus.
An industry standard EIDE (ATA 2) controller is
built into the STPC Client and connected internally
via the PCI bus.
Graphics functions are controlled by the on-chip
SVGA controller and the monitor display is man-
aged by the 2D graphics display engine.
This Graphics Engine is tuned to work with the
host CPU to provide a balanced graphics system
with a low silicon area cost. It performs limited
graphics drawing ope rations, which include hard-
ware acceleration of text, bitblts, transparent blts
and fills. These operations can operate on off-
screen or o n-screen areas. T he fram e buffer size
is up to 4 MBytes anywhere in the physical main
memory.
The graphics resolution supported is a maximum
of 1280x1024 in 65536 colours at 75Hz refresh
rate and is VGA and SVGA compatible. Horizontal
timing fiel ds are VGA compatible while t he vertical
fields are extended by one bit to accommodate
above display resolution.
STPC Client provides s everal addi tional funct ions
to handle MPEG or similar video streams. The
Video Input Port accepts an enc oded dig ital video
stream in one of a number of industry standard
formats, decodes it, optionally decimates it by a
factor of 2:1, and deposits it into an off screen area
of the frame buffer. An interrupt request can be
generated w hen an ent ire fiel d or f ram e has been
captured.
The video output pipeline incorporates a video-
scaler and colour space converter function and
provisions in the CRT controller to display a video
window. While repainting the screen the CRT con-
troller fetches both the video as well as the normal
non-video frame buffer in two separate internal
FIFOs (256-Bytes each). The video stream can be
colour-space converted (optionally) and smooth
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GENERAL DESCRIPTION
8/61 Issue 2.2 - October 13, 2000
scaled. Smooth interpolative scaling in both hori-
zontal and vertical direction are implemented. Col-
our and Chroma key functions are also imple-
mented to allow mixing video stream with non-vid-
eo frame buffer.
The video output passes directly to the RAMDAC
for monitor output or through another optional col-
our space converter (RGB to 4:2:2 YC rCb ) to the
programma ble anti-flicker filter. The flicke r filter is
configured as either a two line filter with gamma
correction (primarily designed for DOS type text)
or a 3 line flicker filter (primarily d esigned for Win-
dows type displays). The flicker filter is optional
and can be software disabled for use with large
screen area’s of video.
The Video output pipeline of the STPC Client in-
terfaces directly to the external digital TV encoder
(STV0119). It takes a 24 bit RGB non-interlaced
pixel stream and converts to a multiplexed 4:2:2
YCrCb 8 bit output stream, the logic includes a
progressive to interlaced scan converter and logic
to insert appropriate CCIR656 timing reference
codes into the output stream. It facilitates the high
quality display of VGA or full screen video streams
received via the Video input port to standard
NTSC or PAL televisions.
The STPC Client core is compliant with the Ad-
vanced Power Management (APM) specification
to provide a standard method by which the BIOS
can control the power used by personal comput-
ers. The Power Management Unit module (PMU)
controls the power consumption by providing a
comprehensive set of features that control the
power usage and supports compliance with the
United States Environmental Protection Agen cy's
Energy Star Computer Program. The PMU pro-
vides following hardware structures to assist the
software in managing the power consumption by
th e syste m.
- System Activity Detection.
- 3 power-down timers detecting system inactivity:
- Doze timer (short durations).
- Stand-by timer (medium durat ions).
- Suspend timer (long duration s).
- House-keeping activity detection.
- House-keeping timer to cope with short bursts
of house-keeping activity while dozing or in stand-
by state.
- Peripheral activity detection.
- Peripheral timer detecting peripheral inactivity
- SUSP# modulation to adjust the system per-
formance in various power down states of the sys-
tem including full power on state.
- Power control outputs to disable power from dif-
ferent planes of the board.
Lack of system activity for progressively longer
period of times is detected by the three power
down timers. These timers can generate SMI in-
terrupts to CPU so that the SMM software can put
the system in decreasing states of power con-
sump ti o n. Alte rn atively, system acti vit y in a power
down state can generate SMI interrupt to allow the
software to bring the system back up to full power
on state. The chip-set supports up to three power
down states: Doze state, Stand-by state and Sus-
pend mode. These correspon d to d ecre asing lev-
els o f power savings.
Power down puts the STPC Client into suspend
mode. The processor completes execution of the
current instruction, any pending decoded instruc-
tions and associated bus cycles. During the sus-
pend mode , interna l clocks are stopped. remov-
ing power down, the processor resumes instruc-
tion fetching and begins execution in the instruc-
tion stream at the point it had stopped.
A reference design for the STPC Client is availa-
ble including the schematics and layout files, the
design is a P C AT X motherb oard de sign. The de-
sign is av ailab le as a dem ons tr ation bo ard f or ap-
plication and system developm ent .
The STPC Client is supported by several BIOS
vendors, including the super I/O device used in
the reference design. Drivers for 2D accelerator,
video features a nd EIDE are available on various
operating system s.
The STPC Client has been designed using mod-
ern reusable modular design techniques, it is pos-
sible to a dd to or rem ov e the s t andard fea tures of
the STPC Client or other variants of the 5ST86
family. Contact your local STMicroelectonics sales
office for further information.
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GENERAL DESCRIPTION
Issue 2.2 - October 13, 2000 9/61
Figure 1-1. Functional description.
x86
Core
Host I/F
DRAM
2D
SVGA
VIP
PCI m/s PCI BUS
CRTC HW Cursor
Monitor
TV Output
SYNC Output
Anti-Flicker
Colour Space
Colour
Key
Chroma
Video
pipeline
CCIR Input
ISA
EIDE
PCI m/s
ISA BUS
IPC
EIDE
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GENERAL DESCRIPTION
10/61 Issue 2.2 - October 13, 2000
Figure 1-2. Pictorial Block Diagram Typ ical Application
STPC C lient
ISA
PCI
4x 16-bit EDO DRAMs
Super I/O
2x EIDE
Flash
Keyboard / Mouse
Seri a l Port s
Parall el Port
Floppy
Monitor
TV
STV0119
Video
SVGA
CCIR601
CCIR656
S-VHS
RGB
PAL
NTSC
IRQ
DMA.REQ
DMA.ACK
DMUX
DMUX
MUX
MUX
RTC
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PIN DESCRIPTION
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2. PI N DESCRI PTIO N
2.1. INTRODUCTION
The STPC Client integrates most of the functional-
ities of the PC architecture. As a result, many of
the traditional interconnections between the host
PC microprocessor and the peripheral devices are
totally assimilated to the STPC Client. This offers
improved performance due to the tight coupling of
the processor core and its peripherals. As a result
many of the external pin connections are made di-
rectly to the on-chip peripheral functions.
Fi
g
ure 2-1 shows the STPC Client’s external inter-
faces. It defines the main busses and their func-
tion. Ta ble 2- 1 describes the physical implementa-
tion listing signals type and their functional ity. Ta-
ble 2-2 provides a full pin listing and description of
the pins. T able 2-3 provid es a full listing of pin lo-
cations of the STPC Client package by physical
connection. Please refer to the pin allocation
drawing for reference.
Note: Several interface pins are multiplexed with
other functions, refer to the Pin Description sec-
tion for further details
Table 2-1. Signal Description
Group name Qty
Basic Clocks reset & Xtal (SYS) 14
Memory Interface (DRAM) 89
PCI interface (excluding VDD5) 54
ISA / IDE / IPC combined interface 83
Video Input (VIP) 9
TV Output (TV) 10
VGA Monitor interface (VGA) 10
Grounds 69
VDD 26
Analog speci fic VCC/VDD 14
Reserved/Test/ Misc./ Speaker 10
Total Pin Count 388
Figure 2-1. STPC C lient Externa l Interfaces
SOUTHNORTH PCI
X86
DRAM VGA VIP TV SYS ISA/IDE IPC
89 10 9 10 54 14 73 10
STPC CL IENT
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PIN DESCRIPTION
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Table 2-2. Def i ni tion of Signa l Pin s
Signal Name Dir Descripti on Qty
BASIC CLOCKS RESETS & XTAL
SYSRSTI# I System Reset / Power good 1
SYSRSTO#* O Reset Output to System 1
XTALI I 14.3MHz External Oscillator Input 1
XTALO I/O 14.3MHz External Oscillator Input 1
PCI_CLKI I 33MHz PCI Input Clock 1
PCI_CLKO O 33MHz PCI Output Clock (from internal PLL) 1
ISA_CLK O ISA Clock Output - Multiplexer Select Line For IPC 1
ISA_CLK2X O ISA Clock x 2 Output - Multiplexer Select Line For IPC 1
OSC14M* O ISA bus synchronisation clock 1
HCLK* O Host Clock (Test) 1
DEV_CLK O 24MHz Peripheral Clock (floppy drive) 1
GCLK2X* I/O 80MHz Graphics Clock 1
DCLK* I/O 135MHz Dot Clock 1
DCLK _DIR* I Dot Clock Direction 1
VDD_xxx_PLL Power Supply for PLL Clocks
MEMORY INTERFACE
MA[11:0] O Memory Address 12
RAS#[3:0] O Row Address Strobe 4
CAS#[7:0] O Column Address Strobe 8
MWE# O Write Enable 1
MD[63:0]* I/O Memory Data 64
PCI INTERFACE
AD[31:0]* I/O PCI Address / Data 32
CBE[3:0]* I/O Bus Commands / Byte Enables 4
FRAME#* I/O Cycle Frame 1
TRDY#* I/O Target Ready 1
IRDY#* I/O Initiator Ready 1
STOP#* I/O Stop Transaction 1
DEVSEL#* I/O Device Select 1
PAR* I/O Parity Signal Transactions 1
SERR#* O System Error 1
LOCK# I PCI Lock 1
PCI_REQ#[2:0]* I PCI Request 3
PCI_GNT#[2:0]* O PCI Grant 3
PCI_INT[3:0]* I PCI Interrupt Request 4
VDD5 I 5V Power Supply for PCI ESD protection 4
ISA AND IDE COMBINED ADDRESS/DATA
LA[23:22]*/ SCS3#,SCS1# I/O Unlatched Address (ISA) / Secondary Chip Select (IDE) 2
LA[21:20]*/ PCS3#,PCS1# I/O Unlatched Address (ISA) / Primary Chip Select (IDE) 2
LA[19:17]*/ DA[2:0] O Unlatched Address (ISA) / Address (IDE) 3
RMRTCCS#* / DD[15] I/O ROM/RTC Chip Select / Data Bus bit 15 (IDE) 1
KBCS#* / DD[14] I/O Keyboard Chip Select / Data Bus bit 14 (IDE) 1
Note; * denotes theat the pin is V5T (see Sec tion 4. )
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PIN DESCRIPTION
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RTCRW#* / DD[13] I/O RTC Read/Write / Data Bus bit 13 (IDE) 1
RTCDS#* / DD[12] I/O RTC Data Strobe / Data Bus bit 12 (IDE) 1
SA[19:8]* / DD[11:0] I/O Latched Address (ISA) / Data Bus (IDE) 16
SA[7:0] I/O Latched Address (IDE) 4
SD[15:0]* I/O Data Bus (ISA) 16
ISA/IDE COMBINED CONTROL
IOCHRDY* / DIORDY I/O I/O Channel Ready (ISA) - Busy/Ready (IDE) 1
ISA CONTROL
ALE* O Address Latch Enable 1
BHE#* I/O System Bus High Enable 1
MEMR#*, MEMW#* I/O Memory Read and Memory Write 2
SMEMR#*, SMEMW#* O System Memory Read and Memory Write 2
IOR#*, IOW#* I/O I/O Read and Write 2
MASTER#* I Add On Card Owns Bus 1
MCS16#*, IOCS16#* I Memory/IO Chip Select16 2
REF#* O Refresh Cycle. 1
AEN* O Address Enabl e 1
IOCHCK #* I I/O Channel Check. 1
ISAOE#* O Bidirectional OE Control 1
GPIOCS#* I/O General Purpose Chip Select 1
IDE CONTROL
PIRQ* I Primary Interrupt Request 1
SIRQ* I Secondary Interrupt Request 1
PDRQ* I Primary DMA Request 1
SDRQ* I Secondary DMA Request 1
PDACK#* O Primary DMA Acknowledge 1
SDACK#* O Secondary DMA Acknowledge 1
PIOR#* I/O Primary I/O Read 1
PIOW#* O Primary I/O Write 1
SIOR#* I/O Secondary I/O Read 1
SIOW#* O Secondary I/O Write 1
IPC
IRQ_MUX[3:0]* I Multiplexed Interrupt Request 4
DREQ_MUX[1:0]* I Multiplexed DMA Request 2
DACK_ENC[2:0]* O DMA Acknowledge 3
TC* O ISA Terminal Count 1
MONITOR INTERFACE
RED, GREEN, BLUE O Red, Green, Blue 3
VSYNC* O Vertical Synchronization 1
HSYNC* O Horizontal Synchronization 1
VREF_DAC I DAC Voltage reference 1
RSET I Resistor Set 1
COMP I Compensation 1
SCL / DDC[1]* I/O I²C Interface - Clock / Can be used for VGA DDC[1] signal 1
Table 2-2. Def i ni tion of Signa l Pin s
Signal Name Dir Descripti on Qty
Note; * denotes theat the pin is V5T (see Sec tion 4. )
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SDA / DDC[0]* I/O I²C Interface - Data / Can be used for VGA DDC[0] signal 1
VIDEO INPUT
VCLK* I Pixel Clock 1
VIN[7:0]* I YUV Video Data Input CCIR 601 or 656 8
DIGITAL TV OUTPUT
TV_YUV[7:0]* O Digital Video Outputs 8
ODD_EVEN* O Frame Synchronisation 1
VCS* O Horizontal Line Synchronisation 1
MISCELLANEOUS
ST[6:0] I/O Test/Misc. pins 7
CLKDEL[2:0]* I/O Reserved (Test/Misc pins) 3
Table 2-2. Def i ni tion of Signa l Pin s
Signal Name Dir Descripti on Qty
Note; * denotes theat the pin is V5T (see Sec tion 4. )
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PIN DESCRIPTION
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2.2.SIGNAL DESCRIPTIONS
2.2.1. BASIC CLOCKS RESETS & XTAL
PWGD
System Reset/Power good.
