Document Number: 68020 For technical questions, contact: te1resistors@vishay.com www.vishay.com
Revision: 19-Nov-08 5
CDHV 2512
Vishay Techno
Thick Film Chip Dividers, High Voltage
ELECTRICAL SPECIFICATIONS
Resistance Range: 1 MΩ to 20 GΩ
Resistance Tolerance: ± 1 % to ± 20 %
Power Rating: See table
Voltage Coefficient: See table
Temperature Coefficient: See table
Ratio Tracking: See table
MECHANICAL SPECIFICATIONS
Construction: 96 % alumina substrate with proprietary
cermet resistance element and specified termination
material
FEATURES
High voltage up to 3000 V
Typical resistance ratios of 250:1, 500:1, etc.
Flow solderable
Tape and reel packaging available
Available with either wraparound terminations
or as a single termination flip chip
Suitable for solderable, epoxy bondable, or wire bondable
applications
Termination: Gold, palladium silver, platinum gold,
platinum silver, platinum palladium gold or solder-coated
nickel barrier available
Multiple styles, termination materials and configurations,
allow wide design flexibility
Non-magnetic terminations available
Lead (Pb)-free version is RoHS compliant
ENVIRONMENTAL SPECIFICATIONS
Operating temperature: - 55 °C to + 150 °C
Life: Less than 0.5 % change when tested at full rated power
(Reference only: Not for all values specified. Consult factory for your
size and value.)
Note
(1) Resistance values below 1 GΩ are calibrated at 100 VDC, and values of 1 GΩ and above are calibrated at 1000 VDC. Calibration at other
voltages available upon request.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Available
Pb-free
RoHS*
COMPLIANT
STANDARD ELECTRICAL SPECIFICATIONS
RESISTANCE (Ω) (1) POWER RATING (mW) VOLTAGE RATING (V max.)
20M to 20G contact factory 3000
VOLTAGE AND TEMPERATURE COEFFICIENTS OF RESISTANCE CHART TYPICAL
RESISTANCE (Ω) RATIO (typical) VCR (ppm/V) TCR (ppm/°C) - 55 °C to + 150 °C
20M 250:1 5 260
150M 300:1 5 80
800M 300:1 10 50
20G 700:1 90 160
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: CDHVAA20M0J2500GFB (preferred part number format)
GLOBAL
MODEL
TERM
STYLE TERM MATERIAL RESISTANCE
VALUE (R1) TOLERANCE RATIO
R1/R2
RATIO
TOLERANCE
SOLDER
TERMINATION PAC K AG I N G
CDHV
=
CDHV2512
A
= 3-sided
B
= top only
A
= Palladium silver
B
= Platinum gold
C
= Gold
D
= Platinum silver
E
= Platinum
palladium gold
F
= Nickel barrier
M = Million
G = Billion
20M0
= 20 M
Ω
800M
= 800 M
Ω
20G0
= 20 G
Ω
F
= ± 1.0 %
G
= ± 2.0 %
H
= ± 3.0 %
J
= ± 5.0 %
K
= ± 10.0 %
M
= ± 20.0 %
3 digit
significant
figure, followed
by a multiplier
2500 = 250:1
3000 = 300:1
7000 = 700:1
F
= ± 1.0 %
G
= ± 2.0 %
H
= ± 3.0 %
J
= ± 5.0 %
E
= Sn100
F
= Sn95/Ag5
N
= No solder
S
=
Sn62/Pb36/Ag2
T
= Sn90/Pb10
B
= Bulk
T
= Tape and
reel
W
= Waffle
Historical Part Numbering: CDHV2512AA2005J2500Ge2 (will continue to be accepted)
CDHV2512 A A 2005 J 2500 G e2
HISTORICAL
MODEL
TERM
STYLE
TERM
MATERIAL
RESISTANCE
VALUE (R1) TOLERANCE RATIO
R1/R2
RATIO
TOLERANCE
SOLDER
TERMINATION
VAA2 M0 J0DH 250 BC G0 F
www.vishay.com For technical questions, contact: te1resistors@vishay.com Document Number: 68020
6Revision: 19-Nov-08
CDHV 2512
Vishay Techno Thick Film Chip Dividers, High Voltage
RATIO TRACKING (ppm/°C)
RESISTANCE (Ω) RATIO (typical) COLD (+ 25 °C to - 50 °C) HOT (+ 25 °C to + 150 °C)
20M 250:1 5 260
150M 300:1 5 80
800M 300:1 10 50
20G 700:1 90 160
Note
• Contact factory for other ratios
DIMENSIONS in inches [millimeters]
TERMINATION LENGTH (L)
± 0.006 [0.152]
WIDTH (W)
± 0.006 [0.152]
THICKNESS (T)
± 0.002 [0.051] A ± 0.005 B ± 0.005 C ± 0.005 E ± 0.005
STYLE A
(wraparound 3 sided) 0.250 0.126 0.025 0.025 0.025 0.040 0.046
STYLE B
(top only) 0.240 0.126 0.025 0.025 0.025 0.040 -
B
B
C
C
TT
A
A
WW
L
Style A Style B
B
A
B
A
Style A Bottom
(3-sided wraparound)
E
C
B
W
A
DERATING CURVE
(Reference only: Not for all values specified. Consult factory for your size and value.)
20 50 70 100 150
120
100
80
60
40
20
0
% OF RA TED POWER
AMBIENT TEMPERATURE IN °C
Document Number: 68020 For technical questions, contact: te1resistors@vishay.com www.vishay.com
Revision: 19-Nov-08 7
CDHV 2512
Thick Film Chip Dividers, High Voltage Vishay Techno
Notes
(1) Use solder termination N for applications requiring wire bondable mounting, and solder terminations F or S for applications requiring solderable
mounting.
(2) While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.
(3) Standard solder plating for the nickel barrier parts are solder terminations E or T. Hot solder dipped terminations F or S are also available.
TYPE TERMINATION
MATERIAL
TERMINATION
STYLE
TERMINATION STYLE/
MATERIAL CODE
SOLDER TERMINATION
CODE
Solderable Nickel barrier
3-sided (wraparound) AF
E, F, S or T (3)
Top only (flip chip) BF
Wire bondable/
Solderable Platinum palladium gold
3-sided (wraparound) AE
N, F or S (1)
Top only (flip chip) BE
Wire bondable/
Epoxy bondable Gold
3-sided (wraparound) AC
N
Top only (flip chip) BC
Epoxy bondable
Palladium silver (2)
3-sided (wraparound) AA
N
Top only (flip chip) BA
Platinum gold
3-sided (wraparound) AB
Top only (flip chip) BB
Platinum silver
3-sided (wraparound) AD
Top only (flip chip) BD
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
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Vishay
All product specifications and data are subject to change without notice.
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(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
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otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
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