1
PF910-03
Micro MINI S1C60N03
4-bit Single Chip Microcomputer
S1C6200B Core CPU
Low Voltage and Low Power
Built-in LCD Driver
Low Cost Performance
DESCRIPTION
The S1C60N03 Series single-chip microcomputer features an S1C6200B CMOS 4-bit CPU as the core. It
contains a 768 (words) × 12 (bits) ROM, 64 (words) × 4 (bits) RAM, LCD driver , 4-bit input port (K00–K03), 4-bit
output port (R00–R03) and a timer.
The S1C60N03 Series is configured as follows, depending on the supply voltage.
S1C60N03: 3.0 V (1.8 to 3.6 V)
S1C60L03: 1.5 V (1.2 to 2.0 V)
FEATURES
Core CPU..............................................S1C6200B
Built-in oscillation circuit ........................Crystal 32.768 kHz (Typ.) or CR oscillation circuit 65 kHz (Typ.)
Instruction set........................................100 instructions
ROM capacity........................................768 words × 12 bits
RAM capacity ........................................64 words × 4 bits
Input port ...............................................4 bits (pull-down resistors are available by mask option)
Output ports ..........................................4 bits (clock and buzzer outputs are possible by mask option)
LCD driver .............................................15 segments × 4, 3 or 2 commons (1/4, 1/3 or 1/2 duty are select-
able by mask option)
Timer .....................................................1 system (clock timer) built-in
Interrupt.................................................External: Input port interrupt 1 system
Internal: Timer interrupt 1 system
Supply voltage.......................................1.5 V (1.2 to 2.0 V) S1C60L03
3.0 V (1.8 to 3.6 V) S1C60N03
Current consumption (Typ.) ..................During HALT: 1.0 µA (32 kHz crystal, with power divider OFF)
During execution: 2.5 µA (32 kHz crystal, with power divider OFF)
15 µA (32 kHz crystal, with power divider ON)
Supply form ...........................................Chip
Low Voltage
Operation
Products
2
S1C60N03
BLOCK DIAGRAM
OSC1
OSC2
COM03
SEG014
V
DD
CA, CB
V
S2
V
SS
K00K03
TEST
RESET
R00 (FOUT, BUZZER)
1
R01 (BUZZER)
1
R02, R03
1: Terminal specifications can be selected by mask option.
Core CPU S1C6200B
ROM
768 words × 12 bits
System Reset
Control
Interrupt
Generator
RAM
64 words × 4 bits
LCD Driver
15 SEG × 4 COM
Power
Controller
OSC
FOUT
& Buzzer
Clock
Timer
Input Port
Output Port
PAD LAYOUT
Pad Layout Diagram
X
(0, 0)
Die No.
Y
2.03 mm
2.32 mm
151015
20 25
30
35
Chip thickness: 400 µm
Pad opening: 95 µm
Pad Coordinates (unit: µm)
No.
1
2
3
4
5
6
7
8
9
10
11
12
Pad name
TEST
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
X
980
850
720
590
460
330
200
70
-60
-190
-320
-450
Y
849
849
849
849
849
849
849
849
849
849
849
849
No.
13
14
15
16
17
18
19
20
21
22
23
24
Pad name
SEG3
SEG2
SEG1
SEG0
COM0
COM1
COM2
COM3
CA
CB
V
S2
V
SS
X
-580
-710
-840
-970
-983
-853
-723
-593
-463
-333
-203
-50
Y
849
849
849
849
-849
-849
-849
-849
-849
-849
-849
-849
No.
25
26
27
28
29
30
31
32
33
34
35
36
Pad name
OSC2
OSC1
V
DD
RESET
R00
R01
R02
R03
K00
K01
K02
K03
X80
210
340
470
994
994
994
994
994
994
994
994
Y
-849
-849
-849
-849
-760
-542
-403
-269
-120
10
140
270
3
S1C60N03
PAD DESCRIPTION
Pad name
VDD
VSS
VS2
CA, CB
OSC1
OSC2
K0003
R00
R01
R02, R03
SEG014
COM03
RESET
TEST
Function
Power supply terminal (+)
Power supply terminal (-)
LCD system voltage doubler (2·VSS)/halver (VSS/2) output
Booster capacitor connecting terminal
Crystal or CR oscillation input terminal
Crystal or CR oscillation output terminal
Input port terminal
Output port terminal, BUZZER or FOUT output terminal
Output port terminal or BUZZER output terminal
Output port terminal
LCD segment output or DC output terminal
LCD common output terminal (1/4, 1/3 or 1/2 duty are selectable )
Initial reset input terminal
Test input terminal
Pad No.