This input is
low when the reset switch is depressed. Other-
wise, it reflects the power supply’s power good
signal. PWGD is asynchronous to all clocks, and
acts as a negative active reset. The reset circuit
initiates a hard reset on the rising edge of PWGD.
XTALI
14.3MHz Pull Down (10 k
)
XTALO
14.3MHz External Oscillator Input
These
pins are the 14.318 MHz ex ternal oscillator in put;
This clock is used as the reference clock for the in-
ternal frequency synthesizer to generate the
HCLK, CLK24M, GCLK2 X and DCLK clocks.
Note: These pins are NOT 5V tolerant
(see Ta ble 4-2)
HCLK
Host Clock.
This is the host 1X clock. Its
frequency can vary from 25 to 75 MHz. All host
transactions and PCI transactions are synchro-
nized to this clock. This clock drives the DRAM
controller to execute the host transactions. In nor-
mal mode, this output clock is generated by the in-
ternal PLL.
GCLK2X
80MHz Graphics Clock.
This is the
Graphics 2X clo ck, which drives the graphics en-
gine and the DRAM controller to execute the
graphics and display cycles .
Normally GCLK2X is generated by the internal fre-
quency synthesizer, and this pin is an output. By
setting a bit in Strap Register 2, this pin can be
made an input so that an external clock can re-
place the internal frequency synthesizer.
DCLK
135MHz Dot Clock.
This is the dot clock,
which drives graphics di splay cycles. I ts frequency
can go from 8M Hz (using internal PLL) up to 135
MHz, and it is req uired to have a wors t case du ty
cycle of 60-40.
DCLK_DIR
Dot Clock Direct ion.
Spec if i es if DCL K
is an input (0) or an output (1).
DEV_CLK
24MHz Peripheral Clock Output.
This
24MHZ signal is provided as a convenience for
the system integration of a floppy disk driver func-
tion in an external chip.
2.2.2. ME MORY INTERFACE
MA[11:0]
Memory Address Output.
These 12 mul-
tiplexed memory address pins support external
DRAM with up to 4K refresh. These include all
16M x N and some 4M x N DRAM modules. The
address signals must be externally buffered to
support mo re than 16 D RAM chips. T he timing of
these signals can be adjusted by software to
match the timings of most DRAM modules.
MD[63:0]
Memory Data I/O.
This is the 64-bit
memory data bus. If only half of a bank is populat-
ed, MD63-32 is pulled high, data is on MD31-0.
MD[40-0] are read by the dev ice st rap option reg-
isters during rising edge of PWGD.
RAS#[3:0]
Row Address Strobe Output.
There
are 4 active low row address strobe outputs, one
for each bank of the memory. Each bank contains
4 or 8-Bytes of data. The memory controller allows
half of a ban k (4 Bytes) to be populated t o enable
memory upgrade at finer granularity.
The RAS# signals drive the SIMMs directly with-
out any external buffering. These pins are always
outputs, but they can also simultaneously be in-
puts, to all ow the memory controller to monitor the
value of the RAS# signals at the pins.
CAS#[7:0]
Column Address Strobe Output.
There
are 8 active low column address strobe outputs,
one for each Byte of the memory.
The CAS# s ignals drive the S IMMs either di re ctly
or through external buffers.
These pins are al ways outputs , but they can also
simultaneously be inputs, to allow the memory
controller to monitor the value of the CAS# signals
at the p ins.
MWE#
Write Enable Output.
Write enable speci-
fies whether the memory access is a read (MWE#
= H) or a write (MWE# = L). This single write ena-
ble controls all DRAMs. It can be externally buff-
ered to boost the maximum number of loads
(DRAM chips) supporte d.
The MWE# signals drive the SIMMs directly with-
out any external buffering.
2.2.3. VIDEO INPUT
VCLK
Pixel Clock Input.
VIN[7:0]
YUV Video Data Input CCIR 601 or 656.
Time multiplexed 4:2:2 luminance and chromi-
nance data as defined in ITU-R Rec601-2 and
Rec656 (except for T TL input le ve ls). This b us in-
terfaces with an M PE G vid eo decoder out put po rt
and typically carries a stream of Cb, Y, Cr, Y digit-
al video at V C LK f requency, clocked on t he rising
edge (by default) of VCLK. A 54-Mbit/s ‘double’
Cb, Y, Cr, Y input multiplex is supported for double
encoding applications (rising and falling edge of
CKREF ar e operating ).
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PIN DESCRIPTION
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2.2.4. TV OUT PUT
TV_YUV[7:0]
Digital video outputs.
ODD_EVEN
Frame Synchronization
.
VCS
Horizontal Line Synchronization
.
2.2.5. PCI INTERFACE
PCI_CLKI
33MHz PCI Input Clock
This signal is
the PCI bus clock input and should be driven from
the PCI_CLKO pin.
PCI_CLKO
33MHz PCI Output Clock.
Th is i s th e
maste r PCI bus clo ck outpu t.
AD[31:0]
PCI Addres s/Data .
This is the 32-bit PCI
multiplexed address and data bus. This bus is
driven by the master during the address phase
and data phase of write transactions. It is driven
by the target during data phase of read transac-
tions. Signals AD[12:11] for internal use only. Not
to be used for External PCI devices.
CBE#[3:0]
Bus Commands/Byte Enables.
These
are the multiplexed command and Byte enable
signals of the PCI bus. During the addres s phase
they define the command and during the data
phase they carry the Byte enable information.
These pins are inputs when a PCI master other
than the STPC Client owns the bus and outputs
when the STPC Client owns the bus.
FRAME#
Cycle Frame.
This is the frame signal of
the PCI bus. It is an input when a PCI master owns
the bus and is an output when STPC Client owns
the PCI bus.
TRDY#
Target Ready.
This is t he t arget ready sig-
nal of the PCI bus. It is driven as an output when
the STPC Client is the target of the current bus
transaction. It is used as an input when STPC Cli-
ent initiates a cycle on the PCI bus .
IRDY#
Initiator Ready.
This is the initiator ready
signal of the PCI bus. It i s used as an output when
the STPC Client initiates a bus cycle on the PCI
bus. It is used as an input during the PCI cycles
targeted t o the STPC Client to determine when the
current PCI master is ready to complete the cur-
rent tra nsaction.
STOP#
Stop Transaction.
Stop is used to imple-
ment the disconnect, retry and abort protocol of
the PCI bus. It is used as an input fo r the b us cy-
cles initiated by the STPC Client and is used as an
output when a P CI mas ter c ycle is target ed t o the
STPC Client.
DEVSEL#
I/O Device Select.
This signal is used
as an input when the STPC Client initiates a bus
cycle on the PCI bus to determine if a PCI slave
device has decoded itself to be the target of the
current transact ion. It is asserted as a n output ei-
ther when the STPC Client is the target of the cur-
rent PCI transaction o r when no other device as-
serts DEVSEL# prior to the subtractive decode
phase of the current PCI transaction.
PAR
Parity Signal Transactions.
This i s the parity
signal of the PCI bus. This signal is used to guar-
antee even parity across AD[31:0], CBE#[3:0],
and PAR. This signal is driven by the master dur-
ing the address phase and data phase of write
transactions. It is driven by the target during data
phase of read transactions. (Its assertion is identi-
cal to t hat of the AD bus delayed by one PCI clock
cycle)
SERR#
System Error.
This is the system error si g-
nal of the PCI bus. It may, if enabled , be a sserted
for one PCI clock cycle if the target aborts an
STPC Client initiat ed PCI transaction. Its assertion
by either the STPC Client or by another PCI bus
agent will trigger the assertion of NMI to the host
CPU. This is an open drain output .
LOCK#
PCI Lock.
This is the lock signal of the PCI
bus and is used to implement the exclusive bus
operations when acting as a PCI target agent.
PCI_REQ#[2:0]
PCI Reques t.
These pins are t he
three external PCI master request pins. They indi-
cate to the PC I arbiter that the external a gents re-
quire use of th e bus.
PCI_GNT#[2:0]
PCI Grant.
These pins indicate
that the PCI bus has been granted master, re-
questing it on its PCI_RE Q#.
2.2.6. ISA/IDE COMBINED ADDRESS/DATA
LA[23]/SCS3#
Unlatched Address (ISA) / Sec-
ondary Chip Select (IDE).
This pin has two func-
tions, dependin g on whet her the I SA bus is ac t ive
or the IDE bus is active.
When the ISA bus is active, this pins is ISA Bus
unlatched address bit 23 for 16-bit devices. W hen
ISA bus is accessed by any cycle initiated from
PCI bus, t his pin is in output m ode. When an ISA
bus master owns the bus, this pins is in input
mode.
When the IDE bus is active, this signals is used as
the active high secondary slave IDE chip select
signal. This signal is to be externally NANDed with
the IS A OE # signal be fore driving the ID E devices
to guarantee it is active only when ISA bus is idle.
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LA[22]/SCS1#
Unlatched Address (ISA) / Sec-
ondary Chip Select (IDE)
This pin has two func-
tions, depending on whet her the I SA bus is ac t ive
or the IDE bus is active.
When the ISA bus is active, this pin is ISA bus un-
latched address bit 22 for 16-bit devices. When
ISA bus is accessed by any cycle initiated from
PCI bus, th is pin is in output m ode. When an ISA
bus master owns the bus, this pin is in input mode.
When the IDE bus is active, this signal is used as
the active high secondary slave IDE chip select
signal. This signal is to be externally ANDed with
the IS A OE # signal be fore driving the ID E devices
to guarantee it is active only when ISA bus is idle.
LA[21]/PCS3#
Unlatched Address (ISA) / Primary
Chip Selec t (ID E).
This pin has two functions, de-
pending on whether the ISA bus is active or the
IDE bus is active.
When the ISA bus i s active, this pin is ISA B us un-
latched address bit 21 for 16-bit devices. When
ISA bus is accessed by any cycle initiated from
PCI bus, th is pin is in output m ode. When an ISA
bus master owns the bus, this pin is in input mode.
When the IDE bus is active, this signas is used as
the active high primary slave IDE chip sele ct sig-
nal. This signal is to be externally NANDed with
the IS A OE # signal be fore driving the ID E devices
to guarantee it is active only when ISA bus is idle.
LA[20]/PCS1#
Unlatched Address (ISA) / Primary
Chip Selec t (ID E).
This pin has two functions, de-
pending on whether the ISA bus is active or the
IDE bus is active.
When the ISA bus i s active, this pin is ISA B us un-
latched address bit 20 for 16-bit devices. When
the ISA bus is accessed by any cycle initiated from
PCI bus, th is pin is in output m ode. When an ISA
bus master owns the bus, this pin is in input mode.
When the IDE bus is active, this signals is used as
the active high primary slave IDE chip sele ct sig-
nal. This signal is to be externally NANDed with
the IS A OE # signal be fore driving the ID E devices
to guarantee it is active only when ISA bus is idle.
LA[19:17]/DA[2:0]
Unlatched Address (ISA) / Ad-
dress (IDE).
These pins are multi-function pins.
They are us ed as t he ISA bus unla tched address
bits [19:17] for ISA bus or the three address bits
for the IDE bus devices.
When used by the ISA bus, these pins are ISA bus
unlatched address bits 19-17 on 16-bit devices.
