SN54ABT241, SN74ABT241A
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS184D – JANUARY 1991 – REVISED JANUAR Y 1997
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
State-of-the-Art
EPIC-
ΙΙ
B
BiCMOS Design
Significantly Reduces Power Dissipation
D
Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
D
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D
Typical VOLP (Output Ground Bounce) < 1 V
at VCC = 5 V, TA = 25°C
D
High-Drive Outputs (–32-mA IOH, 64-mA IOL)
D
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Plastic (N) and Ceramic (J) DIPs, and
Ceramic Flat (W) Package
description
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. Together with the SN54ABT240,
SN74ABT240A, and ’ABT244A, these devices
provide the choice of selected combinations of
inverting and noninverting outputs, symmetrical
active-low output-enable (OE) inputs, and
complementary OE and OE inputs.
T o ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. OE
should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the
current-sourcing capability of the driver.
The SN54ABT241 is characterized for operation over the full military temperature range of –55°C to 125°C. The
SN74ABT241A is characterized for operation from –40°C to 85°C.
Copyright 1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC-ΙΙB is a trademark of Texas Instruments Incorporated.
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
SN54ABT241 ...J OR W PACKAGE
SN74ABT241A . . . DB, DW, N, OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
1Y1
2A4
1Y2
2A3
1Y3
1A2
2Y3
1A3
2Y2
1A4
SN54ABT241 . . . FK PACKAGE
(TOP VIEW)
2Y4
1A1
1OE
1Y4
2A2 2OE
2Y1
GND
2A1 VCC
SN54ABT241, SN74ABT241A
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS184D – JANUARY 1991 – REVISED JANUAR Y 1997
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLES
INPUTS OUTPUT
1OE 1A 1Y
L H H
LLL
H X Z
INPUTS OUTPUT
2OE 2A 2Y
H H H
HLL
L X Z
logic symbol†
2
1A1 4
1A2 6
1A3 8
1A4
EN
1
1Y1
18
1Y2
16
1Y3
14
1Y4
12
11
2A1 13
2A2 15
2A3 17
2A4
EN
19
2OE
2Y1
9
2Y2
7
2Y3
5
2Y4
3
1OE
†This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
1
218
1Y1
1OE
1A1
416
1Y2
1A2
614
1Y3
1A3
812
1Y4
1A4
19
11 9 2Y1
2OE
2A1
13 7 2Y2
2A2
15 5 2Y3
2A3
17 3 2Y4
2A4
SN54ABT241, SN74ABT241A
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS184D – JANUARY 1991 – REVISED JANUAR Y 1997
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high or power-off state, VO –0.5 V to 5.5 V. . . . . . . . . . . . . . . . . . .
Current into any output in the low state, IO: SN54ABT241 96 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74ABT241A 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) –18 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DB package 115°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 128°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages,
which use a trace length of zero.
recommended operating conditions (see Note 3)
SN54ABT241 SN74ABT241A
UNIT
MIN MAX MIN MAX
UNIT
VCC Supply voltage 4.5 5.5 4.5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VIInput voltage 0 VCC 0 VCC V
IOH High-level output current –24 –32 mA
IOL Low-level output current 48 64 mA
∆t/∆vInput transition rise or fall rate Outputs enabled 5 5 ns/V
TAOperating free-air temperature –55 125 –40 85 °C
NOTE 3: Unused inputs must be held high or low to prevent them from floating.
SN54ABT241, SN74ABT241A
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS184D – JANUARY 1991 – REVISED JANUAR Y 1997
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
TA = 25°C SN54ABT241 SN74ABT241A
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYP†MAX MIN MAX MIN MAX
UNIT
VIK VCC = 4.5 V, II = –18 mA –1.2 –1.2 –1.2 V
VCC = 4.5 V, IOH = –3 mA 2.5 2.5 2.5
VOH
VCC = 5 V, IOH = –3 mA 3 3 3
V
V
OH
VCC =45V
IOH = –24 mA 2 2
V
V
CC =
4
.
5
V
IOH = –32 mA 2* 2
VOL
VCC =45V
IOL = 48 mA 0.55 0.55
V
V
OL
V
CC =
4
.