27
24
23
21, 22
26
25
3336
29
30
31, 32
216
1720
28
1
I/O
(I)
(I)
O
I
O
I
O
O
O
O
O
I
I
Can be selected by mask option
OPTION LIST
1. DEVICE TYPE 1. E0C6003 (Normal Type <S1C60N03>)
2. E0C60L03 (Low Power Type <S1C60L03>)
2. LCD SPECIFICATION
BIAS SELECTION ...................... 1. 1/3 Bias By Voltage Divider
2. 1/2 Bias By Voltage Divider
3. 1/2 Bias By Doubler/Halver
DUTY SELECTION..................... 1. 1/4 Duty
2. 1/3 Duty
3. 1/2 Duty
3. OSC1 SYSTEM CLOCK 1. Crystal
2. CR
4. MULTIPLE KEY ENTRY RESET
COMBINATION........................... 1. Not Use
2. Use K00, K01
3. Use K00, K01, K02
4. Use ALL K00K03
5. INTERRUPT NOISE REJECTOR
K00K03 ..................................... 1. Use
2. Not Use
6. TIMER INTERRUPT FREQUENCY
INTERRUPT FREQUENCY........ 1. 32/16/2 Hz Interrupt
2. 64/16/2 Hz Interrupt
7. INPUT PORT PULL DOWN RESISTOR
K00 .............................................. 1. With Resistor 2. Gate Direct
K01 .............................................. 1. With Resistor 2. Gate Direct
K02 .............................................. 1. With Resistor 2. Gate Direct
K03 .............................................. 1. With Resistor 2. Gate Direct
8. R00 SPECIFICATION
OUTPUT TYPE ........................... 1. DC Output
2. Buzzer Inverted Output (R00 Control)
3. FOUT Output
4
S1C60N03
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Rating
Supply voltage
Input voltage (1)
Input voltage (2)
Permissible total output current *1
Operating temperature
Storage temperature
Soldering temperature / time
Permissible dissipation
1: The permissible total output current is the sum total of the current (average current) that simultaneously flows from the output pin
(or is drawn in).
Symbol
VSS
VI
VIOSC
ΣIVSS
Topr
Tstg
Tsol
PD
Value
-5.0 to 0.5
VSS - 0.3 to 0.5
VSS - 0.3 to 0.5
10
-20 to 70
-65 to 150
260°C, 10sec (lead section)
250
Unit
V
V
V
mA
°C
°C
mW
(VDD=0V)
Recommended Operating Conditions
S1C60N03
Condition
Supply voltage
Oscillation frequency
Booster capacitor
Capacitor between V
DD
and V
S2
Symbol
V
SS
f
OSC
C
1
C
2
Remark
V
DD
=0V
Crystal oscillation
CR oscillation, R
CR
=470k
Unit
V
kHz
kHz
µF
µF
(Ta=-20 to 70°C)
Max.
-1.8
80
Typ.
-3.0
32.768
65
Min.
-3.6
50
0.1
0.1
S1C60L03
Condition
Supply voltage
Oscillation frequency
Booster capacitor
Capacitor between V
DD
and V
S2
Symbol
V
SS
f
OSC
C
1
C
2
Remark
V
DD
=0V
Crystal oscillation
CR oscillation, R
CR
=470k
Unit
V
kHz
kHz
µF
µF
(Ta=-20 to 70°C)
Max.
-1.2
80
Typ.
-1.5
32.768
65
Min.