When the ISA bus is accessed by any cycle initiat-
ed from the PCI bus, these pins are in output
mode. When an ISA bus master owns the bus,
these pins are tristat ed.
For IDE devices, these signals are used as the
DA[2:0] and are connected directly or through a
buffer to DA[2:0] of the IDE devices. If the toggling
of signals are to be masked during ISA bus cycles,
they can be externally ORed before being con-
nected to the IDE devices.
SA[19:8]/DD[11:0]
Unlatched Address (ISA) /
Data Bus (IDE).
These are multifunction pins.
When the ISA bus is active, th ey are used as the
ISA bus system address bits 19-8. When the IDE
bus is active, they serve as IDE signals DD[11:0].
These pins are used as an input when an ISA bus
master owns the bus and are outputs at all other
times.
IDE devices are connected to SA[19:8] directly
and the ISA bus is connected to these pins
through two LS245 transceivers. The transceiver
OEs are connected to ISAOE# and the DIR is con-
nected to MA STER#. The transceiver bus si gnals
are connected to the CPC and IDE DD busses
and B bus signals are connected to ISA SA bus.
DD[15:12]
Databus (IDE).
The high 4 bits of the
IDE databus are combined with several of the X-
bus lines. Re fer to the f ollo wing section for X-bus
pins for further information.
SA[7:0]
ISA Bus address bits [7:0].
These are the
8 low bits of the syste m address bus of ISA on 8-
bit slot. These pins are used as an input when an
ISA bus master owns the bus and are outputs at
all other times.
SD[15:0]
I/O Data Bus (ISA).
These pins are the
external databus to the ISA bus.
2.2.7. ISA/IDE COMBINED CONTROL
IOCHRDY/DIORDY
Channel Ready (ISA) / Busy /
Ready (IDE).
This is a multi-function pin. When
the ISA bus is active, this pin is IOCHRDY. When
the IDE bus is active, this serves as IDE signal DI-
ORDY.
IOCHRDY is the I/O channel ready signal of the
ISA bus and i s driven as an out put in respons e to
an ISA master cycle targeted to the host bus or an
internal register of the STPC Client. The STPC
Client monitors this signal as an input when per-
forming an ISA cycle on behalf of the host CPU,
DMA master or refresh.
ISA masters which do not monitor IOCHRDY are
not guaranteed to work with the STPC Client since
the access to the system memory can be consid-
erably delayed due to CRT refresh or a write back
cycle.
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PIN DESCRIPTION
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2.2.8. ISA CONTROL
SYSRSTO#
Reset Output to System.
This is the
system reset signal and is used to reset the rest of
the com ponents (not o n Host B us) in t he system.
The ISA bus reset is an externally inverted buff-
ered version of this output and the PCI bus reset is
an externally buffered version of this output.
ISA_CLK
ISA Clo ck O utput (a lso Multiplexer Se-
lect Line For IPC).
This pin produces the Clock
signal for the ISA bus. It is also used with
ISA_CLK2X as the multiplexor control lines for the
Interrupt Controller Interrupt input lines. This is a
divided down version of either the PCICLK or
OSC14M.
ISA_CLKX2
ISA Clock Output (also Multiplexer
Select Li ne For IPC).
This pin produces a signal at
twice the frequency of the Clock signal for the ISA
bus. It is also used with ISA_CLK as the multiplex-
or cont rol l i nes f or the Interrupt Controller Inte rrupt
input lines.
OSC14M
ISA Bus Synchronization Clock Output.
This is the buffered 14.318 Mhz clock to the ISA
bus.
ALE
Address Latch Enable.
This is the address
latch enable output of the ISA bus and is asserted
by the STPC Client to indicate that LA23-17,
SA19-0, AEN and SBHE# signals are valid. The
ALE is driven high during refresh, DMA master or
ISA ma ster cycles by the STPC Clien t.
ALE is driven low after re set.
BHE#
System Bus High Enable.
This signal, when
asserted, indicates that a data Byte is being trans-
ferred on SD15-8 lines. It is used as an input when
an ISA master owns the bus and is an output at all
other times.
MEMR#
Memory Read.
This is the memory read
command signal of the ISA bus. It is used as an in-
put when an ISA master owns the bus and is an
output at all other times.
The MEMR# signal is active during refresh.
MEMW#
Memory Write.
This is the memory write
command signal of the ISA bus. It is used as an in-
put when an ISA master owns the bus and is an
output at all other times.
SMEMR#
System Memory Read.
The STPC Cli-
ent generates SMEMR# signal of the ISA bus only
when the a ddress is bel ow 1M By te or th e cycle is
a refresh cycle.
SMEMW#
System Memory Write.
The STPC Cli-
ent generates SMEMW# signal of the ISA bus
only when the address is below 1MByte.
IOR#
I/O Read.
This is the I/O read command sig-
nal of the ISA bus. It is an input when an ISA mas-
ter owns the bus and is an output at all other
times.
IOW#
I/O Writ e.
This is the I/O write command sig-
nal of the ISA bus. It is an input when an ISA mas-
ter owns the bus and is an output at all other
times.
MASTER#
Add On Card Owns Bus.
This signal is
active when an ISA device has been granted bus
ownership.
MCS16#
Memory Chip Select 16.
This is the de-
code of LA23-17 address pins of the ISA address
bus withou t any qualification of the c ommand sig-
nal lines. MCS16# is always an input. The STPC
Client ignores this signal during I/O and refresh
cycles.
IOCS16#
I/O Chip Se lect 16.
This signal is t he de-
code of SA15-0 address pins of the ISA address
bus withou t any qualification of the c ommand sig-
nals. The STPC Client does not drive IOCS16#
(similar to PC-AT design). An ISA master access
to an internal register of the STPC Client is exe-
cuted as an extended 8-bit I/O cycle.
REF#
Refresh Cycle.
This is the refresh command
signal of the ISA bus. It is driven as an output
when the S TPC Client performs a refresh c ycle on
the ISA bus. It is used as an input when an ISA
master owns the bus and is used to trigger a re-
fresh cycle.
The STPC Client performs a pseudo hidden re-
fresh. It requests the h ost bus for two host clo cks
to drive t he refresh address and capture it in ext er-
nal buffers. The host bus is then relinquished
while the refresh cycle continues on the ISA bus.
AEN
Address Enable.
Address E nable is enabled
when the DM A c ontroller is the bus owner to i ndi-
cate that a DMA transfer will occur. The enabling
of the signal indicates to I /O devices to ig nore t he
IOR#/IOW# signal during DMA transfers.
IOCHCK#
I/O Channel Check.
I/O Channel Check
is enabled by any ISA device to signal an error
condition that can not be corrected. NMI signal be-
comes active upon seeing IOCHCK# active if the
corresponding bit in Port B is enable d.
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ISAOE#
Bidirectional OE Control.
This signal con-
trols the OE sig nal of the ex ternal t ransceiv er that
connects the IDE DD bus and ISA SA bus .
GPIOCS#
I/O General Purpose Chip Select 1.
This output signa l is used by the ex ternal latc h on
ISA b us t o l atch t he d ata on t he SD [7: 0] bus. T he
latch can be used by the PMU unit to control the
external peripheral devices to power down or any
other desired function.
This pin is also serves as a strap input during re-
set.
2.2.9. IDE CONTROL
PIRQ
Primary Interrupt Request.
Interrupt request
from primary IDE channel.
SIRQ
Secondary Interrupt Request.
Interrupt re-
quest from secondary IDE channel.
PDRQ
Primary DMA Request .
DMA reques t from
primary IDE channel.
SDRQ
Secondary DMA Request.
DMA request
from secondary IDE channel.
PDACK#
Primary DMA Acknowledge.
DMA ac-
knowledge to primary IDE channel.
SDACK#
Secondary DMA Acknowledge.
DMA
acknowledge to secondary IDE channel.
PIOR#
Primary I/O Read.
Primary channel read.
Active low output.
PIOW#
Primary I/O Write
. Primary channel write.
Active low output.
SIOR#
Secondary I/O Read
. Secondary channel
read. Active low output.
SIOW#
Secondary I/O Write.
Secondary channel
write . Active low output.
2.2.1 0 . X-B US INTERFACE PINS / ID E DATA
RMRTCCS# / DD[15]
ROM/Real Time Clock Chip
Select.
This pin is a multi-function pin. When
ISAOE# is active, this signal is used as RM-
RTCCS#. This signal is asserted if a ROM access
is decoded during a memory cycle. It should be
combined with MEMR# or MEMW# signals to
properly access the ROM. During an I/O cycle,
this signal is asserted if access to the Real Time
Clock (RTC) is decoded. It should be combined
with IOR#+ or IOW# signals to properl y access the
real time clock.
When ISAOE# is inactive, this signal is used as
IDE DD[15] signal.
This signal must be ORed externally with ISAOE#
and is then connected to ROM and RTC. An
LS244 or equivalent function can be used if OE# is
connected to ISAOE# and the output is provided
with a weak pull-up resistor.
KBCS# / DD[14]
Keyboard Chip Select.
This pin
is a multi-function pin. When ISAOE# is active,
this signal is used as KBCS#. This signal is assert-
ed if a keyboard access is decoded during a I/O
cycle.
When ISAOE# is inactive, this signal is used as
IDE DD[14] signal.
This signal must be ORed externally with ISAOE#
and is then connected to t he key board. A n LS 244
or equivalent function can be used if OE# is con-
nected to I SAOE# and t he out put is provide d with
a weak pull-up resistor.
RTCRW# / DD[13]
Real Time Clock RW.
This pin
is a multi-function pin. When ISAOE# is active,
this signal is used as RT CRW#. T his s ig nal is as-
serted for any I/O write to port 71H.
When ISAOE# is inactive, this signal is used as
IDE DD[13] signal.
This signal must be ORed externally with ISAOE#
and then connected to the RTC. An LS244 or
equivalent function can be used if OE# is connect-
ed to ISAOE# and the output is provided with a
weak pull-up resistor.
RTCDS# / DD[12]
Real Time Clock DS
. This pin is
a multi-function pin. When ISAOE# is active, this
signal is used as RTCDS. This signal is asserted
for any I/O read to port 71H.
When ISAOE# is inactive, this signal is used as
IDE DD[12] signal.
This signal must be ORed externally with ISAOE#
and is then connected to RTC. An LS244 or equiv-
alent function can be used if OE # is con nected to
ISAOE# and the output is provided with a weak
pull-up resistor.
2.2.11. IPC
IRQ_MUX[3:0]
Multiplexed Interrupt Request.
These are the ISA bus interrupt signals . They are
to be encoded before connection to the STPC Cli-
ent using ISACLK and ISACLKX2 as the input se-
lection strobes.
Note that IRQ8B, which by convention is connect-
ed to the RTC, is inverted before being sent to the
interrupt controller, so that it may be connected di-
rectly to the IRQ pin of the RTC.
PCI_INT[3:0]
PCI Interrupt Request.
These are
the PCI bus interrupt signals. They are to be en-
coded before connection to the STPC Client using
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ISACLK and ISACLKX2 as the input selection
strobes.
DREQ_MUX[1:0]
ISA Bus Multiplexed DMA Re-
quest.
These are the ISA bus DMA request sig-
nals. They are to be encoded before connection to
the STPC Client using ISACLK and ISACLKX2 as
the input selection strobes.
DACK_ENC[2:0]
DMA Acknowledge.
These are
the ISA b us DMA ac knowledge sig nals. They are
encoded by the STPC Client before output and
should be decoded externally using ISACLK and
ISACLKX2 as the control strobes.
TC
ISA Terminal Count.
This is the terminal count
output of the DMA controller and is connected to
the TC line of the ISA bus. It is asserted during the
last DMA transfer, w hen the Byte count expires.
2.2.12. MONITOR INTERFACE
RED, GREEN, BLUE
RGB Video Out put s.
These
are the 3 analog color outputs from the RAM-
DACs. These signals are sensitive to i nterf erence,
therefore they need to be properly shielded.
VSYNC
Vertical Synchronization Pulse.
This is
the vertical synchronization signal from the VGA
controller.
HSYNC
Horizontal Synchroni za tion Pulse.
Th is is
the horizontal synchronization signal from the
VGA controller.
VREF_DAC
DAC Voltage reference.
An external
voltage reference is connected to this pin to bias
the DAC.
RSET
Resistor Current Set.
This reference cur-
rent input to the RAMDAC is used to set the full-
scale output of the RAMDAC.
COMP
Compensation.
T his is the R A M D AC co m-
pensation pin. Normally, an external capacitor
(typically 10nF) is connected between this pin and
VDD to damp oscillations.
DDC[1:0]
Direct Data Channel Serial Link.