5
V
IOL = 64 mA 0.55* 0.55
V
Vhys 100 mV
IIVCC = 5.5 V, VI = VCC or GND ±1±1±1µA
IOZH VCC = 5.5 V, VO = 2.7 V 10 10 10 µA
IOZL VCC = 5.5 V, VO = 0.5 V –10 –10 –10 µA
Ioff VCC = 0, VI or VO ≤ 4.5 V ±100 ±100 µA
ICEX VCC = 5.5 V, VO = 5.5 V Outputs high 50 50 50 µA
IO‡VCC = 5.5 V, VO = 2.5 V –50 –100 –180 –50 –180 –50 –180 mA
V55VI0
Outputs high 1 250 250 250 µA
ICC VCC = 5.5 V, IO = 0,
VI=V
CC or GND
Outputs low 24 30 30 30 mA
VI
=
VCC
or
GND
Outputs disabled 0.5 250 250 250 µA
§
Data VCC = 5.5 V,
One input at 3.4 V, Outputs enabled 1.5 1.5 1.5
∆ICC
§
inputs
,
Other inputs at
VCC or GND Outputs disabled 0.05 0.05 0.05 mA
Control
inputs VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND 1.5 1.5 1.5
CiVI = 2.5 V or 0.5 V 4 pF
CoVO = 2.5 V or 0.5 V 5.5 pF
* On products compliant to MIL-PRF-38535, this parameter does not apply.
†All typical values are at VCC = 5 V.
‡Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
§This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
SN54ABT241, SN74ABT241A
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS184D – JANUARY 1991 – REVISED JANUAR Y 1997
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54ABT241
PARAMETER FROM
(INPUT) TO
(OUTPUT) VCC = 5 V,
TA = 25°CMIN MAX UNIT
MIN TYP MAX
tPLH
A
Y
1 2.6 4.1 0.8 5.3
ns
tPHL
A
Y
1 2.9 4.2 0.8 5
ns
tPZH
OE or OE
Y
1.1 4.8 6.3 1 7
ns
tPZL
OE
or
OE
Y
1.3 4.3 5.8 1 7
ns
tPHZ
OE or OE
Y
1.1 4.6 6.1 0.8 7.9
ns
tPLZ
OE
or
OE
Y
1 3.9 5.4 0.8 6.2
ns
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN74ABT241A
PARAMETER FROM
(INPUT) TO
(OUTPUT) VCC = 5 V,
TA = 25°CMIN MAX UNIT
MIN TYP MAX
tPLH
A
Y
1 2.6 4.1 1 4.6
ns
tPHL
A
Y
1 2.9 4.4 1 4.6
ns
tPZH
OE or OE
Y
1.1 4.8 6.3 1.1 6.8
ns
tPZL
OE
or
OE
Y
1.3 4.3 5.8 1.3 6.8
ns
tPHZ
OE or OE
Y
1.6 4.6 6.1 1.6 7.1
ns
tPLZ
OE
or
OE
Y
1 3.9 5.4 1 5.9
ns
SN54ABT241, SN74ABT241A
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS184D – JANUARY 1991 – REVISED JANUAR Y 1997
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
1.5 V
th
tsu
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
7 V
Open
GND
500 Ω
500 Ω
Data Input
Timing Input 1.5 V 3 V
0 V
1.5 V 1.5 V
3 V
0 V
3 V
0 V
1.5 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
1.5 V 1.5 V 3 V
0 V
1.5 V1.5 V
Input
1.5 V
Output
Control
Output
W aveform 1
S1 at 7 V
(see Note B)
Output
W aveform 2
S1 at Open
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
1.5 V1.5 V
3.5 V
0 V
1.5 V VOL + 0.3 V
1.5 V VOH – 0.3 V
≈ 0 V
3 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7 V
Open
TEST S1
Output
Control
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2. 5 n s, t f≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
1.5 V
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9322701Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9322701QRA ACTIVE CDIP J 20 1 TBD Call TI Call TI
5962-9322701QSA ACTIVE CFP W 20 1 TBD Call TI Call TI
SN74ABT241ADBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI
SN74ABT241ADBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT241ADBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT241ADBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT241ADW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT241ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT241ADWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT241ADWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT241ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT241AN ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74ABT241ANE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74ABT241APW ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT241APWE4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT241APWG4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT241APWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI
SN74ABT241APWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT241APWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74ABT241APWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54ABT241FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54ABT241J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SNJ54ABT241W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54ABT241 :
•Catalog: SN74ABT241
NOTE: Qualified Version Definitions:
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 3
•Catalog - TI's standard catalog product
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74ABT241ADBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74ABT241ADWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74ABT241APWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ABT241ADBR SSOP DB 20 2000 367.0 367.0 38.0
SN74ABT241ADWR SOIC DW 20 2000 367.0 367.0 45.0
SN74ABT241APWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
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Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
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Interface interface.ti.com Medical www.ti.com/medical
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Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
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Wireless Connectivity www.ti.com/wirelessconnectivity
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