Ver. 201207
※Rated Current: DC current value when the self-generation of heat risesto 40℃(Reference ambient temperature:25℃)
※Operating temperature range: –40 to +125°C (Including self-temperature rise)
※Test equipment: Agilent :E4991A+16092A
1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.)
FEATURES
APPLICATION
CHARACTERISTIC DATA
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
DIMENSION
TYPE Dimension [mm]
L W T D
21 2.0±0.2 1.25±0.2 0.9±0.1 0.5+0.2
-0.3
DESCRIPTION
Part no. Size
(inch/mm) Inductance
(uH)@1MHz DC
Resistance(Ω)Rated Current (A)
Max.
CIG21W1R0MNE 0805/2012 1.0 ±25 % 0.133 ±20 % 1.05
CIG21W1R5MNE 0805/2012 1.5 ±25 % 0.150 ±20 % 0.96
CIG21W2R2MNE 0805/2012 2.2 ±20 % 0.200 ±20 % 0.81
CIG21W3R3MNE 0805/2012 3.3 ±20 % 0.250 ±20 % 0.73
CIG21W4R7MNE 0805/2012 4.7 ±20 % 0.300 ±20 % 0.65
Multilayer Power Inductor
RECOMMENDED LAND PATTERN
CIG21W Series (2012/ EIA 0805)
Low Profile (1.0mm max)
Low DC resistance
Magnetically shielded structure
Free of all RoHS-regulated substances
Monolithic structure for high reliability
Ver. 201207
CI G 21 W 1R0 M N E
(1) (2) (3) (4) (5) (6) (7) (8)
(1) Chip Inductor (2) Power Inductor
(3) Dimension (4) Product Series (W:Normal Type)
(5) Inductance (1R0:1.0uH) (6) Tolerance (M:±20%)
(7) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(8) Packaging(C:paper tape, E:embossed tape)
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
PACKAGING
Packaging Style Quantity(pcs/reel)
Embossed Taping 3,000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
REFLOW SOLDERING FLOW SOLDERING