These
bidirectional pins are connected to CRTC register
3Fh to implement DDC capabilities. T hey conform
to I2C electrical specifications, they have open-
collector output drivers which are internally con-
nected to VDD through pull -up resistors.
They can instead be used for accessing I²C devic-
es on board. DDC1 and DDC0 correspond to SCL
and SDA respectiv ely.
2.2.13. MISCELLANEOUS
ST[6],
Reserved.
ST[5] This is used for speaker output.
ST[4]
Reserved.
ST[3:0] The pins are for testing the STPC. The
default settings on these pins should be 1111 for
the STPC to function correctly. By setting the
ST[3:0] to 0111, the STPC is tristated.
CLKDEL[2:0]
Reserved
. The pins are reserved
for Test and Miscellaneous functions)
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Table 2-3. Pinout.
Pin # Pin name
AF3 PWGD
AF15 XTALI
AE16 XTALO
G23 HCLK
F25 DEV_CLK
AC5 GCLK2X
AD5 DCLK
AF5 DCLK_DIR
AD15 MA[0]
AF16 MA[1]
AC15 MA[2]
AE17 MA[3]
AD16 MA[4]
AF17 MA[5]
AC17 MA[6]
AE18 MA[7]
AD17 MA[8]
AF18 MA[9]
AE19 MA[10]
AF19 MA[11]
AD18 RAS#[0]
AE20 RAS#[1]
AC19 RAS#[2]
AF20 RAS#[3]
AE21 CAS#[0]
AC20 CAS#[1]
AF21 CAS#[2]
AD20 CAS#[3]
AE22 CAS#[4]
AF22 CAS#[5]
AD21 CAS#[6]
AE23 CAS#[7]
AC22 MWE#
AF23 MD[0]
AE24 MD[1]
AF24 MD[2]
AD25 MD[3]
AC25 MD[4]
AC26 MD[5]
AB24 MD[6]
AA25 MD[7]
AA24 MD[8]
Y25 MD[9]
Y24 MD[10]
V23 MD[11]
W24 MD[12]
V26 MD[13]
V24 MD[14]
U23 MD[15]
U24 MD[16]
R26 MD[17]
P25 MD[18]
P26 MD[19]
N25 MD[20]
N26 MD[21]
M25 MD[22]
M26 MD[23]
M24 MD[24]
M23 MD[25]
L24 MD[26]
J25 MD[27]
J26 MD[28]
H26 MD[29]
G25 MD[30]
G26 MD[31]
AD22 MD[32]
AD23 MD[33]
AE26 MD[34]
AD26 MD[35]
AC24 MD[36]
AB25 MD[37]
AB26 MD[38]
Y23 MD[39]
AA26 MD[40]
Y26 MD[41]
W25 MD[42]
W26 MD[43]
V25 MD[44]
U25 MD[45]
U26 MD[46]
T25 MD[47]
R25 MD[48]
T24 MD[49]
R23 MD[50]
R24 MD[51]
N23 MD[52]
P24 MD[53]
N24 MD[54]
L25 MD[55]
L26 MD[56]
K25 MD[57]
K26 MD[58]
K24 MD[59]
H25 MD[60]
J24 MD[61]
H23 MD[62]
H24 MD[63]
Pin # Pin name F24 PCI_CLKI
D25 PCI_CLKO
A20 AD[0]
C20 AD[1]
B19 AD[2]
A19 AD[3]
C19 AD[4]
B18 AD[5]
A18 AD[6]
B17 AD[7]
C18 AD[8]
A17 AD[9]
D17 AD[10]
B16 AD[11]
C17 AD[12]
B15 AD[13]
A15 AD[14]
C16 AD[15]
D15 AD[16]
A14 AD[17]
C15 AD[18]
B13 AD[19]
D13 AD[20]
A13 AD[21]
C14 AD[22]
C13 AD[23]
A12 AD[24]
B11 AD[25]
C12 AD[26]
A11 AD[27]
D12 AD[28]
B10 AD[29]
C11 AD[30]
A10 AD[31]
D10 CBE[0]
C10 CBE[1]
A9 CBE[2]
B8 CBE[3]
A8 FRAME#
B7 TRDY#
D8 IRDY#
A7 STOP#
C8 DEVSEL#
B6 PAR
D7 SERR#
A6 LOCK#
C21 PCI_REQ#[0]
A21 PCI_REQ#[1]
B20 PCI_REQ#[2]
Pin # Pin name
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PIN DESCRIPTION
22/61 Issue 2.2 - October 13, 2000
C22 PCI_GNT#[0]
B21 PCI_GNT#[1]
D20 PCI_GNT#[2]
D24 PCI_INT[0]
C26 PCI_INT[1]
A25 PCI_INT[2]
B24 PCI_INT[3]
F2 LA[17]/DA[0]
G4 LA[18]/DA[1]
F3 LA[19]/DA[2]
F1 LA[20]/PCS1#
G2 LA[21]/PCS3#
G3 LA[22]/SCS1#
H2 LA[23]/SCS3#
J4 SA[0]
H1 SA[1]
H3 SA[2]
J2 SA[3]
J1 SA[4]
K2 SA[5]
J3 SA[6]
K1 SA[7]
K4 SA[8]/DD[0]
L2 SA[9]/DD[1]
K3 SA[10]/DD[2]
L1 SA[11]/DD[3]
M2 SA[12] / DD[4]
M1 SA[13] / DD[5]
L3 SA[14] / DD[6]
N2 SA[15] / DD[7]
M4 SA[16] / DD[8]
N1 SA[17] / DD[9]
M3 SA[18] / DD[10]
P4 SA[19] / DD[11]
P3 RTCDS / DD[12]
R2 RTCRW# / DD[13]
N3 KBCS# / DD[14]
P1 RMRTCCS# / DD[15]
R1 SD[0]
T2 SD[1]
R3 SD[2]
T1 SD[3]
R4 SD[4]
U2 SD[5]
T3 SD[6]
U1 SD[7]
U4 SD[8]
V2 SD[9]
Pin # Pin name U3 SD[10]
V1 SD[11]
W2 SD[12]
W1 SD[13]
V3 SD[14]
Y2 SD[15]
AE4 SYSRSTO#
AD4 ISA_CLK
AE5 ISA_CLK2X
C6 OSC14M
W3 ALE
AA2 BHE#
Y4 MEMR#
AA1 MEMW#
Y3 SMEMR#
AB2 SMEMW#
AA3 IOR#
AC2 IOW#
AB4 MASTER#
AC1 MCS16#
AB3 IOCS16#
AD2 REF#
AC3 AEN
AD1 IOCHCK#
AF2 ISAOE#
AE3 GPIOCS#
Y1 IOCHRDY
B1 PIRQ
C2 SIRQ
C1 PDRQ
D2 SDRQ
D3 PDACK#
D1 SDACK#
E2 PIOR#
E4 PIOW#
E3 SIOR#
E1 SIOW#
E23 IRQ_MUX[0]
D26 IRQ_MUX[1]
E24 IRQ_MUX[2]
C25 IRQ_MUX[3]
A24 DREQ_MUX[0]
B23 DREQ_MUX[1]
C23 DACK_ENC[0]
A23 DACK_ENC[1]
B22 DACK_ENC[2]
D22 TC
Pin # Pin name AE6 RED
AD6 GREEN
AF6 BLUE
AE9 VSYNC
AF9 HSYNC
AD7 VREF_DAC
AE8 RSET
AC9 COMP
AF8 DDC[1] / SCL
AD8 DDC[0] / SDA
AD14 VCLK
AE13 VIN[0]
AC12 VIN[1]
AD12 VIN[2]
AE14 VIN[3]
AC14 VIN[4]
AF14 VIN[5]
AD13 VIN[6]
AE15 VIN[7]
AF10 VTV_YUV[0]
AC10 VTV_YUV[1]
AE11 VTV_YUV[2]
AD10 VTV_YUV[3]
AF11 VTV_YUV[4]
AE12 VTV_YUV[5]
AF12 VTV_YUV[6]
AD11 VTV_YUV[7]
AE10 VCS
AD9 ODD_EVEN
B4 ST[0]
D5 ST[1]
A4 ST[2]
C5 ST[3]
B3 ST[4]
C4 ST[5]
A3 ST[6]
C7 CLKDEL[0]
B5 CLKDEL[1]
A5 CLKDEL[2]
AC7 VDD_DAC1
AF4 VDD_DAC2
W4 VDD_GCLK_PLL
AB1 VDD_DCLK_PLL
F26 VDD_HCLK_PLL
G24 VDD_DEVCLK_PLL
Pin # Pin name
Obsolete Product(s) - Obsolete Product(s)
PIN DESCRIPTION
Issue 2.2 - October 13, 2000 23/61
A16 VDD5
B12 VDD5
B9 VDD5
D18 VDD5
A22 VDD
B14 VDD
C9 VDD
D6 VDD
D11 VDD
D16 VDD
D21 VDD
F4 VDD
F23 VDD
G1 VDD
K23 VDD
L4 VDD
L23 VDD
P2 VDD
T4 VDD
T23 VDD
T26 VDD
AA4 VDD
AA23 VDD
AB23 VDD
AC6 VDD
AC11 VDD
AC16 VDD
AC21 VDD
AD19 VDD
AF13 VDD
AE7 VSS_DAC1
AF7 VSS_DAC2
E25 VSS_DLL
E26 VSS_DLL
A1:2 VSS
A26 VSS
B2 VSS
B25:26 VSS
C3 VSS
C24 VSS
D4 VSS
D9 VSS
D14 VSS
D19 VSS
D23 VSS
H4 VSS
J23 VSS
L11:16 VSS
Pin # Pin name M11:16 VSS
N4 VSS
N11:16 VSS
P11:16 VSS
P23 VSS
R11:16 VSS
T11:16 VSS
V4 VSS
W23 VSS
AC4 VSS
AC8 VSS
AC13 VSS
AC18 VSS
AC23 VSS
AD3 VSS
AD24 VSS
AE1:2 VSS
AE25 VSS
AF1 VSS
AF25 VSS
AF26 VSS
Pin # Pin name
Obsolete Product(s) - Obsolete Product(s)
PIN DESCRIPTION
24/61 Issue 2.2 - October 13, 2000
Obsolete Product(s) - Obsolete Product(s)
UPDATE HISTORY FOR PIN DESCRIPTION CHAPTER
Issue 2.2 - October 13, 2000 25/61
2.3 UPDATE HISTORY FOR PIN DESCRIPTION CHAPTER
The following changes have been mad e to the Pin Description Chapter on 11/02/200 0
The following changes have been mad e to the Pin Description Chapter on 08/02/200 0
The following changes have been mad e to the Pin Description Chapter on 13/01/200 0
DCLK
Dot Clock / Pixel clock.
This clock supplies the d isplay controller, the video pipeline, the ramd ac,
and the TV output logic. Its va lue is dependen t on the selected display mode.
Its frequency can be as high as 135 MHz. This signal is either driven by the internal PLL to a minimum of
8MHz or by an external oscillator. The direction can be controlled by a strap option or an internal register
bit.
The following changes have been mad e to the Pin Description Chapter on 28/09/99
The following changes have been mad e to the Pin Description Chapter on 23/09/99
The following changes have been mad e to the Pin Description Chapter on 11/08/99
Section Change Text
2. 2. 5 . Added Signals AD[12:11] for internal use only. Not to be used for E xternal PCI devic-
es.”
Section Change Text
2. 2. 3 . Replaced Signals VIDEO_D[7:0] with VIN, VTV_BT# with ODD_EVEN, VTV_SYNCH with VCS.
Section Change Text
2. 2. Added to a minimum of 8MHz”
Section Change Text
Table 2-1. Changed Updated signal pin counts and added abbreviations to table.
Fi
g
ure 2-1. Changed Updated External interface pin count
Table 2-2. Replaced “PWGD” with “SYSRSTI#”
2. 2. 1 . Moved PCI_CLKI and PCI_CLKO moved from 2.2.1. to 2.2.5.
2. 2. 1 . Moved ISA_CLK and ISA_CLKX2 moved from 2.2.1. to 2.2.8.
2. 2. 3 . Replaced “Video Interface” with “Video Input”
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UPDATE HISTORY FOR PIN DESCRIPTION CHAPTER
26/61 Issue 2.2 - October 13, 2000
Removed statement; “The direction can be controlled by a strap option or an internal register bit.”
The following changes have been made to the Pin Description Chapter from Revision 1.0 to Release 1.2.
Section Change Text
2.2.13. Added “Note;
By setting signals ST[3:0] to the following value allows the STPC to be put
Tristate. This means the STPC is switched off and no signals are being driven.“
Section Change Text
2.1. Replaced “internal” With “assimilated “
2.2.1. Replaced
“The DRAM controller to execute the host transactions is also driven by this
clock”
With
“This clock drives the DRAM controller to execute the host transac tions”
2.2.1. Replaced
“AD[31:0]
PCI Address/Data.