-0.2
50
0.1
0.1
FOUT OUTPUT SPACIFICATION
F1 ........... 1. 256[Hz]
2. 512[Hz]
3. 1,024[Hz]
4. 2,048[Hz]
5. 4,096[Hz]
F2 ........... 1. 512[Hz]
2. 1,024[Hz]
3. 2,048[Hz]
4. 4,096[Hz]
5. 8,192[Hz]
F3 ........... 1. 1,024[Hz]
2. 2,048[Hz]
3. 4,096[Hz]
4. 8,192[Hz]
5. 16,384[Hz]
F4 ........... 1. 2,048[Hz]
2. 4,096[Hz]
3. 8,192[Hz]
4. 16,384[Hz]
5. 32,768[Hz]
OUTPUT SPECIFICATION........... 1. Complementary 2. Pch-Open Drain
9. R01 SPECIFICATION
OUTPUT TYPE ............................. 1. DC Output 2. Buzzer Output
OUTPUT SPECIFICATION........... 1. Complementary 2. Pch-Open Drain
10.R02, R03 SPECIFICATION
R02 OUTPUT SPECIFICATION... 1. Complementary 2. Pch-Open Drain
R03 OUTPUT SPECIFICATION... 1. Complementary 2. Pch-Open Drain
5
S1C60N03
DC Characteristics
S1C60N03
Unit
V
V
V
V
µA
µA
µA
µA
mA
mA
mA
mA
µA
µA
µA
µA
µA
µA
(Unless otherwise specified: V
DD
=0V, V
SS
=-3.0V, f
OSC
=32.768kHz, Ta=25°C, V
S2
is internal voltage
, C
1
=C
2
=0.1µF)
Max.
0
0
0.8V
SS
0.85V
SS
0.5
40
100
0
-1.0
-1.0
-3
-3
-300
Typ.Min.
0.2V
SS
0.15V
SS
V
SS
V
SS
0
10
30
-0.5
3.0
3.0
3
3
300
Characteristic
High level input voltage (1)
High level input voltage (2)
Low level input voltage (1)
Low level input voltage (2)
High level input current (1)
High level input current (2)
High level input current (3)
Low level input current
High level output current (1)
High level output current (2)
Low level output current (1)
Low level output current (2)
Common output current
Segment output current
(during LCD output)
Segment output current
(during DC output)
Symbol
V
IH1
V
IH2
V
IL1
V
IL2
I
IH1
I
IH2
I
IH3
I
IL
I
OH1
I
OH2
I
OL1
I
OL2
I
OH3
I
OL3
I
OH4
I
OL4
I
OH5
I
OL5
V
IH1
=0V, No pull down resistor
V
IH2
=0V, With pull down resistor
V
IH3
=0V, With pull down resistor
V
IL
=V
SS
V
OH1
=0.1V
SS
V
OH2
=0.1V
SS
(built-in protection resistance)
V
OL1
=0.9V
SS
V
OL2
=0.9V
SS
(built-in protection resistance)
V
OH3
=-0.05V
V
OL3
=V
L3
+0.05V
V
OH4
=-0.05V
V
OL4
=V
L3
+0.05V
V
OH5
=0.1V
SS
V
OL5
=0.9V
SS
Condition K00K03
RESET
K00K03
RESET
K00K03
K00K03
RESET
K00K03
RESET, TEST
R02, R03
R00, R01
R02, R03
R00, R01
COM0COM3
SEG0SEG14
SEG0SEG14
S1C60L03
Unit
V
V
V
V
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
(Unless otherwise specified: V
DD
=0V, V
SS
=-1.5V, f
OSC
=32.768kHz, Ta=25°C, V
S2
is internal voltage
, C
1
=C
2
=0.1µF)
Max.
0
0
0.8V
SS
0.85V
SS
0.5
20
100
0
-200
-200
-3
-3
-100
Typ.Min.