This is the 32-bit multiplexed address and data
bus of th e PCI. This bus is driven by the master during the ad dress ph ase and
data p hase of write transact ions. It is driven by the target durin g dat a phase of
read transactions.”
With
“AD[31:0]
PCI Address/Data.
This is the 32-bit PCI multiplexed address and
data bus. This bus is driven by the m aster during the address phas e and data
phas e of write transac tions. It is driven by the ta rget during dat a phase of read
transactions.”
2.2.6. Replaced
“IDE devices are connected to SA[19:8] directly and ISA bus is connected to
these pins through two LS245 transceivers. The OE of the transceivers are
connected to ISAOE# a nd the DIR is co nnected to MAST ER#. The A bus sig-
nals of the transc eivers are co nnecte d to CPC and IDE DD bus and the B bus
signals are connected to ISA SA bus.”
With
“IDE devices are connec ted to SA[19:8] directly and the ISA bus is c onnected
to these pins through two LS245 transceivers. The transceiver OEs are con-
nected to ISAOE# and the DIR is connected to MASTER#. The transceiver bus
signals are connected to the CPC and IDE DD busses and B bus signals are
conn ected to ISA SA bus.”
2.2.6. Replaced
“For I DE device s, these s ign als a re us ed as the DA[ 2:0] and are co nnected t o
DA[2:0] of IDE devices directly or through a buffer. If the toggling of signals is to
be masked during ISA bus cycles, they can be externally ORed before being
conn ected to the IDE devices.”
With
“For IDE dev ices, these signals are us ed as the DA[ 2:0] and are connect ed di-
rectly or through a buffer to DA[2:0] of the IDE devices. If the toggling of signals
are to be masked during ISA bus cycles, they can be externally ORed before
being connected to the IDE devices.”
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UPDATE HISTORY FOR PIN DESCRIPTION CHAPTER
Issue 2.2 - October 13, 2000 27/61
2.2.8. Replaced
“IOCS16#
IO C h ip Sele ct16 .
This signal is the dec ode of the ISA bus SA15-0
address pins of without any qualification of the command signals. The STPC
Client does not drive IOCS16# (similar to PC-AT design). An ISA master ac-
cess to an internal register of the STPC Client is executed as an extended 8-bit
IO cycle.”
With
“IOCS16#
IO Chip Select16.
This signal is the decode of SA15-0 address pins
of the I SA address bus without any qualificat ion of the command s ignals. The
STPC Client does not drive IOCS16# (similar to PC-AT design). An ISA master
access to an internal register of the STPC Client is executed as an extended 8-
bit IO cycle.”
2.2.12. Added “They can instead be used for accessing I²C devices on board. DDC1 and
DDC0 correspond to SCL and SDA respectively.”
2.2.12. Replaced Updated table 3
Section Change Text
Obsolete Product(s) - Obsolete Product(s)
UPDATE HISTORY FOR PIN DESCRIPTION CHAPTER
28/61 Issue 2.2 - October 13, 2000
Obsolete Product(s) - Obsolete Product(s)
STR AP OPT ION
Issue 2.2 - October 13, 2000 29/61
3. STRAP OPTION
This chapter defines the STPC Client Strap Op-
tions and their location
Memory
Data
Lines Refer to Designation Location Actual
Settings Set to ’0 Set to ’1’
MD0 -Reserved - - - -
MD1 -Reserved - - - -
MD2 DRAM Bank 1 Speed Index 4A, bit 2 User defined 70 ns 60 ns
MD3 Speed Index 4A, bit 3 Pull up - -
MD4 Type Index 4A, bit 4 User defined EDO FPM
MD5 DRAM Bank 0 Speed Index 4A, bit 5 User defined 70 ns 60 ns
MD6 Speed Index 4A, bit 6 Pull up
MD7 Type Index 4A, bit 7 User defined EDO FPM
MD8 -Reserved - - - -
MD9 -Reserved Index 4B, bit 1 - - -
MD10 DRAM Bank 3 Speed Index 4B, bit 2 User defined 70 ns 60 ns
MD11 Speed Index 4B, bit 3 Pull up - -
MD12 Type Index 4B, bit 4 User defined EDO FPM
MD13 DRAM Bank 2 Speed Index 4B, bit 5 User defined 70 ns 60 ns
MD14 Speed Index 4B, bit 6 Pull up
MD15 Type Index 4B, bit 7 User defined EDO FPM
MD16 -Reserved Index 4C, bit 0 Pull up - -
MD17 PCI Clock PCI_CLKO Divisor Index 4C, bit 1 User defined HCLK /2 HCLK /3
MD18 -Reserved - - - -
MD19 -Reserved Index 4C, bit 3 Pull up - -
MD20 -Reserved Index 4C, bit 4 Pull up - -
MD21 -Reserved Index 5F, bit 0 Pull up - -
MD22 -Reserved Index 5F, bit 1 Pull up - -
MD23 -Reserved Index 5F, bit 2 Pull up - -
MD24 HCLK HCLK PLL Speed Index 5F, bit 3 User defined 000 Reserved
MD25 Index 5F, bit 4 User defined 001 Reserved
MD26 Index 5F, bit 5 User defined 010 Reserved
User defined 011 25 MHz
User defined 100 50 MHz
User defined 101 60 MHz
User defined 110 66 MHz
User defined 111 75 MHz
MD27 -Reserved - Pull up - -
MD28 -Reserved - Pull up - -
MD29 -Reserved - Pull up - -
MD30 -Reserved - Pull up - -
MD31 -Reserved - Pull down - -
MD32 -Reserved - Note 2 - -
MD33 -Reserved - Pull up - -
MD34 -Reserved - Pull down - -
MD35 -Reserved - Note 2 - -
MD36 -Reserved - - - -
MD37 -Reserved - - - -
Obsolete Product(s) - Obsolete Product(s)
STRAP OPT ION
30/61 Issue 2.2 - October 13, 2000
Note 1; Setting of Strap Options MD [15:2] have
no effect on the DRAM Controller but are purely
meant f or sof tware issues . i .e. Readabl e i n a reg-
ister.
Note 2; The settings for these Straps is show in
the table below:
For further details refer to Application Note 1297
3.1 Power on strap registers de scri ption
3.1.1 Strap register 0 Index 4Ah (Strap0)
Bits 7-0; This register reflect the status of pins
MD[7:0] respectively. They are expected to be
connected on the sy stem board to th e SIMM con-
figuration pins as follows:
Note that the SIMM speed and type information
read here is meant only for the s oftware and is not
used by the hardware. The software must pro-
gram the Host and graphics dram controller con-
figuration registers appropriately based on these
bits.
This register defaults to the values sampled on
MD [ 7 :0 ] p i ns af te r re s e t.
3.1.2 Strap register 1 Index 4Bh (Strap1)
Bits 7-0; This register reflect the status of pins
MD[15:8] respectively. They are expected to be
connected on the sy stem board to th e SIMM con-
figuration pins as follows:
MD38 -Reserved - - - -
MD39 -Reserved - - - -
MD40 -Reserved - - - -
MD41 -Reserved - - - -
MD42 -Reserved - - - -
MD43 -Reserved - - - -
Memory
Data
Lines Refer to Designation Location Actual
Settings Set to ’0 Set to ’1’
Strap Option Dev ices Settin gs
MDBT*70xxxx1
(Old) MD BT*7 10Ax x
(New)
MD [32] Pull Up (1) Pull Down (0)
MD[35] Pull Up (1) Pull Down (0)
Note 1; All devices with the exception of the technical
codes; MDBT*S710A
The Devices are identified using the techical code
which is the first line laser marked under the ST logo.
Bit Sampled Description
Bit 7 SIMM 0 DRAM type
Bits 6-5 SIMM 0 speed
Bit 4 SIMM 1 DRAM type:
Bits 3-2 SIMM 1 speed
Bit 1 Reserved
Bit 0 Reserved
Obsolete Product(s) - Obsolete Product(s)
STR AP OPT ION
Issue 2.2 - October 13, 2000 31/61
Note that the SIMM speed and type information
read here is meant only for the software and is not
used by the hardware. The software must pro-
gram the Host and graphics dram controller con-
figuration registers appropriately based on these
bits.
This register defaults to the values sampled on
MD[15:8] pins after reset.
3.1.3 Strap register 2 Index 4Ch (Strap2)
Bits 4-0; This register reflect the status of pins
MD[20:16] respectively.They are use by the chip
as follows:
Bit 4-2; Reserved.
Bit 1; This bit reflects the value sampled on
MD[17] pin and controls the PCI clock output as
follows:
0: PCI clock output = HCLK / 2
1: PCI clock output = HCLK / 3.
Bit 0; Reserved.
This register defaults to the values sampled on
MD[20:16] pins after reset.
3.1.4 HCLK PLL Strap register Index 5Fh
(HCLK_Strap)
Bits 5-0 of this register reflect the status of the
MD[26:21] & are used as follows:
Bit 5-3 These pins reflect the value sampled on
MD[26:24] pins respec tively and c ont rol the Host
clock frequency synthesizer
Bit 2- 0 Reserved
This register defaults to the values sampled on
above pins after reset.
These pin must not be pulled low for normal sys-
tem operation.
Bit Sampled Description
Bit 7 SIMM 2 DRAM type
Bits 6-5 SIMM 2 speed
Bit 4 SIMM 3 dram type
Bits 3-2 SIMM 3 speed
Bit 1 Reserved
Bit 0 Reserved
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ELECTRICAL SPECIFICA TIONS
32/61 Issue 2.2 - October 13, 2000
4. ELECTRICAL SPECIFICATIONS
4.1 INTRODUCTION
The electrical specifications in this chapter are val-
id for the STPC Client.
4.2 ELECTRICAL CONNECTIONS
4.2.1 POWER/GROUND CONNECTIONS/
DECOUPLING
Due to the high frequency of operation of the
STPC Client, it is necessary to install and test this
device using standard high frequen cy tec hnique s.
The high clock frequencies us ed in the STPC Cli-
ent and its output buffer circuits can cause tran-
sient power surges when several output buffers
switch output levels simultaneously. These effects
can be min imized by filtering the DC power leads
with low-inductance decoupling capacitors, using
low impedance wiring, and by utilizing all of the
VSS and VDD pins.
4.2.2 UNUSED INPUT PINS
All inputs not used by the designer and no t listed
in the table of pin connections in Chapter 3 should
be connected either to VDD or to VSS. Connect
active-high inputs to VDD through a 20 k (±10%)
pull-down resistor and active-low inputs to VSS
and connect active-low inputs to VCC through a
20 k (±10 %) pull-up resistor to prevent spurious
operation.
4.2.3 RESERVE D DESIGNATED PINS
Pins designated reserved should be left discon-
nected. Connecting a reserved pin to a pull-up re-
sistor, pull-down resistor, or an active signal could
cause unexpected results and possible circuit
malfunctions.
4.3 ABSOLUTE MAXIMUM RATINGS
The following table lists the absolute maximum
ratings for the STPC Client device. Stresses be-
yond those listed under Table 4-1 limits may
cause permanent damage to the device. These
are stress ratings only and do not imply that oper-
ation unde r any c onditions ot her than t hose s pec-
ified in section "Operating Conditions".
Exposure to c ondi tions beyond Ta ble 4-1 may (1)
reduce device reliability and (2) result in prema-
ture failure even when there is no immediately ap-
parent sign of failure. P rolonged exposure to con-
ditions at or near the absolute maximum ratings
(Table 4-1) may also result in reduced useful life
and reliab ilit y .
Note 1 : -40°C limit of TCASE (extended temperature
range) is given a s a pr eliminary s pecification and so as
all the -40°C related data.
Table 4-1. Absolute Maximum Ratings
Symbol Parameter Minimum Maximum Units
VDDx DC Supply Voltage -0.3 4.0 V
VI, VODigital Input and Output Voltage -0.3 VDD + 0.3 V
V5T 5Volt Tolerance 2.5 5.5 V
VESD ESD Capacity (Human body mode) 1500 V
TCASE Operating Case Temperature (Note 1) -40 +115 °C
PTOT Total Power Dissipation - 4.8 W
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ELEC TR ICAL SPECIFIC ATIONS
Issue 2.2 - October 13, 2000 33/61
4.4 DC CHARACTERISTICS
Notes:
1. MHz ratings refer to CPU clock frequency.
2. Not 10 0% tested.
3. For detail ed power consumption figures see Ap-
plication Note 1297.
4.5 AC CHARACTERISTICS
Table 4-4 thro ugh Table 4-8 list the AC character-
istics including output delays, input setup require-
ments, input hold requirements and output float
delays. These measurements are based on the
measurement points identified in Fi
g
ure 4-1 and
Fi
g
ure 4-2. The rising clock edge reference level
VREF , and other reference levels are shown in
Table 4-3 below for the STPC Client. Input or out-
put signals must cross these levels during testing.
Fi
g
ure 4-1 shows output delay (A and B) and input
setup and hold times (C and D). Input setup and
hold times (C and D) are specified minimums , de-
fining the s m allest a ccep table sam pling window a
synchronous input signal must be stable for cor-
rect operation.
No te: Re fe r to Fi
g
ure 4-1.
Table 4-2. DC Characteristics
Recommended Operating conditions : VDD = 3.3V ±0.3V, Tcase = 0 to 100°C (Commercial Range) or -40 to
100°C (Industrial Range) unless otherwise specified
Symbol Parameter Test conditions Min Typ Max Unit
VDD Operating Voltage 3.0 3.3 3.6 V
VDD5 5V operating voltage Note 3 4.5 5 5.5 V
PDD Supply Power (Note 3) VDD = 3.3V, HCLK = 66Mhz 3.5 W
HCLK Internal Clock (Note 1) 75 MHz
VDAC DAC Voltage Reference 1.215 1.235 1.255 V
VOL Output Low Voltage ILoad =1.5 to 8mA depending of the pin 0.5 V
VOH Output High Voltage ILoad =-0.5 to -8mA depending of the pin 2.4 V
VIL Input Low Voltage Except XTALI -0.3 0.8 V
XTALI -0.3 0.9 V
VIH Input High Voltage Excep t XTALI 2.1 VDD+0.3 V
XTALI 2.35 VDD+0.3 V
ILK Input Leakage Current Input, I/O -5 5 µA
CIN Input Capacitance ( Note 2) pF
COUT Output Capacitance (Note 2) pF
CCLK Clock Capacitance (Note 2) pF
Table 4-3. Drive Level and Measurement P oints for Switching Characteri stics
Symbol Value Units
VREF 1.5 V
VIHD 3.0 V
VILD 0.0 V
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ELECTRICAL SPECIFICA TIONS
34/61 Issue 2.2 - October 13, 2000
Figure 4-1 Drive Level and Me asure ment Po ints for Switch ing Cha racteristi cs
Figure 4-2 CLK Timing Measurement Points
Note; The above timin
g
s are
g
eneric timin
g
s and are not specific to the interfaces defined below
CLK:
VRef
VILD
VIHD
Tx
LEGEND: A - Maximum Output Delay Specification
B - Minimum Output Delay Specification
C - Minimum Input Setup Specification
D - Minimum Input Hold Specification
VRef
Valid
Valid
Valid
OUTPUTS:
INPUTS:
Output n Output n+1
Input
MAX
MIN
A
B
CD
V
Ref
VILD
VIHD
CLK
T5 T4T3
VRef
VIL (MAX)
VIH (MIN)
T2
T1
LEGEND: T1 - One Clock Cycle
T2 - Minimum Time at VIH
T3 - Minimum Time at VIL
T4 - Clock Fall Time
T5 - Clock Rise Time
NOTE; All sIgnals are sampled on the rising edge of the CLK.
Obsolete Product(s) - Obsolete Product(s)
ELEC TR ICAL SPECIFIC ATIONS
Issue 2.2 - October 13, 2000 35/61
4.5.4 POWER ON SEQUENCE
SYSRSTI # has no c on straint on i ts rising tim e but
needs to be set to high at least 10µs after power
supply is stable.
Strap Options are continuously sampled during
SYSRSTI# low and should be stable. Once
SYSRSTI# is high, they MUST NOT CHANGE
until SYSRSTO# is high.
Strap Options
3.3V Suppl
SYSRSTI#
SYSRSTO#
14MHz
1.6V
VALID CONFIGURATION
> 10 us
HCLK
PCI_CLK
2.3 m s
FRAME#
Obsolete Product(s) - Obsolete Product(s)
ELECTRICAL SPECIFICA TIONS
36/61 Issue 2.2 - October 13, 2000
4.5.5 PCI AC TIMING CHARACTERISTICS
4.5.6 DRAM CONTROLLER AC TIMING CHARCTERISTICS
Table 4-4. PCI Bus AC Timing
Name Parameter Min Max Unit
t1 PCI_CLKI to AD[31:0] valid 2 13 ns
t2 PCI_CLKI to FRAME# valid 2 11 ns
t3 PCI_CLKI to CBE#[3:0] valid 2 12 ns
t4 PCI_CLKI to PAR valid 2 12 ns
t5 PCI_CLKI to TRDY# valid 2 13 ns
t6 PCI_CLKI to IRDY# valid 2 11 ns
t7 PCI_CLKI to STOP# valid 2 14 ns
t8 PCI_CLKI to DEVSEL# valid 2 11 ns
t9 PCI_CLKI to PCI_GNT# valid 2 14 ns
t10 AD[31:0] bus setup to PCI_CLKI 7 ns
t11 AD[31:0] bus hold from PCI_CLKI 3 ns
t12 PCI_REQ#[2:0] setup to PCI_CLKI 10 ns
t13 PCI_REQ#[2:0] hold from PCI_CLKI 1 ns
t14 CBE#[3:0] setup to PCI_CLKI 7 ns
t15 CBE#[3:0] hold to PCI_CLKI 5 ns
t16 IRDY# setup to PCI_CLKI 7 ns
t17 IRDY# hold to PCI_CLKI 4 ns
t18 FRAME# setup to PCI_CLKI 7 ns
t19 FRAME# hold from PCI_CLKI 3 ns
Figu re 4- 3 Read Mode ( ref t abl e Table 4-5)
ROW Column
tRCH
tCPN tRCS tCAH
tCOH tCPN
tCRP
tRP
tRC
tRAS
tRAL tRP
tRAS
tRAH
tRAD
tCHR
tRCD
tRC
tCRD
tCCAS
tCRAS
tCMA
CLK
RAS#
CAS#
MA
MWE#
MD
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ELEC TR ICAL SPECIFIC ATIONS
Issue 2.2 - October 13, 2000 37/61
Figure 4-4 Memo ry Ear ly Write Mode (ref table Table 4-5)
ROW Column
Data Valid
tCPNtCPN
tCWL
tRCH
tCHR
tWRH
tCPN
tDS
tWCH
tWCS
tRCS
tCAH
tCPN
tRP
tRC
tCRW
tRWL
tRAS
tRAL
tRP
tDHR
tWCR
tRAD
tRAS
tRAH
tCHR
tRCD
tRC
tCRP
tCCAS
tCRAS
tCMA
CLK
RAS#
CAS#
MA
MWE#
MD
Figure 4-5 EDO Read Mode (ref table T able 4-5)
Row Column Row
OPEN Valid data OPEN
tCPNtCPN
tCPN tCOH
tRCS tCAH
tCPN
tRCHtRAL
tRAS
tRC
tRAH
tRAD
tAR
tRCD
tCRP
tCSR
tCHR
tRAS
tRPtRP
tRC
tCMD
tCMWE
tCCAS
tCRAS
tCMA
CLK
RAS#
CAS#
MA
MWE#
MD
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ELECTRICAL SPECIFICA TIONS
38/61 Issue 2.2 - October 13, 2000
Figure 4-6 EDO Write Mode (ref table Table 4-5)
Figure 4-7 Fast Page Mode Read (ref table Table 4-5)
Row Column Row
OPEN Valid data OPEN
tCPNtCPN
tCPN tCOH
tRCS tCAH
tCPN
tRCHtRAL
tRAS
tRC
tRAH
tRAD
tAR
tRCD
tCRP
tCSR
tCHR
tRAS
tRPtRP
tRC
tCMD
tCMWE
tCCAS
tCRAS
tCMA
CLK
RAS#
CAS#
MA
MWE#
MD
RO
W
Column 1 Column 2 Column N
Dout 1 Dout 2 Dout N
tCPN tCOH
tCAH
tCPN
tCPN tCOH
tCAHtCPNtCPN tCOH
tCAH
tCPN
tCRP
tRPtRAL tRP
tAR
tRAH
tCSH
tRAD
tRCD
tCRP
tCMD tCRAS
tCMD
tCMA tCCAStCMD
tCMA
tCCAStCMA
tCCAS
tCRAS
CLK
RAS#
CAS#
MA
MWE#
MD
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ELEC TR ICAL SPECIFIC ATIONS
Issue 2.2 - October 13, 2000 39/61
Figure 4-8 Fast Page Mode Wri te (ref table Table 4-5)
Figure 4-9 Refresh Cycle (ref table Table 4-5)
ROW Column 1 Column 2 Column N
Dout 1 Dout 2 Dout N
tRAL
tRCH
tCPN
tDS
tCAH
tCPN
tCPN tDS
tRC
tCAHtCPNtCWL
tCPN
tDS
tWCS
tRC
tCAHtCPN
tCRP
tRPtCRW
tRWL
tRAS
tRAL
tRP
tDHR
tWCR
tAR tRAS
tRAH
tCSH
tRAD
tRCD
tCRP
tCMD
tCCAStCMA
tCRAS
CLK
RAS#
CAS#
MA
MWE#
OE
MD
tCPNtCPNtCPNtCPN
tCSR
tRP
tRPC
tRAS tRP
tCHRtCRS
tCSR tRAS
tRP
tRPC
tRP
tCRAS
tCCAS
CLK
MA[11:0]
RAS#[3:0]
CAS#[7:0]
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ELECTRICAL SPECIFICA TIONS
40/61 Issue 2.2 - October 13, 2000
Table 4-5. AC Memory Timing Characteristics
Parameter Min Max Units
tCRAS HCLK (or GCLK2 X) to RAS#[3:0] valid (see Note 3) 17 ns
tCCAS HCLK (or GCLK2X) to CAS#[7:0] bus valid (see Note 3) 17 ns
tCMA HCLK (or GCLK2X) to MA[11:0] bus valid (see Note 3) 17 ns
tCMWE HCLK (or GCLK2X) to MWE# valid (see Note 3) 17 ns
tCMD HCLK to MD[63:0] bus valid (see Note 3) 25 ns
tGCMD GCLK2X to MD[63:0] bus valid (see Note 3) 23 ns
tMDG MD[63:0] Generic hold 0 ns
tCAH4Column Address Hold Time 1TCycles ns
tCHR4CAS Hold Time 1TCycles ns
tCOH4Data Hold TIme from CAS Low Note 1 ns
tCPN4CAS Precharge Time 1TCycles ns
tCRP4CAS to RAS Precharge Time 1TCycles
tCRW4CAS Low to RAS HIGH (Write only) 1TCycles ns
tCSR4CAS Setup Time 1TCycles ns
tDS4Data In Setup Time 1TCycles ns
tRAH4Row Address Hold Time 1TCycles ns
tRAS4RAS Pulse Width 3TCycles ns
tRC4Random Read or Write Time Cycle 6TCycles ns
tRCD4RAS to CAS Delay Time 1TCycles ns
tRCH4Read Command Hold Time 1TCycles ns
tRCS4Read Command Setup Time 1TCycles ns
tRP4RAS Precharge Time 2TCycles ns
tWCH4Write Command Hold Time 1TCycles ns
tWCS4WE Command Setup Time 1TCycles ns
tWRH4WE Hold Time Note 2 ns
tWRP4WE Setup Time 1TCycles ns
tAR4Column Address Hold Time from RAS 1TCycles ns
tRAD4RAS to valid Column Address Delay 1TCycles ns
tRAL4Column Address to RAS Setup Time 2TCycles ns
tWCR4Write Command Hold Reference to RAS 1TCycles ns
tRWL4Write Command to RAS Setup Time (Note 2) 1TCycles ns
tCWL4Write Command to CAS Setup Time (Note 2) 1TCycles ns
tDHR4Data Hold Reference to RAS 3TCycles ns
tRPC4RAS High to CAS Low Precharge 1TCycles ns
tCRS4CAS Before RAS Setup Time 1TCycles ns
tCHR4CAS Before RAS Hold Time 1TCycles ns
tCSH4CAS Hold Time after RAS 1TCycles ns
Note 1; TCycle x nCAS + (tData off - tCAS out)
Where TCycle is the the number of clock cycles.
nCAS is the number of CAS Cycles (see section 6.7. )
TDataoff is the Generic Datahold
tCAS Out the CLK (either HCLK or GCLK2X) to CAS Low.
TDataoff and tCAS Out are used to refine the timing programming.
Note 2; Value to be derived from CAS pulse width which is programmable (see section 6.7. ).