0.2V
SS
0.15V
SS
V
SS
V
SS
0
5.0
9.0
-0.5
700
700
3
3
130
Characteristic
High level input voltage (1)
High level input voltage (2)
Low level input voltage (1)
Low level input voltage (2)
High level input current (1)
High level input current (2)
High level input current (3)
Low level input current
High level output current (1)
High level output current (2)
Low level output current (1)
Low level output current (2)
Common output current
Segment output current
(during LCD output)
Segment output current
(during DC output)
Symbol
V
IH1
V
IH2
V
IL1
V
IL2
I
IH1
I
IH2
I
IH3
I
IL
I
OH1
I
OH2
I
OL1
I
OL2
I
OH3
I
OL3
I
OH4
I
OL4
I
OH5
I
OL5
V
IH1
=0V, No pull down resistor
V
IH2
=0V, With pull down resistor
V
IH3
=0V, With pull down resistor
V
IL
=V
SS
V
OH1
=0.1V
SS
V
OH2
=0.1V
SS
(built-in protection resistance)
V
OL1
=0.9V
SS
V
OL2
=0.9V
SS
(built-in protection resistance)
V
OH3
=-0.05V
V
OL3
=V
L3
+0.05V
V
OH4
=-0.05V
V
OL4
=V
L3
+0.05V
V
OH5
=0.1V
SS
V
OL5
=0.9V
SS
Condition K00K03
RESET
K00K03
RESET
K00K03
K00K03
RESET
K00K03
RESET, TEST
R02, R03
R00, R01
R02, R03
R00, R01
COM0COM3
SEG0SEG14
SEG0SEG14
Analog Circuit Characteristics and Current Consumption
S1C60N03 (Crystal Oscillation)
Unit
V
V
V
µA
µA
µA
(Unless otherwise specified: VDD=0V, VSS=-3.0V, fOSC=32.768kHz, Ta=25°C, CG=25pF, VS2 is internal voltage, C1=C2=0.1µF)
Max.
1/3·VSS
×0.9
2/3·VSS
×0.9
2.5
5.0
20
Typ.
1/3·VSS
2/3·VSS
VSS
1.0
2.0
15
Min.
1/3·VSS
- 0.1
2/3·VSS
- 0.1
Characteristic
LCD drive voltage
Current consumption
Symbol
VL1
VL2
VL3
IHLT
IEXE1
IEXE2
Condition
Connect 1 M load resistor between VDD and segment
driver (SEG0SEG14) when segment driver's level is VL1
Connect 1 M load resistor between VDD and segment
driver (SEG0SEG14) when segment driver's level is VL2
Connect 1 M load resistor between VDD and segment
driver (SEG0SEG14) when segment driver's level is VL3
During HALT with LCD OFF
During operation with LCD OFF
During operation with power divider ON No panel load
6
S1C60N03
S1C60L03 (Crystal Oscillation)
Unit
V
V
V
µA
µA
µA
(Unless otherwise specified: VDD=0V, VSS=-1.5V, fOSC=32.768kHz, Ta=25°C, CG=25pF, VS2 is internal voltage, C1=C2=0.1µF)
Max.
1/3·VS2
×0.9
2/3·VS2
×0.9
VS2
×0.9
2.5
5.0
20
Typ.
1/3·VS2
2/3·VS2
VS2
1.0
2.0
15
Min.
1/3·VS2
- 0.1
2/3·VS2
- 0.1
VS2
- 0.1
Characteristic
LCD drive voltage
Current consumption
Symbol
VL1
VL2
VL3
IHLT
IEXE1
IEXE2
Condition
Connect 1 M load resistor between VDD and segment
driver (SEG0SEG14) when segment driver's level is VL1
Connect 1 M load resistor between VDD and segment
driver (SEG0SEG14) when segment driver's level is VL2
Connect 1 M load resistor between VDD and segment
driver (SEG0SEG14) when segment driver's level is VL3
During HALT with LCD OFF
During operation with LCD OFF
During operation with power divider ON No panel load
S1C60N03 (CR Oscillation)
Unit
V
V
V
µA
µA
µA
(Unless otherwise specified: VDD=0V, VSS=-3.0V, fOSC=65kHz, Ta=25°C, RCR=470k, VS2 is internal voltage, C1=C2=0.1µF)
Max.
1/3·VSS
×0.9
2/3·VSS
×0.9
15
20
30
Typ.
1/3·VSS
2/3·VSS
VSS
8
15
25
Min.