Note 3; for all chronograms, CLK refers to the clock signal that the program is using. It can be either HCLK or GCLK2X
Note 4; These timings are extracted from simulations and are not garanteed by testing
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ELEC TR ICAL SPECIFIC ATIONS
Issue 2.2 - October 13, 2000 41/61
Table 4-6. Video Input/TV Output AC Timing
Name Parameter Min Max Unit
t34 DCLK to TV_YUV[7:0] bus valid 18 ns
t35 VIN[7:0] setup to VCLK 5 ns
t36 VIN[7:0] hold from VCLK 3 ns
t37 VCLK to ODD_EVEN valid 21 ns
t38 VCLK to VCS valid 21 ns
t39 ODD_EVEN setup to VCLK 10 ns
t40 ODD_EVEN hold from VCLK 5 ns
t41 VCS setup to VCLK 10 ns
t42 VCS hold from VCLK 5 ns
Table 4-7. Graphics Adapter (VGA) AC Timing
Name Parameter Min Max Unit
t43 DCLK to VSYNC valid 45 ns
t44 DCLK to HSYNC valid 45 ns
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ELECTRICAL SPECIFICA TIONS
42/61 Issue 2.2 - October 13, 2000
4.5.7 ISA INTERFACE AC TIMING CHARCTERISTICS
Figure 4-10 ISA Cycle (ref table Table 4-8)
Note 1; Stands for SMEMR#, SMEMW#, MEMR#, MEMW#, IOR# & IOW#.
Note; The clock has not been represented as it cannot be accuratly represented depending on the ISA Slave mode.
Valid AENx
Valid Address
Valid Address, SBHE*
V.Da
t
VALID DATA
54
28
26
64
59
58
55
28
23
61
48
47
26
23
57 27
24
42
41
10
11
34
33
3
22
56 29
25
918
2
12
38
37
15
14
13
12
ALE
AEN
LA [23:17]
SA [19:0]
CONTROL (Note 1)
IOCS16#
MCS16#
IOCHRDY
READ DATA
WRITE DATA
Table 4-8. ISA Bus AC Timing
Name Parameter Min Max Units
24LA[23:17] valid before ALE# negated 5T Cycles
34LA[23:17] valid before MEMR#, MEMW# asserted
3a4Memory access to 16 bit ISA Slave 5T Cycles
3b4Memory access to 8 bit ISA Slave 5T Cycles
94SA[19:0] & SBHE valid before ALE# negated 1T Cycles
104SA[19:0] & SBHE valid before MEMR#, MEMW# asserted
10a4Memory access to 16 bit ISA Slave 2T Cycles
10b4Memory access to 8 bit ISA Slave 2T Cycles
104SA[19:0] & SHBE valid before SMEMR#, SMEMW# asserted
10c4Memory access to 16 bit ISA Slave 2T Cycle
10d4Memory access to 8 bit ISA Slave 2T Cycle
Note; The si
g
nal numberin
g
refers to Table 4-10
Note 4; These timings are extracted from simulations and are not garanteed by testing
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ELEC TR ICAL SPECIFIC ATIONS
Issue 2.2 - October 13, 2000 43/61
10e4SA[19:0] & SBHE valid before IOR#, IOW# asserted 2T Cycles
114XTALO to IOW# valid
11a4Memory access to 16 bit ISA Slave - 2BCLK 2T Cycles
11b4Memory access to 16 bit ISA Slave - Standard 3BCLK 2T Cycles
11c4Memory access to 16 bit ISA Slave - 4BCLK 2T Cycles
11d4Memory access to 8 bit ISA Slave - 2BCLK 2T Cycles
11e4Memory access to 8 bit ISA Slave - Standard 3BCLK 2T Cycles
124ALE# asserted before ALE# negated 1T Cycles
134ALE# asserted before MEMR#, MEMW# asserted
13a4Memory Access to 16 bit ISA Slave 2T Cycles
13b4Memory Access to 8 bit ISA Slave 2T Cycles
134ALE# asserted before SMEMR#, SMEMW# asserted
13c4Memory Access to 16 bit ISA Slave 2T Cycles
13d4Memory Access to 8 bit ISA Slave 2T Cycles
13e4ALE# asserted before IOR#, IOW# asserted 2T Cycles
144ALE# asserted before AL[23:17]
14a4Non compressed 15T Cycles
14b4Compressed 15T Cycles
154ALE# asserted before MEMR#, MEMW#, SMEMR#, SMEMW# negated
15a4Memory Access to 16 bit ISA Slave- 4 BCLK 11T Cycles
15e4Memory Access to 8 bit ISA Slave- Standard Cycle 11T Cycles
18a4ALE# negated before LA[23:17] invalid (non compressed) 14T Cycles
18a4ALE# negated before LA[23:17] invalid (compressed) 14T Cycles
224MEMR#, MEMW# asserted before LA[23:17]
22a4Memory access to 16 bit ISA Slave. 13T Cycles
22b4Memory access to 8 bit ISA Slave. 13T Cycles
234MEMR#, MEMW# asserted before MEMR#, MEMW# negated
23b4Memory access to 16 bit ISA Slave Standard cycle 9T Cycles
23e4Memory access to 8 bit ISA Slave Standard cycle 9T Cycles
234SMEMR#, SMEMW# asserted before SMEMR#, SMEMW# negated
23h4Memory access to 16 bit ISA Slave Standard cycle 9T Cycles
23l4Memory access to 16 bit ISA Slave Standard cycle 9T Cycles
234IOR#, IOW# asserted before IOR#, IOW# negated
23o4Memory access to 16 bit ISA Slave Standard cycle 9T Cycles
23r4Memory access to 8 bit ISA Slave Standard cycle 9T Cycles
244MEMR#, MEMW# asserted before SA[19:0]
24b4Memory access to 16 bit ISA Slave Standard cycle 10T Cycles
24d4Memory access to 8 bit ISA Slave - 3BLCK 10T Cycles
24e4Memory access to 8 bit ISA Slave Standard cycle 10T Cycles
24f4Memory access to 8 bit ISA Slave - 7BCLK 10T Cycles
244SMEMR#, SMEMW# asserted before SA[19:0]
24h Memory access to 16 bit ISA Slave Standard cycle 10T Cycles
24i4Memory access to 16 bit ISA Slave - 4BCLK 10T Cycles
24k4Memory access to 8 bit ISA Slave - 3BCLK 10T Cycles
24l4Memory access to 8 bit ISA Slave Standard cycle 10T Cycles
Table 4-8. ISA Bus AC Timing
Name Parameter Min Max Units
Note; The si
g
nal numberin
g
refers to Table 4-10
Note 4; These timings are extracted from simulations and are not garanteed by testing
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ELECTRICAL SPECIFICA TIONS
44/61 Issue 2.2 - October 13, 2000
244IOR#, IOW# asserted before SA[19:0]
24o4I/O access to 16 bit ISA Slave Standard cycle 19T Cycles
24r4I/O access to 16 bit ISA Slave Standard cycle 19T Cycles
254MEMR#, MEMW# asserted before next ALE# asserted
25b4Memory access to 16 bit ISA Slave Standard cycle 10T Cycles
25d4Memory access to 8 bit ISA Slave Standard cycle 10T Cycles
254SMEMR#, SMEMW# asserted before next ALE# aserted
25e4Memory access to 16 bit ISA Slave - 2BCLK 10T Cycles
25f4Memory access to 16 bit ISA Slave Standard cycle 10T Cycles
25h4Memory access to 8 bit ISA Slave Standard cycle 10T Cycles
254IOR#, IOW# asserted before next ALE# asserted
25i4I/O access to 16 bit ISA Slave Standard cycle 10T Cycles
25k4I/O access to 16 bit ISA Slave Standard cycle 10T Cycles
264MEMR#, MEMW# asserted before next MEMR#, MEMW# asserted
26b4Memory access to 16 bit ISA Slave Standard cycle 12T Cycles
26d4Memory access to 8 bit ISA Slave Standard cycle 12T Cycles
264SMEMR#, SMEMW# asserted before next SMEMR#, SMEMW# asserted
26f4Memory access to 16 bit ISA Slave Standard cycle 12T Cycles
26h4Memory access to 8 bit ISA Slave Standard cycle 12T Cycles
264IOR#, IOW# asserted before next IOR#, IOW# asserted
26i4I/O access to 16 bit ISA Slave Standard cycle 12T Cycles
26k4I/O access to 8 bit ISA Slave Standard cycle 12T Cycles
284Any command negated to MEMR#, SMEMR#, MEMR#, SMEMW# asserted
28a4Memory access to 16 bit ISA Slave 3T Cycles
28b4Memory access to 8 bit ISA Slave 3T Cycles
284Any command negated to IOR#, IOW# asserted
28c4I/O access to ISA Slave 3T Cycles
29a4MEMR# , MEMW# nega ted before next ALE# asserted 1T Cycles
29b4SMEMR#, SMEMW# negated before next ALE# asserted 1T Cycles
29c4IOR#, IOW# negated before next ALE# asserted 1T Cycles
334LA[23:17] valid to IOCHRDY negated
33a4Memory access to 16 bit ISA Slave - 4 BCLK 8T Cycles
33b4Memory access to 8 bit ISA Slave - 7 BCLK 14T Cycles
344LA[23:17] valid to read data valid
34b4Memory access to 16 bit ISA Slave Standard cycle 8T Cycles
34e4Memory access to 8 bit ISA Slave Standard cycle 14T Cycles
374ALE# asserted to IOCHRDY# negated
37a4Memory access to 16 bit ISA Slave - 4 BCLK 6T Cycles
37b4Memory access to 8 bit ISA Slave - 7 BCLK 12T Cycles
37c4I/O access to 16 bit ISA Slave - 4 BCLK 6T Cycles
37d4I/O access to 8 bit ISA Slave - 7 BCLK 12T Cycles
384ALE# asserted to read data valid
38b4Memory access to 16 bit ISA Slave Standard Cycle 4T Cycles
38e4Memory access to 8 bit ISA Slave Standard Cycle 10T Cycles
38h4I/O access to 16 bit ISA Slave Standard Cycle 4T Cycles
Table 4-8. ISA Bus AC Timing
Name Parameter Min Max Units
Note; The si
g
nal numberin
g
refers to Table 4-10
Note 4; These timings are extracted from simulations and are not garanteed by testing
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ELEC TR ICAL SPECIFIC ATIONS
Issue 2.2 - October 13, 2000 45/61
38l4I/O access to 8 bit ISA Slave Standard Cycle 10T Cycles
414SA[19:0] SBHE valid to IOCHRDY negated
41a4Memory access to 16 bit ISA Slave 6T Cycles
41b4Memory access to 8 bit ISA Slave 12T Cycles
41c4I/O access to 16 bit ISA Slave 6T Cycles
41d4I/O access to 8 bit ISA Slave 12T Cycles
424SA[19:0] SBHE valid to read data valid
42b4Memory access to 16 bit ISA Slave Standard cycle 4T Cycles
42e4Memory access to 8 bit ISA Slave Standard cycle 10T Cycles
42h4I/O access to 16 bit ISA Slave Standard cycle 4T Cycles
42l4I/O access to 8 bit ISA Slave Standard cycle 10T Cycles
474MEMR#, MEMW#, SMEMR#, SMEMW#, IOR#, IOW# asserted to IOCHRDY negated
47a4Memory access to 16 bit ISA Slave 2T Cycles
47b4Memory access to 8 bit ISA Slave 5T Cycles
47c4I/O access to 16 bit ISA Slave 2T Cycles
47d4I/O access to 8 bit ISA Slave 5T Cycles
484MEMR#, SMEMR#, IOR# asserted to read data valid
48b4Memory access to 16 bit ISA Slave Standard Cycle 2T Cycles
48e4Memory access to 8 bit ISA Slave Standard Cycle 5T Cycles
48h4I/O access to 16 bit ISA Slave Standard Cycle 2T Cycles
48l4I/O access to 8 bit ISA Slave Standard Cycle 5T Cycles
544IOCHRDY asserted to read data valid
54a4Memory access to 16 bit ISA Slave 1T(R)/2T(W) Cycles
54b4Memory access to 8 bit ISA Slave 1T(R)/2T(W) Cycles
54c4I/O access to 16 bit ISA Slave 1T(R)/2T(W) Cycles
54d4I/O access to 8 bit ISA Slave 1T(R)/2T(W) Cycles
55a4IOCHRDY asserted to MEMR#, MEMW#, SMEMR#,
SMEMW#, IOR#, IOW# negated 1T Cycles
55b4IOCHRY asserted to MEMR#, SMEMR# negated (refresh) 1T Cycles
564IOCHRDY asserted to next ALE# asserted 2T Cycles
574IOCHRDY asserted to SA[19:0], SBHE invalid 2T Cycles
584MEMR#, IOR#, SMEMR# negated to read data invalid 0T Cycles
594MEMR#, IOR#, SMEMR# negated to daabus float 0T Cycles
614Write data before MEMW# asserted
61a4Memory access to 16 bit ISA Slave 2T Cycles
61b4Memory access to 8 bit ISA Slave (Byte copy at end of
start) 2T Cycles
614Write data before SMEMW# asserted
61c4Memory access to 16 bit ISA Slave 2T Cycles
61d4Memory access to 8 bit ISA Slave 2T Cycles
614Write Data valid before IOW# asserted
61e4I/O access to 16 bit ISA Slave 2T Cycles
61f4I/O access to 8 bit ISA Slave 2T Cycles
64a4MEMW# negated to write data invalid - 16 bit 1T Cycles
64b4MEMW# negated to write data invalid - 8 bit 1T Cycles
Table 4-8. ISA Bus AC Timing
Name Parameter Min Max Units
Note; The si
g
nal numberin
g
refers to Table 4-10
Note 4; These timings are extracted from simulations and are not garanteed by testing
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ELECTRICAL SPECIFICA TIONS
46/61 Issue 2.2 - October 13, 2000
64c4SMEMW# negated to write data invalid - 16 bit 1T Cycles
64d4SMEMW# negated to write data invalid - 8 bit 1T Cycles
64e4IOW# negated to write data invalid 1T Cycles
64f4MEMW# negated to copy data float, 8 bit ISA Slave, odd Byte
by ISA Master 1T Cycles
64g4IOW# negated to copy data float, 8 bit ISA Slave, odd Byte by
ISA Master 1T Cycles
Table 4-8. ISA Bus AC Timing
Name Parameter Min Max Units
Note; The si
g
nal numberin
g
refers to Table 4-10
Note 4; These timings are extracted from simulations and are not garanteed by testing
Obsolete Product(s) - Obsolete Product(s)
MECHANICAL DATA
Issue 2.2 - October 13, 2000 47/61
5. ME CHANIC AL DATA
5.1 388-Pin Package Dimension
The pin numbering for the STPC 388-pin Plastic
BGA package is shown in Fi
g
ure 5-1.