1/3·VSS
- 0.1
2/3·VSS
- 0.1
Characteristic
LCD drive voltage
Current consumption
Symbol
VL1
VL2
VL3
IHLT
IEXE1
IEXE2
Condition
Connect 1 M load resistor between VDD and segment
driver (SEG0SEG14) when segment driver's level is VL1
Connect 1 M load resistor between VDD and segment
driver (SEG0SEG14) when segment driver's level is VL2
Connect 1 M load resistor between VDD and segment
driver (SEG0SEG14) when segment driver's level is VL3
During HALT with LCD OFF
During operation with LCD OFF
During operation with power divider ON No panel load
S1C60L03 (CR Oscillation)
Unit
V
V
V
µA
µA
µA
(Unless otherwise specified: VDD=0V, VSS=-1.5V, fOSC=65kHz, Ta=25°C, RCR=470k, VS2 is internal voltage, C1=C2=0.1µF)
Max.
1/3·VS2
×0.9
2/3·VS2
×0.9
VS2
×0.9
15
20
30
Typ.
1/3·VS2
2/3·VS2
VS2
8
15
25
Min.
1/3·VS2
- 0.1
2/3·VS2
- 0.1
VS2
- 0.1
Characteristic
LCD drive voltage
Current consumption
Symbol
VL1
VL2
VL3
IHLT
IEXE1
IEXE2
Condition
Connect 1 M load resistor between VDD and segment
driver (SEG0SEG14) when segment driver's level is VL1
Connect 1 M load resistor between VDD and segment
driver (SEG0SEG14) when segment driver's level is VL2
Connect 1 M load resistor between VDD and segment
driver (SEG0SEG14) when segment driver's level is VL3
During HALT with LCD OFF
During operation with LCD OFF
During operation with power divider ON No panel load
Oscillation Characteristics
Oscillation characteristics will vary according to different conditions (elements used, boad pattern). Use the following char-
acteristics are as reference values.
S1C60N03 Crystal Oscillation
Unit
V
V
pF
ppm
ppm
ppm
V
M
(Unless otherwise specified: V
DD
=0V, V
SS
=-3.0V, f
OSC
=32.768kHz, Crystal: Q13MC146, C
G
=25pF, C
D
=built-in, Ta=25°C)
Max.
5
10
-3.6
Typ.
20
Min.
-1.8
-1.8
-10
40
200
Characteristic
Oscillation start voltage
Oscillation stop voltage
Built-in capacitance (drain)
Frequency/voltage deviation
Frequency/IC deviation
Frequency adjustment range
Harmonic oscillation start voltage
Permitted leak resistance
Symbol
Vsta
Vstp
C
D
f/V
f/IC
f/C
G
V
hho
R
leak
Condition
t
sta5sec (V
SS
)
t
stp10sec (V
SS
)
Including the parasitic capacitance inside the IC
(in chip)
V
SS
=-1.8 to -3.6V
C
G
=5 to 25pF
C
G
=5pF (V
SS
)
Between OSC1 and V
DD
7
S1C60N03
S1C60L03 Crystal Oscillation
Unit
V
V
pF
ppm
ppm
ppm
V
M
(Unless otherwise specified: V
DD
=0V, V
SS
=-1.5V, f
OSC
=32.768kHz, Crystal: Q13MC146, C
G
=25pF, C
D
=built-in, Ta=25°C)
Max.
5
10
-2.0
Typ.
20
Min.
-1.2
-1.2
-10
40
200
Characteristic
Oscillation start voltage
Oscillation stop voltage
Built-in capacitance (drain)
Frequency/voltage deviation
Frequency/IC deviation
Frequency adjustment range
Harmonic oscillation start voltage
Permitted leak resistance
Symbol
Vsta
Vstp
C
D
f/V
f/IC
f/C
G
V
hho
R
leak
Condition
t
sta5sec (V
SS
)
t
stp10sec (V
SS
)
Including the parasitic capacitance inside the IC
(in chip)
V
SS
=-1.2 to -2.0V
C
G
=5 to 25pF
C
G
=5pF (V
SS
)
Between OSC1 and V
DD
S1C60N03 CR Oscillation
Unit
%
V
mS
V
(Unless otherwise specified: V
DD
=0V, V
SS
=-3.0V, R
CR
=470k, Ta=25°C)
Max.
20
Typ.
65kHz
3
Min.
-20
-1.8
-1.8
Characteristic
Oscillation frequency dispersion
Oscillation start voltage
Oscillation start time
Oscillation stop voltage
Symbol
f
OSC
Vsta
t
sta
Vstp
Condition
(V
SS
)
V
SS
=-1.8 to -3.6V
(V
SS
)
S1C60L03 CR Oscillation
Unit
%
V
mS
V
(Unless otherwise specified: V
DD
=0V, V
SS
=-1.5V, R
CR
=470k, Ta=25°C)
Max.
20
Typ.
65kHz
3
Min.
-20
-1.2
-1.2
Characteristic
Oscillation frequency dispersion
Oscillation start voltage
Oscillation start time
Oscillation stop voltage
Symbol
f
OSC
Vsta
t
sta
Vstp
Condition
(V
SS
)
V
SS
=-1.2 to -2.0V
(V
SS
)
BASIC EXTERNAL CONNECTION DIAGRAM
Piezo Buzzer Single Terminal Driving
Note: Use a 1 µF capacitor for C1 and C2 when "S1C60L03 1/3 bias" is selected,
or a 0.1 µF capacitor when "S1C60N03 1/2 bias" or "S1C60L03 1/2 bias (A), (B)" is selected.
No capacitor is required for C1 and C2 when another specification is selected.
C
1
C
2
C
G
X'tal
1.5 V (S1C60L03)
3.0 V (S1C60N03)
Piezo
Buzzer
R01
K00
K03
R00
R02
R03
SEG0
SEG14
COM0
COM3
LCD PANEL
S1C60N03
S1C60L03
Coil
CA
CB
V
DD
V
S2
OSC1
OSC2
RESET
TEST
V
SS
Cp
X'tal
C
G
R
CR
C
1
, C
2
Cp
Crystal oscillator
Trimmer capacitor
Resistor for CR oscillation
Capacitor
Capacitor
32.768 kHz, C
I
(Max.) = 35 k
525 pF
470 k (65 kHz)
1 µF (see Note)
3.3 µF
12
R
CR
1 Crystal oscillation
2 CR oscillation
I
O
S1C60N03
NOTICE:
No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko
Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any liability of any kind arising out of
any inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there is no representation that
this material is applicable to products requiring high level reliability, such as, medical products. Moreover, no license to any intellectual
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license from the Ministry of International Trade and Industry or other approval from another government agency.
© Seiko Epson Corporation 2001 All right reserved.
SEIKO EPSON CORPORATION
ELECTRONIC DEVICES MARKETING DIVISION
IC Marketing & Engineering Group
ED International Marketing Department Europe & U.S.A.
421-8, Hino, Hino-shi, Tokyo 191-8501, JAPAN
Phone : 042-587-5812 FAX : 042-587-5564
ED International Marketing Department Asia
421-8, Hino, Hino-shi, Tokyo 191-8501, JAPAN
Phone : 042-587-5814 FAX : 042-587-5110
http://www.epson.co.jp/device/
EPSON Electronic Devices Website
First issue February, 1999 M
Printed July, 2001 in Japan L
Note: Use a 1 µF capacitor for C1 and C2 when "S1C60L03 1/3 bias" is selected,
or a 0.1 µF capacitor when "S1C60N03 1/2 bias" or "S1C60L03 1/2 bias (A), (B)" is selected.
No capacitor is required for C1 and C2 when another specification is selected.
Piezo Buzzer Direct Driving
C1
C2
CG
X'tal
1.5 V (S1C60L03)
3.0 V (S1C60N03)
K00
K03
R02
R03
SEG0
SEG14
COM0
COM3
LCD PANEL
S1C60N03
S1C60L03
CA
CB
VDD
VS2
OSC1
OSC2
RESET
TEST
VSS
Cp
X'tal
CG
RCR
C1, C2
Cp
Crystal oscillator
Trimmer capacitor
Resistor for CR oscillation
Capacitor
Capacitor
32.768 kHz, CI (Max.) = 35 k
525 pF
470 k (65 kHz)
1 µF (see Note)
3.3 µF
12
RCR
1 Crystal oscillation
2 CR oscillation
Piezo
Buzzer
R01
R00
I
O