Dimensions are shown in Fi
g
ure 5-2, Table 5-1
and Fi
g
ure 5-3, Table 5-2.
Figure 5-1. 388-Pin PBG A Pack age - Top View
A
B
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
C
135791113151719212325
2 4 6 8 10 12 14 16 18 20 22 24 26
A
B
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
C
135791113151719212325
2468101214161820222426
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MECHANICAL DATA
48/61 Issue 2.2 - October 13, 2000
Figure 5-2. 3 88-pin PBGA Pa ckag e - PCB Dimensions
Table 5-1. 388-pin PB GA Package - PCB Dimensions
Symbols mm inches
Min Typ Max Min Typ Max
A 34.95 35.00 35.05 1.375 1.378 1.380
B 1.22 1.27 1.32 0.048 0.050 0.052
C 0.58 0.63 0.68 0.023 0.025 0.027
D 1.57 1.62 1.67 0.062 0.064 0.066
E 0.15 0.20 0.25 0.006 0.008 0.001
F 0.05 0.10 0.15 0.002 0.004 0.006
G 0.75 0.80 0.85 0.030 0.032 0.034
A
A
B
Detail
A1 Ball Pad Corner
D
F
E
G
C
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MECHANICAL DATA
Issue 2.2 - October 13, 2000 49/61
Figure 5-3. 3 88-pin PBGA Pa ckag e - Dimensions
Table 5-2. 388-pin PB GA Package - Dimen sions
Symbols mm inches
Min Typ Max Min Typ Max
A 0.50 0.56 0.62 0.020 0.022 0.024
B 1.12 1.17 1.22 0.044 0.046 0.048
C 0.60 0.76 0.92 0.024 0.030 0.036
D 0.52 0.53 0.54 0.020 0.021 0.022
E 0.63 0.78 0.93 0.025 0.031 0.037
F 0.60 0.63 0.66 0.024 0.025 0.026
G 30.0 11.8
AB
C
Solderball Solderball after collapse
D
E
F
G
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MECHANICAL DATA
50/61 Issue 2.2 - October 13, 2000
5.2 388-Pin Package thermal data
388-pin PBGA package has a Power Dissipation
Capability of 4.5W which increases to 6W when
used with a Heatsink.
Stru cture in sh ow n in Fi
g
ure 5-4.
Thermal dissipation options are illustrated in Fi
g
-
ure 5-5 and Fi
g
ure 5-6.
Figure 5-4. 388-Pin PBG A structur e
Thermal balls
Power & Ground layersSignal layers
Figure 5-5. Thermal dissipation wi thout heatsink
Ambient
Board
Case
Junction
Board
Ambient
Ambient
Case
Junction
Board
Rca
Rjc
Rjb
Rba
66
1258.5
Rja = 13 °C/W
Airflow = 0
Board dimensions:
The PBGA is centered on board
Copper thickness:
- 17µm for internal layers
- 34µm for external layers
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Board temperature taken at the center balls
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Issue 2.2 - October 13, 2000 51/61
Figure 5-6. Thermal dissipation wi th heatsink
Board
Ambient
Case
Junction
Board
Ambient
Ambient
Case
Junction
Board
Rca
Rjc
Rjb
Rba
36
508.5
Rja = 9.5 °C/W
Airflow = 0
Board dimensions:
The PBGA is centered on board
Copper thickness:
- 17µm for internal layers
- 34µm for external layers
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
There are no other devices
Heat sink is 11.1°C/W
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Board temperature taken at the center balls
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BOARD LAYOUT
Issue 2.2 - October 13, 2000 53/61
6. BOARD LAYOUT
6.1 THER MA L D I S SIP A TION
Thermal dissipation of the STPC depends mainly
on supply voltage. As a result, when the system
does not need to work at 3.3V, it may be to reduce
the voltage to 3.15V for example. This may save
few 100’s of mW.
The second area that can be concidered is un-
used interfaces and functions. Depending on the
application, some input signals can be grounded,
and some blocks not powered or shutdown. Clock
speed dynamic adjustment is also a solution that
can be used along with the integrated power man-
agement unit.
The standard way to route thermal balls to internal
ground layer implements only one via pad f or each
ball pad, connected using a 8-mil wire.
With such configuration the Plastic BGA 388 pack-
age dissipates 90% of the heat through the ground
balls, and especially the central thermal balls
which are directly connected to the die, the re-
maining 10% is dissipated through the case. Add-
ing a heat sink reduces this value t o 85%.
As a result, some basic rules have to be applied
when routing the STPC in order to avoid thermal
problems.
First of a ll, the whole ground la yer acts as a heat
sink a nd ground balls m ust be directly connected
to it as illustrated in Fi
g
ure 6-1.
If one ground layer is not enough, a second
ground plane may be added on the solder side.
Fi gur e 6-1. Ground routing
Pad for ground ball
Thru hole to ground layer
Top Layer : Signals
Ground layer
Power layer
Bottom Layer : signals + local ground layer (if needed)
Note: For better visibility, ground balls are not all routed.
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54/61 Issue 2.2 - October 13, 2000
When considering thermal dissipation, the most
important - an d not the more obvious - part of the
layout is the c onnect ion be twee n the ground balls
and the ground layer.
A 1-wire connection is shown in Fi
g
ure 6-2. The
use of a 8-mil wire results in a therm al resistance
of 105°C/W assuming copper is used (418 W/
m.°K). This high value is due to the thickness (34
µm) of the copper on the external side of the PCB.
Considering only the central matrix o f 36 thermal
balls and one via for each ball, the global therm al
resistance is 2.9°C/W. This can be easily im-
proved by using four 10 mil wires to connect to the
four vias around the ground pad link as in Fi
g
ure
6-3. This gives a t otal of 49 vias and a global resis-
tance for the 36 thermal balls of 0.6°C/W.
The use of a ground plane like in Fi
g
ure 6-4 is
even better.
To avoid s older wicking over t o the via pads during
soldering, it is important to have a solde r mask of
4 mil around the pa d (NSMD pad), this gives a di-
ameter of 33 mil fo r a 25 mil g round pad.
To obtain the optimum ground layout, place the
vias directly under the ball pads. In this case no lo-
cal b oard distortion is tolerated.
The thickness of the cop per on P CB layers is typ-
ically 34 µm for external layers and 17 µm for inter-
nal layers. This means thermal dissipation is not
good and te mperature of the boa rd is concent rat-
ed around the devices and falls quickly with in-
creased distance.
When it is possible to place a metal layer inside
the PCB, this improves dramatically the heat
spreading and hence thermal dissipation of the
board.
Figure 6-2. Recommended 1-wire ground pad layout
Figure 6-3. Recommended 4-wire ground pad layout
Solder Mask (4 mil)
Pad for ground ball (diamete r = 25 mil)
Hole to ground layer (diameter = 12 mil)
Connection Wire (width = 10 mil)
Via (diameter = 24 mil)
34.5 mil
1 mil = 0.0254 mm
4 via pad s for each ground ball
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Issue 2.2 - October 13, 2000 55/61
The P BGA Pac kage al so dissi pate s heat through
peripheral ground balls. When a heat sink is
placed on the device, heat is more uniformely
spread throughout the moulding increasing heat
dissipation through the peripheral ground balls.
The mo re v ia p ads are c on nec ted to each gro und
ball, the more heat is dissipated . Th e only limita-
tion is the risk of lossing routing channels.
Fi
g
ure 6-5 shows a routing with a good trade off
between thermal dissipation and number of rout-
ing channels.
Figu re 6- 4. Op timum layout for ce n tr al gr ound ball
Via to Ground layer
Pad for ground ball
Clearance = 6mil
diameter = 25 mil
hole diameter = 14 mil
Solder mask
diameter = 33 mil
External diameter = 37 mil
connections = 10 mil
Figure 6-5. Global ground layout for good thermal dissipation
Ground pad
Via to ground layer
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56/61 Issue 2.2 - October 13, 2000
A local ground plane on opposite side of the board
as shown i n Fi
g
ure 6-6 improves t herma l diss ipa-
tion. It is used t o connect decoupling capacitances
but can also be used for connection to a heat sink
or to the system’s metal box for better dissipation.
This possibility of using the whole system’s box for
thermal di ssipation is very usefull in case of h igh
temperature inside the system and low tempera-
ture outside. In that case, bot h sides of the PBGA
should be therm ally connec ted to the metal chas-
sis in order to propagate the heat through the met-
al. Fi
g
ure 6-7 illust r a te s su c h a n imple m e nt a tio n .
Figure 6-6. Bottom side layout and decouplin g
Ground plane for therma l dissipation
Via to ground layer
Figure 6-7. Use of metal plate for thermal dissipation
Metal planes Thermal conductor
Board
Die
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Issue 2.2 - October 13, 2000 57/61
6.2 HIGH SPEED SIGNALS
Some Interfaces of the STPC run at high speed
and have to be carefully routed or even shielded.
Here is the list of these interfaces, in decreasing
speed order:
- Memory Interface.
- Graphics and video interfaces
- PCI bus
- 14MHz oscillator stage
All the clocks have to be routed first and shielded
for speeds of 27MHz or more. The high speed sig-
nals have the same contrainsts as some of the
memory interface control signals.
The next interfaces to be routed are Memory, Vid-
eo/graphics, and PCI.
All the analog noise sensitive signals have to be
routed i n a s ep arate area and henc e ca n b e rout-
ed indepedent ly.
Figure 6-8. Shielding signals
ground ring
ground pad
shielded signal line
ground pad shielded signal lines
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7. ORDERING DATA
7.1 ORDERING CODES
ST PC D01 66 BT C 3
STMicroelectronics
Prefix
Product Family
PC: PC Compatible
Product ID
D01: Client
Core Speed
66: 66MHz
75: 75MHz
Package
BT: 388 Overmoulded BGA
Temperature Range
C: Commercial
Case Temperature (Tcase) = 0°C to +100°C
I: Industrial
Case Temperature (Tcase) = -40°C to +100°C
A: Auatomotive
Case Temperature (Tcase) = -40°C to +115°C
Operating Voltage
3 : 3.3V ± 0.3V
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Issue 2.2 - October 13, 2000 59/61
7.2 AVAILABLE PART NUMBERS
7.3 CUSTOMER SERVICE
More information is available on the
STMicroelectronics internet site http://
www.ST.com/STPC.
Any specific questions are to be addressed direct-
ly to the loc al ST S ale s Offi ce .
Part Number Core Frequency
( MHz ) CPU Mode
( DX / DX2 ) Tcase Range
( °C ) Operating Voltage
( V )
STPCD0166BTC3 66 DX 0°C to +100°C
3.3V ± 0.3V
STPCD0175BTC3 75 DX
STPCD0166BTI3 66 DX -40°C to +100°C
STPCD0175BTI3 75 DX
STPCD0166BTA3 66 DX -40°C to +115°C
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60/61 Issue 2.2 - October 13, 2000
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Issue 2.2